A film including: particles of a two-dimensional material containing one or plural layers, wherein the one or plural layers comprise a layer body represented by: MmXn, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon or nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n but not more than 5, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom; and a polymer having an anionic functional group and a cationic functional group, wherein a ratio of the polymer to a sum of the particles of the two-dimensional material and the polymer in the film is 5 vol % to 70 vol %.
C08K 9/02 - Ingrédients traités par des substances inorganiques
A61B 5/268 - Électrodes bioélectriques à cet effet caractérisées par les matériaux des électrodes contenant des polymères conducteurs, p. ex. des polymères PEDOT:PSS
A three-dimensional (3D) package includes one or more frames, circuit assemblies, and an encapsulating material to encapsulate at least a part of the one or more frames and the circuit assemblies. The one or more frames each include one or more supporting portions and conductive connecting portions extending from the one or more supporting portions and defining assembly mounting spaces therebetween. Circuit assemblies are each mounted in one assembly mounting space and electrically attached to corresponding one or more of the first and second conductive connecting portions.
H01L 23/04 - ConteneursScellements caractérisés par la forme
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
A power converter includes a first bridge arm and a second bridge arm connected in parallel between a voltage input terminal and a voltage output terminal, a first winding and an inductor connected in series between first and second nodes, a second winding and a third winding connected in series, a third switch connected between the second winding and a ground, and a fourth switch connected between the third winding and the ground. The first bridge arm includes first and second switches connected in series. The second bridge arm includes first and second capacitors connected in series. The first node is on a path connecting the first switch and the second switch, and the second node is on a path connecting the first capacitor and the second capacitor. The first to third windings define a transformer.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
4.
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS WITH ELECTRODES HAVING A SECOND LAYER OF VARIABLE WIDTH
An acoustic resonator device is provided that includes a piezoelectric layer; and an interdigital transducer (IDT) at a surface of the piezoelectric layer, the IDT comprising interleaved fingers. At least one interleaved finger of the interleaved fingers comprises a first layer and a second layer over the first layer, wherein the first layer is between the piezoelectric layer and the second layer. Moreover, a shape of the second layer varies with respect to at least one other interleaved finger of the interleaved fingers. A thickness of the first layer is less than a thickness of the second layer.
A capacitor element that includes: a capacitor portion including an anode plate including a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a sealing layer covering the capacitor portion; conductive interconnect layers on the sealing layer; and an outer insulating layer covering the sealing layer and the conductive interconnect layers. In a plan view from a thickness direction of the anode plate, a center-to-center distance between a first anode through conductor and a first cathode through conductor is equivalent to a center-to-center distance between the first anode through conductor and a second cathode through conductor, and a center-to-center distance between a fifth cathode through conductor and the first cathode through conductor is equivalent to a center-to-center distance between the fifth cathode through conductor and the second cathode through conductor.
A phase shifter for altering the phase of a radio frequency signal is disclosed herein. A Lange coupler is used having reflective ports that are coupled to artificial transmission lines. The artificial transmission lines provide a reflection transmission path, the length of which can be determined by digital control lines. Transistors placed along the length of the central trace provide independent paths to ground that serve to shorten the electrical length of the ATL. Accordingly, by selectively turning the transistors on/off, the electrical length of the ATL can be selected and thus the amount of phase delay introduced by the phase shifter.
A secondary battery of the present disclosure includes a stacked electrode assembly in which a plurality of positive electrodes and a plurality of negative electrodes are alternately stacked with a separator interposed therebetween. The positive electrodes include a positive electrode metal current collector, a positive electrode active material layer stacked on the positive electrode metal current collector, and an adhesive layer adhering to the separator. A region of the positive electrode metal current collector where the positive electrode active material layer is not stacked forms a positive electrode metal current collector exposed portion. An edge portion of the positive electrode active material layer includes a first edge portion adjacent to the positive electrode metal current collector exposed portion and a second edge portion disposed on a side opposite to the first edge portion when viewed from a stacking direction in which the positive electrode and the negative electrode are stacked. The adhesive layer includes a first adhesive layer stacked on the positive electrode metal current collector exposed portion and extending along the first edge portion, and a second adhesive layer extending along the second edge portion.
An inductor component including an element body, a coil in the element body, and first and second outer electrodes that are at the element body and are electrically coupled to the coil. The coil includes a winding portion spirally wound along an axis direction. The coil includes the winding portion, and first and second extended wirings that couple one end and the other end of the winding portion to the first and second outer electrodes, respectively, at least one of the first and second outer electrodes includes an embedded portion embedded in the element body, at least one of the first and second extended wirings includes a coupling portion coupled to the winding portion and a curved portion curved from the coupling portion toward the embedded portion. In a view from the axial direction, the curved portion has a recessed shape.
A secondary battery having higher operation reliability is provided. The secondary battery includes an electrode wound body, a first tape, a second tape, and a third tape. The electrode wound body has a first end face and a second end face that are opposed to each other in a first direction, and a side surface coupling the first end face and the second end face to each other. The first tape covers a first side surface part, of the side surface of the electrode wound body, that is positioned on a side of the first end face. The second tape covers a second side surface part, of the side surface of the electrode wound body, that is positioned on a side of the second end face. The third tape covers a third side surface part, of the side surface of the electrode wound body, that is positioned between the first side surface part and the second side surface part. The third tape has an elongation percentage higher than both an elongation percentage of the first tape and an elongation percentage of the second tape.
H01M 50/586 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’intérieur des batteries p. ex. les contacts incorrects des électrodes
A radio frequency circuit includes: a first output terminal; a second output terminal; a first low-noise amplifier; a second low-noise amplifier; a first filter connected between an output end of the first low-noise amplifier and the first output terminal, the first filter having a passband that includes at least a portion of a first band; and a second filter connected between the output end of the first low-noise amplifier and the second output terminal, the second filter having a passband that includes at least a portion of a second band. The second low-noise amplifier is connected between the second filter and the second output terminal, and the first band and the second band are a combination of bands usable in dual connectivity.
H04B 1/10 - Dispositifs associés au récepteur pour limiter ou supprimer le bruit et les interférences
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
A coil component is capable of reducing specific resistance of a coil and reliably mitigating stress. A coil component includes a base body and a coil disposed in the base body. The base body includes a plurality of magnetic layers laminated in a first direction. The coil includes a plurality of coil wires laminated in the first direction. The coil wires extend along a plane orthogonal to the first direction. Each of the coil wires includes a first coil conductor layer and a second coil conductor layer laminated in the first direction. Specific resistance of the first coil conductor layer is smaller than specific resistance of the second coil conductor layer. Also, in a section orthogonal to an extending direction of each of the coil wires, the second coil conductor layer is adjacent to one side of the first coil conductor layer in the first direction, and a cavity portion is disposed in at least a part between the first coil conductor layer and one of the magnetic layers adjacent to another side of the first coil conductor layer in the first direction.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
A switching power supply device includes a passive EMI filter including capacitors coupled to an output terminal of the passive EMI filter and a ground, a first soft switching converter coupled to the passive EMI filter output terminal and the ground, including a primary side switching circuit coupled to the passive EMI filter output terminal, an isolation transformer including a primary winding coupled to the primary side switching circuit and a secondary winding, and a rectification circuit coupled to the secondary winding and an output terminal of the switching power supply device, and including a rectifier, and a first common-mode noise reduction path coupled between a node coupling the capacitor and the passive EMI filter output terminal and a node coupling a homonymous end of the secondary winding and the rectifier. The first common-mode noise reduction path includes an impedance.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
H02M 1/12 - Dispositions de réduction des harmoniques d'une entrée ou d'une sortie en courant alternatif
H02M 1/44 - Circuits ou dispositions pour corriger les interférences électromagnétiques dans les convertisseurs ou les onduleurs
A power converter includes a first bridge arm including a first switch and a second switch connected in series such that the first switch is connected to the second switch to define a first connection point, a second bridge arm including a third switch and a fourth switch connected in series such that the third switch is connected to the fourth switch to define a second connection point, a first LC resonant cavity connected between the first connection point and the second connection point, a first rectifier and a second rectifier including switches, and a coupling inductance connected to the second switch, the third switch, the first rectifier and the second rectifier respectively, such that a center tap of the coupling inductance is connected to a load.
