- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/00 - Soldering, e.g. brazing, or unsoldering
Patent holdings for IPC class B23K 1/00
Total number of patents in this class: 3520
10-year publication summary
389
|
383
|
340
|
298
|
277
|
235
|
259
|
200
|
179
|
111
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Senju Metal Industry Co., Ltd. | 680 |
91 |
GE Infrastructure Technology, LLC | 6222 |
73 |
UACJ Corporation | 695 |
61 |
International Business Machines Corporation | 61228 |
52 |
Mitsubishi Electric Corporation | 46093 |
52 |
Rtx Corporation | 9376 |
52 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42704 |
47 |
LG Electronics Inc. | 73021 |
44 |
Denso Corporation | 24282 |
43 |
Siemens Energy, Inc. | 1688 |
42 |
Siemens AG | 24484 |
41 |
Illinois Tool Works Inc. | 11470 |
40 |
Murata Manufacturing Co., Ltd. | 24526 |
40 |
Daikin Industries, Ltd. | 9995 |
35 |
Mitsubishi Materials Corporation | 2443 |
35 |
Panasonic Intellectual Property Management Co., Ltd. | 31375 |
34 |
Samsung Electronics Co., Ltd. | 146092 |
30 |
Rolls-Royce Corporation | 1736 |
30 |
Fuji Electric Co., Ltd. | 5140 |
24 |
Alfa Laval Corporate AB | 1311 |
23 |
Other owners | 2631 |