Abrégé

A method for fabricating an xMR magnetic field sensor with at least one xMR sensor element from a workpiece containing an xMR multilayer system, including a magnetically hard reference layer with a reference magnetization direction. The method involves a programming operation to set or modify the reference magnetization direction in a sensor region by locally heating the reference layer beyond a threshold temperature using laser radiation, exposing the heated region to an external magnetic field to set the reference magnetization direction, and subsequently cooling the region. The laser processing operation employs a mask projection technique, where a mask with at least one aperture is irradiated with laser pulses, and the fully illuminated aperture region is imaged onto the processing plane using an imaging lens.

Classes IPC  ?

• G01R 33/00 - Dispositions ou appareils pour la mesure des grandeurs magnétiques
• B23K 26/50 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler
• G01R 33/09 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs magnéto-résistifs

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; Parts for all the aforesaid goods, included in class 7. Treatment of materials with the aid of microtechnology and nanotechnology, namely laser microtechnology and nanotechnology.

Abrégé

A method of producing a microstructured component includes a multiplicity of micro-functional elements on a substrate that carries an array of pixel-forming micro-light-emitting diodes on an electrical supply structure, including laser processing in at least one method stage in a laser processing station under control of a control unit, the method stage including positioning a workpiece to be processed in a processing position of the laser processing station by a workpiece movement system in reaction to movement signals of the control unit, the method including: observing the workpiece in a camera-based manner by a camera system, the observing including capturing at least one portion of the workpiece lying in the object field of a camera and also generating an image representing the portion; evaluating the image by image processing to ascertain position data representing an actual position of at least one structural element of the workpiece in the object field.

Classes IPC  ?

• B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
• B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée
• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/066 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes par utilisation de masques
• B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
• B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
• B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
• B23K 26/70 - Opérations ou équipement auxiliaires
• B23K 101/40 - Dispositifs semi-conducteurs
• H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails

Abrégé

A method and a system of producing a microstructured component includes a multiplicity of micro-functional elements on a substrate, wherein laser processing is carried out in at least one method stage in a laser processing station under the control of a control unit. One preferred field of application is the production of a micro-LED display including a substrate which carries an array of pixel-forming micro-light-emitting diodes arranged on an electrical supply structure arranged on the substrate.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails

Abrégé

In a method for producing microelectronic components, which have a carrier and at least one microelectronic functional layer system applied to the carrier, a functional layer system is formed on a front side of a growth substrate and a layered carrier is arranged on a side of the functional layer system opposite the growth substrate so that an arrangement is formed having the carrier, the functional layer system and the growth substrate. Laser radiation is radiated from the rear of the growth substrate through the growth substrate such that, in a boundary region between the growth substrate and the functional layer system, the laser radiation weakens or destroys a connection between the growth substrate and the functional layer system in the boundary region in locally limited regions or over a large area. The functional layer system or parts thereof are transferred to the substrate in order to form the microelectronic component. The boundary region is irradiated by means of direct laser interference patterning (DLIP), wherein a laser beam emitted from a primary laser radiation source is split into at least two partial beams and the partial beams are guided such that at least two partial beams which are coherent with one another extend through the growth substrate and a spatial intensity pattern is produced in a superimposition region of the coherent laser beams, which spatial intensity pattern has radiation microzones with constructive interference and relatively high power density of the laser radiation next to regions of destructive interference and low power density of the laser radiation in relation to the radiation microzones, wherein in the boundary region damaged microzones, which are arranged laterally spaced from one another, are produced by the laser radiation of the radiation microzones.

Classes IPC  ?

• H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
• B23K 26/50 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler
• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails

Abrégé

The invention relates to a method for manufacturing an xMR magnetic field sensor comprising at least one xMR sensor element composed of a workpiece (150) having one or more layers of an xMR multilayer system that has a hard magnetic reference layer having a reference magnetisation direction, in which method: a programming operation is performed in which the spatial orientation of the reference magnetisation direction in a sensor region provided for forming an xMR sensor element is adjusted and/or changed by heating the reference layer in a laser processing operation in the sensor region (SB) by means of laser radiation (105) to a temperature above a threshold temperature in a locally limited manner, exposing the heated region of the reference layer to an external magnetic field, which is provided by a magnetisation device (160) and has a predefinable field direction, in order to adjust the reference magnetisation direction, and subsequently cooling the heated region back down to below the threshold temperature. The laser processing operation comprises a mask projection operation in which a mask (130) having at least one mask aperture (133) is located in a mask plane (132) that is located at a distance from a processing plane (122) of the laser processing operation, and a region of the mask containing the mask aperture is irradiated with one or more laser pulses of pulsed laser radiation; and a region of the mask aperture illuminated with laser radiation is imaged into the processing plane (122) by means of an imaging lens (140) located between the mask plane and the processing plane.

