An image display device includes: a housing including an inner surface defining an opening, and an outer surface located on a side opposite to the inner surface; a display unit including a display surface and disposed in the opening and; and a structure including a light-emitting surface, the structure at least partially protruding from the outer surface when viewed facing the display surface. The structure includes: a light-transmissive member including an emission surface and an incident surface, the emission surface at least partially constituting the light-emitting surface, and a light source unit that is configured to emit light to the incident surface of the light-transmissive member and through the light-transmissive member in a direction in which the display surface faces.
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japan)
OSAKA UNIVERSITY (Japan)
NICHIA CORPORATION (Japan)
Inventor
Torimoto, Tsukasa
Kameyama, Tatsuya
Kishi, Marino
Miyamae, Chie
Kuwabata, Susumu
Uematsu, Taro
Oyamatsu, Daisuke
Niki, Kenta
Abstract
Semiconductor nanoparticles including Ag, In, Ga, and S are provided. In the semiconductor nanoparticles, a ratio of a number of Ga atoms to a total number of In and Ga atoms is 0.95 or less. The semiconductor nanoparticles emit light having an emission peak with a wavelength in a range of from 500 nm to less than 590 nm, and a half bandwidth of 70 nm or less, and have an average particle diameter of 10 nm or less.
H10H 20/812 - Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
3.
LIGHT-EMITTING DEVICE, SPECTROSCOPE, AND METHOD FOR PRODUCING LIGHT-EMITTING MEMBER
A light-emitting device, a spectroscope, and a method for producing a light-emitting member are provided. A light-emitting device including: a light-emitting element configured to emit first light; a light-emitting member disposed on a light emission side of the light-emitting element and including a resin and a light-emitting material, the light-emitting material being configured to absorb the first light and configured to emit second light having an emission peak wavelength from 800 nm to 1100 nm; and an optical thin film disposed on a light emission side of the light-emitting member and configured to reflect the first light and transmit the second light. In an emission spectrum of the light-emitting device, a first integrated value ratio Ib/Ia that is an integrated value Ib of emission intensity at a wavelength in a range from 550 nm to 600 nm with respect to an integrated value Ia of emission intensity at a wavelength in a range from 200 nm to less than 550 nm is in a range from 0 to 0.05, and a second integrated value ratio Ic/Ia that is an integrated value Ic of emission intensity at a wavelength in a range from 800 nm to 1100 nm with respect to the integrated value Ia is in a range from 0.75 to 30.
A method for manufacturing a light-emitting device includes providing a structure body. The structure body includes a wiring substrate, a light-emitting element, and a protection element. The wiring substrate includes a wiring part at an upper surface of the wiring substrate. The light-emitting element includes a pair of first electrodes, a first semiconductor layer, and a first element substrate. The protection element includes a pair of second electrodes, a second semiconductor layer, and a second element substrate. The pair of first electrodes and the pair of second electrodes face the upper surface of the wiring substrate. The pair of first electrodes and the pair of second electrodes are connected to the wiring part. The method includes removing at least a portion of the first element substrate of the light-emitting element and at least a portion of the second element substrate of the protection element from the structure body.
A light emitting element includes a semiconductor stack structure, a first electrode, a second electrode, and an insulation layer. The semiconductor stack structure includes a first p-type semiconductor layer, a first active layer, a first n-type semiconductor layer, an intermediate layer, a second p-type semiconductor layer, a second active layer, and a second n-type semiconductor layer. The semiconductor stack structure includes a first opening and a second opening. The first opening is provided continuously in the first p-type semiconductor layer and the first active layer. The second opening in a plan view is located to overlap the first opening. The second opening is provided continuously in the first n-type semiconductor layer, the intermediate layer, the second p-type semiconductor layer, and the second active layer.
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
An oxide phosphor includes phosphor particles containing a host crystal containing Ga and oxygen and an activating element, and a first compound particle disposed on at a surface(s) of the phosphor particles, the at least one first compound particle containing an oxide particle containing a first element selected from the group consisting of Group 4 elements, Group 5 elements, Group 14 elements, and Group 15 elements.
A light source device includes first to fourth laser light sources that emit first to fourth laser light, a condenser lens, first to fourth reflecting surfaces that reflect the first to fourth laser lights toward the condenser lens, and first to fourth afocal systems disposed such that the first to fourth laser lights exit the first to fourth afocal systems toward the first to fourth reflecting surfaces. When a plan view taken in a direction along the optical axis is divided into first to fourth quadrants with a position of the optical axis serving as an origin, the first to fourth reflecting surfaces are located in the first to fourth quadrants, respectively.
A semiconductor laser element includes an n-side cladding layer, a p-side cladding layer, and an active layer provided between the n-side cladding layer and the p-side cladding layer. The n-side cladding layer includes a semiconductor portion formed of a nitride semiconductor, and low-refractive index portions formed of a medium other than a nitride semiconductor and having a lower refractive index than a refractive index of the semiconductor portion.
H01S 5/20 - Structure or shape of the semiconductor body to guide the optical wave
H01S 5/22 - Structure or shape of the semiconductor body to guide the optical wave having a ridge or a stripe structure
H01S 5/32 - Structure or shape of the active regionMaterials used for the active region comprising PN junctions, e.g. hetero- or double- hetero-structures
9.
LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
A light-emitting device includes: a substrate including a base material and a Cu wiring line disposed on an upper surface side of the base material; an insulating layer disposed on the substrate and having an opening on at least a part of an upper surface of the Cu wiring line; a Ti layer covering at least the upper surface of the Cu wiring line; a TiN layer disposed on the Ti layer; a TiW layer disposed on the TiN layer; a metal layer disposed on the TiW layer and containing at least one of Au, Pt, Ru, Pd, or Rh; a conductive member disposed on the metal layer and containing Au; and a light-emitting element including an electrode disposed on the conductive member.
A vehicle lamp includes: a light source including a plurality of light-emitting parts arranged in a first direction; a first lens separated from the light source and configured to transmit light emitted from the light source; and a reflector disposed between the first lens and the light source, located below the plurality of light-emitting parts in a second direction orthogonal to the first direction, and having a reflective surface that reflects the light emitted from the light source. The first lens includes a first portion having a positive refractive power in each of the first direction and the second direction, and a second portion having a refractive power in the second direction that is smaller than a refractive power in the first direction. The refractive power of the first portion in the second direction is greater than the refractive power of the second portion in the second direction.
A light-emitting device includes: a base having an upper surface; one or more semiconductor laser elements disposed on the upper surface and configured to emit light in a first direction in a top view; one or more reflecting members spaced from the one or more semiconductor laser elements in the first direction in a top view; and a lens member having one or more lens sections through which light reflected by the one or more reflecting members passes, the lens member being fixed to the base and positioned above the one or more semiconductor laser elements and the one or more reflecting members. In a top view, at least a portion of a first of the one or more reflecting members and an emitting surface of a first of the one or more semiconductor laser elements is disposed in a region inward of an outer edge of a first of the one or more lens sections.
A light-emitting device includes first and second semiconductor laser elements, first and second support members, first and second protective elements, and first to fourth wirings. One of ends of the third wiring is bonded to the first protective element. One of ends of the fourth wiring is bonded to the second protective element. In the top view, a distance between the first semiconductor laser element and the first protective element is shorter than a length of the third wiring when the other of the ends of the third wiring is bonded to the second support member, or a distance between the second semiconductor laser element and the second protective element is shorter than a length of the fourth wiring when the other of the ends of the fourth wiring is bonded to the first support member.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
13.
