The objective of the invention is to provide a plant activator having a resistance to the wash-off and a superior handleability, transportability and storage stability. A powdery plant activator comprising, at least one compound selected from an oxo fatty acid or a derivative or a salt thereof and a hydroxy fatty acid or a derivative or a salt thereof, and an unsaturated fatty acid (excluding an oxo fatty acid and a hydroxy fatty acid).
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
Provided is a heat transfer suppression sheet that has exceptional heat insulation performance and is capable of absorbing deformation of a battery cell to suppress any decrease in battery performance and maintaining exceptional compression restoration force, thereby making it possible to prevent positional deviation and ensure exceptional heat insulation performance even when an abnormality occurs. A heat transfer suppression sheet (10) comprises: a heat-insulating material (11) that contains inorganic particles and at least one of organic fibers and inorganic fibers, the heat-insulating material (11) having a first main surface (21) and a second main surface (22) that constitute a pair; and an elastic body (12) that is layered in the thickness direction of the heat-insulating material (11). The second main surface (22) of the heat-insulating material (11) is disposed facing the elastic body (12). The maximum height Sz2 representing the surface roughness of the second main surface (22) is greater than the maximum height Sz1 representing the surface roughness of the first main surface (21).
A wiring substrate includes a conductor layer, an insulating layer formed on the conductor layer such that the insulating layer is covering the conductor layer, and a via conductor formed in a through hole penetrating through the insulating layer such that the through hole has a first opening on the opposite side with respect to the conductor layer and a second opening facing the conductor layer and that the via conductor is connecting to the conductor layer. The conductor layer has a surface facing the via conductor and having a recess communicating with the through hole such that the recess is smaller than the second opening and has a conical shape tapering toward the opposite side with respect to the via conductor and the recess has the center on the surface of the conductor layer that is offset from the center of the first opening of the through hole.
Provided is a heat transfer suppression sheet having excellent heat insulation performance, capable of absorbing deformation of a battery cell and thereby suppressing degradation of battery performance, and capable of suppressing positional deviation. Due to the foregoing, the heat transfer suppression sheet is capable of ensuring excellent heat insulation performance even in the event of failure. This heat transfer suppression sheet (10) comprises: a heat insulating material (11) that contains inorganic particles, and organic fibers and/or inorganic fibers, and that has a first main surface (21) and a second main surface (22) forming a pair; and an elastic body (12) that is laminated in the thickness direction of the heat insulating material (11). The first main surface of the heat insulating material (11) is disposed facing the elastic body (12). A maximum height Sz1 representing the surface roughness of the first main surface (21) is lower than a maximum height Sz2 representing the surface roughness of the second main surface (22).
A heat transfer suppression sheet includes a heat insulating material containing inorganic particles and an organic fiber; and a resin film encompassing the heat insulating material. The resin film has holes. The resin film is composed of a first surface-side film and a second surface-side film that are respectively disposed on a first surface side and a second surface side which are orthogonal to a thickness direction of the heat insulating material, and an end surface-side film that is disposed on an end surface side which is parallel to the thickness direction of the heat insulating material.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 5/16 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer formed of particles, e.g. chips, chopped fibres, powder
An optical waveguide (1) according to an embodiment comprises a lower cladding (21), a core (3), and an upper cladding (22), and a part of the core (3) on the optical signal incident side or emission side is exposed. The optical waveguide (1) is formed from a resin comprising a thermosetting resin or a photocurable resin, and in the interface (I) between the upper cladding (22) and the core (3), the resin forming the upper cladding (22) and the resin forming the core (3) are compatible with each other. A waveguide mounting substrate according to an embodiment includes a wiring substrate including an insulating layer and a conductor layer, and the optical waveguide according to the embodiment.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
A wiring board (1) according to an embodiment comprises an optical waveguide (102) formed by laminating, on a substrate (10), a lower cladding (21), a core (3), and an upper cladding (22) in this order, and an intermediate layer (M) is disposed between the substrate (10) and the lower cladding (21). An end surface of the intermediate layer (M) is located outside of an end surface of the lower cladding (21).
A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer includes wirings formed such that the wirings have the minimum wiring width of 3 μm or less and the minimum inter-wiring distance of 3 μm or less and that the conductor layer has mesh-like unevenness formed on a side surface of the conductor layer and not on an upper surface of the conductor layer.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A wiring substrate includes a first conductor layer, an insulating layer covering the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in a hole penetrating through the insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The insulating layer is formed such that the hole includes a first portion decreasing in width on the first conductor layer side, a second portion formed on the first conductor layer side of the first portion and increasing in width on the first conductor layer side, and a third portion formed on the first conductor layer side of the second portion and decreasing in width on the first conductor layer side.
A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.
This honeycomb structure includes a partition wall for defining a plurality of through-holes. The partition wall has a metal cyano complex. The honeycomb structure is used for ammonia adsorption.
B01J 20/02 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material
B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
Provided is a heat transfer suppression sheet that has excellent thermal insulation, and that can mitigate contamination of the surroundings due to powder drop. The heat transfer suppression sheet (10) comprises: a heat insulation material (11) that contains inorganic particles; a protective material (16) that is deposited on the heat insulation material (11); and a resin film (12) that encloses a layered body (17) including the heat insulation material (11) and the protective material (16), and has holes (13). The resin film (12) has a heat insulation material-side film (12b) that covers the surface of the heat insulation material (11), and a protective material-side film (12a) that covers the surface of the protective material (16). The total area of the holes (13) in the heat insulation material-side film (12b) is smaller than the total area of the holes in the protective material-side film (12a).
Provided is a cover protector capable of maintaining excellent adhesive performance without delamination of a multilayer structure even when exposed to high heat or flames from a battery cell causing thermal runaway, and thereby capable of protecting a heat insulating material from scattered matter and maintaining excellent heat insulating performance. The cover protector (1) has a heat insulating material (2) and an inorganic fiber sheet (3) adhered to the heat insulating material (2) by an adhesive (4). The oxygen index of the cover protector (1) is greater than 24.7% as measured in accordance with JIS K7201-2, and the viscosity at 250°C of an adhesive material constituting the adhesive (4) is 40 Pa·s or more.
A component built-in wiring board includes a core substrate, a connecting component positioned in opening of the substrate and including electronic components, a first build-up part formed on a first surface side of the substrate, a second build-up part formed on a second surface side of the substrate, and filling resin part filling space formed between the substrate and connecting component in the opening of the substrate. The connecting component includes molding resin part positioning the electronic components spaced apart from each other, and penetrating conductors formed in the molding resin part, and the electronic components include a first component having terminals on the first surface side of the substrate and a second component having terminals on the second surface side of the substrate such that the penetrating conductors are formed on the second surface side and connected to the terminals of the second component on the second surface side.
A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, and a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part positions an optical wiring part on the surface of the electrical wiring part.