H02M 1/00 - Détails d'appareils pour transformation
H02M 7/219 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs dans une configuration en pont
A stretchable device that includes: a stretchable substrate having a main surface; an electronic component on the main surface of the stretchable substrate; a first stretchable wiring connected to the electronic component; and a second stretchable wiring connected to the first stretchable wiring. A first end portion in an extending direction of the first stretchable wiring is connected to the electronic component, and a second end portion in the extending direction of the first stretchable wiring is connected to a third end portion in the extending direction of the second stretchable wiring.
A distal-end structure of an endoscope includes an image sensor disposed in a distal-end portion of an insertion portion of the endoscope elongated in an axial direction D1. The image sensor is directed in the axial direction D1 toward a distal end of the insertion portion and is configured to capture an image. A light-emitting device is disposed in the distal-end portion and configured to emit light in the axial direction D1 toward the distal end. A connection member is disposed inside the distal-end portion and in which the image sensor and the light-emitting device are mounted. Wires are connected to the connection member. The wires supply electricity for driving the image sensor and the light-emitting device from outside the endoscope, transmit driving signals, and also transmit captured image data to a control unit.
A battery unit is provided and includes a battery and a wiring unit. The battery includes an outer package can that includes a first surface on which a first electrode terminal is exposed, a second surface on which a second electrode terminal is exposed, and a side surface coupling the first surface and the second surface to each other. The second surface is disposed on a side opposite to the first surface. The wiring unit includes a first coupling terminal to be welded to the first electrode terminal, a second coupling terminal to be welded to the second electrode terminal, and a flexible wiring substrate. The flexible wiring substrate includes a first support part, a second support part, a middle part, a first wire, and a second wire. The first support part supports the first coupling terminal. The second support part supports the second coupling terminal. The middle part couples the first support part and the second support part to each other. The first wire extends from the first coupling terminal, through the first support part, to the middle part. The second wire extends from the second coupling terminal, through the second support part, to the middle part.
A first radiation conductor layer is provided in a multilayer body. A second radiation conductor layer is provided in or on the multilayer body, is located above the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in an up-down direction. A first floating conductor has a shape surrounding at least a part of a periphery of the first radiation conductor layer when viewed in the up-down direction, is located on a same layer as or above the first radiation conductor layer and on a same layer as or below the second radiation conductor layer in the up-down direction, and is not electrically connected to any conductor present in or on the multilayer body. A second floating conductor has a shape surrounding at least a part of a periphery of the second radiation conductor layer.
A plating apparatus includes a plating bath in which a plating solution including plating targets is stored and an injector that is in the plating bath and that injects the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. The injector has an inner cylindrical shape including a bottom surface extending in a horizontal direction, an inner wall extending in a height direction from the bottom surface, and an opening defined in an upper end of the inner wall. The opening is a first injection port that injects the plating solution to the plating bath. A mesh portion is provided at the first injection port. A second injection port that injects the plating solution to the injector is provided in the bottom surface.
An RFID module is provided that includes a substrate having a first main surface and a second main surface, an RFIC chip disposed on the first main surface of the substrate, and a coil element having a conductive wire having a plurality of windings. A first end of the RFIC chip is electrically connected to a first end of the coil element. A second end of the RFIC chip is electrically connected to a second end of the coil element. The coil element has at least one sparsely wound portion, and both ends of the coil element are first densely wound portions in which the conductive wire is wound at a narrower pitch than the pitch in the sparsely wound portion.
An electronic component includes a base body and a glass film covering an outer surface of the base body. The glass film has a groove extending on an outer surface of the glass film. The groove is recessed from the outer surface of the glass film toward the outer surface side of the base body in a specific section in a direction orthogonal to the outer surface of the glass film. The bottom portion of the groove is located closer to the outer surface side of the glass film than the outer surface of the base body. In addition, the bottom portion of the groove has an arc shape in the specific section.
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and first and second inner electrode layers. The first inner electrode layers include first counter electrode portions facing the second inner electrode layers and first extended portions extending from the first counter electrode portions to a first end surface. The second inner electrode layers include a second counter electrode portions opposing the first inner electrode layers and second extended portions extending from the second counter electrode portions to a first side surface. The first extended portions include a first connection portion connected to straddle at least two or more of the first extended portions in the lamination direction, between the first extended portions, and the second extended portions include a second connection portion connected to straddle at least two or more of the second extended portions in the lamination direction, between the second extended portions.
An acoustic wave device includes a piezoelectric layer, a first comb-shaped electrode on the piezoelectric layer, including a first busbar and first electrode fingers, and connected to an input potential, a second comb-shaped electrode on the piezoelectric layer, including a second busbar and second electrode fingers interdigitated with the first electrode fingers, and connected to an output potential, and a reference potential electrode connected to a reference potential and including third electrode fingers on the piezoelectric layer aligned with the first and second electrode fingers, and a connection electrode connecting adjacent third electrode fingers. An order in which a first electrode finger, a second electrode finger, and a third electrode finger are arranged is such that, starting from the first electrode finger, the first electrode finger, the third electrode finger, the second electrode finger, and the third electrode finger define one period.
Disclosed embodiments may include systems and methods of a permanent magnet (PM) hybrid core inductor and fabrication methods thereof. The permanent magnet hybrid core may include a first set of members comprising a soft magnetic material, the first set of members forming a first gap between two end faces of the first set of members, and a second set of members comprising a permanent magnetic material and located adjacent to the first set of members, wherein the second set of members provides at least a partially parallel path to the first set of members for flow of magnetic flux lines. Some embodiments may include an inductor comprising the permanent magnet hybrid core, or a power conversion circuit including a switched capacitor circuit and a switching regulator, the switching regulator including an inductance, the inductance comprising an electrical conductor wound around a permanent magnet hybrid core.
An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.
H01C 1/034 - BoîtiersEnveloppesEnrobageRemplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
C03C 1/00 - Ingrédients généralement utilisés pour la fabrication des verres, glaçures ou émaux vitreux
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 17/02 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés à la fabrication de résistances avec enveloppe ou carter
H01C 17/28 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés pour appliquer les bornes
A radio frequency circuit supports a first power class and a second power class whose maximum output power is lower than that of the first power class, and includes: a first power amplifier; and a variable load matching circuit connected to an output end of the first power amplifier. Under a condition that the first power class is applied, a first power supply voltage is supplied to the first power amplifier, and a load impedance viewed from the first power amplifier is adjusted to a first impedance by the variable load matching circuit. Under a condition that the second power class is applied, a second power supply voltage is supplied to the first power amplifier, and the load impedance viewed from the first power amplifier is adjusted to a second impedance by the variable load matching circuit.
