The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated.
Various inventions are disclosed in the microchip manufacturing arts. Conductive pattern formation by semi-additive processes are disclosed. Further conductive patterns and methods using activated precursors are also disclosed. Aluminum laminated surfaces and methods of circuit formation therefrom are further disclosed. Circuits formed on an aluminum heat sink are also disclosed. The inventive subject matter further discloses methods of electrolytic plating by controlling surface area of an anode.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C25D 5/02 - Electroplating of selected surface areas
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C25D 5/48 - After-treatment of electroplated surfaces
Methods and devices are contemplated incorporating both high resistance conductive materials (HRCM) and conductors. A HRCM is deposited on a conductor, such that the surface between the HRCM and the conductor is relatively smooth. A dielectric material is then deposited onto an exposed surface of the HRCM. The surface of the HRCM meeting the dielectric material is roughed or otherwise impressed such that it has a Ra of at least 5 μm. The ratio of resistivity between the HRCM and the conductor is at least 50:1 or 100:1, and the ratio of conductivity between the conductive material and the resistive material is at least 9:1, 19:1, or 99:1.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
5.
METHODS AND DEVICES FOR HIGH RESISTANCE AND LOW RESISTANCE CONDUCTOR LAYERS MITIGATING SKIN DEPTH LOSS
Methods and devices are contemplated incorporating both high resistance conductive materials (HRCM) and conductors. A HRCM is deposited on a conductor, such that the surface between the HRCM and the conductor is relatively smooth. A dielectric material is then deposited onto an exposed surface of the HRCM. The surface of the HRCM meeting the dielectric material is roughed or otherwise impressed such that it has a Ra of at least 5µm. The ratio of resistivity between the HRCM and the conductor is at least 50:1 or 100:1, and the ratio of conductivity between the conductive material and the resistive material is at least 9:1, 19:1, or 99:1.
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
Methods, systems, and apparatus for coating the internal surface of nano-scale cavities on a substrate are contemplated. A first fluid of high wettability is applied to the nano-scale cavity, filling the cavity. A second fluid carrying a conductor or a catalyst is applied over the opening of the nano-scale cavity. The second fluid has a lower vapor pressure than the first fluid. The first fluid is converted to a gas, for example by heating the substrate. The gas exits the nano-scale cavity, creating a negative pressure or vacuum in the nano-scale cavity. The negative pressure draws the second fluid into the nano-scale cavity. The conductor is deposited on the interior surface of the nano-scale cavity, preferably less than 10 nm thick.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 14/04 - Coating on selected surface areas, e.g. using masks
Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.
Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.
Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.
Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1m, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500m thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin there between or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
01 - Chemical and biological materials for industrial, scientific and agricultural use
42 - Scientific, technological and industrial services, research and design
Goods & Services
Chemical compositions for use in the manufacture of electronics Development of technologies in the nature of chemicals for the fabrication of electric and electronic circuits
Various inventions are disclosed in the microchip manufacturing arts. Conductive pattern formation by semi-additive processes are disclosed. Further conductive patterns and methods using activated precursors are also disclosed. Aluminum laminated surfaces and methods of circuit formation therefrom are further disclosed. Circuits formed on an aluminum heat sink are also disclosed. The inventive subject mater further discloses methods of electrolytic plating by controlling surface area of an anode.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C25D 5/48 - After-treatment of electroplated surfaces
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C25D 5/02 - Electroplating of selected surface areas
Methods, systems, and apparatus for coating the internal surface of nano-scale cavities on a substrate are contemplated. A first fluid of high wettability is applied to the nano-scale cavity, filling the cavity. A second fluid carrying a conductor or a catalyst is applied over the opening of the nano-scale cavity. The second fluid has a lower vapor pressure than the first fluid. The first fluid is converted to a gas, for example by heating the substrate. The gas exits the nano-scale cavity, creating a negative pressure or vacuum in the nano-scale cavity. The negative pressure draws the second fluid into the nano-scale cavity. The conductor is deposited on the interior surface of the nano-scale cavity, preferably less than 10 nm thick.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 14/04 - Coating on selected surface areas, e.g. using masks
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
C23C 16/04 - Coating on selected surface areas, e.g. using masks
Methods, systems, and apparatus for coating the internal surface of nano- scale cavities on a substrate are contemplated. A first fluid of high wettability is applied to the nano-scale cavity, filling the cavity. A second fluid carrying a conductor or a catalyst is applied over the opening of the nano-scale cavity. The second fluid has a lower vapor pressure than the first fluid. The first fluid is vaporized to a gas, for example by heating the substrate. The gas exits the nano-scale cavity, creating a negative pressure or vacuum in the nano-scale cavity. The negative pressure draws the second fluid into the nano-scale cavity. The conductor is deposited on the interior surface of the nano-scale cavity, preferably less than 10nm thick.