The optical waveguide (1) according to an embodiment comprises a lower cladding (21), a core (3), and an upper cladding (22), and a part of the core (3) on the optical signal incident side or emission side is exposed. The optical waveguide (1) is formed from a resin comprising a thermosetting resin or a photocurable resin, and the maximum roughness of the interface (I) between the lower cladding (21) and the core (3) is 50-300 nm.
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
17.
COMPOSITION, METHOD FOR PRODUCING COMPOSITION, RAW MATERIAL, USE OF EXTRACELLULAR VESICLES (EVS) DERIVED FROM SEAWEED, AGENT FOR IMPROVING STABILITY, METHOD FOR IMPROVING STABILITY, AGENT FOR INCREASING CYCLIC ADENOSINE MONOPHOSPHATE, METHOD FOR PRODUCING AGENT FOR INCREASING CYCLIC ADENOSINE MONOPHOSPHATE, PERMEABLE COMPOSITION, AND PERMEATION ENHANCER
Provided is a composition that includes an extract from seaweed and has excellent action and efficacy. This composition is characterized by including extracellular vesicles (EVs) and carotenoids.
A61K 31/336 - Heterocyclic compounds having oxygen as the only ring hetero atom, e.g. fungichromin having three-membered rings, e.g. oxirane, fumagillin
A61K 31/201 - Carboxylic acids, e.g. valproic acid having a carboxyl group bound to an acyclic chain of seven or more carbon atoms, e.g. stearic, palmitic or arachidic acid having one or two double bonds, e.g. oleic or linoleic acid
A61Q 19/02 - Preparations for care of the skin for chemically bleaching or whitening the skin
C12N 1/00 - Microorganisms, e.g. protozoaCompositions thereofProcesses of propagating, maintaining or preserving microorganisms or compositions thereofProcesses of preparing or isolating a composition containing a microorganismCulture media therefor
C12N 1/04 - Preserving or maintaining viable microorganisms
C12P 23/00 - Preparation of compounds containing a cyclohexene ring having an unsaturated side chain containing at least ten carbon atoms bound by conjugated double bonds, e.g. carotenes
18.
COIL SUBSTRATE FOR MOTOR, MOTOR, AND METHOD FOR MANUFACTURING COIL SUBSTRATE FOR MOTOR
Provided are a coil substrate for a motor and a motor in which the cross-sectional shape of the coil substrate for a motor can be formed into a true circular shape. A coil substrate for a motor according to an embodiment includes a flexible substrate having a first surface and a second surface opposite from the first surface, and a plurality of coil wirings disposed along the longitudinal direction of the flexible substrate, one end-side end part of the coil substrate for a motor being a winding start part, and the coil substrate for a motor being formed in a substantially cylindrical shape, wherein: the coil substrate for a motor is composed of a coil wiring formation region in which coil wiring is formed on at least one of the first surface and the second surface of the coil substrate, and a coil wiring non-formation region in which coil wiring is not formed on either of the first surface and the second surface of the coil substrate; the coil wiring non-formation region is disposed in the vicinity of a longitudinal-direction end part of the coil substrate; and the longitudinal-direction length L1 of the coil wiring non-formation region and the circumferential-direction length C of the coil substrate for a motor satisfy the relationship in formula 1. Formula 1: 1/3 ≤ L1/C < 1
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer. The conductor layer includes a main component including copper such that the conductor layer includes a copper oxide film forming a surface thereof.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, a coil including a wiring and formed on the first surface and/or second surface of the flexible substrate, and a resin insulating layer covering the wiring of the coil formed on the first surface and/or second surface of the flexible substrate. The coil is formed such that the wiring has a first layer and a second layer covering an outer surface of the first layer and that the second layer has a first portion covering an upper surface of the first layer and a second portion covering a side surface of the first layer, and the wiring of the coil is formed such that the wiring has a width in a range of 60 μm to 400 μm and that a ratio T1/T2 of a thickness T1 of the first portion to a thickness T2 of the second portion satisfies 1.0
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in an opening formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer such that the seed layer has a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface of the insulating layer in the opening, and a third portion formed on the first conductor layer exposed from the opening and that the first portion has a thickness that is greater than a thickness of the second portion and a thickness of the third portion.
A mat material having a generally rectangular shape in a plan view, the mat material including inorganic fibers, wherein the mat material includes a first main surface and a second main surface opposite to each other in a thickness direction, a first end surface and a second end surface opposite to each other in a longitudinal direction that is a winding direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular to the thickness direction and the longitudinal direction, the mat material includes, on the first end surface, a protrusion designed to protrude toward the second end surface during winding of the mat material, and non-protruding portions provided at both sides of the protrusion in the width direction and designed not to protrude toward the second end surface during winding of the mat material, the mat material includes, on the second end surface, a recess designed to fit the shape of the protrusion on the first end surface during winding of the mat material, and non-recessed portions provided at both sides of the recess in the width direction and designed to fit the shapes of the non-protruding portions on the first end surface during winding of the mat material, and a ratio [D/C] of a length [D] of the non-recessed portion in the width direction to a length [C] of the non-recessed portion in the longitudinal direction is 1.0 or more.
Provided are: a coil substrate with which the cross-sectional shape of a motor coil substrate can be formed into a true circular shape; and a motor coil substrate and a motor which use the coil substrate. A coil substrate according to an embodiment of the present invention comprises: a resin substrate having a first surface and a second surface opposite to the first surface; and a plurality of coil wirings arranged in the longitudinal direction of the resin substrate. The coil substrate is wound in a substantially cylindrical shape to form a motor coil substrate. The coil substrate is such that: a first edge on one end side of the resin substrate in the longitudinal direction is set as a winding start; a second edge on the other end side of the resin substrate in the longitudinal direction is set as a winding end; the coil substrate is wound by a plurality of times in the circumferential direction about the axis extending parallel to the first side with the winding start set as a starting point; the coil substrate is formed into a substantially cylindrical shape; a virtual line which is a straight line connecting the winding start and the center of the cylindrical shape of the coil substrate is provided to the cylindrical cross section of the motor coil substrate; and the winding end does not exceed the virtual line.
An inorganic fiber mat produced by a method including a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
25.
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHOD
A laminating system includes a laminating device including a laminating roll device that applies a dry film onto a seed layer formed on a surface of a resin insulating layer, and a pressure application device positioned such that the pressure application device applies heat and pressure to the dry film.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming opening through the protective film and insulating layer, removing the film, cleaning the surface of the insulating layer, forming a second conductor layer on the surface of the insulating layer; and forming a via conductor connecting the first and second conductor layers in the opening. The insulating layer includes resin and inorganic particles having spherical shapes, the cleaning includes selectively removing the resin such that the particles include first particles partially embedded and second particles completely embedded in the resin. The forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.
