A gallium nitride (GaN) transistor is provided having a voltage threshold at which the transistor turns ON. The transistor has one or more control electrodes and a gate electrode disposed on a GaN material layer. A bias is applied to the control electrode(s) to prevent shifting of the transistor voltage threshold.
H10D 30/47 - FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
H10D 62/17 - Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
H10D 62/824 - Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
H10D 64/00 - Electrodes of devices having potential barriers
H10D 64/27 - Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
A gallium nitride (GaN) transistor is provided having a voltage threshold at which the transistor turns ON. The transistor has one or more control electrodes and a gate electrode disposed on a GaN material layer. A bias is applied to the control electrode(s) to prevent shifting of the transistor voltage threshold.
H10D 30/47 - FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
H10D 64/00 - Electrodes of devices having potential barriers
3.
GaN HEMT WITH LOW THRESHOLD VOLTAGE SHIFT USING A HOLE INJECTOR/COLLECTOR
A Gallium Nitride (GaN) High Electron Mobility Transistor (HEMT) with multiple metal contacts to a single contiguous p-GaN gate material. The voltage threshold voltage (Vth) of the transistor is controlled through hole injection and removal in the p-GaN material of the transistor gate.
H10D 30/47 - FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
H10D 64/27 - Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
H10D 62/17 - Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
H10D 64/23 - Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
4.
MULTIPHASE N-CHANNEL HIGH-SIDE SWITCH FOR GaN INTEGRATED CIRCUITS
A power supply switch for a gallium nitride integrated circuit. The switch includes two or more parallel n-channel transistor switches (FETs). The FETs are controlled by AC gate waveforms of different phases. The use of multiple AC-controlled FETs allows effective DC operation of a bootstrap inverter circuit without requiring a second DC supply voltage.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
5.
GaN HEMT WITH LOW THRESHOLD VOLTAGE SHIFT USING A HOLE INJECTOR/COLLECTOR
This invention pertains to the design of a novel Gallium Nitride (GaN) High Electron Mobility Transistor (HEMT) with multiple metal contacts to a single contiguous p-GaN island. The invention encompasses various embodiments which introduce innovative mechanisms for threshold voltage (Vth) control through hole injection and removal.
H10D 64/62 - Electrodes ohmically coupled to a semiconductor
H10D 30/47 - FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
H10D 89/00 - Aspects of integrated devices not covered by groups
An enhancement mode gallium nitride (GaN) transistor configured to eliminate holes in the gate material under the gate metal. The transistor has four electrodes, namely a drain electrode, a source electrode, a gate electrode and a hole collector electrode. In a preferred embodiment, a negative voltage is applied to the hole collector electrode, attracting holes in the gate material under the gate metal. The attracted holes recombine with electrons supplied by the negative voltage, thereby substantially eliminating the holes.
H10D 30/47 - FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
7.
GaN TRANSISTOR HAVING MULTI-THICKNESS FRONT BARRIER
A gallium nitride (GaN) transistor which includes a multi-layer/multi-thickness barrier layer formed of segments of progressively increasing thickness between the gate and drain to progressively increase the 2DEG density in the channel from gate to drain. The GaN gate can be formed on the base barrier layer to produce an enhancement mode device with a positive threshold voltage. By forming the gate over a thicker segment of the barrier layer, a GaN transistor with a less positive threshold voltage, or a depletion mode transistor with a negative threshold voltage, can be produced.
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
8.
GaN TRANSISTOR HAVING MULTI-THICKNESS FRONT BARRIER
A gallium nitride (GaN) transistor which includes a multi-layer/multi-thickness barrier layer formed of segments (40, 42, 44, 46) of progressively increasing thickness between the gate (22) and drain (20) to progressively increase the 2DEG density in the channel from gate to drain. The GaN gate (26) can be formed on the base barrier layer (16) to produce an enhancement mode device with a positive threshold voltage. By forming the gate over a thicker segment of the barrier layer, a GaN transistor with a less positive threshold voltage, or a depletion mode transistor with a negative threshold voltage, can be produced.
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 21/337 - Field-effect transistors with a PN junction gate
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/15 - Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
9.
MULTIPHASE N-CHANNEL HIGH-SIDE SWITCH FOR GaN INTEGRATED CIRCUITS
A power supply switch for a gallium nitride integrated circuit. The switch includes two or more parallel n-channel transistor switches (FETs). The FETs are controlled by AC gate waveforms of different phases. The use of multiple AC-controlled FETs allows effective DC operation of a supply switch without requiring a second DC supply voltage.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
10.
Synchronizing turn-on/turn-off times of parallel power FETs
A circuit for synchronizing the turn-on/turn-off times of parallel FETs. The circuit includes a plurality of integrated circuits and a synchronizer. Each of the integrated circuits includes a power FET which operates in parallel with the power FETs of the other integrated circuits, and a phase detector. The phase detector receives and compares the phase output signal of the integrated circuit with the phase output signal of another integrated circuit, and provides signals to the synchronizer regarding the relative turn-on times of the power FETs based upon the phase output signals. The synchronizer, in response to the signals from each of the integrated circuits, reduces or increases the turn-on times of the power FETs, thereby synchronizing the turn-on times of the power FETs.
An enhancement mode gallium nitride (GaN) transistor with a p-type gate configured to eliminate holes accumulating under the gate metal. The gate has two electrodes, a gate electrode and a hole collector electrode. In a preferred embodiment, a negative voltage is applied to the hole collector electrode, attracting holes accumulating under the gate metal. The attracted holes recombine with electrons supplied by the negative voltage, thereby substantially eliminating the holes.
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
12.
ENHANCEMENT MODE GAN DEVICE WITH HOLE ELIMINATION ELECTRODE
An enhancement mode gallium nitride (GaN) transistor with a p-type gate configured to eliminate holes accumulating under the gate metal. The gate has two electrodes, a gate electrode and a hole collector electrode. In a preferred embodiment, a negative voltage is applied to the hole collector electrode, attracting holes accumulating under the gate metal. The attracted holes recombine with electrons supplied by the negative voltage, thereby substantially eliminating the holes.
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H03L 7/00 - Automatic control of frequency or phaseSynchronisation
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
An enhancement mode GaN transistor that includes a multi-region field plate (406) which partially overlaps the gate and partially overlaps a barrier offset layer. The multi-region field plate includes a section of increased height with respect to the channel layer over the portion of the gate nearest the drain contact, and a section of reduced height with respect to the channel layer over the edge or transition of the barrier offset layer, minimizing the peak electric field at the corner of the gate and at the edge or transition of the barrier offset layer.
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/41 - Electrodes characterised by their shape, relative sizes or dispositions
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
14.