FLUORIDE PHOSPHOR, METHOD FOR MANUFACTURING FLUORIDE PHOSPHOR, AND LIGHT-EMITTING DEVICE
Provided is a fluoride phosphor including a fluoride particle and a fluorine compound containing zirconium and disposed on at least a portion of the surface of the fluoride particle. The fluoride particle has a composition including an element M including at least one selected from the group consisting of Group 4 elements, Group 13 elements, and Group 14 elements; at least one selected from the group consisting of an alkali metal and an ammonium ion; manganese; and fluorine atoms. In the composition, when the total number of moles of the alkali metal and the ammonium ion is 2, the number of moles of the manganese is greater than 0 and less than 0.2, the total number of moles of the element M is greater than 0.8 and less than 1, and the number of moles of the fluorine atoms is greater than 5 and less than 7.
A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions having first upper surfaces, each of the first upper surfaces having the same height from the mount surface, the pair of first protrusions being located opposite to each other in a first direction, and one or more conduction regions or metal regions disposed on each of the first upper surfaces of the pair of first protrusions; and one or more semiconductor laser elements mounted on the mount surface of the base, the one or more semiconductor laser elements being configured to emit light forward to one of the first protrusions.
A base includes: a bottom part having a bottom face, wherein the bottom face has a first region configured to support one or more semiconductor laser elements thereon and a second region configured to support a light reflective member and/or an optical member thereon; a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first stepped portion faces the second stepped portion, and wherein the first upper face and the second upper face are disposed below the uppermost face; and one or more first metal films located on the first upper face of the first stepped portion.
A display device according to an embodiment comprises: a support member having a light transmission property; a light adjustment member disposed on the support member and having a plurality of openings; a plurality of first light-emitting elements respectively disposed in the plurality of openings on the support member; a plurality of first conductive parts electrically connected to a plurality of first electrodes of the plurality of first light-emitting elements; a plurality of second conductive parts electrically connected to a plurality of second electrodes of the plurality of first light-emitting elements; a covering member covering the light adjustment member, the plurality of first light-emitting elements, the plurality of first conductive parts, and the plurality of second conductive parts; a third conductive part extending in a first direction on the covering member and electrically connected to the plurality of first conductive parts; and a plurality of fourth conductive parts extending in the first direction on the covering member and electrically connected to the plurality of second conductive parts.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
B60J 1/02 - WindowsWindscreensAccessories therefor arranged at the vehicle front
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
H10H 20/00 - Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
This display device comprises: a first support member; a second support member; a plurality of first light-emitting elements disposed on the first support member; and a plurality of second light-emitting elements disposed on the second support member. The outer shape of the first support member is the same as the outer shape of the second support member. In a first region on the first support member, n (n is an integer of 2 or more) first light-emitting elements that are adjacent to each other are disposed. In a second region on the second support member, one or more but not more than (n-1) of the second light-emitting elements are disposed. The second region is congruent with the first region. The position of the second region in the second support member is relatively the same as the position of the first region in the first support member.
G09F 9/40 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
G09F 9/302 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
18.
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
This display device comprises: a plurality of pixel elements that are configured from a plurality of light emitting elements; and a control unit that controls the passage of a current through each of the plurality of light emitting elements. Each of the plurality of pixel elements includes a green light emitting element and a red light emitting element. The green light emitting element outputs green light having a peak wavelength in the range of 500-560 nm. The red light emitting element outputs red light having a peak wavelength in the range of 600-780 nm. When passing a first green main current through the green light emitting element included in a first pixel element that is one of the plurality of pixel elements, the control unit passes a first green auxiliary current smaller than the first green main current through the red light emitting element included in the first pixel element in order to output green light having desired chromaticity from the first pixel element.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G09F 9/00 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
G09F 9/40 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
H04N 5/66 - Transforming electric information into light information
H10H 20/00 - Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
A light emitting device includes: a wiring substrate including: a substrate, and a first wiring and a second wiring disposed on the substrate; a light emitting element located above the wiring substrate and including a first electrode and a second electrode; a first conductive member connecting the first wiring and the first electrode; and a second conductive member connecting the second wiring and the second electrode. An outer lateral surface of the first conductive member protrudes outward from a straight line that connects an outer end of the first wiring and an outer end of the first electrode in a cross-sectional view.
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
A light emitting device includes semiconductor laser elements, a frame part, one or more light-reflective members, wires, and one or more protective elements. One or more light-reflective members are configured to reflect laser light traveling from the semiconductor laser elements toward a first inner lateral surface of the frame part. The wires are not bonded to an upper surface of the frame part on a light traveling side beyond a virtual line coinciding with a side defining an upper edge of a light-reflective surface of the light-reflective member. A first protective element is arranged in the first region. A first wire is bonded to an upper surface of the frame part in a first region at a position on the light traveling side of the first protective element, and a second wire is bonded in the first region at a position on an element-side of the first protective element.
A light emitting module includes: a wiring board; a plurality of light emitting elements mounted on the wiring board, each of first and second adjacent ones of the light emitting elements having an upper face, a lower face located opposite to the upper face and facing an upper face of the wiring board, and an oblique lateral face between the upper face and the lower face spreading outwards from the lower face to the upper face; a first resin disposed between the upper face of the wiring board and the lower faces of the first and second light emitting elements, and between lateral faces of the first and second light emitting elements, the first resin containing a light reflecting substance; and a second resin containing a phosphor and covering the upper face of at least one of the light emitting elements and an upper face of the first resin.
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
A light emitting device according to the present invention includes: a first support member having translucency; a plurality of first light emitting elements arranged on the first support member along a first direction; a plurality of first conductive parts; a plurality of second conductive parts; and a first control part. The first conductive parts extend in a second direction orthogonal to the first direction on the first support member, and are connected to first electrodes of the first light emitting elements. The second conductive parts extend in the second direction on the first support member and are connected to second electrodes of the first light emitting elements. The second conductive parts are arranged between a first outer edge on the outside in the first direction of one first end light emitting element positioned at one end in the first direction and a second outer edge on the outside in the first direction of the other first end light emitting element positioned at the other end in the first direction.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
G09F 9/40 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
This display device comprises one first light-emitting unit and a plurality of second light-emitting units. The first light-emitting unit includes a first control unit and a plurality of first light-emitting elements. Each of the plurality of second light-emitting units includes a second control unit and a plurality of second light-emitting elements. The first control unit executes: receiving image data; converting the received image data into lighting data for controlling lighting of the first light-emitting elements and the second light-emitting elements; transmitting the lighting data to the plurality of second control units; and causing the first light-emitting elements to emit light on the basis of the lighting data. Each of the plurality of second control units executes receiving the lighting data, and causing the second light-emitting elements to emit light on the basis of the lighting data.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
A light-emitting device includes a substrate; light-emitting elements on an upper surface of the substrate, the light-emitting elements configured to be individually driven; a first wavelength conversion portion covering at least a portion of at least one of the light-emitting elements; a second wavelength conversion portion covering a part of the first wavelength conversion portion; and a diffusion portion covering the first and second wavelength conversion portions. In a cross-sectional view, the light-emitting device includes a first region in which the diffusion portion is arranged above the first wavelength conversion portion without the second wavelength conversion portion between them, and a second region in which the second wavelength conversion portion and the diffusion portion are sequentially arranged on the first wavelength conversion portion. A color temperature of light extracted from the second region is lower than a color temperature of light extracted from the first region.
A light emitting element includes: a first light emitting part including: a first nitride semiconductor layer containing a first conductivity type impurity, a second nitride semiconductor layer containing a second conductivity type impurity, and a first active layer positioned between the first nitride semiconductor layer and the second nitride semiconductor layer; a second light emitting part positioned above the second nitride semiconductor layer, the second light emitting part including: a third nitride semiconductor layer, a fourth nitride semiconductor layer containing a second conductivity type impurity, and a second active layer positioned between the third nitride semiconductor layer and the fourth nitride semiconductor layer. The third nitride semiconductor layer includes: a first layer that contains at least one selected from the group consisting of Be, Mg, Ca, Fe, Zn, and C, a second layer, and a third layer.