A stretchable device that includes: a stretchable substrate that has a first main surface and a second main surface and is stretchable, wherein the first main surface includes a first region and a second region, and the stretchable substrate is in a folded back configuration such that the first main surface is in an inner side of the stretchable device; and an electronic component on the first main surface of the stretchable substrate.
A coil component comprises a first wire including a winding portion wound around a winding core portion of a core, a first end portion electrically connected to a terminal electrode provided in a first flange portion, and a first extended portion connecting the winding portion and the first end portion. In a first direction, the first end portion is positioned on a first side with respect to a central axis of the winding core portion, and a first boundary portion which is a boundary portion between the first extended portion and the winding portion is positioned on a second side with respect to the central axis. A corner of the winding core portion is positioned between the first boundary portion and the first end portion in a circumferential direction. A gap is interposed between the first extended portion and the corner.
The secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode includes a negative electrode active material layer. The negative electrode active material layer includes an alkali metal carbonic acid compound and a magnesium compound. The alkali metal carbonic acid compound has a carbonate bond (—OC(═O)O—), and includes an alkali metal element as a constituent element. The magnesium compound includes magnesium as a constituent element.
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 4/133 - Électrodes à base de matériau carboné, p. ex. composés d'intercalation du graphite ou CFx
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
A plating apparatus includes a plating bath storing a plating solution and plating targets, and an injector in the plating bath. The injector includes a first injection port to inject the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. A mesh portion is provided at the first injection port. The mesh portion is defined by at least two stacked meshes. The mesh portion includes a central portion and a circumferential portion provided outside the central portion when viewed in a planar direction. The circumferential portion is defined by one layer of the mesh or a plurality of layers of the mesh. The central portion is defined by a plurality of layers of the mesh. A number of layers of the mesh in the central portion is greater than that of the circumferential portion.
A plating apparatus includes a plating bath in which a plating solution is stored, a metal pipe having a cylindrical shape and including a hollow portion, the metal pipe defining and functioning as a first electrode, a mesh pipe having a cylindrical shape and including a hollow portion, the mesh pipe being made of an insulating material, and a second electrode. The metal pipe, the mesh pipe, and the second electrode are accommodated in the plating bath, the metal pipe is located inside the hollow portion of the mesh pipe, a plating forming portion is provided between an inside of the mesh pipe and an outside of the metal pipe, the second electrode is located outside the mesh pipe, and an upward flow with which the plating solution is moved upward is generated inside the hollow portion of the metal pipe.
An electronic component is provided that includes a substrate, an insulator layer, an inductor in the insulator layer, planar conductors extending along the substrate, and connecting conductors electrically connected to the planar conductors. The inductor includes surface direction conductors and a plurality of inductor via conductors that connect the surface direction conductors. A direction of a current flowing through an inductor via conductor among the plurality of inductor via conductors configuring a portion of a helical coil having a winding axis along the surface of the substrate, the inductor via conductor being adjacent to the connecting conductors, and a direction of a current flowing through the connecting conductors are opposite to each other.
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
Circuits and methods for achieving good amplifier AM-AM and AM-PM metrics while achieving good power, PAE, linearity, and EVM performance. Embodiments compensate for a non-linear distortion profile (e.g., an AM-PM and/or AM-AM profile) in an amplifier by pre-processing an input signal, such as a radio-frequency signal, to alter the non-linear distortion profile of the input signal so as to compensate for the non-linear distortion profile imposed by a coupled device, such as an amplifier. An inventive aspect includes linearizing an output from an amplifier having a first non-linear distortion profile, including passing an input signal having a second non-linear distortion profile through a reflective hybrid coupler to a non-linear termination circuit, and reflecting a modified input signal from the non-linear termination circuit back through the reflective hybrid coupler as an output signal, the output signal having a third non-linear distortion profile shaped to compensate for the first non-linear distortion profile.
H03F 1/32 - Modifications des amplificateurs pour réduire la distorsion non linéaire
H03F 3/21 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
A multilayer ceramic capacitor includes a multilayer body and external electrodes, which each include a base electrode layer, an electrically conductive resin layer, and a plated layer. The electrically conductive resin layer at a ridge portion of the multilayer body has a film thickness of about 0.8 μm or more and about 8 μm or less. The electrically conductive resin layer includes a peeling region separating from the multilayer body at least one extending portion. The peeling region extends from an end portion of the electrically conductive resin layer adjacent to a middle of the multilayer body in a length direction to before an end of the base electrode layer adjacent to the middle of the multilayer body in the length direction. The peeling region has a dimension of about 5 μm or more in the length direction.
A battery is provided and includes a battery assembly; an exterior body that has an opening at one end and houses the battery assembly; and a safety valve disposed at the opening, in which the safety valve includes an inner terminal positioned relatively inside and an outer terminal positioned relatively outside, the inner terminal includes an annular-in-plan-view thinned part located on an inner peripheral side with respect to an opening end of the opening, and is electrically connected to the battery assembly on an outer peripheral side with respect to the thinned part, and the outer terminal is fixed to the inner terminal in a state of being elastically deformed toward the inside of the exterior body on an inner peripheral side with respect to the thinned part, and is electrically connected to each other.
H01M 50/358 - Passages externes d’évacuation des gaz sur le couvercle ou sur le boîtier de batterie
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
A battery is provided and including a safety valve, in which the safety valve includes a first metal member positioned on an outer side, a second metal member positioned on an inner side, and an insulating member positioned between the first metal member and the second metal member, the first metal member and the second metal member are connected to each other so as to straddle the insulating member, and the first metal member has a stepped part including a thin portion having a thickness relatively reduced as compared with other portions.
H01M 50/578 - Dispositifs ou dispositions pour l’interruption du courant en réponse à la pression
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
36.
ACOUSTIC FILTER DEVICE WITH STAGGERED GROUND INDUCTORS
A filter device is provided that includes series resonator connected between a pair of ports; shunt resonators connected between a ground connection and a node between one or more of series resonator and one of the pair of ports; and inductors that are connected between the ground connection and the shunt resonators, respectively. The inductors have staggered inductance values that are different from each other. Each of the resonators includes a substrate, a piezoelectric layer attached either directly or via one or more intermediate layers to the substrate, and an interdigital transducer (IDT) on a surface of the piezoelectric layer and that includes interleaved IDT fingers extending from first and second busbars, respectively.
A device includes a cap wafer with a sealing region surrounding a gap-control region, and a structure wafer with a corresponding sealing region and gap-control region. The cap wafer has top and bottom surfaces, defining an xy-plane, and a vertical z-direction perpendicular to this plane. The structure wafer is similarly oriented, with its top surface parallel to the xy-plane. The cap wafer and structure wafer are bonded by a eutectic seal connecting their sealing regions, ensuring alignment of their gap-control regions along the z-axis. The device also includes a metal layer located on the bottom surface of the cap wafer in its gap-control region, and the structure wafer features a standoff protruding from its top surface within its gap-control region, extending along the z-direction to contact the metal layer.
A device is provided that includes a stator including a stator element and a row of stator comb fingers, wherein the stator comb fingers extend away from the stator element in a y-direction. A device may include a rotor including a rotor element and a row of rotor comb fingers, wherein the rotor comb fingers extend away from the rotor element in a direction which is opposite to the y-direction, and wherein the stator comb fingers are interdigitated with the rotor comb fingers, and form an interdigitated row, and each pair of adjacent stator comb finger and rotor comb finger are separated from each other by a x-gap in a x-direction, which is perpendicular to the y-direction.
