Provided is a method for producing a cured product of a resin composition, the method making it possible to obtain a cured product with good physical properties from a resin composition containing an ethylenically unsaturated group-containing resin. The method for producing a cured product of a resin composition according to the present invention irradiates, with light emitted from a light-emitting diode, a resin composition containing an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), a photopolymerization initiator (C), and a dye (D) to cure the resin composition. The dye (D) has a maximum absorption wavelength in the 400-1100 nm wavelength range. The light emitted from the light-emitting diode includes light (1) which is in the absorption wavelength range of the photoinitiator (C) and light (2) which is in the absorption wavelength range of the dye (D).
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
This laminate includes: a base material; and a silver particle layer that is provided on the base material and that contains silver particles. The silver particle layer has an L*of 75 or more in the L*a*b* color system, and has radio wave permeability.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
3.
SEALING MATERIAL FOR POWER SEMICONDUCTOR DEVICE, SEALING MEMBER, AND POWER SEMICONDUCTOR DEVICE
The present disclosure relates to a sealing material for use in power semiconductor devices, the sealing material containing a compound having a vinyl phenyl group.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
C08F 32/08 - Homopolymères ou copolymères de composés cycliques ne contenant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique contenant des cycles condensés
A polishing liquid for CMP containing abrasive grains, a nitrogen-containing compound having an aromatic ring, and water, wherein the abrasive grains include cerium-based particles, and the zeta potential of the abrasive grains is negative. A polishing method comprising a step for using the polishing liquid for CMP to polish a surface to be polished.
In this method for manufacturing a semiconductor device, first, a substrate 10A having a support substrate 11A, and a conductive part 12A and a polyimide film 13A provided on the support substrate 11A is prepared. Thereafter, a surface-side part 132 of the polyimide film 13A is cut by a fly-cutting method. In the method for manufacturing a semiconductor device, the tensile elastic modulus of an organic insulating material constituting the polyimide film 13A is 3.5 GPa or less. By using the organic insulating material having such a tensile elastic modulus, the wear of the device used for the fly-cutting method is suppressed, and the surface roughness of the substrate 10A can be reduced. The substrate 10A with the abovementioned features can be used, for example, for hybrid bonding.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 27/00 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun
In this method for manufacturing a semiconductor device, prepared first is a substrate 10 that includes a support substrate 11, conducting sections 12 disposed on the support substrate 11, and a polyimide film 13 disposed on the support substrate 11 and the conducting sections 12. In the prepared substrate 10, the polyimide film 13 includes: a first portion 13a that covers a front surface of the support substrate 11 and side surfaces of the conducting sections 12; and a second portion 13b that is located on the first portion 13a and covers an upper surface of the conducting sections 12. In this method for manufacturing a semiconductor device, after at least part of the second portion 13b is cut away by fly-cutting while leaving the first portion 13a, the front surface of the polyimide film 13 is polished. This makes it possible to shorten labor time in a polishing step and easily reduce the surface roughness of the substrate 10. This substrate 10 can be used, for instance, for hybrid bonding.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/3205 - Dépôt de couches non isolantes, p. ex. conductrices ou résistives, sur des couches isolantesPost-traitement de ces couches
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
Disclosed is a film-like adhesive containing a thermosetting resin component and an elastomer. In a DSC curve of the film-like adhesive obtained by differential scanning calorimetry under conditions of a temperature increase rate of 10 °C/min and a measurement temperature range of 30-300 °C, an onset temperature of an exothermic peak observed in the DSC curve is 165 °C or less, a peak temperature is 185 °C or less, and a calorific value is 90 J/g or more.
The member for wiring formation 1, which is an example of an adhesive film with a metal layer, comprises a metal layer 20 and an adhesive layer 10 disposed on the metal layer 20. The adhesive layer 10 includes copper particles 12 and a thermosetting resin composition. The content of the copper particles 12 is 6 vol% or less based on the total volume of the adhesive layer 10.
A wiring formation member 1 that is one example of an adhesive film with a metal layer comprises a metal layer 20 and an adhesive layer 10 that is provided on the metal layer 20. The adhesive layer 10 includes conductive particles 12 and a curable resin composition. A cured product of the adhesive layer 10 has a coefficient of thermal expansion of 1.5%–3.0% when heated from 40°C to 260°C.
Provided is a pipe lining material containing: a composite material (D) including a resin composition and a fiber base material (d); an inner film disposed on one surface of the composite material (D); and an outer film disposed on the other surface. The resin composition includes an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), and a photopolymerization initiator (C). The inner film is a colored film that has the maximum absorption wavelength in a wavelength region of 400-1100 nm and transmits light.
B29C 63/26 - Garnissage ou gainage de surfaces internes
B29C 63/34 - Garnissage ou gainage de surfaces internes avec des couches ou des gainages tubulaires
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
11.
METHOD FOR PRODUCING OLEFIN-CONTAINING COMPOSITION AND CATALYST FOR PRODUCTION OF OLEFIN-CONTAINING COMPOSITION
Disclosed is a method for producing an olefin-containing composition, the method being characterized by including a step for decomposing a plastic in the presence of zeolite so as to produce an olefin-containing composition that contains an olefin having 2 to 5 carbon atoms. This method for producing an olefin-containing composition is also characterized in that the zeolite is at least one selected from the group consisting of a beta type zeolite containing Rb+and a mordenite type zeolite containing Rb+.
C07C 4/22 - Préparations d'hydrocarbures à partir d'hydrocarbures contenant un plus grand nombre d'atomes de carbone par dépolymérisation en monomère d'origine, p. ex. dépolymérisation du dicyclopentadiène pour obtenir du cyclopentadiène
B01J 29/18 - Zéolites aluminosilicates cristallinesLeurs composés isomorphes du type mordénite
B01J 29/70 - Zéolites aluminosilicates cristallinesLeurs composés isomorphes de types caractérisés par leur structure spécifique non prévus dans les groupes
B01J 37/02 - Imprégnation, revêtement ou précipitation
C08J 11/10 - Récupération ou traitement des résidus des polymères par coupure des chaînes moléculaires des polymères ou rupture des liaisons de réticulation par voie chimique, p. ex. dévulcanisation
C10G 1/10 - Production de mélanges liquides d'hydrocarbures à partir de schiste bitumineux, de sable pétrolifère ou de matières carbonées solides non fusibles ou similaires, p. ex. bois, charbon à partir de caoutchouc ou de déchets de caoutchouc
12.
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND DICING–DIE BONDING INTEGRATED FILM
This semiconductor device production method includes: a step for, in a heated condition, affixing a film B of a dicing–die bonding integrated film which includes a dicing film (film A) that has a base material film and an adhesive layer provided on the base material film and a die bonding film (the film B) that is provided on the adhesive layer to a plurality of semiconductor chips obtained by singulating a semiconductor wafer; and a step for expanding the film A in a cooled condition, thereby singulating the film B, and manufacturing semiconductor chips with film B pieces, each comprising a semiconductor chip and a film B piece obtained by singulating the film B. The film B has a thickness of 20 μm or less. The tensile stress when stretched by 20% at 0°C via a tensile test of the film A is 15 MPa or greater. The thermal shrinkage at 70°C via thermomechanical analysis is 5% or less.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
13.
