- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Patent holdings for IPC class B23K 26/082
Total number of patents in this class: 2060
10-year publication summary
|
154
|
210
|
214
|
215
|
239
|
213
|
204
|
221
|
199
|
28
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Panasonic Intellectual Property Management Co., Ltd. | 33120 |
55 |
| FANUC Corporation | 6981 |
48 |
| IPG Photonics Corporation | 569 |
39 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
38 |
| Seurat Technologies, Inc. | 164 |
37 |
| Toyota Motor Corporation | 34094 |
35 |
| Samsung Display Co., Ltd. | 37396 |
32 |
| Nikon Corporation | 7266 |
31 |
| General Electric Company | 13789 |
30 |
| Disco Corporation | 1919 |
30 |
| Etxe-tar, S.A. | 61 |
24 |
| Electro Scientific Industries, Inc. | 365 |
23 |
| Mitsubishi Electric Corporation | 47416 |
22 |
| Precitec GmbH & Co. KG | 198 |
21 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6114 |
21 |
| Mitsubishi Heavy Industries, Ltd. | 8976 |
20 |
| Amada Company, Limited | 595 |
19 |
| LG Energy Solution, Ltd. | 16862 |
18 |
| Amada Holdings Co., Ltd. | 276 |
17 |
| Hamamatsu Photonics K.K. | 4581 |
16 |
| Other owners | 1484 |