This method for manufacturing a multilayer ceramic electronic component includes: a step of obtaining a mother laminate in which a ceramic green sheet on which an internal electrode layer is laid is laminated together with upper and lower cover layers; a step of obtaining an element precursor obtained by cutting the mother laminate into individual pieces; a step of irradiating the cut side surface where the internal electrode layer of the element precursor is exposed with a laser beam, forming an air flow only by the old negative part in an opening of a suction case whose tip narrows from a direction perpendicular or inclined with respect to the cut side surface, and sucking air around the cut side surface; and a step of sticking a protective layer on the cut side surface of the element precursor.
This heat transfer member comprises: a plurality of graphite blocks having a structure in which a plurality of graphenes are laminated in a first direction; and a protective structure that protects the plurality of graphite blocks. The protective structure is physically and thermally connected to the plurality of graphite blocks. The graphite blocks are anisotropic in terms of thermal conductivity and coefficient of thermal expansion. In a first direction, the thermal conductivity of the protective structure is higher than the thermal conductivity of the graphite blocks. In a direction orthogonal to the first direction, the thermal conductivity of the graphite blocks is higher than the thermal conductivity of the protective structure. In the first direction, the coefficient of thermal expansion of the graphite blocks is higher than the coefficient of thermal expansion of the protective structure. In the direction orthogonal to the first direction, the coefficient of thermal expansion of the protective structure is higher than the coefficient of thermal expansion of the graphite blocks. The protective structure has a metal protective layer that collectively covers the plurality of graphite blocks.
This heat transfer member comprises: a plurality of graphite blocks having a structure in which a plurality of graphenes are laminated in a first direction; and a protective structure for protecting the plurality of graphite blocks. The protective structure is physically and thermally connected to the plurality of graphite blocks. The graphite blocks have anisotropy of thermal conductivity and the thermal expansion coefficient. In the first direction, the thermal conductivity of the protective structure is greater than the thermal conductivity of the graphite blocks, and the thermal expansion coefficient of the graphite blocks is greater than the thermal expansion coefficient of the protective structure. In a direction orthogonal to the first direction, the thermal conductivity of the graphite blocks is greater than the thermal conductivity of the protective structure, and the thermal expansion coefficient of the protective structure is greater than the thermal expansion coefficient of the graphite blocks. The graphite blocks adjacent to each other are joined by a bonding material. The protective structure has a protective layer that collectively covers the plurality of graphite blocks.
This heat transfer member comprises a plurality of graphite blocks that have a structure in which a plurality of graphenes are stacked in a first direction, and a protection structure that protects the plurality of graphite blocks. The protective structure is physically and thermally connected to the plurality of graphite blocks. The graphite blocks have anisotropy in terms of thermal conductivity and thermal expansion coefficient. In the first direction, the thermal conductivity of the protective structure is greater than the thermal conductivity of the graphite blocks. In a direction orthogonal to the first direction, the thermal conductivity of the graphite blocks is greater than the thermal conductivity of the protective structure. In the first direction, the thermal expansion coefficient of the graphite blocks is greater than the thermal expansion coefficient of the protective structure. In a direction orthogonal to the first direction, the thermal expansion coefficient of the protective structure is greater than the thermal expansion coefficient of the graphite blocks. The protective structure has one plate member, and the plurality of graphite blocks are positioned side by side on one principal surface of the plate member.
This image processing device that can cooperate with a voice device having a voice notification function comprises: an image processing unit that performs image processing; and a display unit that displays information related to the image processing, the display unit displaying, in synchronization with the voice notification, character information corresponding to voice notification related to the image processing from the voice device and/or an information code that can be converted into character information corresponding to the voice notification.
Provided is an image processing device capable of operation instruction given by a voice via a voice device having a voice notification function, the image processing device comprising an image processing unit for performing image processing, and a display unit for displaying information related to the image processing. The display unit displays a content image to be subjected to the image processing based on the operation instruction given by the voice.
A laminate according to the present disclosure includes a base material layer, a dielectric layer, and a first conductor. The base material layer contains a thermoplastic resin, and the dielectric layer contains a thermosetting resin. The dielectric layer is layered on at least one surface of the base material layer via the first conductor.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
This wiring board comprises: a plate-shaped insulating substrate having a first board surface; and a wiring conductor positioned inside and on a surface of the insulating substrate. The first board surface has a mounting region for an electronic component, and a first raised region and a second raised region that have raised portions respectively positioned on one side and the other side of the mounting region.
This wiring board comprises a ceramic insulating base and internal wiring located inside the insulating base. The internal wiring includes a sintered body of a plurality of crystal grains mainly composed of copper, and a plurality of glass particles. In a cross section orthogonal to the longitudinal direction of the internal wiring, the internal wiring includes a central region, an intermediate region that surrounds the central region and has more glass particles distributed than the central region, and an outer peripheral region that is a region between the intermediate region and the outer periphery of the internal wiring and in which the distribution of the glass particles is smaller than in the intermediate region. The area density of the glass particles in the outer peripheral region is lower than in the central region and also lower than in the intermediate region.
A wiring board according to the present disclosure includes: a first insulating layer having a first surface; a first conductor layer positioned on the first surface; a second insulating layer positioned so as to cover the first surface and the first conductor layer, and having a second surface facing the first surface and a third surface opposite to the second surface; and an etched groove recessed from the third surface toward the second surface. When viewed in a plan view, the etched groove has a first region where the etched groove and the first conductor layer overlap, and a second region where the etched groove and the first conductor layer do not overlap. The etched groove has a first bottom portion in the first region and a second bottom portion in the second region. The depth from the third surface to the first bottom portion is less than the depth from the third surface to the second bottom portion.
This multilayered substrate comprises an insulating layer, a pair of conductor layers, and a connection conductor. The insulating layer has a first surface and a second surface positioned on the opposite side to the first surface. The conductor layers in the pair are respectively positioned on the first surface and the second surface of the insulating layer. The connection conductor penetrates the insulating layer and electrically connects the pair of conductor layers to each other. The connection conductor has a conductive member and a coating portion in contact with at least a portion of the surface of the conductive member. The coating portion contains a metal component and an inorganic powder component. The area ratio of the metal component in a cross-sectional view of the coating portion is at least 40 area%.
H05B 3/18 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur le conducteur étant enrobé dans un matériau isolant
This electrochemical cell device comprises an electrochemical cell and a gas supply unit that supplies gas to the electrochemical cell. The electrochemical cell has: a flow path member having a gas flow path, a gas introduction part, and a gas discharge part; and an element part positioned on the flow path member. The gas introduction part introduces the gas into the gas flow path. The gas discharge part discharges the gas from the gas flow path. At least one of the gas introduction part and the gas discharge part has an adjustment part for adjusting a pressure loss generated during passage of the gas. In the adjustment part, the introduction direction of the gas introduced from the gas supply part to the gas introduction part and/or the discharge direction of the gas discharged from the gas discharge part is orthogonal to the direction of flow of the gas in the gas flow path.
H01M 8/0258 - CollecteursSéparateurs, p. ex. séparateurs bipolairesInterconnecteurs caractérisés par la configuration des canaux, p. ex. par le champ d’écoulement du réactif ou du réfrigérant
H01M 8/04 - Dispositions auxiliaires, p. ex. pour la commande de la pression ou pour la circulation des fluides
H01M 8/12 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé
H01M 8/1213 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support
H01M 8/1226 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support caractérisés par la couche de support
H01M 8/2432 - Groupement d'éléments élémentaires de forme plane
H01M 8/2475 - Enceintes, boîtiers ou récipients d’empilements d’éléments à combustible
H01M 8/2484 - Détails des groupements d'éléments à combustible caractérisés par les collecteurs d’admission externes
A droplet ejection head according to the present disclosure has a head body, a driver IC, and a head cover. The head body has a plurality of ejection holes through which droplets are ejected. The driver IC controls driving of the head body. The head cover is positioned on the head body. The head cover integrally has a first side wall, a second side wall, a third side wall, and a fourth side wall. The first side wall is positioned on one-end side of the head body in the longitudinal direction. The second side wall is positioned on the other-end side of the head body in the longitudinal direction. The third side wall is positioned on one-end side of the head body in the lateral direction, and is continuous with the first side wall and the second side wall. The fourth side wall is positioned on the other-end side of the head body in the lateral direction, and is continuous with the first side wall and the second side wall.
