- All sections
- C - Chemistrymetallurgy
- C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 1/34 - Alkaline compositions for etching copper or alloys thereof
Patent holdings for IPC class C23F 1/34
Total number of patents in this class: 50
10-year publication summary
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3
|
2
|
2
|
1
|
6
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6
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6
|
3
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2
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 155224 |
4 |
| MEC Company Ltd. | 91 |
3 |
| E. I. du Pont de Nemours and Company | 3632 |
2 |
| Texas Instruments Incorporated | 19636 |
2 |
| Tokyo Electron Limited | 13617 |
2 |
| Novellus Systems, Inc. | 458 |
2 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8473 |
2 |
| Atotech Deutschland GmbH | 528 |
2 |
| EKC Technology, Inc. | 81 |
2 |
| Namics Corporation | 478 |
2 |
| Sachem, Inc. | 67 |
2 |
| Tata Steel Ijmuiden B.V. | 320 |
2 |
| POSTECH Research and Business Development Foundation | 1023 |
2 |
| Atotech Deutschland GmbH & Co. KG | 387 |
2 |
| Samsung Display Co., Ltd. | 38092 |
1 |
| International Business Machines Corporation | 62325 |
1 |
| The Boeing Company | 20131 |
1 |
| FUJIFILM Corporation | 30327 |
1 |
| Konica Minolta, Inc. | 9056 |
1 |
| The Board of Trustees of the Leland Stanford Junior University | 6615 |
1 |
| Other owners | 13 |