A power supply and associated method are disclosed. The power supply comprises a pulse generator configured to receive power from an electrical source and provide power between a first node and a second node. A switch circuit is coupled to the pulse generator, and a sensor is configured to sense current of the power supply and to generate a signal indicative of the current. Control logic is configured, in response to the signal exceeding a threshold, to control the switch circuit to block forward current from the electrical source while simultaneously allowing reverse current to flow to the electrical source.
H03K 17/082 - Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
A61N 1/36 - Applying electric currents by contact electrodes alternating or intermittent currents for stimulation, e.g. heart pace-makers
H03K 3/57 - Generators characterised by the type of circuit or by the means used for producing pulses by the use of an energy-accumulating element discharged through the load by a switching device controlled by an external signal and not incorporating positive feedback the switching device being a semiconductor device
An electrostatic wafer clamping and sensing system includes a power source configured to provide a high voltage clamping signal. A transformer, having a primary and a secondary, is coupled in series with an output of the power source. An AC voltage source is coupled to the primary of the transformer and operates at a frequency within the bandpass of a filter of a plasma processing chamber. A voltage sensing circuit is coupled to an opposing end of the primary of the transformer, the two ends being separated by a center tap. The high voltage clamping signal and a capacitance sensing AC signal from the AC voltage source are combined via the secondary and passed to a capacitive load. While the AC voltage source is held constant, amplitude modulation at the voltage sensing circuit indicates a clamping state of an electrostatic chuck.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
An electrostatic wafer clamping and sensing system includes a power source configured to provide a high voltage clamping signal. A transformer, having a primary and a secondary, is coupled in series with an output of the power source. An AC voltage source is coupled to the primary of the transformer and operates at a frequency within the bandpass of a filter of a plasma processing chamber. A voltage sensing circuit is coupled to an opposing end of the primary of the transformer, the two ends being separated by a center tap. The high voltage clamping signal and a capacitance sensing AC signal from the AC voltage source are combined via the secondary and passed to a capacitive load. While the AC voltage source is held constant, amplitude modulation at the voltage sensing circuit indicates a clamping state of an electrostatic chuck.
C23C 16/453 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
C23C 16/509 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
C23C 16/46 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
C23C 16/503 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
H01J 37/20 - Means for supporting or positioning the object or the materialMeans for adjusting diaphragms or lenses associated with the support
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A busbar assembly comprises a first busbar having a first surface and a second surface opposite the first surface and having a first lead aperture formed therein. The busbar assembly also comprises a second busbar positioned adjacently to the first busbar and having a third surface and a fourth surface opposite the third surface and having a second lead aperture formed therein. The first busbar comprises an extension element extending from the second surface. The first lead aperture is formed through the extension element. The extension element has a portion thereof extending through the second lead aperture.
Various illustrative aspects are directed to a system. The system comprises a setpoint waveform streaming progenitor module, configured to receive inputs indicative of a desired setpoint waveform, and to output a data package based at least in part on the inputs indicative of the desired setpoint waveform, wherein the data package comprises a plurality of points, an interpolation method, and one or more interpolation parameters. The system further comprises a setpoint waveform streaming processing module, configured to receive the data package from the setpoint waveform streaming progenitor module, and to output a streaming setpoint waveform based at least in part on the data package.
This disclosure describes systems, methods, and apparatus for generating a control signal for one or more actuators that is adjusted from a control signal dictated by setpoints, where the adjustment accounts for predicted delays and amplitude errors. More specifically, cross correlation between measurements of the actuator(s) outputs and time-shifted setpoints can be optimized for a time-shift that minimizes the cross correlation. The time-shifted setpoints along with the measurements can then be used to determine an amplitude difference and to remove noise from the amplitude difference. Dynamic uncertainty can then be found from this denoised data set and further optionally used to find the noise that was removed. The time delay, noise, and dynamic uncertainty can be used to preemptively adjust the control signal.
This disclosure describes systems, methods, and apparatuses for open-circuit and back-surge protection of power supplies, where the method comprises: generating a voltage at an output of a power supply; monitoring a rate of change of the voltage with a detection-protection circuit, the detection-protection circuit comprising a capacitor and a plurality of resistors having different resistance values; in response to the rate of change of the voltage exceeding a threshold, discontinuing the generation of the voltage to protect the power supply; and preventing a back bias into at least a portion of the detection-protection circuit, wherein the preventing the back bias is based at least on a respective resistance value of each of the plurality of resistors.
Systems, methods, and apparatuses for measuring capacitance of a load. An apparatus includes a ground connector, an output connector configured to couple to the load, and a time-varying signal source configured to inject a time-varying voltage signal onto a conduction path between the ground connector and the output connector. A DC power source or amplifier is configured to apply a DC offset to the time-varying voltage signal, and a current monitor is configured to measure time-varying current in the conduction path. A capacitance module is configured to determine the capacitance based upon at least one of the time-varying current, and accuracy of this measurement is improved by arranging an AC shunt across the DC power source or amplifier.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
This disclosure describes systems, methods, and apparatuses for open-circuit and back-surge protection of power supplies, where the method comprises: generating a voltage at an output of a power supply; monitoring a rate of change of the voltage with a detection-protection circuit, the detection-protection circuit comprising a capacitor and a plurality of resistors having different resistance values; in response to the rate of change of the voltage exceeding a threshold, discontinuing the generation of the voltage to protect the power supply; and preventing a back bias into at least a portion of the detection-protection circuit, wherein the preventing the back bias is based at least on a respective resistance value of each of the plurality of resistors.
H03K 17/082 - Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
H02H 3/18 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to reversal of direct current
H02M 1/32 - Means for protecting converters other than by automatic disconnection
10.
MATCH NETWORK WITH VARIABLE CAPACITANCE AND SWITCHABLE ARRAY OF SOLID-STATE CAPACITANCE
A match network with variable capacitance and a switchable array of solid-state capacitance. In one embodiment, a match network includes a variable capacitance and one or more solid-state capacitances switchably in parallel with the variable capacitance. The match network also includes a controller configured to control the variable capacitance to impedance match to a first impedance state of a plasma load, and to switch at least one solid-state capacitance into or out of parallel arrangement with the variable capacitance to impedance match to a second state of the plasma load.
H01G 5/14 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of effective area of electrode due to longitudinal movement of electrodes
H03H 7/40 - Automatic matching of load impedance to source impedance
H01G 5/04 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of effective area of electrode
A match network with variable capacitance and a switchable array of solid-state capacitance. In one embodiment, a match network includes a variable capacitance and one or more solid-state capacitances switchably in parallel with the variable capacitance. The match network also includes a controller configured to control the variable capacitance to impedance match to a first impedance state of a plasma load, and to switch at least one solid-state capacitance into or out of parallel arrangement with the variable capacitance to impedance match to a second state of the plasma load.
A bias supply comprising power circuitry configured to apply an asymmetric periodic voltage waveform at the output node wherein the asymmetric periodic voltage waveform comprises a first section that begins with a first negative voltage and changes during a first transition to a peak voltage before changing during a second transition to a second negative voltage and a second section that begins with the second negative voltage and comprises a voltage ramp between the second negative voltage and a third negative voltage. Transition circuitry is configured to adjust a slope of one, or both, of the first and second transitions.
