This compound contains a magnetic powder, an epoxy resin, and imidazole. However, this compound does not contain a phenolic curing agent. The magnetic powder is an alloy containing samarium, iron, and nitrogen.
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
This method for producing a bonded magnet includes a mixing step and a molding step. A magnetic powder, a resin composition, and a non-ketone solvent are mixed in a mixing step to obtain a compound containing the magnetic powder and the resin composition. A molded body comprising a cured product of the compound is obtained by heating and compressing the compound in the molding step. The magnetic powder is an alloy containing samarium, iron, and nitrogen. The resin composition contains an epoxy resin and one or more capsules containing an amine. The one or more capsules include polyurethane.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
This compound contains a magnetic powder and a resin composition. The magnetic powder is an alloy containing samarium, iron, and nitrogen. The resin composition contains an epoxy resin and a curing agent. The curing agent contains imidazole. The melt viscosity of the mixture comprising the epoxy resin and the curing agent at 150°C is 0.20 Pa･s or less.
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
This compound contains a magnetic powder and a resin composition. The magnetic powder is an alloy containing samarium, iron, and nitrogen. The resin composition contains an epoxy resin and one or more capsules containing an amine (curing agent). Since the capsule contains the amine, curing of the compound is suppressed during storage of the compound.
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
5.
COMPOSITION SEARCH DEVICE, COMPOSITION SEARCH METHOD, AND PROGRAM
This composition search device comprises: a composition generation unit that generates a candidate composition of a target substance; a physical property prediction unit that predicts a physical property of the target substance on the basis of the candidate composition; an energy calculation unit that calculates energy corresponding to the candidate composition, on the basis of a loss function that minimizes a loss when a predicted value of the physical property is within a target range; and a result output unit that outputs a prescribed number of candidate compositions having small energy.
A first liquid resin composition according the the present invention contains an epoxy resin, a curing agent, an inorganic filler, and a latent viscosity modifier. The amount of a glycidyl amine type epoxy resin contained in a total of 100 parts by mass of the epoxy resin is less than 50 parts by mass. When the amount of the glycidyl amine type epoxy resin contained in a total of 100 parts by mass of the epoxy resin is defined as A parts by mass and the the latent viscosity modifier content with respect to a total of 100 parts by mass of the epoxy resin is defined as B parts by mass, the value of A×B is more than 20 and at most 120. A second liquid resin composition contains an epoxy resin, a curing agent, an inorganic filler, and a latent viscosity modifier. The amount of a glycidyl amine type epoxy resin contained in a total of 100 parts by mass of the epoxy resin is at least 50 parts by mass, and the latent viscosity modifier content with respect to a total of 100 parts by mass of the epoxy resin is at most 1.5 parts by mass.
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
7.
LIQUID RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING SAME
For the present invention, in viscosity profiles measured under the condition having a temperature rising rate of 10°C/minute, the viscosity at temperature A°C is expressed as ρA, whereas the viscosity at temperature (A + 5)°C is expressed as ρ(A + 5). The lowest temperature AL for this liquid resin composition to have a slope B expressed as ρ(A + 5)/ρA being equal to 1.5 falls in the range of 103-140°C.
The present disclosure relates to a method for manufacturing a conductive polymer dispersion liquid containing a conjugated conductive polymer-containing liquid and a conductivity enhancing agent, the method including: a step for purifying the conjugated conductive polymer-containing liquid which contains a polyanion and then performing dispersion to obtain a first dispersion liquid; and a step for adding the conductivity enhancing agent to the first dispersion liquid, wherein at least either ion exchange or ultrafiltration is performed in the purification.
C08L 101/12 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par des propriétés physiques, p. ex. anisotropie, viscosité ou conductivité électrique
C08G 61/12 - Composés macromoléculaires contenant d'autres atomes que le carbone dans la chaîne principale de la macromolécule
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C08L 79/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement de l'azote, avec ou sans oxygène ou carbone, non prévues dans les groupes
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
9.
SEALING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
This sealing resin composition contains epoxy resin, a curing agent, and an inorganic filler containing alumina. The moisture content of the alumina is 0.190 mass% or less.
Provided is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a photoacid generator, and (C) a thermal crosslinking agent. The alkali-soluble resin has a polymer chain containing an imide-based structural unit which is a group formed by removing one or more hydrogen atoms from an imide compound represented by formula (I). X1and X2are each independently a monovalent group represented by formula (11) or (12). C1, C2, C3, C4, Z1, and Z2 form a first tetravalent group which is a 5-membered cyclic group, or a second tetravalent group containing a cyclic group containing two or more cyclic portions.
G03F 7/023 - Quinonediazides macromoléculairesAdditifs macromoléculaires, p. ex. liants
C07D 209/48 - Iso-indolesIso-indoles hydrogénés avec des atomes d'oxygène en positions 1 et 3, p. ex. phtalimide
C07D 403/04 - Composés hétérocycliques contenant plusieurs hétérocycles, comportant des atomes d'azote comme uniques hétéro-atomes du cycle, non prévus par le groupe contenant deux hétérocycles liés par une liaison directe de chaînon cyclique à chaînon cyclique
This influence degree evaluation device: identifies, on the basis of the configuration of a semiconductor package, a prediction formula for predicting a phenomenon that occurs in the semiconductor package, the prediction formula including a variable corresponding to each of a plurality of factors; calculates the amount of change in the phenomenon with respect to each of the plurality of factors by substituting a prescribed value for each of the plurality of factors into a formula for each of the factors, the formulas being obtained by partially differentiating the prediction formula with respect to each of the variables; and evaluates the degree of influence for each of the factors with respect to the phenomenon on the basis of the amount of change for each of the factors.
Provided is an adhesive composition. The adhesive composition contains a (meth)acrylic resin (A), a photopolymerization initiator (B), and a crosslinking agent (C). The (meth)acrylic resin (A) has a structural unit (M-1) that has a hydroxy group, a structural unit (M-2) that has an ethylenically unsaturated group, and a structural unit (M-3) that has a carboxy group. The (meth)acrylic resin (A) has a weight average molecular weight of 200,000-650,000. The (meth)acrylic resin (A) has an acid value of 5-50 mg KOH/g.
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 27/26 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des durcisseurs
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 175/14 - Polyuréthanes comportant des liaisons non saturées carbone-carbone
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
This slurry contains: abrasive grains including cerium-based particles; and at least one nitrogen-containing compound selected from the group consisting of diamine compounds and diimine compounds. This polishing method comprises a polishing step for polishing a member to be polished using the slurry.
A polishing liquid for polishing undoped silicate glass, the polishing liquid having a pH of 3.0 or more. A polishing method including a step of polishing a surface to be polished of a member to be polished containing undoped silicate glass by using the above-described polishing liquid. A method for manufacturing a component, including obtaining a component by using a polished member polished by the above-described polishing method.
