Asano Laboratories Co., Ltd.

Japon

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Type PI
        Brevet 37
        Marque 4
Juridiction
        International 29
        États-Unis 12
Date
2026 (AACJ) 1
2025 6
2024 6
2023 5
2022 3
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Classe IPC
B29C 51/42 - Chauffage ou refroidissement 21
B29C 51/10 - Formage par une différence de pression, p. ex. sous vide 20
B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires 13
B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements 11
B29C 51/16 - Garnissage ou marquage 9
Voir plus
Classe NICE
07 - Machines et machines-outils 3
11 - Appareils de contrôle de l'environnement 1
Statut
En Instance 1
Enregistré / En vigueur 40

1.

THERMOFORMING DEVICE

      
Numéro d'application JP2025017703
Numéro de publication 2026/014049
Statut Délivré - en vigueur
Date de dépôt 2025-05-15
Date de publication 2026-01-15
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Takai Shogo
  • Hara Nobuharu

Abrégé

A thermoforming device (100) for forming a resinous sheet (S) using a die (150) is provided. The thermoforming device (100) comprises: a sheet holder (50) which has a shape conforming to the die (150) and has the function of positioning and holding the resinous sheet (S); and a clamp (65) which presses the resinous sheet (S) against the surface of the die (150) when the resinous sheet (S) is placed along the surface of the die (150) by bringing the sheet holder 50 close to the die (150). The die (150) has a first jig receiving part (150b) for positioning the sheet holder (50). Due to the configuration, the resinous sheet (S), even in deep drawing, is less likely to have unevenness in thickness.

Classes IPC  ?

  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/08 - Emboutissage profond ou façonnage dans des moules en deux parties, c.-à-d. en utilisant uniquement des moyens mécaniques
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/18 - Appareils de thermoformage

2.

THERMOFORMING DEVICE AND HEAT INSULATION SHEET

      
Numéro d'application JP2025013842
Numéro de publication 2025/234245
Statut Délivré - en vigueur
Date de dépôt 2025-04-07
Date de publication 2025-11-13
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Hayashi Kazushi
  • Osada Takeshi
  • Yokoi Hiroyoshi
  • Takahashi Toshiyuki
  • Akahoshi Kazuo
  • Yasuo Seiichi

Abrégé

The purpose of the present invention is to provide a thermoforming device that can save energy at a heating unit. A thermoforming device 100 comprises a heating unit 150 that has an upper heating means 151 and a lower heating means 152 that heat a resin sheet S from above and below, respectively, a shaping unit 200 that shapes the resin sheet S, and a transport mechanism 155 that transports the resin sheet S. A heat insulation sheet (upper heat insulation sheet 161 and lower heat insulation sheet 171) is removably fixed to an outside surface of the upper heating means 151 and the lower heating means 152.

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 43/32 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/42 - Chauffage ou refroidissement

3.

ASANO LAB

      
Numéro de série 99429424
Statut Enregistrée
Date de dépôt 2025-10-06
Date d'enregistrement 2026-05-05
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Classes de Nice  ? 07 - Machines et machines-outils

Produits et services

Machines for plastics working; Rubber manufacturing machines; Rubber processing machines; Presses for chemical processing; Packaging machines for food; Automatic packing machines for food; Pulp making machines; Papermaking machines; Packaging machines; Wrapping machines

4.

AL

      
Numéro de série 99410376
Statut Enregistrée
Date de dépôt 2025-09-24
Date d'enregistrement 2026-05-05
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Classes de Nice  ? 07 - Machines et machines-outils

Produits et services

Machines for plastics working; Rubber manufacturing machines; Rubber processing machines; Presses for chemical processing; Packaging machines for food; Automatic packing machines for food; Pulp making machines; Papermaking machines; Packaging machines; Wrapping machines

5.

THERMOFORMING DEVICE

      
Numéro d'application 18860302
Statut En instance
Date de dépôt 2023-03-29
Date de la première publication 2025-09-11
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Takai, Toshihiro
  • Oguma, Yasushi

Abrégé

This thermoforming device, which performs thermoforming of a continuously supplied resin sheet to simultaneously mold two or more rows of containers in the feed direction of the resin sheet, has: protruding linear portions of a leading clamp forming thin-walled portions in a direction perpendicular to the feed direction between the two rows of the containers; and protruding linear portions of an upper mold, wherein the protruding linear portions have a cooling means and do not raise the temperatures of the thin-walled portions to a crystallization temperature during heat set thermoforming.

Classes IPC  ?

  • B29C 51/18 - Appareils de thermoformage
  • B29C 51/00 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet
  • B29C 51/08 - Emboutissage profond ou façonnage dans des moules en deux parties, c.-à-d. en utilisant uniquement des moyens mécaniques
  • B29C 51/38 - Moyens d'ouverture, de fermeture ou de serrage
  • B29C 51/42 - Chauffage ou refroidissement
  • B29K 67/00 - Utilisation de polyesters comme matière de moulage
  • B29L 31/00 - Autres objets particuliers

6.

