40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Manufacture of semiconductor wafers and semiconductor substrates; Treating and processing semiconductor wafers and semiconductor substrates, namely, automated ozone gas incorporated into a fluid carrier media, combined with or without additive aqueous chemicals, for the manufacture of semiconductor wafers and semiconductor substrates run as a production method performed on an automated platform.
Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.
B05B 1/16 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openingsNozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with strainers in or outside the outlet opening having selectively-effective outlets
B05B 1/20 - Perforated pipes or troughs, e.g. spray boomsOutlet elements therefor
B05B 1/30 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
B05B 15/658 - Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits the spraying apparatus or its outlet axis being perpendicular to the flow conduit
B05B 1/04 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops in flat form, e.g. fan-like, sheet-like
3.
Systems and methods for a spray measurement apparatus
Various embodiments of a spray measurement system having a jig device that allows measuring spray output of one or more spray nozzles and determine spray distribution patterns of the spray nozzles are disclosed.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01F 3/36 - Measuring the volume flow of fluids or fluent solid material wherein the fluid passes through the meter in successive and more or less isolated quantities, the meter being driven by the flow with stationary measuring chambers having constant volume during measurement
B05B 12/00 - Arrangements for controlling deliveryArrangements for controlling the spray area
Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.
B05B 1/30 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
B05B 15/65 - Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits
B05B 1/20 - Perforated pipes or troughs, e.g. spray boomsOutlet elements therefor
B05B 1/16 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openingsNozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with strainers in or outside the outlet opening having selectively-effective outlets
5.
Systems and methods for a spray measurement apparatus
Various embodiments of a spray measurement system having a jig device that allows measuring spray output of one or more spray nozzles and determine spray distribution patterns of the spray nozzles are disclosed.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01F 3/36 - Measuring the volume flow of fluids or fluent solid material wherein the fluid passes through the meter in successive and more or less isolated quantities, the meter being driven by the flow with stationary measuring chambers having constant volume during measurement
B05B 12/00 - Arrangements for controlling deliveryArrangements for controlling the spray area
Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.
B05B 1/16 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openingsNozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with strainers in or outside the outlet opening having selectively-effective outlets
B05B 1/20 - Perforated pipes or troughs, e.g. spray boomsOutlet elements therefor
B05B 1/30 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
B05B 15/658 - Mounting arrangements for fluid connection of the spraying apparatus or its outlets to flow conduits the spraying apparatus or its outlet axis being perpendicular to the flow conduit
B05B 1/04 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops in flat form, e.g. fan-like, sheet-like
7.
Apparatus and method for cleaning and drying a container for semiconductor workpieces
The invention provides an apparatus for cleaning and drying a container for semiconductor workpieces. The apparatus comprises a load port with a fixture that receives a dirty container and delivers it to a deck assembly with a carrier that removably receives the container for further handling. While the container is received by the carrier, a robot with a first end effector removes the container door and places it on a portion of the carrier. The robot includes a second end effector that engages the carrier and elevates the carrier and container for insertion into a process chamber. The process chamber includes a rotor with at least one receptacle wherein the rotor is rotated to create both high pressure and low pressure regions. Once the container and carrier are loaded into the rotor, the rotor is rotated and means for cleaning injects a processing fluid onto the container and carrier. After a rinse stage and while the rotor is rotating, the means for drying delivers air across the container and carrier. Upon completion of the drying stage, the robot removes both the container and the carrier from the process chamber and reassembles the door to the container such that container can be returned to use.