DESIGN SUPPORT DEVICE, LEARNING DEVICE, DESIGN SUPPORT METHOD, LEARNING METHOD, AND PROGRAM
This design support device supports design of a metal-supported zeolite catalyst by using a machine learning model that has been trained on a correspondence relationship between a reaction yield of a compound and a parameter of zeolite and a parameter of a metal cation that is supported by ion exchange, the design support device comprising: a parameter generation unit that generates an exhaustive combination of parameters of the zeolite and parameters of the metal cation; a prediction unit that predicts a reaction yield of the compound corresponding to the combination by using the trained machine learning model; and a candidate output unit that outputs data of a candidate metal-supported zeolite catalyst, on the basis of a reaction yield of the compound corresponding to the predicted combination.
Disclosed is a pipe lining material which contains a resin composition and a composite material (E) that contains a fiber base material (e). The resin composition contains an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), a photopolymerization initiator (C), and a dye (D). The dye (D) has a maximum absorption wavelength in the wavelength range of 450 nm to 1100 nm. The content of the dye (D) in the resin composition is 0.003 part by mass or more relative to a total of 100 parts by mass of the ethylenically unsaturated group-containing resin (A) and the ethylenically unsaturated group-containing monomer (B).
B29C 63/26 - Garnissage ou gainage de surfaces internes
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
15.
METHOD FOR PRODUCING CURED PRODUCT OF RESIN COMPOSITION
The present invention provides a method for producing a cured product of a resin composition, with which it is possible to obtain a cured product having good physical properties from a resin composition that contains an ethylenically unsaturated group-containing resin. This method for producing a cured product of a resin composition comprises irradiating a resin composition which contains an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), and a photopolymerization initiator (C) with light emitted from a light-emitting diode through a colored film so as to cure the resin composition, the colored film having a maximum absorption wavelength within the wavelength range of 400 nm to 1,100 nm, and the light emitted from the light-emitting diode including light (1) in the absorption wavelength range of the photopolymerization initiator (C) and light (2) in the absorption wavelength range of the colored film.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
16.
SEALING MATERIAL, SEALING MEMBER, AND SEMICONDUCTOR DEVICE
The present disclosure relates to: a sealing material containing a compound having a vinyl phenyl group; a sealing member containing a cured product obtained by using the sealing material; an electronic component device having the sealing member; and the like.
C08G 8/36 - Polycondensats modifiés chimiquement par éthérification
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
17.
SEALING MATERIAL, SEALING MEMBER, AND SEMICONDUCTOR DEVICE
The present disclosure pertains to a sealing material containing a compound having a structural unit represented by formula (Bb1) (in formula (Bb1), XE represents an organic group including an aromatic ring (however, the organic group does not include a structure represented by (X1) or (X2)), B independently represents a group including a vinyl phenyl group, R independently represents a substituent, I represents an integer of 1-5, and m represents an integer of 0-10).
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
C08F 32/08 - Homopolymères ou copolymères de composés cycliques ne contenant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique contenant des cycles condensés
The present disclosure relates to a method for producing a semiconductor device including a semiconductor element and a sealer, the method including using a sealing material to form the sealer, the sealing material, when heated under the conditions of a heating temperature of 175°C and a heating time of 2 hours, giving a cured object having a glass transition temperature of 200°C or higher.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
C08F 32/08 - Homopolymères ou copolymères de composés cycliques ne contenant pas de radicaux aliphatiques non saturés dans une chaîne latérale et contenant une ou plusieurs liaisons doubles carbone-carbone dans un système carbocyclique contenant des cycles condensés
Provided is a method for producing an olefin-containing composition, the method comprising a step for producing an olefin-containing composition containing an olefin having 2 to 5 carbon atoms by decomposing a plastic in the presence of zeolite, wherein the zeolite is an MFI-type zeolite containing Rb+.
C10G 1/10 - Production de mélanges liquides d'hydrocarbures à partir de schiste bitumineux, de sable pétrolifère ou de matières carbonées solides non fusibles ou similaires, p. ex. bois, charbon à partir de caoutchouc ou de déchets de caoutchouc
B01J 29/40 - Zéolites aluminosilicates cristallinesLeurs composés isomorphes du type pentasil, p. ex. types ZSM-5, ZSM-8 ou ZSM-11
C08J 11/16 - Récupération ou traitement des résidus des polymères par coupure des chaînes moléculaires des polymères ou rupture des liaisons de réticulation par voie chimique, p. ex. dévulcanisation par traitement avec une substance inorganique
20.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DICING/DIE-BONDING INTEGRATED FILM
The present invention discloses a method for manufacturing a semiconductor device. The method for manufacturing a semiconductor device includes: a step for preparing a laminate including a dicing/die-bonding integrated film which includes a dicing film (film A) having a substrate film and an adhesive layer provided on the substrate film, and a die bonding film (film B) provided on the adhesive layer, and a plurality of semiconductor chips which are provided on the film B of the integrated film and which are formed by dicing a semiconductor wafer; and a step for dicing the film B by expanding the film A of the laminate under cooling conditions to fabricate film B piece-including semiconductor chips comprising the semiconductor chips and film B pieces obtained by dicing the film B. The tensile stress of the film A at 20% stretching at -15°C as determined by a tensile test is 15 MPa or more, and the elongation at break of the film A at -15°C as determined by the tensile test is 500% or less.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B26F 3/00 - Séparation par des moyens autres que la coupeAppareillage à cet effet
B28D 5/00 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p. ex. des matériaux pour semi-conducteursAppareillages ou dispositifs à cet effet
B28D 7/04 - Accessoires spécialement conçus pour leur utilisation avec les machines ou les dispositifs des autres groupes de la présente sous-classe pour supporter ou maintenir les pièces travaillées
This film-like adhesive is composed of a resin composition having thermosetting properties and containing a rubber component, and has a first surface and a second surface. The film-like adhesive has a region which is in the vicinity of the first surface and in which the content of the rubber component increases from the second surface side toward the first surface side. A graph obtained through indentation measurement using an atomic force microscope has: a portion G1 in which the elastic modulus gradually increases, and which starts from a measurement result at the first surface; and a portion G2 in which the elastic modulus remains approximately constant, and which begins from the end point of the portion G1.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
The purpose of the present disclosure is to provide a method for producing an adhesive film that is capable of suppressing breakage and chipping of an unnecessary portion even when the unnecessary portion is peeled off while winding at a constant conveyance speed, and that improves the production efficiency. The method for producing an adhesive film comprises: a delivery step S01 of delivering a long base material film 2 provided with an adhesive layer 3 on one surface side at a predetermined conveyance speed; a cutting step S02 of precutting the adhesive layer 3 with a cutting line S of a predetermined pattern; and a peeling step S03 of peeling an unnecessary portion F of the adhesive layer 3 from one surface side of the base material film 2 and forming a plurality of adhesive layers 3 having a pattern based on the cutting line S on one surface side of the base material film 2 at predetermined intervals. In the cutting step S02, the unnecessary portion F is divided by a division line D dividing in a width direction B of the base material film 2.
C09J 7/00 - Adhésifs sous forme de films ou de pellicules
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
23.
FILM ADHESION TEST METHOD, PRODUCTION METHOD FOR STRUCTURE, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT DEVICE
This film adhesion test method comprises: forming, in a film formed on a base, notches reaching the base; attaching an adhesive sheet to a surface of the film in which the notches have been formed; and peeling the sheet off the film. The notches are formed by irradiating of the film with laser light.
