A liquid adhesion apparatus that causes a liquid to adhere to an adherend surface of an adherend to which a pellicle film is to be attached, includes: a liquid storage unit that stores the liquid in a liquid storage portion including an opening; a liquid supply unit that supplies the liquid to the liquid storage portion; and a liquid adhesion unit that causes the liquid to adhere to the adherend surface by bringing the adherend surface of the adherend into contact with the liquid stored in the liquid storage portion, in which the liquid supply unit includes a controller that controls an amount of the liquid to be supplied to the liquid storage portion.
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
B05C 3/18 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material only one side of the work coming into contact with the liquid or other fluent material
B05C 3/20 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material for applying liquid or other fluent material only at particular parts of the work
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
An electromagnetic wave absorbing member comprises a resistive layer including a conductive pattern, wherein: the resistive layer includes a first region and a second region having different electromagnetic wave transmission characteristics; the first region has a conductive pattern including first arrays in which first units are arranged, and second arrays in which second units different from the first units are arranged; the second region has a conductive pattern including the first arrays, and the second arrays; the first units and the second units are arranged in a first direction in the first region; the first units and the second units are arranged in a second direction different from the first direction in the second region; and the first array and the second array are arranged adjacent to each other in the first region and the second region.
A pellicle film attachment device, which is configured to attach a pellicle film to an adherend surface of a frame member, includes an attachment unit configured to attach the pellicle film to the adherend surface to which a liquid adheres; and a dryer configured to dry the pellicle film attached to the adherend surface.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
5.
STORAGE CONTAINER OPENING/CLOSING DEVICE AND STORAGE CONTAINER OPENING/CLOSING METHOD
A storage container opening/closing device includes: a storage portion configured to house a frame member to which a pellicle film is attached; a cover configured to cover the storage portion; a storage container support unit configured to support the storage container; and an opening/closing unit configured to open and close the storage container by moving the cover, in which the opening/closing unit includes: a retainer configured to retain the cover; a first movement unit configured to move the cover retained by the retainer in a direction away from and toward the storage portion; and a second movement unit configured to tilt the cover retained by the retainer with respect to the storage portion.
A microneedle array 1 has a plurality of microneedles 11 and is to be used as an acupuncture needle for acupuncture therapy. The length of the microneedles 11 of the microneedle array 1 is 250–1500 μm, and the tip strength of the microneedles 11 measured as the maximum value of the stress that occurs at the microneedles 11 when a compressive load is applied to tip parts of the microneedles 11 in the length direction is at least 50 mN. This microneedle array 1 makes it possible to achieve excellent acupuncture therapy effects.
A method for manufacturing a twisted carbon nanotube yarn includes: drawing carbon nanotubes in sheet form from an end portion of a carbon nanotube forest to provide a carbon nanotube sheet; performing false twisting by twisting the carbon nanotube sheet and then performing untwisting to provide a carbon nanotube linear body; and twisting the carbon nanotube linear body to provide a twisted carbon nanotube yarn, in which the number of twists when the carbon nanotube sheet is false-twisted in the false twisting is in a range from 300 T/m to 5,000 T/m, and the number of twists when the carbon nanotube linear body is twisted in the providing of the twisted carbon nanotube yarn is in a range from 900 T/m to 5,000 T/m.
[Problem] To provide a hard coating film in which the occurrence of cracks or the like during construction is suppressed while excellent scratch resistance is exhibited. [Solution] A hard coating film comprising a base material and a hard coating layer disposed on one main surface of the base material. In a mandrel bend test carried out in accordance with JIS K 5600-5-1 by using a cylindrical mandrel bend tester and bringing a base material-side surface of the hard coating film into contact with a mandrel, when the diameter of the mandrel at which cracks occur in the hard coating layer is defined as D μm, and the total thickness of the hard coating film is defined as α μm, D/α is 130 or less.
There is provided a thermoelectric module including: a first substrate having a first main surface; a second substrate having a second main surface arranged to face the first main surface; a plurality of thermoelectric elements arranged between the first main surface and the second main surface; and an electrode arranged on the first main surface and connected to a first thermoelectric element and a second thermoelectric element among the plurality of thermoelectric elements. An insulating layer including a first portion and a second portion is arranged on the first main surface, the first portion being arranged to surround the electrode and to be spaced apart from the electrode, the second portion being arranged between the first thermoelectric element and the second thermoelectric element.
Protective sheet includes a base material and a coat layer. The protective sheet has a tensile elongation of 60% or more at which the base material does not break but the coat layer cracks when the protective sheet is stretched at a width of 15 mm, a measurement length of 50 mm, and a tensile speed of 200 mm/min in an environment of 23° C. and 50% RH. The protective sheet has an indentation stress of 1 N or more and 8.8 N or less when a surface of the protective sheet or a laminate including the protective sheet on the coat layer side is indented to a depth of 100 μm at a speed of 0.01 mm/sec over an area of 5 mmφ.
A pellicle film attachment device includes: an affinity improvement treatment unit configured to perform, on an adherend surface of a first frame member, an affinity improvement treatment to improve an affinity for a liquid; a liquid adhesion unit configured to cause the liquid to adhere to the adherend surface having been subjected to the affinity improvement treatment; and an attachment unit configured to attach a pellicle film to the adherend surface to which the liquid adheres.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
12.
ELECTRONIC COMPONENT MANUFACTURING METHOD AND ELECTRONIC COMPONENT PROCESSING DEVICE
This invention reduces man-hours required for the manufacture of an electronic component. An adherend is stuck to an adhesive sheet that is larger than the adherend. The adherend stuck to the adhesive sheet is thinned in a state in which an outer peripheral part of the adhesive sheet is fixed. Each of the resulting chips of the adherend are selectively picked up from the adhesive sheet.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
Provided is an adhesive sheet having a novel structure, with which it is possible to change retention force. This adhesive sheet for attaching an electronic component comprises: a base material having a surface with dips and bumps; and an adhesive layer provided in contact with said surface of the base material so as to accommodate the bumps on the surface.
This bonding sheet includes: a base material; and an adhesive layer provided on one surface of the base material. In the bonding sheet, the transmittance of infrared light having a wavelength of 1600 nm is 80% or more. The peeling force between a silicon chip and an energy ray-irradiated product of the adhesive layer, as measured using a test piece that is a laminate of the silicon chip, the energy ray-irradiated product of the adhesive layer, and the base material, is 5 N or less.