A heat conduction sheet includes a heat conduction layer containing at least one kind of graphite particles (A) selected from the group consisting of scale-like particles, ellipsoidal particles and rod-like particles, wherein in a case of scale-like particles, a plane direction of the particle is oriented in a thickness direction of the heat conduction sheet, and in a case of ellipsoidal particles or rod-like particles, a long axis direction of the particle is oriented in the thickness direction of the heat conduction sheet, and the heat conduction sheet contains a metal component having a melting point of 200° C. or less.
The photosensitive element according to the present disclosure comprises a support and a photosensitive layer formed on the support. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a photopolymerization inhibitor. The photopolymerization initiator contains an aryl group-containing biimidazole compound as a first photopolymerization initiator. The photopolymerization inhibitor contains, as a first photopolymerization inhibitor, a compound that has two hydroxyl groups in each molecule and that has a boiling point at 760 mmHg of at least 290°C.
This slurry contains abrasive grains and a compound A including at least one selected from the group consisting of nitrogen atoms and phosphorus atoms, wherein the octanol-water partition coefficient AlogP of the compound A is 2.00 or more, and the pH is 5.0 or more. This polishing method comprises a step for polishing a member to be polished using the slurry.
This slurry contains: abrasive grains; at least one compound A selected from the group consisting of sugar alcohols and inositol; at least one compound B selected from the group consisting of amine compounds having a hydroxy group and compounds having a nitrogen-containing six-membered ring; and at least one compound C selected from the group consisting of carboxylic acids, carboxylates, nitric acids, and nitrates. The abrasive grains include cerium-based particles. This polishing method comprises a step for polishing a member to be polished using the slurry.
One embodiment of the present disclosure relates to a photosensitive element comprising a support film containing a lubricant and a photosensitive layer formed on a first surface of the support film. The support film includes a first lubricant layer, a base material layer, and a second lubricant layer, and has the first lubricant layer on the first surface side of the support film and the second lubricant layer on the second surface side of the support film. The second lubricant layer contains an organic lubricant and does not contain an inorganic lubricant. The number of the organic lubricant of 0.8 μm or more in particle diameter included in the second surface is 2 or more per 0.0225 mm2, and the surface roughness Rz of the first surface and the second surface is less than 100 nm.
This slurry comprises abrasive grains including cerium-based particles and at least one compound A selected from the group consisting of sugar alcohols, saccharides, and polyalkylene glycol compounds having no aromatic ring. This multiple-liquid slurry comprises the slurry components which are stored in separate portions that at least include a first liquid and a second liquid, the first liquid containing the abrasive grains and the second liquid including the compound A. This polishing method comprises a step in which a member to be polished is polished with the slurry.
Provided is a molten aluminum alloy production method involving the melting of raw material using a melting furnace (1) which directly heats the raw material with a combustion flame (15) blown out from a burner nozzle, thereby producing a molten aluminum alloy, wherein: the raw material includes aluminum chips (17) of which 15 or more corresponds to 10 g, and ingots (16); and the aluminum chips (17) are placed in the melting furnace (1) in such a way that the ingots (16) are disposed between said aluminum chips (17) and the burner nozzle, and the raw material is heated.
Disclosed is a thermosetting adhesive composition containing an epoxy resin, a phenolic resin, an elastomer, and a hardening accelerant. After being heated at 95℃ for 3 hours, the reaction percentage of the thermosetting adhesive composition is 50% or more, and the ratio of the storage modulus at 35℃ to the storage modulus at 85℃ is 20 or less.
The photosensitive element according to the present disclosure comprises a support and a photosensitive layer formed on the support. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a photopolymerization inhibitor. The photopolymerization initiator includes, as a first photopolymerization initiator, an aryl group–containing biimidazole compound. The photopolymerization inhibitor includes, as a first photopolymerization inhibitor, a compound having two hydroxyl groups per one molecule and having a boiling point of 290°C or more at 760 mmHg.
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
A powder magnetic core comprises a plurality of metal particles and an oxide containing Si. The metal particles are covered with the oxide. The plurality of metal particles are two or more types of soft magnetic particles among first metal particles, second metal particles, and third metal particles. Each of the first metal particles and the second metal particles is an alloy containing Fe and Si. The third metal particles are pure iron or an alloy containing Fe. The Si content of the first metal particles is S1 mass%, the Si content of the second metal particles is S2 mass%, the Si content of the third metal particles is S3 mass%, and S1, S2, and S3 are such that S1 > S2 > S3 ≥ 0. The ratio of the first metal particles to all the metal particles is M1 mass%, the ratio of the second metal particles to all the metal particles is M2 mass%, the ratio of the third metal particles to all the metal particles is M3 mass%, and (M1 + M2) is greater than M3.
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
B22F 9/08 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques à partir d'un matériau liquide par coulée, p. ex. à travers de petits orifices ou dans l'eau, par atomisation ou pulvérisation
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
C22C 38/00 - Alliages ferreux, p. ex. aciers alliés
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre
H01F 1/22 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
H01F 1/147 - Alliages caractérisés par leur composition
An asphalt composition contains asphalt and a chloroprene-based polymer, wherein a content of the chloroprene-based polymer is 5 parts by mass or more and 20 parts by mass or less based on 100 parts by mass of asphalt solid content, and a tetrahydrofuran insoluble content of the chloroprene-based polymer is 20% by mass or more and 90% by mass or less. A method for producing an asphalt composition includes mixing an asphalt emulsion and a chloroprene latex so that the chloroprene latex is 5 parts by mass to 20 parts by mass based on 100 parts by mass of asphalt solid content in the asphalt emulsion in terms of solid content, wherein a tetrahydrofuran insoluble content of the chloroprene-based polymer is 20% by mass or more and 90% by mass or less.
A SiC epitaxial wafer according to an embodiment includes a SiC substrate, and a SiC epitaxial layer on one surface of the SiC substrate. The SiC epitaxial layer has a buffer layer and a drift layer. The buffer layer is located between the drift layer and the SiC substrate, and has an impurity concentration higher than an impurity concentration of the drift layer. The impurity concentration of the buffer layer is 2.0×1018 cm−3 or more. In a case where the impurity concentration at a center in plan view in a laminating direction is measured in the laminating direction, uniformity of the impurity concentration in the buffer layer is 50% or less.
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
29.
CURABLE COMPOSITION AND ELECTRONIC COMPONENT DEVICE
[Problem] To provide: a curable composition with which deterioration in the physical properties of a cured product can be suppressed even when a curing time is shortened; and an electronic component device comprising the cured product. [Solution] This curable composition comprises a curable component, wherein when the glass transition temperature of a cured product obtained by post-curing, under the conditions of 175ºC and 3 hours, a molded product obtained by molding said curable composition under the conditions of a mold temperature of 175ºC and a curing time of 150 seconds is defined as Tg1, and the glass transition temperature of a cured product obtained by post-curing the molded product under the conditions of 175ºC and 5 hours is defined as Tg2, Tg1/Tg2 is at least 0.9.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
30.