THERMOFORMING DEVICE

      
Numéro d'application JP2024026910
Numéro de publication 2025/057584
Statut Délivré - en vigueur
Date de dépôt 2024-07-29
Date de publication 2025-03-20
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Takai Shogo
  • Kawano Shingo
  • Higashijima Norio
  • Takeda Tsubasa
  • Teramoto Kazunori

Abrégé

This thermoforming device (100), which is for performing pneumatic molding or vacuum molding and in which a work space (50) is divided by a resin sheet (S) held in a state in which an upper chamber (101) and a lower chamber (102) are closed, and thus an upper compartment (51) is formed in the upper chamber (101) and a lower compartment (52) is formed in the lower chamber (102), comprises: a first main pipe path (121) that is connected to the upper compartment (51) to form an upper vacuum circuit (120); a first sub pipe path (122) in which the flow path narrows from the first main pipe path (121) and which branches from the first main pipe path (121); a second main pipe path (131) that is connected to the lower compartment (52) and forms a lower vacuum circuit (130); and a second sub pipe path (132) in which the flow path narrows from the second main pipe path (131) and which branches from the second main pipe path (131).

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/46 - Mesure, commande ou régulation

7.

LAMINATING APPARATUS

      
Numéro d'application JP2024026225
Numéro de publication 2025/047201
Statut Délivré - en vigueur
Date de dépôt 2024-07-23
Date de publication 2025-03-06
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Ishida Tatsuya
  • Hayashi Kazushi
  • Oguma Yasushi
  • Onishi Kazushige

Abrégé

A laminating apparatus (100) comprises: a heating means (110) for heating a resin film (S); a holding means (130) for holding the resin film (S); and a vacuum suction means (140) for coating and forming the resin film (S) on the surface of a base material (B). The laminating apparatus (100) further comprises a shutter device (120) that is disposed between the heating means (110) and the resin film (S) held by the holding means (130) and that opens and closes by being divided at a central portion so as to act as a heat blocking means. The shutter device (120) is controlled so as to be in an open state when the resin film (S) held by the holding means (130) is heated by the heating means (110), and is controlled so as to be in a closed state when the resin film (S) is adhered to the surface of the base material (B) by a vacuum suction means or a compressed air means and the resin film (S) is fused to the surface of the base material (B).

Classes IPC  ?

  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 63/02 - Garnissage ou gainage, c.-à-d. application de couches ou de gainages préformés en matière plastiqueAppareils à cet effet avec des matières sous forme de feuilles ou de nappes

8.

THERMOFORMING METHOD, THERMOFORMING DEVICE, AND THERMOFORMED ARTICLE

      
Numéro d'application JP2024024692
Numéro de publication 2024/248164
Statut Délivré - en vigueur
Date de dépôt 2024-07-09
Date de publication 2024-12-05
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Takai Shogo
  • Asao Norifumi

Abrégé

Provided is a thermoforming method in which a resinous sheet (S) is heated with a hot plate (110) and shaped with a mold (200). The resinous sheet (S) is made of a resin material having light-transmitting properties. A light-transmitting layer (L2) which transmits light is provided on a first surface (SA) of the resinous sheet (S), and a light-shielding layer (L1) which does not transmit light is provided overlapping the light-transmitting layer (L2) to form both light-shielding portions (S4) where light is blocked by the light-shielding layer (L1) and light-transmitting portions (S1) through which light passes. The mold (200) is brought into contact with the resinous sheet (S) on a first surface (SA) side thereof to effect thermoforming. Thus, at least some of the light-transmitting portions (S1) are three-dimensionally shaped so as to protrude toward a second surface (SB), which faces the first surface (SA), and so that the second surface (SB) in the formed resinous sheet (S) is a design surface. The thermoforming method can thus produce a molded article (50) having a three-dimensional decorative portion where printed-design shifting is less conspicuous.

Classes IPC  ?

  • B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/42 - Chauffage ou refroidissement
  • B32B 7/023 - Propriétés optiques
  • B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique

9.

THERMOFORMING DEVICE

      
Numéro d'application JP2023039075
Numéro de publication 2024/202164
Statut Délivré - en vigueur
Date de dépôt 2023-10-30
Date de publication 2024-10-03
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s) Takai Shogo

Abrégé

A thermoforming device (100) applies heat on a resin sheet (S) by a heating means (110), and molds the resin sheet (S) by using a mold (200). The resin sheet (S) is held between a first chamber (101) disposed above and a second chamber (102) disposed below. The thermoforming device comprises a pressure control means (270) for controlling the inside of the first chamber (101) or the second chamber (102) to have an arbitrarily defined pressure when molding the resin sheet (S). The pressure control means (270) controls a first valve (V1) connected to the first chamber (101) or a second valve (V2) connected to the second chamber (102) to switch the internal pressure of the first chamber (101) or the second chamber (102) at multiple stages.

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/46 - Mesure, commande ou régulation

10.

THERMOFORMING DEVICE

      
Numéro d'application JP2023039105
Numéro de publication 2024/202165
Statut Délivré - en vigueur
Date de dépôt 2023-10-30
Date de publication 2024-10-03
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s) Takai Shogo

Abrégé

A thermoforming device (100) heats a resin sheet (S) by means of a heating means (110) and shapes the resin in a mold. The heating means (110) is formed by arranging a plurality of heaters (111) side by side, and has a second area (A2) and a first area (A1) constituted by heaters (111) corresponding to a protruding part (200a) of a mold (200). The heating means (110) is provided with a heating control means capable of performing different output control for the first area (A1) and the second area (A2), and enables the heating control means (250) to perform multistage heating control in which different heating conditions are set for a first heating stage and a second heating stage.

