- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/146 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor the fluid stream containing a liquid
Patent holdings for IPC class B23K 26/146
Total number of patents in this class: 221
10-year publication summary
|
29
|
24
|
31
|
41
|
20
|
23
|
24
|
8
|
11
|
19
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Synova SA | 56 |
34 |
| Insera Therapeutics, Inc. | 71 |
16 |
| Makino Milling Machine Co., Ltd. | 416 |
13 |
| Rtx Corporation | 9429 |
12 |
| Avonisys AG | 17 |
9 |
| Disco Corporation | 1868 |
7 |
| Foro Energy, Inc. | 106 |
6 |
| Subaru Corporation | 3570 |
5 |
| Mitsubishi Electric Corporation | 46346 |
4 |
| Saudi Arabian Oil Company | 13316 |
4 |
| 3D-Micromac AG | 51 |
3 |
| Jiangsu University | 1107 |
3 |
| LSP Technologies, Inc. | 25 |
3 |
| Sugino Machine Limited | 178 |
3 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 542 |
3 |
| GE Infrastructure Technology, LLC | 6247 |
3 |
| Harbin Welding Institute Limited Company | 31 |
3 |
| Samsung Electronics Co., Ltd. | 147334 |
2 |
| Samsung Display Co., Ltd. | 35100 |
2 |
| Toshiba Corporation | 12397 |
2 |
| Other owners | 84 |