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
This wiring board is provided with an insulating substrate, a first electrode, a first conductor, a second conductor, and a second electrode. The insulating substrate has a first surface and a second surface located opposite the first surface. The insulating substrate includes: a first base material containing a ceramic material; and a second base material containing an organic resin and bonded to the first base material. The first electrode is located above the second base material and is electrically connected to an electronic element. The second conductor extends from the first electrode into the second base material. The first conductor is located in the first base material and is electrically connected to the second conductor. The second electrode is electrically connected to the first electrode via at least the second conductor among the first conductor and the second conductor. The first conductor contains a first metal. The second conductor contains a second metal different from the first metal. The electrical resistivity of the first metal is higher than the electrical resistivity of the second metal.
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/08 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques le matériau étant un isolant électrique, p. ex. du verre
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
An electrochemical cell according to the present invention comprises a metal plate and an element part. The metal plate has a first surface, a second surface, and a plurality of through holes which include at least one first hole. The second surface is located on the opposite side from the first surface. The plurality of through holes each have a first opening which is located on the first surface. The element part has a first layer which faces the first surface, a solid electrolyte layer, and a first electrode which is located on the opposite side of the solid electrolyte layer from the first layer. The first layer has a protrusion part which extends into the first hole. The protrusion part covers the edge of the first opening of the first hole and at least a portion of the wall surface of the first hole.
H01M 8/1213 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support
H01M 8/04 - Dispositions auxiliaires, p. ex. pour la commande de la pression ou pour la circulation des fluides
H01M 8/12 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé
H01M 8/1226 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support caractérisés par la couche de support
H01M 8/2475 - Enceintes, boîtiers ou récipients d’empilements d’éléments à combustible
The present invention provides a wiring board comprising a first insulating substrate, a second insulating substrate, a first internal conductor, a second internal conductor, and an interlayer conductor. The first internal conductor has a first via conductor and a first land conductor, and the second internal conductor has a second via conductor and a second land conductor. The coefficient of thermal expansion of the second insulating substrate is different from the coefficient of thermal expansion of the first insulating substrate. The interlayer conductor electrically connects the first via conductor and the second via conductor, and provided that L0 is the minimum distance between the outer edge of the first via conductor and the outer edge of the interlayer conductor, L1 is the minimum distance between the outer edge of the first via conductor and the outer edge of the first land conductor, and L2 is the minimum distance between the outer edge of the second via conductor and the outer edge of the second land conductor in a plan view as seen from a direction perpendicular to a first surface, L0 is greater than L1 and L2.
The present invention achieves, inter alia, a holder where replacement work of a first member is facilitated while having a high level of holding stability. The holder is such that a protruding part has a first side, a second side, a first projection, and a second projection, and a hole has a third side and a fourth side. The first projection abuts the third side, the first side is separated from the third side, the second projection abuts the fourth side, and the second side is separated from the fourth side.
The present invention achieves a cutting tool, or the like, having a cutting insert with high durability and seating stability. The cutting insert of the cutting tool has a through-hole that is open so as to penetrate from a first surface-side to a second surface-side, and a pocket of the cutting tool has a screw hole that is open in a first groove. A screw is inserted into the through-hole and screwed into the screw hole.
This audio processing device comprises: an acquisition unit that acquires audio data obtained by collecting sound occurring around a user, and motion data obtained by detecting the user's movement; and a control unit that determines a selection direction on the basis of the motion data, and generates reproduction data by giving greater weight to sound occurring in the selection direction than to sound occurring in other directions.
An epoxy resin composition according to the present disclosure contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) silica, and (E) alumina. The curing accelerator (C) has a reaction initiation temperature of the curing reaction of 125-150°C when the addition amount per 100 parts by mass of a mixture of a cresol novolac-type epoxy resin and a novolac-type phenolic resin (1 mol of a hydroxyl group of a novolac-type phenolic resin with respect to 1 mol of an epoxy group of a cresol novolac-type epoxy resin) is 1 part by mass. The silica (D) has a specific particle diameter, and the contents of the silica (D) and the alumina (E) are specific amounts.
A treatment liquid for inkjet textile printing according to one embodiment of the present invention contains a water-soluble cationic polymer and ammonium formate.
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
B41M 5/00 - Procédés de reproduction ou méthodes de reproduction ou de marquageMatériaux en feuilles utilisés à cet effet
C09D 11/38 - Encres pour l'impression à jet d'encre caractérisées par des additifs non macromoléculaires autres que les solvants, les pigments ou les colorants
D06B 11/00 - Traitement limité à certaines parties de matières textiles, p. ex. teinture partielle
D06C 23/00 - Production de motifs ou de dessins sur tissus
D06P 5/00 - Autres caractéristiques de la teinture ou de l'impression des textiles ou de la teinture du cuir, des fourrures ou des substances macromoléculaires de toutes formes
A composite wiring board according to the present disclosure comprises: a base board; and a relay board that is electrically connected to the base board via a bonding material. The base board has: a first core substrate; a first organic substrate that is formed from an organic resin and is bonded to the first core substrate; and a plurality of first wirings positioned inside the first organic substrate. The relay board has a second core substrate, a second organic substrate that is formed from an organic resin and is bonded to the second core substrate, and a plurality of second wirings positioned inside the second organic substrate. The thermal expansion coefficient of the relay board is smaller than the thermal expansion coefficient of the base board.
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
23.
DRYING DEVICE FOR INKJET PRINTING, RECORDING SYSTEM, RECORDING DEVICE, AND PRINTING METHOD
A drying device for inkjet printing, wherein an irradiation unit that emits ultraviolet light faces a path along which a recording medium is conveyed and is positioned on a path leading from a first blowing unit for blowing warm air to a first suction unit for suctioning gas.
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
This liquid discharge head comprises: a first member (2) having a pressure chamber (21), a vibration plate (23) located above the pressure chamber (21), and a piezoelectric element (24) located above the diaphragm (23) corresponding to the pressure chamber (21); and a second member (3) located above the first member (2) and having a supply path through which a liquid can be supplied to the pressure chamber (24). The first member (2) is provided with an amorphous silicon layer (29), and the first member (1) and the second member (3) are mutually joined with the amorphous silicon layer (29) therebetween.
A mounting structure according to the present disclosure includes: a wiring board having a first surface and a second surface located on the opposite side from the first surface; an electronic component located on the first surface; and a stiffener located on the first surface so as to surround the electronic component. The wiring board includes a substrate with an insulating layer and a conductor layer. Provided that a first portion is defined to be the electronic component and the portion of the wiring board spanning from the first surface to the second surface where the electronic component is located, a second portion is defined to be the stiffener and the portion of the wiring board spanning from the first surface to the second surface where the stiffener is located, a first lower portion is defined to be the side containing the second surface as bounded by a first imaginary line bisecting the thickness of the first portion, and a second lower portion is defined to be the side containing the second surface as bounded by a second imaginary line bisecting the thickness of the second portion, a first member having a first coefficient of thermal expansion smaller than the coefficient of thermal expansion of the substrate is located in the first lower portion, and/or a second member having a second coefficient of thermal expansion larger than the coefficient of thermal expansion of the substrate is located in the second lower portion.
The present invention generates an inspection image by which an inspection of gloss can be executed with higher accuracy. An inspection image generation device according to an aspect of the present disclosure comprises: an acquisition unit that acquires a plurality of first images captured by illuminating an object from any of a plurality of different illumination directions; and a generation unit which, on the basis of an average value of the luminance values of each pixel in the plurality of first images and at least one luminance value higher than the average value among the luminance values of each of the plurality of pixels of the plurality of first images, generates an inspection image for carrying out an inspection pertaining to the gloss of the object.