Classes IPC  ?

  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/46 - Mesure, commande ou régulation

11.

METHOD FOR SHAPING SHEET MATERIALS

      
Numéro d'application JP2023031721
Numéro de publication 2024/180794
Statut Délivré - en vigueur
Date de dépôt 2023-08-31
Date de publication 2024-09-06
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s) Takai Shogo

Abrégé

A first sheet material S11 includes a first portion A11 to be shaped, which, upon shaping, becomes a first shaped portion 11. A second sheet material S12 has an air passage hole 2 through which air can pass between one surface and the other surface thereof. The first sheet material S11 and the second sheet material S12 are put together so that the air passage hole 2 faces the first portion A11 to be shaped, and are bonded to each other. The bonded first sheet material S11 and second sheet material S11 are positioned so that the first sheet material S11 faces a lower mold 6. A difference in pressure is caused to between the lower mold 6 side and the opposite side of the bonded first sheet material S11 and second sheet material S12, thereby simultaneously shaping the first sheet material S11 and the second sheet material S12 to obtain a shaped article 1.

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches

12.

THERMOFORMING DEVICE

      
Numéro d'application JP2023041993
Numéro de publication 2024/154433
Statut Délivré - en vigueur
Date de dépôt 2023-11-22
Date de publication 2024-07-25
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Takai Shogo
  • Kawano Shingo
  • Yamashita Hirofumi
  • Takahashi Toshiyuki
  • Takeda Tsubasa
  • Teramoto Kazunori

Abrégé

A thermoforming device (100) performs heating of a sheet (S) with a hot plate, and mold-shapes the sheet. The hot plate is made of an upper hot plate (110) heating the sheet (S) from above, and a lower hot plate (150) heating the sheet (S) from below, and comprises a holding device (120) that is disposed around the upper hot plate (110) and sandwiches and holds an outer periphery of the sheet (S). The holding device (120) has a sheet upper support surface (121b) that faces an end upper surface of the sheet (S) and is for pressing down rise-up of at least the periphery of the sheet (S), and a sheet lower support surface (124a) that supports an end lower surface of the sheet (S) at the outer periphery of the sheet (S). The distance between the sheet upper support surface (121b) and the sheet lower support surface (124a) is a set distance obtained by adding, to the thickness of the sheet (S), the distance at which it is possible to adsorb the sheet (S) so as to contact the sheet upper support surface (121b).

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 35/02 - Chauffage ou durcissement, p. ex. réticulation ou vulcanisation
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/42 - Chauffage ou refroidissement

13.

THERMOFORMING DEVICE

      
Numéro d'application JP2023023343
Numéro de publication 2024/029227
Statut Délivré - en vigueur
Date de dépôt 2023-06-23
Date de publication 2024-02-08
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Takai Shogo

Abrégé

The thermoforming device (10) that forms a resin sheet (S) using an upper mold (210) and a lower mold (220) is equipped with a conveyance frame member (100) that holds the outer periphery of a thick resin sheet (S), a traverse device (200) that conveys the conveyance frame member (100), and an air intake mechanism (flow path 105a, air intake hole 105b, opening 105c, air intake path 107) in the conveyance frame member (100). The conveyance frame member (100) abuts the outer periphery of the resin sheet (S); and the resin sheet (S) is held by air intake by the air intake mechanism and conveyed by the traverse device (200).

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/42 - Chauffage ou refroidissement

14.

THERMAL MOLDING MACHINE

      
Numéro d'application JP2023012892
Numéro de publication 2023/228561
Statut Délivré - en vigueur
Date de dépôt 2023-03-29
Date de publication 2023-11-30
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Takai Toshihiro
  • Oguma Yasushi

Abrégé

This thermal molding machine (3), which performs thermal molding on a continuously supplied resin sheet (S1) to simultaneously mold two or more rows of containers (C11) in the feed direction of the resin sheet (S1), has: protruding linear sections (42a, 43a) of a leading clamp 40 forming thin-walled sections (S11, S12) in a direction perpendicular to the feed direction between the two rows of the containers (C11); and protruding linear sections (25a, 26a) of an upper mold (20), wherein the protruding linear sections 42a, 43a have a cooling means and do not raise the temperatures of the thin-walled sections S11, S12 to a crystallization temperature during heat set thermal molding.

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/42 - Chauffage ou refroidissement

15.

THERMOFORMING DEVICE

      
Numéro d'application JP2022040465
Numéro de publication 2023/223575
Statut Délivré - en vigueur
Date de dépôt 2022-10-28
Date de publication 2023-11-23
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Hayashi Kazushi
  • Oguma Yasushi
  • Asao Norifumi

Abrégé

A thermoforming device (1) executes: a heating step for radiation heating, with a radiation heating device (6), a resin film (4) to a predetermined temperature (C21); and an adhesion step for adhering the radiation heated resin film (4) to a pulp mold (10) placed on a base (52). The thermoforming device (1) comprises a vacuum pump (7) for vacuum suctioning the space between the pulp mold (10) and the resin film (4) and adhering the resin film (4) to the pulp mold (10) during the adhesion step. The distance from the resin film (4) can vary between a first heating position at which the resin film (4) is radiation heated during the heating step and a second heating position at which the resin film (4) is radiation heated during the adhesion step in the radiation heating device (6).