In a high-frequency module, a first chip includes one of a plurality of first acoustic wave resonators of a first filter a mounting substrate. A second chip includes one of a plurality of second acoustic wave resonators of a second filter. The second chip is on a side of the first chip opposite to the mounting substrate side. The first chip has a first main surface on the second chip side and a second main surface on the mounting substrate side. The second chip includes a third main surface on the first chip side and a fourth main surface on a side opposite to the first chip side. A first circuit element related to the first filter is on the second main surface side of the first chip. A second circuit element related to the second filter is disposed on the fourth main surface side of the second chip.
An acoustic wave device includes a first acoustic wave filter, a first conductor portion between the first acoustic wave filter and a second acoustic wave filter and connected to a second functional conductor portion of the second acoustic wave filter. The first acoustic wave filter includes a signal electrode on a second main surface of a first piezoelectric substrate and connected to the first conductor portion, a ground electrode on the second main surface of the first piezoelectric substrate, and a second conductor portion connected to the ground electrode. The ground electrode overlaps a first functional conductor portion and does not overlap the signal electrode in a thickness direction of the first piezoelectric substrate. The second conductor portion is located between first and second main surfaces of the first piezoelectric substrate and spaced apart from the first main surface.
A first portion and a second portion are connected to a first surface of a connection portion having the first surface and a second surface opposite to the first surface. A first radiating element is disposed on the first portion, and a second radiating element is disposed on the second portion. The connection portion includes a first flat board portion, a bent portion extending from the first flat board portion, and bent to have the first surface facing outward, and a second flat board portion further extended from the bent portion.
A radio frequency circuit includes a filter with a pass band including at least a part of a band (A) for TDD; a filter with a pass band including at least a part of the band (A); and a switch circuit that has (i) a first mode in which the filter is connected between an antenna connection terminal and a radio frequency input terminal, (ii) a second mode in which the filter is connected between the antenna connection terminal and a radio frequency output terminal, and (iii) a third mode in which the filters are connected in series between the antenna connection terminal and the radio frequency input terminal or between the antenna connection terminal and the radio frequency output terminal.
An acoustic wave device includes a piezoelectric substrate including a piezoelectric layer with first and second main surfaces, and a support on the second main surface, a first comb-shaped electrode on the first main surface including a first busbar and first electrode fingers connected to the first busbar and being connected to an input potential, a second comb-shaped electrode on the first main surface including a second busbar and second electrode fingers connected to the second busbar and interdigitated with the first electrode fingers, and connected to an output potential, and a reference potential electrode connected to a reference potential and including third electrode fingers on the first main surface and aligned with the first and second electrode fingers, connection electrodes connected to the third electrode fingers, respectively, and a third busbar electrically connected to the third electrode fingers by the connection electrodes.
An acoustic wave device includes a piezoelectric layer, first and second comb-shaped electrodes respectively including first and second electrode fingers, and a reference potential electrode including third electrode fingers. An order in which the first, second, and third electrode fingers are arranged is the first electrode finger, the third electrode finger, the second electrode finger, and the third electrode finger and defines one period. A pair of reflectors sandwich a region where the first electrode finger, the second electrode finger, and the third electrode finger are provided in an electrode finger orthogonal direction.
A battery is provided and including a safety valve, in which the safety valve includes a first metal member positioned on an outer side, a second metal member positioned on an inner side, and an insulating member positioned between the first metal member and the second metal member, the first metal member and the second metal member are connected to each other so as to straddle the insulating member, and the second metal member is provided with a groove in a sectional view, the groove has at least two corner portions inside the groove in the sectional view, and shapes of the two corner portions are different from each other.
H01M 50/586 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’intérieur des batteries p. ex. les contacts incorrects des électrodes
A secondary battery is provided and includes a first pole and a second pole both wound along a prescribed direction. A first current collector of the first pole has a first protrusion protruding along the prescribed direction and not overlapping a first active material layer of the first pole. A second current collector of the second pole has a second protrusion protruding along an orthogonal direction orthogonal to the prescribed direction and not overlapping a second active material layer of the second pole. The first tab is electrically connected to the first protrusion. The second tab is electrically connected to the second protrusion.
H01M 50/538 - Connexions de plusieurs conducteurs ou languettes d’électrodes empilées enroulées ou pliées
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
A secondary battery is provided and includes a positive electrode, a negative electrode, a separator, an adhesive layer provided on a principal face of the separator, and an electrolytic solution. The adhesive layer contains a water-soluble binder. With a region where the positive electrode, the negative electrode, and the separator are stacked and overlapped being defined as an electrode body region, the positive electrode and the negative electrode respectively have a positive electrode terminal and a negative electrode terminal that are portions protruding from the electrode body region in plan view in the first direction. The positive electrode terminal and the negative electrode terminal are located on the same side with respect to the geometric center of the electrode body region. When a region overlapping a shortest path in the electrode body region from a first boundary where the positive electrode terminal is connected to the electrode body region to a second boundary where the negative electrode terminal is connected to the electrode body region is defined as a first measurement region, and a region that is point-symmetric to the first measurement region about a geometric center of the electrode body region and has an area equal to that of the first measurement region is defined as a second measurement region, and where an area proportion occupied by the adhesive layer in the first measurement region is denoted by A and an area proportion occupied by the adhesive layer in the second measurement region is denoted by B, 1.1≤A/B≤1.5.
H01M 50/489 - Séparateurs, membranes, diaphragmes ou éléments d’espacement dans les cellules caractérisés par leurs propriétés physiques, p. ex. degré de gonflement, hydrophilicité ou propriétés pour court-circuiter
A secondary battery is provided and includes a first electrode wound body, a second electrode wound body, and an outer package body. The outer package body contains the first electrode wound body and the second electrode wound body. Each of the first electrode wound body and the second electrode wound body includes, at respective ends of a stacked body in a width direction, a first end face at which a first electrode is exposed and a second end face at which a second electrode is exposed. The first electrode wound body and the second electrode wound body are disposed adjacent to each other in the width direction of the stacked body, with the first end face of the first electrode wound body and the first end face of the second electrode wound body being opposed to each other.
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
H01M 50/152 - Couvercles caractérisés par leur forme pour des cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/533 - Connexions d’électrodes dans un boîtier de batterie caractérisées par la forme des conducteurs ou des languettes
H01M 50/534 - Connexions d’électrodes dans un boîtier de batterie caractérisées par le matériau des conducteurs ou des languettes
A battery is provided and including an exterior body that houses a battery assembly and an electrolyte, and a safety valve attached to the exterior body, wherein the battery assembly includes a positive electrode, a negative electrode, and a separator, the exterior body includes a cylindrical portion, a support portion protruding inward from the cylindrical portion at one end portion of the cylindrical portion, and an opening surrounded by the support portion, the safety valve is positioned at the one end portion of the cylindrical portion, and the safety valve and the support portion are fixed to each other with a thermoplastic resin layer interposed therebetween.