Classes IPC  ?

• G01R 33/00 - Dispositions ou appareils pour la mesure des grandeurs magnétiques
• G01R 33/09 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs magnéto-résistifs
• H10N 50/10 - Dispositifs magnéto-résistifs

Abrégé

In a method for producing a micro-structured component which has a plurality of functional micro-elements on a substrate, laser machining is carried out in a laser machining station under the control of a control unit in at least one method step. The method comprises the following steps: providing a first substrate, which bears a plurality of functional micro-elements, which are arranged on a first side of the first substrate in a first spatial arrangement; transferring functional micro-elements from the first substrate onto a transfer substrate in a first transfer step; and transferring functional micro-elements from the transfer substrate to a second substrate in a second transfer step, in such a way that the functional micro-elements are arranged on the second substrate in a second spatial arrangement. The method is characterized in that a dicing tape (100) clamped under strain in a clamping frame (200) is used as the transfer substrate (250), the dicing tape comprising an elastically extensible base film (102), which is under surface tension, with an adhesive layer (104) applied to the base film for temporarily fastening functional micro-units to the dicing tape (100). The method can be used to produce a micro-LED display having a substrate which bears an array of pixel-forming micro-LEDs on an electrical supply structure.

Classes IPC  ?

• H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Produits et services

Machines, apparatus and installations for material treatment with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular transparent materials, including non-toughened glass, toughened glass and sapphire glass; Parts and accessories for all the aforesaid goods, included in class 7. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, Especially Material treatment of transparent materials including non-toughened glass, toughened glass and sapphire glass.

Abrégé

In a method for producing a microelectronic component which has a plurality of functional microelements on a substrate, laser machining is carried out in a laser machining station under the control of a control unit in at least one method step. The method step comprises positioning a workpiece to be machined in a machining position of the laser machining station by means of a workpiece-moving system in response to movement signals from the control unit. Camera-based monitoring of the workpiece is then carried out by means of a camera system, wherein at least one image of a portion of the workpiece located in the object field of a camera is generated. The image is then analysed by means of image processing in order to determine position data which represent the current position of at least one structural element of the workpiece in the object field. The current position is compared with a target position of the structural element and correction signals are generated on the basis of a deviation of the current position from the target position. The machining position is corrected on the basis of the correction signals by actuating the workpiece-moving system in order to align the current position with the target position. A laser beam directed onto the workpiece is then radiated on at least one machining point of the workpiece for local laser machining of the workpiece.

Classes IPC  ?

• B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée
• B23K 26/066 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes par utilisation de masques
• B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
• B23K 26/08 - Dispositifs comportant un mouvement relatif entre le faisceau laser et la pièce
• B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
• B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
• B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
• H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• B23K 26/38 - Enlèvement de matière par perçage ou découpage
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
• B23K 101/40 - Dispositifs semi-conducteurs
• B23K 103/00 - Matières à braser, souder ou découper

Produits et services

machines for material test sample generation in particular for micromechanical and structural failure analysis; machines for ablating and cutting metals, semiconductors, ceramics, polymers, and compound materials Computer hardware with embedded operating system software; computer hardware with embedded computer software for creation of complex 3D-shaped material samples and comprehensive materials analysis

Abrégé

A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• B32B 43/00 - Opérations spécialement adaptées aux produits stratifiés et non prévues ailleurs, p. ex. réparationAppareils pour ces opérations
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
• H01L 21/66 - Test ou mesure durant la fabrication ou le traitement

Abrégé

A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.

Classes IPC  ?

• B23K 26/064 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes
• B23K 26/073 - Détermination de la configuration du spot laser
• B23K 26/352 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface
• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples

Abrégé

A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.

Classes IPC  ?

