Provided is an adhesive which contains an oxygen absorbent and is used in optical applications. When a laminate obtained by bonding two 7.0 cm square soda-lime glass plates which has a thickness of 1.1 mm with an adhesive layer which is formed from the adhesive and has a thickness of 250 μm is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 24 hours, there is no bubble at the edge of the laminate after the endurance condition, or when the laminate is placed under an endurance condition in which the laminate is put in an atmosphere at 170°C for 96 hours, the number of needle-shaped bubbles present at the edge of the laminate after the endurance condition is less than 5. This adhesive makes it possible to suppress the generation of needle-shaped bubbles at the edge of an optical member.
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 11/00 - Caractéristiques des adhésifs non prévues dans le groupe , p. ex. additifs
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 133/10 - Homopolymères ou copolymères d'esters de l'acide méthacrylique
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
3.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a vinyl ether (a) having a hydroxypolyoxyalkylene chain including two or more C1-3 oxyalkylene units. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de manganèse d'oxydes ou d'hydroxydes mixtes contenant du manganèse pour insérer ou intercaler des métaux légers, p. ex. LiMn2O4 ou LiMn2OxFy
H01M 4/525 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de nickel, de cobalt ou de fer d'oxydes ou d'hydroxydes mixtes contenant du fer, du cobalt ou du nickel pour insérer ou intercaler des métaux légers, p. ex. LiNiO2, LiCoO2 ou LiCoOxFy
4.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-50 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de manganèse d'oxydes ou d'hydroxydes mixtes contenant du manganèse pour insérer ou intercaler des métaux légers, p. ex. LiMn2O4 ou LiMn2OxFy
H01M 4/525 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de nickel, de cobalt ou de fer d'oxydes ou d'hydroxydes mixtes contenant du fer, du cobalt ou du nickel pour insérer ou intercaler des métaux légers, p. ex. LiNiO2, LiCoO2 ou LiCoOxFy
5.
COATING LAYER REMOVAL DEVICE AND COATING LAYER REMOVAL METHOD
A coating layer removal device 100 includes: a roll-out shaft 10 that rolls out a laminated film 90; a first backup roll 21 that contacts a base film of the laminated film 90 and transports the laminated film downstream; a first spray unit 31 that is disposed facing the first backup roll 21 and that includes one or more nozzles; a second spray unit 32 that is disposed downstream of the first spray unit, is disposed facing a second backup roll 22 and includes one or more nozzles; a pressurized water supply unit 50 that supplies pressurized water to the first spray unit 31 and the second spray unit 32; and a roll take-up shaft 40 that takes up the base film 91 into a roll shape after the coating layer has been removed. The pressurized water supply unit 50 includes one or more pumps.
Provided is a winding roll 1 in which a laminate film 90 includes: a release film including a base material film 91 and a release agent layer 92; and a ceramic green sheet including green sheet parts 931, 932. The green sheet parts 931, 932 are each arranged along a longitudinal direction of the laminate film 90. A recess 94 sandwiched by the green sheet parts 931, 932 is formed on the release agent layer 92. The laminate film 90 is wound around a shaft core 80 by traverse winding having a size of a swing width α. When viewed in a cross section orthogonal to the longitudinal direction of the laminate film 90, the size of the swing width α is, for example, greater than a width β1 from an edge end of the laminate film 90 on a first end part E1 side to an inner side of the first green sheet part 931.
This wiring sheet (100) comprises a wiring body (2) provided with electrically conductive linear bodies (21), and a pair of electrodes (4) that are in direct contact with the electrically conductive linear bodies (21), wherein the electrically conductive linear bodies (21) have an infrared reflectance of 0% to 90% inclusive at a wavelength of 1000 nm, and have a rate of change in resistance value of 50% or less after being allowed to stand for 1000 hours in a hot, humid environment at a temperature of 85°C and a relative humidity of 85% RH.
H05B 3/12 - Éléments chauffants caractérisés par la composition ou la nature des matériaux ou par la disposition du conducteur caractérisés par la composition ou la nature du matériau conducteur
H05B 3/20 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes
H05B 3/26 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes non flexibles le conducteur chauffant monté sur une base isolante
8.
PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND DEVICE
[Problem] To provide a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive having excellent resistance to bleaching by humidity. [Solution] This pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive for bonding a first member to a second member, wherein the pressure-sensitive adhesive is a polyester-based pressure-sensitive adhesive containing a surfactant. The pressure-sensitive adhesive has a gel content of preferably 60% or less. The polyester-based pressure-sensitive adhesive preferably has a crosslinking structure including at least a polyester-based polymer and a crosslinking agent.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 167/00 - Adhésifs à base de polyesters obtenus par des réactions créant une liaison ester carboxylique dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
9.
WINDOW FILM AND METHOD FOR MANUFACTURING FRONT WINDOW EQUIPPED WITH WINDOW FILM
Provided is a window film having a high heat-insulating performance that is capable of suppressing the occurrence of wrinkles in a resin film when forming a hard coat layer and of following the shape of an adherend at the time of sticking. A window film (1) has a resin film (10) and a hard coat layer (11) disposed on one main surface of the resin film (10). Assuming that the shrinkage rate in an MD direction of the resin film (10) when the resin film (10) is held at 180°C for 5 minutes is A% and that the shrinkage rate in a CD direction is B%, A-B is 0.4% or more. The hard coat layer (11) contains tin-doped indium oxide.
[Problem] To provide a window film that, despite including a transparent resin film, achieves visibility with respect to an outside light source and the property of making it impossible to see an inside part. [Solution] A window film comprising a transparent resin film and a colored adhesive layer which is disposed on one main surface of the resin film, said window film exhibiting total light transmittance of not more than 70% and a haze value of not more than 5%.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
11.
METHOD FOR PRODUCING SILANE COMPOUND POLYMER AND METHOD FOR PRODUCING SEMICONDUCTOR INSULATING FILM FORMING AGENT
Disclosed are: a method for producing a silane compound polymer, the method including a step in which a trifunctional alkoxysilane compound represented by formula (a-1) R133 (wherein R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent, each OR represents an alkoxy group, and OR may be the same as or different from each other) is hydrolyzed and polycondensed in the presence of a solvent that satisfies the requirements 1 and 2 described below; and a method for producing a semiconductor insulating film forming agent. Requirement 1: The solvent is azeotropic with water. Requirement 2: The solvent is a polyether-based solvent.
3/23/2 , and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent]; a semiconductor insulating material comprising the silane compound polymer; and a semiconductor insulating film-forming agent containing the silane compound polymer.
3/23/2 [Me represents a methyl group], and repeating units [repeating units (2)] represented by formula (a-2) (a-2) R13/23/2 [R1 represents an unsubstituted C6-12 aryl group or a C6-12 aryl group having a substituent], wherein the weight average molecular mass (Mw) is 1,500 or more. The present invention further provides a semiconductor insulating material comprising the silane compound polymer, and a semiconductor insulating film-forming agent containing the silane compound polymer.
[Problem] To provide a window film that is suitable for high-mix low-volume production and demonstrates concealing properties as well as visibility of external light sources. [Solution] This window film has a transparent first resin film, a transparent second resin film, and a colored intermediate layer. The intermediate layer is disposed between one main surface of the first resin film and one main surface of the second resin film. The window film has a total light transmittance of 60% or less and a haze value of 8% or less.
This method for using a degradable film comprises: a step for preparing a degradable film containing an aliphatic polycarbonate and an acid/base generator that generates an acid or a base due to energy ray irradiation, the adhesive resin content of said degradable film other than the aliphatic polycarbonate being 10 mass% or less; an exposure step for exposing the entire surface of the degradable film or a portion thereof in plan view with an energy beam; and a decomposition step for heating the degradable film and decomposing the entire surface of the degradable film or the portion thereof in plan view. According to the aforementioned method for using the degradable film, the degradable film can easily be decomposed.