A floating image display device according to the present disclosure includes a display device and a reflective element that reflects image light from the display device and displays the reflected image light as a floating image. The reflective element includes a transparent substrate having a first surface and a second surface, and reflective surfaces disposed inside the transparent substrate and arranged parallel to each other at intervals such that the surface direction intersects the first surface. The reflective surfaces include a plurality of first reflective surfaces located closer to the first surface, a plurality of third reflective surfaces and a plurality of second reflective surfaces each located on the second surface side from the plurality of first reflective surfaces, the plurality of second reflective surfaces having a different arrangement direction than the plurality of first reflective surfaces and the plurality of third reflective surfaces having a different arrangement direction than the plurality of second reflective surfaces, and a plurality of fourth reflective surfaces located closer to the second surface than the plurality of second reflective surfaces and the plurality of third reflective surfaces, the plurality of fourth reflective surfaces having a different arrangement direction than the plurality of third reflective surfaces. The image light is reflected successively by the first, second, third, and fourth reflective surfaces.
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p. ex. des voxels en projetant une image aérienne ou flottante
G02B 5/09 - Miroirs à facettes multiples ou polygonales
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C01B 32/949 - Carbures de tungstène ou de molybdène
C22C 1/051 - Fabrication de métaux durs à base de borures, de carbures, de nitrures, d'oxydes ou de siliciuresPréparation du mélange de poudres utilisé comme matière première à cet effet
This wiring board comprises an insulation board, a first electrode, a first conductor, a second conductor, and a second electrode. The insulation board has a first surface and a second surface which is located opposite to the first surface. The insulation board includes a first base material which contains ceramic, and a second base material which contains an organic resin and is joined to the first base material. The first electrode is located on the first base material and electrically connected to an electronic element. The first conductor extends from the first electrode to the inside of the first base material. The second conductor is located in the second base material and electrically connected to the first conductor. The second electrode is electrically connected to the first electrode via at least the first conductor, among the first conductor and the second conductor. The first conductor contains a first metal. The second conductor contains a second metal which is different from the first metal. The electric resistivity of the first metal is higher than that of the second metal.
H01L 23/08 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques le matériau étant un isolant électrique, p. ex. du verre
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
This wiring board comprises: a first base material including an organic material; a second base material mainly made of an inorganic material and joined to the first base material; and first wiring positioned at least inside the first base material. The first wiring is provided with a first via conductor penetrating at least a part of the first base material, a first wiring layer electrically connected to the first via conductor, and a first alloy layer positioned at the boundary surface between the first via conductor and the first wiring layer. The first via conductor contains a first metal and a second metal different from the first metal. The first wiring layer contains a third metal. The first alloy layer contains an alloy of the second metal and the third metal.
The present invention comprises a first insulating substrate, a second insulating substrate, a first internal conductor, a first conductor layer, a second conductor layer, and a second internal conductor. The first insulating substrate has a first surface and contains a glass material. The second insulating substrate is positioned partially in contact with the first surface and contains a resin material. The first internal conductor is located in the first insulating substrate. The first conductor layer is positioned on the first surface and is electrically connected to the first internal conductor. The second conductor layer is positioned on the first conductor layer. The second internal conductor is located in the second insulating substrate and is electrically connected to the second conductor layer. The thermal conductivity of the first insulating substrate is higher than the thermal conductivity of the second insulating substrate. The first conductor layer contains a glass material. The second internal conductor and the second conductor layer contain the same metallic material.
This light-source module includes: a light-emitting unit including a plurality of light-emitting elements; a heat dissipating member; a cover member having a first opening; a light-transmitting member that closes the first opening; a first cable that is electrically connected to the light emitting unit; and a sealing material composed of a resin. The sealing material closes a first gap between the heat dissipating member and the cover member along the peripheral edge of the first gap. The heat dissipating member includes: a base section having a first surface and a second surface; and a plurality of protrusions each protruding from the second surface. The light-emitting unit is positioned between the first surface and the light-transmitting member. The cover member includes a third surface and a fourth surface, and has a recess on the third surface side. The first opening is open at the recess. The first cable is inserted into the second opening between the recess and the base section. The first cable penetrates the sealing material. The sealing material closes the second opening.
H10H 20/858 - Moyens d’extraction de la chaleur ou de refroidissement
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
H10H 20/00 - Dispositifs individuels émetteurs de lumière à semi-conducteurs inorganiques ayant des barrières de potentiel, p. ex. diodes électroluminescentes [LED]
A heater according to the present disclosure comprises: a ceramic substrate; a heating resistor; two lead parts; two surface electrodes; and a plurality of via conductors. The heating resistor is embedded in the ceramic substrate on one end side in the longitudinal direction thereof. The two lead parts are embedded in the ceramic substrate on the other end side in the longitudinal direction thereof, and are respectively connected to one end and the other end of the heating resistor. The two surface electrodes are respectively positioned on both principal surfaces of the ceramic substrate. The plurality of via conductors respectively connect one of the two lead parts and one of the two surface electrodes, and the other of the two lead parts and the other of the two surface electrodes. In the heater, the thickness of a portion of the lead parts that is connected with the via conductors is greater than the thickness of the other portions of the lead parts.
H05B 3/18 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur le conducteur étant enrobé dans un matériau isolant
H05B 3/20 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes
A communication control method according to one aspect of the present invention is a method for controlling communication in a mobile communication system. The communication control method includes a step in which a user device acquires model identification information for identifying an AI/ML model and additional information of the AI/ML model. The communication control method also includes a step in which the user device transmits the model identification information to a network device. Here, said step for transmission includes a step in which the user device transmits the model identification information to the network device when it is determined on the basis of the additional information that inference with respect to the AI/ML model is possible.
According to the present disclosure, a method for manufacturing a layered electronic component includes: a preparation step for producing a layered body sheet by layering a plurality of green sheets on which conductive films are formed that constitute a plurality of internal electrodes positioned and aligned in a first direction and a second direction; a cutting step for cutting the layered body sheet in the first direction and the second direction to produce a plurality of layered body chips; a mounting step for mounting the plurality of layered body chips so that the same are aligned on a flat mounting surface of a mounting stand; an adhesion step for pressing the plurality of layered body chips in the second direction and adhering side surfaces of the layered body chips to an adhesion surface of a retaining sheet; and a movement step for moving the retaining sheet in a third direction to move the layered body chips.
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances
An electromagnetic wave irradiation device 1 comprises: an irradiation unit 10 that outputs an electromagnetic wave L1; a scanning unit 20 that changes an irradiation direction of the electromagnetic wave L1 in a plurality of different directions to output the electromagnetic wave L1 to a scanning area; a control unit 70 that controls the irradiation unit 10 and the scanning unit 20 to change the irradiation direction of the electromagnetic wave L1 and radiate the electromagnetic wave L1 a plurality of times in one cycle; and a detection unit 40 that detects a reflection wave L2 obtained by reflection of the electromagnetic wave L1 by a material body present in the scanning area, wherein the presence or absence or position of an object S to be detected in the scanning area is determined on the basis of first measurement information generated on the basis of the reflection wave L2 obtained by reflection of the electromagnetic wave L1 radiated a plurality of times during a partial period included in one cycle by the material body.
This multilayer ceramic capacitor comprises a laminate and external electrodes. The laminate is obtained by alternately layering an internal electrode and a dielectric layer, and has a first surface and a second surface which are opposite from each other in the layering direction. The external electrodes include a first external electrode and a second external electrode. The first external electrode and the second external electrode each have a main surface electrode part that is positioned at least on the first surface. The main surface electrode part or a region of the laminate that contacts the main surface electrode part has a first portion and a second portion which is has a greater thickness than the first portion and which, as viewed in the layering direction, is positioned closer to the center of the laminate than the first portion.
A waveguide substrate (1) according to the present disclosure comprises a substrate (10), a waveguide (20), and a mirror (30). The waveguide (20) is located on the substrate (10) and has a core (40) and a cladding (50) that covers at least a portion of the periphery of the core. The mirror (30) has a mirror surface (301) that faces an end of the core (40) in the longitudinal direction and that is inclined with respect to the plate surface of the substrate. The mirror reflects electromagnetic waves incident from the thickness direction of the substrate and introduces the electromagnetic waves into the core (40), or reflects electromagnetic waves incident from the core (40) in the thickness direction of the substrate. When an arbitrary position of the waveguide is defined as a first position (P1) and a position closer to the mirror than the first position is defined as a second position (P2), the thickness (T2) of the core at the second position is larger than the thickness (T1) of the core at the first position.