H01G 5/14 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of effective area of electrode due to longitudinal movement of electrodes
H03H 7/40 - Automatic matching of load impedance to source impedance
H01G 5/04 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of effective area of electrode
A bias supply comprising power circuitry configured to apply an asymmetric periodic voltage waveform at the output node wherein the asymmetric periodic voltage waveform comprises a first section that begins with a first negative voltage and changes during a first transition to a peak voltage before changing during a second transition to a second negative voltage and a second section that begins with the second negative voltage and comprises a voltage ramp between the second negative voltage and a third negative voltage. Transition circuitry is configured to adjust a slope of one, or both, of the first and second transitions.
A match network with switchable variable capacitance. In one embodiment, a match network includes a first variable capacitance, a second variable capacitance, and a third variable capacitance dynamically connectable in parallel with the first variable capacitance. The match network also includes a controller configured to: control at least one of the first variable capacitance and the second variable capacitance for impedance tuning for a first power pulse; place, in response to a second power pulse, the third variable capacitance to be in parallel with the first variable capacitance; and control at least the third variable capacitance for impedance tuning for the second power pulse.
A power controller system comprises multiple power controllers that receive a periodic waveform input and that apply power to multiple loads. A switch-on time and a switch-off time is for each of the power controllers within a cycle of the periodic waveform input. The power controllers generate output waveforms to be applied to the loads that are partial segments of the cycle of the periodic waveform input. Each of the power controllers includes a switchable power component that can be switched on and switched off at any time and that can conduct current in both forward and reverse directions.
H02M 5/293 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
Systems, methods and apparatus for applying a periodic voltage function are disclosed. An exemplary method comprises applying a modified periodic voltage function to an electrical node and monitoring the modified periodic voltage function over multiple cycles to monitor a relationship
Systems, methods and apparatus for applying a periodic voltage function are disclosed. An exemplary method comprises applying a modified periodic voltage function to an electrical node and monitoring the modified periodic voltage function over multiple cycles to monitor a relationship
dV
0
dt
-
I
c
C
1
=
D
Systems, methods and apparatus for applying a periodic voltage function are disclosed. An exemplary method comprises applying a modified periodic voltage function to an electrical node and monitoring the modified periodic voltage function over multiple cycles to monitor a relationship
dV
0
dt
-
I
c
C
1
=
D
to represent a status of a plasma process or the plasma processing chamber, where Ic represents a controllable ion compensation current, D is a unitless value, dV0/dT represents a portion of the modified periodic voltage function that includes a negative voltage ramp, and C1 is an effective capacitance including a capacitance of a substrate support.
G01N 27/06 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
Systems and methods for plasma processing are disclosed. An exemplary system may include a plasma processing chamber including a source to produce a plasma in the processing chamber and at least two bias electrodes arranged within the plasma processing chamber to control plasma sheaths proximate to the bias electrodes. A chuck is disposed to support a substrate, and a source generator is coupled to the plasma electrode. At least one bias supply is coupled to the at least two bias electrodes, and a controller is included to control the at least one bias supply to control the plasma sheaths proximate to the bias electrodes.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
18.
MATCH NETWORK WITH SWITCHABLE VARIABLE CAPACITANCE
A match network with switchable variable capacitance. In one embodiment, a match network includes a first variable capacitance, a second variable capacitance, and a third variable capacitance dynamically connectable in parallel with the first variable capacitance. The match network also includes a controller configured to: control at least one of the first variable capacitance and the second variable capacitance for impedance tuning for a first power pulse; place, in response to a second power pulse, the third variable capacitance to be in parallel with the first variable capacitance; and control at least the third variable capacitance for impedance tuning for the second power pulse.
H01G 5/14 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of effective area of electrode due to longitudinal movement of electrodes
H03H 7/40 - Automatic matching of load impedance to source impedance
H01G 5/04 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of effective area of electrode
Systems, methods and apparatus for regulating ion energies in a plasma chamber and avoiding excessive and damaging charge buildup on the substrate surface and within capacitive structures being built on the surface. An exemplary method includes placing a substrate in a plasma chamber, forming a plasma in the plasma chamber, controllably switching power to the substrate so as to apply a periodic voltage function (or a modified periodic voltage function) to the substrate, and modulating, over multiple cycles of the periodic voltage function, the periodic voltage function responsive to a defined distribution of energies of ions at the surface of the substrate so as to effectuate the defined distribution of ion energies on a time-averaged basis, and to maintain surface charge buildup below a threshold.
H03K 3/64 - Generators producing trains of pulses, i.e. finite sequences of pulses
H03K 3/70 - Generators producing trains of pulses, i.e. finite sequences of pulses by interrupting the output of a generator time intervals between all adjacent pulses of one train being equal
H03K 3/78 - Generating a single train of pulses having a predetermined pattern, e.g. a predetermined number
Various embodiments are directed to a switch circuit comprising: two terminal nodes, comprising an upper node and a lower node; a plurality of switch modules, connected in series between the upper node and the lower node, wherein each of the switch modules comprises a switch, a rectifier, and a capacitor; a connecting circuit, coupled to the switch modules; and a power converter, coupled to the connecting circuit and to a power sink. The switch circuit is configured to limit a voltage or a component of a voltage in the switch circuit, and to recover power from the limiting of the voltage, wherein recovering the power comprises diverting power from the switch modules via the connecting circuit to the power converter, and the power converter outputting the power to the power sink.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 1/32 - Means for protecting converters other than by automatic disconnection
A coating system that reduces parasitic currents that may cause crazing in coatings on a substrate. In one example, the system includes a pair of low impedance shunt paths to ground for parasitic AC currents generated from the plasma in the chamber. The low impedance shunts may be provided through a balanced triaxial connection between a power supply of each chamber and the magnetrons of each chamber. In another example, potential differences between adjacent chambers are minimized through synchronized power supply signals between chambers.
An apparatus for ground fault monitoring comprises a voltage bus, a high resistance midpoint grounding (HRMG) current limiting circuit, and a ground fault sense circuit. The voltage bus comprises a first and second voltage bus lines. The HRMG current limiting circuit comprises first and HRMG resistors. The HRMG current limiting circuit also comprises a positive sense resistor coupled across the base and emitter terminals of a first transistor and a negative sense resistor coupled across the base and emitter terminals of a second transistor. The ground fault sense circuit is configured to generate a ground fault signal indicative of a ground fault condition existing between the voltage bus and a common ground node.
H02H 3/16 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to fault current to earth, frame or mass
A multi-phase power supply circuit comprises a first voltage converter stage, a resonant choke stage, and a transformer assembly. The resonant choke stage comprises a first and second resonant inductors electrically coupled with first and second voltage outputs of the first voltage converter stage. The transformer assembly comprises primary and secondary coil assemblies. Each primary coil assembly comprises first and second primary windings. The first primary winding comprises a first node electrically coupled with the resonant choke stage and a second node. The second primary winding comprises a first node and a second node electrically coupled with the resonant choke stage. The second nodes of the first primary windings are electrically coupled together, the first nodes of the second primary windings are electrically coupled together, and the first and second resonant inductors are wound about a first leg of a first magnetic core.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 3/00 - Conversion of DC power input into DC power output
28.