An image display device includes: a light-transmitting substrate including a first surface; a circuit element located on the first surface; a first wiring layer electrically connectable to the circuit element; a first insulating film covering the circuit element and the first wiring layer on the first surface; a light-emitting element located on the first insulating film; a second insulating film covering at least a portion of the light-emitting element; a second wiring layer located on the second insulating film, the second wiring layer being electrically connected to a surface of the light-emitting element including a light-emitting surface opposite to a surface of the light-emitting element at a first insulating film side; and a first via extending through the first and second insulating films, the first via electrically connecting the first wiring layer and the second wiring layer.
A light-emitting device includes a light-emitting element, a light-transmissive member, a silicone resin member, and an intermediate layer. The light-transmissive member is disposed on an upper surface of the light-emitting element and contains oxygen atoms. The silicone resin member covers the light-transmissive member such that at least a portion of an upper surface of the light-transmissive member is exposed. The intermediate layer is disposed between the light-transmissive member and the silicone resin member. The intermediate layer is made of a silane coupling agent.
A mounting substrate includes a ceramic substrate having two or more through holes, metal members disposed in respective through holes, and a bonding material disposed between the ceramic substrate and each of the metal members in the through holes. A portion of an upper surface, a portion of a lower surface, and a portion of lateral surfaces of each of the metal members are exposed through the ceramic substrate. The portion of the lateral surfaces and the portion of the lower surface of each of the metal members, exposed through the ceramic substrate, are continuous with each other. The portion of the lateral surfaces of each of the metal members, exposed through the ceramic substrate, is coplanar with a lateral surface of the ceramic substrate. The ceramic substrate is disposed so as to surround an outer periphery of each of the metal members in a top view.
A light-emitting device includes: a display comprising a plurality of pixels in which a plurality of light-emitting elements are arranged in a predetermined pattern, a light emission color of each of the plurality of light-emitting elements being variable in accordance with a drive current; and a lighting controller configured to supply a drive current to each of the plurality of light-emitting elements and control a light emission period of each of the plurality of light-emitting elements. The lighting controller is configured to: divide one frame, in which the lighting controller drives the plurality of light-emitting elements to emit light, into a first subframe and a second subframe, drive the plurality of light-emitting elements to emit light of a first light emission color in the first subframe, and drive the plurality of light-emitting elements to emit light of a second light emission color in the second subframe, the second light emission color being different from the first light emission color.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
A light emitting device includes: a semiconductor laser element that has an upper face and a light emitting face, the semiconductor laser element including a first waveguide and a second waveguide, wherein the first and second waveguides extend along a direction perpendicular to the light-emitting face in a top view; and a plurality of wires, each having a first end connected to the upper face of the semiconductor laser element at a connection position, wherein a quantity of the wires that is connected to the upper face of the semiconductor laser element is in a range of two to five, inclusive. In the top view, a quantity of the wires whose connection positions are located in a region overlapping the first waveguide is zero, and a quantity of the wires whose connection positions are located in a region overlapping the second waveguide is zero.
Provided is a laser adjustment method including: a first preparation process of acquiring an image including an image of a first damage formed in a first film due to irradiation of a first film wafer including a first wafer and the first film provided in the first wafer with first laser light as a first damage image; a second preparation process of preparing a second film wafer including a second wafer and a second film provided in the second wafer; a processing process of irradiating the second film wafer with second laser light after the first preparation process and the second preparation process to form a second damage in the second film; an imaging process of imaging the second film to acquire an image including an image of the second damage as a second damage image after the processing process; and an adjustment process of adjusting an aberration.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A light emitting device includes: a plurality of laser elements, each including a light emitting surface; one or more reflectors; a base including: a bottom portion on which the plurality of laser elements and the one or more reflectors are disposed, and a frame portion surrounding the plurality of laser elements in a top view; a cover attached to a top surface of the frame portion; and a lens array that is bonded to the top surface of the cover and includes: a plate-shaped portion, and a plurality of lens-shaped portions protruding upward from the plate-shaped portion, with the plurality of lens-shaped portions integrated into a one-piece body.
A light-emitting device includes: a base; a light-emitting element disposed on the base; a light-transmissive member disposed on the light-emitting element, containing a wavelength conversion member, and having an inclined lateral surface; and a light adjustment member disposed on and in direct contact with an upper surface of the light-transmissive member.
This light-emitting device is provided with: a light-emitting element; a wavelength conversion member disposed on top of the light-emitting element; and a light-transmissive member that is disposed on top of the wavelength conversion member, and has a first surface facing the wavelength conversion member and a second surface on the opposite side to the first surface. The light-transmissive member includes a first light-transmissive member having a first refractive index and having the first surface, and a second light-transmissive member having a second refractive index that is smaller than the first refractive index and having the second surface. The first light-transmissive member has a first structure part including a plurality of first protrusion parts or a plurality of first recess parts on the opposite side to the first surface, and the second light-transmissive member has a second structure part including a plurality of second protrusion parts or a plurality of second recess parts on the opposite side to the second surface. The interface between the first structure part and the second structure part includes a plurality of prism surfaces, and the arithmetic average roughness Ra of the second surface is smaller than the height of the second structure part.
A light-emitting module includes: a light source including a plurality of light-emitting elements; a controller configured to individually turn on the plurality of light-emitting elements; a lens configured to transmit light from the plurality of light-emitting elements; and a driver configured to cause a relative rotation between the lens and the light source such that an optical axis of the lens or a central axis of the light source moves on a first trajectory in a top view. Light from each of the plurality of light-emitting elements after being transmitted through the lens is emitted such that a main light beam of the light moves on a second trajectory corresponding to the first trajectory.
A light emitting module includes a plurality of light emitting parts; an optical member including at least one first region where light having a first chromaticity is extracted and at least one second region where light having a second chromaticity different from the first chromaticity is extracted, and configured to transmit or pass light emitted from the plurality of light emitting parts; a change mechanism configured to change a distance between the optical member and the plurality of light emitting parts in a direction along a center axis of the first lens; and a first lens on which light transmitted or passing through the optical member is incident. The first region or the second region is provided so as to correspond to one of the plurality of light emitting parts.
A method for manufacturing a magnet unit is provided. The magnet unit includes a holding member having multiple slots and bonded magnets inside the slots, respectively. The manufacturing method includes a process of injecting a magnet material into the slots from a first end of the holding member via multiple gates, respectively, and a process of cutting the magnet material at the gates. The gates have different outlet areas. In the process of injecting, a flow of the magnet material flowing into the plurality of slots is regulated with the plurality of gates having the different outlet areas. Further, in the process of injecting, an internal pressure of the magnet material inside each of the plurality of slots does not exceed a threshold at which the holding member plastically deforms.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
An imaging device includes imaging element; a light-emitting device spaced apart from the imaging element in a top view and including a plurality of light-emitting parts; a lens disposed above the light-emitting device; and a controller configured to control light emission of the plurality of light-emitting parts so as to control irradiation light from the light-emitting device onto an irradiation surface that is perpendicular to a central axis of the imaging element and includes a central point of an imaging region. The controller is configured to select, as a reference light-emitting part serving as a reference for controlling the irradiation light, a light-emitting part configured to irradiate the central point of the imaging region with light. The light-emitting device is configured to irradiate the irradiation surface with the irradiation light with the reference light-emitting part as a reference.
A light-emitting device includes a support; a first electrically-conductive part, a second electrically-conductive part, and a third electrically-conductive part disposed apart from one another on the support; a first light-emitting element disposed on the first electrically-conductive part; and an integrated circuit electrically connected to the first light-emitting element. At least a portion of the first electrically-conductive part is located between the second electrically-conductive part and the third electrically-conductive part in a first direction. The integrated circuit and the first light-emitting element are arranged side by side in a second direction orthogonal to the first direction. A maximum length of the integrated circuit in the second direction is smaller than a maximum length of the integrated circuit in the first direction.
