- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 31/10 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to cutting or desurfacing
Patent holdings for IPC class B23K 31/10
Total number of patents in this class: 65
10-year publication summary
5
|
6
|
7
|
10
|
4
|
8
|
6
|
5
|
6
|
7
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Lincoln Global, Inc. | 2159 |
7 |
TRUMPF Werkzeugmaschinen SE + Co. KG | 237 |
6 |
TRUMPF Werkzeugmaschinen GmbH + Co. KG | 548 |
4 |
ArcelorMittal | 2275 |
3 |
JFE Steel Corporation | 6827 |
3 |
Tomologic AB | 22 |
3 |
TensorX, Inc. | 13 |
3 |
Amada Company, Limited | 560 |
2 |
Bystronic Laser AG | 271 |
2 |
Rtx Corporation | 9352 |
2 |
Samsung Display Co., Ltd. | 34595 |
1 |
Komatsu Industries Corporation | 172 |
1 |
Mazda Motor Corporation | 3128 |
1 |
Amada Holdings Co., Ltd. | 280 |
1 |
Berndorf Aktiengesellschaft | 23 |
1 |
Dallan S.p.A. | 73 |
1 |
Disco Corporation | 1851 |
1 |
FANUC Corporation | 6640 |
1 |
Framag Industrieanlagenbau GmbH | 9 |
1 |
General Electric Technology GmbH | 1371 |
1 |
Other owners | 20 |