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 133/04 - Homopolymers or copolymers of esters
There is provided a pressure sensitive adhesive sheet from which an element is more easily peeled. The pressure sensitive adhesive sheet includes a pressure sensitive adhesive layer having a surface with unevenness, the pressure sensitive adhesive sheet is stretchable in a planar direction, and a surface peeling force of an object on the pressure sensitive adhesive sheet after stretching is reduced as compared with a surface peeling force of the object on the pressure sensitive adhesive sheet before stretching.
A laminate including: a pressure sensitive adhesive sheet configured to catch an element distant from a holding substrate, and a release sheet laminated on one of faces of the pressure sensitive adhesive sheet; the pressure sensitive adhesive sheet including a pressure sensitive adhesive layer, the pressure sensitive adhesive layer having an unevenness on a surface; the release sheet including a release layer that is in contact with the pressure sensitive adhesive layer, the release layer having unevenness on a surface; and a peel strength at a release angle of 180° of the release sheet with respect to the pressure sensitive adhesive sheet measured at a release speed of 300 mm/min being 1000 mN/50 mm or less.
Pressure sensitive adhesive sheet (1) includes a pressure sensitive adhesive layer (11) to be attached to a planar heating element. The average value of luminous transmittance of the pressure sensitive adhesive layer (11) in a wavelength region of 380 to 780 nm is 60% or more. The average value of luminous transmittance of the pressure sensitive adhesive layer (11) in a wavelength region of 800 to 1,000 nm is 60% or more. The adhesive strength for the pressure sensitive adhesive sheet (1) is 10 N/25 mm or more when measured through: preparing a laminate configured such that a polyethylene terephthalate film having a thickness of 100 μm and a soda-lime glass plate having a thickness of 1.1 mm are bonded together via the pressure sensitive adhesive layer (11); subjecting the laminate to 200 cycles of a heat shock test in which −35° C. and 70° C. are each applied for 30 minutes in alternation; and then peeling off a laminate of the polyethylene terephthalate film and the pressure sensitive adhesive layer from the soda-lime glass plate. The pressure sensitive adhesive sheet (1) is suitable for attachment to a planar heating element.
H05B 3/28 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
18.
LAMINATE, WINDOW FILM, AND EXTERNAL LIGHT UTILIZATION TYPE DISPLAY BODY
A laminate (window film 2) includes: a light diffusion control film 1 that has an internal structure in a film, the internal structure including a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index; and ultraviolet absorption layers (adhesive layers 22a, 22b containing an ultraviolet absorber) located closer to an external light incident side than the light diffusion control film 1. The light diffusion control film 1 is obtained from a composition containing a high refractive index component and a low refractive index component having a refractive index lower than that of the high refractive index component. The low refractive index component is urethane acrylate having a structure derived from a hydroxyl group-containing acrylic monomer represented by the following general formula (I). The laminate is suppressed in liquefaction. (In the formula, R is a hydrogen atom, and n is an integer of 1 or more).
A workpiece handling sheet 1 comprises: a base material 12; and an interface ablation layer 11 which is laminated on one surface side of the base material 12, can hold a workpiece fragment, and is subjected to interface ablation by irradiation with laser light. The interface ablation layer 11 contains a photosensitizer, and the absorbance of light at a wavelength of 365 nm, as measured for a solution obtained by dissolving the photosensitizer in an organic solvent at a concentration of 10 ppm, is 0.3 or more. The workpiece handling sheet 1 can satisfactorily handle workpiece fragments of various sizes and thicknesses.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
[Problem] To provide a workpiece machining sheet capable of, when a machined workpiece is joined directly to a wafer, suppressing increases in the area of a void in a joining section between the machined workpiece and the wafer or between machined workpieces. [Solution] A workpiece machining sheet used to machine a workpiece for manufacturing a machined product to be directly joined, wherein: when 10 μL of toluene solvent, obtained as a result of immersing the workpiece machining sheet having a size of 80 mm × 100 mm in 15 g of toluene at 25°C for 24 hours, is measured by gel permeation chromatography and the measurement result is represented in a chromatogram in which the vertical axis indicates detected voltage and the horizontal axis indicates elution time from the toluene solvent introduction to the elution from a column, the peak area of detected components within a range from an elution time, corresponding to a situation in which the number average molecular weight calculated in terms of standard polystyrene is 2,500,000, to an elution time, corresponding to a situation in which the number average molecular weight calculated in terms of standard polystyrene is 200, is 4,000 mV·s or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
[Problem] To provide a workpiece processing sheet that makes it possible to suppress cracks or the like of a workpiece even when the workpiece is thinned, and to reduce the number of particles on a bonding surface of a processed workpiece, which is obtained by singulating the workpiece, when the processed workpiece is directly bonded to a wafer. [Solution] The workpiece processing sheet is used for processing a workpiece for manufacturing a processed article that is to be directly bonded, and has a configuration in which a base material and an adhesive layer are laminated. The tensile elastic modulus of the base material at 23°C is 1400 MPa or more. The surface free energy of the surface of the base material that is in contact with the adhesive layer is less than 40 mN/m.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
22.
MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME
A microneedle structure is provided with needle-like parts having a flow path therein. The flow paths open on the surface of the needle-like parts. A coating containing a hydrophilic substance is formed on the inner surface of the flow paths.
A61K 47/18 - AminesAmidesUreasQuaternary ammonium compoundsAmino acidsOligopeptides having up to five amino acids
A61K 47/32 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. carbomers
A61K 47/34 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polyesters, polyamino acids, polysiloxanes, polyphosphazines, copolymers of polyalkylene glycol or poloxamers
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
C08J 9/26 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
C08J 9/42 - Impregnation with macromolecular compounds
23.
METHOD FOR PRODUCING MICRONEEDLE STRUCTURE, AND MICRONEEDLE STRUCTURE
This method for producing a microneedle structure comprises: a step for preparing a needle-shaped section-forming resin composition containing a pore-forming agent and a water-insoluble resin; a step for producing a microneedle intermediate that has a needle-shaped section formed from the needle-shaped section-forming resin composition; and a water treatment step for treating the microneedle intermediate with water so as to remove the pore-forming agent and forming a porous structure in the needle-shaped section. The pore-forming agent contains water-soluble inorganic particles and a water-soluble resin.
A61K 47/18 - AminesAmidesUreasQuaternary ammonium compoundsAmino acidsOligopeptides having up to five amino acids
A61K 47/32 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. carbomers
A61K 47/34 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polyesters, polyamino acids, polysiloxanes, polyphosphazines, copolymers of polyalkylene glycol or poloxamers
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
C08J 9/26 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
C08J 9/42 - Impregnation with macromolecular compounds
24.