The present invention efficiently searches for a manufacturing process capable of realizing a material to be designed that satisfies desired mechanical properties. This material manufacturing process search method is a method for searching for a material manufacturing process for designing a material to be designed, and comprises a computer executing: an analysis step of analyzing a relationship between a manufacturing process for the material to be designed and mechanical properties of the material to be designed; an extraction step of extracting a candidate for the manufacturing process for the material to be designed that satisfies a target value of the mechanical properties, on the basis of an analysis result in the analysis step; a calculation step of calculating, using thermodynamic calculation, data indicating a material structure of the material to be designed, the data affecting the mechanical properties; and a determination step of determining the suitability of the candidate for the manufacturing process on the basis of the data indicating the material structure calculated by performing thermodynamic calculation on the candidate for the manufacturing process in the calculation step.
G16C 60/00 - Science informatique des matériaux, c.-à-d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/04 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages
C22F 1/08 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du cuivre ou de ses alliages
C22F 1/18 - Métaux réfractaires ou à point de fusion élevé ou leurs alliages
Provided is a resin composition containing an acrylic polymer that is an easily combustible component, the resin composition having exceptional flame retardancy while maintaining excellent adhesive strength with copper foil and desmear resistance. Also provided are a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition. Specifically, the resin composition contains (A) an acrylic polymer, (B) a thermosetting resin, and (C) an inorganic filler that is surface-treated with a silane coupling agent, the resin composition furthermore containing (D) a silane coupling agent.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
This cooling member is provided with: a flow path member that has a pair of plate materials disposed at an interval, and that forms a flow path through which a fluid flows between one of the plate materials and the other plate material; and a pool that is disposed on the upstream side of the flow path across the entire width of the flow path member between the flow path and an inflow port for the fluid, and in which the fluid is stored, the pool satisfying h < W and h < H, where h is the internal height of the flow path, H is the internal height of the pool, and W is the width dimension of the pool in the flow direction of the fluid.
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
F28D 1/03 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec des canalisations en forme de plaques ou de laminés
F28F 3/00 - Éléments en forme de plaques ou de laminésEnsembles d'éléments en forme de plaques ou de laminés
F28F 9/02 - Boîtes de distributionPlaques d'extrémité
F28F 21/08 - Structure des appareils échangeurs de chaleur caractérisée par l'emploi de matériaux spécifiés de métal
27.
SEALING MATERIAL COMPOSITION AND ELECTRONIC COMPONENT DEVICE
This sealing material composition contains an epoxy resin, a curing agent, and an inorganic filler, and in the composition, the ratio of 14C to 12C (14C/12C ratio) is 0.05×10-12to 1.2×10-12.
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
28.
TEST METHOD FOR FILM ADHESION, METHOD FOR PRODUCING STRUCTURE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Provided is a test method for film adhesion which comprises: forming incisions in a film formed on a substrate, so that the incisions reach the substrate; applying a pressure-sensitive adhesive sheet to the surface of the film having the incisions; and peeling the sheet from the film. The incisions are formed by irradiating the film with laser light.
This core piece is of a stator core of an axial gap motor, the core piece being obtained by pressing a soft magnetic powder which has been coated with an insulating material. The core piece comprises: a tooth part that has a peripheral surface around which a winding is wound; a first flange part that is connected to an end part on one side of the tooth part; and a second flange part that is connected to an end part on the reverse side of the tooth part from the first flange part. The peripheral surface of the tooth part has: an inner peripheral part; an outer peripheral part that is located on the reverse side from the inner peripheral part; and a first side peripheral part and a second side peripheral part that are connected to the inner peripheral part and the outer peripheral part so as to face each other. A first inner-peripheral-side side end, which is an end part on the side of the first side peripheral part that is toward the inner peripheral part, approaches a second inner-peripheral-side side end, which is an end part on the side of the second side peripheral part that is toward the inner peripheral part, the further toward the inner peripheral part.
H02K 1/02 - Détails du circuit magnétique caractérisés par le matériau magnétique
H02K 1/18 - Moyens de montage ou de fixation des parties magnétiques fixes sur ou aux structures constituant le stator
H02K 15/02 - Procédés ou appareils spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation des machines dynamo-électriques des corps statoriques ou rotoriques
H02K 21/24 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants avec des aimants disposés axialement en face des induits, p. ex. dynamos de bicyclette du type moyeu
30.
RESONANCE SOUND ABSORBER, TIRE, AND METHOD FOR MOUNTING RESONANCE SOUND ABSORBER
Provided is a resonance sound absorber to be mounted in an inner cavity portion of a tire. The resonance sound absorber comprises a resonance box including a self-standing outer wall, a hollow portion formed in the inside of the outer wall, and an opening that opens the hollow portion to the outside of the outer wall. The outer wall comprises a bottom wall portion attached to the inner cavity portion and a top wall portion that forms the hollow portion between this top wall and the bottom wall portion. The top wall portion curves in a protruding shape. Provided is a tire comprising the above-mentioned resonance sound mounted in an inner cavity portion. Provided is a method for mounting resonance sound absorber. This method mounts the resonance sound absorber to an inner cavity portion of a tire, the method comprising: a preprocessing step of polishing a mounting region of the inner cavity portion where the resonance sound absorber is to be mounted; and an affixing step of affixing the resonance sound absorber to the mounting region after the preprocessing step.
This replacement door member comprises: a panel member which constitutes a door for a vehicle and to which door glass is not adhered; and an adhesive which is provided to the panel member in a door glass adhesion region, has a flat surface on the opposite side from the panel member side, and retains curability.
A cleaning composition containing: a main material of a cleaning composition; and an amine compound which does not contain an amino group at the terminal of the molecular chain and does contain an amino group at a position other than the terminal of the molecular chain.
A cleaning composition containing: a main material of a cleaning composition; and an amine compound which does not contain an amino group at the terminal of the molecular chain and does contain an amino group at a position other than the terminal of the molecular chain.
This resin composition comprises an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound.
This semiconductor device comprises: a substrate; a rectangular first semiconductor chip arranged on the substrate; a plurality of spacers arranged around the first semiconductor chip on the substrate; a second semiconductor chip opposing the substrate so as to cover the first semiconductor chip; and an adhesive layer provided on a surface on the first semiconductor chip side of the second semiconductor chip and adhered to the first semiconductor chip and the plurality of spacers. The plurality of spacers include: a first main spacer and a second main spacer respectively disposed on both sides of the first semiconductor chip in a long-side direction of the first semiconductor chip; and a first additional spacer and a second additional spacer respectively disposed on both sides of the first semiconductor chip in a short-side direction of the first semiconductor chip.
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10B 80/00 - Ensembles de plusieurs dispositifs comprenant au moins un dispositif de mémoire couvert par la présente sous-classe
36.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MEMBER
Disclosed is a method for bonding a bridge die 20 having a TSV 23 to a rewiring layer by thermocompression bonding (TCB). In this method, a terminal electrode 22 on the bridge die 20 and an upper end 23a of the TSV 23 are covered with a thermosetting resin film (for example, DAF) to form and cure a resin layer 24. Thereafter, a metal collet C for drawing the bridge die 20 is heated and heat is transferred to an entire surface 24a of the resin layer 24 while a pressure is applied thereto, and a lower end 23b of the TSV 23 and a wiring electrode of the rewiring layer are heat-bonded. According to this method, since heat is transferred from the metal collet C to substantially the entire surface of the bridge die 20, the amount of heat transferred to the junction between the lower end 23b of the TSV 23 and the wiring electrode is increased compared with a method by which heat is only transferred to the outer edge while avoiding the terminal electrode. The pressure at the time of heat-bonding can also be applied to substantially the entire surface of the resin layer 24. Thus, thermocompression bonding can be reliably performed.
