An optical module (200), comprising: a circuit board (300); an optical transceiver component (900) fixed on the circuit board (300), the optical transceiver component (900) comprising a lens assembly (901a), an optical fiber support (902a), a positioning column (903) and an optical emitter chip (310), wherein the optical fiber support (902a) is provided with a first positioning hole (921), the surface of the lens assembly (901a) facing the optical fiber support (902a) is provided with a second lens (9142) and a second positioning hole (9143), the second positioning hole (9143) is located at one side of the second lens (9142), the positioning column (903) is fixed to the second positioning hole (9143) and the first positioning hole (921), the second lens (9142) is plated with an antireflection film, the surface where the second lens (9142) is located is flush with or protrudes from the surface of the lens assembly (901a) facing the optical fiber support (902a), and the optical emitter chip (310) is electrically connected to the circuit board (300) and is configured to generate an optical signal; and a heating device (350a, 350b) provided on the side edge of the optical emitter chip (310) or below the optical emitter chip (310) and configured to generate heat. The second positioning hole (9143) is located at one side of the second lens (9142), and the surface where the second lens (9142) is located is not recessed inwards relative to the surface of the lens assembly (901a) facing the optical fiber support (902a), such that the antireflection film on the second lens (9142) has a uniform thickness.
An optical module (200), comprising: a circuit board (300); a light-receiving component (500), which is arranged on the circuit board (300), and comprises a light-receiving chip array (310) and an optical device (520), wherein the light-receiving chip array (310) is electrically connected to the circuit board (300), the optical device (520) is located above the light-receiving chip array (310), and the light-receiving chip array (310) comprises a first light-receiving chip and a second light-receiving chip; and a second optical fiber (502), which is connected to the optical device (520). The optical device (520) comprises: a demultiplexing assembly, which has a light inlet (5213), wherein the demultiplexing assembly is optically coupled and connected to the second optical fiber (502), a light signal enters the demultiplexing assembly via the light inlet (5213), and the demultiplexing assembly is configured to perform beam splitting on the light signal, and redirect light beams which are transmitted in the extension direction of the second optical fiber (502); and a lens array (522), which is located below a light output end of the demultiplexing assembly, wherein the lens array (522) is located above the light-receiving chip array (310), and the optical axis of the lens array (522) is not perpendicular to a photosensitive surface of the light-receiving chip array (310).
Provided in the present disclosure is an optical module, comprising a circuit board, a substrate, and a heater and a laser chip, which are mounted on the substrate, wherein a signal line and a ground pad are provided on the circuit board; a high-frequency transmission line wire-bonded to the signal line and a ground metal area wire-bonded to the ground pad are provided on the substrate; the laser chip is mounted on the ground metal area; the high-frequency transmission line is wire-bonded to the laser chip; the heater is thermally isolated from the substrate; the heater has a first power supply terminal, a second power supply terminal and a ground terminal; the second power supply terminal is electrically connected to the circuit board; the ground terminal is connected to the ground metal area to supply power to the heater; the first power supply terminal is electrically connected to the circuit board to transmit a drive current to the heater; and the heater is connected to the laser chip via a gold wire to transmit the drive current and conduct heat to the laser chip.
An optical module (200) comprises a circuit board (300) and an optical modulation chip (900). The optical modulation chip (900) comprises a first substrate (910), an optical modulator (911), a second coupled waveguide (913); and a modulation driver (918) is formed on the other side of the optical modulator (911). A transimpedance amplifier (919) is further provided on a surface of the first substrate (910). An optical demodulator (921) is provided on a surface of a second substrate (920), and a first coupled waveguide (923) is formed on one side of the optical demodulator (921). Since the optical demodulator (911) is enclosed in a first recess (912), in order to electrically connect the optical demodulator (921) to the transimpedance amplifier (919), a first via (919a) that runs through the first substrate (910) in a direction from an end of the optical demodulator (912) to the circuit board (300) is formed to electrically connect the optical demodulator (921) to the circuit board (300). A second via (919b) that runs through the first substrate (910) in a direction from a bottom surface of the transimpedance amplifier (919) to the circuit board (300) is formed to electrically connect the transimpedance amplifier (919) to the circuit board (300) and thus electrically connect the light demodulator (921) to the transimpedance amplifier (919).
An optical module (200), comprising an upper housing (201), a circuit board (105), a base (900a), a light receiving component (500a), and a light emitting component (400a). Respectively arranging the light receiving component (500a) and the light emitting component (400a) on different surfaces of the same base (900a) can achieve light reception and light emission of multiple paths of signals. A base mounting portion (301) is formed on a surface of the circuit board (105), such that the base (900a) is fixed to the surface of the circuit board (105) by means of the base mounting portion (301). In order to improve the cooling effect of the base (900a), the light emitting component (400a) is arranged on the lower surface of the base (900a), and a protruding portion (910a) is formed on the upper surface of the base (900a), the protruding portion (910a) protruding towards the upper housing (201), and the protruding portion (910a) being in thermally-conductive connection to the upper housing (201), thereby allowing heat to be dissipated via the base (900a).
The present disclosure provides an optical module, and a method for preparing a hybrid InP/Si optical chip. The optical module comprises: a circuit board; and a hybrid InP/Si optical chip, which is electrically connected to the circuit board and is configured to modulate and generate an optical signal. The hybrid InP/Si optical chip comprises: a Si platform, which is integrated with a silicon optical circuit, wherein an InP region is formed inside the Si platform, the InP region has no pad, a radio frequency pad and a direct-current bias pad are provided at the top of the Si platform, the radio frequency pad is located on one side of the InP region, and the direct-current bias pad is located on the other side of the InP region; an InP phase modulator, which is located in the InP region and comprises an InP waveguide and a coupling electrode, wherein the coupling electrode is arranged above the InP waveguide, and the InP waveguide is electrically connected to the direct-current bias pad; and a radio frequency traveling waveguide, one end of which is connected to the radio frequency pad, and the other end of which extends over the InP waveguide and extends to the other side of the InP region, wherein the radio frequency traveling waveguide is electrically connected to the coupling electrode. Thus, the modulation rate of a phase modulator is increased, thereby meeting the requirements of a high-rate optical module.
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
G02F 1/017 - Structures avec une variation de potentiel périodique ou quasi périodique, p. ex. superréseaux, puits quantiques
An optical module (200), comprising: a housing formed by covering an upper housing (201) and a lower housing (202), and a circuit board (300) located inside the housing. An optical receiving component (500) is located on the lower surface of the circuit board (300). A first optical channel (4051) and a second optical channel (4052) are provided on the upper surface of a transmitting housing (401) of an optical transmitting component (400), and a first optical fiber accommodating portion (4023) and a second optical fiber accommodating portion (4024) are provided on the lower surface of the transmitting housing (401) for accommodating a first internal optical fiber and a second internal optical fiber. A first side wall of the transmitting housing (401) is sequentially provided with a first optical fiber adapter (701), a second optical fiber adapter (702), a third optical fiber adapter (703), and a fourth optical fiber adapter (704) which are located at the same height. By reasonably arranging the position of the optical transmitting component (400), the position of the optical receiving component (500), and the center height of an optical port (205) of the optical module, the number of optical components is reduced, and the space of the optical module is reduced.
The present application discloses an optical module, comprising a circuit board and an optical transceiving component, wherein the optical transceiving component comprises a transceiving tube, a first notch is provided on the end of the transceiving tube facing the circuit board, and the circuit board is fitted in the first notch. A receiving recess is provided on the upper surface of the transceiving tube, and the receiving recess comprises a first receiving recess part and a second receiving recess part, the height of the first receiving recess part being smaller than the height of the second receiving recess part. A transmitting recess is provided on the lower surface of the transceiving tube, and the transmitting recess comprises a first transmitting recess part, a second transmitting recess part and a third transmitting recess part, the heights of the second transmitting recess part, the third transmitting recess part and the first transmitting recess part sequentially increasing. In the present application, a receiving recess is provided on the upper surface of the transceiving tube, and an optical receiver is provided in the receiving recess so as to realize the reception of an optical signal; a transmitting recess is provided on the lower surface of the transceiving tube, and an optical transmitter is provided in the transmitting recess so as to realize the transmission of an optical signal.
An optical module (200), and a preparation method for an optical chip (900). The optical module (200) comprises an optical chip (900) and an optical fiber (101). The optical chip (900) comprises a first substrate (9101), a first buried layer (9102) provided on the first substrate (9101), a first cladding layer (9103) provided on the first buried layer (9102), a second cladding layer (9203) provided on the first cladding layer (9103), and a second buried layer (9202) provided on the second cladding layer (9203), wherein a first waveguide (905) that is away from the first substrate (9101), and a first metal electrode group are provided inside the first cladding layer (9103), and there is a first gap between the first waveguide (905) and the first substrate (9101); and a second waveguide (904) that is away from the first cladding layer (9103) and a second metal electrode group that is close to the first cladding layer (9103) are provided inside the second cladding layer (9203), the second metal electrode group is bonded to the first metal electrode group, the second waveguide (904) is coupled to the first waveguide (905), there is a second gap between the second waveguide and the first waveguide, and the optical fiber (101) is coupled to the first waveguide (905). The optical chip (900) has two substrates (9101, 9201), so as to integrate, in the optical chip (900), the first waveguide (905) that is very far away from the substrates, thereby increasing the distances between the first waveguide (905) and the substrates, and reducing the leakage loss of the substrates.
Disclosed is an optical module, comprising a circuit board, wherein the circuit board comprises a first metal surface layer, a second metal surface layer, and a first metal intermediate layer; the first metal surface layer is provided with golden fingers, an elastic piece is provided on each golden finger, the golden finger includes a high-frequency signal golden finger, and a gap is formed on one side of the golden finger; the first metal intermediate layer is located below the first metal surface layer, and a first insulating supporting layer is provided between the first metal intermediate layer and the first metal surface layer; the first metal intermediate layer in the projection area of the high-frequency signal golden finger does not have a metal layer to form a hollowed-out area; the first insulating supporting layer in the projection area of one side of the high-frequency signal golden finger is hollowed out to form a first groove.
