The present invention relates to plasma-resistant glass, an inner chamber-component for a semiconductor manufacturing process, and manufacturing methods therefor, and, specifically, to plasma-resistant glass, an inner chamber-component for a semiconductor manufacturing process, and manufacturing methods therefor, the glass having a low melting point implemented by controlling the amount of plasma-resistant glass ingredients, having a lowered coefficient of thermal expansion so that, when used at a high temperature, damage thereto caused by thermal shock can be prevented, and having improved light transmittance and durability.
C03C 4/20 - Compositions for glass with special properties for chemical resistant glass
C03C 3/091 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium
C03C 3/085 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
2.
PLASMA POWDER DEPOSITION APPARATUS AND DEPOSITION METHOD USING SAME
The present invention relates to a plasma powder deposition apparatus and a deposition method using same, and specifically to: a plasma powder deposition apparatus which is provided in plurality so that the surfaces of powder particles are melted by plasma and the spray angle of the powder particles is adjusted or varied, thus improving the deposition rate and the density of a deposition layer and relieving stress while improving the thickness of the deposition layer, and also improving the uniformity of the coating thickness on a substrate; and a deposition method using same.
C23C 24/10 - Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
C23C 24/04 - Impact or kinetic deposition of particles
KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY (Republic of Korea)
Inventor
Kim, Dae Gean
Seok, Hye Won
Lee, Mun Ki
Kim, Hyeong Jun
Abstract
The present invention relates to plasma-resistant glass containing 32-52 mol % of SiO2, 5-15 mol % of Al2O3, 30-35 mol % of CaO, and 0.1-15 mol % of CaF2 as chemical components, and a manufacturing method thereof. According to the present invention, a glass stability index KH is 2.0 or higher, and a plasma-resistant characteristic of an etch rate of lower than 10 nm/min for a mixed plasma of fluorine and argon (Ar) is exhibited.
The present invention relates to a plasma-resistant glass, chamber interior parts for a semiconductor manufacturing process, and methods for manufacturing same, and specifically, to a plasma-resistant glass and a method for manufacturing same, wherein the content of components of the plasma-resistant glass can be controlled to reduce the thermal expansion coefficient of the glass and thereby prevent the glass from being damaged due to thermal shock when used at a high-temperature.
C03C 3/085 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
C03B 11/12 - Cooling, heating, or insulating the plunger, the mould, or the glass-pressing machine
C03C 3/087 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
C03C 4/20 - Compositions for glass with special properties for chemical resistant glass
KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY (Republic of Korea)
Inventor
Kim, Dae Gean
Seok, Hye Won
Lee, Mun Ki
Kim, Hyeong Jun
Abstract
2232HH is 2.0 or higher, and a plasma-resistant characteristic of an etch rate of lower than 10 nm/min for a mixed plasma of fluorine and argon (Ar) is exhibited.
C03C 3/112 - Glass compositions containing silica with 40% to 90% silica by weight containing halogen or nitrogen containing fluorine
C03C 3/087 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
8.
Forming method of yttrium oxide fluoride coating film and yttrium oxide fluoride coating film prepared thereby
A forming method of an yttrium oxide fluoride (YOF) coating film and a (YOF) coating film formed thereby are disclosed. The YOF coating film has no or extremely small pores therein and a nanostructure to increase light transmittance thereof, and has high hardness and high bonding strength and thus can protect a transparent window of a display device. The method for forming an YOF coating film involves the steps of: providing pretreated YOF powder having a particle diameter ranging from 0.1 to 12 μm; receiving a transfer gas supplied from a transfer gas supply unit and receiving the pretreated YOF powder supplied from a powder supply unit to transfer the pretreated YOF powder in an aerosol state; and colliding/smashing (spraying) the pretreated YOF powder transferred in the aerosol state with/onto a substrate in a process chamber to form an YOF coating film on the substrate.
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
C23C 24/04 - Impact or kinetic deposition of particles
H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
C23C 4/10 - Oxides, borides, carbides, nitrides or silicidesMixtures thereof
C23C 24/00 - Coating starting from inorganic powder
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C23C 4/12 - Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
An embodiment of the present invention relates to a coating film forming method and a coating film formed thereby. The technical objective is to provide: a coating film forming method for mixing a yttrium oxide (Y2O3) powder and a yttrium fluoride (YF3) powder in predetermined diameter ranges and in a predetermined weight ratio, and pulverizing the mixture powder by allowing the mixture powder to collide with a substrate by aerosol deposition, thereby enabling a yttrium oxide fluoride coating film having desired XRD crystal characteristics and an EDS atomic ratio, which are suitable for a processing environment, to be implemented at low cost; and a coating film formed thereby. To this end, disclosed in an embodiment of the present invention are a coating film forming method and a coating film formed thereby, the method comprising the steps of: providing a mixture powder comprising yttrium (Y), oxygen (O) and fluorine (F); and forming a YOF coating film on a substrate by using the mixture powder, wherein the atomic ratio of Y:O:F according to X-ray photoelectron spectroscopy (XPS), of the YOF coating film, is 1:1:1.