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE PRODUCTION METHOD
This underfill material comprises an epoxy resin, a rubber component, and a filler, wherein: the epoxy resin contains an epoxy compound having two epoxy groups in one molecule, having a molecular weight of 650 or less, and having no ring structure other than the epoxy groups; the rubber component contains core-shell type rubber particles having a core part and a shell part; the core part contains a crosslinked polysiloxane; the shell part contains a constituent unit in which a carbon-carbon double bond of glycidyl methacrylate is cleaved; and the filler contains sol-gel silica.
C08L 51/04 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des caoutchoucs
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
An aspect of the present disclosure relates to a modified styrene-based elastomer having an N-substituted succinimide group containing a phenolic hydroxyl group, an isocyanate group, a blocked isocyanate group, a maleimide group, or a benzoxazine group in a side chain.
As an example of a semiconductor device is disclosed. The semiconductor device 1 includes a semiconductor die 3 and a wiring layer 5a to which the semiconductor die 3 is attached. The semiconductor die 3 includes a semiconductor substrate 3a having a first surface and a second surface opposite thereto, a plurality of terminal electrodes 3b provided on the first surface of the semiconductor substrate 3a, and a cured resin layer 3c. The cured resin layer 3c is provided on the first surface of the semiconductor substrate 3a so as to cover the plurality of terminal electrodes 3c. The semiconductor die 3 can be, for example, a bride die that connects a semiconductor die 2a and a semiconductor die 2b to each other.
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
33.
RESIN COMPOSITION, RESIN FILM, RESIN FILM WITH SUPPORT, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Provided are: a resin composition which contains a radical polymerization initiator and achieves both curability and embedding properties in a circuit board; a resin film using the resin composition; a resin film with a support; a printed wiring board; and a semiconductor package. Specifically, the resin composition contains (A) a maleimide resin, (B) an inorganic filler, (C) a radical polymerization initiator, and (D) a polymerization inhibitor.
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
The present disclosure relates to a resin composition containing a modified styrene-based elastomer having an N-substituted succinimide group in a side chain and a thermosetting resin.
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C08F 8/32 - Introduction d'atomes d'azote ou de groupes contenant de l'azote par réaction avec des amines
C08F 297/04 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire utilisant un catalyseur du type anionique en polymérisant des monomères vinylaromatiques et des diènes conjugués
C08G 61/02 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes
C08K 9/06 - Ingrédients traités par des substances organiques par des composés contenant du silicium
C08L 63/10 - Résines époxy modifiées par des composés non saturés
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
35.
METHOD FOR PRODUCING POLYCRYSTALLINE ALUMINA ABRASIVE GRAINS
A method for producing the polycrystalline alumina abrasive grains at a low cost, and a grindstone using the polycrystalline alumina abrasive grains. The production method includes a step of obtaining a liquid mixture of pseudo-boehmite, predetermined silica, and water; a step of adding a deflocculant to the liquid mixture to obtain a sol; a step of adding alumina seeds to the sol to obtain a seed-containing sol; a step of drying the seed-containing sol, crushing a residual content, and then performing calcination at 550° C. or more and less than 1,200° C.; and a step of performing firing at 1,200° C. to 1,500° C. provides the polycrystalline alumina abrasive grains including an alumina content of 95.0% by mass or more and a silica content of 0.05 to 3.30% by mass, with a grain size of 0.100 to 0.400 um, and a Vickers hardness of 21.00 or more.
Provided is a curable resin composition comprising: a blocked maleimide compound having a maleimide group blocked by a blocking agent that dissociates when heated; and a reactive component. The reactive component is a compound having a reactive group that reacts with the maleimide group, or a compound that generates the reactive group when heated. The blocking agent may be a compound that dissociates from the maleimide group when heated to 220°C or below and that has a boiling point of 250°C or below.
[Problem] To provide a resin composition that can be cured at a low temperature in a short time, and a composite material that contains the resin composition and a fiber base material. [Solution] Specifically disclosed is a resin composition containing a vinyl ester resin (A), an ethylenically-unsaturated-group-containing monomer (B), a metal-containing compound (C), an organic peroxide (D), and a mercapto-group-containing compound (E). The metal-containing compound (C) is a compound that contains a group 7-11 metal element. The metal-equivalent content of the metal-containing compound (C) is 0.1 × 10−6to 2000 × 10−6 parts by mass per 100 total parts by mass of the vinyl ester resin (A) and the ethylenically-unsaturated-group-containing monomer (B).
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
B29C 70/28 - Façonnage de matières composites, c.-à-d. de matières plastiques comprenant des renforcements, des matières de remplissage ou des parties préformées, p. ex. des inserts comprenant uniquement des renforcements, p. ex. matières plastiques auto-renforçantes opération de façonnage des matières composites comprenant uniquement des renforcements
This control system is configured to: acquire, from a sensor that detects a real state of a device to be controlled, detection data indicating the real state; specify a management parameter to be used for controlling the device in the real state, by referring to a storage apparatus that stores auxiliary information including one or more correspondence relationships between a predetermined state of the device and a management parameter related to at least one of the operation of the device and the performance of the device; and control the device on the basis of the specified management parameter.
Disclosed is an adhesive agent composition. The adhesive agent composition contains a (meth)acrylate compound, an epoxy compound, an oxetane compound, and a photoacid generator. The adhesive agent composition optionally further contains a (meth)acrylic resin having a cation-polymerizable group. The epoxy compound optionally contains an alicyclic epoxy compound.
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
40.
JOINED OBJECT PRODUCTION METHOD, JOINED OBJECT, AND ELECTRIC/ELECTRONIC COMPONENT
Provided is a method for producing a joined object obtained by joining a columnar base material A, a thermoplastic film B, and a resin C in this order, the method including sequentially performing: a step 1 of winding the thermoplastic film B around at least a part of an outer periphery of the columnar base material A in a peripheral direction; and a step 2 of joining the resin C to a portion of the columnar base material A around which the thermoplastic film B is wound by insert molding to seal the thermoplastic film B.
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B29K 63/00 - Utilisation de résines époxy comme matière de moulage
B29K 705/00 - Utilisation de métaux, leurs alliages ou leurs composés pour des pièces préformées, p. ex. pour des inserts
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
41.
COPOLYMER, PHOTOSENSITIVE RESIN COMPOSITION, RESIN CURED FILM, AND IMAGE DISPLAY ELEMENT
The copolymer has an acid group-bearing structural unit (a) and a structural unit (b) that has a group represented by formula (1-1) (In formula (1-1), R1 is a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms; R2 and R3 are each independently a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms; and * represents a linking site that links to a residue provided by the removal of the group with formula (1-1) from the structural unit (b).).