THREE-TERMINAL BIDIRECTIONAL ENHANCEMENT MODE GaN SWITCH
A three-terminal bidirectional GaN FET with a single gate. The device is formed by integrating a single-gate bidirectional GaN FET in parallel with a bidirectional device formed of two back-to-back GaN FETs with a source that is connected to the field plate of the device and does not have a pin-out. Diodes or gate-shorted-to-source FETs are connected between the source without pin-out and the D/S and S/D power terminals of the device. In another embodiment, a single-gate bidirectional GaN FET is provided with diodes or gate-shorted-to-source FETs connected between the substrate and the power terminals of the device.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
An enhancement mode GaN transistor that includes a multi-region field plate which partially overlaps the gate and partially overlaps a barrier offset layer. The multi-region field plate includes a section of increased height with respect to the channel layer over the portion of the gate nearest the drain contact, and a section of reduced height with respect to the channel layer over the edge or transition of the barrier offset layer, minimizing the peak electric field at the corner of the gate and at the edge or transition of the barrier offset layer.
H10D 64/00 - Electrodes of devices having potential barriers
H10D 30/47 - FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
H10D 62/10 - Shapes, relative sizes or dispositions of the regions of the semiconductor bodiesShapes of the semiconductor bodies
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
H10D 64/62 - Electrodes ohmically coupled to a semiconductor
16.
Integrated circuit for gate overvoltage protection of power devices
An integrated gate overvoltage protection circuit for protecting the gate of a main field effect transistor (FET). The gate protection circuit includes a blocking FET and a discharge FET connected between the gate and the drain of the main FET. The gate overvoltage protection circuit is configured to turn on both the first FET and the second FET in the event of a fault condition, such that charge from the gate of the main FET is discharged through the first FET and the second FET to the drain of the main FET, thereby protecting the gate of the main FET.
H03K 17/081 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
17.
INTEGRATED CIRCUIT FOR GATE OVERVOLTAGE PROTECTION OF POWER DEVICES
An integrated gate overvoltage protection circuit for protecting the gate of a main field effect transistor (FET). The gate protection circuit includes a blocking FET and a discharge FET connected between the gate and the drain of the main FET. The gate overvoltage protection circuit is configured to turn on both the first FET and the second FET in the event of a fault condition, such that charge from the gate of the main FET is discharged through the first FET and the second FET to the drain of the main FET, thereby protecting the gate of the main FET.
H03K 17/082 - Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
18.
THREE-TERMINAL BIDIRECTIONAL ENHANCEMENT MODE GaN SWITCH
A three-terminal bidirectional GaN FET with a single gate. The device is formed by integrating a single-gate bidirectional GaN FET in parallel with a bidirectional device formed of two back-to-back GaN FETs having a source without a pin-out. The source without pin-out is connected to the field plate of the device. Diodes or gate-shorted-to-source FETs are connected between the source without pin-out and the D/S and S/D power terminals of the device. In another embodiment, a single-gate bidirectional GaN FET is provided with diodes or gate-shorted-to-source FETs connected between the substrate and the power terminals of the device.
H03K 17/081 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
A driver circuit for a solid-state relay which includes a split power supply. The positive supply of the split power supply provides a voltage for application to the gate of a power FET for supplying power to a load. The negative supply of the split power supply provides a negative voltage for turning off a control transistor. The control transistor prevents the power FET from conducting power to the load when the driver circuit is turned off. The circuit is particularly adapted for driving a power GaN FET solid state relay. The circuit is provided in a cascaded embodiment to increase the blocking voltage of the solid-state relay.
H03K 17/68 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being bipolar transistors specially adapted for switching AC currents or voltages
H03K 17/041 - Modifications for accelerating switching without feedback from the output circuit to the control circuit
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
A gate driver circuit which integrates a synchronous bootstrap circuit in an isolation well of an integrated circuit, such that the synchronous bootstrap capacitor connected to the synchronous bootstrap circuit (and to the corresponding switch node of a power converter) can float with the corresponding switch node. Due to this feature, the voltage on one synchronous bootstrapping capacitor can be used to charge the synchronous bootstrapping capacitor of another (higher level) synchronous bootstrap circuit in a separate isolation well connected to a different switch node. As a result, the supply voltages for the synchronous bootstrap circuits in different isolation wells can all be supplied from a single ground referenced supply Vdd.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H03K 19/20 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits
A circuit topology for use as a single-ended or differential level-shifting interface for GaN ICs that allows GaN ICs to be controlled with standard low-voltage CMOS level inputs. The logic level shift circuit is based on a resistive network is therefore insensitive to process and temperature variations, making it particularly well suited for implementation in a GaN IC. The resistive network for a single-ended input signal includes a first branch with a voltage divider connected to the input signal. The voltage divider of the first branch provides a level shifted and scaled input signal to the first input of a comparator at the optimal bias point of the comparator. The resistive network also includes a second voltage divider branch with hysteresis for providing a trip voltage to the second input to the comparator, also at the optimal bias point of the comparator. The comparator outputs complementary bipolar level shifted signals corresponding to the input signal. For a differential input signal, both branches of the resistive network follow the topology of the first branch for a single-ended input signal.
An integrated current sensing amplifier with offset cancellation implemented in GaN technology. The current sensing amplifier senses the current flowing through a low side power FET or a high side power FET of a half bridge circuit. The current sensing amplifier uses the off time of the power FET for storing the amplifier input offset voltage. The stored amplifier input offset voltage is then used to cancel the amplifier input offset voltage during the on time of the power FET, which is the interval that requires current sensing.
A gate driver circuit which integrates a synchronous bootstrap circuit in an isolation well of an integrated circuit, such that the synchronous bootstrap capacitor connected to the synchronous bootstrap circuit (and to the corresponding switch node of a power converter) can float with the corresponding switch node. Due to this feature, the voltage on one synchronous bootstrapping capacitor can be used to charge the synchronous bootstrapping capacitor of another (higher level) synchronous bootstrap circuit in a separate isolation well connected to a different switch node. As a result, the supply voltages for the synchronous bootstrap circuits in different isolation wells can all be supplied from a single ground referenced supply Vdd.
H03K 17/06 - Modifications for ensuring a fully conducting state
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
24.
CURRENT SENSING AMPLIFIER WITH OFFSET CANCELLATION
An integrated current sensing amplifier with offset cancellation implemented in GaN technology. The current sensing amplifier senses the current flowing through a low side power FET or a high side power FET of a half bridge circuit. The current sensing amplifier uses the off time of the power FET for storing the amplifier input offset voltage. The stored amplifier input offset voltage is then used to cancel the amplifier input offset voltage during the on time of the power FET, which is the interval that requires current sensing.
A single-ended or differential level-shifting interface for GaN ICs that allows GaN ICs to be controlled with standard low-voltage CMOS level inputs. The logic level shift circuit is based on a resistive network is therefore insensitive to process and temperature variations, making it particularly well suited for implementation in a GaN IC. The resistive network for a single-ended input signal includes a first branch with a voltage divider connected to the input signal. The voltage divider of the first branch provides a level shifted and scaled input signal to the first input of a comparator at the optimal bias point of the comparator. The resistive network also includes a second voltage divider branch with hysteresis for providing a trip voltage to the second input to the comparator, also at the optimal bias point of the comparator. The comparator outputs complementary bipolar level shifted signals corresponding to the input signal.
