- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/051 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
Patent holdings for IPC class H01L 23/051
Total number of patents in this class: 232
10-year publication summary
|
27
|
21
|
22
|
27
|
8
|
10
|
12
|
15
|
20
|
7
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Denso Corporation | 24355 |
21 |
| Infineon Technologies AG | 8224 |
15 |
| Hitachi Energy Ltd. | 2235 |
13 |
| ABB Schweiz AG | 6987 |
12 |
| Mitsubishi Electric Corporation | 46197 |
9 |
| Dynex Semiconductor Limited | 66 |
9 |
| Zhuzhou CRRC Times Semiconductor Co., Ltd. | 64 |
9 |
| Toyota Motor Corporation | 32450 |
8 |
| Siemens AG | 24453 |
7 |
| ABB Technology AG | 1254 |
7 |
| SiTime Corporation | 203 |
7 |
| Semiconductor Components Industries, L.L.C. | 5255 |
6 |
| Hyundai Motor Company | 22086 |
5 |
| Fuji Electric Co., Ltd. | 5160 |
5 |
| GE Energy Power Conversion Technology Ltd | 424 |
5 |
| Hitachi Energy Switzerland AG | 303 |
5 |
| Robert Bosch GmbH | 42705 |
3 |
| Infineon Technologies Austria AG | 2153 |
3 |
| Rohm Co., Ltd. | 6471 |
3 |
| Microsemi Corporation | 117 |
3 |
| Other owners | 77 |