STATS ChipPAC Pte. Lte.

Singapour

 
Quantité totale PI 1 534
Rang # Quantité totale PI 853
Note d'activité PI 3,2/5.0    295
Rang # Activité PI 2 418
Parent JCET-SC (Singapore) Pte. Ltd

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Dernier brevet 2025 - Semiconductor device and method ...
Premier brevet 1998 - Method of forming extended lead ...

Derniers inventions, produits et services

2024 Invention Antenna-in-package devices and methods of making. A semiconductor device has a PCB with an anten...
Invention Thermally enhanced fcbga package. A semiconductor device has a heat spreader with an opening for...
Invention Methods for forming conductive structures between two substrates. A method for forming conductiv...
Invention Two-way optical sensor package and a method for forming the same. An optical sensor package comp...
Invention Semiconductor package and method for making the same. A semiconductor package and a method for m...
Invention Sensor package and a method for forming the same. A method for forming a sensor package is discl...
Invention Optical sensor package and a method for forming the same. An optical sensor package is disclosed...
Invention Electronic package and method for forming the same. An electronic package is provided. The elect...
Invention Semiconductor package stack and a method for forming the same. A semiconductor package stack com...
Invention Electronic package and a packaging method. An electronic package and a packaging method are prov...
Invention Semiconductor package and method for forming the same. A semiconductor package is provided. The ...
Invention Semiconductor device and method for making the same. A semiconductor device and a method for mak...
Invention Sensor package and method for forming the same. A method for forming a sensor package, comprisin...
Invention Semiconductor device and method of coating a semiconductor wafer with high viscosity liquid photo...
Invention Semiconductor device and a method for forming a semiconductor device. A semiconductor device com...
Invention Device for holding a package substrate with reduced warpage. A device for holding a package subs...
Invention Semiconductor device with compartment shield formed from metal bars and manufacturing method ther...
Invention Method for forming a shielding layer over a semiconductor package with reduced metal burrs. A me...
Invention Selective stencil mask and a stencil printing method. A selective stencil mask and a stencil pri...
Invention Partially shielded semiconductor device and method for making the same. A partially shielded sem...
Invention Integrated package and method for making the same. An integrated package and a method for making...
Invention Method for forming a shielding layer on a semiconductor device. A method for forming a shielding...
Invention Semiconductor device and method of forming vertical interconnect structure for pop module. A sem...
Invention Semiconductor package with improved space utilization and method for making the same. A semicond...
Invention Cooling device and process for cooling double-sided sip devices during sputtering. A semiconduct...
Invention Semiconductor device with partial emi shielding removal using laser ablation. A semiconductor de...
Invention Semiconductor device and method for making the same. A method for making a semiconductor device ...
2023 Invention Method for making a semiconductor device using a double side molding technology. A method for ma...
Invention Semiconductor device and method of making redistribution layers with intensive pulsed light irrad...
Invention Semiconductor device and method of making a semiconductor package with graphene for die attach. ...
Invention Semiconductor device and method of making an emi shield using intensive pulsed light irradiation....
Invention Semiconductor device and method of making an interconnect bridge with integrated passive devices....
Invention Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstit...
Invention Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched ...
Invention Semiconductor device and method of making a fan-out semiconductor package with pre-assembled pass...
Invention Semiconductor device and method of forming shielding material containing conductive spheres. A s...
Invention Semiconductor device and method of forming double-sided rectifying antenna on power module. A se...
Invention Semiconductor device and method of controlling distribution of liquid metal tim using lid structu...
Invention Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic ...
Invention Semiconductor device and method of forming stress relief vias in multi-layer rdl. A semiconducto...
Invention Semiconductor device and method of forming high crystal quality magnetic layer for shielding of l...
Invention Semiconductor device and method of forming interconnect structure with graphene core shells for 3...
Invention System and method of providing foup or cassette supporting structure for handling various size or...
Invention Semiconductor device and method of partial shielding with embedded graphene core shells. A semic...
Invention Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores...
Invention Semiconductor device and method of forming rdl with graphene-coated core. A semiconductor device...
Invention Semiconductor device and method of making a semiconductor package with graphene-coated interconne...
2022 Invention Semiconductor device and method of die attach with adhesive layer containing graphene-coated core...