A light emitting device includes a wavelength converting member, a light emitting part, and a light adjusting member. The wavelength converting member includes an upper surface, a lower surface, a first lateral surface located between the upper surface and the lower surface, and a second lateral surface located between the upper surface and the lower surface, and located opposite to the first lateral surface. The light emitting part includes a light emitting layer, and is disposed below the lower surface of the wavelength converting member and in a region closer to the first lateral surface than to the second lateral surface. The light adjusting member is disposed on the upper surface of the wavelength converting member and in a region closer to the second lateral surface than to the first lateral surface without overlapping with the light emitting layer of the light emitting part in a top view.
A light-emitting device includes first and second semiconductor laser elements, first and second protective elements, and first and second submounts. The second semiconductor laser element has a length greater than the first semiconductor laser element. In a top view, the first protective element is not placed between first and second virtual straight lines respectively passing through and parallel to the light-emitting surface and the first lateral surface of the first semiconductor laser element, and a part or all of the second protective element is placed between third and fourth virtual straight lines respectively passing through and parallel to the light-emitting surface and the first lateral surface of the second semiconductor laser element. In the top view, a midpoint of the light-emitting surface of each of the first and second semiconductor laser elements does not coincide with a midpoint of the first and second submounts, respectively.
A method for manufacturing a light-emitting device includes: preparing an intermediate body including: a substrate, and a plurality of light-emitting elements disposed on the substrate, each including a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a lateral surface connecting the first surface and the second surface; applying a powder composition including a reflective member and a silicone resin powder from above the first surfaces of the plurality of light-emitting elements through a sieve to locate the powder composition on the substrate and between the lateral surfaces of the plurality of light-emitting elements; and forming a first covering member by applying vibration to the powder composition and subsequently applying pressure in a thickness direction of the substrate to perform compression molding.
A light-emitting device includes first and second portions. The first portion includes a light-emitting element, a wavelength conversion member, and a first reflective member covering lateral surfaces of the light-emitting element and the wavelength conversion member. The second portion includes a light-transmissive member disposed above the wavelength conversion member via an air layer, and a second reflective member disposed around the light-transmissive member. An upper surface of the first reflective member has a first upper surface disposed around the wavelength conversion member and a second upper surface disposed outwardly of the first upper surface. A lower surface of the second reflective member has a first lower surface disposed around the light-transmissive member and a second lower surface disposed outwardly of the first lower surface. The air layer extends between the first upper surface of the first reflective member and the first lower surface of the second reflective member.
A method for manufacturing a light-emitting device includes: preparing a submount including a position specifying portion that specifies a position of a front surface; determining a first distance between a light-emitting end surface and a first alignment mark of a semiconductor laser element; disposing the semiconductor laser element so that the light-emitting end surface protrudes from the front surface of the submount in a top view; disposing a bridge-shaped member at a position overlapping with the light-emitting end surface and not overlapping with the first alignment mark and the position specifying portion; measuring a second distance between a position of the first alignment mark and a position of the front surface specified by the position specifying portion; calculating a third distance by subtracting the second distance from the first distance; and determining whether the light-emitting device is a defective product by comparing the third distance and a predetermined value.
A semiconductor laser element includes: a semiconductor layered portion including an active layer and having a waveguide structure, wherein the semiconductor layered portion includes: a first region including a diffraction grating, and a second region including a core region, and cladding regions located on both sides of the core region, the second region allowing laser light to propagate in a plurality of transverse modes. A width of the first region is greater than a width of the core region in a direction in which the core region and the cladding region are arranged. A current shielding structure is located at a position overlapping the first region in a top view, and includes one or more opening regions for injecting a current into the semiconductor layered portion in the first region. A total area of the one or more opening regions is smaller than an area of the first region in a top view.
An optical circuit includes a substrate; a first optical waveguide disposed on the substrate; and a second optical waveguide disposed on the substrate and configured to be optically coupled to the first optical waveguide. The first optical waveguide includes a first cladding, a second cladding, and a first core disposed between the first cladding and the second cladding. The second optical waveguide includes a third cladding, a fourth cladding, and a second core disposed between the third cladding and the fourth cladding. The first cladding is disposed closer to the substrate than the second cladding is. The third cladding is disposed closer to the substrate than the fourth cladding is. A material of the first cladding differs from a material of the third cladding.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
47.
POSITIVE ELECTRODE ACTIVE MATERIAL AND METHOD OF PRODUCING POSITIVE ELECTRODE ACTIVE MATERIAL
A method of producing a positive electrode active material, the method includes: contacting first particles that contain a lithium transition metal composite oxide with a solution containing sodium ions to obtain second particles containing the lithium transition metal composite oxide and sodium element, wherein the lithium transition metal composite oxide has a layered structure and a composition ratio of a number of moles of nickel to a total number of moles of metals other than lithium in a range of from 0.7 to less than 1; mixing the second particles and a boron compound to obtain a mixture; and heat-treating the mixture at a temperature in a range of from 100° C. to 450° C.
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
C01G 53/40 - Complex oxides containing nickel and at least one other metal element
C01G 53/42 - Complex oxides containing nickel and at least one other metal element containing alkali metals, e.g. LiNiO2
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
H01M 4/1391 - Processes of manufacture of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
48.
SELF-INJECTION LOCKED LASER DEVICE AND MOLECULAR INFORMATION OUTPUT DEVICE
Provided is a self-injection locked laser device in which environmental changes are less likely to occur and variations in the optical path length and the resonator length are reduced. The self-injection locked laser device comprises: a first base plate; a second base plate; a temperature adjusting element disposed between the first base plate and the second base plate; a semiconductor laser light source disposed on the first base plate; a reference resonator that is disposed on the first base plate, that is positioned along the optical path of laser light emitted from the semiconductor laser light source, that is provided with at least a first mirror and a second mirror, and that provides the semiconductor laser light source with optical feedback; a first cover that covers the semiconductor laser light source and the reference resonator and that contacts the first base plate; and a second cover that covers the first cover and that contacts the second base plate.
A method for manufacturing a light-emitting device includes preparing and separating. In the preparing, a stacked body is prepared. The stacked body includes a substrate, a semiconductor layer, and a coating member. The substrate includes first and second surfaces. The second surface includes first and second regions. The separating includes first and second processes. In the first process, the substrate is separated from the semiconductor layer by irradiating the first region with a laser light of a first irradiation intensity. In the second process, the substrate is separated from the coating member by irradiating at least the second region with the laser light of a second irradiation intensity. The second irradiation intensity is lower than the first irradiation intensity. The second process is performed after the first process.
A fluid treatment device includes a flow path member having a flow path through which a fluid (e.g., water W) to be treated flows, first and second cover members forming spaces separated from the flow path and including light-transmissive parts disposed between the spaces, respectively, and the flow path, first and second light sources disposed in the spaces formed by the first and second cover members, respectively, to emit light toward the flow path, and a first light detector disposed in the space formed by the first cover member. A first light detector receives a first light flux that is emitted from the first light source and reaches the first light detector without passing through the flow path and a second light flux that is emitted from the first light source and reaches the first light detector after passing through the flow path.
A light-emitting device includes: a display comprising a plurality of pixels in which a plurality of first light-emitting elements each configured to emit light of a first light emission color and a plurality of second light-emitting elements each configured to emit light of a second light emission color different from the first light emission color are arranged in a predetermined pattern; and a lighting controller configured to supply a drive current to each of the plurality of first light-emitting elements and each of the plurality of second light-emitting elements and control a light emission period of each of the plurality of first light-emitting elements and each of the plurality of second light-emitting elements. A light emission color of a second light-emitting element of the plurality of second light-emitting elements is variable in accordance with a drive current supplied thereto.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
52.