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
C08F 220/06 - Acide acryliqueAcide méthacryliqueLeurs sels métalliques ou leurs sels d'ammonium
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08F 220/20 - Esters des alcools polyhydriques ou des phénols polyhydriques
C08F 220/36 - Esters contenant de l'azote contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle
A photosensitive resin composition according to the present disclosure contains an acid-modified vinyl group-containing resin, a photopolymerizable compound, a photopolymerization initiator, and a thermosetting resin. The photopolymerization initiator includes a photopolymerization initiator having a fluorene skeleton. The thermosetting resin includes at least one selected from the group consisting of bisphenol F epoxy resins and novolac epoxy resins.
Provided is a method for polishing a resin film, the method comprising: semi-curing, by heat treatment, a thermosetting resin film containing a maleimide compound with a maleimide group; and polishing the semi-cured resin film by chemical mechanical polishing while supplying an abrasive containing silica particles. Also provided is a method for manufacturing a circuit connection body, the method comprising polishing a resin film.
Provided is a curable resin composition for hybrid bonding, the composition comprising a maleimide compound having a maleimide group, and a reactive component different from the maleimide compound. The reactive component includes a styrene-based compound having a reactive group obtained by removing one or more hydrogen atoms bonded to a benzene ring from a compound represented by formula (I). R1and R2 are each independently a hydrogen atom or a C1-C3 alkyl group.
The purpose of the present invention is to provide a metal complex with which a target gas, especially carbon dioxide, can be separated and recovered from a mixed gas with higher energy efficiency than conventional materials. The metal complex is composed of: a dianion of an aromatic 1,3-dicarboxylic acid compound; a metal dication selected from magnesium, calcium, chromium, molybdenum, tungsten, manganese, iron, ruthenium, cobalt, rhodium, nickel, palladium, copper, zinc and cadmium; and an organic bidentate ligand having a bispyridylethylene structure, and has a structure including two-dimensional sheets stacked in mutual engagement.
B01J 20/22 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance organique
C07C 205/57 - Composés contenant des groupes nitro liés à un squelette carboné le squelette carboné étant substitué de plus par des groupes carboxyle ayant des groupes nitro et des groupes carboxyle liés à des atomes de carbone de cycles aromatiques à six chaînons du squelette carboné
C07D 207/34 - Composés hétérocycliques contenant des cycles à cinq chaînons, non condensés avec d'autres cycles, ne comportant qu'un atome d'azote comme unique hétéro-atome du cycle avec uniquement des atomes d'hydrogène ou de carbone liés directement à l'atome d'azote du cycle comportant deux liaisons doubles entre chaînons cycliques ou entre chaînons cycliques et chaînons non cycliques avec des hétéro-atomes ou avec des atomes de carbone comportant trois liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p. ex. radicaux ester ou nitrile, liés directement aux atomes de carbone du cycle
C07D 401/06 - Composés hétérocycliques contenant plusieurs hétérocycles comportant des atomes d'azote comme uniques hétéro-atomes du cycle, au moins un cycle étant un cycle à six chaînons avec un unique atome d'azote contenant deux hétérocycles liés par une chaîne carbonée contenant uniquement des atomes de carbone aliphatiques
A photosensitive resin composition according to the present disclosure contains an acid-modified vinyl-group-containing resin, a photopolymerizable compound, a photopolymerization initiator, and a thermosetting resin. The photopolymerization initiator includes a photopolymerization initiator having a fluorene skeleton. The thermosetting resin includes at least one selected from the group consisting of bisphenol F epoxy resins and novolac epoxy resins.
[Problem] To provide: a resin composition that can cure rapidly and at low temperatures; and a composite material containing this resin composition and a fibrous base material. [Solution] The resin composition contains a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), a metal-containing compound (C), an organic peroxide (D), and an imidazole compound (E). The vinyl ester resin (A) is an epoxy group-bearing vinyl ester resin; the metal-containing compound (C) is a compound that contains a metal element from groups 7 to 11; and the content as metal of the metal-containing compound (C) is 0.1 × 10-6to 2,000 × 10-6 mass parts per 100 mass parts of the total of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B).
C08G 59/06 - Polycondensats contenant plusieurs groupes époxyde par molécule de composés polyhydroxylés avec l'épihalohydrine ou ses précurseurs de polyphénols
48.
WIRING STRUCTURE, PRODUCTION METHOD FOR WIRING STRUCTURE, AND SEMICONDUCTOR ELEMENT
A wiring structure 3A includes a support body K, an insulation film 12 that is a cured product of a photosensitive resin composition that is provided on the support body K, wiring 13 that is provided on the insulation film 12 in a prescribed pattern, and a post member 14 that is provided so as to penetrate the insulation film 12 in the thickness direction at a position that does not coincide with the wiring 13.
Disclosed are a heat-curable composition and a cured object thereof. The heat-curable composition comprises a polythiol compound having a disulfide bond and a hydroxyl group, a cyclic ether compound having a polyether group and two or more cyclic ether groups, a curing accelerator, and a photo-radical generator.
This seal structure between dissimilar materials includes: a busbar (columnar base material) with a roughened region provided on a surface thereof; a film adhesive wrapped around the outer periphery of the busbar; and a resin bonded at least from the roughened region of the busbar to the portion where film adhesive is wrapped.
One embodiment of the present invention relates to a curable composition containing a polymerization inhibitor and a compound having a vinylphenyl group.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 12/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule double liaison carbone-carbone et l'un au moins étant terminé par un noyau carbocyclique aromatique
One embodiment of the present invention relates to a method for producing a curable composition, the method comprising: mixing a liquid A, which contains a solvent and a compound having a vinylphenyl group, with a polymerization inhibitor B to obtain a liquid B, and removing the solvent from the liquid B to obtain a mixture containing a compound having a vinylphenyl group and the polymerization inhibitor B; and obtaining a curable composition by using the mixture.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C07C 7/20 - Emploi d'additifs, p. ex. pour la stabilisation
C07C 13/45 - Hydrocarbures polycycliques ou leurs dérivés hydrocarbonés acycliques à cycles condensés à système bicyclique contenant neuf atomes de carbone
C08F 12/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule double liaison carbone-carbone et l'un au moins étant terminé par un noyau carbocyclique aromatique
A non-aqueous secondary battery binder polymer including a first structural unit derived from a monomer (a1), a second structural unit derived from a monomer (a2), and a third structural unit derived from a monomer (a3), wherein the monomer (a1) is a non-ionic compound having only one ethylenically unsaturated bond, the monomer (a2) is a compound having a carboxy group and only one ethylenically unsaturated bond, and the monomer (a3) is a polyrotaxane including a cyclic molecule having a cyclic framework to which a group containing an ethylenically unsaturated bond is bonded and a chain molecule that passes through an openings of the cyclic molecule and has stopper groups at both ends.
