Sulfur Chemical Institute Inc.

Japan

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C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond 2
C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers 2
B32B 15/00 - Layered products essentially comprising metal 1
B32B 15/06 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of rubber 1
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance 1
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Found results for  patents

1.

BONDED OBJECT COMPRISING ADHEREND MATERIAL AND PEROXIDE-CONTAINING POLYMERIC MATERIAL, AND PROCESS FOR PRODUCING SAME

      
Application Number JP2011078174
Publication Number 2012/077676
Status In Force
Filing Date 2011-12-06
Publication Date 2012-06-14
Owner
  • ASAHI RUBBER INC. (Japan)
  • SULFUR CHEMICAL INSTITUTE INC. (Japan)
Inventor
  • Mori, Kunio
  • Matsuno, Yusuke
  • Mori, Katsuhito
  • Kudo, Takahiro

Abstract

Provided is a bonded object in which an adherend material such as an inorganic material or organic polymeric material and a peroxide-containing polymeric material have been tenaciously bonded to each other regardless of the material of each member and without requiring the use of an adhesive and which is excellent in terms of light resistance, weatherability, heat resistance, chemical resistance, water resistance, and durability, does not alter even when the environment changes, and is chemically and mechanically stable. The bonded object comprises: an adherend material which is either at least any inorganic material selected from metallic materials and ceramic materials or an organic polymeric material and which has a binder containing a copolymerizable surface improver represented by chemical formula (1), X-Y-Si-(CH3)a(OR)3-a (1) the binder having been applied to the surface of the adherend material or having been applied thereto and bonded and/or adsorbed thereto; and a peroxide-containing polymeric material bonded to the adherend material through the copolymerizable surface improver.

IPC Classes  ?

  • C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
  • B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
  • B32B 15/00 - Layered products essentially comprising metal
  • C09J 11/06 - Non-macromolecular additives organic

2.

PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM

      
Application Number JP2011072559
Publication Number 2012/046651
Status In Force
Filing Date 2011-09-30
Publication Date 2012-04-12
Owner
  • Sulfur Chemical Institute Incorporated (Japan)
  • Meiko Electronics Co., Ltd. (Japan)
Inventor
  • Mori Kunio
  • Matsuno Yusuke
  • Mori Katsuhito
  • Kudo Takahiro
  • Michiwaki Shigeru
  • Miyawaki Manabu

Abstract

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

IPC Classes  ?

  • C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
  • C25D 5/34 - Pretreatment of metallic surfaces to be electroplated
  • C25D 5/56 - Electroplating of non-metallic surfaces of plastics

3.

BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND

      
Application Number JP2011072185
Publication Number 2012/043631
Status In Force
Filing Date 2011-09-28
Publication Date 2012-04-05
Owner SULFUR CHEMICAL INSTITUTE INCORPORATED (Japan)
Inventor
  • Mori Kunio
  • Matsuno Yusuke
  • Mori Katsuhito
  • Kudo Takahiro

Abstract

[Problem] To provide a technique by which an -OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

IPC Classes  ?

  • C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
  • C07F 7/18 - Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
  • C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
  • C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
  • C09J 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
  • C09J 183/14 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon onlyAdhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
  • C09J 185/00 - Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonAdhesives based on derivatives of such polymers

4.

BONDED OBJECT OF THREE-DIMENSIONAL SILICONE RUBBER

      
Application Number JP2009066098
Publication Number 2010/032728
Status In Force
Filing Date 2009-09-15
Publication Date 2010-03-25
Owner
  • ASAHI RUBBER INC. (Japan)
  • SULFUR CHEMICAL INSTITUTE INC. (Japan)
Inventor
  • Mori, Kunio
  • Takagi, Kazuhisa

Abstract

A simple silicone-rubber bonded object is provided in which nonflowable substrates, i.e., a three-dimensional elastic silicone rubber substrate molded beforehand and an adherend substrate, were able to be tenaciously bonded to each other without using a flowable curable adhesive or pressure-sensitive adhesive and which is inexpensive and has high productivity. The silicone-rubber bonded object (1) comprises a three-dimensional elastic silicone rubber substrate (11a) having hydroxy groups on the surface and an adherend substrate (12a) having hydroxy groups on the surface, the substrates having been laminated to each other by covalent bonding between the hydroxy groups of both.  The elastic substrate (11a) and/or the adherend substrate (12a) has undergone corona discharge treatment and/or plasma treatment, whereby the hydroxy groups have been formed on the surface thereof.

IPC Classes  ?

  • B32B 25/20 - Layered products essentially comprising natural or synthetic rubber comprising silicone rubber
  • C08J 5/12 - Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
  • C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
  • C09J 5/02 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
  • C09J 183/04 - Polysiloxanes

5.

LAMINATED BODY AND CIRCUIT WIRING BOARD

      
Application Number JP2009060266
Publication Number 2009/154083
Status In Force
Filing Date 2009-06-04
Publication Date 2009-12-23
Owner SULFUR CHEMICAL INSTITUTE INCORPORATED (Japan)
Inventor
  • Mori, Kunio
  • Matsuno, Yusuke

Abstract

Provided is a laminated body which solves, all at once, the issues of conventional methods, such as adhesiveness to a board having low surface roughness, stress concentration relaxing, reliability improvement, high adhesiveness (especially, that of a conductor layer), heat resistance, almighty characteristics (being adherable irrespective of the type of an adhesive), in manufacture of laminated bodies.  The laminated body is formed by having an entropically elastic molecular adhesive layer between two boards, and the entropically elastic molecular adhesive layer is composed of an entropically elastic material layer, and a layer of a molecular adhesive having a group which can be bonded to the entropically elastic material layer.

IPC Classes  ?

  • B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
  • B32B 15/06 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of rubber
  • B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
  • C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
  • C09J 121/02 - Latex