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/42 - Chauffage ou refroidissement

16.

THERMOFORMING DEVICE

      
Numéro d'application JP2023015399
Numéro de publication 2023/223740
Statut Délivré - en vigueur
Date de dépôt 2023-04-18
Date de publication 2023-11-23
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s) Koguma Yasushi

Abrégé

Provided is a thermoforming device (1) that comprises a radiation heating device (6) and a base (52) opposite from the radiation heating device (6) with a resin film (4) therebetween and that is for performing a heating step for performing radiation heating of the resin film (4) with the radiation heating device (6) to a prescribed temperature (C21) at which molding is possible, and an adhesion step for adhering the resin film (4) which has been subjected to radiation heating to a pulp molding (10) placed on the base (52), wherein, prior to the heating step and the adhesion step, the resin film (4) is cut to a shape along the contour of a flange part (103) of an adhesion surface (104) of the pulp molding (10) for adhesion to the resin film (4), in a state of being adhered to the flange part (103).

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/46 - Mesure, commande ou régulation

17.

Thermoforming device and thermoforming method

      
Numéro d'application 18012436
Numéro de brevet 11691329
Statut Délivré - en vigueur
Date de dépôt 2021-11-23
Date de la première publication 2023-06-08
Date d'octroi 2023-07-04
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto, Kazunori
  • Takai, Shogo
  • Suzuki, Yusuke
  • Iimura, Kimihiro

Abrégé

A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with a space therebetween in a planar direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The distance of the space is 1-15 mm, and the distance of the space is set at least five times larger than the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided between different zones of the masking plate.

Classes IPC  ?

18.

HEATING UNIT STRUCTURE FOR RESIN HEATING/MOLDING DEVICE, AND RESIN HEATING/MOLDING DEVICE

      
Numéro d'application JP2021044395
Numéro de publication 2023/286290
Statut Délivré - en vigueur
Date de dépôt 2021-12-03
Date de publication 2023-01-19
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Yokoi Hiroyoshi
  • Nakai Sadaoki
  • Takai Shogo
  • Asao Norifumi

Abrégé

In the present invention, a clamp group is composed of clamps intermittently disposed on one side of the outer edge of a workpiece. The clamps are disposed in a configuration by which a workpiece holding band, which needs support of the clamps, is partitioned into sections separated by a clamp holding reference pitch P which serves as the reference. For each clamp unit, the clamp holding reference pitch P is composed of a holding part area P1 receiving support of the clamp, and a non-holding part area P2, which is a limited area located adjacent to the holding part area P1 and not receiving support of the clamp. The clamps are provided in such a manner as to satisfy the condition 0

Classes IPC  ?

19.

THERMOFORMING DEVICE

      
Numéro d'application JP2021044240
Numéro de publication 2022/239283
Statut Délivré - en vigueur
Date de dépôt 2021-12-02
Date de publication 2022-11-17
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Takai Shogo

Abrégé

In this thermoforming device (1) comprising forming space (R), wherein in the forming space (R), a resin sheet (4) wound out from a roll sheet wound up in a roll shape is bonded to a forming base material, there are comprised: a base (52) having a placing surface (521) for placing the forming base material in the forming space (R); an upper hot plate (6) having a heating surface (61) that closely adheres to and heats the resin sheet (4), sandwiching the resin sheet (4) on the base (52) from above; and a first vacuum pump (7) that vacuum suctions at least the interval between the forming base material and the resin sheet (4) in the forming space (R). The thickness of the resin sheet (4) is less than 100 μm, and the forming base material is a pulp mold (10).

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/16 - Garnissage ou marquage

20.

THERMOFORMING DEVICE AND THERMOFORMING METHOD

      
Numéro d'application JP2021042864
Numéro de publication 2022/137946
Statut Délivré - en vigueur
Date de dépôt 2021-11-23
Date de publication 2022-06-30
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Takai Shogo
  • Suzuki Yusuke
  • Iimura Kimihiro

Abrégé

A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with spaces therebetween in a surface direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The interval of the spaces is 1-15 mm, and the interval of the spaces is set to a magnitude of at least five times the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided at each site in the masking plate.

Classes IPC  ?

21.

Thermoforming device and thermoforming method

      
Numéro d'application 17565860
Numéro de brevet 12070891
Statut Délivré - en vigueur
Date de dépôt 2021-12-30
Date de la première publication 2022-04-21
Date d'octroi 2024-08-27
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s) Teramoto, Kazunori

Abrégé

A thermoforming device includes: a base configured to hold a substrate; a hot plate including a heating surface facing vertically downward; a sheet transport portion that supplies a sheet onto the heating surface of the hot plate; and a substrate supply portion configured to attach the substrate to the base and detach the substrate from the base, and to dispose the substrate at a substrate supply position positioned in a lower area of the sheet which is opposite to a side of the sheet in which the heating surface is provided. In the thermoforming device, heating of the sheet using the hot plate and attachment and detachment of the substrate with respect to the base are performable at the same time, and the sheet heated and softened by the hot plate is attached to the substrate at the substrate supply position.