C23C 18/06 - Coating on selected surface areas, e.g. using masks
C23C 18/04 - Pretreatment of the material to be coated
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
C25D 5/00 - Electroplating characterised by the processPretreatment or after-treatment of workpieces
C25D 5/02 - Electroplating of selected surface areas
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Methods of patterning electroless metals on a substrate are presented. The substrate is covered by a blocking reagent. After formation of a catalyst blocking layer on the substrate, portions of the catalyst blocking layer are removed to form a circuit pattern. A catalyst is placed the surfaces of both the catalyst blocking layer and the exposed substrate. The catalyst blocking layer prevents or reduces catalytic activity of the catalyst. Electroless metal plating is performed to plate a metal at the active portions of the catalyst.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Methods of patterning electroless metals on a substrate are presented. The substrate is covered by a blocking reagent. After formation of a catalyst blocking layer on the substrate, portions of the catalyst blocking layer are removed to form a circuit pattern. A catalyst is placed the surfaces of both the catalyst blocking layer and the exposed substrate. The catalyst blocking layer prevents or reduces catalytic activity of the catalyst. Electroless metal plating is performed to plate a metal at the active portions of the catalyst.
C23C 18/18 - Pretreatment of the material to be coated
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.
Devices, systems, and methods are contemplated for depositing metals to the surface of a substrate. A first precursor ink including a metal is applied to a surface of the substrate, and the precursor ink is reduced to deposit the metal to the substrate, preferably by thermal reduction, forming a first metal layer. A second precursor ink having a second metal is then applied to the substrate, at least partially over the first metal layer. The second precursor ink is then reduced, typically by chemical reduction, depositing the second metal over the first metal layer in a globular fashion. Precursor inks are also disclosed having an alkyl metal carboxylate, a cyclic amine, and at least one of an ester, a hydrocarbon, or an ether.
Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.
Devices, systems, and methods are contemplated for depositing metals to the surface of a substrate. A first precursor ink including a metal is applied to a surface of the substrate, and the precursor ink is reduced to deposit the metal to the substrate, preferably by thermal reduction, forming a first metal layer. A second precursor ink having a second metal is then applied to the substrate, at least partially over the first metal layer. The second precursor ink is then reduced, typically by chemical reduction, depositing the second metal over the first metal layer in a globular fashion. Precursor inks are also disclosed having an alkyl metal carboxylate, a cyclic amine, and at least one of an ester, a hydrocarbon, or an ether.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
23.
METHOD OF MANUFACTURE FOR EMBEDDED IC CHIP DIRECTLY CONNECTED TO PCB
Methods and systems are contemplated for making portions of electrical circuits with embedded electrical components, and the electrical circuits produced thereby. A layer of dielectric material is deposited over a substrate, and a cavity is formed in the dielectric material. An electrical component (e.g., integrated chip, etc.) is deposited in the cavity and covered by a further dielectric material, embedding the electrical component. Another cavity is formed in the further dielectric material, and a catalyst (e.g., electrolytic deposition catalyst, electroless deposition catalyst, etc.) is deposited over the further dielectric material and at least a portion of the electrical component. A conductor is then plated at the catalyst, preferably contacting the I/O ports of the electrical component.
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
Devices and methods for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
The present invention relates to methods and systems that utilize a catalyst or thin metal film by atomic level deposition (ALD) of one or more metals that allows fine traces deposition to the trench formed in a dielectric material, thereby minimizing potential physical damage due to embedded conductor format and making the fine space between traces to prevent electromigration in the traces.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
26.
Asymmetrical electrolytic plating for a conductive pattern
The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated.
A cable for propagating high frequency signals comprises a first insulated hollow conductor and a second insulated hollow conductor in a braided arrangement to form the cable. The braided arrangement distributes the first and second hollow conductors such that the cable is equalized.
H01B 7/30 - Insulated conductors or cables characterised by their form with arrangements for reducing conductor losses when carrying AC, e.g. due to skin effect
H01B 7/00 - Insulated conductors or cables characterised by their form
H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B05D 7/14 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
29.
Patterning of electroless metals by selective deactivation of catalysts
Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/00 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C23C 18/00 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating
Thin indium-less “optically porous” layers adapted to replace traditional ITO layers are provided herein. A thin metalized film adapted to carry an electrical charge can include a dense pattern of small openings to allow the transmission of light to or from an underlying semiconductor material. The pattern of openings can create a regular or irregular grid pattern of low aspect ratio fine-line metal conductors. Creation of this optically porous metalized film can include the printing of a catalytic precursor material, such as palladium in solution in a pattern on a substrate, drying or curing the catalytic precursor, and the deposition of a thin layer of metal, such as copper on the dried precursor to form the final conductive and optically porous film.