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
A filter includes an acoustic wave resonator including a piezoelectric substrate and an IDT electrode. The piezoelectric substrate includes a piezoelectric layer, a low acoustic velocity layer, and a high acoustic velocity layer. An intersection region of the IDT electrode includes a central region and an edge region. The IDT electrode includes a mass addition film in the edge region. A duty of the IDT electrode and a cut-angle θ° of the piezoelectric layer satisfy any one or more of 0.513≤D≤0.568 and 2.5≤θ≤17.5, 0.538≤D≤0.568 and 17.5≤θ≤22.5, 0.538≤D≤0.588 and 42.5≤θ≤52.5, 0.538≤D≤0.613 and 52.5≤θ≤67.5, 0.513≤D≤0.638 and 67.5≤θ≤77.5, and 0.513≤D≤0.713 and 77.5≤θ≤92.5.
H03H 9/70 - Réseaux à plusieurs accès pour connecter plusieurs sources ou charges, fonctionnant sur des fréquences ou dans des bandes de fréquence différentes, à une charge ou à une source commune
A battery is provided and including a battery element having a first outer end surface and a second outer end surface; and an exterior body having a cylindrical shape, having a first inner end surface to face the first outer end surface, and housing the battery element, in which the exterior body has a first inner diameter φ1 at a position 4 mm distant from the first inner end surface toward the second outer end surface; the exterior body has a second inner diameter φ2 at a position 7 mm distant from the second outer end surface of the battery element toward the first outer end surface; and the first inner diameter φ1 is 0.24 to 0.72% smaller than the second inner diameter φ2.
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
H01M 50/533 - Connexions d’électrodes dans un boîtier de batterie caractérisées par la forme des conducteurs ou des languettes
An acoustic resonator is provided that includes an interdigital transducer (IDT) at a surface of at least one piezoelectric layer, the IDT including interleaved IDT fingers extending from first and second busbars respectively. Moreover, a ratio of a thickness of the IDT fingers to a thickness of the at least one piezoelectric layer is optimized to minimize unwanted spurs. The mark to pitch ratio of the IDT fingers may also be optimized to minimize spurs during operation.
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
An inductor including a component main body having a multilayer structure formed with stacked non-conductive material layers; and a coil inside the component main body and configured of line conductors each extending along an interface between the non-conductive material layers and via conductors penetrating through the non-conductive material layers to a thickness direction. The line conductors each have pad portions connected to the via conductors and line wire portions connected to the pad portions. The coil has a shape of extending along a helical path with the line conductors and the via conductors alternately connected, in which the via conductors include a longitudinal via conductor in a longitudinal shape extending along the line conductor. The pad portions include a longitudinal pad portion connected to the longitudinal via conductor, and a width-direction dimension of the longitudinal pad portion is larger than a width-direction dimension of the line wire portion.
A resonance device includes a resonator including a vibration part, a frame disposed at at least a part of a circumference of the vibration part, and a supporting arm connecting the vibration part to the frame; and a first substrate including a first bottom plate configured to have a first gap from o the vibration part in a thickness direction, a first side wall, and a first limiting part having a first distance to the resonator in the thickness direction smaller than a second distance between the resonator and the first bottom plate. The first limiting part includes a first tip-end with a first metal film facing the resonator in the thickness direction. The first metal film is configured as a first getter that maintains a vacuum of a vibration space in the resonance device.
An acoustic wave device includes a piezoelectric layer, at least one pair of electrodes, and a protective film. The piezoelectric layer includes first and second major surfaces opposing each other in a first direction. The at least one pair of electrodes are on at least one of the first and second major surfaces. The protective film covers at least a portion of the pair of electrodes. The protective film includes a first-component insulative film including a first component and in contact with the pair of electrodes, and a second-component insulative film including a second component and located at the surface layer of the protective film. The first-component insulative film has a higher moisture resistance than the second-component insulative film. The second-component insulative film has a higher plasma resistance than the first-component insulative film.
A secondary battery includes an electrode wound body and an outer package can containing the electrode wound body. The positive electrode includes a positive electrode current collector and first and second positive electrode active material layers. Each of the first and second positive electrode active material layers includes a first thin part and a first thick part having a thickness greater than that of the first thin part and being adjacent to the first thin part in a longitudinal direction. A position of a first border between the first thin part of the first positive electrode active material layer and the first thick part of the first positive electrode active material layer and a position of a second border between the first thin part of the second positive electrode active material layer and the first thick part of the second positive electrode active material layer are different from each other.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
A power supply device includes an input terminal to which a direct-current power supply can be connected, an output terminal, a power converter circuit, a first switch placed between the input terminal and a power converter circuit, a second switch placed between the power converter circuit and the output terminal, and a controller configured to control the first switch and the second switch to switch between an on-state and an off-state. For cutting off an electrical connection between the input terminal and the output terminal, the controller is configured to switch the first switch into an off-state and thereafter switch the second switch into an off-state.
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
A substrate and a chip device mounted on a main surface of the substrate are provided. The chip device is provided with a first differential amplifier including a first carrier amplifier and a second carrier amplifier, and a second differential amplifier including a first peak amplifier and a second peak amplifier. In the chip device, the first carrier amplifier and the second carrier amplifier are disposed side by side in a first direction, the first carrier amplifier and the first peak amplifier are disposed side by side in a second direction different from the first direction, the first peak amplifier and the second peak amplifier are disposed side by side in the first direction, and the second carrier amplifier and the second peak amplifier are disposed side by side in the second direction.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A secondary battery includes a stacked body including a positive electrode, a negative electrode, and a separator. The positive electrode includes a positive electrode active material layer, a positive electrode current collector, and an insulating layer. The positive electrode current collector includes a positive electrode covered region and a positive electrode exposed region. The positive electrode exposed region is not covered with the positive electrode active material layer and extends in a width direction from the positive electrode active material layer. The insulating layer extends along a first edge of the positive electrode active material layer. The first edge is located at a border between the positive electrode covered region and the positive electrode exposed region. The positive electrode active material layer includes a first thin part and a first thick part that is adjacent to the first thin part in the width direction.
H01M 4/13 - Électrodes pour accumulateurs à électrolyte non aqueux, p. ex. pour accumulateurs au lithiumLeurs procédés de fabrication
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
60.
SECONDARY BATTERY-USE ELECTROLYTIC SOLUTION AND SECONDARY BATTERY
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution, and the electrolytic solution contains a phenyl isothiocyanate compound represented by Formula (1).
H01M 10/0567 - Matériaux liquides caracterisés par les additifs
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 10/0568 - Matériaux liquides caracterisés par les solutés
H01M 10/0569 - Matériaux liquides caracterisés par les solvants
61.
COGNITIVE FUNCTION ASSESSMENT DEVICE AND COGNITIVE FUNCTION ASSESSMENT SYSTEM
A cognitive function assessment device includes a brain signal detection part, a response motion detection part, and a computation part. The brain signal detection part detects a brain signal of a subject occurring in response to a stimulus. The response motion detection part detects a response motion of the subject occurring in response to the stimulus and outputs a response signal. The computation part detects an event-related potential and a motor readiness potential from the brain signal, calculates a response speed from the response signal, and assesses cognitive function on the basis of the event-related potential, the motor readiness potential, and the response speed.
G16H 50/30 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour le calcul des indices de santéTIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour l’évaluation des risques pour la santé d’une personne
62.