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/02 - Thermoformage combiné avec la fabrication de la préforme
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
  • B29K 23/00 - Utilisation de polyalcènes comme matière de moulage
  • B29L 31/50 - Chaussures ou leurs parties constitutives

22.

THERMOFORMING DEVICE AND THERMOFORMING METHOD

      
Numéro d'application JP2021022473
Numéro de publication 2021/251502
Statut Délivré - en vigueur
Date de dépôt 2021-06-14
Date de publication 2021-12-16
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Mizoguchi Kenichi
  • Takai Shogo
  • Teramoto Kazunori

Abrégé

A thermoforming device (10) comprising an upper mold (37) and a lower mold (33) as molding dies and whereby a resin molding sheet (S) is interposed between the upper mold (37) and the lower mold (33) and molded. The thermoforming device (10) has a sheet pressing section (37a) provided so as to protrude from the molding surface of either the upper mold (37) or the lower mold (33). The sheet pressing section (37a) has a function that, together with the molding surface of the other molding die, sandwiches a transparent section (M1) which is a section of the resin molding sheet (S) that forms part of the molded product (M) after molding. The resin molding sheet (S) is molded by the rest of the resin molding sheet (S), other than the transparent section (M1), being sandwiched by the upper mold (37) and the lower mold (33).

Classes IPC  ?

  • B29C 51/08 - Emboutissage profond ou façonnage dans des moules en deux parties, c.-à-d. en utilisant uniquement des moyens mécaniques
  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/38 - Moyens d'ouverture, de fermeture ou de serrage

23.

THERMOFORMING DEVICE

      
Numéro d'application JP2020038571
Numéro de publication 2021/166319
Statut Délivré - en vigueur
Date de dépôt 2020-10-13
Date de publication 2021-08-26
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Nishio Tsubasa

Abrégé

This thermoforming device is configured such that a heater is disposed outside an accommodating case, and a forming mold is detachably disposed within the accommodating case through a first opening section and is heated by the heater outside the accommodating case. The thermoforming device comprises a forming mold moving means, which, when an object to be formed is thermoformed by being pressed in a second direction by air pressure and pressed against the forming surface of the forming mold, moves the forming mold, in the second direction, from a separated position which is a position separated from a cooling plate in a first direction, and disposes the forming mold at a contact position, which is a position in contact with the cooling plate.

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/20 - Appareils de thermoformage comportant des moules ou des parties de moule mobiles
  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/30 - Moules
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/46 - Mesure, commande ou régulation
  • B29C 33/02 - Moules ou noyauxLeurs détails ou accessoires comportant des moyens incorporés de chauffage ou de refroidissement

24.

THERMOFORMING DEVICE

      
Numéro d'application JP2020038580
Numéro de publication 2021/140718
Statut Délivré - en vigueur
Date de dépôt 2020-10-13
Date de publication 2021-07-15
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Nishio Tsubasa
  • Nakai Sadaoki
  • Higashijima Norio
  • Mori Yoji

Abrégé

This thermoforming device is provided with: a cooling control unit which cools a sheet via a forming mold by causing a cooling liquid to circulate within a flow passage in a cooling plate; a transfer device for transferring a heater; and a transfer control unit for controlling the operation of the transfer device. When the cooling control unit causes the cooling liquid to circulate within the flow passage in the cooling plate, the transfer control unit performs first control so as to: separate the heater away from the cooling plate by causing the transfer device to move the heater in a second direction; and keep the heater separated away from the cooling plate while the cooling liquid within the flow passage in the cooling plate is caused to circulate by the cooling control unit.

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/46 - Mesure, commande ou régulation

25.

SHEET GUIDE DEVICE

      
Numéro d'application JP2019021520
Numéro de publication 2020/217546
Statut Délivré - en vigueur
Date de dépôt 2019-05-30
Date de publication 2020-10-29
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Kawano Shingo
  • Hayashi Hidekazu

Abrégé

A sheet guide device that guides a molding sheet by which a molded article is molded comprises: sheet guides that guide the conveyed molding sheet; a support member that supports a plurality of the sheet guides arranged in a width direction orthogonal to a conveyance direction of the molding sheet; and a shift mechanism that shifts the support member in the width direction.

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B65H 9/00 - Positionnement des articles, p. ex. orientementDispositifs à cet effet

26.

TRIMMING DEVICE

      
Numéro d'application JP2019021491
Numéro de publication 2020/202586
Statut Délivré - en vigueur
Date de dépôt 2019-05-30
Date de publication 2020-10-08
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Shibata Hideyuki
  • Takai Toshihiro
  • Kato Yuki
  • Ishida Tatsuya

Abrégé

A trimming device that trims a molding sheet in order to remove, from the molding sheet, a molded article molded from the molding sheet by using a mold, wherein: the trimming device has a blade that performs trimming, the blade being provided in one direction along the thickness direction of the molding sheet; and, with respect to a plurality of molded articles molded along the conveyance direction of the molding sheet by performing an operation to mold the molded article by using the mold one time, trimming by the blade is performed a plurality of times for each of a prescribed number of molded articles.