LIGHT-EMITTING DEVICE AND METHOD FOR DRIVING THE SAME
A light-emitting device includes: a display comprising a plurality of pixels in which a plurality of first light-emitting elements each configured to emit light of a first light emission color and a plurality of second light-emitting elements each configured to emit light of a second light emission color different from the first light emission color are arranged in a predetermined pattern; and a lighting controller configured to supply a drive current to each of the plurality of first light-emitting elements and the plurality of second light-emitting elements and control a light emission period of each of the plurality of first light-emitting elements and the plurality of second light-emitting elements. The second light emission color of a second light-emitting element, of the plurality of second light-emitting elements, is variable in accordance with a drive current.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
A light-emitting device includes: a base member having an outer lateral surface, an upper surface meeting the outer lateral surface, and a recess on an upper surface side; a light-emitting element disposed in the recess; a lens disposed on the upper surface of the base member and including a lens portion and a flange portion; and a reflective member disposed in contact with the upper surface of the base member and a lateral surface of the flange portion.
A light-emitting module includes light source units arranged in a first direction and in a second direction orthogonal to the first direction. Each of the light source units includes at least one light-emitting element and a light-transmissive member covering the light-emitting element and having a lateral surface from which light from the light-emitting element is emitted. In a top view, on a normal line passing through a center of the lateral surface being Mth in the first direction and Nth in the second direction, the lateral surface being (M+1)th in the first direction and {N+L (where L is a natural number greater than or equal to 2)}th in the second direction is positioned, while no light source unit is present between the light source unit being the Nth in the second direction and the light source unit being the (N+L)th in the second direction on the normal line.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
A light-emitting device includes: a plurality of light-emitting elements arranged in an array on a base member; and a lens that includes at least one lens part disposed above the base member and including a first surface that faces the plurality of light-emitting elements, the first surface including a plurality of protrusions. The plurality of light-emitting elements include: a first light-emitting element having a center that faces a lens center of the lens in a top view, and a second light-emitting element having a center offset from the lens center of the lens in the top view.
Provided is a wavelength conversion member in which discoloration from an end portion is inhibited. The wavelength conversion member includes a laminate that includes: a wavelength conversion layer containing quantum dots; and two barrier layers each laminated on one of main surfaces of the wavelength conversion layer and on the other main surface. In this wavelength conversion member, the barrier layers each have a first modification part on at least a portion of their end surfaces, the wavelength conversion layer has a second modification part on at least a portion of its end surface, and the second modification part is at least partially exposed on an end surface of the laminate.
A light emitting device including a plurality of light emitting elements for emitting light of different colors depending on a drive current. The device includes a display, a current driver that supplies the drive current, a lighting controller that controls the current driver so that the light emitting elements emit light of a predetermined emission color and luminance, and an information storage that stores current-chromaticity information for determining a drive current value for driving the light emitting elements, in accordance with the emission color to be emitted by the light emitting elements. The lighting controller determines the drive current value for driving the light emitting elements and an ON period for lighting the light emitting elements by referring to the current-chromaticity information, in accordance with the predetermined emission color and gradation information, and performs lighting driving of the light emitting elements using the drive current from the current driver.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
Provided is a light radiation device with which it is possible to indicate a light radiation direction. The light radiation device has an elongated shape having a longitudinal direction and comprises a light emission part and a marker member that is directly or indirectly connected to the light emission part and is radiopaque. The marker member as viewed from a first direction in a direction orthogonal to the longitudinal direction differs in at least one among shape and position from the marker member as viewed from a second direction differing from the first direction in a direction orthogonal to the longitudinal direction, and it is possible to radiate light emitted from the light emission part in a predetermined direction crossing the longitudinal direction.
A vehicle lamp includes a first light source configured to emit light in a direction along a vertical direction; a first reflector having a first reflective surface that allows a portion of the light emitted from the first light source to be reflected forward; a second reflector having a pair of second reflective surfaces that allow light traveling without being reflected by the first reflective surface to be reflected leftward and rightward; a third reflector having a pair of third reflective surfaces that allow light reflected by the second reflective surfaces to be reflected forward; and a first lens that allows light reflected by the first reflective surface and light reflected by the pair of third reflective surfaces to exit forward through an exit surface. A maximum length of the first lens in the vertical direction is smaller than a maximum length of the first lens in a left-right direction.
F21S 41/33 - Multi-surface reflectors, e.g. reflectors with facets or reflectors with portions of different curvature
F21S 41/40 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades
F21S 41/663 - Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
Silicon-containing aluminum nitride particles contain a ratio of a total of a mass of aluminum and a mass of nitrogen of 90% by mass or more, and a ratio of a mass of silicon of 1.5% by mass or more and 10.0% by mass or less relative to a total of the mass of aluminum and the mass of silicon, as obtained by analyzing particles using an inductively coupled plasma-atomic emission spectroscope, and a mass of oxygen and the mass of nitrogen, as obtained by analyzing the particles using an oxygen/nitrogen analyzer, being 100% by mass, wherein a ratio (X/Y) is 0.40 or more and 0.85 or less, a ratio of the mass of oxygen is denoted as X % by mass, a specific surface area of the particles, as measured according to a BET method, is denoted as Y m2/g.
An image display device includes: a circuit element; a first wiring layer electrically connected to the circuit element; an insulating film covering the circuit element and the first wiring layer; a second wiring layer located on the insulating film; a light-emitting element located on the second wiring layer, the light-emitting element having a light-emitting surface opposite to a surface of the light-emitting element at a second wiring layer side; a light-transmissive insulating member covering at least a portion of the light-emitting element; and a third wiring layer located on the insulating member, the third wiring layer being electrically connected to the light-emitting element. The light-emitting element includes: a first semiconductor layer located on the second wiring layer, the first semiconductor layer, a light-emitting layer located on the first semiconductor layer, and a second semiconductor layer located on the light-emitting layer.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A wavelength conversion module includes: a phosphor member; and a light-transmissive substrate that is directly bonded to the phosphor member, wherein a higher thermal conductivity of the light-transmissive substrate is higher than a thermal conductivity of the phosphor member, and the light-transmissive substrate has a thickness in a range from 100 μm to 600 μm.
To provide a light-emitting device that emits amber-colored light and has good temperature characteristics. The light-emitting device includes a light-emitting element having a light emission peak wavelength in a range from 380 nm to 470 nm, and a wavelength conversion member including phosphors that absorb at least a part of light from the light-emitting element and emit light. The phosphors include a first phosphor having a light emission peak wavelength in a range from 535 nm to 560 nm, having a half-value width in a range from 100 nm to 120 nm, and containing a nitride containing La, Ce, and Si, and a second phosphor having a light emission peak wavelength in a range from 605 nm to less than 620 nm, having a half-value width in a range from 70 nm to 80 nm, and containing a nitride containing at least one of Ca or Sr, and Eu, Si and Al. The light-emitting device emits light within a region defined by connecting (0.545, 0.425), (0.560, 0.440), (0.609, 0.390), and (0.597, 0.390) in an xy chromaticity coordinate system of a CIE1931 chromaticity diagram.
Provided is a small-sized light radiation device having heat-dissipation properties and electrically-insulating properties. The light radiation device comprises: a light-emitting element that emits light having a prescribed wavelength; a support body on which the light-emitting element is mounted; an insulated wire that is electrically connected to the light-emitting element; a case that accommodates the light-emitting element, a connecting portion that connects the insulated wire and the light-emitting element, and a portion of the support body; and an insulating seal material that seals the light-emitting element, said portion of the support body, and said connecting portion, inside the case. Another portion of the support body protrudes from the seal material to the outside of the case.
H01S 5/02208 - MountingsHousings characterised by the shape of the housings
A61B 18/24 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser the beam being directed along or through a flexible conduit, e.g. an optical fibreHand-pieces therefor with a catheter
H01S 5/183 - Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
65.