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
39.
SEMICONDUCTOR SUBSTRATE, METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE
This semiconductor substrate comprises: a template substrate having a seed part and a non-seed part; and a GaN-based semiconductor part that is positioned above the template substrate and has a base part positioned on the seed part and a wing part connected to the base part. The wing part has a first portion that contains carbon at a concentration of 1019/cm3 or more and is positioned above the non-seed part, and a second portion that contains carbon at a concentration higher than that of the first portion and is positioned above the non-seed part.
H01L 21/205 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale en utilisant la réduction ou la décomposition d'un composé gazeux donnant un condensat solide, c.-à-d. un dépôt chimique
C30B 25/18 - Croissance d'une couche épitaxiale caractérisée par le substrat
This composite resonator comprises: a first electrode that constitutes a first resonator and is disposed on a first surface; and a second electrode that constitutes a second resonator and is disposed on a second surface which is separated from the first surface in a first direction. In a plan view along a direction orthogonal to the first surface and the second surface, the second electrode has a rotationally-symmetrical opening located in a portion that faces a portion of the first electrode where the magnetic field is relatively small. In a plan view along the direction orthogonal to the first surface and the second surface, the first electrode and the second electrode overlap with each other in a rotationally symmetrical manner.
This unit structure constitutes a resonator and comprises a first electrode that that is disposed on a first surface and a second electrode that is disposed on a second surface separate from the first surface in a first direction. In a plan view from a direction orthogonal to the first surface and the second surface, the second electrode has an opening. The first electrode is constituted by one or more electrodes. In a plan view from a direction orthogonal to the first surface and the second surface, at least one electrode constituting the first electrode has one end part that overlaps with the second electrode and another end part that does not overlap with the second electrode.
Method and system are provided for reducing the AWV table size for phased array-antenna. In one novel aspect, primitive AWV and beam steering AWV are generated and stored for phased-array antenna module. In one embodiment, the phased-array antenna system obtains a primitive AWV table, wherein each primitive beam is selected from a group of beams with similar beam properties, obtains a beam steering AWV table with a set of steering vectors for a set of beams, wherein a set of beam composite AWVs for the set of beams are derived by applying corresponding steering vector in the beam steering AWV table to a primitive composite AWV in the primitive AWV table, and stores the primitive AWV table and the beam steering AWV table in the PAAM. In one embodiment, the primitive AWV table and the beam steering AWV table are generated based on one more criteria to minimize distortion.
H01Q 3/28 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier l'amplitude
H01Q 3/34 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier la phase par des moyens électriques
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
43.
NETWORK NODE, USER DEVICE, AND COMMUNICATION METHOD
A network node according to one aspect is a network node that manages cells in a mobile communication system. The network node has: a control unit that sets, as different synchronization signal blocks, each of a plurality of synchronization signal blocks that can be simultaneously transmitted at different frequencies within the band of a cell; and a transmission unit that transmits setting information indicating the setting.
H04W 72/23 - Canaux de commande ou signalisation pour la gestion des ressources dans le sens descendant de la liaison sans fil, c.-à-d. en direction du terminal
H04W 16/28 - Structures des cellules utilisant l'orientation du faisceau
A network node according to one aspect manages cells in a mobile communication system. The network node has a transmission unit that transmits multiple pieces of bit map information each indicating whether or not to transmit a synchronization signal block within one cycle period of a predetermined frequency, the bit map information being different according to the position of user equipment relative to the network node.
A network node according to an aspect of the present invention manages cells in a mobile communication system. The network node has a transmission unit that transmits a plurality of bit map information items that are different by type and that indicate whether or not to transmit synchronization signal blocks within one cycle period of a prescribed frequency.
H04W 48/10 - Distribution d'informations relatives aux restrictions d'accès ou aux accès, p. ex. distribution de données d'exploration utilisant des informations radiodiffusées
H04W 48/16 - ExplorationTraitement d'informations sur les restrictions d'accès ou les accès
This laminated electronic component comprises an effective part and a cover. The effective part comprises dielectric layers and internal electrodes which are laminated alternatingly in a lamination direction. The cover overlaps with the effective part in the lamination direction. The cover comprises a plurality of insulating layers laminated in the lamination direction and dummy electrodes positioned between the plurality of insulating layers. The dummy electrodes each have at least one oxidation region.
In this laminated electronic component, an active portion has dielectric layers and internal electrodes which are alternately laminated in a lamination direction. A cover overlaps the active portion from a first side in the lamination direction. A base electrode overlaps the cover from the first side. The active portion has an end surface facing a third side among the third side and a fourth side in a first direction intersecting the lamination direction. Each of the plurality of internal electrodes has an exposed edge that is exposed from the end surface. At least some of the plurality of exposed edge portions have different positions in the first direction. The base electrode is positioned in a region on the third side among the surface of the cover on the first side. Among the plurality of exposed edge portions, the position of the exposed edge portion positioned closest to the fourth side is referred to as the deepest position. At this time, the edge portion of the base electrode on the third side is positioned at the same position as the deepest position or more on the fourth side than the deepest position.
In this laminated electronic component, an effective portion has a dielectric layer and an internal electrode which are alternately laminated in the lamination direction. A cover overlaps the effective portion from a first side in the lamination direction. A base electrode overlaps the cover from the first side. An external electrode overlaps the base electrode from the first side. The base electrode and the external electrode are fixed by sharing a diffusion layer in which a material of the base electrode and a material of the external electrode are mixed with each other.
According to the present disclosure, a wiring board comprises: an insulating layer including a first surface and a second surface positioned opposite to the first surface; a first wiring conductor positioned in a groove recessed from the first surface toward the second surface and including a narrow pattern having a width of 15 μm or less; and a second wiring conductor positioned on the first surface and including a wide pattern having a width of 150 μm or more. The first wiring conductor includes: a first base metal layer positioned on an inner wall surface of the groove; and a first electrolytic plating layer positioned on the first base metal layer and filled in the groove. The second wiring conductor includes: a second base metal layer positioned on the first surface; and a second electrolytic plating layer positioned on the second base metal layer.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
This setting method includes: receiving, by a terminal device, selection of at least one setting position from among a plurality of preset setting positions; and receiving, by the terminal device, a setting related to lighting with respect to at least one setting position for which the selection was received.
H05B 47/125 - Commande de la source lumineuse en réponse à des paramètres détectés en détectant la présence ou le mouvement d'objets ou d'êtres vivants en utilisant des caméras
H05B 45/12 - Commande de l'intensité de la lumière à l'aide d'un retour optique
H05B 47/11 - Commande de la source lumineuse en réponse à des paramètres détectés en détectant la luminosité ou la température de couleur de la lumière ambiante
H05B 47/19 - Commande de la source lumineuse par télécommande via une transmission sans fil
51.
CONTROL DEVICE, HOLDING TOOL, TOOL SET, END EFFECTOR, ROBOT, PROGRAM, AND CONTROL METHOD
A control device according to the present invention comprises a control unit that controls at least a part of a robot system which performs a holding operation with respect to an object to be held. The control unit acquires object information pertaining to the object to be held, and determines, on the basis of the acquired object information, a holding tool for use, which is to be used in the holding operation, from a plurality of types of holding tools.
According to the present invention, a communication method for performing serving cell switching for switching a serving cell of a user device from a first cell to a second cell includes: receiving, by a second network node managing the second cell, an uplink reference signal transmitted by the user device to a first network node managing the first cell; generating, by the second network node, timing error information on an error of the reception timing of the uplink reference signal with respect to the frame timing of the second cell on the basis of the uplink reference signal; and transmitting the timing error information to the first network node by the second network node.
A communication method for performing cell switching that switches a serving cell of user equipment from a first cell to a second cell includes: a first condition for executing early uplink synchronization with the second cell and/or a second condition for executing the cell switching being set as a condition for executing an operation related to the cell switching for the user equipment by a first network node that manages the first cell; and a notification indicating the execution of the operation being received by the first network node, on the basis of the condition being satisfied in the user equipment, from the user equipment or from a second network node that manages the second cell.