This binder for firing contains an aliphatic polycarbonate that has a carbonate structure in a main chain and has a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3, and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. By using the above binder for firing, solid matter of a carbon compound derived from the binder does not remain in a sintered body, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains a structural unit derived from a hydroxyl-group-containing vinyl ether (a), and a structural unit derived from an ethylenically unsaturated monomer (b) having a sulfonic acid group or a salt thereof. The amount of the structural unit derived from the hydroxyl-group-containing vinyl ether (a) contained in the water-soluble polymer (A) is 5-80 mol% in all structural units of the water-soluble polymer (A), and the amount of the structural unit derived from the ethylenically unsaturated monomer (b) having the sulfonic acid group or a salt thereof in the water-soluble polymer (A) is 5-30 mol% in all structural units of the water-soluble polymer (A).
BINDER FOR LITHIUM-ION BATTERY, AQUEOUS BINDER SOLUTION FOR LITHIUM-ION BATTERY, ELECTRODE SLURRY FOR LITHIUM-ION BATTERY, ELECTRODE FOR LITHIUM-ION BATTERY, AND LITHIUM-ION BATTERY
This binder for a lithium-ion battery contains a water-soluble polymer (A). The water-soluble polymer (A) contains, relative to all structural units in the water-soluble polymer (A), 5-80 mol% of a structural unit derived from a hydroxyl group-containing vinyl ether (a). The viscosity of an aqueous solution containing 13 mass% of the water-soluble polymer (A) as measured by a B-type viscometer at 23°C is 3,000 mPa·s or more. Said binder is used for forming an electrode that includes an active material exhibiting a pH of 10 or more in an active-material aqueous dispersion as measured by a prescribed method.
H01M 4/505 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de manganèse d'oxydes ou d'hydroxydes mixtes contenant du manganèse pour insérer ou intercaler des métaux légers, p. ex. LiMn2O4 ou LiMn2OxFy
H01M 4/525 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de nickel, de cobalt ou de fer d'oxydes ou d'hydroxydes mixtes contenant du fer, du cobalt ou du nickel pour insérer ou intercaler des métaux légers, p. ex. LiNiO2, LiCoO2 ou LiCoOxFy
19.
ADHESIVE SHEET, METHOD FOR PRODUCING SAME, AND OPTICAL LAMINATE
The present invention pertains to an adhesive sheet that is characterized by having a substrate layer and an adhesive agent layer, and that is characterized in that the thickness of the adhesive agent layer is 100 μm or more, and the adhesive agent layer is formed from an adhesive agent that exhibits, when an adhesive agent layer having a thickness of 500 μm is obtained, a chromaticity b*value of -3.0 or more stipulated by the CIE1976L*a*b* color system in a reflection mode of the adhesive agent layer. The present invention also pertains to: a method for producing the adhesive sheet; and an optical laminate provided with the adhesive sheet. The present invention provides: an adhesive sheet that improves, when an adhesive sheet having a thick adhesive agent layer is applied to the outermost surface of an optical laminate, the phenomenon in which the optical laminate appears bluish white; a method for producing the adhesive sheet; and an optical laminate comprising the adhesive sheet.
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
The present invention provides a thermoelectric conversion material layer having improved electrical conductivity and high thermoelectric performance. Provided is a thermoelectric conversion material layer comprising thermoelectric semiconductor particles and monometallic particles, wherein, in a longitudinal cross-section that includes the center part of the thermoelectric conversion material layer, the area ratio of a region occupied by the monometallic particles to a region occupied by the thermoelectric semiconductor particles and the monometallic particles is 1-50%.
Provided are: a curable composition comprising the following component (A) and component (B), wherein the total amount of the component (A) and the component (B) is at least 98 mass% with respect to the total amount of the curable composition; and a semiconductor insulating film-forming agent. The (A) component is a silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) [R1represents a fluoroalkyl group] and a repeating unit [repeating unit (2)] represented by formula (a-2) [R2 represents an unsubstituted hydrocarbon group or a hydrocarbon group (excluding a fluoroalkyl group) having a substituent, wherein the amount of the repeating unit (1) is at least 40 mol% with respect to the total amount of the repeating unit (1) and the repeating unit (2). (B) is a solvent.
C08L 83/08 - Polysiloxanes contenant du silicium lié à des groupes organiques contenant des atomes, autres que le carbone, l'hydrogène et l'oxygène
C08G 77/24 - Polysiloxanes contenant du silicium lié à des groupes organiques contenant des atomes autres que le carbone, l'hydrogène et l'oxygène groupes contenant des halogènes
H01L 21/316 - Couches inorganiques composées d'oxydes, ou d'oxydes vitreux, ou de verres à base d'oxyde
22.
CURABLE COMPOSITION AND SEMICONDUCTOR INSULATING FILM FORMING AGENT
Provided are a curable composition and a semiconductor insulating film forming agent, the curable composition containing component (A) and component (B) and having a viscosity of 1,000 mPa·s or less at 23°C. Component (A): A silane compound polymer having a repeating unit [repeating unit (1)] represented by formula (a-1) (a-1): R13/23/2 [R1 represents a hydrogen atom, an unsubstituted hydrocarbon group, or a hydrocarbon group having a substituent.] Component (B): A solvent satisfying requirements 1 and 2 Requirement 1: A solvent azeotropic with water. Requirement 2: A polyether-based solvent.
This binder for firing contains an aliphatic polycarbonate having a carbonate structure in a main chain and a hydrocarbon group having 2-8 carbon atoms in a side chain. The aliphatic polycarbonate has a weight average molecular weight of 50,000-170,000 inclusive. The aliphatic polycarbonate preferably has a structural unit represented by general formula (1a). In the formula, R1, R2, R3and R4 are each independently a hydrogen atom or a hydrocarbon group, and at least one thereof is a hydrocarbon group having 2-8 carbon atoms. According to the binder for firing, the solid matter of the carbon compound derived from the binder does not remain in a sintered product, carbon dioxide can be used as a production raw material, carbon dioxide is not substantially discharged during firing, and adhesion to metal is high.
Provided is a workpiece processing sheet comprising: a release sheet having a release agent layer on one surface side of glassine paper; and a work attachment layer laminated on a surface of the release agent layer on the opposite side to the glassine paper. The workpiece processing sheet can greatly contribute to reducing carbon dioxide emissions and decreasing the use of plastic materials.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/00 - Adhésifs sous forme de films ou de pellicules
C09J 7/40 - Adhésifs sous forme de films ou de pellicules caractérisés par des couches antiadhésives
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
25.
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING AND STRUCTURE
An adhesive (1A) for high-frequency dielectric heating contains: (A) a thermoplastic resin containing a styrene-based thermoplastic elastomer (a1) and a thermoplastic resin (a2) other than the styrene-based thermoplastic elastomer (a1); and (B) a dielectric filler. The content of the styrene component with respect to the entirety of the thermoplastic resin (A) is 20.0-45.0 mass%, the storage elastic modulus in an environment at 110°C is 300 MPa or more, and the complex viscosity at a shear rate of 600 rad/s in an environment of 220°C is 350Pa·s or less.
B29C 65/48 - Assemblage d'éléments préformésAppareils à cet effet en utilisant des adhésifs
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 123/00 - Adhésifs à base d'homopolymères ou de copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneAdhésifs à base de dérivés de tels polymères
26.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. The adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recessions on the front surface thereof. The adhesive layer has a polymer having an energy ray-curable group.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
27.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention facilitates the pick up of an object held on an adhesive sheet having an adhesive layer comprising protrusions and recesses on the surface thereof. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive sheet can be extended in the surface direction. When the adhesive sheet is attached to an object, the bonding area ratio of the adhesive sheet to the object is 4%-60%.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
28.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention suppresses the deformation of protrusions and recesses on the surface of an adhesive layer when an object is attached to the adhesive layer. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The gel fraction of the adhesive layer is 90%-100%.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
29.
