- All sections
- C - Chemistrymetallurgy
- C23F - Non-mechanical removal of metallic material from surfacesinhibiting corrosion of metallic materialinhibiting incrustation in generalmulti-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 1/18 - Acidic compositions for etching copper or alloys thereof
Patent holdings for IPC class C23F 1/18
Total number of patents in this class: 295
10-year publication summary
|
26
|
22
|
19
|
14
|
17
|
16
|
15
|
12
|
13
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Gas Chemical Company, Inc. | 3599 |
32 |
| MEC Company Ltd. | 91 |
27 |
| Samsung Display Co., Ltd. | 38092 |
15 |
| Atotech Deutschland GmbH | 528 |
13 |
| Adeka Corporation | 1372 |
12 |
| DONGWOO FINE-CHEM Co., Ltd. | 1408 |
11 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8473 |
10 |
| Panasonic Intellectual Property Management Co., Ltd. | 33812 |
9 |
| JX Nippon Mining & Metals Corporation | 1463 |
8 |
| Samsung Electronics Co., Ltd. | 155224 |
5 |
| Kateeva, Inc. | 393 |
5 |
| Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | 3749 |
5 |
| TCL China Star Optoelectronics Technology Co., Ltd. | 2748 |
5 |
| Dongjin Semichem Co., Ltd. | 495 |
4 |
| Adeia Semiconductor Bonding Technologies Inc. | 562 |
4 |
| BASF SE | 21165 |
3 |
| E. I. du Pont de Nemours and Company | 3632 |
3 |
| KITZ Corporation | 211 |
3 |
| Mitsubishi Paper Mills Limited | 227 |
3 |
| Sigma Engineering AB | 4 |
3 |
| Other owners | 115 |