H03K 5/22 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral
H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
A bootstrapping gate driver circuit in which the size of the bootstrap capacitors is reduced. The gate-to-source voltage of the high side (pull-up) FET is pre-driven to an initial voltage (pre-driven voltage) before the bootstrap capacitor releases charge to charge up the gate-to-source voltage of the high side FET. This pre-driven voltage is applied through a pre-driven FET that allows current flow from the supply voltage to charge the gate of the high side FET to the pre-driven voltage. The pre-driven FET is turned on by a turn-on signal that occurs before the bootstrap capacitor releases charge. The pre-driven period (and hence, the pre-driven voltage) is determined from the time that the pre-driven FET begins to turn on, to the time that the bootstrap capacitor starts to release charge.
H03K 17/0412 - Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the control circuit
A circuit to enhance the driving capability of conventional inverting bootstrapping GaN drivers. When the inverting driver input is logic high and the driver output is off, the voltage stored on the first bootstrap capacitor for turning on the high side (pull-up) FET of the inverting driver is charged to the full supply voltage using an active charging FET, instead of using a diode or diode-connected FET in a conventional bootstrapping driver. The gate voltage of the active charging FET is bootstrapped to a voltage higher than supply voltage by a second bootstrap capacitor that connects to the inverting driver input, which is at a logic high. The second bootstrap capacitor is charged by an additional diode or diode-connected FET connected to the supply voltage when the inverting driver input is a logic low.
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/0412 - Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the control circuit
A bootstrapping circuit that utilizes multiple pre-charged capacitor voltages and applies the capacitor voltages to the high side FET of a GaN bootstrapping driver. During the pre-charging phase of the bootstrapping driver, multiple capacitors are charged in parallel to the supply voltage. During the driving phase of the bootstrapping driver, the capacitors are connected in series through a number of FETs and connected to the gate terminal of the high side FET of the bootstrapping driver. As a result, the gate-to-source voltage of the high side FET is equal to or greater than the supply voltage during the driving phase, increasing the driving capability of the high side FET and reducing the total required capacitance and die area of the bootstrapping driver.
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/0412 - Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the control circuit
A bootstrapping gate driver circuit in which the size of the bootstrap capacitors is reduced. The gate-to-source voltage of the high side (pull-up) FET is pre-driven to an initial voltage (pre-driven voltage) before the bootstrap capacitor releases charge to charge up the gate-to-source voltage of the high side FET. This pre-driven voltage is applied through a pre-driven FET that allows current flow from the supply voltage to charge the gate of the high side FET to the pre-driven voltage. The pre-driven FET is turned on by a turn-on signal that occurs before the bootstrap capacitor releases charge. The pre-driven period (and hence, the pre-driven voltage) is determined from the time that the pre-driven FET begins to turn on, to the time that the bootstrap capacitor starts to release charge.
H03K 17/0412 - Modifications for accelerating switching without feedback from the output circuit to the control circuit by measures taken in the control circuit
H03K 17/042 - Modifications for accelerating switching by feedback from the output circuit to the control circuit
H03K 17/06 - Modifications for ensuring a fully conducting state
A circuit to enhance the driving capability of conventional inverting bootstrapping GaN drivers. When the inverting driver input is logic high and the driver output is off, the voltage stored on the first bootstrap capacitor for turning on the high side (pull-up) FET of the inverting driver is charged to the full supply voltage using an active charging FET, instead of using a diode or diode-connected FET in a conventional bootstrapping driver. The gate voltage of the active charging FET is bootstrapped to a voltage higher than supply voltage by a second bootstrap capacitor that connects to the inverting driver input, which is at a logic high. The second bootstrap capacitor is charged by an additional diode or diode-connected FET connected to the supply voltage when the inverting driver input is a logic low.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
A bootstrapping circuit that utilizes multiple pre-charged capacitor voltages and applies the capacitor voltages to the high side FET of a GaN bootstrapping driver. During the pre-charging phase of the bootstrapping driver, multiple capacitors are charged in parallel to the supply voltage. During the driving phase of the bootstrapping driver, the capacitors are connected in series through a number of FETs and connected to the gate terminal of the high side FET of the bootstrapping driver. As a result, the gate-to-source voltage of the high side FET is equal to or greater than the supply voltage during the driving phase, increasing the driving capability of the high side FET and reducing the total required capacitance and die area of the bootstrapping driver.
A bidirectional GaN FET with a single gate formed by integrating a single-gate bidirectional GaN FET in parallel with a bidirectional device formed of two back-to-back GaN FETs with a common source. The single-gate bidirectional GaN FET occupies most of the integrated circuit die, such that the integrated device has a low channel resistance, while also capturing the advantages of a back-to-back bidirectional GaN FET device.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H10D 62/85 - Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
H10D 64/00 - Electrodes of devices having potential barriers
A bidirectional GaN FET with a single gate formed by integrating a single-gate bidirectional GaN FET in parallel with a bidirectional device formed of two back-to-back GaN FETs with a common source. The single-gate bidirectional GaN FET occupies most of the integrated circuit die, such that the integrated device has a low channel resistance, while also capturing the advantages of a back-to-back bidirectional GaN FET device.
H03K 17/081 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
34.
Half-bridge circuits with symmetrical layout of parallel transistors and capacitors
A physical arrangement of at least two power switches and at least one capacitor in a power loop. At least one of the switches is formed of at least two parallel electronic devices, such as transistors. The arrangement minimizes total power loop impedance and results in approximately equal impedance in each parallel branch of the switch formed of two parallel devices, thereby resulting in approximately equal currents in the switches.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/00 - Conversion of DC power input into DC power output
35.
HALF-BRIDGE SWITCHING CIRCUITS WITH PARALLEL SWITCHES
A physical arrangement of at least two power switches and at least one capacitor in a power loop. At least one of the switches is formed of at least two parallel electronic devices, such as transistors. The arrangement minimizes total power loop impedance and results in approximately equal impedance in each parallel branch of the switch formed of two parallel devices, thereby resulting in approximately equal currents in the switches.
An integrated circuit includes a GaN FET and a metal-insulator-metal capacitor. The capacitor is fully integrated with a lateral GaN process flow, i.e., the same gate metal layer, field plate metal layer and dielectric layer of the GaN FET are also used to form the bottom plate (1001), insulator (2001) and top plate (3001) of the capacitor. The top plate is contacted by a conductive via (3003), which extends through the top plate. To increase the voltage breakdown capability of the capacitor of the integrated circuit, a portion of the gate metal layer is formed in the shape of a ring around the conductive via.
H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
An integrated circuit which includes a GaN FET and a metal-insulator-metal capacitor. The capacitor is fully integrated with a lateral GaN process flow, i.e., the same gate metal layer, field plate metal layer and dielectric layer of the GaN FET are also used to form the bottom plate, insulator and top plate of the capacitor. The top plate is contacted by a conductive via, which extends through the top plate. To increase the voltage breakdown capability of the capacitor of the integrated circuit, a portion of the gate metal layer is formed in the shape of a ring around the conductive via.