SOLIDLY-MOUNTED TRANSVERSELY-EXCITED FILM BULK ACOUSTIC DEVICE
Resonator and filter devices and methods of fabrication. A resonator chip includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between the substrate and a back surface of the piezoelectric plate. A conductor pattern on a surface of the piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The acoustic Bragg reflector is configured to reflect the shear primary acoustic mode. An interposer has a second plurality of contact pads on a back surface. A seal connects a perimeter of the piezoelectric plate to a perimeter of the interposer. Each contact pad of the first plurality of contact pads is directly connected to a respective contact pad of the second plurality of contact pads.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
A capacitor element that includes: a capacitor part including: an anode plate having a core and a porous part on at least one major face of the core, a dielectric layer on a surface of the porous part, and a cathode layer on a surface of the dielectric layer; and a sealing layer that seals the capacitor part, wherein a surface of the sealing layer has a slit.
A stretchable wiring board that includes: a stretchable substrate having a first main surface and a second main surface facing each other in a thickness direction; a wiring member on at least the first main surface side of the stretchable substrate and including at least one stretchable wiring extending in a plane direction including a length direction orthogonal to the thickness direction and a width direction orthogonal to the thickness direction and the length direction; a protective member covering at least one of the first main surface and the second main surface of the stretchable substrate; and a film member on at least one of the stretchable substrate side and a side opposite to the stretchable substrate with respect to the protective member, wherein the film member is constructed such that an appearance of the film member is irreversibly changed when the film member is stretched in the length direction.
A multilayer ceramic capacitor includes dielectric layers including at least Ti, a region in a center portion in a width direction and a lamination direction of the dielectric layers with a dimension in the width direction of about 800 nm and a dimension in the lamination direction of about 1 nm is divided into 800 cells with a size of a dimension in the width direction of about 1 nm and a dimension in the lamination direction of about 1 nm. When a cell in which a mole ratio of rare earths is about 5 mol % or more with respect to 100 mol of Ti is a high concentration cell, about 75% or more and less than about 100% of the 800 cells in the region are high concentration cells.
A multilayer ceramic electronic component includes a multilayer body, first and second outer electrodes respectively extending from first and second end surfaces of the multilayer body to each of first and second main surfaces. The first outer electrode includes a first main surface inclined portion extending from the first main surface side of the multilayer body to the first end surface side. The second outer electrode includes a second main surface inclined portion extending from the first main surface side of the multilayer body to the second end surface side. The first main surface inclined portion covers a ridge portion defined by the first main surface and the first end surface of the multilayer body. The second main surface inclined portion covers a ridge portion defined by the first main surface and the second end surface of the multilayer body.
A coil component includes a core including a winding core portion, a first flange portion, and a second flange portion, and a first wire and a second wire that are wound around the winding core portion in the same direction and that form a winding portion. The winding portion includes a second intersecting portion along a third side surface of the winding core portion at a position on the winding portion nearest to the second flange portion.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
A capacitor element that includes: a capacitor part including: an anode plate having a core and a porous part on at least one major face of the core, a dielectric layer on a surface of the porous part, and a cathode layer on a surface of the dielectric layer; a sealing layer that seals the capacitor part; and an insulating layer inside the sealing layer at a position where the insulating layer does not contact the cathode layer, wherein the insulating layer has a Young's modulus lower than a Young's modulus of the sealing layer.
An analysis method includes: calculating dynamical behavior of a series of atoms included in a constituent component of an electrolytic solution by performing a molecular dynamics calculation regarding the electrolytic solution; calculating a first dielectric relaxation spectrum signal of the constituent component, based on the dynamical behavior of the series of atoms; calculating a second dielectric relaxation spectrum signal of the electrolytic solution, based on the first dielectric relaxation spectrum signal; and calculating a physical property value unique to the constituent component, based on the first dielectric relaxation spectrum signal and the second dielectric relaxation spectrum signal.
G01N 27/02 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance
G01N 27/06 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un liquide
70.
SECONDARY BATTERY, METHOD OF MANUFACTURING THE SAME, AND BATTERY PACK
A secondary battery having higher reliability is provided. The secondary battery includes an electrode wound body, a first electrode current collector plate, and a second electrode current collector plate. The electrode wound body includes a stacked body including a first electrode and a second electrode that are stacked with a separator interposed therebetween. The stacked body is wound around a central axis extending in a first direction. The electrode wound body includes a first end face and a second end face that are opposed to each other in the first direction. The first electrode current collector plate faces the first end face of the electrode wound body and is coupled to the first electrode. The second electrode current collector plate faces the second end face of the electrode wound body and is coupled to the second electrode. The first electrode includes a first electrode covered region in which a first electrode current collector is covered with a first electrode active material layer, and a first electrode exposed region in which the first electrode current collector is exposed without being covered with the first electrode active material layer. The first electrode exposed region includes multiple first edge parts that are adjacent to each other in a radial direction of the electrode wound body. The multiple first edge parts are bent toward the central axis and overlap each other to form the first end face. The multiple first edge parts each have an end including a first curved face.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 50/533 - Connexions d’électrodes dans un boîtier de batterie caractérisées par la forme des conducteurs ou des languettes
H01M 50/534 - Connexions d’électrodes dans un boîtier de batterie caractérisées par le matériau des conducteurs ou des languettes
H01M 50/536 - Connexions d’électrodes dans un boîtier de batterie caractérisées par le procédé de fixation des conducteurs aux électrodes, p. ex. soudage
71.
NEGATIVE ELECTRODE ACTIVE MATERIAL, NEGATIVE ELECTRODE, AND SECONDARY BATTERY
A negative electrode active material includes a first negative electrode active material particle, and the first negative electrode active material includes a silicon-based material. A Si2p spectrum obtained by measuring the first negative electrode active material particle in a state of 0.6 V (vs. Li/Li+) by X-ray photoelectron spectroscopy has a peak in a range from 99.0 eV to 105.0 eV, and a half width of the peak is 1.5 eV or more and 8.0 eV or less.
H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 4/38 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'éléments simples ou d'alliages
H01M 4/587 - Matériau carboné, p. ex. composés au graphite d'intercalation ou CFx pour insérer ou intercaler des métaux légers
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
A clamping circuit is connected between a ground potential and a node through which a radio frequency signal passes. The clamping circuit includes multiple clamping elements that are cascaded. Each of the multiple clamping elements becomes conductive when a voltage greater than or equal to a forward voltage is applied thereto. At least one of the multiple clamping elements is implemented by a resistor-connected transistor that includes a bipolar transistor and a base-collector resistance element connected between the base and the collector of the bipolar transistor.
A radio-frequency circuit includes a power amplifier configured to output a first maximum transmit power, a power amplifier configured to output a second maximum transmit power that is higher than the first maximum transmit power, a filter having a pass band that includes a band A, a filter having a pass band that includes a band B different from the band A, a switch coupled between the power amplifier and the filter and between the power amplifier and the filter, and a switch coupled between the switch and the filter and between the power amplifier and the filter.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
An acoustic wave device includes a support substrate a silicon oxide layer on the support substrate, a lithium niobate layer on the silicon oxide layer, and an IDT electrode on the lithium niobate layer. When a wavelength of the IDT electrode is denoted as λ, a thickness of the silicon oxide layer is more than or equal to about 0λ. Values of TIDT, ρ, duty, LNcut, TLN, and TSiO2 are within ranges that enable BW derived from Formula 1 to be about 12% or less and ksaw2 derived from Formula 2 to be about 0.1% or less.
