Abstract

A system and method of transporting substrates includes a loadport system including a frame, an articulating arm, a mini environment and a tower substantially centered in the frame. The tower includes multiple motors, a first motor mechanically coupled to the mini environment for moving the mini environment vertically. A second motors mechanically coupled to the articulating arm for moving the articulating arm vertically. A tower enclosure is also included. The tower enclosure enclosing the motors separate from the mini environment.

IPC Classes  ?

• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment

Abstract

A spiral cam has a tubular shaped portion defined by an interior cavity and an exterior surface that includes a cam contour. A linear slide assembly having a length defined along a rotational axis is defined to slide lengthwise into the interior cavity of the spiral cam. The linear slide assembly allows for movement of the spiral cam along the rotational axis and prevents rotation of the spiral cam relative to the linear slide assembly. A cam roller is fixed at a position proximate to the exterior surface of the spiral cam. The cam roller is disposed separate from the linear slide assembly and within the cam contour of the spiral cam. The cam roller engages the cam contour to move of the spiral cam along the rotational axis when the linear slide assembly and spiral cam are rotated in unison about the rotational axis relative to the cam roller.

IPC Classes  ?

• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• F16H 53/00 - Cams or cam-followers, e.g. rollers for gearing mechanisms
• B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
• B25J 18/02 - Arms extensible
• B25J 9/06 - Programme-controlled manipulators characterised by multi-articulated arms

Abstract

A loadport has a port door and a frame with an opening through which the port door interfaces with a container door of a container for holding semiconductor workpieces. In one embodiment, a movable closure mechanism is connected to the port door and is defined to be movable in a controlled manner relative to both the port door and the frame. In this embodiment, a stationary closure mechanism is disposed on the frame proximate to the opening. In another embodiment, a stationary closure mechanism is connected to the port door, and a movable closure mechanism is disposed on the frame proximate to the opening. In both embodiments, the movable closure mechanism is defined to engage with the stationary closure mechanism such that movement of the movable closure mechanism to engage with the stationary closure mechanism applies a closing force between the port door and the container door.

IPC Classes  ?

• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A storage system and methods for operating a storage system are disclosed. The storage system includes a storage system assembly positioned at a height that is greater than a height of a tool used for loading and unloading substrates to be processed. The storage system locally stores one or more containers of substrates. The storage system assembly includes a plurality of storage shelves, and each of the plurality of storage shelves have shelf plates with shelf features for supporting a container. Each of the plurality of storage shelves are coupled to a chain to enable horizontal movement and each is further coupled to a rail to enable guiding to one or more positions. A motor is coupled to a drive sprocket for moving the chain, such that each of the plurality of storage shelves move together along the rail to the one or more positions. The rail has at least some sections that are linear and some sections that are nonlinear and the sections are arranged in a loop.

IPC Classes  ?

• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
• B65G 1/04 - Storage devices mechanical
• B66C 17/06 - Overhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports specially adapted for particular purposes, e.g. in foundries, forgesOverhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports combined with auxiliary apparatus serving particular purposes

Abstract

A storage system is disclosed to include a storage system assembly positioned at a height that is greater than a height of a tool used for loading and unloading substrates to be processed. The storage system locally stores one or more containers of substrates. The storage system assembly includes a plurality of storage shelves, and each of the plurality of storage shelves have shelf plates with shelf features for supporting a container. Each of the plurality of storage shelves is coupled to a chain to enable horizontal movement and each is further coupled to a rail to enable guiding to one or more positions. A motor is coupled to a drive sprocket for moving the chain, such that each of the plurality of storage shelves move together along the rail to the one or more positions.

IPC Classes  ?

• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
• B65G 1/04 - Storage devices mechanical
• B66C 17/06 - Overhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports specially adapted for particular purposes, e.g. in foundries, forgesOverhead travelling cranes comprising one or more substantially-horizontal girders the ends of which are directly supported by wheels or rollers running on tracks carried by spaced supports combined with auxiliary apparatus serving particular purposes

Abstract

A modular cluster tool is disclosed. According to one embodiment, a system, comprises a wafer transfer station that includes a first vacuum chamber that stores a plurality of semiconductor wafers. The system also includes an equipment front end module interface, and two or more shuttle lock interfaces.

IPC Classes  ?

• C23F 1/00 - Etching metallic material by chemical means
• C23C 16/00 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
• C23F 1/02 - Local etching