An optical module (200). In the optical module (200), a support plate (2024) is arranged at one end of a lower housing (202), and a support surface (240) is formed on the top of the support plate (2024); an assembly mechanism is arranged on the support surface (240), and the bottom of the assembly mechanism is connected to the support surface (240); snap-fitting components (243, 623, 318) are arranged at an end of the support surface (240), and the snap-fitting components (243, 623, 318) protrude from the support surface (240); the snap-fitting components (243, 623, 318) each is provided with an unlocking surface (245) at a side edge thereof, the unlocking surface (245) being lower than a top surface of each of the snap-fitting components (243, 623, 318); each of the unlocking components (600, 400) comprises a holding portion (610), a connecting portion (620), an assembly portion (630) and an unlocking portion (640); the unlocking portion (640) comprises an unlocking body (641) and an unlocking support body (640a), one end of the unlocking body (641) being connected to the other end of the assembly portion (630), the other end of the unlocking body (641) being connected to the unlocking support body (640a), and the height of the unlocking support body (640a) being greater than the thickness of the unlocking body (641); the assembly portion (630) is assembled and connected to the assembly mechanism, and the assembly portion (630) can move relative to the assembly mechanism; and the unlocking support body (640a) is located at a side edge of each of the snap-fitting components (243, 623, 318), and the unlocking surface (245) enables the unlocking support body (640a) to unlock the snap-fitting components (243, 623, 318).
An optical module, comprising: an upper shell, wherein a first optical fiber socket mounting portion is formed at the end of the upper shell close to an optical port; a lower shell, wherein a second optical fiber socket mounting portion is formed at the end of the lower shell close to the optical port, and the second optical fiber socket mounting portion and the first optical fiber socket mounting portion form an optical fiber socket mounting cavity; a first optical fiber, on which a first optical fiber connecting component is provided, wherein an end portion of the first optical fiber connecting component is located in the optical fiber socket mounting cavity; and a second optical fiber connected to the first optical fiber connecting component; or, the second optical fiber having one end connected to the second optical fiber connecting component, the second optical fiber connecting component comprising a second optical fiber connector and a second optical fiber protection sleeve, wherein the second optical fiber protection sleeve is sleeved on the first optical fiber, one end of the second optical fiber connector is connected to the second optical fiber protection sleeve, the outer edge of an end portion of the second optical fiber protection sleeve is assembled and connected to the optical fiber socket mounting cavity, and the outer edge of the second optical fiber connector is assembled and connected to the optical fiber socket mounting cavity.
An optical module provided by the present disclosure comprises: a lower housing, comprising a bottom plate, a first lower side plate and a third lower side plate which are located on a side of the bottom plate, and a second lower side plate and a fourth lower side plate which are located on another side of the bottom plate, a first interval being provided between the first lower side plate and the third lower side plate, and a second interval being provided between the second lower side plate and the fourth lower side plate; a first upper sub-housing, which is coveringly connected to the first lower side plate and the second lower side plate, so that the first upper sub-housing and the lower housing form a first accommodating cavity; a second upper sub-housing, one end of which is coveringly connected to the first lower side plate, the second lower side plate, and the first upper sub-housing, the other end of which is coveringly connected to the third lower side plate and the fourth lower side plate, so that the second upper sub-housing and the lower housing form a second accommodating cavity, and the second accommodating cavity is in communication with the first accommodating cavity. The optical module provided by the present disclosure has convenient optical module assembly.
The present disclosure provides an optical module, comprising a light source comprising a laser assembly. The laser assembly comprises a semiconductor gain chip and a wavelength tuning chip which form a resonant cavity; the wavelength tuning chip comprises at least one micro-ring filter; the at least one micro-ring filter is used for screening for a beam of a specific wavelength from among beams emitted by the semiconductor gain chip; the micro-ring filter comprises a first slab region and a second slab region which are located on two sides of a silicon waveguide ridge region, and a contact electrode; an N-type doped region is provided in the first slab region, and a P-type doped region is provided in the second slab region; the P-type doped region and the N-type doped region form a PN junction electrically connected to the contact electrode; and electron-hole pairs in the silicon waveguide ridge region and the first and second slab regions can be absorbed by applying a reverse bias to the PN junction.
The present disclosure provides an optical module, comprising a coherent assembly for receiving local oscillator light and a first optical signal and performing coherent demodulation on the local oscillator light and the first optical signal. A reception photodetector generates a photo-generated current from the first optical signal. A transimpedance amplifier receives the photo-generated current and amplifies the photo-generated current to output a voltage signal. An analog-to-digital conversion sampler converts the voltage signal into an AD sampling value and transmits the AD sampling value to an MCU formula. The AD sampling value is substituted into a reference optical power formula to calculate a reference optical power value, and the current frequency value is substituted into a frequency deviation formula to calculate the current frequency deviation. The current frequency deviation is subtracted from the reference optical power value to obtain an optical power calculation value as a reported optical power.
An optical module (200), comprising a circuit board (300) and a lens assembly. A first sealing member is provided between the lens assembly and the circuit board (300); one end of the first lens assembly (911) is provided with a wrapping cavity (9112); optical port recesses (9111), a blocking piece (913) and a third sealing member are arranged on the first lens assembly, the third sealing member is located on the outer side wall of the blocking piece (913), the blocking piece (913) covers the optical port recesses (9111), and each optical port recess (9111) is provided with a reflective surface (9115); an optical fiber holder (912) is fixed in the wrapping cavity (9112); a first end surface of the optical fiber holder (912) is buried in the wrapping cavity (9112); a second sealing member is provided between the optical fiber holder (912) and the wrapping cavity (9112); a first vent hole (9119a) is formed in the wrapping cavity (9112); the extension range of the second sealing member in a gap between the top surface of the optical fiber holder (912) and the wrapping cavity (9112) does not exceed the first vent hole (9119a); and a twelfth sealing member is provided in the first vent hole (9119a). A cooling liquid is isolated by means of the first sealing member, the second sealing member, the blocking piece (913), and the twelfth sealing member arranged in the first vent hole (9119a), and a sealing adhesive is isolated by burying the first end surface of the optical fiber holder (912) in the wrapping cavity (9112).
The present disclosure provides an optical module, comprising: a circuit board provided with an optical chip; a lens assembly covering the optical chip, wherein a first sealing member is arranged between the lens assembly and the circuit board, the first sealing member is located on the outer side wall of the lens assembly and the surface of the circuit board, a wrapping cavity is formed in one end of the lens assembly, the lens assembly is provided with a recessed optical port slot and a blocking assembly, at least part of the blocking assembly covers the optical port slot so as to block a cooling liquid from permeating into the optical port slot, the optical port slot is provided with a reflecting surface, and the reflecting surface is configured to reflect an optical signal; and an optical fiber holder, wherein an optical fiber is fixed on one end of the optical fiber holder, and the other end of the optical fiber holder is fixed in the wrapping cavity; a first end face of the optical fiber holder is buried in the wrapping cavity, a second sealing member is arranged between the optical fiber holder and the wrapping cavity, and the second sealing member is located between side surfaces of the optical fiber holder and the outer side surfaces of three side walls of the wrapping cavity away from the circuit board, and located around one side wall of the wrapping cavity close to the circuit board.
An optical module (200), comprising a cover shell (910), a base (920), an optical waveguide substrate (900a), a turning prism (502), an optical receiving chip (503), a laser chip (402), a reflector (405), and a displacement prism (407), wherein the base (920) comprises a partition (923), an upper-layer space (924), and a lower-layer space (925); the optical waveguide substrate (900a) is optically coupled to an internal optical fiber, such that a corresponding first input optical port (901a), first output optical port (902a), second input optical port (903a), and second output optical port (904a) are respectively provided on different sides of the optical waveguide substrate (900a), thereby transmitting an optical receiving signal and an optical emitting signal; the laser chip (402) is arranged in the lower-layer space (925) and located in a different layer from that of the optical waveguide substrate (900a), and the laser chip (402) is electrically connected to the other surface of a circuit board (300); in order to guide to the second input optical port (903a) the optical emitting signal generated by the laser chip (402), the reflector (405) is disposed on an output optical path of the laser chip (402), so that the reflector (405) reflects towards a side wall of the partition (923) the optical emitting signal generated by the laser chip (402); and the displacement prism (407) is disposed on the side wall of the partition (923), the displacement prism (407) has an input end facing the layer of the laser chip (402), and an output end facing the second input optical port (903a), thereby guiding into the optical waveguide substrate (900a) the optical emitting signal reflected outwards by the reflector (405).
Provided in the present disclosure is an optical module, comprising a lens assembly and an optical fiber holder, wherein an enclosure cavity is provided in the end of the lens assembly facing the optical fiber holder; a second lens is provided in the enclosure cavity; the optical fiber holder encloses an optical fiber; there is a gap between an optical-fiber end face of the optical fiber and the second lens; and the optical-fiber end face of the optical fiber and a first end face of the optical fiber holder are both bevel faces. The enclosure cavity comprises a stop protrusion, wherein the stop protrusion protrudes from the second lens, and the face of the stop protrusion facing the optical fiber holder is a stop face; and the stop face is a bevel face, and is in contact connection with the first end face. In the optical fiber holder and lens assembly of the present disclosure, the stop face and the first end face of the optical fiber holder are both bevel faces, such that the connection between the optical fiber holder and the lens assembly in the lengthwise direction of the lens assembly is realized.
An optical module (200) comprises a tube body (910), a light emitting component (400), a light receiving component (500) and an optical assembly (920). The optical assembly (920) is located in the tube body (910); the light emitting component (400) and the light receiving component (500) are both connected to the tube body (910); the light emitting component (400) is used for emitting emitted light; and the light receiving component (500) is used for receiving first reflected light. A receiving tube cap (502) of the light receiving component (500) is provided with a first lens (501); a light blocking member (950) covers the first lens (501); the light blocking member (950) is provided with a first light through hole (951); the optical assembly (920) comprises a light processing member; the light processing member is located on a light exit path of second reflected light and is configured to process the second reflected light; the tube body (910) is provided with an extinction cavity; and the extinction cavity is in communication with an inner cavity of the tube body (910) by means of a third light through hole (908). An extinction member is attached to the inner wall of the extinction cavity, and an isolation member (924) is provided at the third light through hole (908).