C09D 151/08 - Compositions de revêtement à base de polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères greffés sur des composés macromoléculaires obtenus autrement que par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone
54.
CURABLE COMPOSITION FOR SEALING MEMBER, AND SEALING MEMBER
One embodiment of the present invention relates to a curable composition for a sealing member, the curable composition containing: a compound having a vinyl phenyl group; and a polymerization inhibitor containing a TEMPO compound.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 12/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule double liaison carbone-carbone et l'un au moins étant terminé par un noyau carbocyclique aromatique
C08F 290/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux
55.
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
This semiconductor package comprises: a package substrate having a main surface that includes a first electrode; a semiconductor chip component having an outer peripheral surface and a circuit surface that includes a second electrode; an underfill; a sealing layer; and an intermediate resin part. The underfill includes a portion that is interposed between the package substrate and the semiconductor chip component. The sealing layer includes a portion that surrounds the semiconductor chip component on the package substrate. The intermediate resin part is provided so as to be interposed between the underfill and the sealing layer and to be in contact with the outer peripheral surface of the semiconductor chip component.
A photosensitive element according to the present disclosure comprises a support and a photosensitive layer formed on the support. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer. The photopolymerization initiator contains a hexaarylbiimidazole compound. The content of the sensitizer is 0.019 parts by mass or less with respect to 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.
G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
57.
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, ELECTRONIC COMPONENT INTERMEDIATE, INTERPOSER WITH DUMMY PATTERN SECTION, AND RESIN COMPOSITION FOR UNDERFILL
This method for manufacturing an electronic component comprises: a step for forming, on an interposer, a plurality of wiring patterns for bonding with a semiconductor chip; a step for forming a dummy pattern section on the interposer so as to cover the periphery of the wiring patterns in plan view; a step for bonding the semiconductor chip to the wiring patterns via a solder joint; and a step for supplying a resin composition for underfill to a gap between the interposer and the semiconductor chip to form a sealing resin part.
An arm part (11) of this suspension arm is formed such that when the suspension arm is viewed in a plan view from a side surface direction perpendicular to both a virtual straight line connecting a ball joint part (12) and a rear bush part (13) and the thickness direction of the arm part (11), the arm part (11) has a maximum thickness part at which the thickness is maximum within a range of ± 100 mm from the rear bush part (13) formation position along the virtual straight line, and said thickness is smaller than the maximum thickness part at the connection part with the ball joint part (12) and the connection part with the rear bush part (13).
The present invention predicts a prescribed physical property in the reaction path of a multimolecular reaction. This prediction device comprises: an acquisition unit that acquires a trained model trained using a data set including, in a multimolecular reaction in which a formation system including two or more types of formation molecules is formed from a reaction system including two or more types of reaction molecules, the reaction system, the formation system, intermediate structures of the reaction molecules generated in the process of forming the formation molecules from the reaction molecules by the multimolecular reaction, and a prescribed physical property of at least one of the reaction system and the formation system; and a prediction unit that predicts the physical property using the trained model.
There is provided a method for storing fluoroalkene in which, even when stabilizers for suppressing reactions of fluoroalkene are not added, the reactions of the fluoroalkene hardly occur and the purity of the fluoroalkene hardly decreases during storage. Fluoroalkene having a bromine atom or an iodine atom in the molecule is at least one type of fluoroethylene represented by a first general formula C2HpFqXr and fluoropropene represented by a second general formula C3H3FtXu (X represents a bromine atom or an iodine atom), and contains or does not contain at least one type among manganese, cobalt, nickel, and silicon as metal impurities. When any of the foregoing is contained, the fluoroalkene is stored in a container with the total concentration of the manganese, the cobalt, the nickel, and the silicon set to 1000 ppb by mass or less.
A method for manufacturing a substrate with conductive vias includes a step a of preparing a substrate provided with holes, and providing a metal paste portion containing metal particles and a volatile solvent so as to fill the inside of the holes and cover at least a surface of the substrate around the holes; a step b of heating the metal paste portion to remove a part of the volatile solvent; a step c of removing a part of the metal paste portion after heating so as to expose the surface, and forming conductive via precursors having a flattened exposed surface and containing a remainder of the metal particles and the volatile solvent inside the holes; and a step d of firing the conductive via precursors to form conductive vias.
C23C 24/10 - Revêtement à partir de poudres inorganiques en utilisant la chaleur ou une pression et la chaleur avec formation d'une phase liquide intermédiaire dans la couche
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
62.
CURABLE COMPOSITION AND ELECTRONIC COMPONENT DEVICE
[Problem] To provide a curable composition containing a biomass-derived material. [Solution] A curable composition containing a curable component derived from biomass.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08G 59/06 - Polycondensats contenant plusieurs groupes époxyde par molécule de composés polyhydroxylés avec l'épihalohydrine ou ses précurseurs de polyphénols
C08K 3/013 - Charges, pigments ou agents de renforcement
H01L 21/30 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes
63.
METHOD FOR PRODUCING MODIFIED MALEIMIDE RESIN SOLUTION
Provided are a method for producing a modified maleimide resin solution, the method comprising reacting, in an organic solvent, (A) a maleimide resin having an acid value of 3.50 mgKOH/g or more and having two or more N-substituted maleimide groups, (B) an amine compound having two or more primary amino groups and (C) a monoamine compound having an acidic substituent; a method for producing a resin composition, comprising using the modified maleimide resin solution produced by said production method; a method for producing a prepreg; a method for producing a laminate; a method for producing a resin film; a method for producing a printed wiring board; and a method for producing a semiconductor package.
The present invention discloses one embodiment of a temporary fixing process in a semiconductor device manufacturing method. The process involves forming a detachment layer 11 on a glass base 10, and providing a heat-resistant member 12 to a rim 11a of the detachment layer 11. The heat-resistant member 12 is, for example, a heat-resistant polyimide tape. After the heat-resistant member 12 is provided, an adhesion layer 13 is formed on the detachment layer 11, and the adhesion layer 13 is heated to pre-bake the same. Then, the heat-resistant member 12 is removed, and a semiconductor member 20 is attached to the adhesion layer 13. The detachment layer 11 is irradiated with laser to separate the glass base 10 from the semiconductor member 20. With this method, since burn-in to the rim 11a of the detachment layer 11 is prevented, the glass base 10 can be easily separated. Since the glass base 10 can be separated in a clean state, the glass base 10 can be reused. The method is particularly useful when the base is an expensive glass wafer.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
65.
PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
The photosensitive element according to the present disclosure comprises a substrate and a photosensitive layer formed on this substrate. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer. The thickness of the photosensitive layer is less than 10 μm. The photosensitive layer has a light transmittance of over 70% at a wavelength of 405 nm.