ENHANCED CAPACITANCE SENSING SYSTEM FOR ELECTROSTATIC CHUCK DEVICES
An electrostatic chuck system and method for determining workpiece bow are disclosed. The system includes a power supply configured to generate high DC voltages for chucking forces and low AC voltages for capacitance sensing. A multi-segmented chuck is driven by multiple outputs of the power supply. A capacitance monitor incorporated in the power supply measures load capacitance by sensing current due to the low AC voltages modulated on the high DC voltage. Capacitance is measured for one or more segments at a time with the low AC voltage portion of the signal inverted to the segments being measured. Measurements on inverted signals are performed until all segments have been measured and then a spread in the measured currents is used to assess wafer bow.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
29.
HIGH VOLTAGE POWER SUPPLY FOR FAST VOLTAGE CHANGES
The disclosure describes a high voltage power supply and control system for electron beam tools. The system includes a primary DC source, one or more secondary regulated sources, and a fast power control interposed therebetween. The fast power control includes a transfer capacitor coupled to ground, a first fast power control, and a second fast power control. The first fast power control makes rapid and small adjustments to the total output provided to the secondaries and hence controls small adjustments to the tool, while the second fast power control makes proportional voltage or current changes of an opposing polarity to charge or discharge the transfer capacitor and thereby maintain charge balance relative to cable capacitances of cables connecting the high voltage power source to the tool. The system can be used with electron beam tools such as scanning electron microscopes, electron beam inspection tools, or electron lithography tools.
G05F 1/46 - Regulating voltage or current wherein the variable actually regulated by the final control device is DC
H01J 37/24 - Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
H01J 37/248 - Components associated with high voltage supply
H02M 1/14 - Arrangements for reducing ripples from DC input or output
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
30.
HIGH VOLTAGE POWER SUPPLIES FOR FAST VOLTAGE CHANGES
The disclosure describes a high voltage power supply and control system for electron beam tools. The system includes a primary DC source, one or more secondary regulated sources, and a fast power control interposed therebetween. The fast power control includes a transfer capacitor coupled to ground, a first fast power control, and a second fast power control. The first fast power control makes rapid and small adjustments to the total output provided to the secondaries and hence controls small adjustments to the tool, while the second fast power control makes proportional voltage or current changes of an opposing polarity to charge or discharge the transfer capacitor and thereby maintain charge balance relative to cable capacitances of cables connecting the high voltage power source to the tool. The system can be used with electron beam tools such as scanning electron microscopes, electron beam inspection tools, or electron lithography tools.
An electrostatic chuck system and method for determining workpiece bow are disclosed. The system includes a power supply configured to generate high DC voltages for chucking forces and low AC voltages for capacitance sensing. A multi-segmented chuck is driven by multiple outputs of the power supply. A capacitance monitor incorporated in the power supply measures load capacitance by sensing current due to the low AC voltages modulated on the high DC voltage. Capacitance is measured for one or more segments at a time with the low AC voltage portion of the signal inverted to the segments being measured. Measurements on inverted signals are performed until all segments have been measured and then a spread in the measured currents is used to assess wafer bow.
An example device comprises a reference model module, an adaptation law module, and an adaptive control module. The reference model module is configured to receive a setpoint input and a reference model input, and to generate a reference model output. The adaptation law module is configured to receive the reference model output from the reference model module, to perform a signum projection tensor operation based at least in part on the reference model output, and to generate a signum projection adaptation law output. The adaptive control module is configured to receive the adaptation law output from the adaptation law module, to receive the setpoint input, and to receive a sensor system output from a sensor system, and to generate an adaptive control signal.
G05B 6/02 - Internal feedback arrangements for obtaining particular characteristics, e.g. proportional, integral or differential electric
G05B 13/04 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
software for use in the design and configuration of power systems and power supplies. computer services, namely, providing online technological information in the field of power supplies and power systems via a website; providing a website featuring software tools for selecting and configuring power supplies and power systems.
An apparatus comprises a vacuum chamber configured to produce a substantially atmospheric vacuum environment for plasma processing; a radio frequency (RF) power supply located outside of the vacuum chamber; an RF matching network operatively coupled to the RF power supply; and a plurality of electrodes mounted within the vacuum chamber, the plurality of electrodes configured to receive RF power signals from the RF power supply through the RF matching network. The RF power signals are simultaneously delivered to the plurality of electrodes during a sputtering operation. The plurality of electrodes and a set of electrical components are operative to manage the inductive and capacitive reactance for coupling the RF power signals to provide more desirable plasma coupling during the sputtering operation.
An apparatus comprises a vacuum chamber configured to produce a substantially atmospheric vacuum environment for plasma processing; a radio frequency (RF) power supply located outside of the vacuum chamber; an RF matching network operatively coupled to the RF power supply; and a plurality of electrodes mounted within the vacuum chamber, the plurality of electrodes configured to receive RF power signals from the RF power supply through the RF matching network. The RF power signals are simultaneously delivered to the plurality of electrodes during a sputtering operation. The plurality of electrodes and a set of electrical components are operative to manage the inductive and capacitive reactance for coupling the RF power signals to provide more desirable plasma coupling during the sputtering operation.
09 - Scientific and electric apparatus and instruments
Goods & Services
Impedance matching products, namely radio frequency match
network products; impedance alteration electrical circuits
for radio frequency power; radio frequency electrical
circuits for application in manufacturing and controlling
processes in the manufacture of thin films and
semiconductors.
Match networks, systems, and methods are disclosed. A match network comprises an input, an output, a first variable reactive component, a second variable reactive component, a third variable reactive component, and a controller. The controller is configured to control the first variable reactive component and the second variable reactive component to, at least in part, match a load impedance at the output to a source impedance at the input during a first and second states, and the controller is configured to set the third variable reactive component so that frequency sweeping completes tuning during at least one of the states.
H01Q 5/50 - Feeding or matching arrangements for broad-band or multi-band operation
H01Q 5/335 - Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
Match networks, systems, and methods are disclosed. A match network comprises an input, an output, a first variable reactive component, a second variable reactive component, a third variable reactive component, and a controller. The controller is configured to control the first variable reactive component and the second variable reactive component to, at least in part, match a load impedance at the output to a source impedance at the input during a first and second states, and the controller is configured to set the third variable reactive component so that frequency sweeping completes tuning during at least one of the states.
Devices and methods for measuring capacitance of a load. A device may include a ground connector configured to couple to ground and an output connector configured to couple to the load. The device may include a direct current (DC) supply arranged in a conduction path between the ground connector and the output connector wherein the DC supply is configured to apply a DC voltage and noise voltage onto the conduction path. The device may include a voltage monitor configured to monitor the noise voltage applied by the DC supply and the device may include a current monitor configured to measure current in the conduction path that results from the noise voltage. The device may include a capacitance module coupled to the current monitor and voltage monitor, the capacitance module configured to determine the capacitance based upon the monitored current and noise voltage.