Classes IPC  ?

  • B26D 3/00 - Coupe d'une pièce caractérisée par la nature de la coupeAppareillage à cet effet
  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires

27.

Thermoforming device and thermoforming method

      
Numéro d'application 15770844
Numéro de brevet 11173648
Statut Délivré - en vigueur
Date de dépôt 2016-10-17
Date de la première publication 2018-12-13
Date d'octroi 2021-11-16
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s)
  • Teramoto, Kazunori
  • Nihira, Masanobu
  • Usami, Hideki

Abrégé

A thermoforming device includes: an upper hot plate including a first heating surface configured to heat a sheet from above; a lower hot plate including a second heating surface configured to heat the sheet from below; and a substrate-supplying unit including a base configured to hold a molded substrate, and configured to attach the molded substrate to and detach the molded substrate from the base and to dispose the molded substrate at a molding position below the first heating surface with the sheet interposed therebetween, in which the upper hot plate and the lower hot plate are configured to heat the sheet simultaneously from an upper surface and a lower surface of the sheet, the lower hot plate is provided to be movable in a horizontal direction with respect to a position below the upper hot plate, and the thermoforming device die-molds or adheres, onto the molded substrate held by the base, the sheet softened by being heated by the upper hot plate and the lower hot plate.

Classes IPC  ?

  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/02 - Thermoformage combiné avec la fabrication de la préforme
  • B29C 51/36 - Moules spécialement adaptés au formage sous vide
  • B29C 51/20 - Appareils de thermoformage comportant des moules ou des parties de moule mobiles
  • B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29K 623/00 - Utilisation de polyalcènes pour des pièces préformées, p. ex. pour des inserts

28.

THERMOFORMING DEVICE AND THERMOFORMING METHOD

      
Numéro d'application JP2016080682
Numéro de publication 2017/073390
Statut Délivré - en vigueur
Date de dépôt 2016-10-17
Date de publication 2017-05-04
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Teramoto Kazunori
  • Nihira Masanobu
  • Usami Hideki

Abrégé

The thermoforming device according to the present invention is provided with: an upper hot plate having a first heating surface for heating a sheet from above; a lower hot plate having a second heating surface for heating the sheet from below; and a substrate supplying part having a base capable of retaining a forming substrate, the substrate supplying part being configured so as to be capable of attaching and detaching the forming substrate to and from the base and arranging the forming substrate in a forming position below the first heating surface with the sheet interposed between the first heating surface and the forming substrate; the upper hot plate and the lower hot plate being capable of heating from a top surface and a bottom surface of the sheet simultaneously, the lower hot plate being provided so as to be movable in a horizontal direction with respect to a position below the upper hot plate, and the sheet softened by being heated by the upper hot plate being die-molded with respect to the forming substrate retained on the base, or being bonded to the forming substrate.

Classes IPC  ?

  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide

29.

HEAT MOLDING DEVICE AND HEAT MOLDING METHOD

      
Numéro d'application JP2016066767
Numéro de publication 2016/199724
Statut Délivré - en vigueur
Date de dépôt 2016-06-06
Date de publication 2016-12-15
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s) Teramoto Kazunori

Abrégé

A heat molding device is provided with: a base configured to hold a base material; a heating plate having a heating surface directed vertically downward; a sheet conveying part that supplies a sheet onto the heating surface of the heating plate; and a base substrate supplying part configured to attach and detach the base material to and from the base and arrange the base material at a base material supplying position, i.e., a lower position on a side opposite to a side where the heating surface for the sheet is provided. The heating of the sheet by the heating plate and the attachment and detachment of the base material to and from the base can be performed in parallel, and the sheet heated and softened by the heating plate is bonded to the base material at the base material supplying position.

Classes IPC  ?

  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements

30.

THERMOFORMING APPARATUS AND THERMOFORMING METHOD

      
Numéro d'application JP2016062518
Numéro de publication 2016/171175
Statut Délivré - en vigueur
Date de dépôt 2016-04-20
Date de publication 2016-10-27
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s) Teramoto Kazunori

Abrégé

A thermoforming apparatus, which is for mold-shaping a sheet with respect to a base material or bonding said sheet to said base material, is provided with: a lower frame, which has a surrounding frame wall and a frame bottom in which a vacuum vent hole is formed and which forms a space for accommodating the base material; a heating plate, which has a heating surface and is configured so that the heating surface comes into close contact with the upper edge of the surrounding frame wall; a base with a base material-holding section capable of holding the base material; a sealing frame, which is provided so as to protrude from the base-setting surface of the frame bottom and, in planar view, surrounds the entire circumference of the base material-holding section; and a sheet-gripping section for gripping the peripheral edge of the sheet without gaps over the entire perimeter thereof, the section being provided inside the lower frame so as to be vertically movable between an elevated position in which the sheet is heated by the heating plate and a lowered position in which the sheet-gripping section is in close contact with the upper edge of the sealing frame. The thermoforming apparatus is configured so that when the sheet-gripping section is in close contact with the upper edge of the sealing frame: a sealed space surrounded by the sheet and the sealing frame is formed; the vacuum vent hole is in communication with the space inside the lower frame and passes through at least the frame bottom on the inside of the sealing frame and opens onto the upper surface within the sealing frame; and with the sealed space formed, a vacuum is drawn through the vacuum vent hole.