This electrochemical cell has an element part and a sealing material. The element part includes: a solid electrolyte layer that has a first surface; a first electrode that faces the first surface; and a second electrode that is positioned on the opposite side of the first electrode across the solid electrolyte layer. The sealing material has a portion that is located on the first surface, and covers an end surface of the second electrode. The first electrode has a second surface that is positioned on the opposite side from the solid electrolyte layer. When L1 is the length from the first surface to the second surface and L2 is the length from the end of the sealing material located on the first surface side to the first surface in a first direction that is perpendicular to the first surface, the sealing material has a portion where L2 is larger than the average of L1.
H01M 8/0276 - Moyens d’étanchéité caractérisés par leur forme
C25B 1/04 - Hydrogène ou oxygène par électrolyse de l'eau
C25B 9/00 - Cellules ou assemblages de cellulesÉléments de structure des cellulesAssemblages d'éléments de structure, p. ex. assemblages d'électrode-diaphragmeCaractéristiques des cellules relatives aux procédés
C25B 9/23 - Cellules comprenant des électrodes fixes de dimensions stablesAssemblages de leurs éléments de structure avec des diaphragmes comprenant des membranes échangeuses d'ions dans ou sur lesquelles est incrusté du matériau pour électrode
C25B 9/63 - Supports d'électrodesPositionnement des électrodes
H01M 8/04 - Dispositions auxiliaires, p. ex. pour la commande de la pression ou pour la circulation des fluides
H01M 8/12 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé
H01M 8/1226 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support caractérisés par la couche de support
H01M 8/2475 - Enceintes, boîtiers ou récipients d’empilements d’éléments à combustible
55.
CONDUCTIVE PASTE, METHOD FOR MANUFACTURING SAME, AND CONDUCTIVE FILM
This conductive paste contains a conductor, a binder resin, and cellulose nanofibers. When the content of the conductor is 100 parts by mass, the content of the binder resin is 0.5-2 parts by mass, and the content of the cellulose nanofibers is 0.175-0.35 parts by mass.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/10 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
This wiring board comprises a first base material and a second base material. The first base material includes a first surface and a second surface positioned opposite to the first surface, and contains an inorganic material as a material thereof. The second base material overlaps the first surface, is directly bonded to the first base material, and contains an organic material as a material thereof. The first surface includes a first central portion, and a first inclined portion positioned on an outer edge side of the first central portion and inclined toward the second surface toward the outer edge. The second base material extends from the first central portion to the first inclined portion along the first surface.
A diffusion plate (10) comprises a microlens array (110) in which a plurality of convex lenses (11) are aligned, and a glass substrate (120) that is bonded to the microlens array (110) via an adhesive layer (130). The adhesive layer (130) has an end (131) positioned outside the outer edge of the microlens array (110) in a plan view. The end (131) of the adhesive layer (130) may also be positioned outside the outer edge of the substrate (120) in a plan view. Furthermore, the end (131) of the adhesive layer (130) may have a surface inclined obliquely with respect to a first direction along the layering direction of the substrate (120) and the microlens array (110).
H10F 55/00 - Dispositifs à semi-conducteurs sensibles au rayonnement couverts par les groupes , ou structurellement associés à des sources lumineuses électriques et électriquement ou optiquement couplés avec lesdites sources
A network node according to a first aspect manages a cell in a mobile communication system, and comprises: a transmission unit that transmits, by beamforming, a synchronization signal block used in a cell search performed by a user device; and a control unit that performs beam sweeping for switching a transmission beam direction of the synchronization signal block at predetermined time intervals. The control unit controls the transmission unit to simultaneously transmit N (N: an integer of 2 or more) synchronization signal blocks in a band of the cell at different frequencies.
A network node according to one aspect is a network node that manages cells in a mobile communication system. The network node has: a control unit that sets a plurality of synchronization signal blocks that can be simultaneously transmitted at different frequencies within the band of a cell, as different synchronization signal blocks according to the type thereof; and a transmission unit that transmits setting information indicating the setting.
H04W 72/23 - Canaux de commande ou signalisation pour la gestion des ressources dans le sens descendant de la liaison sans fil, c.-à-d. en direction du terminal
A tool assembly according to one non-limiting aspect of the present disclosure includes: a holder that has a shape extending along a first central axis and having a first hole extending along the first central axis; a sleeve that has a cylindrical shape extending along a second central axis parallel to the first central axis, has a second hole extending along the second central axis, and is inserted into the first hole; and a cutting tool that has a columnar shape extending along a third central axis parallel to the second central axis, has a third hole extending along the third central axis, and is inserted into the second hole. The second hole has a bottom surface that is positioned on the rear end side in a direction along the second central axis and that is in contact with the cutting tool, and a through-hole that penetrates the bottom surface in a direction along the second central axis. The second hole is eccentric with respect to the second central axis.
A power conditioner (10) comprises a first connection terminal (11), a bidirectional DC/DC converter (12), a first relay (13), a first voltage sensor (14), a bidirectional inverter (15), and a control unit (16). The bidirectional DC/DC converter (12) is connected to the first connection terminal (11). The first relay (13) opens and closes an electrical connection between the first connection terminal (11) and the bidirectional DC/DC converter (12). The first voltage sensor (14) detects a voltage between the first connection terminal (11) and the first relay (13). The control unit (16) causes the bidirectional inverter (15) to carry out AC/DC conversion in the connection sequence. The control unit (16) switches the first relay (13) to ON after adjusting the DC voltage output from the bidirectional DC/DC converter (12) to the first connection terminal side to a first voltage in the connection sequence.
This semiconductor substrate comprises: a base substrate that includes, in the surface portion, a first crystal that is not a GaN-based semiconductor; a seed part that partially overlaps the base substrate; and a GaN-based semiconductor part located above the base substrate. The GaN-based semiconductor part has a base section that overlaps the seed part, and a wing section that does not overlap the seed part, that has a smaller threading dislocation density than the base section, and that contains a second crystal which is a GaN-based semiconductor. The first crystal and the second crystal are bonded via a boundary crystal layer that contains at least one main constituent element of the first crystal and at least one main constituent element of the second crystal.
C30B 25/04 - Dépôt suivant une configuration déterminée, p. ex. en utilisant des masques
H01L 21/20 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale
H01L 21/205 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale en utilisant la réduction ou la décomposition d'un composé gazeux donnant un condensat solide, c.-à-d. un dépôt chimique
H10D 62/85 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe III-V, p. ex. GaAs
63.
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM, AND PROGRAM
This information processing device is provided with a display unit, an input unit for receiving user input, and a control unit. The control unit displays, on the display unit, a layout of a candidate set for multiple hardware components required for work of a robot, and evaluation indices of the work according to the layout. When the input unit receives first input involving editing of the layout, the control unit acquires the evaluation indices based on the first input to redisplay the evaluation indices on the display unit.
G06F 3/04815 - Interaction s’effectuant dans un environnement basé sur des métaphores ou des objets avec un affichage tridimensionnel, p. ex. modification du point de vue de l’utilisateur par rapport à l’environnement ou l’objet
B25J 9/22 - Systèmes d'enregistrement ou de reproduction
G05B 19/4068 - Vérification d'un programme de pièce à l'écran, en dessinant ou par d'autres moyens
G05B 19/418 - Commande totale d'usine, c.-à-d. commande centralisée de plusieurs machines, p. ex. commande numérique directe ou distribuée [DNC], systèmes d'ateliers flexibles [FMS], systèmes de fabrication intégrés [IMS], productique [CIM]
This liquid discharge head has a first flow path and an actuator. The first flow path includes: a discharge hole for discharging liquid; a pressure chamber communicating with the discharge hole; and a portion on at least the pressure chamber side of a supply path for supplying the liquid to the pressure chamber. The actuator applies pressure to the pressure chamber. When a rectangular pulse for discharging by pull-push drive is applied to the actuator, the upper limit for each pulse width at which the liquid is ejected as a single droplet without splitting is referred to as the single-droplet upper-limit velocity, and a half of the natural vibration period of the liquid in the first flow path is referred to as AL. In this case, in the liquid discharge head, a predetermined condition relating to the minimum value of the single-droplet upper-limit velocity when the pulse width is within the range of AL ± 25% is satisfied.