A resonant sound absorber according to the present invention is attached to an attachment surface in an inner cavity of a tire. The resonant sound absorber comprises: a resonance box that has an opening and has a hollow part formed on the interior thereof; and a hollow neck part that is inserted into the opening and affixed to the resonance box, and extends into the hollow part.
G10K 11/172 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général utilisant des effets de résonance
A resonant sound absorber according to the present invention is attached to an attachment surface of a tire. The resonant sound absorber comprises a resonance box that has an opening and has a hollow part formed on the interior thereof. The resonance box comprises a bottom wall part that is made to face the attachment surface, an upper wall part that forms the hollow part together with the bottom wall part, and side wall parts that surround the hollow part. The bottom wall part is thicker than the upper wall part.
G10K 11/172 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général utilisant des effets de résonance
68.
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME
An adhesive composition according to the present invention includes a thermoplastic resin and a filler, wherein the thermoplastic resin is a polyester urethane resin, and the mass ratio of the polyester urethane resin to the filler is 1.5-5. The adhesive composition including the thermoplastic resin and a filler is such that the thermoplastic resin has a glass transition temperature of 50°C or higher, and a cured product of the adhesive composition has a storage modulus at 100°C of 6.0×107 Pa or higher.
C09J 175/06 - Polyuréthanes à partir de polyesters
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01R 11/01 - Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p. ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par le câble et possédant des moyens pour faciliter la connexion électrique avec quelqu'autre fil, borne, ou organe conducteur, répartiteurs caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
H01R 43/00 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques
Provided is a method for producing monofluoroethane, which enables production of monofluoroethane from ethylene and hydrogen fluoride at a high conversion rate even under mild reaction conditions. This method for producing monofluoroethane comprises reacting ethylene gas with hydrogen fluoride gas in the presence of a catalyst to obtain monofluoroethane. The catalyst contains a chromium compound, which is at least one selected from chromium fluoride and chromium oxyfluoride.
The purpose of the present disclosure is to provide an adhesive film that can prevent the generation of defective semiconductor devices, a method for manufacturing the adhesive film, and a method for manufacturing the semiconductor device. An adhesive film (1) includes: an elongate base material film (2); an adhesive layer (3); an adhesive film (4); and a defect marking (5) formed at the same position as a defect (8) at least in a longitudinal direction LD of the adhesive film. This method for manufacturing an adhesive film comprises: preparing a raw film (101) provided with the elongate base material film (2), the adhesive layer (3), and the adhesive film (4); inspecting the raw film (101); and, if a defect is detected, forming a defect marking (5) at the same position as the defect at least in the longitudinal direction LD of the raw film (101). This method for manufacturing a semiconductor device comprises: preparing the adhesive film (1); pre-cutting the adhesive layer (3) and the adhesive film (4) in a predetermined pattern to form a plurality of adhesive pieces (6); and attaching an adhesive piece (6) having no defect marking (5) among the plurality of adhesive pieces (6) to a semiconductor wafer (102).
A method for manufacturing a semiconductor device is disclosed. The method for manufacturing a semiconductor device includes forming a positive photosensitive resin film on a surface of a semiconductor wafer; exposing a part of the positive photosensitive resin film to light and providing an exposed portion on the positive photosensitive resin film; developing the positive photosensitive resin film using a developer and removing the exposed portion to form a pattern; obtaining a patterned semiconductor chip by performing plasma dicing using the pattern as a mask and singulating the semiconductor wafer; exposing a pattern of the patterned semiconductor chip; and obtaining a semiconductor chip in which the pattern is removed from the patterned semiconductor chip by removing the pattern exposed by using a removing liquid.
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
72.
PROPERTY PREDICTION DEVICE, PROPERTY PREDICTION METHOD, AND PROGRAM
A relation between design conditions and property prediction values of a target substance is visualized to be easily grasped. A standard design determination unit configured to determine a standard design condition representing a design condition in a target substance produced using two or more material substances, a neighboring design generation unit configured to generate a plurality of neighboring design conditions by changing one design value with respect to the standard design condition, a property prediction unit configured to predict two or more property values under each of the plurality of neighboring design conditions, and a visualization unit configured to arrange symbols corresponding to the plurality of neighboring design conditions, on a plane having the design value and a first property value as axes, in a color representation corresponding to a second property value, are included.
Provided is a metal paste for bonding that contains metal particles, a reducing agent, and a dispersion medium, and that has a yield stress measured via the procedure described here of 2.0 MPa or less. Yield stress measurement procedure: (1) Apply the metal paste for bonding on a copper substrate, dry at 90°C for 30 minutes, and form a 3x3x0.05 mm thick metal-particle-containing layer. (2) Use a die shear testing machine to press the metal-particle-containing layer in the horizontal direction with a 4 mm wide tool, under the conditions of a heating temperature of 90°C, a speed of 100 μm/s, and a distance between the tip of the tool and the copper substrate of 0.02 mm, thereby obtaining a stress (MPa)-strain (%) curve. (3) Define the stress when the permanent strain becomes 0.2% in the stress (MPa)-strain (%) curve as the yield stress (MPa).
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B22F 1/10 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
74.
METHOD FOR PRODUCING JOINED BODY, JOINED BODY, METAL PASTE FOR JOINING, AND METHOD FOR PRODUCING SAME
This method for producing a metal paste for joining includes a step in which at least metal particles that each have a first fatty acid having 10 or more carbon atoms on the surface, a second fatty acid having 18 or less carbon atoms, and a reducing agent that is a polyhydric alcohol are mixed with each other. This method for producing a joined body includes: a first step for forming a coating film of a metal paste for joining on a first member by applying the metal paste for joining, which is obtained by the above-described method; a second step for forming a metal particle-containing layer by drying the coating film; a third step for obtaining a laminate by disposing a second member on the metal particle-containing layer; and a fourth step for sintering the metal particle-containing layer of the laminate.
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B22F 1/10 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
75.
LAMINATE, DECORATIVE DEVICE, MILLIMETER WAVE RADAR DEVICE, AND SENSOR DEVICE
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
G01S 7/03 - Détails de sous-ensembles HF spécialement adaptés à ceux-ci, p. ex. communs à l'émetteur et au récepteur
76.
CUBIC BORON NITRIDE SINTERED BODY, METHOD FOR PRODUCING SAME, AND TOOL
C04B 35/5831 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de bore à base de nitrure de bore cubique
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
B23B 27/20 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier à éléments tranchants constitués par des diamants
77.
SIC SINGLE CRYSTAL, SIC SUBSTRATE AND SIC EPITAXIAL WAFER
A SiC single crystal according to an embodiment has a lattice surface measured along each of a first straight line, a second straight line, a third straight line, a fourth straight line, a fifth straight line and a sixth straight line, which is curved in a convex shape. In the lattice surface measured along each of the first straight line, the second straight line, the third straight line, the fourth straight line, the fifth straight line and the sixth straight line, the center is located closer to a C surface than an end portion of the lattice surface measured along each of the straight lines. Each of the first straight line, the second straight line, the third straight line, the fourth straight line, the fifth straight line and the sixth straight line is a straight line passing through the center when seen in a plan view in a thickness direction and inclined by 30° each based on the center.