Provided in the present disclosure is an optical module, comprising: a circuit board; an optical receiving component, which is arranged on the circuit board and is used for receiving a received optical signal comprising multiple wavelengths, wherein the optical receiving component comprises: a first lens assembly comprising a first lens body, an accommodating groove being provided in the first lens body, the bottom of the first lens body being connected to the circuit board, the accommodating groove and the circuit board defining an accommodating cavity, the received optical signal being input at one end of the first lens body, a reflective surface being provided on a side wall of the accommodating groove, and the reflective surface being configured to reflect the optical signal; a demultiplexer, which is arranged in the accommodating groove and is configured to receive the received optical signal and transmit the demultiplexed optical signal to the reflective surface; and an optical receiving chip, which is surface-mounted on the circuit board and is located in the accommodating cavity, the optical receiving chip receiving the optical signal reflected by the reflective surface.
An optical module (200), comprising a circuit board (105) and a light emitting component (400). The light emitting component (400) comprises a housing (410), a first flexible circuit board (440), an electrical connector (420), and a support member (450). A first wire bonding area is formed on the surface of the first flexible circuit board (440). One end of the electrical connector (420) is separately provided with a first step (422a1) and a second step (423a1). A wire bonding area is formed on the surface of the first step (422a1). In order to achieve wire bonding between the first flexible circuit board (440) and the first step (422a1), a support member (450) is provided on the second step (423a1), the support member (450) is fixedly connected to the second step (423a1), and the first flexible circuit board (440) is supported by means of the support member (450), so that the first wire bonding area on the surface of the first flexible circuit board (440) is flush with the second wire bonding area on the surface of the first step (422a1), thereby implementing a wire bonding process between the first flexible circuit board (440) and the first step (422a1). The high-frequency signal transmission quality can be improved.
An optical module (200), comprising a lower housing (202), an upper housing (201), a circuit board (300), an optical component, an optical fiber adapter (700), an optical cable plug (900), a protective sleeve, and an unlocking component (600). The upper housing (201) and the lower housing (202) form a cavity. The optical fiber adapter (700) is located in the cavity, and the optical fiber adapter (700) comprises a snap-fit clip (710) and an optical fiber plug (720). The optical cable plug (900) comprises an insertion portion (901), a connection portion (906), and an annular sliding sleeve (905). The protective sleeve comprises a first protective sleeve (910) and a second protective sleeve (920), the first protective sleeve (910) is snap-fitted to the second protective sleeve (920), and the annular sliding sleeve (905) is located in the first protective sleeve (910) and the second protective sleeve (920); and the protective sleeve abuts against side surfaces of the upper housing (201) and of the lower housing (202). The unlocking component (600) comprises a handle (610) and an unlocking device, the unlocking device is snap-fitted onto side plates of the upper housing (201), and the handle (610) is rotatably connected to the unlocking device. Switching between an optical fiber optical module and an optical cable optical module is achieved by means of the optical cable plug (900); the detachment of the optical cable plug (900) is prevented by means of the protective sleeve; and the rotatable structure of the unlocking component facilitates the mounting of the protective sleeve on the optical cable plug (900).
An optical module (200), comprising: a circuit board (300), a light receiving component (500), and a digital signal processor chip (301). The light receiving component (500) and the digital signal processor chip (301) are both located on the upper surface of the circuit board (300). The light receiving component (500) comprises a light receiving chip (504). The digital signal processor chip (301) is connected to the circuit board (300) by means of a solder ball. A transimpedance amplifier chip is integrated inside the digital signal processor chip (301), a first solder ball of the transimpedance amplifier chip is provided on the lower surface of the digital signal processor chip (301), and the light receiving chip (504) is connected to the first solder ball of the digital signal processor chip (301). A first placement recess (310a) recessed inwards is provided on the upper surface of the circuit board (300), and the light receiving chip (504) is provided in the first placement recess (310a). The difference between the depth of the first placement recess (310a) and the thickness of the light receiving chip (504) is within a first preset range, such that the height difference between a high-frequency signal pin of the light receiving chip (504) and the first solder ball is within the first preset range.
An optical module (200), comprising an upper shell (201), a lower shell (202), a circuit board (300), optical components (400, 500), and an optical connecting component (900) mounted on the circuit board (300). A cavity formed by the upper shell (201) and the lower shell (202) has only one opening (204) for accommodating the optical connecting component (900) and a goldfinger (301) on the circuit board (300). Optical devices of the optical components (400, 500) are electrically connected to the circuit board (300), and comprise a first optical emitting component connected to the optical connecting component (900) through a first ribbon optical fiber cable, and a second optical emitting component connected to the optical connecting component (900) through a second ribbon optical fiber cable. The optical connecting component (900) comprises an optical fiber fixing piece (902), a plug-in connector (904) and a ferrule element (905) connected to the plug-in connector (904), wherein the optical fiber fixing piece (902) comprises a connecting part and an inserting part (9021) which are connected, an accommodating cavity into which the plug-in connector (904) is inserted being formed in the connecting part, and a cavity (910) in communication with the accommodating cavity being formed in the inserting part (9021); the ferrule element (905) is inserted into the cavity (910) through the plug-in connector (904); optical fibers connected to the optical components (400, 500) run through the accommodating cavity to be optically connected to the ferrule element (905); and a clearance gap (9045) is formed in the plug-in connector (904), and the first ribbon optical fiber cable and the second ribbon optical fiber cable run through the clearance gap (9045).
Provided in the present disclosure is an optical module (200), comprising: a circuit board (300), in which a mounting hole (302) is formed; a light-emitting component (400) embedded in the mounting hole (302), the light-emitting component (400) comprising an emitting base (410) embedded in and connected to the mounting hole (302), a light-emitting assembly arranged on the emitting base (410) and connected to a surface of the circuit board (300) in a wire bonding manner for generating 2N paths of optical signals, where N ≥ 1, and a collimating lens group (440) located in an output optical path of the light-emitting assembly; a first light receiving component (510) arranged on the circuit board (300) for receiving N paths of optical signals, the first light receiving component (510) being connected to the surface of the circuit board (300); and a second light receiving component (520) arranged on the circuit board (300) for receiving N paths of optical signals, the second light receiving component (520) being connected to the surface of the circuit board (300). A second optical fiber (721) is connected to the first light receiving component (510), and the second optical fiber (721) passes through the side of the emitting base (410); and a third optical fiber (731) is connected to the second light receiving component (520), and the third optical fiber (731) passes through the side of the emitting base (410).
The present disclosure provides an optical module, comprising: a first optical transmitter chip, a second optical transmitter chip, a first amplitude-limiting driver chip, a second amplitude-limiting driver chip, and a micro control unit. A first input end of a third switch is connected to the first amplitude-limiting driver chip, a second input end of the third switch is connected to the micro control unit, and a second output end of the third switch is connected to the first amplitude-limiting driver chip. The second amplitude-limiting driver chip is connected to a first output end of the third switch. At a first temperature, the first optical transmitter chip transmits first wavelength signal light, and the second optical transmitter chip transmits third wavelength signal light. At a second temperature, the first optical transmitter chip transmits second wavelength signal light, and the second optical transmitter chip transmits fourth wavelength signal light. The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light increase sequentially. The ratio of a high temperature difference to an ambient temperature threshold is less than or equal to 40%.
Provided in the embodiments of the present disclosure is an optical module, comprising: a circuit board, which is provided with a digital signal processing assembly, a depressed area being formed on the surface of the circuit board; and an optical receiving component, comprising an optical receiving chip which is configured to receive an optical signal and is located in the depressed area, the difference between the depth of the depressed area and the thickness of the optical receiving chip being within a first preset range, such that the height difference between a high-frequency signal pin of the optical receiving chip and a signal connection end of the digital signal processing assembly is within the first preset range, wherein the signal connection end of the digital signal processing assembly and the depressed area are located on the same surface of the circuit board. The optical module further comprises a receiving bottom board, which is embedded in the depressed area, the optical receiving component being located on the receiving bottom board, and the elastic modulus of the receiving bottom board being greater than that of the circuit board.
Provided in the embodiments of the present disclosure is an optical module, comprising: a circuit board, wherein a notch is formed in the surface thereof, a first connecting part is formed on the side wall of the notch, and the circuit board is provided with a signal pin area; a light transmitting component, located at the notch, the light transmitting component comprising an electric connector, the electric connector being provided with a bonding pad area, the bonding pad area being connected to the signal pin area, a second connecting part being formed on the end face of the electric connector facing the circuit board, and the second connecting part being embeddedly connected to the first connecting part, so as to achieve a relatively fixed connection between the electric connector and the circuit board; a carrying component, connected to the light transmitting component or the circuit board, the carrying component being configured to adjust the position of the light transmitting component at the notch, such that the signal pin area is flush with the bonding pad area; and a protective component, provided on the circuit board, the protective component being configured to protect the connection between the signal pin area and the bonding pad area.
An optical module (200), the optical module (200) comprising: a circuit board (300), a surface of which is provided with an optical transmitting chip (310) and an optical receiving chip (320); and a lens assembly (400), wherein the bottom of the lens assembly (400) is connected to the circuit board (300) and the lens assembly (400) covers the optical transmitting chip (310) and the optical receiving chip (320); the lens assembly (400) comprises a lens assembly body (430), a first optical fiber adapter (410) and a second optical fiber adapter (420); the first optical fiber adapter (410) and the second optical fiber adapter (420) are arranged at a first end of the lens assembly body (430), the first optical fiber adapter (410) is configured to transmit an emitted-light signal, and the second optical fiber adapter (420) is configured to transmit a received-light signal; the distance between the center of the optical transmitting chip (310) and the center of the optical receiving chip (320) in a direction perpendicular to the optical axis of the first optical fiber adapter (410) and the optical axis of the second optical fiber adapter (420) is less than the distance between the optical axis of the first optical fiber adapter (410) and the optical axis of the second optical fiber adapter (420); and the lens assembly body (430) is provided with a first optical face (4311), a second optical face (4321), a third optical face (4331) and a fourth optical face (4341).