A detergent composition contains a main material of the detergent composition and an amine compound containing an amino group at a position other than the end of the molecular chain, and has a moisture content of 8 mass % or less.
Disclosed is a method for bonding a bridge die 20 provided with TSVs 23 to a rewiring layer through thermocompression bonding (TCB). The method involves covering terminal electrodes 22 on the bridge die 20 and upper ends 23a of the TSVs 23 with a thermosetting resin film (for example, a DAF) to form a resin layer 24 and curing the same. Thereafter, a metal collet C for suctioning the bridge die 20 is heated, pressure is applied while heat is transferred to the entire surface 24a of the resin layer 24, and lower ends 23b of the TSVs 23 and a wiring electrode of the rewiring layer are heat-bonded. According to this method, heat is transferred from the metal collet C to almost the entire surface of the bridge die 20, and thus the quantity of heat transferred to a bonding part between the lower ends 23b of the TSVs 23 and the wiring electrode is increased compared to a method for transferring heat only to an outer edge while avoiding terminal electrodes. Moreover, pressure during heat-bonding can also be applied to almost the entire surface of the resin layer 24. Therefore, the thermocompression bonding can be surely performed.
A detergent composition contains a main material of the detergent composition and an amine compound containing an amino group at a position other than the end of the molecular chain, and has a moisture content of 8 mass % or less.
The present invention provides: a resin composition which exhibits low transmission loss and excellent flame retardancy, and can improve the appearance of a laminate; and the like. Specifically, the resin composition is as follows. The resin composition contains (A) a thermosetting resin, (B) a polymer that has a hydrocarbon chain or a polyether chain, (X) a phosphorus compound-based flame retardant, and (Y) a flame retardant other than the phosphorus compound-based flame retardant, wherein: in cases where the (X) component does not contain (X1) a filler flame retardant, and the (Y) component does not contain (Y1) a filler flame retardant, or in cases where the (X) component contains (X1) a filler flame retardant or the (Y) component contains (Y1) a filler flame retardant, the total content of the (X1) filler flame retardant and the (Y1) filler flame retardant is 25 parts by mass or less with respect to 100 parts by mass of the solid content in the resin composition.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
C08K 3/013 - Charges, pigments ou agents de renforcement
A bump-equipped circuit member 1 comprises a substrate 2, an electrode 3 provided to one surface of the substrate 2, and a bump 4 provided to the electrode 3. The bump 4 includes electroconductive particles 11, and a base layer 5 that contains tin or a tin alloy and electrically connects the electroconductive particles 11 and the electrode 3 in a state of covering at least some of the electroconductive particles 11. The base layer 5 includes an alloy layer 5A with a metal constituting the electrode 3, and an eutectic solder layer 5B.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
This resin composition contains an epoxy resin, an active ester compound that serves as a curing agent, a high dielectric inorganic filler, and a cyclic carbodiimide compound.
C08K 5/29 - Composés contenant des liaisons doubles carbone-azote
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H01B 3/40 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines époxy
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
43.
THERMOSETTING RESIN COMPOSITION, CURED ARTICLE, AND FLEXIBLE PRINTED SUBSTRATE
One embodiment relates to a thermosetting resin composition containing (A) a resin having at least one group selected from the group consisting of an acid anhydride group and a carboxy group, (B) an ion trapping agent containing Zr, Mg, and Al, (C) an inorganic filler, and (D) an epoxy resin.
C08L 101/08 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés contenant des atomes d'oxygène des groupes carboxyle
C08G 59/32 - Composés époxydés contenant au moins trois groupes époxyde
C08G 59/42 - Acides polycarboxyliquesLeurs anhydrides, halogénures ou esters à bas poids moléculaire
One embodiment of the present invention pertains to a thermosetting resin composition containing: a resin having at least one group selected from the group consisting of acid anhydride groups and a carboxy group; and a trifunctional amine-type epoxy resin.
An adhesive composition comprising a cationically polymerizable compound and a curing agent, wherein the curing agent is a salt of a nitrogen-containing cation with an anion represented by general formula (1). [In formula (1), R1 represents a fluoroalkyl group, a fluoroaryl group, or a fluoroalkyl-substituted aryl group, m is 0 or 1, and n is an integer of 1-4.]
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
C07F 5/00 - Composés contenant des éléments des groupes 3 ou 13 du tableau périodique
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
This simulation device is provided with: a selection unit that selects target coordinates in a structural space; an addition unit that adds a potential to the target coordinates; a calculation unit that calculates time evolution of the structural space in a first time interval by a first principle calculation; and a prediction unit that predicts time evolution in a second time interval on the basis of a prediction model in which the time is used as an explanatory variable and the target coordinates that have changed due to the application of an artificial force derived from the potential are used as objective variables.
G16C 10/00 - Chimie théorique computationnelle, c.-à-d. TIC spécialement adaptées aux aspects théoriques de la chimie quantique, de la mécanique moléculaire, de la dynamique moléculaire ou similaires
A main purpose of the present disclosure is to provide an adhesive composition which contains a (meth)acrylate having a fluorine-containing organic group and which nevertheless can give cured objects having sufficient adhesion strength and a high infrared-light transmittance. The adhesive composition comprises a (meth) acrylate compound, an epoxy compound, a crosslinking agent, and a photoacid generator. The (meth) acrylate compound includes a (meth) acrylate having a fluorine-containing organic group. The crosslinking agent includes a (meth)acrylic resin comprising a first structural unit, which is derived from a (meth)acrylate having a fluorine-containing organic group, and a second structural unit, which is derived from a (meth)acrylate having a cyclic ether group.
Disclosed is a method for producing a (meth)acrylic resin solution. The method for producing a (meth)acrylic resin solution includes a step in which one or more monomers including a (meth)acrylate compound are polymerized in a solvent having a cyclic ether group but not having a radically polymerizable group, thereby obtaining a (meth)acrylic resin solution.
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08G 59/02 - Polycondensats contenant plusieurs groupes époxyde par molécule
49.
METHOD FOR AFFIXING FILM ADHESIVE MATERIAL AND DEVICE FOR AFFIXING FILM ADHESIVE MATERIAL
This method for affixing a film adhesive material comprises: a step for winding one film adhesive material onto one end surface and both plate surfaces of a heated plate member extending in one direction; a step for pressing the one film adhesive material onto both of the plate surfaces; a step for pressing the one film adhesive material onto the one end surface; a step for winding another film adhesive material onto another end surface and both of the plate surfaces of the heated plate member and overlapping the other film adhesive material and the one film adhesive material on both of the plate surfaces; a step for pressing the other film adhesive material onto both of the plate surfaces; and a step for pressing the other film adhesive material onto the other end surface.