• H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
• B32B 43/00 - Opérations spécialement adaptées aux produits stratifiés et non prévues ailleurs, p. ex. réparationAppareils pour ces opérations
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
• H01L 21/66 - Test ou mesure durant la fabrication ou le traitement

Abrégé

A laser machining system (100) for creating a laser beam with a linear beam cross section with a short axis and, perpendicular thereto, a long axis in a machining plane (105) comprises a laser beam source (102) for creating a raw laser beam, a beam widening system (120), connected downstream of the laser beam source, for receiving the raw laser beam and for creating a widened laser beam, and a homogenisation system, connected downstream of the beam widening system, for receiving the widened laser beam and for creating a laser beam that is homogenised with respect to the light intensity distribution and has a linear beam cross section in the machining plane. The homogenisation system has a first homogenisation arrangement for homogenisation along the short axis and a second homogenisation arrangement for homogenisation along the long axis, wherein each of the homogenisation arrangements has optical elements (140-1, 140-2) for splitting the laser beam into a plurality of partial beams and a condenser system (150-1, 150-2) for superposing the partial beams in a superposing plane. The first homogenisation arrangement has a first condenser system (150-1) with at least one first mirror (150-1A, 150-1B) and the second homogenisation arrangement has a second condenser system (150-2) with at least one second mirror (150-2A, 150-2B).

Classes IPC  ?

• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/073 - Détermination de la configuration du spot laser
• B23K 26/352 - Travail par rayon laser, p. ex. soudage, découpage ou perçage pour le traitement de surface

Abrégé

In a method for producing microelectronic components, which have a carrier and a microelectronic functional layer system applied to the carrier, a functional layer system is initially formed on a front side of a growth substrate and a layer-shaped carrier is subsequently applied onto the functional layer system in order to form a workpiece in the form of a layer composite, which has the carrier, the functional layer system and the growth substrate. A workpiece is fastened to a workpiece carrier in such a way that the rear side, lying opposite the front side, of the growth substrate is accessible. Then, a laser beam is radiated through the growth substrate from the rear side of the growth substrate in such a way that the laser beam is focused in a boundary region between the growth substrate and the functional layer system and a connection between the growth substrate and the functional layer system is weakened or destroyed in the boundary region. Finally, a functional layer stack comprising the carrier and the functional layer system is separated from the growth substrate. For the purposes of separating the functional layer stack (150) from the growth substrate (110), a vacuum gripper (710) with a sealing zone (730) surrounding an inner region (720) is placed onto the rear side (114) of the growth substrate. After placement, negative pressure is produced in the inner region (720) in such a way that a separation of the functional layer stack (150) from the growth substrate (110) is initiated in the inner region under the action of a separating force on the growth substrate. Then, the growth substrate (110) held at the vacuum gripper is removed from the functional layer stack held at the workpiece carrier (400).

Classes IPC  ?

• H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels

Abrégé

A method produces a structured element by machining a workpiece with pulsed laser radiation, the workpiece including a workpiece material transparent to the laser radiation, the laser radiation being radiated into the workpiece from an entry side and, in an area of a rear side of the workpiece located opposite the entry side, being focused within the workpiece in a focus area such that workpiece material is removed in the focus area by multi-photon absorption, and includes bringing the rear side of the workpiece, at least in a machining area currently being machined around the focus area, into contact with a free-flowing liquid transparent to the laser radiation, wherein at least some of the liquid flows in a direction towards the machining area such that the liquid flows into the machining area at an angle of 60° or less to the rear side.

Classes IPC  ?

• B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
• B23K 26/146 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet l'écoulement de fluide contenant un liquide
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B28D 1/22 - Travail de la pierre ou des matériaux analogues p. ex. briques, béton, non prévu ailleursMachines, dispositifs, outils à cet effet par découpage, p. ex. exécution d'entailles
• C03B 33/02 - Découpe ou fendage des feuilles de verreDispositifs ou machines à cet effet
• C03B 33/08 - Sectionnement du verre refroidi par fusion
• B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
• B23K 103/00 - Matières à braser, souder ou découper

Abrégé

Disclosed is a method for producing a structured element by means of material-removing machining of a workpiece (200) by pulsed laser radiation (130), the workpiece (200) consisting of a workpiece material that is transparent to laser radiation. The workpiece (200) is irradiated with the laser radiation (130) from a radiation entry face (210) and the radiation is focused inside the workpiece (200), in a focus region (135) in the region of a rear face (220) of the workpiece (200) that lies opposite the radiation entry face, such that workpiece material is removed in the focus region (135) by means of multi-photon absorption. During machining, the rear face (220) of the workpiece (200) is contacted, at least in a machining region which comprises the focus region (135), with a flowable liquid (320) that is transparent to laser radiation (130), wherein at least one portion of the liquid (320) is made to flow in the direction of the machining region in such a way that the liquid (320) flows into the machining region at an acute angle of 60° or less to the rear face (220). Also disclosed are a device suitable for carrying out the method and an element produced by means of said method.

