- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/52 - Mounting semiconductor bodies in containers
Patent holdings for IPC class H01L 21/52
Total number of patents in this class: 2117
10-year publication summary
|
148
|
157
|
173
|
178
|
164
|
148
|
181
|
166
|
139
|
94
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 46127 |
107 |
| Hitachi Chemical Company, Ltd. | 2346 |
97 |
| Lintec Corporation | 1958 |
74 |
| Shinkawa Ltd. | 428 |
74 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
65 |
| Nitto Denko Corporation | 8241 |
58 |
| Rohm Co., Ltd. | 6459 |
52 |
| The Furukawa Electric Co., Ltd. | 3652 |
48 |
| Fuji Electric Co., Ltd. | 5148 |
43 |
| Sumitomo Bakelite Co., Ltd. | 1499 |
38 |
| Panasonic Corporation | 20099 |
34 |
| Toray Engineering Co., Ltd. | 486 |
34 |
| Samsung Electronics Co., Ltd. | 146346 |
33 |
| Sekisui Chemical Co., Ltd. | 3388 |
33 |
| Showa Denko Materials Co., Ltd. | 624 |
31 |
| Resonac Corporation | 2815 |
31 |
| Hitachi, Ltd. | 15495 |
24 |
| Infineon Technologies AG | 8225 |
23 |
| Mitsubishi Materials Corporation | 2444 |
23 |
| Namics Corporation | 443 |
23 |
| Other owners | 1172 |