ADHESIVE SHEET AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer has energy ray reactivity, and the value of (loss tangent (tanδ) at 50° C) / (tanδ at 30° C) of the adhesive layer after energy ray irradiation is 1.30 or more.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
30.
ADHESIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET
The present invention makes it possible for an object held on an adhesive sheet provided with protrusions and recesses on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises a base material, and an adhesive layer that has protrusions and recesses on the surface thereof. The adhesive layer contains an acrylic acid ester copolymer, and the copolymerization ratio of an energy ray-curable group-containing monomer in the acrylic acid ester copolymer is 20%-50%.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
31.
METHOD FOR PEELING OBJECT FROM ADHESIVE SHEET AND METHOD FOR MANUFACTURING ARTICLE
The present invention makes it possible for an object that is being held on an adhesive sheet provided with an adhesive layer having protrusions and recessions on the surface thereof to be picked up by means of a milder operation. Provided is a method for peeling an object from an adhesive sheet that comprises a base material and an energy reactive adhesive layer having protrusions and recessions on the surface thereof, the adhesive sheet holding the object on the adhesive layer. Energy is applied to the adhesive sheet. The adhesive sheet is expanded in the plane direction. The object is peeled from the adhesive layer of the adhesive sheet after energy has been applied and the sheet has been expanded in the plane direction.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 133/04 - Homopolymères ou copolymères d'esters
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 201/02 - Adhésifs à base de composés macromoléculaires non spécifiés caractérisés par la présence de groupes déterminés
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
32.
SEMICONDUCTOR DEVICE AND COMPOSITION FOR FORMING BACK SURFACE PROTECTIVE FILM
This semiconductor device comprises a semiconductor substrate, a back surface protective film that protects the back surface of the semiconductor substrate, and a forgery prevention layer that is provided on the back surface protective film and contains a pattern-forming substance that forms an authenticity-determining pattern, wherein the back surface protective film contains an inorganic pigment.
The present invention provides a semiconductor device comprising a semiconductor substrate, a protective layer that protects the semiconductor substrate, and anti-counterfeit layer provided on the protective layer. The anti-counterfeit layer includes a pattern-forming substance that forms a pattern for determining the authenticity of the semiconductor device. The protective layer contains a spherical filler.
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japon)
Inventeur(s)
Takano, Ken
Matsuno, Sayaka
Sugimoto, Hiroshi
Fujii, Minoru
Abrégé
A composition for a forgery prevention layer for forming a forgery prevention layer in a semiconductor device includes pattern formation particles formed by an inorganic material having a refractive index n of 3 or more.
An LED lamp (1) that can be used in a low-temperature environment, comprising: an LED lamp unit (2) that has an LED element; a housing (3) that houses the LED lamp unit (2); and a transparent cover member (4) that transmits light from the LED lamp unit (2). The LED lamp (1) is also provided with an infrared absorption member (infrared absorption layer (6)) that absorbs infrared rays from the LED lamp unit (2) and generates heat, at a position at which heat generated by the infrared absorption member (infrared absorption layer (6)) is conducted to the transparent cover member (4). The LED lamp (1) makes it possible to heat the transparent cover member (4) and solve problems resulting from use in a low-temperature environment.
A LED lamp 1 that may be used in a low-temperature environment comprises: an LED lamp unit 2 having an LED element; a housing 3 that houses the LED lamp unit 2; and a transparent cover member 4 that transmits light from the LED lamp unit 2, an infrared absorbing member (infrared absorbing layer 6) that absorbs infrared rays from the LED lamp unit 2 and generates heat being provided at a position where heat generated by the infrared absorbing member (infrared absorbing layer 6) is conducted to the transparent cover member 4. According to this LED lamp 1, the transparent cover member 4 can be heated, and problems encountered in low-temperature environments can be overcome.
F21S 45/60 - Chauffage des dispositifs d’éclairage, p. ex. pour le désembuage
F21S 41/148 - Diodes électroluminescentes [LED] la direction principale d’émission des LED faisant un angle avec l’axe optique du dispositif d’éclairage la direction principale d’émission des LED étant perpendiculaire à l’axe optique
An LED lamp (1) that can be used in a low-temperature environment comprises: an LED lamp unit (2) having an LED element; a housing (3) that houses the LED lamp unit (2); a transparent cover member (4) that transmits light from the LED lamp unit (2); and a film heater (6). The film heater (6) is provided at a position at which heat generated by the film heater (6) is conducted to the transparent cover member (4). According to the LED lamp (1), ice, snow, and water droplets adhered to the transparent cover member (4) can be removed.
This mid-air image formation device 10a, 10b comprising a display part 1, a light transmission and image formation part 3, a light diffusion control part 2, and an adhesion layer 4, wherein the light transmission and image formation part 3 transmits light originating from the display part 1 and forms an image at a position on the surface side opposite from the display part 1, the light diffusion control part 2 diffuses or transmits light incident on the inside of the light diffusion control part 2 depending on the incident angle thereof, and has a louver-shaped regular internal structure comprising, within a region having a relatively low refractive index, a plurality of plate-shaped regions each having a relatively high refractive index, and the adhesion layer 4 comprises any one of an adhesive, a pressure-sensitive adhesive, and a hardenable pressure-sensitive adhesive, and the number of acidic groups present in the adhesion layer 4 with respect to all components constituting the adhesion layer 4 is 0.050 mmol/g or less. This mid-air image formation device 10a, 10b has excellent durability and makes it possible to satisfactorily view a mid-air image.
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p. ex. des voxels en projetant une image aérienne ou flottante
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
G02B 5/122 - Réflecteurs reflex du type en sommet de cube, en trièdre ou en réflecteur triple
G02B 5/124 - Réflecteurs reflex du type en sommet de cube, en trièdre ou en réflecteur triple plusieurs éléments réfléchissants faisant partie d'une plaque ou d'une feuille formant un tout
The present invention provides an aerial image forming device 10a, 10b, 10c comprising: a display part 1 which has a display surface and emits light from the display surface; a light transmission and image formation part 2 which is arranged on the display surface side of the display part 1, transmits the light, and forms an image at a position on a surface side opposite to the display part 1; and a coat layer 3 which is laminated on the light transmission and image formation part 2, on the surface side opposite to the display part 1, and contains a plasticizer. The aerial image forming device 10a, 10b, 10c has excellent antifouling properties, and the visibility of an aerial image is improved.
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p. ex. des voxels en projetant une image aérienne ou flottante
G02B 5/122 - Réflecteurs reflex du type en sommet de cube, en trièdre ou en réflecteur triple
G02B 5/124 - Réflecteurs reflex du type en sommet de cube, en trièdre ou en réflecteur triple plusieurs éléments réfléchissants faisant partie d'une plaque ou d'une feuille formant un tout
This operation detection device includes an operation detection unit that detects operation information relating to a part of a user in order to convert the operation information into an operation command corresponding to a device by an operation detection member attached to said part, the part being a body port that can be bent/stretched, the device being subject to an operation. Accordingly, operation information relating to a part of a user can be intuitively converted into an operation command corresponding to a device subject to an operation.