Classes IPC  ?

• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B28D 1/22 - Travail de la pierre ou des matériaux analogues p. ex. briques, béton, non prévu ailleursMachines, dispositifs, outils à cet effet par découpage, p. ex. exécution d'entailles
• C03B 33/02 - Découpe ou fendage des feuilles de verreDispositifs ou machines à cet effet
• C03B 33/08 - Sectionnement du verre refroidi par fusion
• B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
• B23K 26/146 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet l'écoulement de fluide contenant un liquide
• B23K 103/00 - Matières à braser, souder ou découper

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the mems (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology; parts for the aforesaid goods, included in this class. Lasers, not for medical use, laser calorimeters; optical apparatus and instruments, fiber optic cables, optical-fibre cables, optical lenses, optical filters, mirrors [optics]; electronic apparatus for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; parts for the aforesaid apparatus, included in this class; software, including recorded software, in particular for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Scientific and technological services and research and design relating thereto, industrial analysis and research services, technical project studies, the aforesaid services mainly in the field of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; design and development of computer hardware and software.

Produits et services

Machines and mechanical installations for treating brittle materials, including glass, ceramics and semiconductors. Treatment of brittle materials, namely glass, ceramics and semiconductors.

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology; parts for the aforesaid goods, included in this class. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology.

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology; parts for the aforesaid goods, included in this class.

Produits et services

Treatment of materials by means of lasers which employ laser-microtechnology and laser-nanotechnology Machines, power tools and machine tools for use in the treatment of materials by means of laser-microtechnology and laser-nanotechnology for drilling, cutting, ablating, structuring, engraving, marking [, imprinting ] and sintering the materials, for use in the MEMS (Micro-Electro-Mechanical-Systems) industry, semiconductor industry, medical technology and solar technology industries; parts for the afore-mentioned goods Lasers, not for medical use; [ Laser calorimeters; ] Optical apparatus and instruments, namely, homogenizers, guiders, deflectors, diffractors, shapers, and masks for laser beams; Optical apparatus and instruments, namely, laser drilling heads, laser frequency multipliers, [ optical parametric amplifiers ] and attenuators, and laser polarization modifiers; Fiber optic cables, optic light conductor cables, optic lenses, optic filters, and optic mirrors; Electronic instruments, namely, power amplifiers, cameras, optical sensors, electric sensors, electrical controllers, scanner control boards, laser beam analyzers, laser pointing stabilizers, laser power measurers, laser positioning attachments, and camera cognition systems comprising cameras, lighting filters, objectives, and image recognition software, all for controlling wavelength, profile, 3D-raypath, positioning, intensity, and focusing of laser beams and for controlling workpiece position in 3D space in machines and instruments used to treat materials by means of laser-microtechnology and laser-nanotechnology; Parts for the aforementioned goods; Computer software in both downloadable form and in disk form for controlling wavelength, profile, 3D raypath, positioning, intensity, and focusing of laser beams, and for controlling workpiece position in 3D space, for image recognition, and to collect, store, analyze, and evaluate image data in machines and instruments used to treat materials by means of laser-microtechnology and laser-nanotechnology Scientific and technological services and research and design in the field of materials customization for scientific and technological applications; technical project planning in the nature of design engineering of laser-microtechnology and laser-nanotechnology products for others; design and development of computer hardware and software

Produits et services

Machines, apparatus and installations, namely, power drills, cutting machines, [ industrial printing machines, ] engraving machines, laser engraving machines, and sintering machines, for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing, and sintering of materials, in particular in the MEMS (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology; and replacement parts for the aforesaid goods being included in this class

Produits et services

[ Treatment of materials by means of laser beams and employing laser-microtechnology and laser-nanotechnology ] Machines, apparatus and installations, namely, power drills, cutting machines, [ industrial printing machines, ] engraving machines, laser engraving machines, and sintering machines for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, [ printing ] and sintering of materials, in particular in the MEMS (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology, and replacement parts for the aforesaid goods being included in this class

