- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/005 - Soldering by means of radiant energy
Patent holdings for IPC class B23K 1/005
Total number of patents in this class: 527
10-year publication summary
|
44
|
47
|
40
|
40
|
48
|
44
|
32
|
41
|
38
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| PAC Tech - Packaging Technologies GmbH | 100 |
31 |
| Honda Motor Co., Ltd. | 26034 |
11 |
| Samsung Electronics Co., Ltd. | 157946 |
9 |
| Alpha Assembly Solutions Inc. | 211 |
8 |
| KEMET Electronics Corporation | 320 |
8 |
| Rolls-Royce Corporation | 1677 |
8 |
| Laserssel Co., Ltd. | 19 |
8 |
| Siemens Energy, Inc. | 1684 |
7 |
| K.K. Sun Metalon | 29 |
7 |
| Seagate Technology LLC | 3958 |
6 |
| Hyundai Motor Company | 24703 |
6 |
| Delta Electronics, Inc. | 2830 |
6 |
| FANUC Corporation | 7235 |
6 |
| JPMorgan Chase Bank, National Association | 8958 |
5 |
| Laservall Technology Co., Ltd | 10 |
5 |
| Pratt & Whitney Canada Corp. | 5506 |
4 |
| Mitsubishi Electric Corporation | 48048 |
4 |
| Kia Motors Corporation | 7718 |
4 |
| Audi AG | 7561 |
4 |
| Disco Corporation | 1956 |
4 |
| Other owners | 376 |