LIGHT IRRADIATION DEVICE AND LIGHT IRRADIATION SYSTEM
This light irradiation device has an oblong shape and is for medical use, the light irradiation device including a device body, a laser light source, and a cooling liquid flow path. The device body has an oblong shape. The laser light source is provided at the distal end of the oblong device body and emits laser light. The cooling liquid flow path runs to the laser light source side of the device body, and allows a cooling liquid for cooling the laser light source to pass to the laser light source side.
A61N 5/067 - Radiation therapy using light using laser light
A61B 18/20 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
A light-emitting device includes a light source, including a light-emitting element and an optical axis in a first direction, and an optical element. The optical element has a surface including an incident region, a first region that reflects, toward the light source, a first light entering the optical element through the incident region, a ring-shaped second region surrounding the first region, and a ring-shaped third region surrounding the incident region. The first region reflects, toward the light source a portion of the first light that reaches a central region, overlapping the light-emitting element when viewed in the first direction, of the first region, and a portion of the first light that reaches an outer region of the first region. The second region reflects a second light entering the optical element through the incident region. The third region reflects, toward the second region, the second light reflected by the second region.
A light-emitting device includes a substrate; a frame disposed on an upper surface of the substrate; a first light-emitting element disposed on the upper surface of the substrate and within a first region along an inner periphery of the frame; a second light-emitting element disposed on the upper surface of the substrate and within a second region surrounded by the first region; a wall part disposed on the upper surface of the substrate, contacting the frame, and extending from the inner periphery of the frame toward the second region; a wavelength conversion member disposed on the upper surface of the substrate and within a region surrounded by the frame, and covering the wall part, the first light-emitting element, and the second light-emitting element; and a circuit including a first drive circuit that drives the first light-emitting element and a second drive circuit that drives the second light-emitting element.
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
A light emitting element comprises a semiconductor structure that includes an n-side layer, a p-side layer, and an ultraviolet light emitting active layer interposed between these layers; an n-side electrode electrically connected to the n-side layer; and a p-side electrode electrically connected to the p-side layer. The n-side layer has an undoped first layer and a second layer positioned between the active layer and the first layer and containing an n-type impurity. The n-side electrode includes a first electrode and a second electrode that are in contact with the second layer, but not in contact with the first layer. The reflectance of the first electrode for a peak wavelength of light emitted from the active layer is higher than the reflectance of the second electrode for the peak wavelength of the light emitted from the active layer.
A light-emitting device includes a substrate; a first frame disposed on the substrate; a second frame disposed on the substrate and inward of the first frame; a first light-emitting element disposed on the substrate and between the first and second frames; a second light-emitting element disposed on the substrate and inward of the second frame; a first wavelength conversion member disposed on the substrate and within a region surrounded by the first frame, and covering the second frame, the first light-emitting element, and the second light-emitting element; and a circuit including a first drive circuit that drives the first light-emitting element and a second drive circuit that drives the second light-emitting element. The first wavelength conversion member includes a phosphor-containing portion, phosphor particles are present predominantly on a substrate side of the phosphor-containing portion, and a height of the second frame is less than a thickness of the phosphor-containing portion.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
A method of manufacturing a wiring substrate includes preparing a ceramic substrate including a ceramic plate having a first recessed portion disposed in a first surface, a second recessed portion disposed in a second surface opposite to the first surface, and a through hole connecting the first recessed portion and the second recessed portion. A metal member is disposed continuously in the first recessed portion, the second recessed portion, and the through hole. The method includes disposing a protective film on a part of the metal member, blasting an other part of the metal member and at least a part of the first surface of the ceramic plate, disposing a covering member in a recessed portion from which the other part of the metal member and the part of the first surface of the ceramic plate have been removed by the blasting, and removing the protective film.
A light-emitting device includes a light-emitting element, and a light-reflective member that includes an inorganic member and reflects light from the light-emitting element. The inorganic member contains silicon oxide, an alkali metal, and a hydroxide containing an alkaline earth metal.
A light source device includes: a combined body including light emitting portions including: a first light emitting portion including a first light emitting element, and a second light emitting portion provided separately from and along an outer periphery of the first light emitting portion in a plan view, the second light emitting portion including a plurality of second light emitting elements; and a lens disposed above the combined body. The lens includes an incident surface though which light emitted from the combined body enters the lens, and an exit surface from which light exits the lens, the exit surface being flat, and the incident surface including a convex portion and a plurality of concentric annular convex portions surrounding the convex portion. The first light emitting element and the plurality of second light emitting elements are arrayed in first and second directions that are perpendicular to each other.
A method of manufacturing a wiring board includes: providing a substrate including an insulating resin and a metal member provided with an anti-rust layer on a surface facing a second surface of the insulating resin; forming a plurality of first holes passing through the metal member by etching; forming a second hole passing through the insulating resin and communicating with at least one of the first holes from a first surface side of the insulating resin; and filling an electroconductive paste to connect the second hole with any of the plurality of first holes and disposing the electroconductive paste on the first surface of the insulating resin to form wiring continuous with the filled electroconductive paste, the anti-rust layer on the surface of the metal member being removed from an inner bottom surface of the second hole in the forming of the second hole.
F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
F21Y 105/16 - Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
A light-emitting device includes: a substrate having an upper surface; a light-transmissive member having a lower surface facing the upper surface of the substrate; a plurality of surface emitting laser elements disposed between the upper surface of the substrate and the lower surface of the light-transmissive member, the surface emitting laser elements being configured to perform top emission; and an intermediate conductive component disposed between the upper surface of the substrate and the lower surface of the light-transmissive member. The substrate includes a first conductive member and a second conductive member. The light-transmissive member includes a third conductive member electrically connected to the first conductive member by the intermediate conductive component. The plurality of surface emitting laser elements include a first laser element electrically connected to the third conductive member, and a second laser element electrically connected to the second conductive member.
Provided is a light irradiation device which is small and has heat dissipation and electrical insulation. The light irradiation device includes: a light-emitting element that has a first surface for emitting light having a prescribed wavelength; a support body on which the light-emitting element is mounted; a first insulating layer that covers at least a part of the light-emitting element excluding the first surface; an insulated wire electrically connected to the light-emitting element in a region excluding the first surface; and a case that seals the first surface in a first space.
H01S 5/02208 - MountingsHousings characterised by the shape of the housings
A61B 18/24 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser the beam being directed along or through a flexible conduit, e.g. an optical fibreHand-pieces therefor with a catheter
Provided is a light irradiation device which is small and has heat dissipation and electrical insulation. The light irradiation device is provided with: a light-emitting element that emits light having a prescribed wavelength; a support body on which the light-emitting element is mounted; an insulated wire electrically connected to the light-emitting element; and an insulating layer that integrally covers the outer surface of a structure including the light-emitting element, the support body, and the insulated wire.
H01S 5/02208 - MountingsHousings characterised by the shape of the housings
A61B 18/24 - Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser the beam being directed along or through a flexible conduit, e.g. an optical fibreHand-pieces therefor with a catheter
A light-emitting device including a first electrically-conductive member and a second electrically-conductive member, solder on upper surfaces of the first and second electrically-conductive members, a light-emitting element bonded to the upper surfaces of the first and second electrically-conductive members with the solder, a light-transmitting member on an upper surface of the light-emitting element, and a cover member covering the upper surfaces of the first and second electrically-conductive members and a lateral surface of the light-emitting element. A lateral surface of the first electrically-conductive member includes a first recessed surface contiguous with the upper surface and a second recessed surface located at a lower level than the first recessed surface. The solder continuously covers the upper surface of the first electrically-conductive member and at least part of the first recessed surface, and the cover member further covers the solder covering the first recessed surface and at least part of the second recessed surface.
A light emitting device includes a base member, a submount, a semiconductor laser element, and a lens. The lens includes a lens portion having an incident surface and a lower surface. When a plane parallel to the lower surface of the lens portion and including a generatrix farthest from the emission end surface is defined as a reference plane, portions of the lens portion, each of which is within a range of a predetermined distance, are symmetrical with respect to the reference plane in a direction normal to the reference plane. A portion of the lens portion extends beyond the predetermined distance from the reference plane in a direction opposite to the lower surface. The lower surface of the lens portion is located at the predetermined distance from the plane. A gap is present between the lower surface of the lens portion and the upper surface of the base member.