A wiring substrate includes a core substrate including a resin substrate, a glass substrate in opening of the resin substate, and filling resin between the resin and glass substrates, and a build-up part on the core substrate and including conductor layers and resin insulating layers. The glass substrate has first through-hole conductors including main material including copper, the resin substrate has second through-hole conductors including main material including copper, and the first and second through-hole conductors are formed in the glass and resin substrates respectively such that density of the first through-hole conductors is greater than density of the second through-hole conductors, where the density of the first through-hole conductors is number of the first through-hole conductors per unit area of surface of the glass substrate, and the density of the second through-hole conductors is number of the second through-hole conductors per unit area of surface of the resin substrate.
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas formed on surface, and forming a build-up part including conductor layers and insulating layers on the surface of the substrate across the product areas. The product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that each insulating layer has elongation rate of 7% or more, the laminating the conductor layers includes forming a resist layer having a resist pattern and forming a conductor pattern including wirings according to the pattern such that the wirings have minimum width of 2 μm or less and minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C03C 17/40 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C25D 5/02 - Electroplating of selected surface areas
C25D 5/54 - Electroplating of non-metallic surfaces
C25D 7/00 - Electroplating characterised by the article coated
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas on a surface, and forming a build-up part on the surface across the product area. The one or more product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that difference in thermal expansion coefficient between the substrate and insulating layers is 13 ppm/° C. or less, the laminating the conductor layers includes forming a resist layer having resist pattern and forming conductor pattern including wirings according to the pattern such that the wirings have the minimum width of 2 μm or less and the minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas on first surface, and forming a build-up part including conductor layers and insulating layers on the first surface across the one or more product areas. The glass substrate has a support body attached to second surface. The one or more product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers, the laminating the conductor layers includes forming a resist layer having pattern and forming conductor pattern including wirings according to the pattern. The wirings have the minimum width of 2 μm or less and the minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
Provided are: a heat transfer suppression sheet that has excellent sheet strength and makes it possible to inhibit inorganic particles from falling off, maintain excellent thermal insulation performance, and mitigate stresses from impacts, pressing force, and the like; and a battery pack having the heat transfer suppression sheet. The heat transfer suppression sheet (10) includes inorganic particles (4) and organic fibers (11) and has, on at least one of the front surface and the back surface thereof, a fiber aggregate section (2) formed by intertwining a plurality of the organic fibers (11), and a recess (3) recessed from the fiber aggregate section (2). In addition, the battery pack includes a plurality of battery cells and the heat transfer suppression sheet (10), and the plurality of battery cells are connected in series or in parallel.
Provided is a battery pack that can quickly discharge a high-temperature gas emitted from an abnormal battery cell during thermal runaway and prevent a thermal runaway cascade caused by backflow of the high-temperature gas to an adjacent battery cell. This battery pack comprises a module that includes a plurality of battery cells that each have a safety valve, a case that accommodates the module, and a heat insulation material that is provided between the module and the case. The battery pack is characterized in that the heat insulation material includes a first heat insulation sheet that, as seen in plan view, comprises a plurality of covering parts that respectively cover the plurality of safety valves and a body part that is outside the covering parts, each of the covering parts being positioned so as to overlap at least a portion of one safety valve and having a first slit part that is formed along the outline of the covering part and a second slit part that is at least partially formed inside the outline of the covering part, the outline of the covering part including at least two connection parts that connect the covering part and the body part where the first slit part is not formed.
The present invention provides a thermal insulation material for a battery pack, said thermal insulation material being thin but yet exhibiting excellent thermal insulation properties. This thermal insulation material for a battery pack includes a layered inorganic material sheet formed by laminating a plurality of layered inorganic material papers, said thermal insulation material characterized in that the layered inorganic material papers are impregnated with a resin, and the layered inorganic material sheet is expanded by heating at 500°C so as to create voids in the layered inorganic material sheet.
The present invention provides a thermal insulation material (40) for a battery pack, said thermal insulation material being thin but yet exhibiting excellent thermal insulation properties. This thermal insulation material (40) for a battery pack includes a layered inorganic material sheet (42) obtained by laminating layered inorganic material papers (43), said thermal insulation material characterized by comprising voids, the size of which in the thickness direction is 10-100 μm inclusive, at least between the layered inorganic material papers.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
A wiring substrate includes a build-up part including a conductor layer and an insulating layer, a solder resist layer formed in contact with a surface of the build-up part, and a metal post formed on the build-up part and protruding from the solder resist layer. The build-up part includes conductor layers including the conductor layer and insulating layers including the insulating layer such that the conductor layer includes a conductor pad, is formed on a surface of the solder resist layer and is in contact with a surface of the insulating layer forming the surface of the build-up part, and the metal post includes a base plating layer connected to the conductor pad of the conductor layer in the build-up part such that the base plating layer includes a penetrating portion formed in an opening of the solder resist layer and a pad portion protruding from the solder resist layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
This mat material includes a laminated mat including at least one layer of an alignment layer made of inorganic fibers and having the alignment directions of the inorganic fibers aligned, and at least one layer of a random layer made of inorganic fibers and having random orientation directions of the inorganic fibers. The laminated mat includes a binder.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
38.
COMPOSITE MEMBER, METHOD FOR MANUFACTURING SAME, AND POWER STORAGE DEVICE
Provided is a composite member having an insulation film that is capable of maintaining excellent insulation and heat resistance for a long period of time, does not require operation such as winding a tape or the like, and is free from problems such as occurrence of winding unevenness or a gap and detachment. A composite member (1) has a base material (2) and an insulation film (3) covering at least a portion of the surface of the base material (2). The insulation film (3) has: an inner layer (4) comprising a first film material which has a matrix (8) including a compound having a siloxane bond and an inorganic material (9) dispersed in the matrix (8) and having a squamous, plate, flake, or fibrous shape; and an outer layer (5) comprising a second film material which has a matrix (8) including a compound having a siloxane bond and an inorganic material dispersed in the matrix (8) and having a squamous, plate, flake, or fibrous shape. In the inner layer (4) and the outer layer (5), the respective alignments of the inorganic materials (9) with respect to the surface of the base material (2) are different from each other.