G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Devices and methods for measuring capacitance of a load. A device may include a ground connector configured to couple to ground and an output connector configured to couple to the load. The device may include a direct current (DC) supply arranged in a conduction path between the ground connector and the output connector wherein the DC supply is configured to apply a DC voltage and noise voltage onto the conduction path. The device may include a voltage monitor configured to monitor the noise voltage applied by the DC supply and the device may include a current monitor configured to measure current in the conduction path that results from the noise voltage. The device may include a capacitance module coupled to the current monitor and voltage monitor, the capacitance module configured to determine the capacitance based upon the monitored current and noise voltage.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
G01R 15/16 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using capacitive devices
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01R 29/26 - Measuring noise figureMeasuring signal-to-noise ratio
A bias supply configured for predicting behavior of one or more aspects of a plasma load by measuring a current waveform is disclosed. The bias supply applies an asymmetric periodic voltage waveform and a corresponding current waveform. The asymmetric periodic voltage waveform includes a first section comprising a positive pulse peak and a second section comprising a negative voltage ramp. The bias supply receives data about the current waveform during the first section, and based upon the received data, provides information about a plasma load.
Bias supplies and plasma processing systems are disclosed. One bias supply comprises an output node, a return node, and a switch network and at least one power supply coupled to the output node and the return node. The switch network and the at least one power supply configured, in combination, to apply an asymmetric periodic voltage waveform and provide a corresponding current waveform at the output node relative to the return node. A timing parameter estimator receives a digital representation of a full cycle of the voltage and current waveforms, and generates a pulse width control signal based on a crossing time that the current waveform crosses a threshold current value after falling from a positive peak current value to control the switch network.
H02M 7/537 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 7/5395 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters with automatic control of output wave form or frequency by pulse-width modulation
47.
PLASMA BEHAVIORS PREDICTED BY CURRENT MEASUREMENTS DURING ASYMMETRIC BIAS WAVEFORM APPLICATION
A bias supply configured for predicting behavior of one or more aspects of a plasma load by measuring a current waveform is disclosed. The bias supply applies an asymmetric periodic voltage waveform and a corresponding current waveform. The asymmetric periodic voltage waveform includes a first section comprising a positive pulse peak and a second section comprising a negative voltage ramp. The bias supply receives data about the current waveform during the first section, and based upon the received data, provides information about a plasma load.
A remote plasma source (RPS) may include a toroidal chamber shaped to promote diffusion, reduce fluid velocity, and prolong fluid residence time in the RPS. A toroidal chamber may include an inlet, an outlet, an input leg, an output leg, and two interstitial legs connecting the input and output legs. A reference plane may bisect the toroidal chamber, the inlet, the outlet, and the four legs, wherein the inlet is substantially perpendicular to the reference plane and thereby configured to direct a fluid into the toroidal chamber substantially perpendicularly to the reference plane. A second inlet may be arranged in an opposing direction to the first inlet, either at the same corner of the input leg or at an opposing corner of the input leg.
H05H 1/12 - Arrangements for confining plasma by electric or magnetic fieldsArrangements for heating plasma using applied magnetic fields only wherein the containment vessel forms a closed loop, e.g. stellarator
F17D 1/04 - Pipe-line systems for gases or vapours for distribution of gas
09 - Scientific and electric apparatus and instruments
36 - Financial, insurance and real estate services
37 - Construction and mining; installation and repair services
42 - Scientific, technological and industrial services, research and design
45 - Legal and security services; personal services for individuals.
Goods & Services
Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, in industrial products and associated manufacturing, test, and control systems; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within commercial products and associated manufacturing, test, and control systems; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within source power conversion, measurement, and control, namely, utility source power and other energy source power; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within semiconductor, thin film plasma processes including industrial coating, optical coating and other coatings; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within data center, cloud computing, networking systems, and telecommunication systems; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within analytical instrumentation and analytical instrumentation processes; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within medical equipment, therapeutic equipment, and diagnostic equipment; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within industrial production and manufacturing systems; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within material and chemical processing; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for use with temperature measurement and control of glass applications, metal applications, nonmetal applications, refineries, gas plants, petrochemicals processes, semiconductor and thin-film production, inspection of boiler tubes and furnace walls, pilot flames and flare stacks, rolling processes, rotary kilns, and glass production; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within electrostatic instrumentation; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, temperature calibration devices for calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for use in gas sensing and monitoring automotive emissions, patients, greenhouse gases, freon refrigerants, carbon dioxide, sulfur hexafluoride, and ventilation systems; temperature calibration devices for use with calibrating pyrometers, thermal imaging cameras, radiometers, heatflux, and spectrographic measurement systems, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors in the nature of devices for monitoring waste gas ignition system characteristics to identify failure, thermal imaging cameras, infrared cameras, power controllers, residual gas analyzers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within power delivery, power control, power measurement, power conversion, power transformation, power refinement, power modification, and power supply systems; Electronic devices, namely, power supplies, power supply inverters, power shelves in the nature of power supplies, power rectifiers in the nature of power supplies and power strips, all for use with server rack installations, apparatus for conducting, regulating, and controlling electricity for plasma sources in the nature of power supplies, matching networks, and plasma chambers for use with chemical vapor deposition (CVD), power sources in the nature of radio frequency ("RF") plasma generators for producing RF power to generate and maintain plasma in CVD chambers, temperature measurement devices, power controllers, gas sensors for measuring gas concentration, rectifiers, power adapters, power converters, DC/DC converters, digital multi-meters, match networks in the nature of variable impedance-adapting circuits, voltage amplifiers in the nature of high voltage multipliers, voltmeters, electrostatic detectors and sensors for detecting and sensing electrostatic charge buildup, Instrumentation for locating static charges and measuring ionizer performance in the nature of charged plate monitors, surface/volume resistance meters, ionizers being ionization apparatus for scientific or laboratory use, ion collecting plates in the nature of electrostatic emission control devices being electrostatic precipitators for reducing particulate emission in industrial applications, electrostatic force microscopes, voltage pulse generators for testing electric current, power amplifiers, battery backup power supplies, computer hardware, and downloadable computer software and firmware for user interface functionality and back-end processing with power diagnostics, power visualization, power optimization, ventilation system coordination, gas monitoring, thermal comfort assessment, process control, process monitoring, preventive maintenance, and error detection, within the aerospace and defense systems; Downloadable computer software and firmware for monitoring, controlling, and analyzing power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems; downloadable software for providing analytics in the form of advanced diagnostics, predictive or prescriptive actional insights, and computing infrastructure for use in association with manufacturing processes; electrostatic instrumentation, namely, electrostatic copying machines, gas sensors for measuring gas concentration and gas flow monitors Extended warranty services, namely, service contracts. Technical support services, namely, providing technical advice and support services related to the repair of computer hardware and software sold as a unit; Equipment repair and maintenance services, namely, repair of power supplies, power generators, power inverters, power shelves, plasma sources, plasma generators, temperature measurement devices, temperature calibration