- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
Patent holdings for IPC class H01C 1/034
Total number of patents in this class: 62
10-year publication summary
|
3
|
4
|
9
|
7
|
6
|
3
|
3
|
9
|
9
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 25252 |
12 |
| KOA Corporation | 422 |
11 |
| Rohm Co., Ltd. | 6678 |
5 |
| Littelfuse, Inc. | 789 |
4 |
| Panasonic Intellectual Property Management Co., Ltd. | 32983 |
3 |
| Amotech Co., Ltd. | 536 |
2 |
| Nippon Chemi-Con Corporation | 405 |
2 |
| SEMITEC Corporation | 70 |
2 |
| United States of America AS represented by The Administrator of NASA | 454 |
2 |
| Vishay Dale Electronics, LLC | 117 |
2 |
| TDK Electronics AG | 991 |
2 |
| E. I. du Pont de Nemours and Company | 3767 |
1 |
| Texas Instruments Incorporated | 19542 |
1 |
| Denso Corporation | 24983 |
1 |
| Samsung Electro-mechanics Co., Ltd. | 5756 |
1 |
| Epcos AG | 668 |
1 |
| Continental Automotive GmbH | 4676 |
1 |
| Cyntec Co., Ltd. | 262 |
1 |
| Cree, Inc. | 950 |
1 |
| Minco Products, Inc. | 14 |
1 |
| Other owners | 6 |