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
A cross-coupled differential activated latch circuit with circuitry comprising a plurality of n-FETs and inverters that can be implemented completely in GaN. The circuitry prevents the digital latched values on the outputs of the latch from changing unless the digital input values on the inputs are different, thus preventing common-mode voltage on the inputs from corrupting the stored latch values.
H03L 5/00 - Automatic control of voltage, current, or power
H03K 5/22 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral
H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
A cross-coupled differential activated latch circuit with circuitry comprising a plurality of n-FETs and inverters (72, 74) that can be implemented completely in GaN. The circuitry prevents the digital latched values on the outputs of the latch (24, 26) from changing unless the digital input values on the inputs (20, 22) are different, thus preventing common-mode voltage on the inputs (20, 22 being high or 20, 22 being low) from corrupting the stored latch values (20, 22).
A multi-level converter includes a flying capacitor and a resistive voltage divider. The multi-level converter is configured to convert an input voltage into an output voltage. The resistive voltage divider is configured to charge a flying capacitor in the multi-level converter during an initial charging mode of operation. In some implementations, the multi-level converter includes a plurality of flying capacitors and a plurality of resistive voltage dividers including a resistive voltage divider for each flying capacitor in the plurality of flying capacitors.
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 1/36 - Means for starting or stopping converters
H02M 1/06 - Circuits specially adapted for rendering non-conductive gas discharge tubes or equivalent semiconductor devices, e.g. thyratrons, thyristors
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 7/483 - Converters with outputs that each can have more than two voltage levels
41.
Multi-level converter with voltage divider for pre-charging flying capacitor
A multi-level converter includes a flying capacitor and a resistive voltage divider. The multi-level converter is configured to convert an input voltage into an output voltage. The resistive voltage divider is configured to charge a flying capacitor in the multi-level converter during an initial charging mode of operation. In some implementations, the multi-level converter includes a plurality of flying capacitors and a plurality of resistive voltage dividers including a resistive voltage divider for each flying capacitor in the plurality of flying capacitors.
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 7/483 - Converters with outputs that each can have more than two voltage levels
H02M 1/36 - Means for starting or stopping converters
H02M 3/06 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider
42.
Low parasitic inductance structure for power switched circuits
A highly efficient, multi-layered, single component sided circuit board layout design providing reduced parasitic inductance for power switched circuits. Mounted on the top board are one or more transistor switches, one or more loads, and one or more capacitors. The switches and capacitors form a loop with very low parasitic inductance. The loads may be a part of the loop, i.e. in series with the switches and capacitors, or may be connected to two or more nodes of the loop to form additional loops with common vertices. Parallel wide conductors carry the switch load current resulting in a low inductance path for the power loop. The power loop and gate loop current travel in opposite directions and are well separated, minimizing common source inductance (CSI) and maximizing switching speed.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
A laser-diode driver for Lidar applications with an output stage comprised of two enhancement mode GaN FETs. The output stage includes a driver GaN FET in a traditional common-source configuration, with the drain connected to the cathode of a laser diode and the source connected to ground. The gate of the driver GaN FET is driven by the source of the second, substantially smaller GaN FET in a source-follower configuration, rather than being driven directly by a pre-driver. The source-follower GaN FET has its drain connected to the drain of the common-source driver GaN FET, similar to a Darlington connection used in bipolar devices. The input drive signal from the pre-driver is applied at the gate of the source-follower GaN FET. The current required to turn on the driver GaN FET is thereby drawn from a main power supply through the laser diode, rather than from the power supply for the pre-driver, improving overall current efficiency.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 17/00 - Electronic switching or gating, i.e. not by contact-making and -breaking
H03K 17/51 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
A laser-diode driver for Lidar applications with an output stage comprised of two enhancement mode GaN FETs. The output stage includes a driver GaN FET in a traditional common-source configuration, with the drain connected to the cathode of a laser diode and the source connected to ground. The gate of the driver GaN FET is driven by the source of the second, substantially smaller GaN FET in a source-follower configuration, rather than being driven directly by a pre-driver. The source-follower GaN FET has its drain connected to the drain of the common-source driver GaN FET, similar to a Darlington connection used in bipolar devices. The input drive signal from the pre-driver is applied at the gate of the source-follower GaN FET. The current required to turn on the driver GaN FET is thereby drawn from a main power supply through the laser diode, rather than from the power supply for the pre-driver, improving overall current efficiency.
A gallium nitride (GaN) transistor which includes multiple insulator semiconductor interface regions. Two or more first insulator segments and two or more second insulator segments are positioned between the gate and drain contacts and interleaved together. At least one first insulator segment is nearer to the gate contact than the second insulator segments. At least one second insulator segment is nearer to the drain contact than the first insulator segments. The first and second insulators are chosen such that a net electron donor density above the channel under the first insulator segments is lower than a net electron density above the channel under the second insulator segments. The first insulator segments reduce gate leakage and electric fields near the gate that cause high gate-drain charge. The second insulator segments reduce electric fields near the drain contact and provide a high density of charge in the channel for reduced on-resistance.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
A gallium nitride (GaN) transistor which includes multiple insulator semiconductor interface regions. Two or more first insulator segments and two or more second insulator segments are positioned between the gate and drain contacts and interleaved together. At least one first insulator segment is nearer to the gate contact than the second insulator segments. At least one second insulator segment is nearer to the drain contact than the first insulator segments. The first and second insulators are chosen such that a net electron donor density above the channel under the first insulator segments is lower than a net electron density above the channel under the second insulator segments. The first insulator segments reduce gate leakage and electric fields near the gate that cause high gate-drain charge. The second insulator segments reduce electric fields near the drain contact and provide a high density of charge in the channel for reduced on-resistance.
H01L 29/207 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds further characterised by the doping material
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/205 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds in different semiconductor regions
An integrated circuit that includes a plurality of GaN transistor sets. A first set of the plurality of GaN transistor sets includes transistors with a first drain-to-source distance, and wherein a second of the plurality of GaN transistor sets includes transistors with a second drain-to-source distance that is greater than the first drain-to-source distance.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01F 21/04 - Variable inductances or transformers of the signal type continuously variable, e.g. variometers by relative movement of turns or parts of windings
H03K 5/153 - Arrangements in which a pulse is delivered at the instant when a predetermined characteristic of an input signal is present or at a fixed time interval after this instant
49.
Magnetic field pulse current sensing for timing-sensitive circuits
A direct-coupled level shifter to level shift a ground referenced input logic signal to an output logic signal that can have either a positive or negative reference. The level shifter includes two level shift drivers, each of which includes a positive level shift driver and a negative level shift driver. The positive level shift drivers operate when the reference of the latch is above ground and turn off when the reference is below ground. Similarly, the negative level shift drivers operate when the reference is below ground and turn off when the reference is above ground. The output logic signal is based on the output from the positive level shift driver receiving the input signal and the output from the negative level shift driver receiving an inverse of the input signal. The inverse of the output logic signal is based on the output from the positive level shift driver receiving an inverse of the input signal and the output from the negative level shift driver receiving the input signal.