ARTICLE MANUFACTURING METHOD, IDENTITY DETERMINATION METHOD, AND MANUFACTURING SYSTEM
An article manufacturing method comprising an ink marking process in which an identity determination mark to be used to determine the identity of an article is formed on a marking surface using an ink, wherein the determination of the identity of an article involves comparing information obtained from an image of the identity determination mark on a genuine article with information obtained from an image of an identity determination mark on an article to be assessed, and the image of the identity determination mark has individuality resulting from the wet spreading of ink droplets.
H01L 23/00 - Details of semiconductor or other solid state devices
25.
BINDER AQUEOUS SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY AND MANUFACTURING METHOD THEREFOR, AND LITHIUM-ION BATTERY AND MANUFACTURING METHOD THEREFOR
Provided are: a binder aqueous solution for a lithium-ion battery, the binder aqueous solution comprising a water-soluble polymer (A), carbon nanotubes (B), and a compound (C) represented by general formula (1); an electrode slurry for a lithium-ion battery; an electrode for a lithium-ion battery and a manufacturing method therefor; and a lithium-ion battery and a manufacturing method therefor.
A pressure sensor (100) comprises: a conductive fabric (10) having a conductive linear body (20) and non-conductive fibers (40); and a conductive member (30) provided at a position facing the conductive fabric (10). In the pressure sensor (100), when no external force is applied in a direction for the conductive member (30) to move toward the conductive fabric (10), the conductive linear body (20) and the conductive member (30) are separated by the non-conductive fibers (40) and are in an electrically insulated, non-conductive state, and when an external force is applied in the direction for the conductive member (30) to move toward the conductive fabric (10), at least a portion of the conductive member (30) pushes aside and moves through the non-conductive fibers (40), so that the conductive member (30) and the conductive linear body (20) are in an electrically connected, conductive state.
G01L 5/00 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
G01L 1/20 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
27.
WORKPIECE PROCESSING FILM AND WORKPIECE PROCESSING METHOD
[Problem] To provide a workpiece processing film and a workpiece processing method with which it is possible to hold a workpiece while keeping an attachment surface clean by being attached to the workpiece during workpiece processing. [Solution] This workpiece processing film is used for processing a workpiece, wherein: the workpiece processing film is a substrate-less double-sided adhesive film; and when 10 μL of a toluene solvent, obtained by immersing a workpiece processing film having a size of 80 mm×100 mm in 15 g of toluene at 25ºC for 24 hours, is measured by gel permeation chromatography, and the measurement results are shown as a chromatogram in which the vertical axis is a detection voltage and the horizontal axis is an elution time from the introduction of the toluene solvent to the elution from a column, the peak area of a detection component from an elution time corresponding to a time when the number-average molecular weight in terms of standard polystyrene is 2,500,000 to an elution time corresponding to a time when the number-average molecular weight in terms of standard polystyrene is 200 is at most 4,000 mV∙sec.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a heat curable composition comprising a component (A) and a component (B), said heat curable composition having a thixotropic index (the viscosity at a shear rate of 1s-1divided by the viscosity at a shear rate of 103s-1) of not less than 1.1. The component (A) is a silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) (where R1 is represents a C6-20 aryl group that is unsubstituted or that has a substituent). The component (B) is one or more fillers selected from the group consisting of alumina, aluminum nitride, and zinc oxide.
Provided is a thermosetting composition which contains the component (A) and the component (B) described below, wherein the thixotropic index ((viscosity when shear rate is 1 s-1)/(viscosity when shear rate is 103 s-1)) is less than 1.1. Component (A): a silane compound polymer which has a repeating unit (repeating unit (1)) that is represented by formula (a-1) (wherein R1 represents an unsubstituted or substituted aryl group having 6 to 20 carbon atoms); Component (B): one or more fillers which are selected from the group consisting of alumina and zinc oxide
In this component manufacturing method, one surface of a workpiece is a fixed surface and the other surface is a ground surface, and the ground surface of the workpiece is ground in a state in which the fixed surface of the workpiece is fixed to a chuck table, wherein: the chuck table has a fixing portion for fixing an outer peripheral portion of the fixed surface of the workpiece and a recessed portion surrounded by the fixing portion; the outer peripheral portion of the fixed surface of the workpiece is fixed by means of the fixing portion of the chuck table; a space formed by the fixed surface of the workpiece that has been fixed to the fixing portion and the recessed portion of the chuck table is filled with one or more fluids selected from the group consisting of liquids and pressurized gases; and the ground surface of the workpiece is ground in a state in which the fixed surface of the workpiece is in contact with the fluid.
B24B 41/06 - Work supports, e.g. adjustable steadies
B23Q 3/08 - Work-clamping means other than mechanically-actuated
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
B24B 55/00 - Safety devices for grinding or polishing machinesAccessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
This laminate is used in an environment irradiated with light including infrared rays having a wavelength of 780 nm to 2500 nm, and satisfies the requirement (A), (B) or (C) below. This outdoor electronic apparatus is used in an environment irradiated with light including infrared rays having a wavelength of 780 nm to 2500 nm, wherein the laminate is disposed on a surface of the outdoor electronic apparatus on which the light is incident. (A) An infrared reflective layer is provided to the surface of the laminate on which light is incident, the total light transmittance being 3% or more, and the heat shielding coefficient being 0.90 or less. (B) An infrared absorption layer is provided to the surface of the laminate on which light is incident, the total light transmittance being 3% or more, and the heat shielding coefficient being 0.90 or less. (C) An infrared shielding layer is provided to the surface of the laminate on the light is incident, and a heat insulating layer is provided to a surface of the infrared shielding layer opposite to a surface on which external light is incident.
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
32.
ANTI-FINGERPRINT COMPOSITION, CURED ARTICLE LAYER, ANTI-FINGERPRINT ARTICLE, AND HARD COAT FILM
An anti-fingerprint composition comprising: at least one selected from a polyfunctional (meth)acrylate-based monomer, a (meth)acrylate-based prepolymer, and a urethane-based polymer; and a plasticizer, wherein when a cured article layer having a thickness of 10 μm and formed by curing the anti-fingerprint composition is formed on a polyethylene terephthalate film having a thickness of 125 μm and a surface of the cured article layer is rubbed back and forth 5 times over a distance of 10 cm using a #0000 steel wool with a load of 125 g/cm2, the number of scratches generated is 10 or less. According to such a cured article layer formed using the anti-fingerprint composition, the scratch resistance is excellent and a fingerprint residue of sebum can be made invisible without the need to wipe off the fingerprint residue.