The present invention provides an aerial image forming device 10a, 10b comprising: a display unit 1 which has a display surface and which emits light from the display surface; a light-transmissive image forming unit 2 which is disposed on the display-surface side of the display unit 1, transmits the light, and causes an image to be formed at a position on the opposite side of the display unit 1; and an antistatic layer 3 containing an antistatic agent and laminated on the surface of the light-transmissive image forming unit 2 that is on the display unit 1 side or on the surface of the light-transmissive image forming unit 2 that is on the side opposite from the display unit 1. The aerial image forming device 10a, 10b has excellent antistatic properties and excellent visibility.
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p. ex. des voxels en projetant une image aérienne ou flottante
An electromagnetic wave absorption member (1) has a resistance layer (10), a spacer layer (20), and a reflection layer (30). The resistance layer (10), the spacer layer (20), and the reflection layer (30) are laminated in this order. The resistance layer (10) has a conductor pattern (11). The conductor pattern (11) is embedded in the spacer layer (20) in a surface (20a) that is on the reverse side from a surface (20b) facing the reflection layer (30).
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 7/025 - Propriétés électriques ou magnétiques
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
An electromagnetic wave absorption member (1) having a resistive layer (10), a spacer layer (30), and a reflective layer (40), wherein the resistive layer (10), the spacer layer (30), and the reflective layer (40) are laminated in that order, the spacer layer (30) includes a thermoplastic resin, a high-permittivity material, and a conductive material, and the relative permittivity of the spacer layer (30) is 5 or greater.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
Provided is a semiconductor device manufacturing apparatus capable of verifying a semiconductor device by using a new verification technique. The semiconductor device manufacturing apparatus includes: a sticking means 10 that sticks a coating material AS containing a filler FL to a semiconductor body WF to form a semiconductor device SD; and a first image forming means 30 that images the coating material AS of the semiconductor device SD to form a first image PT1. The first image forming means 30 includes: a first image forming device 31 that forms the first image PT1 by capturing a unique feature appearing in the coating material AS due to the filler FL contained in the coating material AS; and an image output device 32 that outputs the first image PT1 to a verification device 50 that verifies the semiconductor device SD. Drawing_references_to_be_translated:
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
45.
ADHESIVE SHEET FOR WORKPIECE PROCESSING AND METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Provided are: an adhesive sheet for workpiece processing, the adhesive sheet having a buffer layer, a substrate, and an adhesive layer, wherein the buffer layer contains a cured product of a thermosetting resin composition; and a method for manufacturing an electronic device using said adhesive sheet for workpiece processing.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
C09J 7/25 - Matières plastiquesMatières plastiques métallisées à base de composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
An electromagnetic wave absorbing member (1) has a resistance layer (10), a spacer layer (30), and a reflection layer (40). The resistance layer (10), the spacer layer (30), and the reflection layer (40) are stacked in this order. The resistance layer (10) has three or more conductor patterns (12) having differing sizes in plan view. When the difference between the maximum length L1 of the largest pattern in the conductor patterns (12) and the maximum length L3 of the smallest pattern therein is defined as ΔL, there stands ΔL/L1 > 0.34; the thickness of the spacer layer (30) is 400 μm or less; and the dielectric constant of the spacer layer (30) is 5 or more.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
This release sheet comprises a base material and a release agent layer provided on at least one side of the base material, wherein: the release agent layer is formed from a release agent composition containing (A) an alicyclic epoxy group-containing cyclic siloxane compound, (B) a carbinol-modified polyorganosiloxane, and (C) an acid catalyst; and the blending amount of the carbinol-modified polyorganosiloxane (B) with respect to 100 parts by mass of the alicyclic epoxy group-containing cyclic siloxane compound (A) is 3-15 parts by mass. According to said release sheet, a silicone component hardly migrates from the release agent layer, and the release force can be set low.
This method comprises: a step for preparing a first board having a first main surface and a second main surface, with a thermoelectric element bonded to the first main surface; a step for applying a bonding material to a prescribed position on a third main surface of a second board having the third main surface and a fourth main surface; a step for aligning the thermoelectric element and the bonding material by disposing the first board on top of the second board, which has been placed so that the fourth main surface is in contact with a bearing surface of a jig, so that the first main surface faces the second board; and a step for bringing the thermoelectric element and the bonding material into contact with each other to bond the first board and the second board to each other via the thermoelectric element and the bonding material.
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/58 - Montage des dispositifs à semi-conducteurs sur des supports
H01L 21/98 - Assemblage de dispositifs consistant en composants à l'état solide formés dans ou sur un substrat communAssemblage de dispositifs à circuit intégré
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
49.
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE
Provided is a semiconductor device production method that makes it possible to produce a compact semiconductor device, wherein performed are: a coating material preparation step 10 for preparing a coating material AS which is for coating a semiconductor body WF; an identification member preparation step 20 for preparing an identification member WK in which an identifier ID is formed; and a layering step 50 for layering the identification member WK on the semiconductor body WF with the coating material AS therebetween, to form a semiconductor device SD. In the coating material preparation step 10, prepared as the coating material AS is a material that is capable of bonding to both the semiconductor body WF and the identification member WK. In the layering step 50, the identification member WK is layered on the semiconductor body WF in a state in which the identification member WK is in direct contact with the coating material AS.
An adhesive according to the present invention contains an oxygen absorbent and is to be used for optical purposes. The adhesive is such that, when a laminate obtained by bonding two 7.0 cm squared soda-lime glass panels having a thickness of 1.1 mm by using a 250 μm-thick adhesive layer formed from the adhesive is placed in a 140°C atmosphere under persistent conditions for 100 hours of insertion, the absolute value of the ratio of b*2 to b*1 is 4.5 or less when b*1 is the chromaticity b*, as defined by the CIE 1976 L*a*b* color space, of the adhesive layer before the persistent conditions, and b*2 is the chromaticity b*, as defined by the CIE 1976 L*a*b* color space, of the adhesive layer at an end of the laminate after the persistent conditions. The adhesive enables suppression of yellowing at the ends of an optical member.
[Problem] To provide a microneedle structure capable of analyzing body fluids by using a means other than a functional member. [Solution] A microneedle structure 10 comprises: a liquid storage layer 20 for absorbing and storing a liquid derived from a living body; and a needle-shaped portion 11 in which a flow path 13 is formed, wherein the flow path 13 in the needle-shaped portion 11 is in contact with the liquid storage layer 20.
A61M 37/00 - Autres appareils pour introduire des agents dans le corpsPercutanisation, c.-à-d. introduction de médicaments dans le corps par diffusion à travers la peau
A61B 5/15 - Dispositifs de prélèvement d'échantillons de sang
A61B 5/145 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang
52.
MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME
This microneedle structure comprises needle-shaped sections to be inserted into an object. The needle-shaped sections have a porous structure. The porous structure includes openings in the side surfaces of the needle-shaped sections, and holes through which a liquid to be injected into the object or a liquid received from the object flows. The side-surface opening count, which is the number of openings per 10,000 μm2 in the side surfaces of the needle-shaped sections, is 30 or greater.
A61B 5/15 - Dispositifs de prélèvement d'échantillons de sang
A61M 37/00 - Autres appareils pour introduire des agents dans le corpsPercutanisation, c.-à-d. introduction de médicaments dans le corps par diffusion à travers la peau
B29C 67/20 - Techniques de façonnage non couvertes par les groupes , ou pour la fabrication d'objets poreux ou cellulaires, p. ex. des mousses plastiques, des mousses alvéolaires
C08J 9/26 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement par élimination d'une phase solide d'un objet ou d'une composition macromoléculaire, p. ex. par lessivage
A microneedle patch 1 comprises: a liquid absorbent layer 20 that absorbs liquid; needle-shaped parts 11 each including a flow path 13 formed therein, the flow path 13 in each needle-shaped part 11 being connected to one surface side of the liquid absorbent layer 20; and a cover layer disposed detachably on the other surface side of the liquid absorbent layer 20 and covering the liquid absorbent layer 20. Such a microneedle patch has adequate strength and enables a sufficient amount of body fluid to be drawn from a subject and analyzed. The present invention also provides an analysis method using the microneedle patch, with which a sufficient amount of body fluid can be drawn from a subject and analyzed.