A direct-coupled level shifter to level shift a ground referenced input logic signal to an output logic signal that can have either a positive or negative reference. The level shifter includes two level shift drivers, each of which includes a positive level shift driver and a negative level shift driver. The positive level shift drivers operate when the reference of the latch is above ground and turn off when the reference is below ground. Similarly, the negative level shift drivers operate when the reference is below ground and turn off when the reference is above ground. The output logic signal is based on the output from the positive level shift driver receiving the input signal and the output from the negative level shift driver receiving an inverse of the input signal. The inverse of the output logic signal is based on the output from the positive level shift driver receiving an inverse of the input signal and the output from the negative level shift driver receiving the input signal.
A multi-channel current pulse generator for driving a plurality of loads with unique positive terminals and a shared negative terminal. The pulse generator comprises a pulse control transistor and, for each load, a load capacitor and a charging control transistor. The pulse control transistor allows or blocks current pulses through the loads and has a drain terminal connected to the shared negative terminal, a source terminal connected to ground, and a gate terminal for receiving a load driver control signal. The load capacitors are discharged by current pulses through the corresponding loads. The charging control transistors allow or block charging currents for the corresponding load capacitors. The pulse control transistor is preferably an enhancement mode GaN FET and is chosen to withstand current pulses through a maximum number of loads to be driven simultaneously.
H03K 3/57 - Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback the switching device being a semiconductor device
H03K 3/02 - Generators characterised by the type of circuit or by the means used for producing pulses
H03K 3/53 - Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback
53.
Multi-channel pulse current generator with charging
A multi-channel current pulse generator for driving a plurality of loads with unique positive terminals and a shared negative terminal. The pulse generator comprises a pulse control transistor and, for each load, a load capacitor and a charging control transistor. The pulse control transistor allows or blocks current pulses through the loads and has a drain terminal connected to the shared negative terminal, a source terminal connected to ground, and a gate terminal for receiving a load driver control signal. The load capacitors are discharged by current pulses through the corresponding loads. The charging control transistors allow or block charging currents for the corresponding load capacitors. The pulse control transistor is preferably an enhancement mode GaN FET and is chosen to withstand current pulses through a maximum number of loads to be driven simultaneously.
G05F 3/24 - Regulating voltage or current wherein the variable is DC using uncontrolled devices with non-linear characteristics being semiconductor devices using diode-transistor combinations wherein the transistors are of the field-effect type only
H02J 7/34 - Parallel operation in networks using both storage and other DC sources, e.g. providing buffering
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
55.
Cascaded bootstrapping GaN power switch and driver
A cascaded bootstrapping gate driver configured to provide quick turn-on of a high side power FET and low static current consumption. The cascaded bootstrapping gate driver includes an initial bootstrapping stage with a resistor to decrease static current consumption during transistor turn-off. A secondary bootstrapping stage is driven by the initial bootstrapping stage and includes a GaN FET transistor with a low on resistance in place of the resistor. The source terminal of the GaN FET transistor provides a gate driving voltage to the high side power switch FET. The low on-resistance of the GaN FET transistor provides quick turn-on of the high side power FET. Transistors in the cascaded bootstrapping gate driver are preferably enhancement mode GaN FETs and may be integrated into a single semiconductor die.
H03K 17/06 - Modifications for ensuring a fully conducting state
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
An enhancement mode GaN FET based gate driver circuit including an active pre-driver to drive a high-slew rate, high current output stage GaN FET. Due to the active driver current from the pre-driver, the output stage pull-up FET can turn on faster as compared to a pre-driver that utilizes a passive pull-up load. The active pre-driver must provide a voltage to drive the gate of the output stage pull-up FET which is higher than the normal supply voltage to enable the maximum output level of the driver FET to approach the normal supply voltage. A feedback circuit is included in the active pre-driver to avoid the need for two supply voltages.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
57.
GaN based fail-safe shutdown of high-current drivers
A driver shutdown circuit configured to trigger driver shutdown based on the magnitude and duration of the driving current. A first GaN FET is connected to a second GaN FET and an input node and generates a discharging current proportional to the driving current. The discharging current is drawn from a timer capacitor through the first and second GaN FETs. The second GaN FET receives a control signal and stops flow of the discharging current in between driver pulses so a pre-charger circuit can recharge the timer capacitor to a particular voltage. The discharging current drains the timer capacitor, and a shutdown signal generator outputs a shutdown signal to the driver in response to the voltage on the timer capacitor decreasing below a triggering voltage.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H03K 17/30 - Modifications for providing a predetermined threshold before switching
An enhancement mode GaN FET based gate driver circuit including an active pre-driver to drive a high-slew rate, high current output stage GaN FET. Due to the active driver current from the pre-driver, the output stage pull-up FET can turn on faster as compared to a pre-driver that utilizes a passive pull-up load. The active pre-driver must provide a voltage to drive the gate of the output stage pull-up FET which is higher than the normal supply voltage to enable the maximum output level of the driver FET to approach the normal supply voltage. A feedback circuit is included in the active pre-driver to avoid the need for two supply voltages.
H03K 17/042 - Modifications for accelerating switching by feedback from the output circuit to the control circuit
H03K 19/01 - Modifications for accelerating switching
H03K 19/02 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits using specified components
H03K 19/08 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits using specified components using semiconductor devices
H03K 19/094 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits using specified components using semiconductor devices using field-effect transistors
59.
CASACADED BOOTSTRAPPING GaN POWER SWITCH AND DRIVER
A cascaded bootstrapping gate driver configured to provide quick turn-on of a high side power switch FET and low static current consumption. An initial bootstrapping stage includes a resistor to decrease static current consumption during transistor turn-off. A secondary bootstrapping stage includes a GaN FET transistor with a low on resistance driven by the initial bootstrapping stage. A source terminal of the GaN FET transistor is configured to provide a gate driving voltage to the high side power switch FET. The low on resistance of the GaN FET transistor provides quick turn-on of the high side power switch FET. Transistors in the cascaded bootstrapping gate driver are preferably enhancement mode GaN FETs and may be integrated into a single semiconductor die.
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 19/01 - Modifications for accelerating switching
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
A lateral power semiconductor device with a metal interconnect layout for low on-resistance. The metal interconnect layout includes first, second, and third metal layers, each of which include source bars and drain bars. Source bars in the first, second, and third metal layers are electrically connected. Drain bars in the first, second, and third metal layers are electrically connected. In one embodiment, the first and second metal layers are parallel, and the third metal layer is perpendicular to the first and second metal layers. In another embodiment, the first and third metal layer are parallel, and the second metal layer is perpendicular to the first and third metal layers. A nonconductive layer ensures solder bumps electrically connect to only source bars or only drain bars. As a result, a plurality of available pathways exists and enables current to take any of the plurality of available pathways.