The present invention provides an optical module, comprising a circuit board, a power supply chip, a DSP chip, a light receiving component, an MCU, and a light transmitting component. The power supply chip is electrically connected to gold fingers on a circuit board, and supplies power to the DSP chip; the light receiving component is electrically connected to the DSP chip; and the MCU is separately connected to the power supply chip and the DSP chip. The MCU is configured to: control the power supply chip to output a power supply voltage; acquire the power supply voltage and a reception parameter in the DSP chip, wherein the reception parameter comprises a bit error rate and a signal-to-noise ratio at a receiving side; when a temperature changes, determine whether the reception parameter exceeds a target range; when the reception parameter does not exceed the target range, control the power supply chip to decrease the outputted power supply voltage value; and when the reception parameter exceeds the target range, control the power supply chip to increase or decrease the outputted power supply voltage value. According to the optical module, when the temperature changes, a reception parameter of the optical module is changed by adjusting a power supply voltage of a DSP chip, such that the high performance and low power consumption of the optical module are guaranteed.
The present disclosure provides an optical module, comprising a circuit board and a transceiver housing. The transceiver housing is provided with a notch, and the circuit board extends into the transceiver housing through the notch. One surface of the circuit board is provided with a first light receiving chip and a second light receiving chip, and the other surface of the circuit board is provided with a third light receiving chip. A second prism, a first prism, a wavelength division multiplexer, a first displacement prism set, a second displacement prism set and a third displacement prism set are respectively arranged in the transceiver housing. The wavelength division multiplexer comprises a first light outlet, a second light outlet and a third light outlet. The first displacement prism set is arranged corresponding to the first light outlet and is configured to adjust the transmission direction of a fifth wavelength optical signal and raise an optical path of the fifth wavelength optical signal. The second displacement prism set is arranged corresponding to the second light outlet and is configured to raise the optical path of the fifth wavelength optical signal. The third displacement prism set is arranged corresponding to the third light outlet and is configured to guide the transmission direction of a sixth wavelength optical signal on one surface of the circuit board to the other surface of the circuit board.
The present disclosure provides an optical module. The optical module comprises a circuit board and a light emitting component electrically connected to the circuit board; the light emitting component comprises a transmitting tube shell, pins, and a grounding member and a light emitting assembly which are located in the transmitting tube shell; insertion holes are formed in one side of the transmitting tube shell; one end of each pin is electrically connected to the circuit board, and the other end of the pin is inserted into the insertion hole; the pins are sealedly connected to the insertion holes by means of insulating members; the pins comprise grounding pins connected to the transmitting tube shell and high-speed signal pins inserted into the transmitting tube shell; the grounding member is attached to the inner wall of the transmitting tube shell; the grounding member surrounds the high-speed signal pins; the projection area of the grounding member on the transmitting tube shell covers some of the insulating members; and laser groups of the light emitting assembly are respectively connected to the high-speed signal pins and the grounding member by means of wire bonding so as to generate signal light. According to the present disclosure, the grounding member is additionally arranged on the periphery of the high-speed signal pins, so that the distance between the high-speed signal pins and the GND is reduced by means of the grounding member, thereby achieving impedance matching between the high-speed signal pins and the laser groups.
An optical module, comprising: a circuit board; and a light emitting component having one end electrically connected to the circuit board. The light emitting component comprises a bottom plate; the bottom plate comprises a first placement recess and a supporting plate; a laser chip set and a first focusing lens set are arranged in the first placement recess; an optical transmission component is arranged in the supporting plate; and an optical signal emitted by the laser chip set is converged by the first focusing lens set and is then coupled to the optical transmission component. The supporting plate comprises: an adaptation base protruding from the upper surface of the supporting plate, the optical transmission component being located above the adaptation base; and an adhesive spilling groove located on at least one side of the adaptation base. The supporting plate is provided with a limiting portion, and the limiting portion protrudes from the upper surface of the adaptation base; and the side wall of the optical transmission component is connected to the limiting portion.
The present disclosure provides an optical module, comprising a circuit board and a light emitting component. A driver on the circuit board comprises a first output end and a second output end, which respectively output a first modulation signal and a second modulation signal. In the light emitting component, a first modulation unit is connected to the first output end by means of a first path, and a second modulation unit is connected to the second output end by means of a second path. The first modulation unit performs first modulation on an optical signal according to the first modulation signal, and the second modulation unit performs second modulation on the optical signal according to the second modulation signal. The first modulation and the second modulation are in-phase modulations. The in-phase modulations comprise: when the first modulation signal and the second modulation signal are the same signals, the attributes of the first modulation unit and the second modulation unit are different, and a phase reverse circuit is arranged on the first path or the second path; when the first modulation signal and the second modulation signal are differential signals, the attributes of the first modulation unit and the second modulation unit are the same, and a phase reverse circuit is arranged on the first path or the second path.
An optical module (200), comprising: a circuit board (300) provided with a notch (310), and an optical transceiver component (400) comprising an optical transceiver housing (500). A first support plate (510) is formed on one side of the optical transceiver housing (500), and a second support plate (520) and a third support plate (530) are formed on another side of the optical transceiver housing (500), the first support plate (510) being located above the second support plate (520), and a gap (570) being formed between a bottom surface of the second support plate (520) and a top surface of the third support plate (530). The optical transceiver housing (500) is located in the notch (310), and the gap (570) has an embedded connection to the circuit board (300) having the notch (310) in its edge. The optical module also comprises: a first light-emitting assembly (410a), disposed on the top surface of the first support plate (510); a second light-emitting assembly (410b), disposed on the bottom surface of the first support plate (510); a first light-receiving assembly (420a), disposed on the second support plate (520); a second light-receiving assembly (420b), disposed on the third support plate (530); a first upper cover (430), connected to the optical transceiver housing (500) and covering the first light-emitting assembly (410a) and the first light-receiving assembly (420a); and a second upper cover (440), connected to the optical transceiver housing (500) and covering the second light-emitting assembly (410b) and the second light-receiving assembly (420b).
An optical module (200), comprising a circuit connection board (300a) and an optical receiver (500), wherein the optical receiver (500) comprises a case. A recess (301a) is formed on one end of the circuit connection board (300a), the surface of the recess (301a) comprising a first side wall (301a1), a second side wall (301a2), and a connecting face (301a3) disposed between the first side wall (301a1) and the second side wall (301a2). One end of the case is provided with a clearance hole (515); and a first step (511), a second step (512), a third step (513) and a fourth step (514), which are located at sequentially increasing heights, are formed on a bottom surface of the case, such that different optical elements are arranged by means of the steps at different heights. The clearance hole (515) allows the circuit connection board (300a) to extend into the case until the recess (301a) surrounds the periphery of the second step (512); the first step (511) is used for supporting the circuit connection board (300a); and the second step (512) is used for supporting an optical receiving chip (550) and a TIA (560). The surface of the recess (301a) consists of the first side wall (301a1), the second side wall (301a2), and the connecting face (301a3) disposed between the first side wall (301a1) and the second side wall (301a2); and the recess (301a) of this form allows for an increase in the orientations and regions for pad arrangement, thereby facilitating the layout of bonding wires of the optical receiving chip (550) and the TIA (560), and shortening the length of said bonding wires.
In an optical module provided in the present disclosure, one end of an optical fiber adapter is configured to connect to an external optical fiber; an optical accommodating component is connected to the other end of the optical fiber adapter; a light-emitting component comprises a second cavity; one end of the second cavity is connected to the optical accommodating component; and a first-wavelength optical signal, a second-wavelength optical signal and a third-wavelength optical signal outputted by the light-emitting component are input into the optical accommodating component, and are transmitted to the external optical fiber by means of the optical fiber adapter. The optical accommodating component comprises: a first cavity inside which an accommodating inner cavity is formed, wherein one end of the first cavity is connected to the optical fiber adapter, and the other end thereof is connected to the second cavity, and a second connecting hole, a third connecting hole and a fourth connecting hole are provided in a second side of the first cavity; an optical assembly, which is arranged in the accommodating inner cavity; a first light-receiving component, which is connected to the second connecting hole; a second light-receiving component, which is connected to the third connecting hole; and a third light-receiving component, which is connected to the fourth connecting hole. A circuit board is electrically connected to the light-emitting component, the first light-receiving component, the second light-receiving component and the third light-receiving component.
An optical module (200), comprising a first light shaping assembly (540) or a second light shaping assembly, a filter assembly (560), and photoelectric assemblies (570, 580), wherein the filter assembly (560) is located on a light exit path of the first light shaping assembly (540) or the second light shaping assembly; photosensitive surfaces of the photoelectric assemblies (570, 580) face the filter assembly (560); the first light shaping assembly (540) converts a second light signal into a first light sub-beam and a second light sub-beam, which each include first signal light and second signal light, the wavelength of the first signal light being different from the wavelength of the second signal light; and the central axis of the first light shaping assembly (540) coincides with a bisector of an included angle between the first light sub-beam and the second light sub-beam.
G02B 6/34 - Moyens de couplage optique utilisant des prismes ou des réseaux
G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
An optical module, comprising a lower casing (202), a circuit board (300) mounted in the lower casing (202) and a digital signal processor connected, by means of solder balls, to the circuit board (300). Opposite side surfaces of the circuit board (300) are respectively in contact with lower side plates (2022) of the lower casing (202). The circuit board (300) comprises an upper layer plate (303), at least one heat conduction plate (304, 305) and a lower layer plate (306) which are stacked, a heat conduction layer (3019) being plated on the upper layer plate (303), the heat conduction layer (3019) being in contact with the lower side plates (2022), and grounding solder balls (3021) at the edge of the digital signal processor being connected to the heat conduction layer (3019). A heat-conducting connection block (312) is provided in the upper layer plate (303), and grounding solder balls (3021) on the inner side of the digital signal processor are connected to the grounding solder balls (3021) at the edge of the digital signal processor by means of the heat-conducting connection block (312). The at least one heat conduction plate (304, 305) is in contact with the lower side plates (2022), and a heat conduction via hole is provided between the upper layer plate (303) and the at least one heat conduction plate (304, 305), two ends of the heat conduction via hole being respectively connected to the grounding solder balls (3021) and the at least one heat conduction plate (304, 305). Heat of the digital signal processor is transferred to the side wall of the lower casing (202) by means of the circuit board (300), thereby increasing heat dissipation channels and improving heat dissipation efficiency.