H01B 3/02 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
Provided is a heat transfer suppression sheet which has excellent heat insulation properties, can absorb pressing force even when the pressing force is applied to the heat transfer suppression sheet, and thereby being able to suppress powder drop and maintain the excellent heat insulation properties, and also provided is a battery pack having the heat transfer suppression sheet. A heat transfer suppression sheet (10) contains heat insulating particles (5) and organic fibers (3). The heat-insulating particles (5) include large-diameter inorganic particles (1) having an average primary particle diameter of 0.1 μm or more and silica nanoparticles (2). One part of the principal surface (10a) of the heat transfer suppression sheet (10) orthogonal to the thickness direction has a first region (11) in which the large-diameter inorganic particles (1) are eccentrically located, and the other part of the principal surface (10a) has a second region (12) in which the large-diameter inorganic particles (1), the silica nanoparticles (2), and the organic fibers (3) are dispersed.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
A method for manufacturing a wiring substrate includes forming a build-up part including conductor layers and insulating layers across one or more product areas on a support substrate such that the one or more product areas have a rectangular shape with each side in a range of 80 mm to 240 mm. The forming the build-up part includes forming a resist layer having a resist pattern and forming a conductor pattern according to the resist pattern, and forming wirings in the conductor pattern such that the wirings have a minimum width of 2 μm or less and a minimum inter-wiring distance of 2 μm or less, and the forming the resist layer having the resist pattern includes exposing the resist layer by direct imaging exposure.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method for manufacturing a wiring substrate includes preparing two support substrates having one or more product areas, forming a first build-up part including first conductor and insulating layers across the one or more product areas on a first surface of each support substrate, positioning the substrates such that second surfaces of the substrates face each other, and forming a second build-up part including second conductor and insulating layers on each first build-up part. The minimum wiring width and the minimum inter-wiring distance of wirings in the first conductor layers are smaller than those of wirings in the second conductor layers. The forming the first build-up part includes forming a first resist layer having a first resist pattern and forming a conductor pattern according to the first resist pattern for each first conductor layer. The forming the first resist layer includes exposing the first resist layer by direct imaging exposure.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Provided are: a heat transfer suppression sheet which exhibits high holding ability of a particle material and also excellent compression characteristics, is capable of preventing increase in convective heat transfer, and exhibits excellent thermal insulation performance; and a battery pack which comprises said heat transfer suppression sheet and is excellent in safety. A heat transfer suppression sheet (10) includes inorganic particles (30) and first organic fibers (20) having wide stem parts (21) in which the dimension equivalent to the width thereof is 1-100 μm, and branch parts (22) which branch from the stem parts (21). The stem parts (21) of the first organic fibers (20) are multilayered and aligned along a main surface (10a) of the heat transfer suppression sheet (10). In addition, this battery pack has: a plurality of battery cells; and the heat transfer suppression sheet (10). The plurality of battery cells are connected in series or in parallel.
This wiring board includes a build-up part which is a plurality of conductor layers and a plurality of insulating layers and which has a via conductor for interlayer connection of the plurality of conductor layers, and an optical waveguide (OPW). The build-up part is made of a first build-up part (10), a second build-up part (20), and a third build-up part (30). The first build-up part (10) includes a plurality of conductor layers (12) and insulating layers (11). The second build-up part (20) includes a plurality of conductor layers (22) and insulating layers (21). The third build-up part (30) includes a plurality of conductor layers (32) and insulating layers (31). The optical waveguide (OPW) is formed on a first surface (10F) of the first build-up part (10). The thickness (T1) of the first insulating layers, the thickness (T2) of the second insulating layers, and the thickness (T3) of the third insulating layers satisfy the relationship T1 ≠ T2 ≠ T3, and the second insulating layers (21) or the insulating layers (31) contain a core material.
An optical waveguide (1) according to an embodiment includes a lower cladding (21), a core (3) formed on the lower cladding (21), and an upper cladding (22) formed on the lower cladding (21) and the core (3). A part of the core (3) on the incident side or the exit side of the optical signal is exposed. The optical waveguide (1) comprises a region without an upper cladding and a region with an upper cladding. The region without the upper cladding has a core-exposed portion in which an upper surface (31) of the core (3) is exposed. The region with the upper cladding has a core non-exposed portion in which the upper surface (31) of the core (3) is not exposed. A corner portion (30) of the cross-sectional shape of the core (3a) in the core exposed portion is rounded.
A wiring substrate includes a conductor layer including a via land, a conductor film formed on the via land of the conductor layer, an insulating layer covering the conductor layer and the conductor film formed on the via land, and a via conductor formed in the insulating layer such that the via conductor is penetrating through the insulating layer and is connecting to the via land via the conductor film. A ratio of the shortest distance between an upper surface of the conductor film and an end surface of the via conductor on the opposite side with respect to an end surface connected to the conductor film to the shortest distance between an upper surface of the via land and the end surface of the via conductor on the opposite side with respect to the end surface connected to the conductor film is in the range of 0.4 to 0.7.
The purpose of the present invention is to provide a transformant having excellent 2,3-butanediol production capability. Provided is a transformant of a hydrogen-oxidizing bacterium that grows in the co-presence of oxygen, the transformant being used for the production of 2,3-butanediol. In the transformant, (a) a nucleic acid encoding an enzyme for synthesizing acetolactate from pyruvic acid, (b) a nucleic acid encoding an enzyme for converting acetolactate into acetoin, (c) a nucleic acid encoding an enzyme for converting acetoin into 2,3-butanediol, and (d) a regulatory sequence operably linked to the nucleic acids (a) to (c) are introduced, wherein the nucleic acid (b) is located upstream of the nucleic acid (a) and the nucleic acid (c).
Provided are a composite member that is excellent in insulation property and heat resistance and enables suppression of detachment or the like of an insulating coating film at a corner part which is especially likely to be damaged by collision between the composite members or between the composite member and another component, and a method for manufacturing the same. The composite member (20) comprises a base material (25) and an insulating coating film (10) that covers at least a part of the surface of the base material (25). The base material (25) includes a pair of opposing main surface parts (25a), a plurality of end surface parts (25b) that connect the pair of main surface parts (25a) to each other, and a corner part (25c) between the main surface part (25a) and the end surface part (25b). Porosity P1 of the insulating coating film (10) formed on the corner part (25c) of the base material (25) is smaller than porosity P2 of the insulating coating film (10) formed on the main surface part (25a) of the base material (25).
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
The present invention provides a heat transfer suppression sheet in which it is possible to accurately align the positions of a heat insulation material and an elastic sheet, and with which it is possible to suppress destruction of a battery case and deterioration of the battery performance due to deformation of a battery cell, to further suppress propagation of heat between battery cells when an abnormality occurs, and to reduce the starting material cost. This heat transfer suppression sheet (50) has: a heat insulation material (10) which contains inorganic particles; elastic sheets (51a, 51b) which are superposed on a first surface (10a) and a second surface (10b) of the heat insulation material (10), the first and second surfaces being orthogonal to the thickness direction of the heat insulation material; and joining parts (55a, 55b) which join the heat insulation material (10) and the elastic sheets (51a, 51b) to each other. Facing regions (45a, 45b) in which the heat insulating material (10) and the elastic sheets (51a, 51b) face each other have joining regions (44a, 44b) in which the joining parts (55a, 55b) are present, and non-joining regions (41a, 41b) in which the joining parts (55a, 55b) are not present.