H01L 29/08 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/06 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H03K 17/00 - Electronic switching or gating, i.e. not by contact-making and -breaking
H03K 5/24 - Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
G01S 17/89 - Lidar systems, specially adapted for specific applications for mapping or imaging
62.
GAN BASED FAIL-SAFE SHUTDOWN OF HIGH-CURRENT DRIVERS
A driver shutdown circuit configured to trigger driver shutdown based on the magnitude and duration of the driving current. A first GaN FET is connected to a second GaN FET and an input node and generates a discharging current proportional to the driving current. The discharging current is drawn from a timer capacitor through the first and second GaN FETs. The second GaN FET receives a control signal and stops flow of the discharging current in between driver pulses so a pre-charger circuit can recharge the timer capacitor to a particular voltage. The discharging current drains the timer capacitor, and a shutdown signal generator outputs a shutdown signal to the driver in response to the voltage on the timer capacitor decreasing below a triggering voltage.
H03K 17/08 - Modifications for protecting switching circuit against overcurrent or overvoltage
H03K 17/0812 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
H03K 17/082 - Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
H03K 17/51 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
A lateral power semiconductor device with a metal interconnect layout for low on-resistance. The metal interconnect layout includes first, second, and third metal layers, each of which include source bars and drain bars. Source bars in the first, second, and third metal layers are electrically connected. Drain bars in the first, second, and third metal layers are electrically connected. In one embodiment, the first and second metal layers are parallel, and the third metal layer is perpendicular to the first and second metal layers. In another embodiment, the first and third metal layer are parallel, and the second metal layer is perpendicular to the first and third metal layers. A nonconductive layer ensures solder bumps electrically connect to only source bars or only drain bars. As a result, a plurality of available pathways exists and enables current to take any of the plurality of available pathways.
H01L 23/20 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
64.
CURRENT PULSE GENERATOR WITH INTEGRATED BUS BOOST CIRCUIT
A current pulse generator circuit configured to be monolithically integrated into a single semiconductor die and provide high pulsing frequencies. A first GaN FET transistor controls the charging of a capacitor in a boost converter. A second GaN FET transistor controls the discharging of the capacitor through a load, such as a laser diode, connected to the boost converter. Both GaN FET transistors are preferably enhancement mode GaN FETs and may be integrated into the single semiconductor die, together with gate drivers. The diode in a conventional boost converter circuit can also be implemented in the present invention as a GaN FET transistor, and also integrated into the single semiconductor die.
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
65.
Current pulse generator with integrated bus boost circuit
A current pulse generator circuit configured to be monolithically integrated into a single semiconductor die and provide high pulsing frequencies. A first GaN FET transistor controls the charging of a capacitor in a boost converter. A second GaN FET transistor controls the discharging of the capacitor through a load, such as a laser diode, connected to the boost converter. Both GaN FET transistors are preferably enhancement mode GaN FETs and may be integrated into the single semiconductor die, together with gate drivers. The diode in a conventional boost converter circuit can also be implemented in the present invention as a GaN FET transistor, and also integrated into the single semiconductor die.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A common gate amplifier circuit configured to provide decreased voltage transients in the input voltage due to reverse gain. A second FET transistor is connected in series with a first FET of the common gate amplifier to function as an additional capacitive voltage divider between the amplifier output and the amplifier input without influencing the input or output currents. The first FET transistor, coupled to the amplifier input, may be a low voltage FET and smaller than the second FET transistor, which is coupled to the amplifier output. Both FET transistors are preferably enhancement mode GaN FET transistors and may be integrated into a single semiconductor chip with a single internal bias voltage divider.
H03F 3/16 - Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only with field-effect devices
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
67.
Wireless power receiver synchronization detection circuit
A wireless power receiver circuit includes an active rectifier circuit with a plurality of power transistors, wherein the active rectifier circuit is configured to rectify an induced AC receiver current. The wireless power receiver circuit includes also includes a gate drive controller circuit configured to sense the induced AC receiver current and to provide gate drive signals for the plurality of power transistors synchronized with the induced AC receiver current. The gate drive controller circuit includes a current sense circuit configured to provide two voltage signals having a difference proportional to the induced AC receiver current.
H02J 50/12 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
H02M 7/219 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only in a bridge configuration
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
Circuits, structures and techniques for independently connecting a surrounding material in a part of a semiconductor device to a contact of its respective device. To achieve this, a combination of one or more conductive wells that are electrically isolated in at least one bias polarity are provided.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 27/085 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
H01L 21/8258 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by , , or
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
A large area wireless power system having a synchronization transmitter and a plurality of synchronization receivers for receiving a plurality of differential signals from the synchronization transmitter and outputting a plurality of second single-ended signals. The synchronization transmitter generates a first single-ended signal and converts the first single-ended signal into the plurality of differential signals to be transmitted to the synchronization receivers over a plurality of differential line pairs that also provide power to the synchronization receivers. The large area wireless power system also includes a plurality of high power amplifiers for receiving the plurality of second single-ended signals from the respective synchronization receivers and generating power, and a plurality of wireless power coils for receiving the power generated by the plurality of high power amplifiers and wirelessly providing power.
H02J 17/00 - Systems for supplying or distributing electric power by electromagnetic waves
H02J 50/40 - Circuit arrangements or systems for wireless supply or distribution of electric power using two or more transmitting or receiving devices
H02J 50/70 - Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
A large area wireless power system having a synchronization transmitter and a plurality of synchronization receivers for receiving a plurality of differential signals from the synchronization transmitter and outputting a plurality of second single-ended signals. The synchronization transmitter generates a first single-ended signal and converts the first single-ended signal into the plurality of differential signals to be transmitted to the synchronization receivers over a plurality of differential line pairs that also provide power to the synchronization receivers. The large area wireless power system also includes a plurality of high power amplifiers for receiving the plurality of second single-ended signals from the respective synchronization receivers and generating power, and a plurality of wireless power coils for receiving the power generated by the plurality of high power amplifiers and wirelessly providing power.
A power converter in which two power FETs are provided in a full bridge arrangement with two diodes for supplying a rectified voltage to a load. The gates of the power FETs receive alternating and opposite voltage waveforms such that the power FETs conduct oppositely to each other. A turn-off FET is connected to the gate of each power FET to prevent spurious turn on of the power FET during periods in which the opposite power FET is turned on. A voltage sense FET is also connected to the gate of each power FET to limit the gate voltage of the power FET. The voltage sense FETs are each synchronously modulated with the corresponding power FET to limit the gate to source voltage of the voltage sense FET when the corresponding turn-off FET is on and the corresponding power FET is off.
H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 1/088 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
72.
Low voltage drop cascaded synchronous bootstrap supply circuit
A cascaded synchronous bootstrap supply circuit with reduced voltage drop between the cascaded bootstrap capacitors by replacing bootstrap diodes with gallium nitride (GaN) transistors. GaN transistors have a much lower forward voltage drop than diodes, thus providing a cascaded gate driver bootstrap supply circuit with a reduced drop in bootstrap capacitor voltage, which is particularly important as the number of levels increases.
