- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 31/024 - Arrangements for cooling, heating, ventilating or temperature compensation
Patent holdings for IPC class H01L 31/024
Total number of patents in this class: 350
10-year publication summary
|
38
|
57
|
50
|
32
|
36
|
29
|
20
|
11
|
7
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 62279 |
15 |
| Samsung Electronics Co., Ltd. | 154406 |
8 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47518 |
8 |
| ABS Global, Inc. | 136 |
8 |
| Phion Technologies Corp. | 9 |
8 |
| Sony Corporation | 30368 |
7 |
| Canon Inc. | 42406 |
7 |
| Kyocera Corporation | 14280 |
6 |
| Optiz, Inc. | 43 |
6 |
| TDK Taiwan Corp. | 814 |
6 |
| Texas Instruments Incorporated | 19635 |
5 |
| Raytheon Company | 8465 |
5 |
| OSRAM Opto Semiconductors GmbH | 3263 |
5 |
| OSRAM OLED GmbH | 1753 |
5 |
| Pixart Imaging Inc. | 1714 |
5 |
| W&wsens Devices, Inc. | 23 |
5 |
| Microsoft Technology Licensing, LLC | 54243 |
4 |
| Hamamatsu Photonics K.K. | 4613 |
4 |
| Nippon Telegraph and Telephone Corporation | 15961 |
4 |
| Advanced Semiconductor Engineering, Inc. | 1710 |
4 |
| Other owners | 225 |