222 adsorbent carried on the surface of the partition wall. The partition wall and the outer peripheral wall are made of silicon carbide, and have an opening ratio of 65-86%. The surface area of the partition wall is 20-36 cm2per 1 cm32222 in the air is captured.
B01D 53/14 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
B01D 53/04 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
Provided is a composite member that has a high-strength insulating coating film formed at a desired region of the surface of a substrate and can thereby prevent reductions in insulating properties caused by partial damage to an insulating coating film. A composite member (20) includes a substrate (25) and an insulating coating film (10) that covers at least a portion of the surface of the substrate (25). The substrate (25) has a first region (41) and a second region (42) that have different surface roughnesses. The surface roughness Ra1 of the first region (41) is at least 1 μm, and the ratio (Ra1/Ra2) of the surface roughness Ra1 of the first region (41) to the surface roughness Ra2 of the second region (42) is 1.5–60.
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape and that a cylindricity of an outer circumferential surface is greater than 0.0 mm and equal to or less than 0.3 mm.
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
(wherein, R1 is a straight or branched alkylene group with 6 to 12 carbon atoms, and optionally comprises one or more double bonds, R2 is an alkyl group with 2 to 8 carbon atoms, and optionally comprises one or more branches and/or double bonds) or a salt or an ester thereof.
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
53.
FLAMEPROOF MATERIAL, METHOD FOR PRODUCING FLAMEPROOF MATERIAL, AND BATTERY MODULE
A flameproof material contains a heat insulation material containing an inorganic fiber or an infusible fiber, and an inorganic fiber cloth. The heat insulation material and the inorganic fiber cloth are integrated to each other by physical means. The physical means may be at least one of needling, a resin staple, a resin tag pin, or thread sewing.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
D04H 1/413 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties containing granules other than absorbent substances
D04H 1/498 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres entanglement of layered webs
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
A connection structure includes an electrical wiring part, an optical element having a light receiving or light emitting surface, and an optical waveguide including a core part, a first cladding layer in contact with a first surface of the core part, and a second cladding layer in contact with a second surface of the core part on the opposite side. The waveguide has a first end surface and a second end surface formed such that the core part and first cladding layer are substantially flush on the first end surface and the second cladding layer has the second end surface extending from the first end surface, the core part has a light transmitting surface that is exposed on the first end surface and faces the light receiving or light emitting surface of the optical element, and the optical element is positioned on the second end surface of the optical waveguide.
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape, and the coils are formed such that a space factor of the coils in a cross section of the motor coil substrate is in a range of 50% to 99%.
Provided is a heat transfer suppression sheet having desired strength and heat insulation properties and capable of flexibly adapting to various designs such as size and heat insulation properties. A heat transfer suppression sheet (50) is formed by coupling a plurality of pieces of heat insulation material (10) containing inorganic particles. The heat insulation material (10) has a pair of main surfaces (10a, 10b), and a connection surface (10c) that connects the pair of main surfaces (10a, 10b). The connection surfaces (10c) of the plurality of pieces of heat insulation material (10) are disposed facing each other, and a coupling surface (61) for coupling the pieces of heat insulation material (10) together is formed. In a cross-sectional view orthogonal to the pair of main surfaces (10a, 10b) and parallel to a direction in which the pieces of the heat insulation material (10) are adjacent to each other, the length of the coupling surface (61) is longer than the thickness of the heat insulation material (10) in a region in which the coupling surface (61) is formed.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
A penetration promoter for an organic substance for plants, containing at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof. An agricultural composition containing: (a) at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof; and (b) at least one organic substance for plants.
An optical waveguide includes a core part, a first cladding layer formed on the core part such that the first cladding layer is in contact with a first surface of the core part, and a second cladding layer formed on the core part such that the second cladding layer is in contact with a second surface of the core part. The core part, first cladding layer and second cladding layer form an end portion of the optical waveguide such that the core part and first cladding layer form a first end surface of the optical waveguide on which the core part is exposed and the core part and the first cladding layer are flush with respect to each other, and a second end surface of the optical waveguide including a portion of the second cladding layer extending from the first end surface at the end portion of the optical waveguide.
A method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a firing step of firing the first inorganic fiber molding prepared in the preparing step, a defibrating step of defibrating the first inorganic fiber molding fired in the firing step to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
A wiring substrate includes a first wiring substrate including first insulating layers, first conductor layers, and first via conductors, and a second wiring substrate mounted on the first substrate and including second insulating layers, second conductor layers, and second via conductors. The second substrate is formed such that the minimum wiring width of wirings in the second conductor layers is smaller than the minimum wiring width of wirings in the first conductor layers, the minimum inter-wiring distance of the wirings in the second conductor layers is smaller than the minimum inter-wiring distance of the wirings in the first conductor layers, the wiring widths of the wirings in the second conductor layers are 3 μm or less, the inter-wiring distances of the wirings in the second conductor layer are 3 μm or less, and aspect ratio of the wirings in the second conductor layer is in range of 2.0 to 4.0.
Provided is a plant activator with which it is possible to safely, stably, and effectively promote an increase in fruiting by appropriately spraying the activator onto plants or using the same for irrigation. The plant activator contains: at least one compound selected from an oxo fatty acid or a derivative thereof or a salt thereof; and a terpene.
A flameproof sheet contains a flameproof material and an elastic member, and the flameproof material is laminated with the elastic member so that a joint surface of the flameproof material with the elastic member and a joint surface of the elastic member with the flameproof material are movable along the joint surface.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
B32B 7/08 - Interconnection of layers by mechanical means
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
B32B 25/10 - Layered products essentially comprising natural or synthetic rubber next to a fibrous or filamentary layer
63.
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN WIRING BOARD
A component built-in wiring board includes a core substrate having an opening, electronic components positioned in the opening of the substrate such that the electronic components are spaced apart with respect to each other, a build-up part formed on the substrate such that the build-up part is covering the electronic components in the opening of the substrate, and a resin part formed in the opening of the substrate and including a first resin part and a second resin part such that the second resin part is connecting the electronic components in the opening of the substrate and the first resin part is filling a space formed between the core substrate and the second resin part in the opening of the 10 substrate. The second resin part of the resin part is connecting the electronic components having different heights such that terminal surfaces of the electronic components are flush with each other.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
64.
AGENT FOR INCREASING POLYPHENOL CONTENT IN LEAVES OF PLANT OF FAMILY THEACEAE, AND AGENT FOR INCREASING THEANINE CONTENT
Provided are an agent for increasing polyphenol content and an agent for increasing theanine content in leaves of a plant of the family Theaceae, these agents making it possible to safely increase the amount of polyphenols, such as catechins, and/or theanine contained in the tea tree by appropriately spraying or irrigating the plant without adversely affecting the biological tissue of the plant. The agent for increasing the polyphenol content and/or the theanine content in leaves of a plant of the family Theaceae contains at least one compound selected from the group consisting of oxo fatty acids or salts thereof and fatty acid hydroxides or salts thereof.