A light emitting element includes: a semiconductor stack structure including: a first p-type semiconductor layer, a first active layer disposed on the first p-type semiconductor layer, a first n-type semiconductor layer disposed on the first active layer, an intermediate layer disposed on the first n-type semiconductor layer, a second p-type semiconductor layer disposed on the intermediate layer, a second active layer disposed on the second p-type semiconductor layer, and a second n-type semiconductor layer disposed on the second active layer, wherein: a plurality of first openings are continuously located in the first p-type semiconductor layer, the first active layer, and the first n-type semiconductor layer, and a plurality of second openings are continuously located in the first p-type semiconductor layer, the first active layer, the first n-type semiconductor layer, the intermediate layer, the second p-type semiconductor layer, the second active layer, and the second n-type semiconductor layer.
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
A light-emitting module includes: a substrate; a plurality of light source units, each including: a light source located on the substrate, and a lens on which light emitting from the light source is incident; a driver configured to rotate the plurality of light source units in a state in which the substrate and the plurality of light source units are fixed relative to each other; and a controller configured to control outputs of the plurality of light sources conjunctively with the driver. Among the lenses of the plurality of light source units, a number of the lenses configured to irradiate light while being on a trajectory in a first irradiation region centered on a rotation axis of the plurality of light source units is less than a number of the lenses configured to irradiate light while being on a trajectory in a second irradiation region centered on the rotation axis.
H10H 20/855 - Optical field-shaping means, e.g. lenses
F21V 5/04 - Refractors for light sources of lens shape
F21V 14/06 - Controlling the distribution of the light emitted by adjustment of elements by movement of refractors
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
82.
METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE
An image display device includes: a circuit element; a first wiring layer electrically connected to the circuit element; a first insulating film covering the circuit element and the first wiring layer; a light-emitting element located on the first insulating film; a light-shielding layer located in the first insulating film between the circuit element and the light-emitting element; a second insulating film covering at least a portion of the light-emitting element; and a second wiring layer located on the second insulating film and electrically connected to the light-emitting element. The light-emitting element includes a first semiconductor layer of a first conductivity type, a light-emitting layer located on the first semiconductor layer, and a second semiconductor layer located on the light-emitting layer, the second semiconductor layer being of a second conductivity type that is different from the first conductivity type. In a plan view, the light-shielding layer covers the circuit element.
A light-emitting module includes: a substrate; plurality of light sources disposed on the substrate, the plurality of light sources including a red light source, a green light source, a blue light source, and an infrared light source; at least one light-receiving element disposed on the substrate; and a lens disposed facing the plurality of light sources and the at least one light-receiving element. The red light source includes: a first light-emitting element configured to emit blue light, and a first phosphor configured to convert a wavelength of at least part of the blue light emitted from the first light-emitting element to emit red light. The at least one light-receiving element is configured to output biological photodetection information obtained by receiving light that has been emitted from at least one of the plurality of light sources and reflected or scattered by a biological body.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
F21V 14/02 - Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
A method for manufacturing a light-emitting device includes disposing a plurality of light-emitting elements on a support, each of the plurality of light emitting elements having an upper surface; disposing on the upper surfaces of the light-emitting elements and between adjacent light-emitting elements of the plurality of light-emitting elements an inorganic member having a void; forming a groove between the adjacent light-emitting elements in the inorganic member, and disposing a covering member on an upper surface of the inorganic member located above the light-emitting elements and in the groove to impregnate the void with a part of the covering member.
A rare earth aluminate phosphor includes: a first element M1 including at least one selected from the group consisting of yttrium (Y), lanthanum (La), lutetium (Lu), gadolinium (Gd), and terbium (Tb); cerium (Ce); aluminum (Al); oxygen atoms (O) and optionally a second element M2 including at least one selected from the group consisting of gallium (Ga) and scandium (Sc). The rare earth aluminate phosphor has a composition in which when a number of moles of oxygen atoms is 12, a total number of moles of the first element M1 and cerium is 2.9 or more and 3.1 or less, and a total number of moles of aluminum and the second element M2 is 4.5 or more and 5.5 or less, and has a reflection spectrum in which a ratio of reflectance at a wavelength of 280 nm to reflectance at a wavelength of 380 nm is 0.33 or more and 0.76 or less.
A lighting apparatus includes light emitting elements having an emission peak wavelength of 400 to 510 nm, a first phosphor having an emission peak wavelength of 485 to 700 nm, a second phosphor having an emission peak wavelength of 510 to 590 nm, a third phosphor having an emission peak wavelength of 600 to 700 nm, and a color filter having transmittance for light with a wavelength of 600 to 730 nm that is 80% or more and transmittance for light with a wavelength of 410 to 480 nm that is 3% or more and 50% or less. The color filter transmits a part of light emitted from the first phosphor, at least a part of light emitted from the second phosphor, and at least a part of light emitted from the third phosphor. Light transmitted through the color filter is emitted to the outside.
F21S 43/20 - Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
B60Q 1/34 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating change of drive direction
B60Q 1/44 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating braking action
F21S 43/16 - Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
F21V 9/08 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromaticElements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for reducing intensity of light
F21V 9/32 - Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
F21V 9/40 - Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
The present invention provide an additive for bonded magnets which makes it possible to improve the fluidity of a thermoplastic resin-containing bonded magnet compound, the mechanical properties of a bonded magnet, and other properties, as well as methods of producing a bonded magnet compound or bonded magnet with improved such properties. The present invention relates to an additive for thermoplastic resin-containing bonded magnets containing a cured product of a thermosetting resin and a curing agent having a ratio of the number of reactive groups of the curing agent to the number of reactive groups of the thermosetting resin of at least 2 but not higher than 11.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01F 1/057 - Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and IIIa elements, e.g. Nd2Fe14B
H01F 1/059 - Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and Va elements, e.g. Sm2Fe17N2
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A light source includes a plurality of light emitting elements, a plurality of light-transmissive members, and a light-blocking member. The light-transmissive members are respectively arranged above the light emitting elements. The light-transmissive members include a plurality of first light-transmissive members each containing a first phosphor, and a plurality of second-color light-transmissive members each containing a second phosphor configured to emit light having a different color from light emitted from the first phosphor. At least one of the first light-transmissive members is arranged between adjacent ones of the second light-transmissive members in a plan view. The light-blocking member covers lateral surfaces of the light-transmissive members while upper surfaces of the light-transmissive members are exposed from the light-blocking member.
F21K 9/66 - Details of globes or covers forming part of the light source
F21K 9/64 - Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
A light-emitting module includes: a light source including a plurality of light-emitting parts having respective light-emitting surfaces and including: at least one first light-emitting part configured to emit light having a first chromaticity, and at least one second light-emitting part configured to emit light having a second chromaticity different from the first chromaticity; a lens configured to transmit light from the light source; an actuator configured to change at least one of a relative position between the light source and the lens in a direction intersecting an optical axis of the lens or a relative inclination of the optical axis of the lens with respect to a corresponding one of the light-emitting surfaces; and a controller configured to control light emission of each of the plurality of light-emitting parts and operation of the actuator.
F21V 14/06 - Controlling the distribution of the light emitted by adjustment of elements by movement of refractors
F21Y 105/12 - Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
F21Y 113/10 - Combination of light sources of different colours
Provided is a method for manufacturing a light-emitting module in which dimensional accuracy of a lens or a light-shielding member for controlling light distribution of a light-emitting element is improved. A method for manufacturing a light-emitting module according to an embodiment comprises: a step for preparing a first intermediate member including a support member having a first surface and a second surface, a wiring layer provided on the first surface, a plurality of light-emitting elements electrically connected to the wiring layer on the first surface, and a photoresist member covering the light-emitting elements; and a step for lighting the plurality of light-emitting elements to expose a plurality of first portions of the photoresist member to form a second intermediate member. The photoresist member is exposed irradiation by light including the wavelength of light of the plurality of light-emitting elements.