The present invention provides a marking device (AE) which makes it possible to reduce the motivation for a third party to reproduce a semiconductor wafer or a semiconductor chip and which imparts a prescribed mark MK on, for example, a semiconductor wafer WF or a semiconductor chip CP. The marking device comprises: a first marking means (10) for imparting, in first impartation form (12), a first mark (MK1) on a semiconductor wafer (WF) or a semiconductor chip (CP); and a second marking means (29) for imparting, in second impartation form (22), a second mark (MK2) on the semiconductor wafer (WF) or the semiconductor chip (CP) on which the first marking means (10) has imparted the first mark (MK1).
In order to prevent a predetermined mark applied to a semiconductor wafer or a semiconductor chip from becoming unreadable later, a marking device (EA) for applying a predetermined mark (MK) to a semiconductor wafer (WF) or a semiconductor chip (CP) is provided with a marking means (10) for applying the predetermined mark (MK) to the semiconductor wafer (WF) or the semiconductor chip (CP), and a covering means (20) for providing a covering material (AS) so as to cover the predetermined mark (MK) applied to the semiconductor wafer (WF) or the semiconductor chip (CP). (FIG. 1)
This semiconductor device manufacturing system comprises: a curing device for irradiating a semiconductor device including a base layer formed of an energy ray-curable resin composition with an energy ray to cure the base layer; and an ink marking device that applies an ink on the base layer to make an identity determination mark for determining the identity of the semiconductor. The curing device and the ink marking device are in-line.
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
57.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR DETERMINING IDENTITY OF SEMICONDUCTOR DEVICE, AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
Disclosed is a method for manufacturing a semiconductor device, the method including: a base layer formation step for forming a base layer, which is formed of a curable resin composition, on a semiconductor base material; an ink marking step for applying an identity determination mark onto the base layer with an ink, the identity determination mark being used for determination of the identity of a semiconductor device; and a curing step for curing the base layer after the ink marking step.
An adhesive (1A) for high-frequency dielectric heating contains a thermoplastic resin (A) and a dielectric filler (B). When a cut surface obtained by cutting, along the thickness direction, the adhesive (1A) for high-frequency dielectric heating is observed by a scanning electron microscope, the relationship of the distance Dg between nearest centroids of the dielectric filler (B) to the particle diameter Dn of the dielectric filler (B) satisfies formula (F1). (F1): 1.55 ≤ Dg/Dn ≤ 1.85
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 123/00 - Adhésifs à base d'homopolymères ou de copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneAdhésifs à base de dérivés de tels polymères
A writing-feel-improving sheet 1 with a surface to be touched by a touch pen has an average vibration intensity of 1.2mm/s2 or more in a frequency range of 50-100Hz, the average vibration intensity being acquired from a vibration intensity-period chart obtained by: bringing the pen tip of a specific touch pen into contact with the surface to be touched by a touch pen; then applying a load of 200g to the touch pen and maintaining an angle formed by the touch pen and the surface at 45°; detecting, by an accelerometer, a change in power due to acceleration of vibrations in the same direction as the sliding direction of the touch pen while linearly sliding the touch pen at a speed of 16.6mm/s; and subjecting a power value-time chart, which is obtained between the start of sliding and a sliding distance of 100mm, to fast Fourier transform. The writing-feel-improving sheet 1 offers excellent writing feel with a touch pen.
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
A writing feel improving sheet 1 having a surface with which a touch pen contacts. After a predetermined pen tip of the touch pen is brought into contact with the surface with which the touch pen is in contact, a load of 200 g is applied to the touch pen, an angle formed by the touch pen and the surface is maintained at 45°, and a change of electric power generated by acceleration of vibration in the same direction as a sliding direction of the touch pen is detected by an accelerometer while linearly sliding the touch pen at a speed of 16.6 mm/s, with the electric power value-time chart obtained in an interval from the start of sliding to a sliding distance of 100 mm being fast Fourier transformed. The average value of the vibration intensities in the range of frequencies 50-100 Hz acquired from the obtained vibration intensity-period is 1.5 mm/s 2 or less, and the arithmetic average roughness Ra of the surface with which the touch pen contacts is 0.1 μm or less, or the ten-point average roughness Rzjis is 1 μm or less. According to the writing feel improving sheet 1, the writing feel of the touch pen is excellent, and excellent transparency can be exhibited.
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
A writing-feel improving sheet 1 having a surface on which a touch pen is brought into contact, wherein the distance between the center of gravity point of the writing-feel improving sheet 1 and the reference center of gravity point is 4.8 or lower, said reference center of gravity point being obtained by performing principal component analysis using, as data: an arithmetic average roughness Ra (μm), a ten-point average roughness Rzjis (μm), and a rolling circle maximum height waviness (μm) of a writing surface of a writing object serving as a reference and the surface of the writing-feel improving sheet on which the touch pen is brought into contact; a coefficient of static friction and a coefficient of dynamic friction measured by bringing a writing tool serving as a reference into contact with the writing surface of the writing object serving as a reference, then applying a load of 200 g on the writing tool, and linearly sliding the writing tool at 16.6 m/second while maintaining the angle between the writing tool and the writing surface at 45; and a coefficient of static friction and a coefficient of dynamic friction measured by the same method as above for the writing-feel improving sheet. This writing-feel improving sheet 1 makes it possible to obtain a desired writing feel.
This electromagnetic wave absorbing member has a resistance layer that has conductor patterns. The resistance layer has first and second regions that have different electromagnetic wave transmission characteristics from each other. The first region has a conductor pattern having a plurality of first arrays in which a plurality of first units are arranged, and having a plurality of second arrays in which a plurality of second units that are different from the first units are arranged. The second region has a conductor pattern having a plurality of the first arrays and having a plurality of the second arrays. In the first region, a plurality of the first units and the second units are arranged in a first direction. In the second region, a plurality of the first units and the second units are arranged in a second direction that is different from the first direction. In the first region and the second region, the first arrays and the second arrays are arranged neighboring each other.
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
A wiring board (100) comprises: a substrate (1) having a transmittance of 70% or more of near-infrared light having a wavelength of 1000 nm; and an electrode (21) provided on the substrate (1) and comprising a conductive paste. The surface of the electrode (21) has a first electroless plating layer (22) formed by electroless plating and containing nickel and boron. The surface of the first electroless plating layer (22) has a second electroless plating layer (23) formed by electroless plating and comprising a metal.
H05B 3/84 - Dispositions pour le chauffage spécialement adaptées à des surfaces transparentes ou réfléchissantes, p. ex. pour désembuer ou dégivrer des fenêtres, des miroirs ou des pare-brise de véhicules
H05B 3/20 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
Provided is an adhesive sheet 1 having an adhesive layer 11, wherein, taking the haze value (%) of the adhesive layer 11 by 450 nm light as H(450) and the haze value by 650 nm light as H(650), the absolute value of slope S1 represented by formula (1) is more than 0.026, the haze value of the adhesive layer 11 is 10-100%, and the adhesive force of the adhesive sheet 1 to soda lime glass is 1 N/25 mm or more. S1 = (H(650) - H(450))/200 … (1) According to the adhesive sheet 1, the lighting color can be adjusted to a color other than white while manifesting a concealing property.
