Hydroflex Technology

Netherlands

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IPC Class
B63B 32/57 - Boards characterised by the material, e.g. laminated materials 1
B63B 32/59 - Boards characterised by their manufacturing process, e.g. moulded or 3D printed 1
Found results for  patents

1.

Board with board bumper

      
Application Number 17952375
Status Pending
Filing Date 2022-09-26
First Publication Date 2024-03-28
Owner Hydroflex Technology (Netherlands)
Inventor Kootstra, Adriaan Jan Hendrik

Abstract

The present invention relates to a method of manufacturing a board for sport equipment and the board for sport equipment thereof. The method comprises the steps of molding a substrate on a first mold; transferring the substrate to a second mold; and injecting a thermoplastic material into a cavity provided between at least a part of an edge side of the substrate and the second mold to form the board with a board bumper on the at least a part of the edge side of the substrate.

IPC Classes  ?

  • B63B 32/59 - Boards characterised by their manufacturing process, e.g. moulded or 3D printed
  • B63B 32/57 - Boards characterised by the material, e.g. laminated materials