An optical module (200), comprising an optical transceiver component (400). The optical transceiver component (400) comprises: a rounded square tube (401), which is provided with a rounded square tube (401) accommodating cavity, and a first tube opening (40131), a second tube opening (4011) and a third tube opening (40134) in communication with the rounded square tube (401) accommodating cavity; an adjusting ring, which is provided with an adjusting ring accommodating cavity, and a first end and a second end in communication with the adjusting ring accommodating cavity, wherein the first end of the adjusting ring is fixedly connected to the first tube opening (40131) of the rounded square tube (401); a light-emitting assembly (402), which is in communication with the first tube opening (40131) of the rounded square tube (401) by means of the adjusting ring, wherein the light-emitting assembly (402) is provided with a light-emitting assembly accommodating cavity, and the second end of the adjusting ring is fixed in the light-emitting assembly accommodating cavity; a light-receiving assembly (403), which is arranged in the second tube opening (4011); an optical fiber adapter (405), which is arranged in the third tube opening (40134); and an optical assembly (404), which is partially arranged inside the rounded square tube accommodating cavity, is partially arranged inside the adjusting ring accommodating cavity, and extends into the light-emitting assembly (402). The optical assembly (404) comprises: a first lens (4042), which is provided at one end of the optical assembly (404), and is used for collimating an optical signal emitted by the light-emitting assembly (402); a second lens (4043), which is provided at the other end of the optical assembly (404), faces the optical fiber adapter (405), and is used for coupling an optical signal in the rounded square tube (401) to the optical fiber adapter (405) and for collimating an optical signal incident into the rounded square tube (401) from the optical fiber adapter (405); and a light guide member (4041), which is located between the first lens (4042) and the second lens (4043), and is provided with a first end and a second end, wherein the first end of the light guide member (4041) is connected to the first lens (4042), and the second end of the light guide member (4041) is connected to the second lens (4043). The light guide member (4041) is provided with a light-splitting film or an optical filter, and is used for transmitting into the second lens (4043) the optical signal collimated by the first lens (4042) and for reflecting to the light-receiving assembly (403) the optical signal collimated by the second lens (4043). The first lens (4043) is arranged in the light-emitting assembly (402); and the first end of the light guide member (4041) is inserted into the adjusting ring accommodating cavity, and the second end of the light guide member (4041) and the second lens (4043) are arranged in the rounded square tube accommodating cavity.
An optical module (200), a substrate (600) being provided on the surface of a circuit board (300), and the substrate (600) has a clamping groove. A light receiving portion comprises two light receiving assemblies (503, 504), the two light receiving assemblies (503, 504) both being disposed at the clamping groove. The two light receiving assemblies (503, 504) each comprise a receiving tube cap (5032), a receiving tube base (5031) and a light splitting device (5036, 5038). The light splitting device (5036, 5038) is fixedly connected to the receiving tube cap (5032), the light splitting device (5036, 5038) comprises a light splitting member and at least two lenses (50363, 50365), and the at least two lenses (50363, 50365) are each fixedly connected to the light splitting member. The light splitting member has at least two light splitting films, the at least two light splitting films dividing a received beam of data light into at least two beams of data light. The at least two beams of data light are coupled to corresponding light receiving chips (5034, 5035), respectively, by means of the lenses. The light receiving portion comprises light receiving assemblies (503, 504), the light receiving assemblies (503, 504) being fixed on the circuit board (300) by means of the substrate (600). The light receiving assemblies (503, 504) comprise the light splitting devices (5036, 5038), the light splitting devices (5036, 5038) being used to split light to enable the light receiving components (503, 504) to achieve at least dual-channel receiving functions.
An optical module (200), comprising a circuit board (300) and a light receiving component (500). The light receiving component (500) is electrically connected to the circuit board (300). The light receiving component (500) comprises a tube base (510), a tube cap (520), a support (530) and an optical assembly (540). The top surface of the tube base (510) is provided with a first photoelectric detector (512) receiving a light signal having a first wavelength, and a second photoelectric detector (513) receiving a light signal having a second wavelength. The bottom of the tube cap (520) is connected to the tube base (510), and covers the tube base (510) to form a sealed cavity with the tube base (510). The support (530) is provided in the sealed cavity and has a chamber. The optical assembly (540) is provided on the support rack (530), and is located above the first photoelectric detector (512) and the second photoelectric detector (513). The optical assembly (540) is configured to separate the optical signal having the first wavelength and the optical signal having the second wavelength according to the wavelength in a beam of optical signals, transmit the optical signal having the first wavelength to the first photoelectric detector (512), and transmit the optical signal having the second wavelength to the second photoelectric detector (513). The optical assembly (540) comprises a light splitting sheet (541) located above the first photoelectric detector (512), a reflecting sheet (542) located above the second photoelectric detector (513) as well as an optical filter (543), all of which are located in the chamber.
An optical module (200), comprising a circuit board (300), a first object placement member (600), a second object placement member (900), a first digital signal processing chip (301), a second digital signal processing chip (302), a first light-emitting component (400), a first light-receiving component (500), a second light-emitting component (401) and a second light-receiving component (501), wherein the first light-emitting component (400) is located on the second object placement member (900), and both the first light-emitting component (400) and the first light-receiving component (500) that is located on an upper surface of the circuit board (300) are connected to the first digital signal processing chip (301); the second light-emitting component (401) is located on a lower surface of the first object placement member (600), and both the second light-emitting component (401) and the second light-receiving component (501) that is located on the upper surface of the circuit board (300) are connected to the second digital signal processing chip (302); the first object placement member (600) is provided with a notch (602) and a hollow region (604); a second receiving optical fiber is wound from one face of the first object placement member (600) to the other face by means of the notch (602), and a second emitting optical fiber is wound from one face of the first object placement member (600) to the other face by means of the hollow region (604), such that the second light-emitting component (401) and the second light-receiving component (501) are connected to an optical fiber connector group (800) by means of optical fibers; the second receiving optical fiber is an optical fiber for connecting the optical fiber connector group (800) to the second light-receiving component (501); and the second emitting optical fiber is an optical fiber for connecting the optical fiber connector group (800) to the second light-emitting component (401).
The present disclosure provides an optical module and a received optical power calibration method therefor. The optical module comprises a circuit board, a photoelectric detector and an MCU. The photoelectric detector is electrically connected to the circuit board, and is used to convert an optical signal into an electric signal. The MCU comprises a first register, the first register being used to store a compensation rule used for receiving an optical power ADC sampling value, the compensation rule comprising a deviation value of a received optical power ADC sampling value of a selected wavelength relative to a received optical power ADC sampling value of a reference wavelength. The MCU is configured to: acquire a received optical power calibration function of the reference wavelength; perform compensation on the received optical power ADC sampling value of the corresponding wavelength according to the compensation rule, to obtain a received optical power ADC compensation value; and obtain a corresponding received optical power report value according to the received optical power calibration function of the reference wavelength and the received optical power ADC compensation value of the corresponding wavelength.
H04B 10/69 - Dispositions électriques dans le récepteur
H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données
The present disclosure provides an optical module, comprising a circuit board and a transceiving component. The optical transceiving component comprises a tube base and an optical device. The tube base comprises: a tube base body, provided with a through hole running through a top surface and a bottom surface of the tube base body, a first optical device being supported on the top surface; a grounding pin, one end of which is connected to a conductive layer, the conductive layer being disposed in the through hole, and an insulating layer being disposed between the conductive layer and the tube base body; and a high frequency pin, one end of which passes through the conductive layer, the conductive layer surrounding around an edge of the high frequency pin, an insulating layer being disposed between the conductive layer and the high frequency pin, and the end of the high frequency pin passing through the conductive layer being electrically connected to the first optical device. Alternatively, the tube base comprises: a tube base body, provided with a through hole running through a top surface and a bottom surface of the tube base body, a second optical device being supported on the top surface, a conductive wall being provided on the top surface, and the conductive wall surrounding an edge of the through hole; and a high frequency pin, one end of which passes through the through hole and is insulated from the tube base body, the end of the high frequency pin passing through the through hole being electrically connected to the second optical device.
The present disclosure provides an optical module, comprising a circuit board and a light emitting device. The light emitting device is electrically connected to the circuit board, and the light emitting device comprises: a tube base; a cap in snap-fit to the tube base to form a light emitting space; a base arranged on one side of the tube base and located in the light emitting space; pins, one end of each pin passing through and protruding out of the tube base; and a metal ceramic substrate arranged on one side of the base, the bottom surface of the metal ceramic substrate abutting against the tops of the pins. The maximum distance between the metal ceramic substrate and the base is larger than the minimum distance between the pin and the base. The other end of the pin passes through the tube base and protrudes out of the light emitting space. The light emitting device further comprises a laser chip connected to the pins; and a flexible circuit board having one end sleeved on the pins and the other end connected to the circuit board, wherein a matching resistor is arranged on the flexible circuit board, and the sum of the impedance of the matching resistor and the impedance of a laser driving chip is equal to the impedance of the laser chip.
H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données
The present disclosure provides an electrical port module, which comprises a circuit board, a network port terminal, and a PHY chip and an MCU arranged on the circuit board. The end part of the circuit board is provided with a gold finger comprising an I2C pin and a multiplexing pin. The PHY chip comprises a state register used for storing a state register value corresponding to a link state of the network port terminal. One end of the MCU receives an instruction of a host device through the I2C pin, and the other end of the MCU is connected to the PHY chip to obtain a state register value and send a corresponding level signal to the multiplexing pin according to the state register value. A function configuration register in the MCU is configured to store a register value corresponding to the instruction of the host device, and the MCU performs corresponding function configuration on the multiplexing pin according to the register value, thus obtaining the link state of the network port terminal according to the level signal of the multiplexing pin. The present disclosure allows the multiplexing pin to have a new function, and the host device obtains the link state of the network port terminal by monitoring the level state of the multiplexing pin, thereby facilitating identification by a user.
A laser device (900) and an optical module (200). The optical module (200) comprises the laser device (900), which comprises a substrate, wherein the surface of the substrate is provided with a grating region (910) and a silicon waveguide region (920), and a III-V waveguide region (930) covers the entire upper surface of the grating region (910) and part of the upper surface of the silicon waveguide region (920). The grating region (910) comprises a first partition (911) and a second partition (912); the silicon waveguide region (920) comprises a first tapered silicon waveguide region (921), a second tapered silicon waveguide region (922) and a third tapered silicon waveguide region (923); and the III-V waveguide region (930) comprises a III-V linear waveguide region (931), a first III-V gradient waveguide region (932) and a second III-V gradient waveguide region (933). The laser device (900) is of an asymmetric waveguide coupling structure, the grating coupling coefficient of the grating region (910) showing partitioned differences, wherein the grating coupling coefficient of the first partition (911) is greater than the grating coupling coefficient of the second partition (912), such that the reflection on the side of the first partition (911) is improved, thereby realizing single-ended, high-power and single-wavelength output of the laser device (900), and improving the optical power and reducing the power consumption thereof.