This resin composition for molding comprises a curable resin and an inorganic filler containing alumina particles and at least one of calcium titanate particles and strontium titanate particles. The total content of the calcium titanate particles and the strontium titanate particles is 5.0 vol% to 15.0 vol% with respect to the whole inorganic filler, and the content of the whole inorganic filler exceeds 60 vol% with respect to the whole resin composition for molding.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08K 3/013 - Charges, pigments ou agents de renforcement
The present invention discloses a crosslinking agent. The crosslinking agent contains a (meth)acrylic resin which has a first structural unit derived from a (meth)acrylate that has a fluorine-containing organic group and a second structural unit derived from a (meth)acrylate that has a cyclic ether group.
The polyimide-based resin precursor contains at least one of a constituent unit represented by formula (A1) or a constituent unit represented by formula (A2). At least one of R2or R3is an optionally substituted aromatic group, at least one of R2or R3is a group containing a photopolymerizable group, and R4 represents an aromatic group substituted with a group containing a photopolymerizable group.
C08G 73/06 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principale de la macromoléculePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
C07C 235/00 - Amides d'acides carboxyliques, le squelette carboné de la partie acide étant substitué de plus par des atomes d'oxygène
53.
METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICONDUCTOR DEVICE
This method for manufacturing a wiring board comprises: a step for forming a first insulating layer on a support substrate; a step for forming a resist layer on the first insulating layer; a step for forming a plurality of openings including a first opening and a second opening for a wiring electrode and a third opening for a dummy electrode in the resist layer; a step for forming a first wiring electrode and a second wiring electrode in the first opening and the second opening, respectively; a step for forming a first dummy electrode in the third opening; a step for removing the resist layer after forming the first wiring electrode, the second wiring electrode, and the first dummy electrode; and a step for forming a second insulating layer on the first insulating layer so as to cover at least the first dummy electrode. In this manufacturing method, the surfaces of the first wiring electrode and the second wiring electrode are exposed from the second insulating layer, and at least a part of the first dummy electrode is positioned between the first wiring electrode and the second wiring electrode.
This resin composition comprises a copolymer (A), a basic catalyst (B), and a solvent (C). The copolymer (A) includes: a structural unit (a) having an acid group; and a structural unit (pb) having a group represented by formula (1) (in formula (1), R1and R4each independently represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms, R2and R3 each independently represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms, and * represents a link site with respect to a residue resulting from removing the group of formula (1) from the structural unit (pb)). The contained amount of the basic catalyst (B) is 0.5-10 parts by mass with respect to 100 parts by mass of the copolymer (A).
C08L 101/02 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 8/00 - Modification chimique par post-traitement
C08F 265/02 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères d'acides monocarboxyliques non saturés ou de leurs dérivés tels que définis dans le groupe sur des polymères d'acides, de sels ou d'anhydrides
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
A method for producing a binder pitch for carbon materials, the method comprising: a step (step 1) in which a petroleum-based heavy oil is heat-treated; a step (step 2) in which the heat-treated product obtained in step 1 is distilled to obtain, as a high-boiling-point fraction, a base pitch having a softening point of 60-110°C, a fixed-carbon content of 50.0 mass% or greater, an initial boiling point of 320-450°C, and a quinoline insoluble content (QI) of 1.0 mass% or less; and a step (step 3) in which a carbon powder is added to and mixed with the base pitch obtained in step 2.
Provided is a method for producing a carbon material using, as binder pitch, pitch that has a softening point of 70-120°C, a fixed carbon content of 50.0 mass% or greater, a quinoline-insoluble content of 18.0 mass% or less, an initial boiling point of 320°C or higher, and a Casson yield value of 0.18 Pa or higher at a temperature higher than the softening point by 100°C.
This adhesive agent film for circuit connection contains a thermoplastic resin, a thermosetting component, conductive particles, and a non-conductive filler. The non-conductive filler includes a non-conductive filler MF having an average linear thermal expansion coefficient of 0ppb/°C or less from 30°C to 150°C.
This organic electronics material contains a charge transporting polymer having a branched structure, the charge transporting polymer including a trivalent structural unit represented by formula (a) and a divalent structural unit represented by formula (b). The charge transporting polymer has a structure which is formed by direct bonding of at least one binding site in the trivalent structural unit and at least one binding site in the divalent structural unit, and which is represented by formula (I). The charge transporting polymer has a weight-average molecular weight of 2,000-500,000. In the formula, Ar1represents a trivalent organic group derived from an aromatic hydrocarbon or an aromatic heterocyclic ring having 2-30 carbon atoms or triaryl amine; Ar2 represents a monovalent organic group derived from an aromatic hydrocarbon having 6-30 carbon atoms and having an electron-withdrawing group or an electron-donating group; and * represents a binding site with another structure.
This organic electronics material includes a charge transporting polymer having a branched structure, a weight average molecular weight of 2,000-500,000, and a structure that is represented by formula (I), that includes a trivalent structural unit represented by formula (a), a divalent structural unit represented by formula (b), and a polymerizable functional group, and that is formed through direct binding of at least one binding hand in the trivalent structural unit and at least one binding hand in the divalent structural unit. In the formulae, Ar1represents an aromatic heterocyclic ring or an aromatic hydrocarbon having 2-30 carbon atoms, or a trivalent organic group derived from triarylamine, Ar2 represents a monovalent organic group derived from an aromatic hydrocarbon having 6-30 carbon atoms, and * represents a binding site with respect to other structures.
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
Provided is a method for producing an arylamine polymer, the method comprising: reacting a starting material monomer that contains an aromatic compound (A) having two or more triflate groups or halogen atoms directly bonded to an aromatic ring and an aromatic compound (B) having an amino group in the presence of a palladium-containing catalyst and a water-insoluble organic solvent so as to form a reaction liquid that contains an arylamine polymer; forming a mixed liquid comprising the reaction liquid, water, and a water-soluble organic solvent that is compatible with the water-insoluble organic solvent; separating the mixed liquid into an organic phase and an aqueous phase; and recovering the organic phase.
Provided is a method for producing silicon-containing oxide-coated aluminum nitride particles comprising aluminum nitride particles and a silicon-containing oxide film covering the surfaces of the aluminum nitride particles, the method comprising: a first step for crushing agglomerates contained in raw aluminum nitride particles to obtain crushed aluminum nitride particles; a second step for covering the surfaces of the crushed aluminum nitride particles with an organosilicon compound having a specific structure to obtain organosilicon compound-coated aluminum nitride particles; and a third step for heating the organosilicon compound-coated aluminum nitride particles at a heating temperature of 300°C or higher and lower than 1000°C, wherein the reduction rate of the loose bulk density of the crushed aluminum nitride particles relative to the loose bulk density of the raw aluminum nitride particles is at least 10%.
This resin composition for molding contains: an epoxy resin; a curing agent; a release agent including a polyethylene oxide having a weight average molecular weight of 3,500 or more; and an inorganic filler including alumina.
C08L 23/30 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères modifiées par post-traitement chimique par oxydation
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
63.
MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
This molding resin composition comprises: an epoxy resin; a curing agent; a release agent containing an oxidized polyethylene; and an inorganic filler containing alumina. A parameter P calculated by formula A on the basis of the weight average molecular weight of the oxidized polyethylene and the content of the oxidized polyethylene with respect to 100 parts by mass of the epoxy resin is 300-1500. In formula A, Mi represents the weight average molecular weight of a type no. i oxidized polyethylene, and Ri represents the content of the type no. i oxidized polyethylene with respect to 100 parts by mass of the epoxy resin.
C08L 23/30 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères modifiées par post-traitement chimique par oxydation
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
64.
