- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
Patent holdings for IPC class H01L 23/50
Total number of patents in this class: 2158
10-year publication summary
|
155
|
216
|
214
|
179
|
144
|
152
|
131
|
150
|
102
|
23
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
198 |
| Rohm Co., Ltd. | 6740 |
131 |
| Intel Corporation | 46638 |
106 |
| Samsung Electronics Co., Ltd. | 153573 |
73 |
| Mitsubishi Electric Corporation | 47556 |
73 |
| Qualcomm Incorporated | 90109 |
61 |
| Renesas Electronics Corporation | 5871 |
53 |
| International Business Machines Corporation | 62182 |
45 |
| Denso Corporation | 25165 |
43 |
| Texas Instruments Incorporated | 19615 |
39 |
| Boe Technology Group Co., Ltd. | 42901 |
37 |
| Micron Technology, Inc. | 27266 |
33 |
| Murata Manufacturing Co., Ltd. | 25506 |
30 |
| Fuji Electric Co., Ltd. | 5383 |
29 |
| Skyworks Solutions, Inc. | 3884 |
20 |
| SK Hynix Inc. | 12134 |
19 |
| Monolithic 3D Inc. | 329 |
19 |
| Infineon Technologies AG | 8383 |
18 |
| Mediatek Inc. | 5388 |
18 |
| Kioxia Corporation | 10706 |
18 |
| Other owners | 1095 |