C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
Provided is a π-type thermoelectric conversion module having excellent cooling performance with suppressed back-flow of heat, including: a pair of a first substrate including a first electrode and second substrate including a second electrode, the first substrate and the second substrate opposing each other; a thermoelectric conversion member A including a thermoelectric conversion element M; and a heat back-flow suppression member B including a thermoelectric conversion element K, the thermoelectric conversion member A and the heat back-flow suppression member B being arranged alternately and apart from each other between the first and second substrates, and electrically connected in series via the first electrode on the first substrate and the second electrode on the second substrate, in which carriers of the thermoelectric conversion element M and the thermoelectric conversion element K are different from each other, one of the carriers being a hole and the other of the carriers being an electron, and a sum SA (m2) of areas of surface sides of the thermoelectric conversion member A bonded to the first electrode and the second electrode is larger than a sum SB (m2) of areas of surface sides of the heat back-flow suppression member B bonded to the first electrode and the second electrode.
H10N 10/17 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
34.
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ADHESIVE SHEET
A pressure sensitive adhesive sheet includes at least a pressure sensitive adhesive layer, wherein a pressure sensitive adhesive constituting the pressure sensitive adhesive layer is an emulsion-type pressure sensitive adhesive containing a cyclic oligosaccharide, and an adhesive strength to soda-lime glass is 5 N/25 mm or more. The above emulsion-type pressure sensitive adhesive is preferably an emulsion-type acrylic-based pressure sensitive adhesive.
This method for removing a coating layer involves, in the following order, a preparation step for preparing a laminated film (for example, a roll (50C)) having a base material film and a coating layer, an ultrasonic treatment step for irradiating the laminated film with ultrasonic waves via water (W1), a removal step for removing the coating layer from the laminated film by treating the laminated film using treatment water or steam, and a recovery step for recovering the base material film, wherein: the coating layer includes a hydrophilic and water-insoluble intermediate layer, and a release agent layer; and the intermediate layer is disposed between the base material film and the release agent layer.
A method includes preparing a first substrate including a first main surface and a second main surface and having a thermoelectric element bonded to the first main surface, dispensing a bonding material to a predetermined position on a third main surface of a second substrate including the third main surface and a fourth main surface, aligning the thermoelectric element and the bonding material with each other by disposing the first substrate on the second substrate placed with the fourth main surface in contact with a placement surface of a fixture such that the first main surface faces the second substrate, and bonding the first substrate and the second substrate via the thermoelectric element and the bonding material by bringing the thermoelectric element and the bonding material into contact with each other.
A light diffusion control member includes a light diffusion control layer having a regular internal structure that includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index, and a diffusion pressure sensitive adhesive layer containing light-diffusing fine particles. L1, L2, and L3 identified from reflected light measured for the light diffusion control member (1a, 1b) satisfy the following expressions: (1) L1>1.00; (2) 0.70≤L2≤1.00; and (3) L3<2.00.
An aliphatic polycarbonate resin having an ether structure in its main chain and having a structure in which a repeating unit represented by Formula (Ia) below, a repeating unit represented by Formula (Ib) below, a repeating unit represented by Formula (Ic) below, and a repeating unit represented by Formula (Id) below are randomly copolymerized, wherein R1 and R2 are each a hydrocarbon group whose carbon number is 6 or more, and may be the same or different, and R3 and R4 are each a hydrocarbon group having a crosslinkable functional group and may be the same or different.
An aliphatic polycarbonate resin having an ether structure in its main chain and having a structure in which a repeating unit represented by Formula (Ia) below, a repeating unit represented by Formula (Ib) below, a repeating unit represented by Formula (Ic) below, and a repeating unit represented by Formula (Id) below are randomly copolymerized, wherein R1 and R2 are each a hydrocarbon group whose carbon number is 6 or more, and may be the same or different, and R3 and R4 are each a hydrocarbon group having a crosslinkable functional group and may be the same or different.
An electromagnetic wave absorbing member (10) includes an electromagnetic wave absorbing layer (20), a spacer layer (30), and a reflective layer (40). The electromagnetic wave absorbing layer (20), the spacer layer (30), and the reflective layer (40) are laminated in this order. A relative permittivity of the spacer layer (30) is 5 or greater, and a melting point of the spacer layer (30) is 150° C. or higher.
An aerial image forming device includes a display unit that has a display surface and emits light from the display surface; a light diffusion control unit that is disposed on the display surface side of the display unit and diffuses or transmits the light depending on its incident angle; and a light-transmitting image formation unit that is laminated on a surface side of the light diffusion control unit opposite to the display unit, transmits the light transmitted through the light diffusion control unit, and forms an image in a position on a surface side opposite to the light diffusion control unit. The light diffusion control unit has a louver-shaped regular internal structure that includes a plurality of plate-shaped regions having a relatively high refractive index in a region having a relatively low refractive index.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
Microneedle structure of the present invention includes a needle-shaped portion having an interior formed with a hole portion. The needle-shaped portion contains a low-melting-point resin having a weight-average molecular weight of 25,000 or more and a melting point of 130° C. or lower. Such a microneedle structure can be configured to have a needle-shaped portion having high strength.
G01N 5/02 - Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content
The present invention addresses the problem of providing an inkjet printing sheet that has an ink-receiving layer having excellent blocking resistance while having excellent ink adhesion and excellent water adhesion resistance of ink. The problem is solved by having a laminated structure in which an ink-receiving layer (X) and a base material (Y) are laminated, and the ink-receiving layer (X) is formed from a resin composition (x1) containing: an acrylic resin (A) having a crosslinkable functional group; a crosslinking agent (B); an ultraviolet curable acrylate compound (C); a photopolymerization initiator (D); and a silicone-based surface modifier (E) having a (meth)acryloyl group.
An adhesive agent for applications in which the adhesive agent itself is to be recycled, wherein the gel fraction (gel fraction G1) after being immersed for 72 hours in ethyl acetate is 25% or greater, and the gel fraction (gel fraction G2) after being immersed for 72 hours in a solvent resulting from mixing ethyl acetate and acetylacetone at a mass ratio of 9:1 is 25% or less. With this adhesive agent and an adhesive sheet that is provided with an adhesive agent layer comprising this adhesive agent, the adhesive agent itself can be recycled. It also becomes possible to recycle an adherend or substrate to which the adhesive agent layer was adhered.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
46.
RESIN COMPOSITION, BINDER RESIN, POLYMER THIN FILM AND BATTERY
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
where, in the formulae (1) and (2): R1 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; L1 and L2 are each independently a single bond or an alkylene group having 1 to 3 carbon atoms; and X1 is a reactive group selected from groups represented by a structural formula (2-1) and a structural formula (2-2) below.