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 7/10 - Adhésifs sous forme de films ou de pellicules sans support
C09J 133/04 - Homopolymères ou copolymères d'esters
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
Provided is a display body 1 comprising a light scattering layer 11, at least one light diffusion control layer 12 that is laminated on one surface side of the light scattering layer 11 and has a regular internal structure provided with a plurality of regions having a relatively high refractive index within a region having a relatively low refractive index, and a display device 13 laminated on a surface side of the light diffusion control layer 12 opposite the light scattering layer 11. At a position 0.3 cm from a display surface, the ratio (maximum inclination/0° luminance) of the maximum value of inclination (maximum inclination) of luminance to angles in a luminance distribution measured in a range of −70° to 70°, where 0° indicates a direction perpendicular to the display surface, to the luminance of light emitted in the direction perpendicular to the display surface (front direction) is 0.030 or lower. In the display body 1, the change in luminance resulting from the difference of the recognized angle is excellently uniformized.
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
G02B 5/00 - Éléments optiques autres que les lentilles
An adhesive sheet 1 has an adhesive layer 11, wherein: an absolute value of an inclination S1 represented by formula (1) is 0.026 or less, where H(450) is a haze value (%) of the adhesive layer 11 under a light beam having a wavelength of 450 nm, and H(650) is a haze value (%) of the adhesive layer 11 under a light beam having a wavelength of 650 nm; the haze value of the adhesive layer 11 is 10%-100%; and the adhesive force of the adhesive sheet 1 to soda lime glass is 1 N or more per 25 mm. (1): S1 = (H(650) - H(450))/200 According to the adhesive sheet 1, the luminescent color can be adjusted to white while exhibiting concealability.
C09J 7/10 - Adhésifs sous forme de films ou de pellicules sans support
C09J 133/04 - Homopolymères ou copolymères d'esters
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
Provided is a method for removing a coating layer, the method comprising: a step in which a stack (501) obtained by superposing layers of one sheet of a release film (50) including, for example, a substrate film and a coating layer is prepared or a stack obtained by superposing layers of a plurality of sheets of the release film (50) is prepared; a step in which the stack (501) is immersed in treatment water (W1); a step in which after the immersion in the treatment water (W1), the release film (50) is released from the stack (501); and a step in which the coating layer is removed from the released release film (50). The coating layer includes an interlayer and a releasant layer, the interlayer being interposed between the substrate film and the releasant layer.
A method for removing a coating layer is provided, the method comprising: a step for preparing a release film (50) comprising, for example, a substrate film and a coating layer; a step for introducing the release film (50) into a pressure vessel (400) (one example of a treatment vessel); a step for exposing the release film (50) to water vapor (V2, V3) inside the pressure vessel (400); and a step for removing the coating layer from the release film (50). The coating layer includes an interlayer and a releasant layer, the interlayer being interposed between the substate film and the releasant layer.
Provided is a sheet for inkjet printing, wherein an ink-receiving layer is in direct contact with one surface of a substrate layer or with an easy-adhesion layer formed on one surface of the substrate layer, the other surface of the substrate layer has, in this order, an adhesive layer and a release liner in a laminated structure. The release liner has a silicone-based release agent layer on the contact surface contacting the adhesive layer. The ink-receiving layer is a cured layer of a composition for forming the ink-receiving layer, contains an energy ray-curable compound (A), a silicone-based leveling agent (B), and a filler (C). The energy ray-curable compound (A) is an ester of a polyol compound and (meth)acrylic acid. The water contact angle of the ink-receiving layer is 80° or less, and the difference in refractive index [(X)-(Y)] between the refractive index (X) of the ink-receiving layer and the refractive index (Y) of the layer directly in contact with the ink-receiving layer is greater than -0.03.
B41M 5/50 - Feuilles d'enregistrement caractérisées par les revêtements utilisés pour améliorer la réceptivité aux encres, aux colorants ou aux pigments, p. ex. pour jet d'encre ou pour l'enregistrement par transfert thermique de colorants
70.
PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD OF HANDLING OBJECT
The present invention makes it possible to pick up, by a milder operation, an object held by a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer with an uneven surface. This pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer with an uneven surface. The pressure-sensitive adhesive layer has an adhesive force in application to a silicon mirror surface, as determined at a peel angle of 180° and a peel rate of 300 mm/min, of 35 mN/50 mm or less.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/40 - Adhésifs sous forme de films ou de pellicules caractérisés par des couches antiadhésives
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having a relief pattern on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises an adhesive layer having a relief pattern on the surface thereof. After the mirror surface of a silicon chip having a size of 5.0 mm × 5.0 mm is pressed against the adhesive layer of the adhesive sheet at a contact pressure of 0.3 MPa, the workload when peeling the silicon chip from the adhesive layer is 25 μJ or less.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/40 - Adhésifs sous forme de films ou de pellicules caractérisés par des couches antiadhésives
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
The present invention makes it possible for an object held on an adhesive sheet provided with an adhesive layer having a relief pattern on the surface thereof to be picked up by means of a milder operation. This adhesive sheet comprises an adhesive layer having a relief pattern on the surface thereof. The tensile breaking stress of the adhesive layer at 23°C is 20 MPa or higher.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
[Problem] To provide an adhesive sheet which is capable of securing flexibility of an adhesive layer at low temperatures and is capable of suppressing variation in the degree of deformation even in cases where the adhesive layer is deformed in a specific temperature range. [Solution] An adhesive sheet which has an adhesive layer for bonding a first member and a second member, wherein the Shore hardness of the adhesive layer at -20°C is 70 HS or less as measured with a type E durometer, and the recovery rate of the adhesive layer at 23°C is 70% or more.
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
Provided is a reflection-type display body 1 that comprises a light diffusion control layer 11 that has a regular internal structure that comprises a plurality of regions that have a relatively high refractive index within a region that has a relatively low refractive index, a display device 12, and a diffuse reflection plate 13 that has a reflection surface that has an uneven structure. The reflection-type display body 1 is configured such that, when a beam of light that has an angle of incidence of 30° is shined from the four directions at azimuths of 0°, 90°, 180°, and 270° at one arbitrary point on the surface on the light diffusion control layer 11 side to generate reflected light that is diffusely reflected from the one point and the standard deviation of the brightness of the reflected light that both advances within a plane that includes the one point and a normal line and is orthogonal to the azimuth from which the light beam was shined and is also at an angle of no more than 30° from the normal line is calculated for each of the four directions, the average of the four standard deviations is less than 0.25 cd/m2. The reflection-type display body 1 makes it possible to achieve excellent visibility regardless of the vertical direction of display content.
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
A contact detecting sensor (100) is provided with a sensor unit (1) that detects contact while alleviating impacts during contact, the sensor unit (1) comprising an expanding/contracting sensor (2).
G01V 3/00 - Prospection ou détection électrique ou magnétiqueMesure des caractéristiques du champ magnétique de la terre, p. ex. de la déclinaison ou de la déviation
B60R 21/0136 - Circuits électriques pour déclencher le fonctionnement des dispositions de sécurité en cas d'accident, ou d'accident imminent, de véhicule comportant des moyens pour détecter les collisions, les collisions imminentes ou un renversement réagissant à un contact effectif avec un obstacle
G01L 1/20 - Mesure des forces ou des contraintes, en général en mesurant les variations de la résistance ohmique des matériaux solides ou des fluides conducteurs de l'électricitéMesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c.-à-d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte
G01N 27/04 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance
Provided is an emulsion containing, as a dispersoid, a (meth)acrylic acid ester polymer comprising, as a monomer unit constituting the polymer, an ethylene carbonate-containing acrylic monomer that has an ethylene carbonate structure represented by formula (1). By using this emulsion, a novel emulsion that uses carbon dioxide as a production starting material, and an article that comprises a resin film formed from an emulsion composition are provided.