Abrégé

A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material present in accordance with a prescribed pattern, electrically non-conductive second regions lying between the first regions to produce RFID antennas or flexible printed circuit boards in a roller-to-roller process, the method including connecting a conductor foil to the substrate by a laterally structured layer of adhesive lying in between such that in first regions a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones, and in laterally extended second regions the conductor foil is not connected or is connected less firmly by adhesive to the substrate; structuring the conductor foil by cutting the conductor foil along boundaries of the first regions; and removing contiguous pieces of foil of the conductor foil from laterally extended second regions.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/04 - Élimination du matériau conducteur par voie mécanique, p. ex. par poinçonnage
• B32B 37/12 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par l'usage d'adhésifs
• B32B 38/10 - Enlèvement de couches ou de parties de couches, mécaniquement ou chimiquement
• G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
• H05K 1/02 - Circuits imprimés Détails
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.

Classes IPC  ?

• B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
• B23K 26/046 - Focalisation automatique du faisceau laser
• C03B 33/02 - Découpe ou fendage des feuilles de verreDispositifs ou machines à cet effet
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B23K 26/146 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet l'écoulement de fluide contenant un liquide
• C03B 33/09 - Sectionnement du verre refroidi par chocs thermiques
• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• B23K 26/60 - Traitement préliminaire
• H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
• B23K 103/00 - Matières à braser, souder ou découper

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; Parts for the aforesaid goods, included in class 7. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology.

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; Parts for the aforesaid goods, included in class 7.

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; Parts for the aforesaid goods, included in class 7. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology.

Produits et services

Machines and mechanical installations for treating brittle materials, including glass, ceramics and semiconductors. Treatment of brittle materials, namely glass, ceramics and semiconductors.

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; Parts for the aforesaid goods, included in class 7. Lasers, Not for medical use, Laser calorimeters; Optical apparatus and instruments, Fiber optic cables, Optical-fibre cables, Optical lenses, Optical filters, Mirrors [optics]; Electronic apparatus for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; Parts for the aforesaid apparatus, included in class 9; Software, including recorded software, in particular for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Scientific and technological services and research and design relating thereto, industrial analysis and research services, technical project studies, the aforesaid services mainly in the field of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; Design and development of computer hardware and software.

Abrégé

A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.

Classes IPC  ?

• H05K 3/46 - Fabrication de circuits multi-couches
• H05K 3/04 - Élimination du matériau conducteur par voie mécanique, p. ex. par poinçonnage
• G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
• H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
• H05K 3/22 - Traitement secondaire des circuits imprimés
• H05K 3/26 - Nettoyage ou polissage du parcours conducteur
• H05K 1/02 - Circuits imprimés Détails

Abrégé

The invention relates to a method for producing a multi-layer element having a substrate and having at least one conductor structure connected to the substrate in a planar manner, which conductor structure has first regions made of electrically conductive material, which electrically conductive material is present in accordance with a specified pattern, electrically non-conductive second regions lying between the first regions. The method according to the invention is characterized by the following steps: connecting a conductor film (142) to the substrate (200) by means of a laterally structured adhesive layer (220) lying therebetween, in such a way that, in the first regions (240), a partial adhesive contact between the substrate and the conductor film is produced in a plurality of adhesion zones (224) and, in laterally extended second regions (250), the conductor film is not connected to the substrate by the adhesive or is connected to the substrate less strongly by the adhesive; structuring the conductor film by cutting the conductor film along boundaries of the first regions; and removing contiguous film pieces (142') of the conductor film from laterally extended second regions (250). The method is provided in particular for producing RFID antennas or flexible circuit boards in a roll-to-roll method.

Classes IPC  ?

• B32B 37/12 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par l'usage d'adhésifs
• B32B 38/10 - Enlèvement de couches ou de parties de couches, mécaniquement ou chimiquement
• G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
• H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage

Abrégé

The present invention relates to a method and a device for separating a flat workpiece (1) into multiple parts (7) using the technique of thermal laser separation (TLS). In the method, before the TLS step, a further laser (5) is used to produce, by local material processing, at least one line (2) of modified material along one or more predefined separating lines in the workpiece (1), which lead to a reduction in the stress at failure of the workpiece (1) along the separating lines. Said line (2) is in this case produced completely or at least in sections so as to be spaced apart from the surface of the workpiece (1). A higher quality of the edges of the cut-off parts is attained by means of the method.

Classes IPC  ?

• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• C03B 33/02 - Découpe ou fendage des feuilles de verreDispositifs ou machines à cet effet
• C03B 33/09 - Sectionnement du verre refroidi par chocs thermiques
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée

Abrégé

The invention relates to a method and to a device for separating a flat workpiece (1) into a plurality of sections (7) using the technique of thermal laser beam separation (TLS). In the method, prior to the TLS step, at least one line (2) of modified material is generated along one or more predefined separating lines in the workpiece (1) by way of local material processing using a further laser, which results in a reduction of the breaking stress of the workpiece (1) along the separating lines. Said line (2) is thereby entirely, or at least sectionally, generated at a distance from the surface of the workpiece (1). By means of the method, a higher quality of the edges of the separated sections is achieved.

Classes IPC  ?

• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• C03B 33/02 - Découpe ou fendage des feuilles de verreDispositifs ou machines à cet effet
• C03B 33/09 - Sectionnement du verre refroidi par chocs thermiques
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• B23K 26/14 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet
• B23K 26/04 - Alignement, pointage ou focalisation automatique du faisceau laser, p. ex. en utilisant la lumière rétrodiffusée

Abrégé

What is described is a method for producing a multilayer element having a substrate and at least one conductor structure which is connected in an areal manner to the substrate and has first regions made of electrically conductive material which is present in accordance with a predefined pattern, wherein electrically non-conductive second regions are present between the first regions. The method is characterized by the following steps: connecting a conductor film (142) to the substrate (200) in such a manner that the conductor film is fixedly connected to the substrate in the first regions and partial bonding contact between the substrate and the conductor film is generated at a multiplicity of bonding zones (224) in laterally extended, second regions; structuring the conductor film by cutting the conductor film along boundaries of the first regions; and removing cohesive film pieces (143) of the conductor film from laterally extended, second regions (250) by releasing the partial bonding contact between the substrate and the conductor film. The method can be used, for example, for producing RFID antennas in a roller-to-roller process.

Classes IPC  ?

• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

The invention relates to a method for authentication and identification of an object, comprising the following steps: capturing a first capture image of a selected inspection region (PB) of an object surface of the object (OBJ) for generating first capture image data (EBD) which represent the characteristic properties of the object surface in the inspection region; generating of third image data (DBD) which represent a third image which differs from the first capture image; determining first comparison data (VD1) by a first comparison operation (V1), wherein the first capture image data are compared to the third image data using a predefined comparison method; capturing a specimen image of an inspection region (PB) of an object surface of an inspection object (PRO) to be inspected to generate inspection image data (PBD) which represent the characteristic properties of the object surface of the inspection object to be inspected in the inspection region; determining second comparison data (VD2) by a second comparison operation (V2), wherein the inspection image data (PBD) are compared to the third image data (DBD) using the predefined comparison method; and authentication of the inspection object by comparing the first comparison data (VD1) to the second comparison data (VD2) to determine authenticity properties and by evaluating the authenticity properties.

Classes IPC  ?

• G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
• G06K 19/08 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code utilisant des marquages de différentes sortes sur le même support d'enregistrement, p. ex. un marquage étant lu optiquement et l'autre par des moyens magnétiques
• G06K 7/14 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire utilisant la lumière sans sélection des longueurs d'onde, p. ex. lecture de la lumière blanche réfléchie
• G06K 9/62 - Méthodes ou dispositions pour la reconnaissance utilisant des moyens électroniques

Abrégé

A laser machining system (100) which can be used, for example, in a line production plant for producing printed electronic components on a band-like flexible substrate in a roll-to-roll method, has a housing (110), which can be closed off in a gas-tight manner and encloses a process chamber (112), at least one substrate holding device (120) which is arranged in the process chamber and is set up to hold the substrate (115) for laser machining in a machining position within the process chamber, and a laser unit (140), fitted outside the housing, having an exit optical system (150) for emitting a laser beam that can be directed onto the substrate, wherein an optical window (170), which is transparent to the laser beam, for injecting the laser beam into the process chamber is provided, said optical window (170) separating the process chamber from the surroundings. The exit optical system (150) of the laser unit (140) is coupled in a mechanically rigid manner to the substrate holding device (120) and mechanically uncoupled from the housing (110).

Classes IPC  ?

• B23K 26/12 - Travail par rayon laser, p. ex. soudage, découpage ou perçage sous atmosphère particulière, p. ex. dans une enceinte
• B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, in particular for the treatment of flat, flexible materials, all of the aforesaid goods being preferably for drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (microelectromechanical systems) industry, the electronic industry, the semiconductor industry, the battery industry, the photovoltaic industry, in medical technology and solar technology; parts for all the aforesaid goods, included in this class.