A device is provided that includes a stator core having a molded body of magnetic powder that includes an annular yoke extending circumferentially and a tooth protruding radially from the yoke's inner surface. The device further includes a coil that includes a winding wire wound around the tooth. A terminal plate is fixed to the axial end surface of the yoke and includes a plate portion and a terminal portion. The plate portion features a first main surface on the side of the yoke's end surface and a second main surface on the opposite side. The terminal portion extends axially from the second main surface. One end of the winding wire is fixed to the terminal portion by being bound around it. This configuration facilitates electrical connection and structural integration within the stator core.
A capsule medication device is provided that includes a housing having a capsule shape, a substrate disposed inside the housing, a power receiving coil on the substrate, and a secondary battery that can be charged with power received by the power receiving coil. A gravity center of the capsule medication device 10 not located at a center of a cut face when the capsule medication device is cut along a plane that passes through the gravity center and is orthogonal to the longitudinal direction of the capsule medication device, and is located to overlap the substrate in a view along a direction orthogonal to the substrate.
A receiving unit of a CPAP apparatus includes a base member, a receiving case, a heating unit, and an elastic member. The receiving case is disposed on an upper side of the base member and includes an opening formed in a lower wall. The heating unit is disposed between the base member and the lower wall of the receiving case. The elastic member is disposed on the base member and holds the heating unit. The heating unit includes a heating element and a thermal conductor. The thermal conductor is disposed on an upper side of the heating element, has a shape wider than a shape of the heating element when the heating element is viewed from the receiving unit in plan view, and includes a peripheral portion that does not overlap the heating element.
A stretchable wiring board that includes: a stretchable substrate having a first main surface and a second main surface facing each other in a thickness direction; and a wiring member on at least the first main surface side of the stretchable substrate and including at least one stretchable wiring extending in a plane direction including a length direction orthogonal to the thickness direction and a width direction orthogonal to the thickness direction and the length direction, wherein the at least one stretchable wiring includes a first wiring portion and a second wiring portion both extending in the length direction, at least the first wiring portion is an electric path to an outside of the stretchable wiring board, and a tensile strength in the length direction of the second wiring portion is lower than a tensile strength in the length direction of the first wiring portion.
A capacitor including: a capacitor element including a body and an external electrode on an end surface of the body; a lead-out terminal electrically connected to the external electrode; an outer case housing the capacitor element such that the lead-out terminal protrudes outward therefrom, wherein an outer surface of the outer case includes a mounting surface that faces a mounting object in a first direction when the lead-out terminal is welded to the mounting object; a filling resin filling the outer case such that the capacitor element is embedded in the filling resin; and a mounting foot on the outer surface of the outer case for welding the outer case to the mounting object at the mounting surface, the mounting foot being electrically isolated from the lead-out terminal and including a metal material of a same type as that of the lead-out terminal.
A secondary battery includes an electrode wound body and an outer package can containing the electrode wound body. The electrode wound body includes a stacked body including a positive electrode, a negative electrode, and a separator and being wound along a longitudinal direction thereof, and has a through hole in a width direction. The positive electrode includes a positive electrode current collector, and a positive electrode active material layer provided thereon. The positive electrode active material layer includes a first thin part, a thick part, and a second thin part. The thick part has a thickness greater than a thickness of the first thin part and is adjacent to the first thin part in the longitudinal direction. The second thin part has a thickness smaller than the thickness of the thick part and is positioned on an opposite side of the thick part to the first thin part.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
A secondary battery includes an electrode wound body and an outer package can containing the electrode wound body. The electrode wound body includes a stacked body including a positive electrode, a negative electrode, and a separator and being wound along a longitudinal direction thereof, and has a through hole provided through the electrode wound body in a width direction. The positive electrode includes a positive electrode current collector extending in both the longitudinal direction and the width direction, and a positive electrode active material layer provided thereon. The positive electrode active material layer includes a first thin part, a thick part, and a grooved part. The thick part has a thickness greater than a thickness of the first thin part and is adjacent to the first thin part in the longitudinal direction. The grooved part is positioned between the first thin part and the thick part.
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
A first bias circuit, a second bias circuit, a first differential amplifier, a second differential amplifier, and an inverting amplifier are included. The first bias circuit has: a first bias output terminal from which first bias current or a voltage is output to a carrier amplifier; and a first monitoring terminal from which a first monitoring signal is output. The second bias circuit has: a second bias output terminal from which second bias current or a voltage is output to a peaking amplifier; and a second monitoring terminal from which a second monitoring signal is output. The first differential amplifier outputs the first bias control signal. The second differential amplifier outputs an amplified signal. The inverting amplifier outputs the second bias control signal resulting from inverting amplification of the amplified signal.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A secondary battery includes an electrode wound body. The electrode wound body includes a stacked body including a positive electrode, a negative electrode, and a separator and wound along a longitudinal direction thereof, and has a through hole in a width direction. The positive electrode includes a positive electrode active material layer, and a positive electrode current collector including a positive electrode covered region and a positive electrode exposed region. The positive electrode covered region is covered with the positive electrode active material layer. The positive electrode exposed region is covered with no positive electrode active material layer and extends in the width direction from the positive electrode active material layer. The positive electrode active material layer includes a first thin part, and a first thick part having a thickness greater than that of the first thin part and being adjacent to the first thin part in the width direction.
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
84.
ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL
An electronic component is provided that includes a package, at least one electronic chip housed within an enclosure inside the package, and at least one first bonding pad, at least one second bonding pad, and at least one bond connected to at least one bonding pad and at least one second bonding pad for establishing an electric connection between the electronic chip and surrounding circuitry. A cleaning pad is provided in the package. The cleaning pad is spaced from first bonding pad and second bonding pad, designed to be electrically disconnected from other structures or components, and designed to enable cleaning of a bonding tool.
An acoustic resonator device is provided that includes a substrate; a piezoelectric layer at least partially supported by the substrate; an interdigital transducer (IDT) at the piezoelectric layer; an acoustic Bragg reflector between the substrate and the piezoelectric layer. The acoustic Bragg reflector includes alternating layers of a first material and a second material having a higher acoustic impedance than the first material. Thicknesses of the first material and the second material of the acoustic Bragg reflector are configured to generate a reflectance frequency band centered around a displaced frequency f0′, the displaced frequency f0′ being displaced from a resonance frequency fr of the acoustic resonator device based on a harmonic spur of the resonance frequency fr. In this aspect, the thicknesses of the first material and the second material are measured in a direction normal to the substrate.
A multilayer inductor includes a body. The body includes, within a magnetic member having a stack of magnetic layers containing iron powder, a coil including a coil conductor wound around and a through conductor that is electrically connected to the coil conductor and exposed in a bottom surface of the magnetic member. The multilayer inductor also includes an outer electrode that is on the through conductor and is electrically connected to the through conductor; and an exterior resin layer on the bottom surface of the magnetic member. The outer electrode includes protrusions that protrude perpendicular to a stacking direction of the magnetic layers in an upper end portion on a far side from the through conductor and a lower end portion on a near side from the through conductor in the stacking direction. The exterior resin layer extends across between the protrusions in the upper and lower end portions.
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
Outer terminal electrodes form exposed surfaces that extend in the form of a substantially L shape while at least part thereof are embedded in a component main-body. A loop conductor layer of the coil conductor has a lower side portion, lateral side portions, oblique side portions, and an upper side portion. The lower side portion has a length shorter than a gap between outer terminal electrodes, and is positioned within a range of the gap.