B41J 2/015 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre caractérisés par le procédé de formation du jet
B41J 2/045 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre caractérisés par le procédé de formation du jet en produisant à la demande des gouttelettes ou des particules séparées les unes des autres par pression, p. ex. à l'aide de transducteurs électromécaniques
A composite wiring board according to the present disclosure includes a base substrate, a bonding material that is variable melting point type, and a relay substrate that is electrically connected to the base substrate by means of the bonding material. The base substrate has a first core base material, a first organic base material that is formed from an organic resin and is bonded to the first core base material, and a plurality of first wiring lines that are positioned inside the first organic base material. The relay substrate has a second organic base material that is formed from an organic resin, and a plurality of second wiring lines that are positioned inside the second organic base material. The second wiring lines each have a diffusion suppressing layer on side surfaces.
This semiconductor substrate comprises a template substrate, and a first semiconductor part that is positioned above a first seed region and a growth suppression region. The first semiconductor part includes a first wing part that is positioned above the growth suppression region. The first wing part has a first nitride semiconductor layer, an aluminum-based semiconductor layer that is positioned on the first nitride semiconductor layer, and a second nitride semiconductor layer that is positioned on the aluminum-based semiconductor layer. The upper surface of the second nitride semiconductor layer has a lower silicon concentration than the upper surface of the first nitride semiconductor layer.
H01L 21/20 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale
H01L 21/205 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale en utilisant la réduction ou la décomposition d'un composé gazeux donnant un condensat solide, c.-à-d. un dépôt chimique
H10H 20/825 - Matériaux des régions électroluminescentes comprenant uniquement des matériaux du groupe III-V, p. ex. GaP contenant de l’azote, p. ex. GaN
A wiring board comprising: a first base material containing ceramic as a material; a second base material containing an organic material as a material and joined to the first base material; a recessed part positioned astride the second base material and the first base material and penetrating at least the second base material; and wiring positioned inside the second base material, wherein the second base material has a covering part positioned further toward the inside of the recessed part than a side surface of the first base material constituting the inner surface of the recessed part and covering a part of the side surface.
This wiring board comprises a substrate body having: a first base material containing ceramic as a material; and a second base material laminated on the first base material and containing an organic material as a material. In a first direction view in which the substrate body is viewed from a lamination direction of the first base material and the second base material, the substrate body has a straight section extending linearly, and a first recessed section recessed inward from the straight section. The first recessed section has a first step portion at the boundary between the first base material and the second base material in a cross-section of a second direction view in which the substrate body is viewed from a direction crossing the lamination direction.
This heat dissipation substrate is provided with a base material. The base material has: a first plate having a mounting region for a heat source; a second plate positioned in the Z-direction of the first plate; an internal space positioned between the first plate and the second plate; and a support column that is positioned in the internal space and connects the first plate and the second plate along the Z-direction. The support column has a first portion in which a cross-sectional area perpendicular to the Z-direction increases partially within a range including a connected position with the first plate. The mounting region overlaps at least a part of an expanded portion, of the first portion, in which the cross-sectional area of the support column increases in a plan perspective view.
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A floating image display device according to the present disclosure comprises: a display unit having a display surface; a first concave mirror that reflects image light emitted from the display surface in a direction different from a direction toward the display unit; and a second concave mirror that reflects the image light reflected by the first concave mirror in a direction different from a direction toward the first concave mirror and forms an image as a floating image of a real image. A first inclination angle of the first concave mirror with respect to a first virtual plane encompassing the display surface has a size equal to or greater than a second inclination angle of the second concave mirror with respect to a second virtual plane encompassing a virtual image formation surface for the floating image.
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p. ex. des voxels en projetant une image aérienne ou flottante
This electronic device transmits and receives radio waves by a time division duplex system. The electronic device comprises: a transmission unit provided with at least one antenna; a reception unit provided with at least one antenna; a channel estimation unit; and a correction value calculation unit. The channel estimation unit estimates a first channel matrix that is the channel matrix of a first channel directed from the transmission unit to the reception unit, and a second channel matrix that is the channel matrix of a second channel directed from the reception unit to the transmission unit. The correction value calculation unit calculates a correction value for establishing the reciprocity between the first channel and the second channel on the basis of the difference between the first channel matrix and the second channel matrix.
H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
H04B 7/08 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station de réception
72.
LIQUID DISCHARGE HEAD, RECORDING DEVICE, AND LEVEL SHIFTER
In a shifter body according to the present invention, a first FET of a first type and a second FET of the first type are connected in order from the power supply voltage side to the actuator side. A third FET of a second type and a fourth FET of the second type are connected in order from the actuator side to the reference potential side. An intermediate wire applies an intermediate potential between the reference potential and the power supply voltage to the gate of the second FET and the gate of the third FET. In bootstrapping, a first relay line connects an input section and the gate of the first FET. A second relay line connects the input section and the gate of the fourth FET. A capacitor is positioned on the first relay line. A diode connects the first FET side of the capacitor and the intermediate wire. When the first type is p-type, the cathode is connected to the capacitor side, and when the first type is n-type, the anode is connected to the capacitor side.
H03F 3/16 - Amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge ou uniquement des dispositifs à semi-conducteurs comportant uniquement des dispositifs à semi-conducteurs avec dispositifs à effet de champ
73.
ELECTRONIC DEVICE, METHOD FOR CONTROLLING ELECTRONIC DEVICE, AND PROGRAM
Provided is a method for controlling an electronic device used in measuring vibration of an object on the basis of electromagnetic waves reflected from the object, the control being carried out using calibration information stored in a calibration coefficient memory, the method comprising a calibration step for calibrating a result of measurement by the electronic device on the basis of a result of measuring the vibration of a reference vibration body.
This electromagnetic wave irradiation device is provided with: an irradiation unit (31) that irradiates electromagnetic waves; a lens group into which the electromagnetic waves are incident; and a changing unit that changes the irradiation direction of the electromagnetic waves that have passed through the lens group. The lens group includes a first anamorphic lens (41) configured so that the power thereof in a first direction perpendicular to the optical axis of the electromagnetic waves is greater than the power in a second direction perpendicular to the optical axis and the first direction. The spread angle of the electromagnetic waves in the first direction is greater than the spread angle in the second direction.
An electromagnetic wave radiation device 1 includes: a radiation part 11 for radiating an electromagnetic wave L1; a second detection part 82 for detecting the electromagnetic wave L1; a change part 40 for changing the radiation direction of the electromagnetic wave L1 radiated by the radiation part 11 along a first direction D1 and a second direction D2 intersecting the first direction D1; and a branching part 50b for guiding, to the second detection part 82, a portion of the electromagnetic wave L1 of which the radiation direction is changed by the change part 40.
An electromagnetic wave irradiation device 1 comprises: an irradiation unit 11 that irradiates electromagnetic waves L1; a second detection unit 82 that detects the electromagnetic waves L1; and a changing unit 40 that changes the irradiation direction of the electromagnetic waves L1 irradiated by the irradiation unit 11 so that such waves follow a first direction D1 and a second direction D2 crossing the first direction D1. The second detection unit 82 is disposed so as to be inclined with respect to a trajectory which indicates an irradiation-position change and which is based on a change in the irradiation direction of the electromagnetic waves L1 in the first direction D1, such irradiation position being on a surface of the second detection unit 82 that includes a detection surface.
This electromagnetic wave radiation device comprises: a second radiation unit (32) that radiates second electromagnetic waves; a detection unit that detects the second electromagnetic waves; a change unit that changes the travel direction of the second electromagnetic waves so that the irradiation position when a detection surface of the detection unit is irradiated with the second electromagnetic waves changes along a first direction and a third direction intersecting the first direction; and an optical system that reduces the change in the irradiation position of the second electromagnetic waves in the third direction on the detection surface of the detection unit.
A communication control method according to one aspect of the present invention is used in a wireless communication system. The communication control method includes a step in which an IoT device receives, from a communication node, at least one of a first unmodulated signal, a preamble signal, a signal representing identifier information of the IoT device, and a signal representing control information related to backscattering transmission, as a received signal. In addition, the communication control method includes a step in which the IoT device uses the received signal to perform backscattering transmission on a second unmodulated signal transmitted from the communication node.