Produits et services

Machines, apparatus and installations, namely, power drills, cutting machines, [ industrial printing machines, ] engraving machines, laser engraving machines [, and sintering machines ] for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, in particular for the treatment of flat, flexible materials, all of the aforesaid goods being preferably for drilling, cutting, removing, structuring, engraving, marking, printing, coating, drying and sintering of materials, in particular in the MEMS (microelectromechanical systems) industry, the electronic industry, the semiconductor industry, the battery industry, the photovoltaic industry, in medical technology and solar technology; parts for all the aforesaid goods, included in this class

Abrégé

The invention relates to a transparent vacuum clamping device (100) that has a housing (110) and an at least partly transparent clamping plate (120) which is supported by the housing and which has a front face (122) that is designed as a clamping surface, an opposite rear face (124), and gas-permeable channels that pass from the front face to the rear face. Furthermore, an illuminating device (130) is provided for illuminating the rear face of the clamping plate with the light of at least one light source. The clamping plate (120) consists of an open-pore material at least in one useful region, said material comprising a plurality of communicating pores which form the gas-permeable channels.

Classes IPC  ?

• B25B 11/00 - Porte-pièces ou dispositifs de mise en position non couverts par l'un des groupes , p. ex. porte-pièces magnétiques, porte-pièces utilisant le vide

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, in particular for the treatment of flat, flexible materials, all of the aforesaid goods being preferably for drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (microelectromechanical systems) industry, the electronic industry, the semiconductor industry, the battery industry, the photovoltaic industry, in medical technology and solar technology; Parts for all the aforesaid goods, included in class 7. Organising, arranging and conducting trade fairs and exhibitions, in particular trade fairs and exhibitions in the field of mechanical engineering and in the field of laser microprocessing and coating technologies; Advertising; Marketing. Scientific and technological services and research and design relating thereto, industrial analysis and research services, technical project studies, the aforesaid services mainly in the field of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; Design and development of computer hardware and software.

Produits et services

Printed matter, Books, Periodicals,Conference proceedings, instructional and teaching material (except apparatus), the aforesaid goods in particular in the field of mechanical engineering and in the field of laser microprocessing and coating technologies. Organising, arranging and conducting trade fairs and exhibitions, in particular trade fairs and exhibitions in the field of mechanical engineering and in the field of laser microprocessing and coating technologies; Advertising; Marketing. Organising, Arrangement and conducting of congresses, Seminars, Workshops, Colloquiums, Conferences,Symposiums and other teaching and further training events; Providing of training and further training; Publication and edition of books, Magazines and Conference proceedings; All the aforesaid services in particular in the field of mechanical engineering and in the field of laser microprocessing and coating technologies.

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; parts for all the aforesaid goods, included in this class. Lasers, not for medical purposes, laser calorimeters; optical apparatus and instruments, optical fibre cables, fibre-optic cables, optical lens, optical filters, optical mirrors; electronic apparatus for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; parts for the aforesaid apparatus, included in this class; software, including recorded software, in particular for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Scientific and technological services and research and design relating thereto, industrial analysis and research services, technical project studies, the aforesaid services mainly in the field of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; design and development of computer hardware and software.

Abrégé

In a method for producing a permanent mark in an optical element which consists essentially of a material that is transparent in the visible spectral region, a marking region of the optical element is irradiated with laser radiation in order to generate local, near-surface material changes in such a way that a mark of prescribed shape and size is generated. The laser radiation has an operating wavelength λ from the wavelength region between 1.1 μm and 9.2 μm. A thulium-doped fiber laser is preferably used as laser radiation source. The operating wavelength is selected in dependence from the material of the optical element such that the material exhibits a partial absorption with a transmittance between 60% and 98%. The method can be used, in particular, to provide spectacle lenses, contact lenses or intraocular lenses with marks.

Classes IPC  ?

