- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/005 - Soldering by means of radiant energy
Patent holdings for IPC class B23K 1/005
Total number of patents in this class: 529
10-year publication summary
|
44
|
47
|
40
|
40
|
48
|
44
|
32
|
41
|
38
|
11
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| PAC Tech - Packaging Technologies GmbH | 99 |
31 |
| Honda Motor Co., Ltd. | 26657 |
11 |
| Samsung Electronics Co., Ltd. | 159473 |
9 |
| Alpha Assembly Solutions Inc. | 212 |
8 |
| KEMET Electronics Corporation | 319 |
8 |
| Rolls-Royce Corporation | 1685 |
8 |
| Laserssel Co., Ltd. | 19 |
8 |
| Siemens Energy, Inc. | 1676 |
7 |
| K.K. Sun Metalon | 29 |
7 |
| Seagate Technology LLC | 3970 |
6 |
| Hyundai Motor Company | 25119 |
6 |
| Delta Electronics, Inc. | 2872 |
6 |
| FANUC Corporation | 7421 |
6 |
| Laservall Technology Co., Ltd | 13 |
6 |
| JPMorgan Chase Bank, National Association | 8973 |
5 |
| Pratt & Whitney Canada Corp. | 5594 |
4 |
| Mitsubishi Electric Corporation | 48460 |
4 |
| Kia Motors Corporation | 7713 |
4 |
| Audi AG | 7590 |
4 |
| Disco Corporation | 1965 |
4 |
| Other owners | 377 |