Various embodiments of the present invention relate to a method for forming an yttrium oxide fluoride coating film and an yttrium oxide fluoride coating film formed thereby. The technical task to be solved is to provide a method for forming an yttrium oxide fluoride coating film which has no or extremely small pores therein and a nanostructure to increase light-permeability thereof, and has high hardness and high bonding strength and thus can protect a transparent window of a display device, and yttrium oxide fluoride coating film formed thereby. To this end, the method for forming an yttrium oxide fluoride coating film according to various embodiments of the present invention comprises the steps of: providing a pretreated YOF powder having a particle diameter ranging from 0.1 to 12μm; receiving a transfer gas supplied from a transfer gas supply unit and receiving the pretreated YOF powder supplied from a powder supply unit to transfer the pretreated YOF powder in an aerosol state; and colliding/smashing (spraying) the pretreated YOF powder transferred in the aerosol state with/onto a substrate in a process chamber to form an yttrium oxide fluoride coating film on the substrate.
The present invention relates to a glass coating structure and a method for forming the same. A technical problem to be solved is to provide a glass coating structure having high light transmittance without grain boundary and a method of forming the same, by coating glass powder on a base material by a vacuum injection method at room temperature and then performing a heat treatment process. To this end, disclosed are a glass coating structure comprising: a base material; and a transparent coating layer without grain boundary formed by heat-treating an opaque coating layer with a grain boundary formed by mechanical impact of glass powder on the base material, and a method of forming the same.
The present invention relates to a composite structure, and a method for forming same, and the technical issues to be solved are to provide a composite structure that can prevent damage and breaks to the substrate surface due to mechanical impact during functional layer formation by forming the functional layer after protecting the substrate surface, which can develop fine cracks or etching due to high surface roughness or powder particle collisions, by forming a buffer layer thereon, and a method for forming the composite structure. To that end, disclosed are the composite structure, and method for forming same, the composite structure comprising: a substrate which has surface roughness of 0.1 ㎛ or greater or which is made of organic material; a buffer layer in which buffer powder is coated on the substrate by means of mechanical impact; and a functional layer in which functional powder is coated on the buffer layer by means of mechanical impact, wherein the strength of the buffer layer is less than the strength of the functional layer.
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B05D 7/02 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
13.
METHOD FOR FORMING TRANSPARENT FLUORINE FILM, AND TRANSPARENT FLUORINE FILM FORMED THEREBY
One embodiment of the present invention relates to a method for forming a transparent fluorine film, and a transparent fluorine film formed thereby, and the technical issues to be resolved are to provide a method for forming a transparent fluorine film, and transparent fluorine film formed thereby that can protect the transparent windows of display devices by having not only high transmissivity due to no or extremely small nano-structured pores in the interior, but also having high strength and adhesiveness. To that end, disclosed are a method for forming a transparent fluorine film, and a transparent fluorine film formed thereby, the method comprising the steps of: receiving transport gas from a transport gas supply unit and YF3 powder from a powder supply unit, and transporting the YF3 powder in aerosol form; and colliding and crushing the YF3 powder transported in aerosol form against a substrate in the interior of a processing chamber, and forming a transparent YF3 film on the substrate.
The present invention relates to a method for forming a ceramic coating having improved plasma resistance and a ceramic coating formed thereby. The present invention discloses the method for forming the ceramic coating having improved plasma resistance and the ceramic coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of ceramic powders having a first powder particle size range, and transporting the powders using a transport gas; and forming a ceramic coating in which a plurality of first ceramic particles within a first coating particle size range and a plurality of second ceramic particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported ceramic powders to collide with a substrate inside a process chamber, at the speed of 100 to 500 m/s so as to be pulverized.
C23C 24/04 - Impact or kinetic deposition of particles
C23C 16/06 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
C04B 35/505 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare earth compounds based on yttrium oxide
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized.
