- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/38 - Removing material by boring or cutting
Patent holdings for IPC class B23K 26/38
Total number of patents in this class: 3517
10-year publication summary
|
241
|
212
|
282
|
310
|
281
|
284
|
263
|
265
|
257
|
217
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 542 |
151 |
| Bystronic Laser AG | 270 |
97 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 252 |
93 |
| Disco Corporation | 1871 |
84 |
| Hamamatsu Photonics K.K. | 4448 |
82 |
| Amada Holdings Co., Ltd. | 277 |
71 |
| Corning Incorporated | 10314 |
68 |
| Amada Company, Limited | 569 |
68 |
| Mitsubishi Electric Corporation | 46449 |
54 |
| Samsung Display Co., Ltd. | 35269 |
51 |
| Asahi Glass Company, Limited | 2760 |
38 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
38 |
| FANUC Corporation | 6771 |
34 |
| Electro Scientific Industries, Inc. | 368 |
32 |
| Nippon Electric Glass Co., Ltd. | 2470 |
31 |
| Precitec GmbH & Co. KG | 196 |
29 |
| LG Energy Solution, Ltd. | 15346 |
26 |
| IPG Photonics Corporation | 540 |
25 |
| Mitsubishi Heavy Industries, Ltd. | 8787 |
24 |
| Nitto Denko Corporation | 8295 |
24 |
| Other owners | 2397 |