H01S 5/10 - Structure ou forme du résonateur optique
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique
50.
OPTICAL MODULE, AND METHOD FOR MONITORING TRANSMITTED OPTICAL POWER OF OPTICAL MODULE
Disclosed are an optical module, and a method for monitoring the transmitted optical power of an optical module. The optical module comprises: a circuit board, which is provided with a laser driving chip and an MCU; and a light transmitting component, which comprises a semiconductor laser, a backlight detector and a temperature sensor, wherein the backlight detector is used for receiving backlight of the semiconductor laser, and the temperature sensor is used for measuring the operating temperature of the semiconductor laser; the backlight detector is connected to the laser driving chip, the laser driving chip is connected to the MCU, and the laser driving chip obtains an ADC value and transmits same to the MCU; and the MCU acquires the ADC value and the current operating temperature of the semiconductor laser, determines a corresponding dark current compensation value and a corresponding optical power compensation value according to the current operating temperature, and uses the dark current compensation value and the optical power compensation value to compensate for the ADC value, which is measured by using the backlight detector, of the transmitted optical power of the optical module.
H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données
An optical module is provided in the present disclosure, which comprises: a circuit board; a light source; an optical modulation chip, said chip being electrically connected to the circuit board, and the optical modulation chip comprising an optical modulator, the optical modulator being configured to modulate direct current light that does not carry data into an optical signal; the optical modulator comprises: two interference arms; and optical power detection assemblies, which are at least arranged on light emergent sides of the two interference arms, and acquire detected voltages; an MCU is electrically connected to the circuit board, and the MCU is configured to adjust the detected voltages to preset voltages. By means of heaters or phase converters, the optical power of the optical modulator is adjusted, and the power consumption of the optical module is reduced.
An optical module (200), comprising a first circuit board (300) and a tunable laser module (600), wherein the tunable laser module (600) comprises a packaging cavity (600c) and a second circuit board (600a); a light-emitting chip (651), a functional electrical chip group, a wavelength selection component, a shifter (655) and a phase shifter (654) are respectively arranged inside the packaging cavity (600c); a second MCU and a power conversion chip (600a2) are arranged on a surface of the second circuit board (600a); the functional electrical chip group comprises an analog switch (665), a current driving chip (666) and a monitoring chip (667); the current driving chip (666) and the monitoring chip (667) are transferred into the packaging cavity (600c) to reduce the area of the second circuit board (600a), thereby reducing the volume of the tunable laser module (600); and according to a first enable control signal that is output by the second MCU, the analog switch (665) controls a polling connection between the current driving chip (666) and an object to be heated, and according to a second enable control signal that is output by the second MCU, the analog switch (665) also controls a polling connection between the monitoring chip (667) and an object to be monitored, so as to ensure the normal operation of the current driving chip (666) and the monitoring chip (667).
A pluggable electronic module, comprising: a housing, the housing consisting of an upper housing and a lower housing (202), the upper housing and the lower housing (202) defining a chamber for accommodating a circuit board (105), and the housing comprising an unlocking motion guide structure for limiting the motion position of a unlocking device (2032), a position-fixing protrusion (2021) provided on the outer wall of the housing, and a first pivotable position-fixing component provided on the side surface, wherein the position-fixing protrusion (2021) and the unlocking motion guide structure are arranged on the same surface of the housing; and an unlocking mechanism (203), comprising a handle (2031) and an unlocking device (2032). The handle (2031) is provided with a second pivotable position-fixing component and an unlocking surface, and the handle (2031) is pivotably connected to the housing by means of the fitting connection of the second pivotable position-fixing component and the first pivotable position-fixing component. A reset spring (2033) is provided in an accommodation chamber of the unlocking motion guide structure, and the reset spring (2033) connects the unlocking device (2032) and the housing. One side of the unlocking device (2032) is inserted into the accommodation chamber of the unlocking motion guide structure, and the end part of the other side of the unlocking device opposite to said side is in contact with the unlocking surface. Thus, when the handle (2031) rotates, an applied force drives the unlocking device (2032) to slide on the housing; during unlocking, the applied force drives the unlocking device (2032) to slide and compress the reset spring (2033) until the locking of the position-fixing protrusion (2021) by an external device is released; and after unlocking, as the applied force is removed, the compressed reset spring (2033) drives the unlocking device (2032) to slide on the housing, and the unlocking device (2032) slides to drive the handle (2031) to rotate to be reset.
Disclosed is an optical module, comprising: a light source; a local oscillator optical fiber having one end connected to the light source and the other end connected to an optical fiber splice; a coherent optical chip comprising a receiving optical fiber coupling port, a local oscillator optical fiber coupling port, a transmitting optical fiber coupling port, a polarization rotation beam splitter configured to split received signal light into first received signal light and second received signal light, a receiving coupling power monitor configured to monitor coupling optical power of the receiving optical fiber coupling port, and a transmitting coupling power monitor configured to monitor coupling optical power of the transmitting optical fiber coupling port; and a circuit board provided with an MCU electrically connected to the receiving coupling power monitor and the transmitting coupling power monitor. In a mounting coupling stage, the coupling precision of the optical fiber splice and the coherent optical chip is obtained by reading monitoring data of the receiving coupling power monitor and the transmitting coupling power monitor in the MCU, thereby facilitating mounting and adjustment.
An optical module (200), comprising: a semiconductor gain chip (4051), a silicon optical chip (4052), a wavelength calibration member (4062), and a second power monitor (4063). The silicon optical chip (4052) comprises: an input coupler (40521), a directional coupler (40522), a wavelength adjustable optical component, a second power splitter (40525), a third power monitor (40528), and an output coupler (405210). The input coupler (40521) is configured to receive a light beam emitted by the semiconductor gain chip (4051) and emit a light beam of a specific wavelength to the semiconductor gain chip (4051). The third power monitor (40528), the wavelength calibration member (4062) and the second power monitor (4063) form a wavelength locking optical component, so that the wavelength locking optical component implements wavelength locking according to the ratio of the optical power of the second power monitor (4063) to the optical power of the third power monitor (40528).
An optical module (200), comprising: a light source (401) and a circuit board (300), wherein the light source (401) comprises a package cavity (410), which is provided with a connecting pin (420), the connecting pin (420) is connected to the circuit board (300), the circuit board (300) is provided with several functional electric chips (460), and the functional electric chips (460) are connected to the connecting pin (420), such that the light source (401) emits local oscillator light of a specific wavelength, and one end of a local oscillator optical fiber is connected to the light source (401), and the other end thereof is connected to an optical fiber connector (504). A coherent optical chip (501) comprises: a receiving optical fiber coupling port (5111), a local oscillator optical fiber coupling port (5112) and a transmitting optical fiber coupling port (5113). A polarization rotation beam splitter (5121) splits received signal light into first received signal light and second received signal light. A receiving coupled power monitor (5122) monitors a coupled light power of the receiving optical fiber coupling port (5111). A transmitting coupled power monitor (5143) monitors a coupled light power of the transmitting optical fiber coupling port (5113). The circuit board (300) is provided with an MCU, which is electrically connected to the transmitting coupled power monitor (5143) and the receiving coupled power monitor (5122). Monitoring data of the receiving coupled power monitor (5122) and the transmitting coupled power monitor (5143) in the MCU may be read, such that the coupling precision between the optical fiber connector (504) and the coherent optical chip (510) is obtained, and the mounting and adjustment thereof are facilitated.
An optical module (200), comprising a circuit board (300), an optical fiber support (500), and a lens assembly (400). The circuit board (300) is provided with an optoelectronic chip, an optical fiber is fixed within the optical fiber support (500), and a positioning hole (502) is provided on a side surface at one end of the optical fiber support (500). The lens assembly (400) covers the optoelectronic chip, a side surface at one end of the lens assembly (400) is provided with a positioning post (402) and a support arm, and the positioning post (402) and the positioning hole (502) are arranged opposite to each other. The optical fiber support (500) is provided with a boss, and the support arm supports the boss, so that there is a gap between the optical fiber support (500) and a surface of the circuit board (300). A side surface of the lens assembly (400) is provided with a recess (403), a first lens (404) is disposed in the recess (403), and the optical fiber is in coupled docking connection with the first lens (404). The optical fiber support (500) is positioned by means of the positioning post (402), the positioning hole (502), and the lens assembly (400), and the optical fiber support (500) is supported and fixed by means of the support arm, which not only increases the stability of the optical fiber support (500) and the lens assembly (400), but also suspends the optical fiber support (500). The optoelectronic chip, a signal line, etc. can be placed on the circuit board (300) under the optical fiber support (500), so that a layout space on the circuit board (300) is increased.
An optical module (200), comprising a circuit board (206) and an optical transceiving component (207) electrically connected to the circuit board (206). The optical transceiving component (207) comprises an optical transmitting component (300), wherein the optical transmitting component (300) comprises a header (310), a laser assembly (400), and a flexible circuit board (370). The header (310) comprises: a header body (311) provided with the laser assembly (400) on the top; a high-frequency pin (312) embedded to the header body (311) and insulated from the header body (311), one end of the high-frequency pin protruding from the top surface of the header body (311) and being electrically connected to the laser assembly (400); and a first grounding pin (3131) and a second grounding pin (3132) which are provided on two sides of the high-frequency pin (312), a first boss (3133) being provided at the joint of the first grounding pin (3131) and the header body (311), and a second boss (3134) being provided at the joint of the second grounding pin (3132) and the header body (311). A high-frequency connection hole (371), a first grounding connection hole (372), and a second grounding connection hole (373) are formed in the flexible circuit board (370), the first boss (3133) is embedded in the first grounding connection hole (372), and the second boss (3134) is embedded in the second grounding connection hole (373).