sources, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors, thermal imagers, infrared cameras, power controllers, gas analyzers, gas sensors, rectifiers, power adapters, power converters, DC/DC converters, multi-meters, match networks, voltage amplifiers, voltmeters, electrostatic detectors and sensors, charged plate monitors, surface/volume resistance meters, ionizers, ion collecting plates, electrostatic form microscopes, voltage pulse generators, power amplifiers, battery backup units, computer hardware, and remote plasma sources equipment; building maintenance and repair, namely, industrial production facilities repair, overhaul, and maintenance; field services, namely, installation, on-site repair, and on-site application support in the nature of repair and maintenance of power supplies, power generators, power inverters, power shelves, plasma sources, plasma generators, temperature measurement devices, temperature calibration sources, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors, thermal imagers, infrared cameras, power controllers, gas analyzers, gas sensors, rectifiers, power adapters, power converters, DC/DC converters, multi-meters, match networks, voltage amplifiers, voltmeters, electrostatic detectors and sensors, charged plate monitors, surface/volume resistance meters, ionizers, ion collecting plates, electrostatic form microscopes, voltage pulse generators, power amplifiers, battery backup units, computer hardware, and remote plasma sources; refurbishment services, namely, refurbishing of pre-owned power supplies, power generators, power inverters, power shelves, plasma sources, plasma generators, temperature measurement devices, temperature calibration sources, fiber optic temperature sensors, pyrometers, infrared thermometers, flare pilot monitors, thermal imagers, infrared cameras, power controllers, gas analyzers, gas sensors, rectifiers, power adapters, power converters, DC/DC converters, multi-meters, match networks, voltage amplifiers, voltmeters, electrostatic detectors and sensors, charged plate monitors, surface/volume resistance meters, ionizers, ion collecting plates, electrostatic form microscopes, voltage pulse generators, power amplifiers, battery backup units, computer hardware, and remote plasma sources equipment; maintenance and repair of computers; technical support services, namely, providing technical advice, and support services related to the repair of electronic devices, computer hardware and downloadable computer hardware and software sold as a unit, for use with power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems; Commissioning services in the nature of contractor services, namely, review of and remedial recommendations for power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems Field services, namely, on-site calibration; mechanical support services, namely, providing technical advice, and support services related to the repair of downloadable computer software for use with power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems; Software as a service (SAAS) services featuring software for monitoring, controlling, and analyzing power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems; Software as a service (SAAS) services featuring software for providing analytics in the form of advanced diagnostics, predictive or prescriptive actional insights, and computing infrastructure for use in association with manufacturing processes; Maintenance and upgrading of computer software; Technological consulting services in the field of electrical power delivery solutions for semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation processes, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control applications, electrostatic instrumentation products, and industrial gas sensors and monitors; Providing power regulation and control services in the nature of energy monitoring services to ensure proper functioning for the delivery of power for use by the electronic equipment of others, namely, power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems; Providing online nondownloadable software for use in monitoring, controlling, and analyzing power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems; technical support services, namely, providing technical advice, and support services related to the repair of downloadable computer software; calibration services; enhancement and upgrade services, namely, upgrading computer software; Commissioning services in the nature of quality evaluation and analysis for others in the field of power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems to assure compliance with industry standards; IT integration services, namely, combining one or more of power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems, and software and hardware computing systems to communicate and/or operate with a one or more of power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems, and software and hardware computing systems safety inspection services for power delivery systems, power control systems, power measurement systems, power conversion systems, power transformation systems, power refinement systems, power modification systems, and power supply systems, semiconductor and thin film plasma processes, data center, cloud computing, networking systems, and telecommunication systems, analytical instrumentation, medical equipment, industrial production systems, material and chemical processing systems, temperature measurement and control systems to ensure proper set-up, installation, operation, and/or use for safety purposes
Bias supplies and bias control methods are disclosed. One method comprises applying an asymmetric periodic voltage waveform and providing a corresponding current waveform at an output node relative to a return node; receiving a signal to change from a current state of the asymmetric periodic voltage waveform to a next state of the asymmetric periodic voltage waveform; and adjusting, during a transition from the current state to the next state, at least one portion of the asymmetric periodic voltage waveform and simultaneously adjusting a fundamental frequency of the asymmetric periodic voltage waveform to settle at the next state.
Systems, methods, and apparatuses for measuring capacitance of a load. An apparatus includes a ground connector, an output connector configured to couple to the load, and a time-varying signal source configured to inject a time-varying voltage signal onto a conduction path between the ground connector and the output connector. A DC power source is configured to apply a DC offset to the time-varying voltage signal, and a current monitor is configured to measure time-varying current in the conduction path. A capacitance module is configured to determine the capacitance based upon at least one of the time-varying current and a frequency of the time-varying voltage signal.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 33/02 - Measuring direction or magnitude of magnetic fields or magnetic flux
09 - Scientific and electric apparatus and instruments
Goods & Services
Electronic power conversion products, namely, radio frequency control systems and match networks in the nature of radio-frequency sensors and capacitors for measuring impedance, not for medical use
A power supply component comprising a supply node to provide a supply voltage and a supply line to provide a source voltage. The supply line comprising a source node that has a source voltage, and the supply line includes a supply line switch coupled between the source node and the supply node, wherein the supply line switch couples the source voltage to the supply node when the supply line switch is closed. A current diversion component diverts leakage current away from one or both of the source node and the supply node when the supply line switch is open.
H02M 3/15 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using discharge tubes only
A power supply component comprising a supply node to provide a supply voltage and a supply line to provide a source voltage. The supply line comprising a source node that has a source voltage, and the supply line includes a supply line switch coupled between the source node and the supply node, wherein the supply line switch couples the source voltage to the supply node when the supply line switch is closed. A current diversion component diverts leakage current away from one or both of the source node and the supply node when the supply line switch is open.
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 17/06 - Modifications for ensuring a fully conducting state
H03K 17/081 - Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
An energy delivery system comprises a power supply configured to generate a pulsed output voltage and a pulsed output current, and an over-energy protection (OEP) circuit coupled to the power supply. The OEP circuit senses the output current of the power supply and generates a sensed current signal, generates a charge-delivered signal from the sensed current signal that is representative of the charge delivered by the power supply over a time interval, and generates a fault signal that disables the power supply if the charge-delivered signal exceeds a threshold.
An energy delivery system comprises a power supply configured to generate a pulsed output voltage and a pulsed output current, and an over-energy protection (OEP) circuit coupled to the power supply. The OEP circuit senses the output current of the power supply and generates a sensed current signal, generates a charge-delivered signal from the sensed current signal that is representative of the charge delivered by the power supply over a time interval, and generates a fault signal that disables the power supply if the charge-delivered signal exceeds a threshold.
A61B 18/08 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by means of electrically-heated probes
A61B 18/12 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
A61B 18/04 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
A61B 18/18 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
60.