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01G 7/06 - Treatment of growing trees or plants, e.g. for preventing decay of wood, for tingeing flowers or wood, for prolonging the life of plants
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part positioned on a surface of the electrical wiring part and including a support substrate and an optical waveguide such that the optical wiring part has a component region configured to position a component on the optical wiring part and the optical waveguide includes a core part and a cladding part. The support substrate in the optical wiring part has a thermal expansion coefficient lower than a thermal expansion coefficient of the optical waveguide and includes a conductor region and a non-conductor region such that the optical waveguide is formed on a surface of the support substrate in the non-conductor region and the optical wiring part includes one or more penetrating conductors penetrating through the support substrate in the conductor region.
A printed wiring board includes an uppermost conductor layer having an electrode that mounts an electronic component, an upper build-up part including conductor layers and resin insulating layers such that the uppermost conductor layer is formed on the upper build-up part, and a lower build-up part including conductor layers and resin insulating layers and formed such that the lower build-up part is formed below the upper build-up part. The upper build-up part is formed such that each of the conductor layers includes a seed layer formed by sputtering, and an electrolytic plating layer formed below the seed layer, and the lower build-up part is formed such that each of the conductor layers includes a seed layer formed by electroless plating, and an electrolytic plating layer formed below the seed layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.
[Problem] To provide a wiring board having a novel configuration. [Solution] A wiring board 10 has a substrate 20 having a conductor layer 26, and has disposed on the substrate 20: an optical element region 30; and a plurality of optical waveguides 40 each having lower cladding 41, a core 42, and upper cladding 43. The optical element region 30 includes an electric connection material 50 for electrically connecting the conductor layer 26 and the optical element region 30. The optical waveguides 40 are arranged and have the cores 42, which are optically coupled to the optical element region 30, exposed therefrom.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A coil substrate includes a flexible substrate including a first substrate and a second substrate extending from the first substrate, and coils formed on the flexible substrate. The coils are positioned substantially in a row and include an m-th coil, an (m+1)-th coil, an (m+2)-th coil, an (m+3)-th coil, and an (m+4)-th coil. The (m+1)-th coil is positioned next to the m-th coil, the (m+2)-th coil is positioned next to the (m+1)-th coil, the (m+3)-th coil is positioned next to the (m+2)-th coil, the (m+4)-th coil is positioned next to the (m+3)-th coil, the m-th coil, the (m+1)-th coil, and the (m+2)-th coil partially overlap, and the m-th coil and the (m+4)-th coil do not overlap, where m is a natural number.
Provided is a battery pack capable of preventing a chain of thermal runaway caused by a high-temperature gas generated from an abnormal battery cell during thermal runaway. This battery pack comprises a module that has a plurality of battery cells each provided with a safety valve, a case that accommodates the module, and a heat insulating material that is provided between the module and the case, the battery pack being characterized in that: the heat insulating material includes a first heat insulating sheet, and a second heat insulating sheet laminated on the first heat insulating sheet; the heat insulating material is disposed such that the first heat insulating sheet is positioned on the module side and the second heat insulating sheet is positioned on the case side; a plurality of openings penetrating the second heat insulating sheet are formed in the second heat insulating sheet; the plurality of openings each have a covering piece that covers at least a portion of the opening; the covering pieces are bonded to the first heat insulating sheet and/or the second heat insulating sheet by an adhesive layer; and when the second heat insulating sheet is seen in a perspective plan view, one of the openings is positioned so as to overlap at least a portion of one of the safety valves.
Provided is a battery pack in which the chain of thermal runaway due to high-temperature gas from an abnormal battery cell generated during a thermal runaway can be prevented. The battery pack according to the present invention comprises: a module having a plurality of battery cells each provided with a safety valve; a case accommodating the module; and a heat insulating material provided between the module and the case. The battery pack is characterized in that: the heat insulating material includes a first heat insulating sheet; the first heat insulating sheet has a plurality of openings formed through the first heat insulating sheet; a cover piece is disposed at each of the plurality of openings, the cover piece covering at least a part of the opening; the cover piece is bonded to the first heat insulating sheet by an adhesive; and when the first heat insulating sheet is viewed in a planar transparent view, one of the openings is positioned so as to overlap at least a part of one of the safety valves.
A method for producing a heat transfer suppression sheet contains processing a mixture containing an inorganic particle, a binder fiber having a core-sheath structure, and a hot melt powder into a sheet. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion and a melting point of a third organic material constituting the hot melt powder.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
This mat material comprises: a laminated mat in which a plurality of mats including inorganic fibers and each having a rectangular shape in a plan view are laminated; and a fixing member for fixing the laminated mat. The mat material is characterized in that: the plurality of mats include a first mat and a second mat; and, regarding a sagging amount measured through a sagging test by laminating and fixing two mats of the same type, the sagging amount of the first mat is larger than the sagging amount of the second mat, and the sagging amount of the mat material measured with the second mat below and the first mat up is 60 mm or less.
B32B 5/06 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer needled to another layer, e.g. of fibres, of paper
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
0
A mat material including: inorganic fibers; and multiple entanglement points formed by needling at least one of a front surface or a back surface of the mat material, wherein a density p of the entanglement points is in a range of 0.5 pcs/cm2≤ρ<18 pcs/cm2, at least one of a 4 mm×4 mm first region without the entanglement points or a 3 mm×8 mm second region without the entanglement points is arranged in a 25 mm×25 mm region, and the mat material contains an inorganic binder and has a shear modulus of 0.20 or more and a post-firing surface pressure of 50 kPa or more.
D04H 1/488 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres in combination with at least one other method of consolidation in combination with bonding agents
D04H 1/587 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives characterised by the bonding agents used
An electronic component mounting substrate includes an electronic component, a printed wiring board that mounts the electronic component thereon, and a cover that accommodates and seals the electronic component mounted on the printed wiring board. The cover has an upper portion and a support portion supporting the upper portion such that the upper portion has a thickness of 2 mm or more, and the printed wiring board includes an upper build-up part and a lower build-up part such that the upper build-up part mounts the electronic component thereon and includes an uppermost resin insulating layer not containing a reinforcing material and that the lower build-up part includes a lowermost resin insulating layer including a reinforcing material.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
The purpose of the present invention is to provide a sustained release plant activator from which an appropriate elution amount of an active component is eluted. This plant activator contains plant charcoal and at least one compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof. The compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof, is held in the plant charcoal. This plant activator contains a particle-like carbide, a binder resin, and at least one compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof. The compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof, is held in the particle-like carbide.