An optical module (200), comprising a circuit board (300), a first support member (400), a laser component and a detector component, wherein a golden finger is provided at one end of the front surface of the circuit board (300), a welding pin is provided at the other end thereof, and the golden finger is electrically connected to the welding pin by means of a signal wire arranged on the front surface of the circuit board (300); one end of the first support member (400) supports and fixes the circuit board (300), the first support member (400) is provided with a through hole (4101), and the through hole (4101) is located below the circuit board (300); the laser component is arranged on the front surface of the first support member (400) and is electrically connected to the welding pin by means of wire bonding; and the detector component is arranged on the back surface of the circuit board (300), is located in the through hole (4101) and is electrically connected to a signal wire arranged on the back surface of the circuit board (300), the detector component is configured to convert received light into an electrical signal, and the electrical signal is transmitted by means of the signal wire. The first support member (400) in support connection with the circuit board (300) is additionally arranged in the optical module, and a light-emitting component and a light-receiving component are directly arranged on a carrier composed of the first support member (400) and the circuit board (300), such that a BOX packaging structure is omitted, and the miniaturized development of the optical module (200) is facilitated.
An optical module (200), comprising an upper casing (201) and a lower casing (202). The upper and lower casings (201, 202) form an enclosing chamber; with respect to the enclosing chamber, one end is provided with a first electrical interface, and the other end is provided with a first optical interface (210), a second optical interface (220) and a second electrical interface (230); the optical module (200) further comprises a pluggable module (300); with respect to the pluggable module (300), one end is provided with a first optical fiber connector (310), a second optical fiber connector (320) and a third electrical interface (330), and the other end is provided with a third optical interface (361) and a fourth optical interface (362); the pluggable module (300) further comprises a functional chip (350); with respect to the first optical fiber connector (310), one end is connected to the first optical interface (210), and the other end is connected to the functional chip (350) by means of an optical fiber, so as to allow an optical signal to pass through the functional chip (350); with respect to the second optical fiber connector (320), one end is connected to the second optical interface (220), and the other end is connected to the functional chip (350) by means of an optical fiber, so as to allow an optical signal to pass through the functional chip (350); the second electrical interface (230) is connected to the third electrical interface (330) so as to supply power to the functional chip (350).
An optical module (200), comprising a circuit board (300), an optical fiber adapter (700), and first and second optical transceiver assemblies (400, 500a). The front surface of the circuit board (300) is provided with a mounting hole (302) and first and second data processors (310, 320). The first optical transceiver assembly (400) is electrically connected to the first data processor (310) and is hard-connected to the optical fiber adapter (700); and the second optical transceiver assembly (500a) comprises a second tube housing (501a), a first transmitting cover plate (502a), and optical transmitting and receiving devices. The first transmitting cover plate (502a) is provided on the front surface of the circuit board (300) and has a first preset angle with a light transmission direction; and the optical transmitting device comprises an optical processing assembly, and a laser and a translation prism assembly which are provided on the top surface of the second tube housing (501a) by means of the mounting hole (302). The optical processing assembly is provided on the first transmitting cover plate (502a) and is connected to the optical fiber adapter (700) by means of an optical fiber pigtail; and the optical receiving device is provided in an accommodating cavity on the back surface of the second tube housing (501a) and is connected to the optical fiber adapter (700) by means of the optical fiber pigtail.
Provided in the present disclosure is an optical module, comprising: a circuit board and a light-emitting component. The light-emitting component comprises a third substrate, a light-emitting chip and a first lens. One end of the third substrate is electrically connected to the circuit board. The light-emitting chip is arranged above the third substrate, and the first lens is located on a light output optical path of the light-emitting chip. The side of the first lens facing the light-emitting chip is a convex surface; and a reflective coating is provided on the convex surface of the first lens, and reflects a portion of signal light. A photoelectric detector is provided between the first lens and the light-emitting chip, and is configured to receive the reflected signal light. A lower surface of the reflective coating is higher than a central axis of the first lens; or an upper surface of the reflective coating is lower than the central axis of the first lens.
An optical module (200), comprising a circuit board (300), an optical chip (420) and an electronic chip (410), wherein the electronic chip (410) is stacked on a surface of the circuit board (300) by means of first solder balls (430). The electronic chip (410) comprises a first front face (4101), a first back face (4102) and a plurality of electrically conductive through holes, wherein one side of each electrically conductive through hole is connected to the first solder ball (430); and signal lines, which are connected to the electrically conductive through holes, are arranged on the side face of the electronic chip (410) that faces away from the circuit board (300). The area of the optical chip (420) is less than the area of the electronic chip (410). The optical chip (420) comprises a second front face (4201) and a second back face (4202), the second front face (4201) being stacked on the electronic chip (410) by means of second solder balls (440), and the second solder balls (430) being connected to the other sides of the signal lines. By using the electronic chip (410) as an adapter board, the optical chip (420) is mounted on the electronic chip (410) by means of a flip-chip soldering process; and by using a mature TSV process for the electronic chip (410), high-frequency signal transmission between the optical chip (420), the electronic chip (410) and the circuit board (300) is realized via the shortest path, thereby ensuring the integrity of a high-frequency signal. In addition, a gold wire bonding process is eliminated, such that the density of connection ports between the optical chip (420), the electronic chip (410) and the circuit board (300) is improved, thereby realizing the high-density layout of the circuit board (300).
An optical module (200), comprising a circuit board (300) and an optical transceiving assembly (400). The circuit board (300) is provided with a hollowed-out area (3033). The optical transceiving assembly (400) comprises an upper cover (4011) covering the circuit board (300), a tranceiving tube seat (4012), and an optical assembly. The tranceiving tube seat (4012) comprises a tube seat body (40121) and a second supporting protrusion (40124), and forms a storage cavity together with the upper cover (4011). The second supporting protrusion (40124) is provided with a first storage slot (40122) and a first supporting protrusion (40123) and is engaged in the hollowed-out area (3033). The optical assembly is located in the storage cavity and comprises a laser chip (4021), a lithium niobate chip (4024), and other devices. The laser chip (4021) and other devices are all located at a first end of the second supporting protrusion (40124), and the lithium niobate chip (4024) is located at a second end of the second supporting protrusion (40124). The laser chip (4021) is located in the first storage slot (40122). The lithium niobate chip (4024) is located on the first supporting protrusion (40123).
An optical module (200), comprising an optical transceiver component (400). The optical transceiver component (400) comprises a transceiver housing (401), a light-emitting component (402), a light-receiving component (403), an optical fiber adapter (404), and a third circuit board (303). The light-emitting component (402), the light-receiving component (403) and the optical fiber adapter (404) are sequentially disposed in an orifice of the optical transceiver component (403). The third circuit board (303) is inserted into the orifice. A first optical filter (40212), an optical modulation chip (4024), a second lens (4025), a second optical filter (4026), and a third optical filter (40213) are provided in the transceiver housing (401). A laser chip (4021) and a first lens (4022) are provided inside the light-emitting component (402). A third lens (4027) and a light-receiving chip are provided inside the light-receiving component (403). The optical modulation chip (4024) comprises a substrate and an optical modulation film layer, and the optical loss is less than 10 dB. The optical modulation film layer is laid on the substrate, and has a thickness of less than 100 μm. The laser chip (4021) provides high-power light, and the optical loss of the optical modulation chip (4024) is less than the optical loss of a silicon optical chip, so that optical signals modulated by the optical modulation chip (4024) meet the requirements of optical power of the light emitted by a 50G PON.
An electro-absorption modulated laser and an optical module. The electro-absorption modulated laser comprises: a substrate (580), and a DFB quantum well (513) and an EAM quantum well (522) arranged side by side above the substrate (580); an N-side electrode (570) arranged below the substrate (580); a grating layer (512) arranged above the DFB quantum well (513); a conductive covering layer (590) arranged above the grating layer (512) and the EAM quantum well (522); and a high-reflection coating layer (540) and an anti-reflection coating layer (550) which form a closed space with the N-side electrode (570) and the conductive covering layer (590), wherein a window region (560) is provided between the anti-reflection coating layer (550) and the conductive covering layer (590); the window region comprises an InP filling region (562) and an InGaAs light-absorbing region (561); and the InP filling region (562) is located between the substrate (580) and the InGaAs light-absorbing region (561).
H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
Provided is an optical module (200), comprising a circuit board (206) and at least one carrier coherent assembly, wherein the carrier coherent assembly comprises a U-shaped groove cover shell, a U-shaped groove substrate and a carrier assembly. A first U-shaped groove is formed in a surface of the U-shaped groove cover shell, and the first U-shaped groove is configured to avoid a connecting plate and expose an optical waveguide of a silicon optical chip. A second U-shaped groove is formed in a surface of the U-shaped groove substrate, and the second U-shaped groove is configured to raise the height of the silicon optical chip and carry out the transfer of an electrical signal. The carrier assembly comprises a laser box, the silicon optical chip, an optical fiber connector, the connecting plate, a first electronic chip and a second electronic chip. The U-shaped groove substrate is electrically connected to the circuit board (206), and the silicon optical chip is electrically connected to the U-shaped groove substrate, such that a signal transmitted between the circuit board (206) and the silicon optical chip is transferred by means of the double U-shaped groove substrate. By means of the layout forms of the carrier coherent assembly, the carrier coherent assembly is integrated inside the optical module (200), thereby improving the transmission rate of the optical module (200).
Provided in the present disclosure is an optical module. The optical module comprises a circuit board, a laser driving chip, a laser and a heating element, wherein the laser driving chip, the laser and the heating element are arranged on the circuit board, and the laser is electrically connected to the laser driving chip; the circuit board comprises a first heat transfer layer, a filling layer and a second heat transfer layer which are stacked, and the first heat transfer layer is located on the circuit board and forms a gap with the laser driving chip; the heating element is located on the first heat transfer layer, and the first heat transfer layer surrounds the laser and is spaced apart from the periphery of the laser by the gap, so as to transfer heat to the laser; and a plurality of heat conduction through holes are formed between the second heat transfer layer and the first heat transfer layer, the first heat transfer layer is connected to the second heat transfer layer by means of the heat conduction through holes, and the second heat transfer layer is connected to the laser by means of the heat conduction through hole in contact with the laser. According to the present disclosure, the circuit board is provided with the first and second heat transfer layers which are connected by means of the heat conduction through holes, the first heat transfer layer surrounds the laser, and heat of the heating element is transferred to the laser by means of the first and second heat transfer layers, so that more heat is transferred, and the heat transfer efficiency is higher.
