- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Patent holdings for IPC class H01L 23/467
Total number of patents in this class: 886
10-year publication summary
|
84
|
95
|
101
|
72
|
89
|
54
|
65
|
50
|
74
|
27
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46751 |
31 |
| Siemens AG | 24547 |
25 |
| International Business Machines Corporation | 61123 |
21 |
| Mitsubishi Electric Corporation | 45860 |
20 |
| BorgWarner US Technologies LLC | 435 |
19 |
| Huawei Technologies Co., Ltd. | 111237 |
15 |
| Microsoft Technology Licensing, LLC | 53545 |
14 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42222 |
12 |
| Google LLC | 41903 |
12 |
| Toyota Motor Corporation | 31565 |
11 |
| Micron Technology, Inc. | 26214 |
10 |
| Fuji Electric Co., Ltd. | 5114 |
10 |
| Frore Systems Inc. | 101 |
10 |
| Samsung Electronics Co., Ltd. | 144426 |
9 |
| Dell Products L.P. | 14134 |
9 |
| Nidec Corporation | 2644 |
9 |
| Apple Inc. | 54527 |
7 |
| General Electric Company | 13830 |
7 |
| Fujitsu Limited | 18362 |
7 |
| Raytheon Company | 8388 |
7 |
| Other owners | 621 |