A resin composition containing a copolymer, the copolymer including a constituent unit represented by a formula (1) below and 0.3 mol % or more and 20.0 mol % or less of a constituent unit represented by a formula (2) below,
where, in the formulae (1) and (2): R1 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; L1 and L2 are each independently a single bond or an alkylene group having 1 to 3 carbon atoms; and X1 is a reactive group selected from groups represented by a structural formula (2-1) and a structural formula (2-2) below.
A brittle adhesive sheet includes a film base material, and an adhesive layer provided at a first surface side of the film base material, wherein the film base material has a film base material main body formed of a polystyrene-based resin and a print receptive layer provided at a second surface side, opposite to a side of the film base material where the adhesive layer is provided, and the print receptive layer includes a polyester-based resin or an acrylic-based resin.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/26 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the laminating process, e.g. release layers or pressure equalising layers
48.
IMPROVED NERVE REGENERATION SCAFFOLD FOR ACCELERATED REGROWTH
Improved nerve regeneration scaffolds are disclosed, which include a plurality of modified nanotube yarn bundles disposed of within the scaffold lumen. The modified nanotube yarn bundles have enhanced hydrophilicity and water absorption. They are separated by distances to form channels corresponding to nerve fiber diameters to be occupied by regenerative nerve tissues. The channel walls have gaps between the yarn bundles for enhanced permeability. The scaffolds have reduced inflammatory infiltration and rejection response and support individual nerve fiber regrowth with a reduced likelihood of undesirable outcomes, such as nerve pain or reduced nerve function.
Functionalized nanofiber yarns with increased hydrophilicity with more than doubled water absorption property are provided. Methods of treatment for producing such functionalized nanofiber yarns are also provided.
D06M 11/34 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompoundsSalts derived from anions with an amphoteric element-oxygen bond with oxygen, ozone or ozonides
D06M 11/09 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with halogensTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with halogen acids or salts thereofTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxides or oxyacids of halogens or salts thereof with free halogens or interhalogen compounds
D06M 11/30 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with halogensTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with halogen acids or salts thereofTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxides or oxyacids of halogens or salts thereof with oxides of halogens, oxyacids of halogens or their salts, e.g. with perchlorates
D06M 11/48 - Oxides or hydroxides of chromium, molybdenum or tungstenChromatesDichromatesMolybdatesTungstates
D06M 11/50 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompoundsSalts derived from anions with an amphoteric element-oxygen bond with hydrogen peroxide or peroxides of metalsTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with oxygen, ozone, ozonides, oxides, hydroxides or percompoundsSalts derived from anions with an amphoteric element-oxygen bond with persulfuric, permanganic, pernitric, percarbonic acids or their salts
D06M 11/55 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with sulfur, selenium, tellurium, polonium or compounds thereof with sulfur trioxideTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with sulfur, selenium, tellurium, polonium or compounds thereof with sulfuric acid or thiosulfuric acid or their salts
D06M 11/64 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with nitrogen or compounds thereof, e.g. with nitrides with nitrogen oxidesTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with nitrogen or compounds thereof, e.g. with nitrides with oxyacids of nitrogen or their salts
Microneedle structure includes needle-shaped portions having hole portions formed therein and a base material having one surface side on which the needle-shaped portions are formed. Each of the needle-shaped portions is formed with a porous structure, and the value of tip strength of the needle-shaped portions is 40 mN or more. The method for producing a microneedle structure is used to produce the microneedle structure. Thus, it is possible to provide: a microneedle structure having needle-shaped portions that are suppressed in the defect or breakage during use; and a method for producing such a microneedle structure.
The present invention provides a label having excellent barrier property and transparency, wherein contamination of the container and adhesive residue due to the residual monomer in the adhesive layer are suppressed. The label is a label that is used for shrink-wrapping a container body of a resin container by wrapping around a barrel of the container body and heat-shrinking the shrinkable label, wherein the label comprises at least one heat shrinkable base material, a transparent vapor-deposited film consisting of an inorganic oxide, and an adhesive layer, and the adhesive layer comprises an adhesive composition comprising a triblock copolymer having a block structure of segment A1-segment B-segment A2.
A method of enhancing extreme ultraviolet (EUV) transmission and reducing scattering of a carbon nanostructure pellicle film is disclosed. The method includes annealing the carbon nanostructure pellicle film at least once at an elevated temperature before exposing the pellicle film to an EUV lithography process. The method further provides measures to maintain the annealed nanostructure pellicle film in an inert gas environment or vacuum.
A pellicle film has a porous structure. The pellicle film includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, and a standard deviation of an orientation angle of the carbon nanotubes is 8.0 degrees or less, the standard deviation being determined based on an approximate ellipse of a power spectrum image acquired by subjecting an image obtained by imaging the first pellicle film surface or the second pellicle film surface of the pellicle film to two-dimensional Fourier transform.
G03F 1/64 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof characterised by the frames, e.g. structure or material thereof
G03F 1/70 - Adapting basic layout or design of masks to lithographic process requirements, e.g. second iteration correction of mask patterns for imaging
Provided is an adhesive which contains an oxygen absorbent and is used in optical applications. When a laminate obtained by bonding two 7.0 cm square soda-lime glass plates which has a thickness of 1.1 mm with an adhesive layer which is formed from the adhesive and has a thickness of 250 μm is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 24 hours, there is no bubble at the edge of the laminate after the endurance condition, or when the laminate is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 96 hours, the number of needle-shaped bubbles present at the edge of the laminate after the endurance condition is less than 5. This adhesive makes it possible to suppress the generation of needle-shaped bubbles at the edge of an optical member.
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C09J 133/04 - Homopolymers or copolymers of esters
C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
56.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a vinyl ether (a) having a hydroxypolyoxyalkylene chain including two or more C1-3 oxyalkylene units. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
57.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-50 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
58.
COATING LAYER REMOVAL DEVICE AND COATING LAYER REMOVAL METHOD
A coating layer removal device 100 includes: a roll-out shaft 10 that rolls out a laminated film 90; a first backup roll 21 that contacts a base film of the laminated film 90 and transports the laminated film downstream; a first spray unit 31 that is disposed facing the first backup roll 21 and that includes one or more nozzles; a second spray unit 32 that is disposed downstream of the first spray unit, is disposed facing a second backup roll 22 and includes one or more nozzles; a pressurized water supply unit 50 that supplies pressurized water to the first spray unit 31 and the second spray unit 32; and a roll take-up shaft 40 that takes up the base film 91 into a roll shape after the coating layer has been removed. The pressurized water supply unit 50 includes one or more pumps.