H02J 50/20 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant des micro-ondes ou des ondes radio fréquence
H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
H04W 84/10 - Réseaux à petite échelleRéseaux faiblement hiérarchisés
An electromagnetic wave radiating device 1 comprises a radiating unit 11 for radiating electromagnetic waves L1, a first detecting unit 81 for detecting the electromagnetic waves L1, a second detecting unit 82 for detecting the electromagnetic waves L1, and a modifying unit 40 for changing the radiation direction of the electromagnetic waves L1 radiated by the radiating unit 11 along a first direction D1 and a second direction D2 intersecting the first direction D1, wherein: the first detecting unit 81 and the second detecting unit 82 are disposed in the path of at least a portion of the electromagnetic waves L1 of which the radiation direction is changed by the modifying unit 40; and the second detecting unit 82 is disposed in a position in which a change in the trajectory of the electromagnetic waves L1 in a plane including a detecting surface of the second detecting unit 82, based on a change to the electromagnetic waves L1 in the second direction D2, is larger than the change in the trajectory of the electromagnetic waves L1 on a plane including a detecting surface of the first detecting unit 81.
A communication control method according to an aspect of the present invention is for a wireless communication system. The communication control method includes a step in which a communication node transmits, to an IoT device, at least one of a first unmodulated signal, a preamble signal, a signal indicating identifier information of the IoT device, and a signal indicating control information pertaining to back scattering transmission, as a transmission signal. Moreover, the communication control method includes a step in which the IoT device receives the transmission signal. Furthermore, the communication control method includes a step in which the communication node transmits a second unmodulated signal. Furthermore, the communication control method includes a step in which the IoT device uses the transmission signal to perform back scattering transmission in response to the second unmodulated signal.
H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
H04W 52/54 - Aspects de signalisation des instructions TPC, p. ex. structure de trame
The present invention reduces chatter vibrations in a ball-nose end mill. This ball-nose end mill has: bits in the form of projections; and discharge flutes. The bits have: a first cutting edge that, heading toward the rear end, parts away from the rotational shaft; and a second cutting edge that extends from the first cutting edge toward the rear end and that, heading toward the rear end, approaches the rotational shaft. The discharge flutes have a first rake face at least a portion of which is positioned along the first cutting edge, and a second rake face at least a portion of which is positioned along the second cutting edge. The rake angle of the first rake face and the rake angle of the second rake face grow larger heading toward the rear end, and the minimum degree of the rake angle of the second rake face is smaller than the maximum degree of the rake angle of the first rake face.
This display device comprises a display panel, a first retardation plate, a semi-transmissive mirror, a second retardation plate, and a reflective polarizing plate. The display panel emits display light. The first retardation plate is disposed to face the display panel. The second retardation plate is disposed apart from the first retardation plate. The reflective polarizing plate is disposed to face the second retardation plate, transmits first polarized light, and reflects second polarized light. The semi-transmissive mirror is disposed between the first retardation plate and the second retardation plate and has a reflection surface facing the second retardation plate. The first retardation plate and the second retardation plate make the display light into the first polarized light and the second polarized light.
B60K 35/21 - Dispositions de sortie, c.-à-d. du véhicule à l'utilisateur, associées aux fonctions du véhicule ou spécialement adaptées à celles-ci utilisant une sortie visuelle, p. ex. voyants clignotants ou affichages matriciels
G02B 30/26 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques en fournissant des première et seconde images de parallaxe à chacun des yeux gauche et droit d’un observateur du type autostéréoscopique
G02B 30/30 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques en fournissant des première et seconde images de parallaxe à chacun des yeux gauche et droit d’un observateur du type autostéréoscopique comprenant des barrières de parallaxe
G02F 1/13 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des cristaux liquides, p. ex. cellules d'affichage individuelles à cristaux liquides
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
G02F 1/13363 - Éléments à biréfringence, p. ex. pour la compensation optique
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
83.
MODEL DETERMINATION DEVICE, PREDICTION DEVICE, AND MODEL DETERMINATION METHOD
A model determination device according to the present invention includes: a first creation unit that creates first data indicating a set consisting of multiple pairs of a first variable and a second variable used when constructing a prediction model that outputs a predicted value of the discharge capacity of a manufactured secondary battery; a second creation unit that creates second data indicating a set consisting of multiple pairs of a first variable and a second variable measured when inspecting the secondary battery that is the object of the predicted value output; and a determination unit that determines whether the second data is similar to the first data on the basis of the results of statistical processing performed on the first data and the second data.
A printing system according to an aspect of the present invention comprises: a printer; a speech input/output unit that receives a speech input; a speech processing server that generates a control instruction on the basis of the speech input received by the speech input/output unit; and a printer control server that controls the printer on the basis of the control instruction. The printer transmits printer state information regarding the state of the printer to the speech processing server without going through the printer control server. The speech processing server causes the speech input/output unit to output speech based on the printer state information.
User equipment according to the present invention performs wireless communication with a node in a mobile communication system and comprises: a reception unit that receives a first reference signal transmitted by the node; a control unit that measures a first reference signal resource, calculates, on the basis of the measurement of the first reference signal resource, a precoder used for transmission of a physical uplink shared channel, and applies the precoder to the physical uplink shared channel; and a transmission unit that transmits, to the node, the physical uplink shared channel to which the precoder has been applied.
This piezoelectric device comprises: a package having a recess, with an electrode pad positioned within the recess; and a piezoelectric vibration element joined to the electrode pad by a joining member. The piezoelectric vibration element is substantially rectangular when observed in plan view, and comprises: a vibrating unit: and a thick part that is thicker than the vibrating unit and that is arranged, with the vibrating unit, in an X direction, the X direction extending along the longitudinal direction of at least the piezoelectric vibration element. The joining member joins the thick part and the electrode pad at at least two locations. The center position of the joining member in plan view, from a side surface on the thick part side in the X direction, is located within a range from 0.21 to 0.61 times a first length which extends in the X direction of the piezoelectric vibration element.
A cutting insert according to one non-limiting aspect of the present disclosure has a main body portion and a cutting portion positioned on a tip end side of the main body portion. The cutting portion has an upper surface that extends from a tip end surface toward the main body portion. The upper surface has a pair of first breaker projections, each extending from the main body portion side toward the tip end surface, and a pair of second breaker projections, extending respectively from the first breaker projections toward the tip end surface. Each of the pair of first breaker projections has a forward surface positioned on the tip end side and having a flat inclined region. The pair of second breaker projections each have a curved surface shape and extend respectively from the forward surfaces of the pair of first breaker projections toward the tip end surface.
B23B 27/16 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants interchangeables, p. ex. pouvant être fixés par des brides
88.
GENERATION METHOD, TRAINING METHOD, GENERATION DEVICE, CONTROL PROGRAM, AND RECORDING MEDIUM
The present invention generates training images that make it possible to reduce the risk of lowering the accuracy of a machine learning model for cases in which images that include at least a portion of a subject are used as the training images. The present invention comprises: an acquisition step in which a first image that includes at least a portion of a subject is acquired; and a generation step in which image processing is performed on the first image, and a training image to be used for training a machine learning model is generated.
A61B 6/46 - Agencements pour l’interface avec l’opérateur ou avec le patient
A61B 6/00 - Appareils ou dispositifs pour le diagnostic par radiationsAppareils ou dispositifs pour le diagnostic par radiations combinés avec un équipement de thérapie par radiations
A61B 6/50 - Appareils ou dispositifs pour le diagnostic par radiationsAppareils ou dispositifs pour le diagnostic par radiations combinés avec un équipement de thérapie par radiations spécialement adaptés à des parties du corps spécifiquesAppareils ou dispositifs pour le diagnostic par radiationsAppareils ou dispositifs pour le diagnostic par radiations combinés avec un équipement de thérapie par radiations spécialement adaptés à des applications cliniques spécifiques
A wiring board according to the present disclosure comprises: a first base material; a second base material that is made of an organic resin, that contains a plurality of inorganic particles, and that is bonded to the first base material; and wiring that is located on the second base material. The first base material has higher rigidity than the second base material. The second base material includes: a first organic resin layer; and a second organic resin layer laminated on the first organic resin layer. If a region, in the first organic resin layer, which faces the wiring and which is part of an interface region that interfaces the second organic resin layer is defined as a first wiring region, and a region, in the interface region, which faces the second organic resin layer is defined as a first bonding region, the content of the inorganic particles in the first bonding region is lower than the content of the inorganic particles in the first wiring region.
This electrochemical cell comprises a metal plate and an element section. The element section has a flat plate shape and is disposed on the metal plate. The element section has a solid electrolyte layer, a first electrode, and a second electrode. The solid electrolyte layer has a first surface located on a metal plate side, and a second surface on the opposite side to the first surface. The first electrode faces the first surface. The second electrode faces the second surface. When viewed in plan from a second electrode side, the solid electrolyte layer has a central part with an area centroid, and an edge part. When the distance from the metal plate to the second surface at the area centroid is L0 and the distance from the metal plate to the second surface at the edge part is L1, the solid electrolyte layer has a portion where L1 is smaller than L0.
H01M 8/1213 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support
C25B 1/042 - Hydrogène ou oxygène par électrolyse de l'eau par électrolyse de la vapeur
C25B 9/00 - Cellules ou assemblages de cellulesÉléments de structure des cellulesAssemblages d'éléments de structure, p. ex. assemblages d'électrode-diaphragmeCaractéristiques des cellules relatives aux procédés
C25B 13/05 - DiaphragmesÉléments d'espacement caractérisés par le matériau à base de matériaux inorganiques
H01M 8/04 - Dispositions auxiliaires, p. ex. pour la commande de la pression ou pour la circulation des fluides
H01M 8/12 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé
H01M 8/1226 - Éléments à combustible avec électrolytes solides fonctionnant à haute température, p. ex. avec un électrolyte en ZrO2 stabilisé caractérisés par la combinaison électrode/électrolyte ou par le matériau de support caractérisés par la couche de support
H01M 8/2475 - Enceintes, boîtiers ou récipients d’empilements d’éléments à combustible
91.
INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
This information processing system is provided with: an information acquisition unit that acquires action information pertaining to each action performed by a user during a period from wake-up to bedtime; a quality derivation unit that, on the basis of the action information, predicts sleep quality, which is the quality of sleep of the user after sleep onset; and an information presentation unit that presents, to the user, information indicating the predicted sleep quality.
G16H 20/70 - TIC spécialement adaptées aux thérapies ou aux plans d’amélioration de la santé, p. ex. pour manier les prescriptions, orienter la thérapie ou surveiller l’observance par les patients concernant des thérapies mentales, p. ex. la thérapie psychologique ou le training autogène
G16H 20/00 - TIC spécialement adaptées aux thérapies ou aux plans d’amélioration de la santé, p. ex. pour manier les prescriptions, orienter la thérapie ou surveiller l’observance par les patients
A wiring board according to the present disclosure comprises: a first base material; a second base material that contains a plurality of inorganic particles and is made from an organic resin bonded to the first base material; and wiring that is located in the second base material. The first base material is more rigid than the second base material. The second base material includes a first layer having a relatively low inorganic particle content and a second layer that is laid on the first layer and has a relatively high inorganic particle content. The first layer is in contact with the first base material.
SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND LIGHT-EMITTING ELEMENT
This semiconductor substrate comprises: a template substrate and a first semiconductor part located above the template substrate and including a nitride semiconductor. The first semiconductor part includes a first wing part. A gap is located between the first wing part and the template substrate. The first wing part has a plurality of projections that protrude downward. At least some of the plurality of projections have a tapered shape and have a sloping surface that is inclined with respect to the thickness direction of the template substrate.
C30B 25/04 - Dépôt suivant une configuration déterminée, p. ex. en utilisant des masques
C30B 25/18 - Croissance d'une couche épitaxiale caractérisée par le substrat
C30B 33/10 - Gravure dans des solutions ou des bains fondus
H01L 21/20 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale
H01L 21/205 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale en utilisant la réduction ou la décomposition d'un composé gazeux donnant un condensat solide, c.-à-d. un dépôt chimique
H10H 20/825 - Matériaux des régions électroluminescentes comprenant uniquement des matériaux du groupe III-V, p. ex. GaP contenant de l’azote, p. ex. GaN
NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY (Japon)
KYOCERA CORPORATION (Japon)
NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY (Japon)
Inventeur(s)
Inagaki Satoshi
Kubota Yoshihiro
Ohuchi Kazuya
Kumano Keigo
Kameda,kenta
Nishina,yuta
Abrégé
This carbon dioxide capture and release device comprises: a composite containing a carbon-containing member and an anthraquinone derivative that is chemically bonded to the surface of the carbon-containing member; and an electrode having the composite at the surface.
B01D 53/32 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par effets électriques autres que ceux prévus au groupe
B01J 20/20 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant du carbone libreCompositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant du carbone obtenu par des procédés de carbonisation
B01J 20/28 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation caractérisées par leur forme ou leurs propriétés physiques
This ceramic wiring board comprises a ceramic substrate and a via conductor. The ceramic substrate includes one or more ceramic layers and has a first surface and a second surface which are orthogonal to the thickness direction. The via conductor penetrates at least one of the ceramic layers in the thickness direction. The aspect ratio (height/diameter) of the via conductor is less than 1.
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
96.
PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ACTUATOR, AND MASS FLOW CONTROLLER
This piezoelectric element is provided with a layered body and a conductor layer. In the layered body, a plurality of piezoelectric bodies and a plurality of internal electrodes are stacked. The conductor layer is connected to the internal electrodes and is positioned along the stacking direction of the layered body. An oxide layer including bismuth oxide is positioned in the vicinity of the interface between a piezoelectric body and the conductor layer.
H10N 30/063 - Formation d’interconnexions, p. ex. d’électrodes de connexion de parties piézo-électriques ou électrostrictives multicouches
H10N 30/20 - Dispositifs piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique, p. ex. fonctionnant comme actionneurs ou comme vibrateurs
H10N 30/87 - Électrodes ou interconnexions, p. ex. connexions électriques ou bornes
97.
PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ACTUATOR, AND MASS FLOW CONTROLLER
This piezoelectric element is provided with a stack, a conductor layer, a wiring member, and a bonding material. For the stack, a plurality of piezoelectric bodies and a plurality of internal electrodes are stacked. The conductor layer is connected to the internal electrodes and is positioned along a stacking direction of the stack. The wiring member is electrically connected to the conductor layer. The bonding material, which is conductive, bonds the conductor layer and the wiring member together. A first region in which bismuth is segregated is positioned in the vicinity of the interface between the conductor layer and the bonding material.
H10N 30/063 - Formation d’interconnexions, p. ex. d’électrodes de connexion de parties piézo-électriques ou électrostrictives multicouches
H10N 30/20 - Dispositifs piézo-électriques ou électrostrictifs à entrée électrique et sortie mécanique, p. ex. fonctionnant comme actionneurs ou comme vibrateurs
A communication method according to a first aspect of the present disclosure is executed by a user equipment in a cellular communication system, and comprises a step for receiving, from a network node different from a mobile relay node, a system information block for inter-frequency cell reselection performed by the user equipment in an RRC idle state or an RRC inactive state. The system information block includes frequency information indicating a mobile relay node frequency that is a frequency to which a mobile relay node cell managed by the mobile relay node belongs, a list of physical cell identifiers used by the user equipment to identify the mobile relay node cell, and additional information relating to the list.
H04W 48/16 - ExplorationTraitement d'informations sur les restrictions d'accès ou les accès
H04W 48/10 - Distribution d'informations relatives aux restrictions d'accès ou aux accès, p. ex. distribution de données d'exploration utilisant des informations radiodiffusées
99.
COMMUNICATION METHOD, USER EQUIPMENT, AND NETWORK NODE
A communication method according to a first aspect of the present disclosure is executed by a relay node in a cellular communication system, and comprises: a step for transmitting, to a donor node, a message including information for determining one of a mobile relay node configuration and a stationary relay node configuration as the configuration of the relay node; and a step for receiving, from the donor node, configuration information indicating the details of the configuration of the relay node.
22. The first electrode has a first portion and a second portion located between the first portion and the solid electrolyte layer. In the second portion, the ratio of the concentration of the first dopant to the total concentration of the first dopant and Ce is larger than that in the first portion.
brevets
