Absolics Inc.

États‑Unis d’Amérique


Commandez votre montre hebdomadaire Absolics Inc.
Quantité totale PI 64
Rang # Quantité totale PI 21 593
Note d'activité PI 2,8/5.0    77
Rang # Activité PI 8 966
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

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Dernier brevet 2025 - Manufacturing method for packagi...
Premier brevet 2019 - Semiconductor device having a gl...
Dernière marque 2025 - ABSOLICS
Première marque 2022 - InProut

Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 P/S Printed circuit boards; Electronic circuit boards; Electronic integrated circuits; Integrated cir...
P/S Components for electric circuits in the nature of electric circuit boards, electric circuit close...
2024 Invention Method of manufacturing substrate including packaging substrate. Disclosed is a method of manufa...
Invention Manufacturing method for packaging substrate. A manufacturing method for a packaging substrate i...
Invention Packaging substrate and manufacturing method thereof. A packaging substrate and a manufacturing ...
Invention Plate shaped substrate and packaging substrate. A substrate and a packaging substrate are provid...
Invention Packaging substrate and method for manufacturing same. A packaging substrate includes a glass su...
Invention Packaging substrate and manufacturing method of packaging substrate. The present disclosure rela...
Invention Manufacturing method for a packaging substrate. A method of manufacturing a packaging substrate ...
Invention Packaging substrate and manufacturing method of packaging substrate. An embodiment relates to a ...
Invention Packaging substrate and semiconductor package comprising the same. A packaging substrate accordi...
Invention Packaging substrate and manufacturing method of packaging substrate. This specification relates ...
Invention Substrate having sidewall protection layer and manufacturing method thereof. Embodiments of a su...
Invention Packaging substrate and semiconductor package comprising the same. A packaging substrate and a s...
Invention Packaging substrate and manufacturing method of the same. An embodiment relates to a packaging s...
Invention Manufacturing method of packaging substrate and packaging substrate using the same. The present ...
Invention Packaging substrate and manufacturing method of the same. Embodiments relate to packaging substr...
Invention Manufacturing method of packaging substrate and packaging substrate using the same. A method for...
Invention Substrate and manufacturing method for the same. A substrate according to a present disclosure c...
Invention Substrate and manufacturing method for the same. A substrate according to an embodiment includes...
Invention Substrate with embedded elements and manufacturing method of the same. A substrate with an embed...
2023 Invention Substrate gripper and method for moving a substrate using the same. Disclosed herein are a subst...
Invention Packaging substrate and semiconductor apparatus comprising same. The embodiment relates to a pack...
Invention Semiconductor packaging substrate, semiconductor packages, and method for manufacturing the semic...
Invention Substrate and semiconductor module. An embodiment relates to a substrate and a semiconductor mod...
Invention Packaging substrate and semiconductor package including the same. A packaging substrate accordin...
Invention Packaging substrate, method of manufacturing an element package and method of manufacturing packa...
Invention Method of manufacturing packaging substrate and packaging substrate manufactured thereby. The pr...
Invention Packaging substrate and method of manufacturing the same. An embodiment relates to a packaging s...
Invention Core-substrate, substrate and use of substrate for semiconductor packaging. The present disclosu...
Invention Packaging substrate having electric power transmitting elements on non-circular core via of core ...
Invention Packaging substrate having element group in cavity unit and semiconductor device comprising the s...
2022 Invention Via connection structure comprising multiple vias and substrate comprising the same. A connectio...
Invention Via connection structure comprising multiple vias and substrate comprising the same. A connection...
Invention Cleaned packaging substrate and cleaned packaging substrate manufacturing method. A manufacturin...
Invention Cleaned packaging substrate and cleaned packaging substrate manufacturing method. A manufacturing...
Invention Substrate carrier and substrate assembly comprising the same. A substrate carrier and a substrat...
Invention Substrate carrier and substrate assembly comprising the same. A substrate carrier and a substrate...
Invention Packaging substrate, semiconductor package, packaging substrate preparation method, and semicondu...
Invention Substrate and package substrate comprising the same. A substrate comprising a glass substrate is...
Invention Substrate and package substrate comprising the same. A substrate comprising a glass substrate is ...
Invention Device packaging substrate, manufacturing method for the same, and device package comprising the ...
Invention Device packaging substrate, manufacturing method, and device package. An electronic element packa...
Invention Substrate comprising a lid structure, package substrate comprising the same and semiconductor dev...
P/S Chemicals for industrial purposes; chemicals for use in metal plating; chemical compositions for ...
Invention Packaging substrate and semiconductor device comprising the same. Disclosed are a packaging subst...
P/S Components for electric circuits; semiconductor packages; printed circuit boards; electronic circ...