Provided is a winding roll 1 in which a laminate film 90 includes: a release film including a base material film 91 and a release agent layer 92; and a ceramic green sheet including green sheet parts 931, 932. The green sheet parts 931, 932 are each arranged along a longitudinal direction of the laminate film 90. A recess 94 sandwiched by the green sheet parts 931, 932 is formed on the release agent layer 92. The laminate film 90 is wound around a shaft core 80 by traverse winding having a size of a swing width α. When viewed in a cross section orthogonal to the longitudinal direction of the laminate film 90, the size of the swing width α is, for example, greater than a width β1 from an edge end of the laminate film 90 on a first end part E1 side to an inner side of the first green sheet part 931.
This wiring sheet (100) comprises a wiring body (2) provided with electrically conductive linear bodies (21), and a pair of electrodes (4) that are in direct contact with the electrically conductive linear bodies (21), wherein the electrically conductive linear bodies (21) have an infrared reflectance of 0% to 90% inclusive at a wavelength of 1000 nm, and have a rate of change in resistance value of 50% or less after being allowed to stand for 1000 hours in a hot, humid environment at a temperature of 85°C and a relative humidity of 85% RH.
H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
61.
PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND DEVICE
[Problem] To provide a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive having excellent resistance to bleaching by humidity. [Solution] This pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive for bonding a first member to a second member, wherein the pressure-sensitive adhesive is a polyester-based pressure-sensitive adhesive containing a surfactant. The pressure-sensitive adhesive has a gel content of preferably 60% or less. The polyester-based pressure-sensitive adhesive preferably has a crosslinking structure including at least a polyester-based polymer and a crosslinking agent.
C09J 167/00 - Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chainAdhesives based on derivatives of such polymers
62.
WINDOW FILM AND METHOD FOR MANUFACTURING FRONT WINDOW EQUIPPED WITH WINDOW FILM
Provided is a window film having a high heat-insulating performance that is capable of suppressing the occurrence of wrinkles in a resin film when forming a hard coat layer and of following the shape of an adherend at the time of sticking. A window film (1) has a resin film (10) and a hard coat layer (11) disposed on one main surface of the resin film (10). Assuming that the shrinkage rate in an MD direction of the resin film (10) when the resin film (10) is held at 180°C for 5 minutes is A% and that the shrinkage rate in a CD direction is B%, A-B is 0.4% or more. The hard coat layer (11) contains tin-doped indium oxide.
[Problem] To provide a window film that, despite including a transparent resin film, achieves visibility with respect to an outside light source and the property of making it impossible to see an inside part. [Solution] A window film comprising a transparent resin film and a colored adhesive layer which is disposed on one main surface of the resin film, said window film exhibiting total light transmittance of not more than 70% and a haze value of not more than 5%.
Disclosed are: a method for producing a silane compound polymer, the method including a step in which a trifunctional alkoxysilane compound represented by formula (a-1) R133 (wherein R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent, each OR represents an alkoxy group, and OR may be the same as or different from each other) is hydrolyzed and polycondensed in the presence of a solvent that satisfies the requirements 1 and 2 described below; and a method for producing a semiconductor insulating film forming agent. Requirement 1: The solvent is azeotropic with water. Requirement 2: The solvent is a polyether-based solvent.
3/23/2 , and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent]; a semiconductor insulating material comprising the silane compound polymer; and a semiconductor insulating film-forming agent containing the silane compound polymer.
3/23/2 [Me represents a methyl group], and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent], wherein the weight average molecular mass (Mw) is 1,500 or more. The present invention further provides a semiconductor insulating material comprising the silane compound polymer, and a semiconductor insulating film-forming agent containing the silane compound polymer.
[Problem] To provide a window film that is suitable for high-mix low-volume production and demonstrates concealing properties as well as visibility of external light sources. [Solution] This window film has a transparent first resin film, a transparent second resin film, and a colored intermediate layer. The intermediate layer is disposed between one main surface of the first resin film and one main surface of the second resin film. The window film has a total light transmittance of 60% or less and a haze value of 8% or less.
Provided is a thermoelectric conversion module including a release sheet in which thermoelectric performance is not suppressed, a function as a support base material during a manufacturing process is provided and deformation and damage during conveyance and handling are suppressed. The thermoelectric conversion module includes: a thermoelectric element layer in which a P-type thermoelectric element and an N-type thermoelectric element are arranged alternately and electrically connected in series; a first conductive layer provided on a first surface of the thermoelectric element layer; a first pressure sensitive adhesive layer provided on a surface of the first conductive layer on a side opposite to a surface on the thermoelectric element layer side; and a first release sheet provided on a surface of the first pressure sensitive adhesive layer on a side opposite to a surface on the first conductive layer side. A curvature of the first release sheet is R1000 or greater when the first release sheet is cut to a length of 250 mm and suspended at a center in a length direction.
B32B 3/08 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
T={(Tp−Td)/(Tb−Td)}×100 (Numerical Formula 1)
A pellicle film having a porous structure includes carbon nanotubes. The pellicle film has a first pellicle film surface and a second pellicle film surface on a side opposite to the first pellicle film surface, a visible light transmittance calculated by a numerical formula (Numerical Formula 1) below is in a range from 60% to 85%, and a standard deviation of the visible light transmittance is 0.56% or less.
T={(Tp−Td)/(Tb−Td)}×100 (Numerical Formula 1)
(In the numerical formula (Numerical Formula 1), T represents a visible light transmittance of the pellicle film, Tp represents a pixel value in the image of the pellicle film in the light-transmitting state, Tb represents a pixel value in the image of the image-capturing position in the bright state, and Td represents a pixel value in the image of the image-capturing position in the dark state.)
This method for using a degradable film comprises: a step for preparing a degradable film containing an aliphatic polycarbonate and an acid/base generator that generates an acid or a base due to energy ray irradiation, the adhesive resin content of said degradable film other than the aliphatic polycarbonate being 10 mass% or less; an exposure step for exposing the entire surface of the degradable film or a portion thereof in plan view with an energy beam; and a decomposition step for heating the degradable film and decomposing the entire surface of the degradable film or the portion thereof in plan view. According to the aforementioned method for using the degradable film, the degradable film can easily be decomposed.
This binder for firing contains an aliphatic polycarbonate that has a carbonate structure in a main chain and has a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3, and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. By using the above binder for firing, solid matter of a carbon compound derived from the binder does not remain in a sintered body, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains a structural unit derived from a hydroxyl-group-containing vinyl ether (a), and a structural unit derived from an ethylenically unsaturated monomer (b) having a sulfonic acid group or a salt thereof. The amount of the structural unit derived from the hydroxyl-group-containing vinyl ether (a) contained in the water-soluble polymer (A) is 5-80 mol% in all structural units of the water-soluble polymer (A), and the amount of the structural unit derived from the ethylenically unsaturated monomer (b) having the sulfonic acid group or a salt thereof in the water-soluble polymer (A) is 5-30 mol% in all structural units of the water-soluble polymer (A).