C30B 25/20 - Croissance d'une couche épitaxiale caractérisée par le substrat le substrat étant dans le même matériau que la couche épitaxiale
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
78.
LAMINATE, DECORATIVE DEVICE, MILLIMETER WAVE RADAR DEVICE, AND SENSOR DEVICE
Provided is a laminate comprising a clearcoat layer, a base material, and a silver mirror layer in this order. Y (reflectance) in an XYZ color system (Yxy color system), when measured from a surface side where the clearcoat layer is provided, is 40% or more.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
G01J 1/02 - Photométrie, p. ex. posemètres photographiques Parties constitutives
G01S 7/03 - Détails de sous-ensembles HF spécialement adaptés à ceux-ci, p. ex. communs à l'émetteur et au récepteur
Provided is a resin composition exhibiting excellent flame retardancy together with high copper foil peel strength and high desmear resistance. Also provided are a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition. Specifically, the resin composition contains (A) a thermosetting resin and (B) a flame retardant. The flame retardant (B) contains (B1) a phosphorus-based flame retardant having a styrene skeleton.
A method for manufacturing a wiring board includes, in the stated order: a step of forming a resist layer 3 on a metal layer 20 provided on a support 1; a step of forming a pattern, including an opening 3A through which the metal layer 20 is exposed, on the resist layer 3 by exposure and development of the resist layer 3; a step of forming a copper plating layer 21 on the metal layer 20 exposed within the opening 3A by electrolytic plating; a step of removing the resist layer 3; a step of filling at least a part of an opening void 21A opening at a surface of the copper plating layer 21; and a step of removing an exposed part of the metal layer 20 by etching.
H05K 3/22 - Traitement secondaire des circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
81.
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND CALCULATION ASSISTANCE PROGRAM
The present invention improves convenience for a user who uses a calculation program based on a localized wave basis density functional method. This information processing device for executing a calculation program based on a localized wave basis density functional method: acquires a reference basis function set for executing the calculation program at a target precision level, and a low-precision basis function set for executing the calculation program at a precision level lower than the target precision level; acquires, with respect to structural information about a target material, low-precision optimization structural information by using the structural information as initial structural information and by using the low-precision basis function set to execute the calculation program when an execution instruction of the calculation program is received; and acquires optimization structural information about the target precision level by using the low-precision optimization structural information as the initial structural information and by using the reference basis function set to execute the calculation program.
G16C 10/00 - Chimie théorique computationnelle, c.-à-d. TIC spécialement adaptées aux aspects théoriques de la chimie quantique, de la mécanique moléculaire, de la dynamique moléculaire ou similaires
G16C 60/00 - Science informatique des matériaux, c.-à-d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
82.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A photosensitive resin composition, containing: an acid-modified vinyl group-containing resin (A); a photopolymerization initiator (B); a photopolymerizable compound (C); and polymerization inhibitor (D), in which the photopolymerization initiator (B) includes an alkyl phenone-based photopolymerization initiator (B1), an oxime ester-based photopolymerization initiator (B2), and a benzophenone-based photopolymerization initiator (B3).
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/115 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des supports ou couches ayant des moyens pour obtenir un effet de réseau ou pour augmenter le contact dans le tirage sous vide
G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
83.
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND CALCULATION SUPPORT PROGRAM
The present invention improves the convenience of a user using a calculation program based on the plane-wave basis density functional method. Provided is an information processing device for executing a calculation program based on the plane-wave basis density functional method, wherein: reference condition information to be executed at a target accuracy level and low accuracy condition information to be executed at an accuracy level lower than the target accuracy level are acquired as condition information for execution of the calculation program; when an instruction to execute the calculation program for structure information on a target substance has been received, the calculation program is executed using the low accuracy condition information with the structure information serving as initial structure information to acquire low-accuracy optimization structure information; and optimization structure information at the target accuracy level is acquired by executing the calculation program using the reference condition information with the low-accuracy optimization structure information serving as initial structure information.
G16C 60/00 - Science informatique des matériaux, c.-à-d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
G16C 10/00 - Chimie théorique computationnelle, c.-à-d. TIC spécialement adaptées aux aspects théoriques de la chimie quantique, de la mécanique moléculaire, de la dynamique moléculaire ou similaires
84.
POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT PRODUCTION METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD
A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A1) a polyglycerol having a weight average molecular weight of 350 to 2800 and (B) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded. A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A2) a polyglycerol having a hydroxyl value of 800 to 1000 mgKOH/g and (B) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A1) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded and (B) a 4-pyrone-based compound represented by General Formula (1) below. A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A2) a polyglycerol and (B) a 4-pyrone-based compound represented by General Formula (1) below.
A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A1) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded and (B) a 4-pyrone-based compound represented by General Formula (1) below. A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A2) a polyglycerol and (B) a 4-pyrone-based compound represented by General Formula (1) below.
A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A1) a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded and (B) a 4-pyrone-based compound represented by General Formula (1) below. A polishing liquid containing: abrasive grains; an additive; and water, in which the additive includes (A2) a polyglycerol and (B) a 4-pyrone-based compound represented by General Formula (1) below.
[In the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent.]
Disclosed is a method for manufacturing a multilayer substrate, the method including: a first step for forming a first insulating resin layer that contains a maleimide resin on a base material; a second step for forming a second insulating resin layer; and a third step for collectively curing at least the first insulating resin layer and the second insulating resin layer.
A SiC substrate according to an embodiment has an end region within 5 mm from an outer circumferential end portion, a density of metallic foreign bodies in the end region detected by a scanning electron microscope is equal to or smaller than 1.5 pieces/mm2.
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
88.
THERMAL CONDUCTION SHEET HOLDER AND METHOD OF MANUFACTURING HEAT DISSIPATING DEVICE
A thermal conduction sheet holder include, in the following order, an elongated carrier film, a plurality of thermal conduction sheets, and an elongated cover film covering the plurality of thermal conduction sheets, the shortest distance between adjacent thermal conduction sheets is 2 mm or more, the plurality of thermal conduction sheets are disposed at intervals in a longitudinal direction of the carrier film and the cover film, and the plurality of thermal conduction sheets are peelable from the cover film and the carrier film.
B65H 37/00 - Appareils délivrant des articles ou des bandes, comportant des dispositifs pour exécuter des opérations auxiliaires particulières
B23P 15/26 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe d'échangeurs de chaleur
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
89.
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, AND CURABLE RESIN COMPOSITION
Provided is a method for manufacturing a wiring board comprising a first step for forming, on a glass base material, a first insulating resin layer containing a maleimide resin such that the glass base material and the first insulating resin layer are in direct contact with each other.