PHASE SHIFT SCHEME TO OPTIMIZE THERMAL EFFICIENCY FOR FULL-BRIDGE CONVERTER
A power converter may include a first leg comprising a first and a second switch connected to a first terminal of the load, a second leg comprising a third and a fourth switch connected to a second terminal of the load, and a controller configured to regulate switching of the first, second, third, and fourth switches, by switching the switches of each of the first and the second leg in a complementary manner. The controller causes the first leg to be a leading leg for one or more first switching transitions of the switches in the first leg and causes the second leg to be a leading leg for one or more second switching transitions of the switches in the second leg, based at least in part on controlling a phase shift angle for a voltage between the first and the second terminal.
H02M 7/5387 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
61.
PHASE SHIFT SCHEME TO OPTIMIZE THERMAL EFFICIENCY FOR FULL-BRIDGE CONVERTERS
A power converter may include a first leg comprising a first and a second switch connected to a first terminal of the load, a second leg comprising a third and a fourth switch connected to a second terminal of the load, and a controller configured to regulate switching of the first, second, third, and fourth switches, by switching the switches of each of the first and the second leg in a complementary manner. The controller causes the first leg to be a leading leg for one or more first switching transitions of the switches in the first leg and causes the second leg to be a leading leg for one or more second switching transitions of the switches in the second leg, based at least in part on controlling a phase shift angle for a voltage between the first and the second terminal.
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 7/00 - Conversion of AC power input into DC power outputConversion of DC power input into AC power output
A cascoded high-voltage amplifier is disclosed. The amplifier can include a chain of series-coupled low-voltage amplifiers, sometimes with a common gain, where an output of each low-voltage amplifier is coupled to an input of a next low-voltage amplifier, and inputs of adjacent low-voltage amplifiers are coupled via a feedforward connection, and optionally through an impedance component. In this way, a change in the input signal can level shift the entire chain of low-voltage amplifiers through the feedforward connections. The gain of the cascoded high-voltage amplifier can be a function of the number of low-voltage amplifiers, and a high-voltage output can be achieved without seeing high-voltage drops within the amplifier.
A cascoded high-voltage amplifier with Class D-H preamplifier is disclosed. The cascoded amplifier can include a chain of series-coupled low-voltage amplifiers, sometimes with a common gain, where an output of each low-voltage amplifier is coupled to an input of a next low-voltage amplifier, and inputs of adjacent low-voltage amplifiers are coupled via a feedforward connection, and optionally through an impedance component. In this way, a change in the input signal to the preamplifier can level shift the entire chain of low-voltage amplifiers through the feedforward connections. The gain of the cascoded high-voltage amplifier can be a function of the number of low-voltage amplifiers plus that of the Class D-H preamplifier, and a high-voltage output can be achieved without seeing high-voltage drops within the amplifier.
A cascoded high-voltage amplifier is disclosed. The amplifier can include a chain of series-coupled low-voltage amplifiers, sometimes with a common gain, where an output of each low-voltage amplifier is coupled to an input of a next low-voltage amplifier, and inputs of adjacent low-voltage amplifiers are coupled via a feedforward connection, and optionally through an impedance component. In this way, a change in the input signal can level shift the entire chain of low-voltage amplifiers through the feedforward connections. The gain of the cascoded high-voltage amplifier can be a function of the number of low-voltage amplifiers, and a high-voltage output can be achieved without seeing high-voltage drops within the amplifier.
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 3/20 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
H03F 3/21 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
H03F 1/08 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
H03F 3/213 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
Systems, methods, and apparatuses for measuring capacitance of a load. The method includes applying, via a conductor, a time-varying voltage signal with a DC offset to the load. At least a portion of the conductor is shielded with a shield and the time-varying voltage signal is applied to the shield. The conductor is coupled to the load and one or more power-related parameters of the conductor are monitored to monitor the capacitance of the load.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
66.
SYSTEM AND METHOD OF DETERMINING A LOAD VOLTAGE IN A POWER CONVERTER
Determining a load voltage across a load includes receiving electrical energy from a voltage source through a voltage input, transferring at least a portion of the received electrical energy to the load through a voltage output via a switching assembly, and determining a voltage of the received electrical energy via a first voltage sensor coupled to the voltage input. Further included is determining a voltage across the switching assembly via a second voltage sensor coupled to the voltage input and to the voltage output and determining the load voltage based on a comparison of the determined voltage of the received electrical energy with the determined voltage across the switching assembly.
Determining a load voltage across a load includes receiving electrical energy from a voltage source through a voltage input, transferring at least a portion of the received electrical energy to the load through a voltage output via a switching assembly, and determining a voltage of the received electrical energy via a first voltage sensor coupled to the voltage input. Further included is determining a voltage across the switching assembly via a second voltage sensor coupled to the voltage input and to the voltage output and determining the load voltage based on a comparison of the determined voltage of the received electrical energy with the determined voltage across the switching assembly.
H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
A power converter comprises a transformer comprising a primary winding and a secondary winding, a first switch coupled with the secondary winding, a filter circuit coupled with the first switch and comprising a resistor-capacitor (RC) filter coupled in series with a second switch, and a switch controller. The switch controller is coupled with the first switch and the filter circuit and configured to sense a voltage across the first switch, compare the voltage across the first switch with a voltage threshold, and control a gate of the first switch and a gate of the second switch in response to the comparison of the voltage.
H02M 3/00 - Conversion of DC power input into DC power output
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
A voltage converter comprises a drive control circuit configured to generate a pair of hysteretic current reference waveforms, generate a comparison signal based on a comparison of an inductor current with a first current reference waveform, and generate an interrupt signal. The drive control circuit is further configured to generate first and second sets of PWM signals configured to control the plurality of controllable switch devices based on one the comparison signal or the interrupt signal, and control the plurality of controllable switch devices based on the first set of PWM signals to generate the inductor current.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
Bias supplies and plasma processing systems are disclosed. One bias supply comprises an output node, a return node, and a switch network and at least one power supply coupled to the output node and the return node. The switch network and the at least one power supply configured, in combination, to apply an asymmetric periodic voltage waveform and provide a corresponding current waveform at the output node relative to the return node.
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
A power controller system comprises multiple power controllers that receive a periodic waveform input and that apply power to multiple loads. A switch-on time and a switch-off time is for each of the power controllers within a cycle of the periodic waveform input. The power controllers generate output waveforms to be applied to the loads that are partial segments of the cycle of the periodic waveform input. Each of the power controllers includes a switchable power component that can be switched on and switched off at any time and that can conduct current in both forward and reverse directions.
H02M 5/27 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means for conversion of frequency
H02M 5/293 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
H02M 5/297 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal for conversion of frequency
H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
A method for assembling a power supply module, wherein a plurality of spacers are positioned between planes of different electrical potential on at least a high voltage end of a printed circuit board (PCB). The plurality of spacers having an electric field of a creepage distance greater than 0.4kV/mm and configured to mechanically support the PCB during assembly and curing of an encapsulant. The encapsulant being an insulating material configured to provide electrical and thermomechanical insulation to the power supply module.