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01G 7/06 - Treatment of growing trees or plants, e.g. for preventing decay of wood, for tingeing flowers or wood, for prolonging the life of plants
A01N 25/08 - Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of applicationSubstances for reducing the noxious effect of the active ingredients to organisms other than pests containing solids as carriers or diluents
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A heat transfer suppression sheet contains a first inorganic fiber having a glass transition point of 800° C. or lower and/or a first inorganic particle having a glass transition point of 800° C. or lower; a second inorganic fiber having a glass transition point of 1000° C. or higher; a second inorganic particle having a glass transition point of 1000° C. or higher; and an organic binder.
A method for producing a heat transfer suppression sheet contains processing a mixture into a sheet by a dry method, the mixture containing an inorganic particle and a binder fiber having a core-sheath structure. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion.
A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.
A heat insulation sheet contains a first inorganic particle, a second inorganic particle composed of a nanoparticle, and an inorganic fiber. A total content of the first inorganic particle and the second inorganic particle is 30 mass % or more and 90 mass % or less with respect to a total mass of the heat insulation sheet, D50 is 1 μm or more and 100 μm or less, and a ratio (D90/D10) is 10 or more and 1000 or less in a volume-based cumulative distribution of the first inorganic particle.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
A heat transfer suppression sheet contains inorganic particles, and an organic fiber. At least a part of the organic fiber has a branched structure containing a base portion and branch portions extending from the base portion in at least three directions. The base portion may be a fused portion in which a plurality of the organic fibers are fused with each other. The heat transfer suppression sheet may have a plurality of empty holes.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
H01M 10/6555 - Rods or plates arranged between the cells
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer and including organic material, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the adhesive layer on the conductor layer formed on the insulating layer. The resin insulating layer includes resin and inorganic particles dispersed in the resin, and the adhesive layer has a smooth film part and a protruding part including protrusions protruding from the smooth film part such that a number of the inorganic particles in spaces between the protrusions with respect to a predetermined area is smaller than a number of the inorganic particles outside the spaces between the protrusions with respect to the predetermined area.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
84.
BATTERY PACK, STRUCTURE, AND METHOD FOR MANUFACTURING MICA PLATE
Provided is a battery pack with a mica plate that is resistant to damage and is lightweight. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case for accommodating the module, and a mica plate disposed between the module and the case and having a first main surface and a second main surface facing the first main surface, characterized in that: the battery pack further includes a fixing member for fixing the mica plate; the mica plate has a first fixing member hole part formed therein penetrating from the first main surface to the second main surface; the module and/or the case has a second fixing member hole part formed therein; the fixing member includes a head part and a body part connected to the head part; the fixing member fixes the mica plate with the body part passing through the first fixing member hole part and inserted into the second fixing member hole part; in a planar transparent view of the mica plate, the head part covers at least a part of the contour of the first fixing member hole part and overlaps the mica plate; and an area S1 of the portion where the head part and the mica plate overlap is 5.8 × 10-6 times or more of an area S2 of the mica plate.
Provided is a battery pack comprising a lightweight mica plate that is unlikely to be broken. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case accommodating the module, and a mica plate disposed between the module and the case and having a first main surface and a second main surface facing the first main surface. The battery pack is characterized by further including a fixing member for fixing the mica plate and by that a first hole for the fixing member that penetrates from the first main surface to the second main surface is formed in the mica plate, a connection member having a second hole for the fixing member is provided in the module and/or the case, the fixing member has a head part and a body part connected to the head part, the head part of the fixing member is positioned on the first main surface side of the mica plate, the body part of the fixing member passes through the first hole for the fixing member and is inserted into the second hole for the fixing member to fix the mica plate, the head part covers at least a part of the contour of the first hole for the fixing member and overlaps with the mica plate when the mica plate is viewed in a plan view, and the area S1 of the portion where the head part and the mica plate overlap is 5.8 × 10-6 times or more of the area S2 of the mica plate.
Provided is a battery pack with a mica plate which is resistant to damage and is lightweight. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case that houses the module, and a mica plate that is disposed between the module and the case and has a first main surface and a second main surface facing the first main surface, the battery pack being characterized in that: the battery pack further includes an adhesive member that is disposed on a surface of the mica plate and fixes the mica plate; and, in a planar view of the mica plate, an area S1 of the adhesive member is 5.8 × 10-6 times or more of an area S2 of the mica plate.
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 10/647 - Prismatic or flat cells, e.g. pouch cells
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/209 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
An inorganic fiber mat is produced by a method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat, a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated 10 inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
D04H 1/46 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
D21B 1/32 - Defibrating by other means of waste paper
Provided is a composite member which exhibits excellent heat resistance in addition to excellent insulating properties, which does not require a winding operation that is necessary in the case of a ceramic tape, which does not have problems such as uneven winding, gap generation, and separation, and which can be easily suited to a conductive base material that has a complicated shape. This composite member (1) has a base material (2), and an insulating coating film (3) that covers at least a part of the surface of the base material (2) and has a film thickness of 150 μm or more. The insulating coating film (3) has a matrix (10) that contains a compound having a siloxane bond, and an inorganic material (20) that is dispersed in the matrix (10). If a cross-section of the insulating coating film (3), the cross-section being parallel to the film thickness direction, is observed, the ratio (P1/P2) of the porosity P1 in a region R1 in the range from the interface with the base material (2) to 100 μm to the porosity P2 in a region R2 in the range from the surface of the insulating coating film (3) to 100 μm is 0.3 to 3.0 inclusive. The regions R1 and R2 are each 75 μm in the film thickness direction and 300 μm in a direction that is orthogonal to the film thickness.
H01B 3/00 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
To provide a method for producing a composite member, with which it is possible to easily form an insulating film having sufficient strength for a base material of a complex shape, tightly adhering to a base material without peeling even when heated at a high temperature, and having excellent insulation property and heat resistance, without needing to wrap a tape or the like and without problems such as uneven winding, gaps, or peeling. A method for producing a composite member (1) having a base material (2) and an insulating film (3) that covers at least a part of the surface of the base material (2), the method comprising: a coating step for applying a first coating material containing a material of a matrix (10) containing a compound having a siloxane bond, and an inorganic material (20) to at least a part of the surface of the base material (2); and a first coating material curing step for curing the first coating material. An insulating film containing a first layer (11) and a second layer (12) is formed by repeating at least the coating step multiple times.
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
B05D 1/36 - Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
C09D 5/25 - Electrically-insulating paints or lacquers
H01B 3/46 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes silicones
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
The present invention provides a composite member which is excellent in terms of heat resistance, and is particularly excellent in terms of insulation properties, and which does not require winding work that is necessary for a ceramic tape and can be easily suited to a complicated shape without causing winding unevenness or a gap. This composite member is able to maintain excellent insulation properties and excellent heat resistance even if heated at high temperatures. This composite member (1) has a base material (2) and an insulating coating film (3) that covers at least a part of the surface of the base material (2). The insulating coating film (3) is obtained by alternately stacking a plurality of first coating films (11) and a plurality of second coating films (12) in this order from the base material (2) side. The first coating films (11) each have a matrix (10) that contains a compound having a siloxane bond, and an inorganic material (20) that is dispersed in the matrix (10). The second coating films are formed of the material of the matrix (10).