C23C 24/04 - Impact or kinetic deposition of particles
C23C 16/06 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
C04B 35/505 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare earth compounds based on yttrium oxide
C04B 35/622 - Forming processesProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
Disclosed is a power transmission shaft capable of performing a fuse-like function with respect to excessive torque when excessive torque is applied to a power input side. The power transmission shaft comprises: a main shaft connected to a power device; flanges provided at both sides of the main shaft so as to be connected to the power device; and a flexible coupling extending in the radial direction of the main shaft, wherein the power transmission shaft is provided with a power shutoff unit, formed at one part of at least one of the main shaft and the flanges, which shuts off power by breaking the main shaft or the flanges when torque greater than a predetermined level is applied. As such, when excessive torque is applied to the power input side, the power transmission shaft performs a fuse-like function with respect to the excessive torque, whereby it is possible to enhance safety, prevent sparks from occurring at the time of breakage of the flanges or the shaft, facilitate the production thereof, and effectively prevent vibration while sufficiently supporting the speed or load in the event of a high rotation rate.
F16D 9/06 - Couplings with safety member for disconnecting by breaking due to shear stress
F16D 9/08 - Couplings with safety member for disconnecting by breaking due to shear stress over a single area encircling the axis of rotation, e.g. shear necks on shafts
F16D 3/79 - Yielding couplings, i.e. with means permitting movement between the connected parts during the drive with the coupling parts connected by one or more intermediate members shaped as an elastic disc or flat ring, arranged perpendicular to the axis of the coupling parts, different sets of spots of the disc or ring being attached to each coupling part, e.g. Hardy couplings the disc or ring being metallic
Disclosed is a power transmission shaft which, by alleviating the phenomenon in which stress is concentrated on a specific portion of a diaphragm, has improved fatigue life span. The power transmission shaft, which connects a power apparatus, comprises a flexible coupling, which is configured by a hub unit positioned inside in a radial direction, a rim unit positioned outside in a radial direction of the hub unit, and a flexible diaphragm unit positioned between the hub unit and the rim unit, wherein the thickness in the axial direction of the flexible diaphragm unit, from the hub unit toward the rim unit, becomes thinner then thicker and thereby has a minimum thickness interval, wherein the flexible diaphragm unit has a contoured first side on one side in the axial direction and a contoured second side on the other side, wherein the first side has a first inflection point and the second side has a second inflection point, and wherein the first inflection point is formed at a different position in a radial direction with respect to the second inflection point. Accordingly, fatigue properties of the diaphragm are improved by alleviating the phenomenon in which stress is concentrated on a specific portion of the diaphragm, and the life span of the power transmission shaft can be extended.
F16D 3/79 - Yielding couplings, i.e. with means permitting movement between the connected parts during the drive with the coupling parts connected by one or more intermediate members shaped as an elastic disc or flat ring, arranged perpendicular to the axis of the coupling parts, different sets of spots of the disc or ring being attached to each coupling part, e.g. Hardy couplings the disc or ring being metallic
18.
METHOD FOR FORMING CERAMIC COATING HAVING IMPROVED PLASMA RESISTANCE AND CERAMIC COATING FORMED THEREBY
One embodiment of the present invention relates to a method for forming a ceramic coating having improved plasma resistance and a ceramic coating formed thereby. The present invention discloses the method for forming the ceramic coating having improved plasma resistance and the ceramic coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of ceramic powders having a first powder particle size range, and transporting the powders using a transport gas; and forming a ceramic coating in which a plurality of first ceramic particles within a first coating particle size range and a plurality of second ceramic particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported ceramic powders to collide with a substrate inside a process chamber, at the speed of 100 to 500 m/s so as to be pulverized, wherein the first ceramic coating particle size range of the first particles is 200 nm to 900 nm, and wherein the second ceramic coating particle size range of the second particles is 900 nm to 10 μm.
One embodiment of the present invention relates to a method for forming a coating having a composite coating particle size and a coating formed thereby. The present invention discloses the method for forming the coating having the composite coating particle size and the coating formed thereby, comprising the steps of: receiving, from a powder supply portion, a plurality of powders within a first powder particle size range, and transporting the powders using a transport gas; and forming a coating in which a plurality of first particles within a first coating particle size range and a plurality of second particles within a second coating particle size range, which is larger than the first coating particle size range, by causing the transported powders to collide with a substrate inside a process chamber at the speed of 100 to 500 m/s so as to be pulverized, wherein the first coating particle size range of the first particles is 200 nm to 900 nm, and wherein the second coating particle size range of the second particles is 900 nm to 10 μm.
The present invention relates to a cleaning apparatus which can remove foreign substances without causing damage to the surface of glass. For example, the cleaning apparatus comprises: a main shaft, the top of which has a main air inlet port and the bottom of which has a flange; an impeller which is coupled to the flange of the main shaft, and which has a plurality of exhaust ports; and a housing which is coupled to an upper portion of the impeller, and which has a plurality of auxiliary air inlet ports.
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
B05B 1/10 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops in the form of a fine jet, e.g. for use in wind-screen washers
B08B 7/00 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass
B05B 3/04 - Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet
patents