A method for assembling a power supply module, wherein a plurality of spacers are positioned between planes of different electrical potential on at least a high voltage end of a printed circuit board (PCB). The plurality of spacers having an electric field of a creepage distance greater than 0.4 kV/mm and configured to mechanically support the PCB during assembly and curing of an encapsulant. The encapsulant being an insulating material configured to provide electrical and thermomechanical insulation to the power supply module.
A generator and a method for controlling the generator are disclosed. The method comprises receiving a power sequence comprising a plurality of power states, creating a dynamic reference-time response within each state, and determining a dynamic average-delivered-power value within each state. An error signal is calculated within each state, and a controller output is produced using the error signal. An internal setpoint is produced based upon the error signal, and a power amplifier is controlled using the internal setpoint to control output power.
Systems and methods are described for monitoring fluid flow through a conduit. A method comprises conveying a fluid in a conduit so that the fluid impinges upon an impingement within the conduit and sensing a temperature with a heated temperature sensor that is thermally coupled to the conduit to provide a heated temperature measurement. The method also includes heating the heated temperature sensor with a heater and sensing a temperature of the fluid at a location of the conduit that is thermally isolated from the heater to obtain a reference temperature measurement. An indication of a flowrate of the fluid is provided based on a temperature difference between the reference temperature measurement and the heated temperature measurement.
G01F 1/69 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
Systems and methods are described for monitoring fluid flow through a conduit. A method comprises conveying a fluid in a conduit so that the fluid impinges upon an impingement within the conduit and sensing a temperature with a heated temperature sensor that is thermally coupled to the conduit to provide a heated temperature measurement. The method also includes heating the heated temperature sensor with a heater and sensing a temperature of the fluid at a location of the conduit that is thermally isolated from the heater to obtain a reference temperature measurement. An indication of a flowrate of the fluid is provided based on a temperature difference between the reference temperature measurement and the heated temperature measurement.
G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
G01F 1/688 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
78.
ADDITIONAL STRAY CAPACITOR AS ANOTHER TUNING KNOB FOR 1-SUPPLY EV SOURCE
A bias supply system and methods are disclosed. The bias supply system comprises an output node, a return node, and a bias supply configured to apply an asymmetric periodic voltage waveform between the output node and the return node. A variable capacitance is coupled between the output node and the return node, and a controller is coupled to the variable capacitance. The controller is configured to receive a setting that defines a slope of a workpiece voltage, monitor electrical parameters at the output node to obtain an indication of an actual slope of the workpiece voltage, and control the variable capacitance so the actual slope of the workpiece voltage approaches the slope defined by the setting.
A bias supply system and methods are disclosed. A method comprises coupling and decoupling a first voltage to a first node to produce a peak of the waveform, and applying, after the peak of the waveform, a step in the waveform. Current is provided to the first node to produce a ramp of the waveform after the step in the waveform and a capacitance at the first node is controlled to adjust the ramp of the waveform.
G09G 3/296 - Driving circuits for producing the waveforms applied to the driving electrodes
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
09 - Scientific and electric apparatus and instruments
Goods & Services
Impedance matching products, namely radio frequency match network products in the nature of radio frequency tuning devices in the nature of resonators; impedance alteration electrical circuits for radio frequency power; radio frequency electrical circuits for application in manufacturing and controlling processes in the manufacture of thin films and semiconductors
81.
COMPENSATION OF IMPEDANCE MODULATION IN A PLASMA GENERATOR BY FREQUENCY SWEEP
A plasma processing system is disclosed. A very high frequency (VHF) generator delivers power to a plasma chamber, and a mid-frequency (MF) generator delivers power to the plasma chamber. The VHF generator includes a sensor configured to provide a signal indicative of an impedance of a plasma load that is presented to the VHF generator. The VHF generator further includes a frequency tuner configured to adjust a frequency of the VHF generator within a cycle of the MF generator based on the signal to mitigate impedance modulation caused by the MF generator. Impedance modulation may also be mitigated by a sync line between the VHF and MF generators that allows presetting the VHF generator frequency in synchronization with a cycle of the MF generator.
A plasma processing system is disclosed. A very high frequency (VHP) generator delivers power to a plasma chamber, and a mid-frequency (MF) generator delivers power to the plasma chamber. The VHF generator includes a sensor configured to provide a signal indicative of an impedance of a plasma load that is presented to the VHF generator. The VHF generator further includes a frequency tuner configured to adjust a frequency of the VHF generator within a cycle of the MF generator based on the signal to mitigate impedance modulation caused by the MF generator. Impedance modulation may also be mitigated by a sync line between the VHF and MF generators that allows presetting the VHF generator frequency in synchronization with a cycle of the MF generator.
H03H 7/40 - Automatic matching of load impedance to source impedance
H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
H01J 37/36 - Gas-filled discharge tubes for cleaning surfaces while plating with ions of materials introduced into the discharge, e.g. introduced by evaporation
A generator produces output such as delivered power, voltage, current, forward power etc. that follows a prescribed pattern of output versus time where the pattern repeats with a repetition period by controlling sections of the pattern based on measurements taken one or more repetition periods in the past. A variable impedance match network may control the impedance presented to a radio frequency generator while the generator produces the output that follows the prescribed pattern of output versus time where the pattern repeats with a repetition period by controlling variable impedance elements in the match during sections of the pattern based on measurements taken one or more repetition periods in the past.
Bias supplies and plasma processing systems are disclosed. One bias supply comprises an output node, a return node, and a power section coupled to the output node and the return node. A resonant switch section is coupled to the power section at a first node, a second node, and a third node wherein the resonant switch section is configured to connect and disconnect a current pathway between the first node and the second node to apply an asymmetric periodic voltage waveform at the output node relative to the return node. The asymmetric periodic voltage waveform includes a first portion that begins with a first negative voltage and changes to a positive peak voltage, a second portion that changes from the positive peak voltage level to a third voltage level and a fourth portion that includes a negative voltage ramp from the third voltage level to a fourth voltage level.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Method and apparatuses for clamping a disc cell assembly. An apparatus includes a first plate coupled to the disc cell assembly, a second plate, and one or more disc springs between the plates configured to apply a clamping force to the disc cell assembly when compressed. A method includes adjusting the clamping force via a central fastener coupled to the first and second plates until a desired force has been achieved. Perimeter fasteners coupled to the first plate, second plate, and the disc cell assembly maintain the clamping force after adjustment.
Method and apparatuses for clamping a disc cell assembly. An apparatus includes a first plate coupled to the disc cell assembly, a second plate, and one or more disc springs between the plates configured to apply a clamping force to the disc cell assembly when compressed. A method includes adjusting the clamping force via a central fastener coupled to the first and second plates until a desired force has been achieved. Perimeter fasteners coupled to the first plate, second plate, and the disc cell assembly maintain the clamping force after adjustment.