MOSFET-based IC architectures, including SOI NEDMOS ICs and bulk semiconductor LDMOS ICs, that mitigate or eliminate the problems of edge transistors. One IC embodiment includes end-cap body contact regions angle-implanted to have a first characteristic (e.g., P+), a drift region, and a gate structure partially overlying the end-cap body contact regions and the drift region and including a conductive layer having a third characteristic (e.g., N+) and a first side angle-implanted to have the first characteristic. Steps for fabricating such an IC include implanting a dopant at an angle in the range of about 5° to about 60° within the end-cap body contact regions and within the first side of the conductive layer in a region of the gate structure overlying the end-cap body contact regions, wherein the angle-implanted dopant results in the first characteristic for the end-cap body contact regions and the first side of the conductive layer.
H01L 27/06 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration non répétitive
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/10 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode ne transportant pas le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
A filter includes acoustic wave resonators connected to a path connecting terminals. A substrate includes a laminated structure of a piezoelectric film, and low and high acoustic velocity films. An electrode finger wavelength of the IDT electrode is λ (m), a film thickness of the piezoelectric film is t1 (m), a film thickness of electrode fingers is t2 (m), t1/A is a film thickness-wavelength ratio A of the piezoelectric film, t2/A is a film thickness-wavelength ratio B of the plurality of electrode fingers, a density of the piezoelectric film is x (g/cm3) and a density of the IDT electrode is y (g/cm3), and (A/x+B/y) is a mass coefficient M of an acoustic wave resonator which is connected closest to the terminal and equal to or more than about 0.95×0.054 and equal to or less than about 1.05×0.054.
An inductor component includes an element body having a rectangular parallelepiped shape; an inner wire inside the body and including a coil spirally wound along a coil axial direction; a first outer electrode electrically connected to one end portion of the inner wire and on one of the end surfaces of the body; and a second outer electrode electrically connected to the other end portion of the inner wire and on the other end surface of the body. In a section parallel to the coil axial direction and orthogonal to a direction in which the inner wire extends, the inner wire has four corners, and a part of the inner wire at either end in a direction parallel to the coil axial direction includes the corner that is adjacent to a corner portion of the body and has a shape different from shapes of the remaining three corners.
A power amplifier, which includes a plurality of stages of amplification units each of which includes a common-emitter transistor, includes a first amplification unit including a first transistor configured to amplify an input radio-frequency signal, a second amplification unit including a second transistor configured to amplify an output of the first amplification unit, a voltage detection circuit including at least one impedance element and provided between the first transistor and the second transistor, and a protection circuit configured to reduce, based on an output of the voltage detection circuit, a base bias current applied to at least one of the first transistor and the second transistor.
An APT module is provided that includes a converter circuit that outputs a power supply voltage, output terminals to which the power supply voltage is applied, a FB terminal connected to a signal path connecting the output terminal and power amplifiers, a FB terminal connected to a signal path connecting the output terminal and power amplifiers, and a control circuit connected to the FB terminals and the converter circuit.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A semiconductor device is flip-chip mounted on a mounting substrate. A mold resin seals the semiconductor device. An insulating heat transfer member having a thermal conductivity higher than a thermal conductivity of the mold resin is on a surface of the semiconductor device facing the mounting substrate. The semiconductor device includes a device layer including a transistor, a plurality of bumps that are on a surface of the device layer facing the mounting substrate and are connected to the mounting substrate, and an insulating layer that is on a surface of the device layer opposite to the surface facing the mounting substrate. When the mounting substrate is viewed in plan view, the transistor has a non-overlapping portion that does not overlap with any of the bumps. The heat transfer member is continuous from a region overlapping with the non-overlapping portion to at least one of the bumps.
A power amplifier circuit includes one or a plurality of amplification stages. A first amplification stage includes a first amplifier and a second amplifier that amplify a differential signal, a first capacitor electrically connected between an output terminal of the first amplifier and an input terminal of the second amplifier, a second capacitor electrically connected between an input terminal of the first amplifier and an output terminal of the second amplifier, a first resonant circuit and a first resistor that are electrically connected in series with each other and are electrically connected between the output terminal and the input terminal of the first amplifier, and a second resonant circuit and a second resistor that are electrically connected in series with each other and are electrically connected between the output terminal and the input terminal of the second amplifier.
H03F 3/21 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
H03F 3/19 - Amplificateurs à haute fréquence, p. ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs
A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.
A filter device is provided that includes a plurality of bulk acoustic resonators that each includes a piezoelectric layer; a conductor pattern on the piezoelectric layer and including an interdigital transducer (IDT) having a first plurality of fingers extending from a first busbar and a second plurality of fingers extending from the second busbar, such that the first plurality of fingers and the second plurality of fingers are interleaved with each other; a dielectric strip that overlaps a margin of the first plurality of fingers and that extends into a gap between ends of the first plurality of fingers and the second busbar. Moreover, a thickness ts of the dielectric strip a first bulk acoustic resonator of the plurality of bulk acoustic resonators is different than a thickness ts of the dielectric strip of a second bulk acoustic resonator of the plurality of bulk acoustic resonators.
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/13 - Moyens d'excitation, p. ex. électrodes, bobines pour réseaux se composant de matériaux piézo-électriques ou électrostrictifs
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers, the external electrode layers each further including a base electrode layer including a first region, a second region, and a third region divided therein, in order from the multilayer body. The first region includes a metal included in the internal electrode layers in a higher amount than the second region and the third region, the second region includes glass in a higher amount than the first region and the third region, and the third region includes copper in a higher amount than the first region and the second region.
To reduce the height in a thickness direction of a mounting substrate. A radio-frequency module includes a mounting substrate, an electronic component, first and second chip components. The electronic component is mounted on a first main surface of the mounting substrate. The first and second chip components are mounted on a second main surface of the mounting substrate. Each of the first and second chip components includes a substrate and a circuit portion. The substrate has first and second main surfaces facing each other. The circuit portion is formed on the first main surface side of the substrate. The second main surface of the substrate in each of the first and second chip components is exposed. A material of the substrate in the first chip component is the same as a material of the substrate in the second chip component.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
A multiplexer includes a transmission filter and a reception filter each including resonators including one or more series arm resonators. The transmission filter includes a piezoelectric substrate and a first series arm resonator unit on the piezoelectric substrate. The reception filter shares the piezoelectric substrate with the transmission filter and includes a second series arm resonator unit on the piezoelectric substrate. The transmission filter includes an input terminal, an output terminal, and a ground terminal. In a circuit configuration of the transmission filter, a path connecting the input terminal and the output terminal is a series arm, a path branching from the series arm to the ground terminal is a parallel arm, and a connection point between the series arm and the parallel arm is a node.
A switching power supply device includes a power conversion circuit including input and output capacitors, a switching element, and an inductor, a common-mode choke coil between a DC power supply and the power conversion circuit, and a multilayer circuit board on which the power conversion circuit and the common-mode choke coil are mounted. The common-mode choke coil includes a first winding having one end connected to a low-potential side of the DC power supply via a first reference potential wiring pattern P-and another end connected to a low-potential side of a load via a second reference potential wiring pattern L-, and a second winding of which one end is connected to a high-potential side of the DC power supply via a DC positive potential wiring pattern and another end is connected to an input side of the power conversion circuit via an input positive potential wiring pattern.
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
H02M 1/44 - Circuits ou dispositions pour corriger les interférences électromagnétiques dans les convertisseurs ou les onduleurs
H02M 7/00 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continuTransformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
brevets
