Abstract

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

IPC Classes  ?

• C25D 5/02 - Electroplating of selected surface areas
• C25D 7/12 - Semiconductors
• C25D 5/20 - Electroplating using ultrasonics
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 5/06 - Brush or pad plating
• C25D 17/14 - Electrodes for pad-plating
• C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

IPC Classes  ?

• C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
• C25D 17/12 - Shape or form
• C25D 5/06 - Brush or pad plating
• C25D 5/08 - Electroplating with moving electrolyte, e.g. jet electroplating
• C25D 5/20 - Electroplating using ultrasonics
• C25D 7/12 - Semiconductors
• H05K 3/24 - Reinforcing of the conductive pattern

Abstract

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

IPC Classes  ?

• C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
• C25D 7/12 - Semiconductors
• C25D 5/02 - Electroplating of selected surface areas
• C25D 5/20 - Electroplating using ultrasonics
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 5/06 - Brush or pad plating
• C25D 17/14 - Electrodes for pad-plating
• H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material