H02M 1/088 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
H03K 17/06 - Modifications for ensuring a fully conducting state
H02M 3/00 - Conversion of DC power input into DC power output
G05F 1/46 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC
73.
Enhancement-mode GaN transistor with selective and nonselective etch layers for improved uniformity in GaN spacer thickness
An enhancement-mode transistor gate structure which includes a spacer layer of GaN disposed above a barrier layer, a first layer of pGaN above the spacer layer, an etch stop layer of p-type Al-containing column III-V material, for example, pAlGaN or pAlInGaN, disposed above the first p-GaN layer, and a second p-GaN layer, having a greater thickness than the first p-GaN layer, disposed over the etch stop layer. The etch stop layer minimizes damage to the underlying barrier layer during gate etching steps, and improves GaN spacer thickness uniformity.
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/43 - Electrodes characterised by the materials of which they are formed
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
74.
ENHANCEMENT-MODE GaN TRANSISTOR WITH SELECTIVE AND NONSELECTIVE ETCH LAYERS FOR IMPROVED UNIFORMITY IN GaN SPACER THICKNESS
An enhancement-mode transistor gate structure which includes a spacer layer of GaN disposed above a barrier layer, a first layer of pGaN above the spacer layer, an etch stop layer of p-type Al-containing column III-V material, for example, pAlGaN or pAlInGaN, disposed above the first p-GaN layer, and a second p-GaN layer, having a greater thickness than the first p-GaN layer, disposed over the etch stop layer. Any variation across the wafer from etching the etch stop layer and the underlying thin pGaN layer is much less than the variation resulting from etching a thick pGaN layer. The method of the present invention thus leaves a thin layer of GaN above the barrier layer with minimal variation across the wafer.
An integrated DC-DC converter device includes a plurality of GaN transistor sets. A first set of the plurality of GaN transistor sets includes transistors with a first drain-to-source distance, and wherein a second of the plurality of GaN transistor sets includes transistors with a second drain-to-source distance that is greater than the first drain-to-source distance.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
A scalable highly resonant wireless power coil structure that is suitable for use across a large surface area. The structure includes a plurality of single turn loops with adjacent loops that are decoupled from each other, yet form part of a single member.
H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters
A scalable highly resonant wireless power coil structure that is suitable for use across a large surface area. The structure includes a plurality of single turn loops with adjacent loops decoupled from each other yet form part of a single member.
A circuit for an RF switch using FET transistors that largely cancels the non-linearity of the Coss of the FETs over a majority of the signal range, and reduces distortion. The RF switch includes two substantially identical FETs. The source of one FET is connected to the drain of the other FET and the node formed comprises one terminal of the switch. Two substantially identical capacitors are connected in series with each other and in parallel with the FETs, and the node thus formed comprises the second terminal of the switch. The capacitors are selected such that they have negligible impedance at AC frequencies for which the switch is expected be used, and in particular a much lower impedance than Coss of each FET. A voltage source with a series impedance is also connected in parallel with the capacitors and the two FETs.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 17/00 - Electronic switching or gating, i.e. not by contact-making and -breaking
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
H03K 17/16 - Modifications for eliminating interference voltages or currents
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 17/693 - Switching arrangements with several input- or output-terminals, e.g. multiplexers, distributors
80.
Bootstrap capacitor over-voltage management circuit for GaN transistor based power converters
A drive circuit for a half bridge transistor circuit formed of enhancement mode GaN transistors. A shunt diode is connected to the bootstrap capacitor at a node between the bootstrap capacitor and ground, the shunt diode being decoupled from the midpoint node of the half bridge by a shunt resistor. The shunt diode advantageously provides a low voltage drop path to charge the bootstrap capacitor during the dead-time charging period when both the high side and low side transistors of the half bridge are off.
H03B 1/00 - GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNERGENERATION OF NOISE BY SUCH CIRCUITS Details
H03K 3/00 - Circuits for generating electric pulsesMonostable, bistable or multistable circuits
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
G05F 1/571 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor for protection with overvoltage detector
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H03K 17/042 - Modifications for accelerating switching by feedback from the output circuit to the control circuit
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/0812 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
H03K 17/567 - Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
H02M 1/32 - Means for protecting converters other than by automatic disconnection
A drive circuit for a half bridge transistor circuit formed of enhancement mode GaN transistors. A shunt diode is connected to the bootstrap capacitor at a node between the bootstrap capacitor and ground, the shunt diode being decoupled from the midpoint node of the half bridge by a shunt resistor. The shunt diode advantageously provides a low voltage drop path to charge the bootstrap capacitor during the dead-time charging period when both the high side and low side transistors of the half bridge are off.
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
H01L 27/00 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H02M 7/538 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a push-pull configuration
H03K 17/00 - Electronic switching or gating, i.e. not by contact-making and -breaking
H03K 17/51 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components
gd). A second insulator (or multiple insulators), disposed between the first insulator and the drain, minimizes electric fields at the drain contact and provides a high density of charge in the channel for low on-resistance.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/205 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds in different semiconductor regions
A gallium nitride (GaN) transistor which includes two or more insulator semiconductor interface regions (insulators). A first insulator disposed between the gate and drain (near the gate) minimizes the gate leakage and fields near the gate that cause high gate-drain charge (Qgd). A second insulator (or multiple insulators), disposed between the first insulator and the drain, minimizes electric fields at the drain contact and provides a high density of charge in the channel for low on-resistance.
H01L 29/205 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds in different semiconductor regions
A fully integrated GaN driver comprising a digital logic signal inverter, a level shifter circuit, a UVLO circuit, an output buffer stage, and (optionally) a FET to be driven, all integrated in a single package. The level shifter circuit converts a ground reference 0-5 V digital signal at the input to a 0-10 V digital signal at the output. The output drive circuitry includes a high side GaN FET that is inverted compared to the low side GaN FET. The inverted high side GaN FET allows switch operation, rather than a source follower topology, thus providing a digital voltage to control the main FET being driven by the circuit.
H03K 3/00 - Circuits for generating electric pulsesMonostable, bistable or multistable circuits
H03K 17/04 - Modifications for accelerating switching
H01L 27/088 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/22 - Modifications for ensuring a predetermined initial state when the supply voltage has been applied
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
A fully integrated GaN driver comprising a digital logic signal inverter, a level shifter circuit, a UVLO circuit, an output buffer stage, and (optionally) a FET to be driven, all integrated in a single package. The level shifter circuit converts a ground reference 0-5 V digital signal at the input to a 0-10 V digital signal at the output. The output drive circuitry includes a high side GaN FET that is inverted compared to the low side GaN FET. The inverted high side GaN FET allows switch operation, rather than a source follower topology, thus providing a digital voltage to control the main FET being driven by the circuit.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
G05F 1/00 - Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
H01L 23/528 - Layout of the interconnection structure
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
87.