Classes IPC  ?

  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires
  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements

31.

THERMOFORMING APPARATUS

      
Numéro d'application JP2015062539
Numéro de publication 2015/166889
Statut Délivré - en vigueur
Date de dépôt 2015-04-24
Date de publication 2015-11-05
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Mizoguchi Kenichi
  • Teramoto Kazunori

Abrégé

A thermoforming apparatus provided with: a casing material having a region for accommodating a substrate that is to be thermoformed, and a casing edge; and a heating plate, which has a heating surface that is square in planar view and a frame part that protrudes toward the casing material from the peripheral edge of the heating surface, and in which the frame part is capable of abutting against the casing edge of the casing material. The heating plate is provided with vacuum holes that open at the corner formed by the heating surface and the frame part at the periphery of the heating plate in planar view. Before adhesion, on the heating surface, of a sheet that is disposed between the casing edge of the casing material and the peripheral edge of the heating plate, there is a gap between at least a portion of the sheet and the heating surface.

Classes IPC  ?

  • B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
  • B29C 51/42 - Chauffage ou refroidissement

32.

Forming apparatus and forming method

      
Numéro d'application 13933275
Numéro de brevet 09511541
Statut Délivré - en vigueur
Date de dépôt 2013-07-02
Date de la première publication 2013-11-07
Date d'octroi 2016-12-06
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s)
  • Mizoguchi, Kenichi
  • Teramoto, Kazunori

Abrégé

A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.

Classes IPC  ?

  • B29C 65/48 - Assemblage d'éléments préformésAppareils à cet effet en utilisant des adhésifs
  • B29C 51/32 - Moules comportant des moyens de découpage
  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/08 - Emboutissage profond ou façonnage dans des moules en deux parties, c.-à-d. en utilisant uniquement des moyens mécaniques

33.

Forming apparatus and forming method

      
Numéro d'application 13823972
Numéro de brevet 09505170
Statut Délivré - en vigueur
Date de dépôt 2011-11-22
Date de la première publication 2013-07-11
Date d'octroi 2016-11-29
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s)
  • Mizoguchi, Kenichi
  • Teramoto, Kazunori

Abrégé

A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.

Classes IPC  ?

  • B29C 65/48 - Assemblage d'éléments préformésAppareils à cet effet en utilisant des adhésifs
  • B29C 51/32 - Moules comportant des moyens de découpage
  • B29C 51/16 - Garnissage ou marquage
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/08 - Emboutissage profond ou façonnage dans des moules en deux parties, c.-à-d. en utilisant uniquement des moyens mécaniques

34.

MOLDING DEVICE AND MOLDING METHOD

      
Numéro d'application JP2011076877
Numéro de publication 2013/051162
Statut Délivré - en vigueur
Date de dépôt 2011-11-22
Date de publication 2013-04-11
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s)
  • Mizoguchi Kenichi
  • Teramoto Kazunori

Abrégé

A molding device provided with: a substrate jig provided on a base; a bonding means for bonding to a substrate held on the substrate jig a sheet having an adhesive layer, the sheet having been applied to the substrate, and a trimming means for trimming the sheet adhered to the substrate without removing the substrate from the substrate jig.

Classes IPC  ?

  • B29C 51/08 - Emboutissage profond ou façonnage dans des moules en deux parties, c.-à-d. en utilisant uniquement des moyens mécaniques
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/32 - Moules comportant des moyens de découpage

35.

Thermoforming device and thermoforming method using hot plate heating

      
Numéro d'application 13505373
Numéro de brevet 09364992
Statut Délivré - en vigueur
Date de dépôt 2010-06-25
Date de la première publication 2012-08-23
Date d'octroi 2016-06-14
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s)
  • Takai, Toshihiro
  • Mizoguchi, Kenichi
  • Usami, Hideki
  • Teramoto, Kazunori

Abrégé

A thermoforming device using a hot plate heating includes a frame; a hot plate; a decompression unit connected to the frame; a decompression unit which is connected to a hot plate; a unit which is connected to the hot plate and opens a heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate; a decompression control unit which performs a decompression operation in the concave portion; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/42 - Chauffage ou refroidissement
  • B29C 51/16 - Garnissage ou marquage

36.

DIFFERENTIAL PRESSURE MOLDING DEVICE AND METHOD FOR PRODUCING DIFFERENTIAL PRESSURE MOLDED SHEET

      
Numéro d'application JP2011051564
Numéro de publication 2011/105153
Statut Délivré - en vigueur
Date de dépôt 2011-01-27
Date de publication 2011-09-01
Propriétaire ASANO LABORATORIES CO.,LTD. (Japon)
Inventeur(s) Takai Toshihiro

Abrégé

A sheet holding means (20) having a sheet holding unit (21), a closed space forming body (30) having a recess (32) which faces one surface (S1a) of a sheet (S1) held by the sheet holding unit (21), and a molding die (40) which faces the recess (32), are used. The sheet holding unit (21) and the closed space forming body (30) are approached to form a before molding space (SP1) surrounded by the one surface (S1a) of the sheet (S) and the recess (32), and differential pressure wherein the pressure on the side of the other surface (S1b) of the sheet (S1) is lower than the pressure of the before molding space (SP1) is provided so that the sheet (S1) is in close contact with the molding die (40), the pressure on the other surface (S2b) of the molding sheet (S2) is equal to or larger than the atmospheric pressure while the after molding space (SP2) surrounded by one surface (S2a) of the molding sheet (S2) and the recess (32) is depressurized to have a pressure less than the atmospheric pressure, and the closed space forming body (30) and the molding die (40) are separated to release the molding sheet (S2).