C08L 33/14 - Homopolymères ou copolymères des esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C09D 7/63 - Adjuvants non macromoléculaires organiques
C09D 133/06 - Homopolymères ou copolymères d'esters d'esters ne contenant que du carbone, de l'hydrogène et de l'oxygène, l'atome d'oxygène faisant uniquement partie du radical carboxyle
C09D 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
A label (1) for fabric comprises a base material (10) and a thermosetting adhesive layer (20) laminated on one side of the base material (10), wherein the adhesive layer (20) contains an acrylic polymer (a) with an epoxy group, and a thermosetting agent (b). A method of applying the label (1) for fabric includes: a step of bonding the label (1) for fabric to an adherend by means of pressure-sensitive adhesion using the adhesive layer (20); and a step of thermally curing the adhesive layer (20) by heating the label (1) for fabric bonded by pressure-sensitive adhesion.
This adhesive sheet for workpieces comprises: an adhesive layer that is configured so as to be affixed to a workpiece for an electronic device; and a release sheet that is disposed on the adhesive layer and can be removed from the adhesive layer. The release sheet has dust-free paper.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 7/40 - Adhésifs sous forme de films ou de pellicules caractérisés par des couches antiadhésives
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
This microneedle structure is provided with: a needle-like part to be inserted into a subject; and a flow path that opens on the surface of the needle-like part and through which a liquid to be injected into the subject or a liquid received from the subject flows. The needle-like part is formed of a needle-like part composition. The needle-like part composition contains a first resin which is a water-insoluble hydrophilic resin.
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/151 - Dispositifs de prélèvement d'échantillons de sang spécialement adaptés pour le prélèvement d'échantillons de sang capillaire, p. ex. par des lancettes
A61M 37/00 - Autres appareils pour introduire des agents dans le corpsPercutanisation, c.-à-d. introduction de médicaments dans le corps par diffusion à travers la peau
C08L 101/12 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par des propriétés physiques, p. ex. anisotropie, viscosité ou conductivité électrique
The present invention addresses the problem of providing a film for latex inks which includes a latex-ink-receiving layer formed from an actinic-ray-curable compound and having excellent adhesion to the substrate and excellent ink adhesion thereto. The problem is solved with a film having a laminate structure comprising a latex-ink-receiving layer (X) and a substrate (Y) laminated on each other, the latex-ink-receiving layer (X) being formed from a composition (x1) comprising an actinic-ray-curable compound (A) and a specific dispersant (B).
Provided are: an adhesive composition containing an antistatic agent for constituting an adhesive used in contact with a metal member, wherein the antistatic agent is a compound having a hydroxyl group or the antistatic agent is a compound having a chain hydrocarbon and the number of carbons in the chain hydrocarbon is 1-7; an adhesive obtained by crosslinking the adhesive composition; and an adhesive sheet 1 provided with an adhesive layer 11 comprising the adhesive. The adhesive composition, the adhesive, and the adhesive sheet 1 have excellent antistatic properties and metal corrosion resistance.
The purpose of the present invention is to provide an exterior window film which has improved adhesion between a base material and a hard coat layer, prevents the occurrence of cracks in the hard coat layer when wound in a roll shape while ensuring transparency, and has excellent weather resistance. An exterior window film according to the present invention is characterized by comprising: a base material configured from a material containing polyethylene terephthalate; a hard coat layer provided on one surface side of the base material; an anchor coat layer provided between the base material and the hard coat layer; and an adhesive layer disposed on the surface side of the base material opposite to the side on which the hard coat layer is disposed; the hard coat layer is composed of a material containing a (meth)acrylate resin having urethane (meth)acrylate as a constituent component, a hindered amine light stabilizer and a first ultraviolet absorber; and the anchor coat layer is composed of a material containing a thermosetting acrylic resin.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
B32B 27/30 - Produits stratifiés composés essentiellement de résine synthétique comprenant une résine vinyliqueProduits stratifiés composés essentiellement de résine synthétique comprenant une résine acrylique
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C09D 7/48 - Stabilisants contre la dégradation par l’oxygène, la chaleur ou la lumière
C09D 133/00 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesCompositions de revêtement à base de dérivés de tels polymères
C09D 175/14 - Polyuréthanes comportant des liaisons non saturées carbone-carbone
Provided is an aerial image forming device 10 comprising: a display part 1 that has a display surface and emits light from the display surface; a light transmission and image formation part 2 that is disposed on the display surface side of the display part 1, transmits light, and forms an image at a position on the surface side opposite from the display part 1; and a light diffusion control part 3 that is laminated on the surface side opposite from the display part 1 of the light transmission and image formation part 2, wherein the light diffusion control part 3 diffuses or transmits light incident on the inside of the light diffusion control part 3 depending on the incident angle thereof, and the light diffusion control part 3 has a louver-shaped regular internal structure provided with a plurality of plate-shaped regions having a relatively high refractive index within a region having a relatively low refractive index. This aerial image forming device 10 makes it possible to suppress the influence of disturbance light and satisfactorily visually recognize an aerial image.
G02B 30/56 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p. ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p. ex. des voxels en projetant une image aérienne ou flottante
An electromagnetic wave absorbing member (10) comprises a resistive layer (20), a spacer layer (30), and a reflective layer (40). The resistive layer (20), the spacer layer (30), and the reflective layer (40) are laminated in this order. The resistive layer (20) has a plurality of regions which are equal in area in plan view to the electromagnetic wave absorption member (10) and which are different from one another in electromagnetic wave absorption characteristics. Each region includes two or more types of conductor pattern (22) formed in parallel to one another on the spacer layer (30). Each of the two or more types of conductor pattern (22) is formed of a plurality of units arranged in one direction with a certain interval therebetween. The region is different in at least one of the shape of the unit forming the conductor pattern (22), the size of the unit, and the arrangement interval of the unit from another adjacent region.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 7/025 - Propriétés électriques ou magnétiques
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
A writing-feel-improving sheet 1 provided with a base material 11 and a writing-feel-improving layer 12 with which a touch pen comes into contact, wherein the writing-feel-improving layer 12 contains at least one of a plasticizer and a porous fine particle, and a dynamic friction coefficient measured by linearly sliding the touch pen at a speed of 1.6 mm/sec after bringing a pen tip, of 0.5 mm in diameter, of the touch pen into contact with the surface of the writing-feel-improving layer 12 with which the touch pen comes into contact and then applying a load of 200 g to the touch pen while maintaining the angle formed by the touch pen and the surface of the writing-feel-improving layer 12 at 45°, is 0.12 or greater. According to the writing-feel-improving sheet 1, the writing feel of the touch pen is satisfactory, and even when fingerprint traces due to sebum adhere to the touch pen, the fingerprint traces do not need to be wiped off and the writing-feel performance hardly deteriorate.
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
B32B 33/00 - Produits stratifiés caractérisés par des propriétés particulières ou des caractéristiques de surface particulières, p. ex. par des revêtements de surface particuliersProduits stratifiés conçus pour des buts particuliers non couverts par une seule autre classe
G02B 1/14 - Revêtements protecteurs, p. ex. revêtements durs
A recyclable sheet 1 comprises: a base material 11; an undercoat layer 12 provided on at least one surface side of the base material 11; and a functional layer 13 provided on the undercoat layer 12 on the opposite side from the base material 11. The undercoat layer 12 contains a cyclodextrin compound. The gel fraction of the materials constituting the undercoat layer 12 is preferably at most 20%. The undercoat layer 12 preferably contains the cyclodextrin compound as a monomer, and preferably further contains an acrylic monomer. By using the recyclable sheet 1, it is possible to recycle the base material.