• B41M 5/26 - Thermographie
• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
• G02B 1/12 - Revêtements optiques obtenus par application sur les éléments optiques ou par traitement de la surface de ceux-ci par traitement de la surface, p. ex. par irradiation
• G02C 7/02 - VerresSystèmes de verres

Produits et services

Machines, power tools and machine tools for use in the treatment of materials by means of laser-microtechnology and laser-nanotechnology for drilling, cutting, ablating, structuring, engraving, marking, imprinting and sintering the materials, for use in the MEMS (Micro-Electro-Mechanical-Systems) industry, semiconductor industry, medical technology and solar technology industries; parts of the afore-mentioned goods Lasers, not for medical use; Laser calorimeters; Optical apparatus and instruments, namely, homogenizers, guiders, deflectors, diffractors, shapers, and masks for laser beams; Optical apparatus and instruments, namely, laser drilling heads, laser frequency multipliers, optical parametric amplifiers and attenuators, and laser polarization modifiers; Fiber optic cables, optic light conductor cables, optic lenses, optic filters, and optic mirrors; Electronic instruments, namely, power amplifiers, cameras, optical sensors, electric sensors, electrical controllers, scanner control boards, laser beam analyzers, laser pointing stabilizers, laser power measurers, laser positioning attachments, and camera cognition systems comprising cameras, lighting filters, objectives, and image recognition software, all for controlling wavelength, profile, 3D-raypath, positioning, intensity, and focusing of laser beams and for controlling workpiece position in 3D space in machines and instruments used to treat materials by means of laser-microtechnology and laser-nanotechnology; Parts for the aforementioned goods; Computer software in both downloadable form and in disk form for controlling wavelength, profile, 3D raypath, positioning, intensity, and focusing of laser beams, and for controlling workpiece position in 3D space, for image recognition, and to collect, store, analyze, and evaluate image data in machines and instruments used to treat materials by means of laser-microtechnology and laser-nanotechnology Treatment of materials by means of lasers which employ laser-microtechnology and laser-nanotechnology Scientific and technological services and research and design in the field of materials customization for scientific and technological applications; technical project planning in the nature of design engineering of laser-microtechnology and laser-nanotechnology products for others; design and development of computer hardware and software

Produits et services

Machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing and sintering of materials, in particular in the MEMS (Micro-Electric Mechanical Systems) industry, the semiconductor industry, in medical technology and solar technology; parts for all the aforesaid goods, included in class 7. Lasers, not for medical purposes, laser calorimeters; optical apparatus and instruments, optical fibre cables, fibre-optic cables, optical lens, optical filters, optical mirrors; electronic apparatus for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; parts for the aforesaid apparatus, included in class 9; software, including recorded software, in particular for controlling and regulating machines, apparatus and installations for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology. Scientific and technological services and research and design relating thereto, industrial analysis and research services, technical project studies, the aforesaid services mainly in the field of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology; design and development of computer hardware and software.

Abrégé

The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Classes IPC  ?

• B23K 26/40 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever
• H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
• C03B 32/02 - Cristallisation thermique, p. ex. pour la cristallisation de produits vitreux en articles vitrocéramiques
• B26F 3/16 - Séparation par la chaleur par des radiations

Abrégé

The invention relates to a device for applying powder to an application surface. Said device has a powder container (35) and a voltage source (32) for applying a voltage between the powder container and the application surface. The powder container (35) at least partially consists of a conductive material and during the application of the voltage, the powder container (35) has an opening (35a) or is completely open on the side facing towards the application surface.

Classes IPC  ?

• B29C 67/00 - Techniques de façonnage non couvertes par les groupes , ou
• B22F 3/105 - Frittage seul en utilisant un courant électrique, un rayonnement laser ou un plasma

Abrégé

The invention relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire. The method includes the step of heating the flat material along desired dividing lines below its melting temperature by means of a laser alone desired separating lines. Then the material is shocked by a coolant jet so that a thermally-induced mechanical stress difference brings about a material separation. Traces are formed in the flat material in advance along the separation lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.

Classes IPC  ?

• B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage

Abrégé

The invention relates to a laser micromachining station, which contains at least one UV laser with a wavelength of less than 200 nm, a device for forming the beam, a device for reproducing the laser beam on the substrate to be machined and a positioning system, which is situated in a machining chamber (5). The beam forming device consists of at least several reflective components. The beam forming device and the device for reproducing the laser beam are located in a pressure-tight and vacuum-tight chamber system, which can be evacuated and filled with at least one inert gas or inert gas mixture. The machining chamber is pressure-tight and vacuum-tight and can also be evacuated and filled with at least one inert gas or inert gas mixture.

Classes IPC  ?

• B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
• B23K 26/12 - Travail par rayon laser, p. ex. soudage, découpage ou perçage sous atmosphère particulière, p. ex. dans une enceinte