Provided are: a laminate having a low difference between a dielectric loss tangent (Df) at 10 GHz and a dielectric loss tangent (Df) at 80 GHz, and having a low dielectric loss tangent (Df) at 80 GHz; and a laminated board, a printed wiring board, and a semiconductor package that include the aforementioned laminate. Specifically, provided is a laminate in which a thermosetting resin composition layer (A), a core material, and a thermosetting resin composition layer (B) are laminated in the stated order, wherein the core material is a thermosetting resin film, the difference (ΔDf) between the dielectric loss tangent (Df) at 10 GHz and the dielectric loss tangent (Df) at 80 GHz of a cured product of the laminate is 0.0010 or less, and the dielectric loss tangent (Df) of the cured product of the laminate at 80 GHz is 0.0020 or less.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 7/025 - Propriétés électriques ou magnétiques
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
91.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR PRINTED WIRING BOARD
A photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerizable compound, (D) a photopolymerization initiator, and (E) an inorganic filler, wherein the inorganic filler (E) contains a first inorganic filler having an average particle size of 0.5 μm or more and a second inorganic filler having an average particle size of 0.3 μm or less, and the solid content mass ratio of the first inorganic filler content to the second inorganic filler content is 6:4 to 8:2.
A photosensitive resin composition for a permanent resist according to the present disclosure contains (A) an acid-modified vinyl group-containing resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) an isocyanate group-containing silane compound.
Provided is an electrode active material layer which contains an electrode active material, wherein: the thickness of the electrode active material layer is 50 µm or more; the number of through passages, which reach a depth of 50 µm from the surface of the electrode active material layer, per unit area is 3.50 passages/µm2or more as determined by visualizing pores of the electrode active material layer in a three-dimensional image that is obtained by X-ray CT scanning of the electrode active material layer; and the density of the electrode active material layer is 1.20 g/cm3 or more.
Disclosed is a curable resin composition. The curable resin composition contains an epoxy compound, an inorganic filler, a coupling agent, and a polymerization initiator. The epoxy compound includes an alicyclic epoxy compound. The alicyclic epoxy compound content is 60 mass% or more based on the total amount of the epoxy compound.
In this method for manufacturing a bonded body, a bonded body comprising a first member, a second member, and a bonding part that includes a sintered body of a metal paste containing metal particles and that joins the first member and the second member is manufactured. The surface shape on the joining side of the second member is a quadrilateral having two pairs of parallel sides X and Y with all corners being right angles. The first member has a main surface that is wider than the quadrilateral. The method comprises: a step A for providing a metal paste coating in a predetermined pattern in a region corresponding to the quadrilateral on the main surface of the first member; a step B for placing the second member on the first member having the coating so as to align with the region to obtain a laminate; and a step C for forming the bonding part by sintering the coating of the laminate. In the step A, the pattern is a honeycomb arrangement of hexagons having three pairs of parallel sides a, b, and c at a predetermined interval, and the coating is provided in the region so as to satisfy the following conditions (i) and (ii). Condition (i): The side X and the side a of a hexagon are parallel to each other. Condition (ii): The side X does not overlap a gap between adjacent hexagons in a direction orthogonal to the side X.
A photosensitive resin composition containing: (A) a resin having an ethylenically unsaturated bond and an acidic group; (B) a thermosetting resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) an inorganic filler, wherein the inorganic filler (E) contains a first inorganic filler having an average particle size of 0.5 μm or more and a second inorganic filler having an average particle size of 0.3 μm or less, and the solid content mass ratio of the first inorganic filler content to the second inorganic filler content is 6:4 to 8:2.
In this method for producing a composite sheet, particles are arranged on a surface of a sheet layer formed in a sheet shape, and pressure is applied in the thickness direction of the sheet layer, so that the particles are embedded in the sheet layer. In a method for producing another composite sheet, particles are arranged on a surface of a first sheet layer that is formed in a sheet shape and forms a part of a sheet layer, a second sheet layer that is formed in a sheet shape and forms a part of the sheet layer is disposed on the surface of the first sheet layer where the particles are arranged, and pressure is applied to the first sheet layer and the second sheet layer in an opposing direction between the first sheet layer and the second sheet layer, so that the particles are embedded in at least one of the first sheet layer and the second sheet layer. The composite sheet contains particles in the sheet layer, and the particles are distributed only within a certain range in the thickness direction of the sheet layer. The other composite sheet contains particles in the sheet layer, and the particles are arranged in a single layer such that the particles do not overlap in the thickness direction of the sheet layer.
B29C 43/28 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur indéfinie en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
98.
CMP POLISHING LIQUID, CMP POLISHING LIQUID SET, AND POLISHING METHOD
A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A1) a 4-pyrone-based compound represented by General Formula (1) below, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A2) a picolinic acid compound, and a pH is 5.0 or more.
A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A1) a 4-pyrone-based compound represented by General Formula (1) below, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A2) a picolinic acid compound, and a pH is 5.0 or more.
A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A1) a 4-pyrone-based compound represented by General Formula (1) below, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A2) a picolinic acid compound, and a pH is 5.0 or more.
[In the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent.]
A pressure-sensitive adhesive composition includes: a (meth)acrylic resin, photopolymerization initiator, and crosslinking agent, wherein the (meth)acrylic resin is a diblock copolymer of an X block and a Y block at a molar ratio from 40:60 to 95:5; the X block includes: structural unit (M-1) having a hydroxy, and structural unit (M-2) having an ethylenically unsaturated group; the Y block includes: structural unit (M-3) derived from ethylenically unsaturated compound (m-3) having an SP value of 20 (J/cm3)1/2 or less; at least one of structural units (M-1) to (M-3) is derived from a (meth)acryloyloxy group; a total amount of structural units (M-1) and (M-2) included in the X block is 18 to 95 mol % relative to all structural units in the X block; and a total amount of structural units (M-1) and (M-2) included in the Y block is 0 to 17 mol % relative to all structural units in the Y block.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
100.
DESIGN ASSISTANCE DEVICE, DESIGN ASSISTANCE METHOD, PROGRAM, AND INFORMATION PROCESSING SYSTEM
A design assistance device is configured to assist design of a material in which a plurality of raw materials are to be formulated, by using a machine learning model that has learned a correspondence relationship between design condition information of a material, in which a plurality of raw materials are to be formulated, and property information of the material. The design assistance device includes a memory; and a processor connected to the memory and configured to store information of names and attributes of a plurality of registered raw materials, receive an input of information of a name and an attribute of a raw material to be newly registered, and store the received information, and generate a feature of the raw material inputtable to the machine learning model, from information that is selected as the design condition information and is information of attributes of a plurality of raw materials stored.
G16C 60/00 - Science informatique des matériaux, c.-à-d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
G16C 20/70 - Apprentissage automatique, exploration de données ou chimiométrie