ADHESIVE SET, STRUCTURE AND METHOD FOR PRODUCING SAME
Disclosed is an adhesive set that comprises a main agent and a curing agent. The main agent contains a urethane prepolymer. The curing agent contains a polyol including a polyol having a glass transition temperature of 0°C or lower. At least one of the main agent and the curing agent contains a filler including calcium carbonate. The average hydroxyl value of the polyol is 50 mg KOH/g or less. The average number of hydroxyl groups in the polyol is 2.5 or less. The content of the polyol having a glass transition temperature of 0°C or lower is 20 mass% or more relative to the total amount of the main agent and the curing agent. The content of the calcium carbonate is 10 mass% or more relative to the total amount of the main agent and the curing agent.
A polyimide resin precursor including at least one of a structural unit represented by formula (A1) and a structural unit represented by formula (A2), wherein at least one of R2and R3is an optionally substituted aromatic group, and R4 represents an optionally substituted aromatic group.
C08G 73/06 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principale de la macromoléculePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
66.
RESIN COMPOSITION, MODIFIED RESIN COMPOSITION, AND METHOD FOR PRODUCING MODIFIED RESIN COMPOSITION
Provided is a resin composition containing a copolymer (A), a basic catalyst (B), and a solvent (C), wherein the copolymer (A) contains a structural unit (a) having an acid group and a structural unit (pb) having a group represented by formula (1) (In formula (1), R1and R4each independently are a hydrogen atom or a C1-20 hydrocarbon group, R2and R3 each independently are a hydrogen atom or a C1-20 hydrocarbon group, and * represents a linking site with a residue obtained by removing the group of formula (1) from the structural unit (pb).), and the basic catalyst (B) has a pKa (acidity constant) at 25°C of 4-12.
C08L 101/02 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 8/00 - Modification chimique par post-traitement
C08F 265/02 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères d'acides monocarboxyliques non saturés ou de leurs dérivés tels que définis dans le groupe sur des polymères d'acides, de sels ou d'anhydrides
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
Provided is a method for cleaning a high-pressure gas container capable of suppressing generation of water inside the high-pressure gas container. The method for cleaning the high-pressure gas container comprises: a pressure accumulation purge step for purging the inside of the high-pressure gas container; and a cleaning step for cleaning the inside of the high-pressure gas container that has undergone the pressure accumulation purge step. The pressure accumulation purge step includes: a depressurization stage of bringing the inside of the high-pressure gas container into a depressurized state; and an inert gas supply stage of supplying an inert gas to the high-pressure gas container. The cleaning step includes: a hydrogen halide supply stage of supplying hydrogen halide to the high-pressure gas container that has undergone the pressure accumulation purge step; a metal oxide removal stage of generating water by reacting the metal oxide, which exists on the inner surface of the high-pressure gas container, with the hydrogen halide, inside the high-pressure gas container that has undergone the hydrogen halide supply stage; and a discharge stage of discharging the water, which was generated in the metal oxide removal stage, and the hydrogen halide from the high-pressure gas container.
Provided is a cleaning method for a high-pressure gas container by which it is possible to suppress the generation of water inside the high-pressure gas container. This cleaning method for a high-pressure gas container includes: a decompression step of decompressing the inside of a high-pressure gas container until an internal pressure becomes 5 Pa or less; and a cleaning step of cleaning the inside of the high-pressure gas container that has been subjected to the decompression step. The cleaning step includes: a hydrogen halide supply stage of supplying hydrogen halide to the high-pressure gas container that has been subjected to the decompression step; a metal oxide removal stage of generating water by causing, inside the high-pressure gas container that has been subjected to the hydrogen halide supply stage, a metal oxide existing on an inner surface of the high-pressure gas container to react with the hydrogen halide supplied in the hydrogen halide supply stage; and a discharge stage of discharging, from the high-pressure gas container, the water generated in the metal oxide removal stage and the hydrogen halide supplied in the hydrogen halide supply stage.
Provided is a polyimide-based resin precursor which contains at least one of a constituent unit represented by formula (A1): [Chemical formula 1] and a constituent unit represented by formula (A2): [Chemical formula 2], wherein at least one of R2and R3represents an aromatic group that may be substituted, and R4 represents an aromatic group that may be substituted.
C08G 73/06 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principale de la macromoléculePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
The present invention addresses the problem of providing an adhesive composition which is capable of securing a sufficient pot life (working life) at room temperature, and is capable of exhibiting a sufficient bonding strength after curing. This adhesive composition contains an organoborane complex, a compound having a radically polymerizable group, and a thermal acid generator. This adhesive composition may additionally contain at least one substance that is selected from the group consisting of a metal halide salt and a compound having a thiocarbonylthio structure.
Disclosed is an adhesive body. The adhesive body comprises a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate to each other. The haze of the first substrate and the second substrate is 5% or more. The adhesive layer contains a cured product of an adhesive composition containing: an organoborane complex; a compound having a radically polymerizable group; and a thermal acid generator.
Provided is a corrosion-resistant member that does not tend to react with hydrogen chalcogenide even at high temperature and does not tend to generate chalcogen-containing substances. The corrosion-resistant member is provided in a passivation device having a reaction vessel for performing passivation using a hydrogen chalcogenide gas and forms a portion of the reaction vessel that is in contact with the hydrogen chalcogenide gas. The corrosion-resistant member has a sintered body containing at least one selected from oxides of aluminum, nitrides of aluminum, oxides of zirconium, nitrides of zirconium, oxides of silicon, nitrides of silicon, and nitrides of boron, and the total proportion of oxides of aluminum, nitrides of aluminum, oxides of zirconium, nitrides of zirconium, oxides of silicon, nitrides of silicon, and nitrides of boron in the sintered body is more than 90 mass%.
C04B 35/583 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore
C04B 35/14 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de silice
C04B 35/581 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure d'aluminium
C04B 41/80 - Post-traitement des mortiers, du béton, de la pierre artificielle ou des céramiquesTraitement de la pierre naturelle de céramiques uniquement
C23C 16/44 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches
H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs
73.
METHOD FOR PRODUCING THIN WIRING MEMBERS, THIN WIRING MEMBER, AND METHOD FOR PRODUCING WIRING BOARD
This method for producing thin wiring members is for producing a plurality of thin wiring members 1, and comprises: a step for adhering, to a fine wiring layer that has a plurality of wiring parts, an adhesive that has a bending stiffness of 10 × 10-3Nmm2or more; and a step for separating a wiring unit, which has been obtained by adhering the adhesive layer to the fine wiring layer, into individual pieces. This thin wiring member is provided with a fine wiring layer and an adhesive layer that is provided on the fine wiring layer, and the bending stiffness of the adhesive layer is 10 × 10-3Nmm2 or more.
A curable resin composition according to one aspect of the present disclosure comprises (A) a rubber component, (B) a compound having an epoxy group, (C) a curing agent, (D) a curing accelerator, and (E) a filler, wherein the rubber component (A) comprises a modified styrene-based elastomer having a degree of modification with maleic anhydride of 1.8-10.0 mass%.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
C08K 3/013 - Charges, pigments ou agents de renforcement
C08K 9/04 - Ingrédients traités par des substances organiques
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
A wiring board comprising: conductor wiring; an insulation layer having a first main surface with which a surface of the conductor wiring is brought into firm contact, and a second main surface on the side opposite to the first main surface; a magnetic layer positioned on the second main surface side of the insulation layer; and a conductor layer positioned on the side opposite to the insulation layer with respect to the magnetic layer. The surface or the first main surface has an arithmetic average roughness of 0.1 μm to 5.0 μm.
