Provided is a copper plating technique that enables the filing of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates and ceramic substrates. The disclosed technique involves a copper plating method, a copper plating bath and copper plating additives that include a tertiary amine compound represented by general formula 1 (wherein the R1 moiety is a C2 - C30 glycol ether represented, the R2 moieties are hydrocarbons that form 5-membered rings, 6-membered rings or a 5- and a 6-membered ring and the R2 moieties may include a C3 - C8 unsaturated bond and may be substituted with nitrogen atoms or oxygen atoms) and/or a quaternary amine compound thereof.
C07D 295/08 - Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 7/00 - Electroplating characterised by the article coated
Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a copper plating method, a copper plating bath and copper plating additives that include a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and/or a quaternary amine compound thereof.
C07D 295/08 - Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 7/00 - Electroplating characterised by the article coated
Disclosed is a technique for carrying out electroless nickel plating, electroless palladium plating and electroless gold plating on a high density copper wiring pattern, which is formed by a semi-additive method, without forming bridges on a base resin. Specifically disclosed is a method for producing a printed wiring board, which is characterized in that: a printed wiring substrate that is provided with a copper wiring pattern by a semi-additive method is processed with a catalyst removal liquid that contains nitric acid, chlorine ions and a cationic polymer; then the resulting printed wiring substrate is processed with a bridge prevention liquid that contains a sulfur-containing organic material; and after that electroless nickel plating, electroless palladium plating and electroless gold plating are carried out thereon.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
A process for producing a two-layer flexible copper-clad laminate substrate by wet plating using an acidic copper plating bath composition and a resin film coated with a conductive metal serving as a seed layer. The process for two-layer FCCL production includes: a step in which a seed layer is formed by electroless nickel plating on a hydrophilized surface of a resin film; and a step in which this resin film is subjected, without performing primary copper plating, to wet electroplating in the acidic copper plating bath composition to thickly deposit a conductive copper layer on the seed layer.
There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I):
wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
This invention provides a method for containing an insulating resin, which can enhance the adhesion between a metallic film and an insulating resin by a simple method in the formation of a metallic film on a smooth insulating resin, and a method for metallizing an insulating resin utilizing this method. The method is characterized in that, after the hydrophilization of the insulating resin, the resin is treated with a solution containing a polymer having a primary amine or a secondary amine or both the primary or secondary amines on its side chain.
An RF coil (23) is arranged between a target (11) and a work (W), and sputtering particles scattering from the target (11) toward the work (W) are ionized to positive ions when the RF coil (23) is supplied with high frequency power. The work (W) or the work holder (8) holding the work (W) are negatively biased by a bias power supply (26), and the ionized sputtering particles are attracted. A current flowing in the bias power supply (26) is controlled not to have the adhered sputtering particles immediately become electrically neutral.
Provided is a sputtering technology for uniformly forming a film with sputter particles even on a work having a complicated three-dimensional shape. The film is formed on the three-dimensional work, which is attached to a rotating carousel-type work holder arranged to face the target, by sputtering the target. The three-dimensional work is rotated by means of a shaft arranged within a surface vertical to a surface which connects the target and the rotating shaft of the carousel-type work holder. At least for a partial time during the total sputtering time, the main scattering direction of the spatter particles scattering from the target is permitted to be a direction decentered from the center direction of the rotating shaft of the carousel-type work holder.
Provided is a sputtering apparatus which suppresses entry of thermal electrons into a work and does not cause problems such as work deformation due to heat, even at the time of forming a film on materials, such as plastic, having a low heat resistance. The apparatus is provided with a target and a carousel-type work holder arranged to face the target with a rotating shaft, in a vacuum chamber. The carousel-type work holder has a work holder supporting section and a plurality of work holding sections. The work holding section is arranged at the outer circumfernce of the work holder supporting section. The carousel-type work holder and/or the work holding section is rotatably arranged by a shaft arranged within a surface vertical to a surface connecting the target and the rotating shaft of the carousel-type work holder. Inside the carousel-type work holder, a thermal electron capturing member is arranged.
A main rotating section (15) which rotates with a main shaft (13) at the center is provided with a plurality of sub-rotating sections (16), and each sub-rotating section (16) has a plurality of work holders (17). A work (W) held by the work holder (17) rotates on its own rotating shaft (46), while rotating with the main shaft (13) at the center and rotating with a sub-shaft (36) at the center by rotation of the main rotating section (15) and sub-rotating sections (16). Films are formed by making surfaces of the works (W) sequentially face a target (23).