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). The viscosity of an aqueous solution containing 13 mass% of the water-soluble polymer (A) as measured by a B-type viscometer at 23°C is 3,000 mPa·s or more. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
74.
ADHESIVE SHEET, METHOD FOR PRODUCING SAME, AND OPTICAL LAMINATE
The present invention pertains to an adhesive sheet that is characterized by having a substrate layer and an adhesive agent layer, and that is characterized in that the thickness of the adhesive agent layer is 100 μm or more, and the adhesive agent layer is formed from an adhesive agent that exhibits, when an adhesive agent layer having a thickness of 500 μm is obtained, a chromaticity b*value of -3.0 or more stipulated by the CIE1976L*a*b* color system in a reflection mode of the adhesive agent layer. The present invention also pertains to: a method for producing the adhesive sheet; and an optical laminate provided with the adhesive sheet. The present invention provides: an adhesive sheet that improves, when an adhesive sheet having a thick adhesive agent layer is applied to the outermost surface of an optical laminate, the phenomenon in which the optical laminate appears bluish white; a method for producing the adhesive sheet; and an optical laminate comprising the adhesive sheet.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
The present invention provides a thermoelectric conversion material layer having improved electrical conductivity and high thermoelectric performance. Provided is a thermoelectric conversion material layer comprising thermoelectric semiconductor particles and monometallic particles, wherein, in a longitudinal cross-section that includes the center part of the thermoelectric conversion material layer, the area ratio of a region occupied by the monometallic particles to a region occupied by the thermoelectric semiconductor particles and the monometallic particles is 1-50%.
Provided are: a curable composition comprising the following component (A) and component (B), wherein the total amount of the component (A) and the component (B) is at least 98 mass% with respect to the total amount of the curable composition; and a semiconductor insulating film-forming agent. The (A) component is a silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) [R1represents a fluoroalkyl group] and a repeating unit [repeating unit (2)] represented by formula (a-2) [R2 represents an unsubstituted hydrocarbon group or a hydrocarbon group (excluding a fluoroalkyl group) having a substituent, wherein the amount of the repeating unit (1) is at least 40 mol% with respect to the total amount of the repeating unit (1) and the repeating unit (2). (B) is a solvent.
C08L 83/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
H01L 21/316 - Inorganic layers composed of oxides or glassy oxides or oxide-based glass
77.
CURABLE COMPOSITION AND SEMICONDUCTOR INSULATING FILM FORMING AGENT
Provided are a curable composition and a semiconductor insulating film forming agent, the curable composition containing component (A) and component (B) and having a viscosity of 1,000 mPa·s or less at 23°C. Component (A): A silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) (a-1): R13/23/2 [R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent.] Component (B): A solvent satisfying requirements 1 and 2 Requirement 1: A solvent azeotropic with water. Requirement 2: A polyether-based solvent.
This binder for firing contains an aliphatic polycarbonate having a carbonate structure in a main chain and a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate has a weight average molecular weight of 50,000-170,000 inclusive. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. According to the binder for firing, the solid matter of the carbon compound derived from the binder does not remain in a sintered product, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
A pressure sensitive adhesive composition containing a multimer of modified cyclodextrin; a pressure sensitive adhesive obtained from the pressure sensitive adhesive composition; and a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer formed of the pressure sensitive adhesive. The multimer of modified cyclodextrin is preferably a dimer. The pressure sensitive adhesive is preferably an acrylic-based pressure sensitive adhesive and, in particular, preferably contains a crosslinked product obtained by crosslinking a (meth)acrylic ester polymer using a crosslinker.
Provided is a workpiece processing sheet comprising: a release sheet having a release agent layer on one surface side of glassine paper; and a work attachment layer laminated on a surface of the release agent layer on the opposite side to the glassine paper. The workpiece processing sheet can greatly contribute to reducing carbon dioxide emissions and decreasing the use of plastic materials.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/00 - Adhesives in the form of films or foils
C09J 7/40 - Adhesives in the form of films or foils characterised by release liners
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
81.
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING AND STRUCTURE
An adhesive (1A) for high-frequency dielectric heating contains: (A) a thermoplastic resin containing a styrene-based thermoplastic elastomer (a1) and a thermoplastic resin (a2) other than the styrene-based thermoplastic elastomer (a1); and (B) a dielectric filler. The content of the styrene component with respect to the entirety of the thermoplastic resin (A) is 20.0-45.0 mass%, the storage elastic modulus in an environment at 110°C is 300 MPa or more, and the complex viscosity at a shear rate of 600 rad/s in an environment of 220°C is 350Pa·s or less.
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
82.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. The adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recessions on the front surface thereof. The adhesive layer has a polymer having an energy ray-curable group.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
83.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention facilitates the pick up of an object held on an adhesive sheet having an adhesive layer comprising protrusions and recesses on the surface thereof. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive sheet can be extended in the surface direction. When the adhesive sheet is attached to an object, the bonding area ratio of the adhesive sheet to the object is 4%-60%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
84.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention suppresses the deformation of protrusions and recesses on the surface of an adhesive layer when an object is attached to the adhesive layer. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The gel fraction of the adhesive layer is 90%-100%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
85.
METHOD OF PRODUCING AN ADHESIVE SHEET OR A RELEASE LINER
A release liner which makes it difficult for an adhesive layer to impair slidability and makes it easy to exhibit an adhesive force suitably, a method of producing a release liner, an adhesive sheet, and a method of producing an adhesive sheet. A release liner has a surface provided with a ridge portion extending linearly, and on the surface, a plurality of recesses having different depths are randomly formed in a surface direction and are continuously connected.
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer has energy ray reactivity, and the value of (loss tangent (tanδ) at 50° C) / (tanδ at 30° C) of the adhesive layer after energy ray irradiation is 1.30 or more.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
87.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object held on an adhesive sheet provided with protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer contains an acrylic acid ester copolymer, and the copolymerization ratio of an energy ray-curable group-containing monomer in the acrylic acid ester copolymer is 20%-50%.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
88.
METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET AND METHOD FOR MANUFACTURING ARTICLE
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. Provided is a method for peeling an object from an adhesive sheet that comprises a base material and an energy reactive adhesive layer having protrusions and recessions on the surface thereof, the adhesive sheet holding the object on the adhesive layer. Energy is applied to the adhesive sheet. The adhesive sheet is expanded in the plane direction. The object is peeled from the adhesive layer of the adhesive sheet after energy has been applied and the sheet has been expanded in the plane direction.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 133/04 - Homopolymers or copolymers of esters
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
89.
SEMICONDUCTOR DEVICE AND COMPOSITION FOR FORMING BACK SURFACE PROTECTIVE FILM
This semiconductor device comprises a semiconductor substrate, a back surface protective film that protects the back surface of the semiconductor substrate, and a forgery prevention layer that is provided on the back surface protective film and contains a pattern-forming substance that forms an authenticity-determining pattern, wherein the back surface protective film contains an inorganic pigment.
The present invention provides a semiconductor device comprising a semiconductor substrate, a protective layer that protects the semiconductor substrate, and anti-counterfeit layer provided on the protective layer. The anti-counterfeit layer includes a pattern-forming substance that forms a pattern for determining the authenticity of the semiconductor device. The protective layer contains a spherical filler.
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japan)
Inventor
Takano, Ken
Matsuno, Sayaka
Sugimoto, Hiroshi
Fujii, Minoru
Abstract
A composition for a forgery prevention layer for forming a forgery prevention layer in a semiconductor device includes pattern formation particles formed by an inorganic material having a refractive index n of 3 or more.
An LED lamp (1) that can be used in a low-temperature environment, comprising: an LED lamp unit (2) that has an LED element; a housing (3) that houses the LED lamp unit (2); and a transparent cover member (4) that transmits light from the LED lamp unit (2). The LED lamp (1) is also provided with an infrared absorption member (infrared absorption layer (6)) that absorbs infrared rays from the LED lamp unit (2) and generates heat, at a position at which heat generated by the infrared absorption member (infrared absorption layer (6)) is conducted to the transparent cover member (4). The LED lamp (1) makes it possible to heat the transparent cover member (4) and solve problems resulting from use in a low-temperature environment.
A LED lamp 1 that may be used in a low-temperature environment comprises: an LED lamp unit 2 having an LED element; a housing 3 that houses the LED lamp unit 2; and a transparent cover member 4 that transmits light from the LED lamp unit 2, an infrared absorbing member (infrared absorbing layer 6) that absorbs infrared rays from the LED lamp unit 2 and generates heat being provided at a position where heat generated by the infrared absorbing member (infrared absorbing layer 6) is conducted to the transparent cover member 4. According to this LED lamp 1, the transparent cover member 4 can be heated, and problems encountered in low-temperature environments can be overcome.
F21S 45/60 - Heating of lighting devices, e.g. for demisting
F21S 41/148 - Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
An LED lamp (1) that can be used in a low-temperature environment comprises: an LED lamp unit (2) having an LED element; a housing (3) that houses the LED lamp unit (2); a transparent cover member (4) that transmits light from the LED lamp unit (2); and a film heater (6). The film heater (6) is provided at a position at which heat generated by the film heater (6) is conducted to the transparent cover member (4). According to the LED lamp (1), ice, snow, and water droplets adhered to the transparent cover member (4) can be removed.
This mid-air image formation device 10a, 10b comprising a display part 1, a light transmission and image formation part 3, a light diffusion control part 2, and an adhesion layer 4, wherein the light transmission and image formation part 3 transmits light originating from the display part 1 and forms an image at a position on the surface side opposite from the display part 1, the light diffusion control part 2 diffuses or transmits light incident on the inside of the light diffusion control part 2 depending on the incident angle thereof, and has a louver-shaped regular internal structure comprising, within a region having a relatively low refractive index, a plurality of plate-shaped regions each having a relatively high refractive index, and the adhesion layer 4 comprises any one of an adhesive, a pressure-sensitive adhesive, and a hardenable pressure-sensitive adhesive, and the number of acidic groups present in the adhesion layer 4 with respect to all components constituting the adhesion layer 4 is 0.050 mmol/g or less. This mid-air image formation device 10a, 10b has excellent durability and makes it possible to satisfactorily view a mid-air image.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
The present invention provides an aerial image forming device 10a, 10b, 10c comprising: a display part 1 which has a display surface and emits light from the display surface; a light transmission and image formation part 2 which is arranged on the display surface side of the display part 1, transmits the light, and forms an image at a position on a surface side opposite to the display part 1; and a coat layer 3 which is laminated on the light transmission and image formation part 2, on the surface side opposite to the display part 1, and contains a plasticizer. The aerial image forming device 10a, 10b, 10c has excellent antifouling properties, and the visibility of an aerial image is improved.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
This operation detection device includes an operation detection unit that detects operation information relating to a part of a user in order to convert the operation information into an operation command corresponding to a device by an operation detection member attached to said part, the part being a body port that can be bent/stretched, the device being subject to an operation. Accordingly, operation information relating to a part of a user can be intuitively converted into an operation command corresponding to a device subject to an operation.
The present invention provides an aerial image forming device 10a, 10b comprising: a display unit 1 which has a display surface and which emits light from the display surface; a light-transmissive image forming unit 2 which is disposed on the display-surface side of the display unit 1, transmits the light, and causes an image to be formed at a position on the opposite side of the display unit 1; and an antistatic layer 3 containing an antistatic agent and laminated on the surface of the light-transmissive image forming unit 2 that is on the display unit 1 side or on the surface of the light-transmissive image forming unit 2 that is on the side opposite from the display unit 1. The aerial image forming device 10a, 10b has excellent antistatic properties and excellent visibility.
G02B 30/56 - Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels by projecting aerial or floating images
A film for latex ink including a latex ink-receiving layer achieving excellent ink adhesion and excellent scratch resistance. A film having a laminate structure in which a latex ink-receiving layer and a substrate are layered, and the latex ink-receiving layer formed from a resin composition containing an acrylic resin having a cross-linkable functional group, a specific cross-linking agent, an ultraviolet curable acrylate compound, and a photopolymerization initiator.
C08J 7/043 - Improving the adhesiveness of the coatings per se, e.g. forming primers
B41M 5/00 - Duplicating or marking methodsSheet materials for use therein
B41M 5/50 - Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
An electromagnetic wave absorption member (1) has a resistance layer (10), a spacer layer (20), and a reflection layer (30). The resistance layer (10), the spacer layer (20), and the reflection layer (30) are laminated in this order. The resistance layer (10) has a conductor pattern (11). The conductor pattern (11) is embedded in the spacer layer (20) in a surface (20a) that is on the reverse side from a surface (20b) facing the reflection layer (30).