Disclosed is a photosensitive resin composition which contains a polymer composed of a plurality of kinds of monomers, wherein: the dispersion term of the Hansen solubility parameter as calculated on the basis of the monomers is 16.99 to 17.35 inclusive; the number of carboxylic acids in each molecule as calculated on the basis of the monomers is 0.272 to 0.304 inclusive; the logarithmic value of the octanol/water partition coefficient as calculated on the basis of the monomers is 2.16 to 2.79 inclusive; and the glass transition temperature as calculated on the basis of the monomers is 354 K to 382 K inclusive.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
A protective coating composition comprising a urethane resin having a urethane structure and a carbonate structure in the same molecule, and an ethylenically unsaturated compound, wherein the urethane resin is a urethane (meth)acrylate resin, and the erosion resistance of cured products of the protective coating composition is 1.5 hours or more.
This ultrasound element comprises a piezoelectric element that generates ultrasound in the range of 20-100 kHz and an acoustic matching layer that is provided on the piezoelectric element and that includes a resin, wherein the maximum thickness from the surface of the piezoelectric element opposite to the surface on which the acoustic matching layer is disposed to the surface of the acoustic matching layer opposite to the surface on which the piezoelectric element is disposed is not more than 1.5 mm.
A method for manufacturing a semiconductor device is provided, comprising: forming a temporarily bonded body by heating and pressurizing a laminate having a first circuit member, a second circuit member, and a thermosetting adhesive layer by means of pressing members; and forming a connection body by heating the temporarily bonded body in a pressurized atmosphere. The first circuit member may be a semiconductor chip. The laminate is pressed by the pressing members at a predetermined pressure of 1.50 MPa or less. In some or all of the time during which the laminate is heated and pressed by the pressing members, at least one of the pressing members is heated to a temporary bonding temperature equal to or higher than an onset temperature of the thermosetting adhesive layer.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
80.
DEFECT INSPECTION DEVICE, DEFECT INSPECTION METHOD, AND DEFECT INSPECTION PROGRAM
The present invention reduces processing load and improves detection accuracy when detecting a defect. This defect inspection device includes: an image recognition processing unit that performs image recognition processing on captured image data obtained by capturing an image of an inspection target and determines the attributes of regions in the inspection target; a cutting-out unit that cuts out, from the captured image data, partial image data including a region having a specific attribute from among the regions in the inspection target; a prediction unit that predicts the probability of a defect in the partial image data by inputting the partial image data to a trained defect detection model; and a display control unit that superimposes and displays a marker in a display form corresponding to the predicted probability on the position where the partial image data of the captured image data is cut out.
This anti-fogging agent contains: silica particles; a silane coupling agent X having a reactive group X; and a polyether compound Y having at least two reactive groups Y capable of reacting with the reactive group X and bonding thereto.
This method for manufacturing a photoelectric composite wiring board includes: a step for forming an optical waveguide by laminating a plurality of layers of different materials on a substrate having a first wiring layer, and while doing so, exposing and developing one layer of the plurality of layers; a step for forming a though-via hole in an insulating layer formed by laminating the plurality of layers; and a step for forming a second wiring layer on the insulating layer, and also forming in the through-via hole a through-via conductor for connecting the first wiring layer and the second wiring layer.
G02B 6/132 - Circuits optiques intégrés caractérisés par le procédé de fabrication par le dépôt de couches minces
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/138 - Circuits optiques intégrés caractérisés par le procédé de fabrication en utilisant la polymérisation
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
A method for manufacturing a photoelectric composite wiring board includes the steps for: forming an insulating layer having a plurality of layers composed of different materials on a substrate having a first wiring layer; forming an optical waveguide by exposing at least one layer of the insulating layer; forming a via hole in the insulating layer; forming a second wiring layer on the insulating layer; and forming a via conductor connecting the first wiring layer and the second wiring layer in the via hole.
G02B 6/132 - Circuits optiques intégrés caractérisés par le procédé de fabrication par le dépôt de couches minces
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/138 - Circuits optiques intégrés caractérisés par le procédé de fabrication en utilisant la polymérisation
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
A method for manufacturing a photoelectric composite wiring board according to the present invention has: a step for forming an insulating layer having a plurality of layers of different materials on a substrate having a first wiring layer; a step for exposing at least one of the insulating layers to form an optical waveguide; a step for forming via holes in the insulating layer; and a step for forming a second wiring layer on the insulating layer and forming via conductors in the via holes to connect the first wiring layer and the second wiring layer.
G02B 6/13 - Circuits optiques intégrés caractérisés par le procédé de fabrication
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
111 of the difference between maximum and minimum thickness is 10 μm or less. This printed circuit board and this semiconductor package include said substrate.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
86.
METHOD FOR MANUFACTURING JOINED BODY, AND ELECTRIC-ELECTRONIC COMPONENT
A method for manufacturing a joined body in which a columnar base material A, a thermoplastic film B, and a resin C are joined together in the stated arrangement order, the method sequentially comprising step 1 for wrapping the thermoplastic film B in the circumferential direction around at least a portion of the outer circumference of the columnar base material A, and step 2 for joining the resin C to the portion of the columnar base material A around which the thermoplastic film B has been wrapped, wherein the shear adhesive force of the thermoplastic film B at 80°C is at least 4.0 MPa with respect to the columnar base material A, and the peak value of tanδ in a temperature range of 0-200°C of the thermoplastic film B is at least 1.0 in a temperature-tanδ curve when the temperature of the thermoplastic film B is increased from 0°C to 200°C at a rate of 4°C/min at a measurement frequency of 10 Hz.
One embodiment of the present invention relates to a compound comprising an indene ring, a vinylbenzyl group, and an aromatic ring-containing group having 6 or more carbon atoms and not having a polymerizable carbon-carbon double bond, the vinylbenzyl group and the aromatic ring-containing group being each directly bonded to the indene ring.
C08F 12/34 - Monomères contenant plusieurs radicaux aliphatiques non saturés
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C07C 15/58 - Hydrocarbures cycliques ne contenant que des cycles aromatiques à six chaînons en tant que partie cyclique substitués par des radicaux hydrocarbonés non saturés polycycliques condensés contenant deux cycles
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
88.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MULTILAYER BODY FOR PROVISIONAL FIXATION
The present invention discloses a method for manufacturing a semiconductor device. This method for manufacturing a semiconductor device comprises: a step for preparing a multilayer body for provisional fixation, the multilayer body sequentially having a support member, a light absorption layer, and a provisional fixation material layer that contains a cured product of a thermosetting resin component, in this order from the support member; a step for provisionally fixing a semiconductor member to the support member with the light absorption layer and the provisional fixation material layer being interposed therebetween; a step for processing the semiconductor member, which is provisionally fixed to the support member; and a step for separating the semiconductor member from the support member by irradiating the light absorption layer of the multilayer body for provisional fixation with light from the support member side. With respect to a surface of the provisional fixation material layer on which the semiconductor member is to be disposed, if a nanoindentation method employing a Berkovich indenter is used to increase a load for 5 seconds at a load speed of 20 μN/second under the condition of 25°C, hold the load at 100 μN for 2 seconds after the load reaches 100 μN, and then decrease the load for 5 seconds at an unloading speed of 20 μN/second to 0 mN, the indentation depth is 600 nm or more.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B32B 27/06 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
89.
METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND SEMICONDUCTOR DEVICE
In one example of this method for manufacturing a package substrate, a first substrate 30 having a cured insulating layer, a second substrate 40 having a cured insulating layer, a third substrate 50 having a cured insulating layer, and a fourth substrate 60 having a cured insulating layer are prepared. A semi-cured bonding body 70 (prepreg) is sandwiched and laminated between the first substrate 30 and the second substrate 40, and then the same is cured to form a first laminated substrate 100. Similarly, a semi-cured bonding body 80 is sandwiched and laminated between the third substrate 50 and the fourth substrate 60, and then the same is cured to form a second laminated substrate 110. Thereafter, a semi-cured bonding body 90 is sandwiched and laminated between the first laminated substrate 100 and the second laminated substrate 110, and then the same is cured to form a package substrate 1. According to this method, the steps can be shortened as compared with the case where layers are laminated one by one in order, and the shortening effect is prominent especially when the number of layers to be laminated is large.
A method for manufacturing a semiconductor device according to one embodiment of the present invention includes preparing, for example, four semiconductor wafers 40, 50, 60, 70. In this manufacturing method, the semiconductor wafer 40 and the semiconductor wafer 50 are bonded by hybrid bonding to produce a laminated wafer 100. Similarly, the semiconductor wafer 60 and the semiconductor wafer 70 are bonded by hybrid bonding to produce another laminated wafer 110. Subsequently, the laminated wafer 100 and the other laminated wafer 110 are further bonded by hybrid bonding to produce a laminated wafer 120. With this method, processes can be shortened as compared with a case of laminating layers one by one in order, and the effect of the shortening is remarkable especially when the number of layers to be laminated is large.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
91.
COMPOSITION COMPRISING SELF-ASSEMBLED STRUCTURE, AND FREEZE-DRIED PRODUCT THEREOF
Provided is a composition comprising a self-assembled structure of a tocopheryl phosphoric acid ester, a metal salt having a valency of 2 or higher, and water. Also provided is a freeze-dried product comprising a self-assembled structure of a tocopherol phosphoric acid ester and a metal salt having a valency of 2 or higher, wherein the molar ratio of the metal salt having a valency of 2 or higher to the tocopherol phosphoric acid ester is 0.05-12.
As an example of a method for producing a semiconductor device, a method is disclosed in which connection terminals of a bridge die 20 are mounted on a support such as a rewiring layer in a state facing upward (face-up). This method is characterized in that a resin layer 23 is formed so as to cover a plurality of terminal electrodes 22 on a semiconductor substrate 21 of the bridge die 20 with a thermosetting resin film (for example, DAF) or a thermosetting adhesive before forming an adhesive layer on the rear surface of the bridge die. In the fabrication of semiconductor devices, the bridge dies 20 are mounted on a support such as a wiring layer 12 by vacuum-sucking the whole surface of the cured resin layer 23 with a collet. According to this method, since an entire surface 23a can be sucked when the bridge dies 20 are sucked by the collet C, the bridge dies can be prevented from bending as compared with a method in which only the outer edge is sucked while avoiding the terminal electrodes. Furthermore, it is possible to suppress chip cracking when picking up a chip and void generation when the chip is mounted by thermocompression bonding.
This conductive adhesive film includes an adhesive layer located on an adherend side, and a base material layer, wherein the surface resistance value of the conductive adhesive film is 1×107Ω/sq to 1×1012 Ω/sq.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
94.
MAGNETIC PASTE, CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CIRCUIT MEMBER
Provided is a magnetic paste to be used for filling a recess formed in a substrate for circuit members, the magnetic paste containing magnetic powder and a thermosetting component, wherein the volume-based particle size distribution of the magnetic powder has at least a first peak with a peak particle size of 0.5 to 6.0 µm, and a second peak with a peak particle size of 8.0 to 50.0 µm.
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
95.
METHOD FOR STORING PHOSPHORUS FLUORIDE AND GAS-FILLED CONTAINER
Provide is a method which is for storing phosphorus fluoride and by which an increase in the concentration of metal impurities is less likely to occur. The phosphorus fluoride, which is at least one among phosphorus trifluoride, phosphorus pentafluoride, and diphosphorus tetrafluoride, is stored in a container while the total concentration of copper, magnesium, calcium, and palladium contained in the phosphorus fluoride is 3,500 mass ppb or less.
Provided is a method for storing a phosphorus fluoride in which concentrations of metal impurities hardly increase. A phosphorus fluoride, which is at least one of phosphorus trifluoride, phosphorus pentafluoride, and diphosphorus tetrafluoride, is to be stored in this storage container in which a portion that makes contact with the phosphorus fluoride is formed of a metal material. The total concentration of copper, magnesium, calcium, and palladium contained in the metal material is 0.8 mass% or less.
This conductive adhesive film includes an adhesive layer located on an adherend side, and a base material layer, wherein the surface resistance value of the conductive adhesive film is 1×107Ω/sq to 1×1012 Ω/sq.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
98.
CONDUCTIVE ADHESIVE FILM, METHOD FOR PROCESSING ADHEREND, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Disclosed is a conductive adhesive film which comprises an adhesive layer that is located on the adherend side, and a base material layer. The surface resistivity of the conductive adhesive film at 140°C on a side opposite to the adhesive layer side is 1 × 107Ω/□ to 1 × 1012 Ω/□.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
99.
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Disclosed as an example of a method for producing a semiconductor device is a method in which a bridge die 20 is mounted on a support such as a redistribution layer in a state in which a connection terminal of the bridge die 20 is facing upward (in a face-up state). This method is characterized in that a resin layer 23 is formed so as to cover a plurality of terminal electrodes 22 of the bridge die 20 on a semiconductor substrate 21 with a thermosetting resin film (for example, DAF) or a thermosetting adhesive before an adhesive layer is formed on the back surface of the bridge die. Each bridge die 20 is mounted on a support such as a wiring layer 12 by vacuum-sucking the entire surface of the cured resin layer 23 with a collet, and a semiconductor device is produced. According to this method, since the entirety of the surface 23a can be sucked when the bridge die 20 is sucked by the collet C, flexure of the bridge die can be suppressed as compared with a method in which only the outer edge is sucked while avoiding the terminal electrode. Furthermore, it is possible to suppress chip cracking when a chip is picked up and to suppress generation of a void when the chip is mounted by thermocompression bonding.
A modified (meth)acrylic resin obtained by adding an isocyanate group–containing ethylenically unsaturated compound (a) to a part of a side chain hydroxy group of a copolymer (A-0) having a structural unit derived from a hydroxy group–containing (meth)acrylate (m-1) and a structural unit derived from an alkyl (meth)acrylate (m-2), wherein the weight average molecular weight (Mw) is 30×104to 150×104, and the molecular weight distribution (Mw/Mn) is 1.1 to 3.0.
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08F 8/30 - Introduction d'atomes d'azote ou de groupes contenant de l'azote
C08F 299/00 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires
C08G 18/62 - Polymères de composés contenant des liaisons doubles carbone-carbone
C08G 18/81 - Isocyanates ou isothiocyanates non saturés
C09J 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle