- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 101/42 - Printed circuits
Patent holdings for IPC class B23K 101/42
Total number of patents in this class: 696
10-year publication summary
|
61
|
92
|
91
|
66
|
62
|
50
|
44
|
41
|
42
|
33
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 684 |
57 |
| Illinois Tool Works Inc. | 11485 |
30 |
| Jiaxing Super Lighting Electric Appliance Co., Ltd | 401 |
19 |
| International Business Machines Corporation | 61344 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 31598 |
15 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
14 |
| Murata Manufacturing Co., Ltd. | 24621 |
13 |
| Fuji Corporation | 3378 |
12 |
| Alpha Assembly Solutions Inc. | 203 |
10 |
| Kulicke and Soffa Industries, Inc. | 304 |
10 |
| ERSA GmbH | 98 |
9 |
| Mitsubishi Materials Corporation | 2447 |
9 |
| PAC Tech - Packaging Technologies GmbH | 95 |
9 |
| Tamura Corporation | 358 |
9 |
| Samsung Electronics Co., Ltd. | 147003 |
8 |
| Intel Corporation | 47051 |
8 |
| KEMET Electronics Corporation | 332 |
8 |
| Fujitsu Ten Limited | 454 |
6 |
| Denso Corporation | 24372 |
6 |
| Fuji Electric Co., Ltd. | 5162 |
6 |
| Other owners | 422 |