A pressure-sensitive adhesive sheet 1 has a pressure-sensitive adhesive agent layer 11 for pasting together two display body constituting members. When G1 represents the gel fraction of a pressure-sensitive adhesive agent constituting the pressure-sensitive adhesive agent layer 11 after being pasted and G2 represents the gel fraction of the pressure-sensitive adhesive agent constituting the pressure-sensitive adhesive agent layer 11 after ultraviolet rays having an illumination intensity of 100 mW/cm2 are applied for 120 hours on the pressure-sensitive adhesive agent layer 11 after being pasted, G1 equals 30-95%, and the gel fraction change ratio which is the ratio of G2 with respect to G1 is 117% or less. The pressure-sensitive adhesive sheet 1 can suppress occurrence of needle-like cracks and has excellent weather resistance.
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
A pressure-sensitive adhesive sheet 1 having a pressure-sensitive adhesive layer 11 for bonding two display-body-constituting members to each other, wherein the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 11 is an active energy ray-curable pressure-sensitive adhesive, and, when the peak temperature of the loss tangent tan δ of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 11' after active energy ray curing is taken as Tb (°C) and the peak temperature of the loss tangent tan δ of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 11' after applying 100 mW/cm2 UV rays for 120 hours to the pressure-sensitive adhesive layer 11' after active energy ray curing is taken as Ta (°C), the value obtained by subtracting Tb from Ta exceeds 3. The pressure-sensitive sheet 1 can suppress the occurrence of needle-like cracks and has excellent weather resistance.
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
89.
RESIN COMPOSITION, BINDER RESIN, POLYMER THIN FILM AND BATTERY
Disclosed is a resin composition which contains a copolymer that comprises a constituent unit represented by general formula (1) and 0.3 to 20.0% by mole (inclusive) of a constituent unit represented by general formula (2). (In general formula (1) and general formula (2), R1represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; L1and L2each independently represent a single bond or an alkylene group having 1 to 3 carbon atoms; and X1 represents a reactive group selected from among groups represented by structural formula (2-1) and structural formula (2-2).)
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
H01M 4/13 - Électrodes pour accumulateurs à électrolyte non aqueux, p. ex. pour accumulateurs au lithiumLeurs procédés de fabrication
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
H01M 50/414 - Résines synthétiques, p. ex. thermoplastiques ou thermodurcissables
Provided is a window film having high visible ray transmittance and heat ray shielding rate, and further having improved workability. This window film comprises a low refractive index layer, a hard coat layer, a base material, a heat ray shielding layer, and an adhesive layer, which are laminated in the stated order. The low refractive index layer is formed from a low refractive index layer forming composition that contains hollow silica particles and an active energy ray curable component. The heat ray shielding layer is formed from a heat ray shielding layer forming composition that contains an infrared shielding metal oxide and an active energy ray curing component.
[Problem] To provide an adhesive sheet in which lifting and separation of an adhesive layer in a bent part are suppressed and color unevenness in the bent part is suppressed without impairing the designability of a flexible display in cases where the adhesive sheet is used for bonding of a flexible member, or the like. [Solution] An adhesive sheet for flexible devices, the adhesive sheet having an adhesive layer for bonding a first flexible member and a second flexible member to each other, wherein: the adhesive layer has a storage elastic modulus of 0.12 MPa or less at 23°C; the lightness L*of the adhesive layer as defined by the CIE 1976 L*a*b* color system is 95 or less; the restoration rate of the adhesive layer is 80% or more; and the adhesive force of the adhesive layer is 4 N/25 mm or more, or the gel fraction of the adhesive layer is 84% or less.
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
Provided is a molding device capable of easily cutting off an excess sheet protruding outside a textured molded article. A molding device (100) is provided with: a lower die (101) on which a sheet (1) is placed; an upper die (102) provided above the lower die (101) and disposed to be movable toward and away from the lower die (101); a table (103) provided inside the lower die (101) and on which a textured molded article (50) is placed; a heating means (104) that heats the sheet (1); a pressure adjusting means (105, 106) that makes the pressure inside the upper die (102) greater than the pressure inside the lower die (101) to affix the sheet (1) onto the textured molded article (50); and a cutting means (103c) that cuts the sheet (1) when the sheet is affixed onto the textured molded article (50) by the pressure adjusting means (105, 106).
B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
Provided is a molding device from which an adhesive sheet can be easily peeled. The molding device (100) is provided with: a lower mold (101) on which an adhesive sheet (1) is placed; an upper mold (102) that is provided above the lower mold (101) and can move toward and away from the lower mold (101); a table (103) that is provided inside the lower mold (101) and on which an uneven molded article (50) is placed; a heating means (104) for heating the adhesive sheet (1); and pressure adjusting means (105, 106) for sticking the adhesive sheet (1) to the uneven molded article (50) by making the pressure inside the upper mold (102) greater than the pressure inside the lower mold (101). At least one of the lower mold (101) or the table (103) has release material layers (101a, 103a), capable of releasing the adhesive sheet (1), formed at places with which the adhesive sheet (1) comes into contact when attached to the uneven molded article (50).
B29C 51/10 - Formage par une différence de pression, p. ex. sous vide
B29C 51/12 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet d'objets comportant des inserts ou des renforcements
The present invention is: a coating film having a base material layer and a coating layer, wherein the coating film is characterized in that the transmissive sharpness is 50 or more, the coating layer is formed from a composition for coating layer formation that contains component (A), which is a urethane acrylate material, and component (B), which is a surface conditioner, and the amount of residual organic solvent in the coating layer is 50 ppm or less; and an article provided with the coating film. The present invention provides: a coating film that is environmentally friendly, has excellent coatability, and has excellent optical characteristics and mechanical characteristics; and an article provided with the coating film.
Provided is a pellicle membrane (10) having a porous structure. The pellicle membrane (10) contains carbon nanotubes. The average pore size of pores measured on the surface of the porous structure is 60 nm or less. The average distance between nearest neighbor centroids in the pores is 70 nm or less.
A pellicle film (10) having a porous structure, wherein the pellicle film (10) contains carbon nanotubes, the aperture ratio of voids measured on the surface of the porous structure is 30% or less, and the light transmittance at a wavelength of 550 nm is 50% or more.
FB1 FB2 FB2 of the second fibrous material (2) is at least 100 μm and less than 250 μm. A pellicle (200) is provided with: a support body (30) which has a frame part (31) and an opening (32) surrounded by the frame part (31), and which supports the pellicle film (100); and the pellicle film (100).
Provided are a thermoelectric wafer having exceptional mechanical strength, and a method for manufacturing the same. A thermoelectric wafer comprising a thermoelectric element layer that contains a thermoelectric semiconductor material, the thermoelectric wafer being provided with an edge region and a recess region surrounded by the edge region, and the thickness of the edge region being greater than the thickness of the recess region.
A layered body (100) comprising a first substrate (1), a second substrate (2) that has a higher coefficient of linear expansion than the first substrate (1), and a wiring sheet (10) that is sandwiched between the first substrate (1) and the second substrate (2), wherein the wiring sheet (10) comprises a wiring body (3) in which a plurality of conductive linear bodies (31) are arranged at intervals, a first resin layer (4) that directly or indirectly supports the wiring body (3), and a pair of electrodes (5) that are in direct contact with the conductive linear bodies (31), and the first substrate (1) or second substrate (2) and the wiring sheet (10) are layered with a second resin layer (6) that has a lower storage modulus than the first resin layer (4) interposed therebetween.
An adhesive according to the present invention is for optical applications and contains an oxygen absorber. The adhesive has excellent weather resistance and can suppress the occurrence of needle-like cracks. The oxygen absorber is preferably a compound represented by general formula (II). (In general formula (II), R9represents a hydrogen atom or a methyl group, and R10represents a hydroxyl group, a (meth)acryloyloxy group, a styryloxy group, or a C2–5 alkenyloxy group. R11, R12, R13, and R14 each independently represent a C1–6 alkyl group, a C2–6 alkenyl group, an aryl group, or an aralkyl group.)
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