H01B 3/00 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
Provided is a composite member which does not require winding work, can easily handle complex shapes, can suppress the occurrence of burning and peeling of an insulating film even when heated at high temperatures, and can maintain excellent insulation and heat resistance. A composite member (1) has a metal base material (2) and an insulating coating (3) that covers at least a portion of the surface of the base material (2). The insulating coating (3) has: a matrix (10) containing a compound with a siloxane bond; and an inorganic material (20) dispersed in the matrix. At normal temperature, the base material (2) and the insulation coating (3) are in contact with each other. When heated to a temperature equal to or higher than the oxidation initiation temperature of the metal constituting the base material (2), an adhesive layer (8) is formed between the base material (2) and the insulation coating (3). The adhesive layer (8) has a metal element included in the base material (2), a metal oxide of a metal element, an inorganic material (20), and at least one selected from silicone and silica.
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
In an optical waveguide (1) according to an embodiment, a lower cladding (21), a core (3), and an upper cladding (22) are stacked in this order, and a part of the core (3) on the side where an optical signal is incident and a part of the core (3) on the side where the optical signal is emitted are exposed. The optical waveguide (1) comprises an upper cladding non-formation region (1a) and an upper cladding formation region (1b). The upper cladding non-formation region (1a) has a core-exposed portion (3a) in which an upper surface (31) of the core (3) is exposed at at least one end (11) of the optical waveguide (1). The upper cladding formation region (1b) has a core-unexposed portion (3b) in which the upper surface (31) of the core (3) is not exposed. The width (W1) of the core (3) of the core-exposed portion (3a) and the width (W2) of the core (3) of the core-unexposed portion (3b) satisfy the relationship of W1 > W2.
Provided is a heat transfer suppression sheet that is capable of effectively suppressing heat transfer of high heat from a battery cell in which thermal runaway has occurred, and is excellent in adapting to battery cell expansion and contraction. Also provided is a highly safe battery pack comprising said heat transfer suppression sheet. In the heat transfer suppression sheet (1), an insulating layer (10) and heat conduction layers (30) are laminated with organic elastic layers (20) interposed therebetween. A heat transfer suppression sheet (60) with a pedestal is formed by providing, in an integrated manner on one surface or both surfaces of the heat transfer suppression sheet (1), a battery cell pedestal (70) made of an insulating material on which battery cells (40) are to be placed. In a battery pack (100), a plurality of battery cells (40) have the heat conduction layers (30) of the heat transfer suppression sheet (1) interposed therebetween so at to be in contact with main surfaces of the battery cells (40), and the battery cells (40) are connected in series or in parallel. In the battery pack (100), the battery cells (40) are placed on the battery cell pedestal (70) of the heat transfer suppression sheet (60) with a pedestal.
Provided is a heat transfer suppression sheet capable of maintaining a heat transfer suppression effect even when a resin substrate is burned out by high heat or flame from a battery cell-caused thermal runaway. Also, provided is a battery pack having higher safety, capable of maintaining a heat transfer suppression effect even when a resin substrate is burned out by high heat or flame from a thermal runaway battery cell. A heat transfer suppression sheet (1) includes a resin substrate (10), first inorganic particles (20), and second inorganic particles (30) having a melting point lower than that of the first inorganic particles (20). A heat transfer suppression member (60) has a heat insulation layer (50) on the surface of the heat transfer suppression sheet (1). A battery pack (100) comprises the heat transfer suppression sheet (1) or the heat transfer suppression member (60) interposed between battery cells (110), wherein the battery cells (110) are connected in series or in parallel.
A wiring substrate includes an insulating layer having through holes, a first conductor layer, a second conductor layer, interlayer conductors formed in the through holes. The interlayer conductors are connecting the first and second conductor layers and include first interlayer conductors formed in first region of the insulating layer and second interlayer conductors formed in second region of the insulating layer at density higher than density of the first interlayer conductors formed in the first region. A thickness of each first interlayer conductor is larger than a thickness of each second interlayer conductor. The insulating layer is formed such that the through holes includes first through holes having the first interlayer conductors formed therein and second through holes having the second interlayer conductors formed therein and that an inner diameter of each of the first through holes is larger than an inner diameter of each of the second through holes.
A printed wiring board includes an uppermost resin insulating layer, an uppermost conductor layer, a solder resist layer, a dam conductor connected to the upper most conductor layer, and a metal dam formed on and connected to the dam conductor. The uppermost conductor layer includes electrodes and a conductor circuit that are positioned to mount an electronic component in a mounting area in the solder resist layer. The metal dam is surrounding the mounting area. The solder resist layer has first openings reaching to the electrodes of the uppermost conductor layer and a second opening reaching to the conductor circuit of the uppermost conductor layer. The dam conductor is formed in the second opening of the solder resist layer. The conductor circuit in the uppermost conductor layer is a ground circuit or power supply circuit such that the conductor circuit is connected to the metal dam via the dam conductor.
Provided is a flameproof sheet composed of a combination of a heat insulating material and an elastic body, in which there is no problem of powder falling from the heat insulating material, the elastic body is hardly broken, a hole is hardly opened, and the elastic body can be made thin. The flameproof sheet (1) has a heat insulating sheet (50), and an elastic coating (60) comprising a foam of a thermosetting resin. The elastic coating (60) covers the entire heat insulating sheet (50) without having a joint part.
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A heat transfer suppression sheet contains a first organic fiber having no glass transition point at a temperature lower than 120° C., a first inorganic particle, and a resin binder. The first organic fiber may be a crystalline organic fiber having a glass transition point of 120° C. or higher and/or an organic fiber having no glass transition point.
H01M 50/24 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A heat transfer suppression sheet contains a fiber component and a particle component. A main component of a first inorganic fiber contained in the fiber component is the same kind as a main component of a first inorganic particle contained in the particle component, and a content of the main component of the first inorganic particle is larger than a content of the main component of the first inorganic fiber.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
100.
PLATE-SHAPED HEAT INSULATOR, COMBUSTION CHAMBER, BOILER AND WATER HEATER
A plate-shaped heat insulator including a plate-shaped papermaking product containing inorganic fibers, and one or more grooves in at least one of its surfaces. The plate-shaped heat insulator is intended to be disposed in a combustion chamber.
F23M 5/02 - CasingsLiningsWalls characterised by the shape of the bricks or blocks used
F22B 21/34 - Water-tube boilers of vertical or steeply-inclined type, i.e. the water-tube sets being arranged vertically or substantially vertically built-up from water tubes grouped in panel form surrounding the combustion chamber, i.e. radiation boilers
F24H 1/00 - Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