On a first film forming stage (8) in a vacuum tank (3), a sputtering apparatus (10), which constitutes a sputtering apparatus, is arranged. On a second film forming stage (9), a deposition apparatus (11) is arranged. Sputtering step of forming a thin film is performed by operating the sputtering apparatus (10), while rotating a carousel (4). After the sputtering step, a thin film is further formed by operating the deposition apparatus (11). In the sputtering step, the deposition apparatus (11) is cooled so that a deposition material does not evaporate nor sublime.
C23C 14/22 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
Disclosed is a laminated polyimide substrate in which the adhesion between a polyimide film and a metal layer is kept at a satisfactory level, whose deterioration with time under severe conditions is prevented effectively, and in which various properties are retained and/or imparted. Also disclosed is a method for producing the laminated polyimide substrate. Specifically disclosed is a laminated polyimide substrate comprising a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer arranged in this order, wherein the alkali-treated layer has an anionic functional group and has a laminated structure composed of a layer arranged on the side facing the metal layer and containing a catalyst metal and a layer arranged on the side facing the polyimide layer and containing a complex of the catalyst metal.
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
13.
ETCHING SOLUTION, AND METHOD FOR METALLIZATION OF PLASTIC SURFACE EMPLOYING THE METHOD
Disclosed is an etching solution which is highly effective for modifying various plastic materials, has high bath stability, and can be used for the metallization of a plastic surface on an industrial scale. The etching solution comprises a permanganic acid salt and a periodic acid salt or a salt thereof, and has a pH value of 2.0 or lower.
The invention aims at providing a practical process for chrome-free metallization of plastic surfaces by which a plating film adhering tightly to the surface of a plastics part can be formed and which is free from the deposition on a jig. A process for the metallization of plastic surfaces which is characterized by treating a plastics part with an etching fluid containing both a permanganate and an inorganic acid, treating the resulting plastics part with a potentiator fluid for the impartment of a catalyst which contains a compound exhibiting selective adsorption to functional groups exposed on the surface of the plastics part, imparting a catalyst to the treated plastics part with a catalyst imparting fluid, and then subjecting the resulting plastics part to metal plating.
Simple means for unfailing prevention of whisker occurrence even when leaving is made at room temperature for 5000 hr after tin or tin alloy plating. There is provided a whisker preventive agent for tin or tin alloy plating, comprising (A) sulfuric acid, an alkanesulfonic acid, an alkanolsulfonic acid and derivative thereof, (B) a peroxide and (C) ions of a metal noble in potential to copper. Further, there is provided a method of whisker prevention for tin or tin alloy plating, characterized in that after immersion of a material to be plated in the above whisker preventive agent for tin or tin alloy plating, tin or tin alloy plating is carried out.
A surface modification liquid for plastic that in pretreatment for metallization of a plastic surface by metal plating, solves the problems of etching treatment with the use of conventional etchant containing chromic acid, etc. There is provided a surface modification liquid for plastic characterized by containing permanganic acid, phosphoric acid and nitric acid.
The object is to provide a technique for forming a selective metal coating film on a non-conductive resin by allowing a catalyst metal to adsorb selectively onto an anionic group (e.g., a carboxyl group) on the resin. Thus, disclosed are: a palladium complex represented by the formula (I) below or a structural isomer thereof; a catalyst-imparting treatment solution for electroless plating, comprising the palladium complex or the isomer as an active ingredient; and a method for formation of a metal plating coating film on a non-conductive resin, comprising the steps of subjecting a non-conductive resin having an anionic group formed on its surface to a catalyst-imparting treatment with the catalyst-imparting treatment solution and then performing reduction treatment, electroless metal plating and electrolytic plating. (I) wherein L represents an alkylene group; and R represents an amino group or a guanidyl group.
C07C 229/08 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one amino and one carboxyl group bound to the carbon skeleton the nitrogen atom of the amino group being further bound to hydrogen atoms
C07C 229/22 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated the carbon skeleton being further substituted by oxygen atoms
C07C 229/24 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having more than one carboxyl group bound to the carbon skeleton, e.g. aspartic acid
C07C 229/26 - Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having more than one amino group bound to the carbon skeleton, e.g. lysine
C07C 279/14 - Derivatives of guanidine, i.e. compounds containing the group the singly-bound nitrogen atoms not being part of nitro or nitroso groups having nitrogen atoms of guanidine groups bound to acyclic carbon atoms of a carbon skeleton being further substituted by carboxyl groups
C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
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