Input impedance networks and associated methods are disclosed. An input impedance network comprises a source-terminal-pair configured to couple to a power source, a recovered-power-terminal-pair configured to couple to a power sink, a transmission line coupled to the source-terminal-pair that comprises M sections, and N clamping circuits. Each of the N clamping circuits is configured to clamp at least one of voltage or current in one of the M sections, and a power recovery circuit is coupled to the N clamping circuits to enable recovered energy to be applied to the recovered-power-terminal-pair.
H02M 7/537 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
This disclosure describes a non-dissipative snubber circuit configured to boost a voltage applied to a load after the load's impedance rises rapidly. The voltage boost can thereby cause more rapid current ramping after a decrease in power delivery to the load which results from the load impedance rise. In particular, the snubber can comprise a combination of a capacitive element, two inductive elements, and three switches, where a duty cycle of two of the three switches controls the voltage boost. The snubber can be arranged between a DC power supply and a switching circuit configured to generate a pulsed waveform for provision to the load.
Systems, methods, and apparatuses for measuring capacitance of a load. An apparatus includes a ground connector, an output connector configured to couple to the load, and a time-varying signal source configured to inject a time-varying voltage signal onto a conduction path between the ground connector and the output connector. A DC power source or amplifier is configured to apply a DC offset to the time-varying voltage signal, and a current monitor is configured to measure time-varying current in the conduction path. A capacitance module is configured to determine the capacitance based upon at least one of the time-varying current, and accuracy of this measurement is improved by arranging an AC shunt across the DC power source or amplifier.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
H01J 37/244 - DetectorsAssociated components or circuits therefor
Plasma processing systems and methods are disclosed. The system may include at least one modulating supply that modulates plasma properties where the modulation of the plasma properties has a repetition period, T. A synchronization module configured to send a synchronization signal with a synchronization-signal-repetition-period that is an integer multiple of T to at least one piece of equipment connected to the plasma processing system. A waveform-communication module communicates characteristics of a characterized waveform to at least one piece of equipment connected to the plasma system to enable synchronization of pieces of equipment connected to the plasma processing system. The characterized waveform may contain information about the modulation of the plasma or information about a desired waveform of a piece of equipment connected to the plasma processing system.
Bias supplies and bias control methods are disclosed. One method comprises applying an asymmetric periodic voltage waveform and providing a corresponding current waveform at an output node relative to a return node; receiving a signal to change from a current state of the asymmetric periodic voltage waveform to a next state of the asymmetric periodic voltage waveform; and adjusting, during a transition from the current state to the next state, at least one portion of the asymmetric periodic voltage waveform and simultaneously adjusting a fundamental frequency of the asymmetric periodic voltage waveform to settle at the next state.
Bias supplies and bias control methods are disclosed. One method comprises applying an asymmetric periodic voltage waveform and providing a corresponding current waveform at an output node relative to a return node; receiving a signal to change from a current state of the asymmetric periodic voltage waveform to a next state of the asymmetric periodic voltage waveform; and adjusting, during a transition from the current state to the next state, at least one portion of the asymmetric periodic voltage waveform and simultaneously adjusting a fundamental frequency of the asymmetric periodic voltage waveform to settle at the next state.
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 7/48 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
Systems and methods for plasma processing are disclosed. An exemplary system may include a plasma processing chamber including a source to produce a plasma in the processing chamber and at least two bias electrodes arranged within the plasma processing chamber to control plasma sheaths proximate to the bias electrodes. A chuck is disposed to support a substrate, and a source generator is coupled to the plasma electrode. At least one bias supply is coupled to the at least two bias electrodes, and a controller is included to control the at least one bias supply to control the plasma sheath(s) proximate to the bias electrodes.
An apparatus and method to produce a waveform. The apparatus includes a first node to couple to a substrate support and a power supply coupled to a second node wherein the power supply is configured to provide a DC voltage to set an ion-energy at a surface of the substrate. The apparatus also includes a first switch that couples the second node to the first node, and responsive to the first switch being closed, a first voltage is applied at the first node. A second switch of the power supply couples a third node to the first node, and responsive to the second switch being closed, a second voltage is applied at the first node to effectuate a negative voltage at the surface of the substrate.
Bias supplies, plasma processing systems, and associated methods are disclosed. One bias supply comprises a first inductor coupled between a first node of a switch and an output node where a first node of a second inductor is coupled to one of the output node or the first node of the switch. A voltage source is coupled between a second node of the switch and a second node of the second inductor. A connection is made between the return node and one of the second node of the switch and the second node of the second inductor. The bias supply also comprises a controller configured to cause an application of the periodic voltage between the output node and the return node by repeatedly closing the switch so current through the switch completes a full cycle.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An adaptive engine and adaptive control method. The method comprises receiving an input regressor and applying one or more estimation laws to the input regressor to estimate a plurality of estimated model parameter tensors for a nonlinear model. The method also includes computing an estimation error or a cost function using a system output measurement and an estimated system output for the previous iteration and determining a model order based at least in part on the estimation error or the cost function and receiving two or more possible control signals each using a corresponding control portion of the nonlinear model. In addition, the method includes generating two or more estimated system outputs each using a corresponding estimation portion of the nonlinear model and selecting a preferred control signal from a set comprising at least the two or more possible control signals or a preferred combination of possible control signals.
G05B 13/04 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
An adaptive engine and a method of adaptive control are disclosed. The method comprises receiving an input regressor, where the input regressor comprises a reference signal, a system output measurement, and a control output. The method includes applying one or more estimation laws to the input regressor to estimate two or more sets of estimated model parameter tensors, Θ; receiving two or more possible control signals; generating two or more estimated system outputs; and selecting a control signal from a set comprising at least the first possible control signal and the second possible control signal, or a combination of possible control signals blended from two or more of the sets.
G05B 13/04 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
Colorado State University Research Foundation (USA)
Inventor
Samuels, Chad S.
Young, Peter
Abstract
This disclosure describes systems, methods, and apparatus for a distributed controller. The distributed controller can include a traditional closed or open loop feedback controller followed by an empirically derived mapping that converts the controller output to a modified output, where the controller optimizes stability and the empirically derived mapping optimizes performance. The empirically derived mapping can be formed of coefficients representing linear controllers at inflection points, where the linear controllers are inversely related to a system model. The system model can comprise a static linear model, a dynamic linear model, and a total uncertainty. The static linear model can be derived from large signal steady state analysis, the dynamic nonlinear model can be derived from small signal transient analysis, and the uncertainty can be derived from small signal steady state analysis.
G05B 19/4155 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
100.
Plasma processing control system with adaptive fuzzy controller
Fuzzy control systems and methods are disclosed. A method includes receiving a reference signal defining target values for a parameter that is controlled at an output of the plasma processing system and obtaining a measure of the parameter that is controlled at the output. A fuzzy controller provides a control signal to adjust at least one actuator based at least upon the reference signal and the measure of the controlled parameter. In addition, output membership functions of the fuzzy controller, input membership functions of the fuzzy controller, and a rule base of the fuzzy controller are adapted while controlling an output of a system based at least upon the based at least upon an estimated model parameter tensor, the reference signal and the measure of the controlled parameter, and the control signal.
G05B 13/02 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
