- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/02 - HousingEnclosingEmbeddingFilling the housing or enclosure
Patent holdings for IPC class H01C 1/02
Total number of patents in this class: 114
10-year publication summary
|
9
|
10
|
11
|
15
|
10
|
11
|
7
|
9
|
9
|
4
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| KOA Corporation | 415 |
10 |
| Vishay Dale Electronics, LLC | 114 |
6 |
| Samsung Electro-mechanics Co., Ltd. | 5475 |
5 |
| Siemens Energy Global GmbH & Co. KG | 2902 |
5 |
| Hamilton Sundstrand Corporation | 4823 |
4 |
| Hubbell Incorporated | 3218 |
4 |
| NR Electric Co., Ltd. | 319 |
3 |
| NR Engineering Co., Ltd | 281 |
3 |
| NR Electric Power Electronics Co., Ltd. | 53 |
3 |
| TDK Electronics AG | 923 |
3 |
| Ford Global Technologies, LLC | 20367 |
2 |
| Murata Manufacturing Co., Ltd. | 24226 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 30769 |
2 |
| Rohm Co., Ltd. | 6412 |
2 |
| Xiamen Set Electronics Co., Ltd | 76 |
2 |
| Eaton Intelligent Power Limited | 5919 |
2 |
| Niterra Co., Ltd. | 1246 |
2 |
| Hitachi Energy Ltd. | 2169 |
2 |
| Micron Technology, Inc. | 26167 |
1 |
| Texas Instruments Incorporated | 19481 |
1 |
| Other owners | 50 |