Classes IPC  ?

  • B29C 51/44 - Démoulage ou éjection des objets formés
  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide

37.

DEVICE AND METHOD FOR THERMOFORMING BY HOT-PLATE HEATING

      
Numéro d'application JP2010004236
Numéro de publication 2011/080850
Statut Délivré - en vigueur
Date de dépôt 2010-06-25
Date de publication 2011-07-07
Propriétaire ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Takai, Toshihiro
  • Mizoguchi, Kenichi
  • Usami, Hideki
  • Teramoto, Kazunori

Abrégé

Disclosed is a device for thermoforming by hot-plate heating, which is equipped with: a frame having a base, walls, and a recess; a hot plate having a heating surface and a heating unit that heats the heating surface; a decompression unit that has a sheet fixed to the top ends of the frame walls and decompresses the interior of the recess covered by the sheet, by connecting to the frame; a decompression unit that suctions the heating surface side by connecting to the hot plate; a unit that pressurizes or releases pressure from the heating surface side by connecting to the hot plate; an adsorption and heating control unit that conducts the adsorbing and heating operations of the sheet by means of the hot plate, in a state in which the frame and the hot plate are in close contact having the sheet therebetween; a decompression control unit that conducts the decompression operation of the interior of the recess covered by the sheet; and a forming operation control unit that conducts the adsorbing and heating operations in parallel with the decompression operation, stops the aforementioned adsorbing and heating operations of the sheet after a prescribed period of time after initiating the operations, and pressurizes or releases pressure from the area between the hot plate and the sheet.

Classes IPC  ?

  • B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
  • B29C 51/26 - Éléments constitutifs, détails ou accessoiresOpérations auxiliaires

38.

RETURNABLE CONTAINER

      
Numéro d'application JP2007064654
Numéro de publication 2008/087760
Statut Délivré - en vigueur
Date de dépôt 2007-07-26
Date de publication 2008-07-24
Propriétaire
  • LGC, LTD. (Japon)
  • ASANO LABORATORIES CO., LTD. (Japon)
Inventeur(s)
  • Okada, Toshiharu
  • Kumagai, Manabu
  • Mizoguchi, Kenichi
  • Usami, Hideki
  • Osada, Takeshi
  • Nakai, Sadaoki

Abrégé

A returnable container comprising an external box with its superior portion open; an internal bottom member of nylon resin film disposed on the bottom plane of the external box; and a partition board for partitioning the space superior to the internal bottom member into multiple cavities.

Classes IPC  ?

39.

Heating apparatus and heating method

      
Numéro d'application 11558507
Numéro de brevet 07495194
Statut Délivré - en vigueur
Date de dépôt 2006-11-10
Date de la première publication 2008-04-10
Date d'octroi 2009-02-24
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Inventeur(s)
  • Takai, Toshihiro
  • Ohashi, Yasuyoshi
  • Hayashi, Kazushi

Abrégé

A heating apparatus includes a plurality of heating means that heat a heated object, a temperature measuring means that measures temperatures of some of the plurality of heating means, a heated object information storing means that stores, in a coordinate manner, heated object identification names, target heating temperatures at the heating means, and sets of heating ratios respectively assigned to the heating means, a heating information storage means that defines a relationship between temperatures during heating of the heating means up to the target heating temperatures and heating intensities at the temperatures, a heated object identification name obtaining means that obtains one of the heated object identification names, a heated object information reading-out means that reads out one of the target heating temperatures and one of the sets of heating ratios respectively assigned to the plurality of heating means, corresponding to the heated object identification name from the heated object information storage means, a heating information reading-out means that reads out one of the heating intensities corresponding to the temperature measured by the temperature measuring means from the heating information storage means, and a heat control means that controls each of the plurality of heating means so that the target heating temperature is achieved.

Classes IPC  ?

  • H05B 3/02 - Chauffage par résistance ohmique Détails
  • H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances

40.

ASANO QUICK RESPONSE HEATER

      
Numéro de série 77083651
Statut Enregistrée
Date de dépôt 2007-01-16
Date d'enregistrement 2008-11-18
Propriétaire Asano Laboratories Co., Ltd. (Japon)
Classes de Nice  ? 11 - Appareils de contrôle de l'environnement

Produits et services

Plastics manufacturing machine in the nature of a heating device used for plastic processing

41.

QRH

      
Numéro de série 77083663
Statut Enregistrée
Date de dépôt 2007-01-16
Date d'enregistrement 2008-11-18
Propriétaire Asano Laboratories Co., Ltd (Japon)
Classes de Nice  ? 07 - Machines et machines-outils

Produits et services

Plastics manufacturing machine in the nature of a heating device used for plastic processing