- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/063 - Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
Patent holdings for IPC class H10N 30/063
Total number of patents in this class: 47
10-year publication summary
|
0
|
0
|
0
|
2
|
2
|
4
|
9
|
4
|
16
|
8
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42288 |
7 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10925 |
3 |
| Magnecomp Corporation | 201 |
3 |
| Murata Manufacturing Co., Ltd. | 24409 |
2 |
| Kyocera Corporation | 13721 |
2 |
| Suncall Corporation | 185 |
2 |
| Taiyo Yuden Co., Ltd. | 1927 |
2 |
| Canon Inc. | 39618 |
1 |
| Seiko Epson Corporation | 19296 |
1 |
| Texas Instruments Incorporated | 19481 |
1 |
| Koninklijke Philips N.V. | 24660 |
1 |
| Sumitomo Chemical Company, Limited | 9027 |
1 |
| Rohm Co., Ltd. | 6414 |
1 |
| Boe Technology Group Co., Ltd. | 40728 |
1 |
| Aker Technology Co., Ltd. | 6 |
1 |
| FUJIFILM SonoSite, Inc. | 432 |
1 |
| The Hong Kong Polytechnic University | 467 |
1 |
| Nanyang Technological University | 1989 |
1 |
| Newsouth Innovations Pty Limited | 591 |
1 |
| PI Ceramic GmbH | 22 |
1 |
| Other owners | 13 |