Abstract

An energy supply for a test device includes an energy source configured to provide energy via an inductive element for use by test circuitry; and an energy recovery circuit electrically couplable to the energy source and configured to direct unused energy from the inductive element to the energy source.

IPC Classes  ?

• G01R 31/26 - Testing of individual semiconductor devices
• G01R 1/36 - Overload-protection arrangements or circuits for electric measuring instruments

Abstract

A method is provided for using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, The method includes placing the first loop-back probe in electrical contact with the first conductive region, and placing the second loop-back probe in electrical contact with the second conductive region. Continuity between the substrate and the second conductive region is then measured.

IPC Classes  ?

• G01R 1/067 - Measuring probes
• G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer

Abstract

A device and method for limiting damage to a semiconductor device under test when the semiconductor device fails during a high current, or high power test is provided. The occurrence of a failure of the device under test is detected, and power applied to the semiconductor device is diverted through a parallel path element upon detection of failure of the semiconductor device.

IPC Classes  ?

• G01R 1/067 - Measuring probes
• G01R 1/36 - Overload-protection arrangements or circuits for electric measuring instruments
• G01R 31/12 - Testing dielectric strength or breakdown voltage
• G01R 31/27 - Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects due to surrounding elements
• G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
• G01R 31/26 - Testing of individual semiconductor devices
• G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection

Abstract

A device and method for limiting damage to a semiconductor device under test when the semiconductor device fails during a high current, or high power test is provided. The occurrence of a failure of the device under test is detected, and power applied to the semiconductor device is diverted through a parallel path element upon detection of failure of the semiconductor device.

IPC Classes  ?

• G01R 31/26 - Testing of individual semiconductor devices

Abstract

A test system, apparatus and method for applying high current test stimuli to a semiconductor device in wafer or chip form includes a plurality of probes for electrically coupling to respective contact points on the semiconductor device, a plurality of current limiters electrically coupled to respective ones of the plurality of probes, and a current sensor electrically coupled to the plurality of probes. The current limiters are operative to limit current flow passing through a respective probe, and the current sensor is operative to provide a signal when detected current in any contact of the plurality of probes exceeds a threshold level.

IPC Classes  ?

• G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
• G01R 31/26 - Testing of individual semiconductor devices
• G01R 1/00 - Details of instruments or arrangements of the types covered by groups or

Goods & Services

commercial work stations including accessories and components therefor for building, testing and repairing probe cards for use in semiconductor manufacture