GaN transistors with polysilicon layers used for creating additional components
A GaN transistor with polysilicon layers for creating additional components for an integrated circuit and a method for manufacturing the same. The GaN device includes an EPI structure and an insulating material disposed over EPI structure. Furthermore, one or more polysilicon layers are disposed in the insulating material with the polysilicon layers having one or more n-type regions and p-type regions. The device further includes metal interconnects disposed on the insulating material and vias disposed in the insulating material layer that connect source and drain metals to the n-type and p-type regions of the polysilicon layer.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/085 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
H01L 29/36 - Semiconductor bodies characterised by the concentration or distribution of impurities
H01L 21/76 - Making of isolation regions between components
H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 21/8258 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by , , or
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 21/763 - Polycrystalline semiconductor regions
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
88.
Gate with self-aligned ledge for enhancement mode GaN transistors
An enhancement-mode GaN transistor with reduced gate leakage current between a gate contact and a 2DEG region and a method for manufacturing the same. The enhancement-mode GaN transistor including a GaN layer, a barrier layer disposed on the GaN layer with a 2DEG region formed at an interface between the GaN layer and the barrier layer, and source contact and drain contacts disposed on the barrier layer. The GaN transistor further includes a p-type gate material formed above the barrier layer and between the source and drain contacts and a gate metal disposed on the p-type gate material, with wherein the p-type gate material including comprises a pair of self-aligned ledges that extend toward the source contact and drain contact, respectively.
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
H01L 29/205 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds in different semiconductor regions
An electrical circuit arranged in a half bridge topology. The electrical circuit includes a high side transistor; a low side transistor; a gate driver and level shifter electrically coupled to a gate of the high side transistor; a gate driver electrically coupled to a gate of the low side transistor; a capacitor electrically coupled in parallel with the gate driver and level shifter; a voltage source electrically coupled to an input of the gate driver and level shifter and an input of the gate driver; and, a bootstrap transistor electrically coupled between the voltage source and the capacitor. A GaN field-effect transistor is synchronously switched with a low side device of the half bridge circuit.
Circuits, structures and techniques for independently connecting a surrounding material in a part of a semiconductor device to a contact of its respective device. To achieve this, a combination of one or more conductive wells that are electrically isolated in at least one bias polarity are provided.
H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
H01L 21/8258 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by , , or
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 27/085 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate
An enhancement-mode GaN transistor with reduced gate leakage current between a gate contact and a 2DEG region and a method for manufacturing the same. The enhancement-mode GaN transistor including a GaN layer, a barrier layer disposed on the GaN layer with a 2DEG region formed at an interface between the GaN layer and the barrier layer, and source contact and drain contacts disposed on the barrier layer. The GaN transistor further includes a p-type gate material formed above the barrier layer and between the source and drain contacts and a gate metal disposed on the p-type gate material, with wherein the p-type gate material including comprises a pair of self- aligned ledges that extend toward the source contact and drain contact, respectively.
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 21/283 - Deposition of conductive or insulating materials for electrodes
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
H01L 29/205 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds in different semiconductor regions
92.
Integrated circuit with matching threshold voltages and method for making same
An integrated circuit having a substrate, a buffer layer formed over the substrate, a barrier layer formed over the buffer layer, and an isolation region that isolates an enhancement mode device from a depletion mode device. The integrated circuit further includes a first gate contact for the enhancement mode device that is disposed in one gate contact recess and a second gate contact for the depletion mode device that is disposed in a second gate contact recess.
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 21/8252 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
An electrical circuit arranged in a half bridge topology. The electrical circuit includes a high side transistor; a low side transistor; a gate driver and level shifter electrically coupled to a gate of the high side transistor; a gate driver electrically coupled to a gate of the low side transistor; a capacitor electrically coupled in parallel with the gate driver and level shifter; a voltage source electrically coupled to an input of the gate driver and level shifter and an input of the gate driver; and, a bootstrap transistor electrically coupled between the voltage source and the capacitor. A GaN field-effect transistor is synchronously switched with a low side device of the half bridge circuit.
H03K 3/00 - Circuits for generating electric pulsesMonostable, bistable or multistable circuits
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 17/042 - Modifications for accelerating switching by feedback from the output circuit to the control circuit
H03K 17/16 - Modifications for eliminating interference voltages or currents
An electrical circuit arranged in a half bridge topology. The electrical circuit includes a high side transistor; a low side transistor; a gate driver and level shifter electrically coupled to a gate of the high side transistor; a gate driver electrically coupled to a gate of the low side transistor; a capacitor electrically coupled in parallel with the gate driver and level shifter; a voltage source electrically coupled to an input of the gate driver and level shifter and an input of the gate driver; and, a bootstrap transistor electrically coupled between the voltage source and the capacitor. A GaN field-effect transistor is synchronously switched with a low side device of the half bridge circuit.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
95.
GaN transistors with polysilicon layers used for creating additional components
A GaN transistor with polysilicon layers for creating additional components for an integrated circuit and a method for manufacturing the same. The GaN device includes an EPI structure and an insulating material disposed over EPI structure. Furthermore, one or more polysilicon layers are disposed in the insulating material with the polysilicon layers having one or more n-type regions and p-type regions. The device further includes metal interconnects disposed on the insulating material and vias disposed in the insulating material layer that connect source and drain metals to the n-type and p-type regions of the polysilicon layer.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/085 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
H01L 29/778 - Field-effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT
H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
H01L 21/8258 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by , , or
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
H01L 29/417 - Electrodes characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
H01L 21/763 - Polycrystalline semiconductor regions
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
96.
Flip chip interconnection with reduced current density
A method and system for electrically connect a semiconductor device with a flip-chip form factor to a printed circuit board. An exemplary embodiment of the method comprises: aligning solder contacts on the device with a first copper contact and a second copper contact of the external circuitry, and, applying a supply current only directly to a buried layer of the first copper and not directly to the layer which is nearest the device, such that no current is sourced to the device through the layer nearest the device.
H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
A high efficiency voltage mode class D amplifier and energy transfer system is provided. The amplifier and system includes a pair of transistors connected in series between a voltage source and a ground connection. Further, a ramp current tank circuit is coupled in parallel with one of the pair of transistors and a resonant tuned load circuit is coupled to the ramp current tank circuit. The ramp current tank circuit can include an inductor that absorbs an output capacitance COSS of the pair of transistors and a capacitor the provides DC blocking.
A circuit and technique are provided to control bias setting to an FET based common source RF amplifier that can operate with large signals present. The circuit and technique described herein use a second FET in an identical circuit having the gate circuits connected in parallel and being sourced by the same drain voltage that serves as a reference to a first circuit bias setting. The drain current in a first FET will include both the bias and RF amplification current, whereas the second FET only carries the bias current. Because the devices and circuits are matched, the gate voltage variations will appear in both FETs thereby providing regulation of the drain current.