The present invention realizes a small-sized light-emitting device which emits light having different polarization directions. The light-emitting device comprises: a plurality of semiconductor laser elements having light emitting peak wavelengths of a first wavelength±20 nm or less; and a plurality of reflection members including a first reflection member having a first light reflection surface and a second reflection member having a second light reflection surface and a wavelength plate which is provided on the second light reflection surface. The plurality of semiconductor laser elements include a first semiconductor laser element and a second semiconductor laser element. Light emitted from the first semiconductor laser element is reflected by the first light reflection surface of the first reflection member. Light emitted from the second semiconductor laser element is reflected by the second light reflection surface of the second reflection member. Light incident on the first light reflection surface and light incident on the second light reflection surface have the same polarization direction. Light emitted from the first reflection member and light emitted from the second reflection member have different polarization directions.
A light-emitting device includes a semiconductor laser element, an optical member, and a mounting member. The semiconductor laser element has a light-emitting surface. The optical member has a light incident surface and includes a conductive portion. The mounting member has a mounting surface on which first and second conductive regions, and an insulating region are provided. The second conductive region is insulated from the first conductive region via the insulating region. The semiconductor laser element is disposed in the first conductive region of the mounting surface. The optical member is disposed on the mounting surface such that the conductive portion and the mounting surface face each other and the conductive portion overlaps at least portions of the first and second conductive regions in a plan view. The semiconductor laser element is electrically connected to the second conductive region via the conductive portion.
Provided is a laser welding method for welding a metal material and a laminated body of metal foil together by irradiation with laser light. The laser welding method includes: a first step of forming a first weld part in which at least a plurality of the metal foils included in the laminated body are welded by emitting the laser light; and a second step of welding the laminated body and the metal material together by irradiating the laser light onto a region at least partially including the first weld part.
A light-emitting device includes a first substrate, a second substrate disposed above the first substrate, a plurality of light-emitting elements disposed on the second substrate, and a bonding member bonding a lower surface of the second substrate to the upper surface of the first substrate. The second substrate has a shape elongated in a first direction when viewed from above the second substrate, and has a thermal expansion coefficient different from that of the first substrate. The bonding member includes a first portion having a length in the first direction equal to or less than a length in a second direction orthogonal to the first direction, and second portions disposed on opposite sides of the first portion in the first direction, respectively. Each of the second portions has a Young's modulus and a thermal conductivity lower than those of the first portion.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
F21S 41/143 - Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
F21S 41/153 - Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
H01L 23/00 - Details of semiconductor or other solid state devices
95.
PARTITIONING MEMBER, PLANAR LIGHT SOURCE, AND LIQUID CRYSTAL DISPLAY DEVICE
A planar light source includes a substrate, a plurality of light sources arranged on the substrate, and at least one partitioning member disposed on the substrate. The at least one partitioning member includes: a plurality of first ridges extending in a first direction; a plurality of first wall parts, each first wall part having a predetermined height, at least two sides of each first wall part facing each other; a plurality of partitioned regions, each partitioned region being partitioned by the plurality of first ridges in a plan view, the plurality of partitioned regions arranged in a second direction intersecting the first direction; at least one first cut provided on a corresponding one of the plurality of first ridges; and at least one of the light sources arranged in a corresponding one of the plurality of partitioned regions.
Provided is a light-emitting element configured so that, when individually controlling the light emission of a plurality of light-emitting parts, it is possible to reduce the extraction of light emitted by the light-emitting parts from regions other than a region above the light-emitting parts that emit light. This light-emitting element comprises: a semiconductor structure including an n-side semiconductor layer and a plurality of light-emitting parts, the n-side semiconductor layer having a first surface, a plurality of second surfaces positioned on the side opposite the first surface, and a third surface positioned on the side opposite the first surface, and the plurality of light-emitting parts each having an active layer and a p-side semiconductor layer disposed on the second surface, wherein the third surface is positioned between the plurality of light-emitting parts in plan view and is exposed from the active layer and the p-side semiconductor layer; an n-side electrode disposed on the third surface; and p-side electrodes disposed on each of the p-side semiconductor layers of the plurality of light-emitting parts and electrically connected to the p-side semiconductor layers. In plan view: the first surface has a first region and a second region having an arithmetic average roughness smaller than that of the first region; the first region overlaps the second surface; and the second region overlaps the third surface.
H10H 20/819 - Bodies characterised by their shape, e.g. curved or truncated substrates
H10H 20/82 - Roughened surfaces, e.g. at the interface between epitaxial layers
H10H 20/813 - Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
H10H 20/814 - Bodies having reflecting means, e.g. semiconductor Bragg reflectors
H10H 20/831 - Electrodes characterised by their shape
A light-emitting element includes: a first semiconductor layer, a second semiconductor layer, a third semiconductor layer, and a fourth semiconductor layer in this order. The first semiconductor layer is Alx1Iny1Ga1-x1-y1N (0≤x1≤1, 0≤y1≤1, 0≤x1+y1≤1), the second semiconductor layer is Alx2Iny2Ga1-x2-y2N (0≤x2≤1, 0≤y2≤1, 0≤x2+y2≤1), the third semiconductor layer is Alx3Iny3Ga1-x3-y3N (0≤x3≤1, 0≤y3≤1, 0≤x3+y3≤1), and the fourth semiconductor layer is Alx4Iny4Ga1-x4-y4N (0≤x4≤1, 0≤y4≤1, 0≤x4+y4≤1).
H01L 33/14 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
H01L 33/32 - Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
A method of manufacturing a light emitting device includes: preparing a light emitting element comprising an external terminal having a first portion located on a semiconductor structure side and a second portion disposed on the first portion, wherein an area of the second portion is less than an area of the first portion; preparing a substrate having a wiring part; bonding the light emitting element and the wiring part by bringing the second portion of the external terminal into contact with the wiring part; and subsequent to bonding the light emitting element and the wiring part, forming plating continuously on lateral faces of the first and second portions, wherein a thickness of the second portion is 5 μm at most, and wherein the plating is formed such that the plating formed on the wiring part is in contact with the plating formed on the first portion.
A sintered body contains a fluorescent material being at least one selected from the group consisting of a nitride fluorescent material having a composition of formula (I) and an α-SiAlON fluorescent material having a composition of formula (II), and emits light having a color tone in an area A1 surrounded by lines connecting a point 1a (x=0.549, y=0.425), a point 2a (x=0.562, y=0.438), a point 3a (x=0.589, y=0.411), and a point 4a (x=0.576, y=0.407) in the chromaticity diagram of the CIE 1931 color system upon irradiation with excitation light, wherein, upon irradiation with excitation light, the light emitted from the sintered body has an emission spectrum in which an integral value ratio Z2/Z1 as described in the disclosure is 0.005 or more.
A method of producing a compound for bonded magnets, the method including: heat-curing a thermosetting resin and a curing agent having a ratio of the number of reactive groups of the curing agent to the number of reactive groups of the thermosetting resin of at least 2 but not higher than 11 to obtain an additive for bonded magnets; and kneading the additive for bonded magnets, magnetic powder, and a thermoplastic resin to obtain a compound for bonded magnets in which a filling ratio of the magnetic powder is at least 91.5% by mass.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
B29K 77/00 - Use of polyamides, e.g. polyesteramides, as moulding material
B29K 505/00 - Use of metals, their alloys or their compounds, as filler
H01F 1/057 - Alloys characterised by their composition containing rare earth metals and magnetic transition metals, e.g. SmCo5 and IIIa elements, e.g. Nd2Fe14B