An optical module, comprising an optical transceiver component (400). The optical transceiver component (400) comprises a transceiver housing (401) and a third circuit board (303), wherein the transceiver housing (401) is provided with an optical window (401212) at a first end, an insertion port (401213) at a second end, and an optical component inside; and a first optical signal in the transceiver housing (401) is emitted via the optical window (401212), and a second optical signal in an optical fiber adapter (404) is directed into the transceiver housing via the optical window (401212). A first lens (4022) couples high-power light to an optical modulation chip (4024), which comprises a substrate and an optical modulation thin-film layer, and has an optical loss of less than 10 dB, the optical modulation thin-film layer being laid on the substrate, and having a thickness of less than 100 μm; a second lens (4025) collimates a modulated optical signal to obtain a collimated optical signal; a second optical filter (4026) transmits the collimated optical signal to the optical fiber adapter (404); a third lens (4027) couples to a receiving deflection prism (40210) the second optical signal, which is reflected by the second optical filter (4026); and the receiving deflection prism (40210) reflects the second optical signal to an optical receiving chip (4028).
The present disclosure provides a circuit board and an optical module. The circuit board comprises a top layer, a bottom layer, and a plurality of middle layers stacked between the top layer and the bottom layer; the top layer is provided with a data processing chip and first and second rows of golden fingers, and the first row of golden fingers are closer to the edge of the circuit board than the second row of golden fingers; first and second rows of hollowed-out areas corresponding to the first and second rows of golden fingers are provided on the middle layers, first and second high-speed signal line groups are provided on one middle layer, one side of the first high-speed signal line group is connected to the second row of golden fingers, one side of the second high-speed signal line group passes through the first row of hollowed-out areas to be connected to the first row of golden fingers, and the other side of the first high-speed signal line group and the other side of the second high-speed signal line group are connected to the data processing chip by means of a first through hole between the middle layers and the top layer. According to the present disclosure, a plurality of high-speed signal lines are provided on the middle layers of the circuit board, no high-speed signal line is provided on the top layer, and the high-speed signal lines pass through the hollowed-out areas to be connected to the golden fingers, so that the layout space of the top layer is saved, and the high-speed performance of the optical module is improved.
An optical module (200), comprising an upper shell (201), a lower shell (202), and an optical fiber array (500). A first recess (20111) is formed in the upper shell (201), and a second recess (20211) is formed in the lower shell (202). A third recess (20212) is formed in a housing formed by the upper shell (201) and the lower shell (202), wherein the third recess (20212) is located on two sides of the first recess (20111) and is communicated with the first recess (20111), or the third recess (20212) is located on two sides of the second recess (20211) and is communicated with the second recess (20211). A first elastic conductive member (701) is placed in the first recess (20111), a second elastic conductive member (702) is placed in the second recess (20211), the first elastic conductive member (701) is connected to the second elastic conductive member (702), and the optical fiber array (500) is located at the joint of the first elastic conductive member (701) and the second elastic conductive member (702). An elastomeric connector (800) separately connected to the upper shell (201) and the lower shell (202) is placed in the third recess (20212). The width of the first recess (20111) communicated with the third recess (20212) is less than the width of the second recess (20211), or the width of the second recess (20211) communicated with the third recess (20212) is less than the width of the first recess (20111).
An optical module, comprising: a circuit board (300); a light emitting component (400), comprising: an emitting base (410) fixedly mounted in a mounting hole (302); multiple light emitting chips (401), disposed in the emitting base (410), electrically connected to the circuit board (300), and used to generate multiple signal lights having different wavelengths; a multiplexer (4041, 4042), disposed on the emitting base (410), located in a light emitting direction of a signal light, and used to combine the signal lights of different wavelengths into a first sub-signal light beam and a second sub-signal light beam, signal light wavelengths in the first sub-signal light beam not being adjacent, and signal light wavelengths in the second sub-signal light beam not being adjacent; and a polarization combiner (4051, 4052), disposed on the emitting base (410), located in a light emitting direction of the multiplexer (4041, 4042), and used to rotate a polarization direction of the first sub-signal light beam, and combine the rotated first sub-signal light beam and the second sub-signal light beam into a composite signal beam. The emitting base (410) is provided with a first mounting surface (4119a) and a second mounting surface (4120a), a height of the first mounting surface (4119a) being lower than a height of the second mounting surface (4120a), the light emitting chip (401) being mounted on the first mounting surface (4119a), and the multiplexer (4041, 4042) and the polarization combiner (4051, 4052) being mounted on the second mounting surface (4120a).
An optical module (200). A laser box (500) thereof comprises a top opening (570A), a box body bottom surface (570), and a plurality of side walls; a side wall light exit opening (5131), a side wall insertion port (511), and a side wall electrical connection port (540) are respectively formed in the side walls; the side wall light exit opening (5131) and the side wall electrical connection port (540) are located on different side walls; a first cover plate groove (5132) is provided on different side walls from the side wall insertion port (511), and is communicated with the side wall insertion port (511); a first cover plate (530) is inserted into the first cover plate groove (5132) from the side wall insertion port (511), and is located above the side wall light exit opening (5131) to block the top opening (570A); a second light window (520) blocks the side wall light exit opening (5131); an inner wall layer (519) and a limiting plate (518) are respectively connected to the side walls of the box body and separated from each other, and a gap between the inner wall layer (519) and the limiting plate (518) forms a second cover plate groove (5133); the inner wall layer (519) extends to the box body bottom surface (570), and the limiting plate (518) is located below the first cover plate (530); and a second cover plate (550) is inserted into the second cover plate groove (5133) to separate the first cover plate (530) from the box body bottom surface (570).
An optical module. The optical module comprises a circuit board (300), a light emitting component (500), a first light receiving component (600), a second light receiving component (700), and a rounded square tube body (400), wherein the light emitting component (500) comprises a laser chip (544) and a first lens (543); the light emitting component (500) is configured to emit a first wavelength emitting light; the first light receiving component (600) is configured to receive a first wavelength reflected light, the first wavelength reflected light being light reflected back from the first wavelength emitting light by the outside of the optical module; the second light receiving component (700) is configured to receive a second wavelength receiving light; each of the light emitting component (500), the first light receiving component (600) and the second light receiving component (700) is connected to the rounded square tube body (400); and an optical assembly is provided inside the rounded square tube body (400), and comprises a beam splitter (820), a light absorber (830), a reflector (870), a first filter (850), a second filter (860), a third filter (880), and a second lens (890). A dual-lens system is formed by the first lens (543) and the second lens (890), so that the optical coupling efficiency is improved; and one emitting and two receiving functions of the optical module are realized by means of the optical assembly.
An optical module (200), comprising circuit boards (301, 302) and an optical transceiving component (400). A first circuit board (301) is connected to a second circuit board (302) by means of a fixing support (500), and positioning holes (3011, 3012) are respectively formed in the first circuit board (301) and the second circuit board (302). The optical transceiving component (400) is connected to the first circuit board (301) by means of a flexible circuit board (304). The flexible circuit board (304) comprises a connecting flexible circuit board (3041) and sub-flexible circuit boards (3042, 3043). The fixing support (500) comprises a positioning column (502) and a support column (503). The positioning column (502) is fitted in the positioning holes (3011, 3012), is provided with a limiting protrusion (50212), and comprises first, second, third, and fourth sub-positioning columns (5021, 5022, 5023, 5024). The support column (503) is connected to the lower surface of the first circuit board (301). The limiting protrusion (50212) is connected to the upper surface of the second circuit board (302). The vertical distance between the first sub-positioning column (5021) and the optical transceiving component (400) is less than the vertical distance between the third sub-positioning column (5023) and the optical transceiving component (400), and the vertical distance between the second sub-positioning column (5022) and the optical transceiving component (400) is less than the vertical distance between the fourth sub-positioning column (5024) and the optical transceiving component (400). The first circuit board (301) and the second circuit board (302) are fixed by means of the fixing support (500), thereby facilitating assembly of the optical module (200).
A laser (400) and an optical module (200). The laser (400) comprises a gain chip (411), a first wave plate (413), a Faraday magneto-optic crystal (414), a polarization beam combiner (415), a second wave plate (416), a polarization beam splitter (417), a first reflecting mirror (418), and a second reflecting mirror (419). A light beam generated by the gain chip (411) sequentially passes through the first wave plate (413), the Faraday magneto-optic crystal (414), the polarization beam combiner (415), the second wave plate (416), and the polarization beam splitter (417); at this time, the light beam is divided into a first polarization component and a second polarization component, the first polarization component is transmitted out, and the second polarization component is reflected from the polarization beam splitter (417) to the first reflecting mirror (418), and is returned to the gain chip (411) through the second reflecting mirror (419), the polarization beam combiner (415), and the Faraday magneto-optic crystal (414), to collide with a light beam generated by the gain chip (411) so as to achieve gain, thereby continuously and stably outputting optical signals; the included angle between the optical axis of the second wave plate (416) and a second directional axis is variable, so as to adjust the size of the first polarization component, thereby adjusting the optical power of the transmitted optical signals.
An optical module (200), comprising a housing formed by covering a lower shell (400) with an upper shell (300), and an unlocking component (500) provided outside the housing. The lower shell (300) comprises: a bottom plate (410) and a first lower side plate (420) and a second lower side plate (430) provided on two sides of the bottom plate (410). The unlocking component (500) comprises a first unlocking portion (521) and a second unlocking portion (522). A first reed (600) is provided on the inner wall of the first unlocking portion (521), and the first reed (600) has one end fixedly connected to the first unlocking portion (521) and the other end movably connected to the first unlocking portion (521). The central area of the first reed (600) protrudes towards the first lower side plate (420), and the width of the first reed (600) is less than or equal to that of the first unlocking portion (521). A second reed (700) is provided on the inner wall of the second unlocking portion (522), and the second reed (700) has one end fixedly connected to the second unlocking portion (522) and the other end movably connected to the second unlocking portion (522). The central area of the second reed (700) protrudes towards the second lower side plate (430), and the width of the second reed (700) is less than or equal to that of the second unlocking portion (522).
Provided in the present application are an optical module and a laser assembly. The optical module comprises an optical emitting component, wherein the optical emitting component is configured to emit an optical signal, and the optical emitting component comprises a laser assembly. The laser assembly comprises: a substrate, a top surface thereof being provided with a positive electrode layer and a negative electrode layer, wherein there is a gap between the positive electrode layer and the negative electrode layer, several first metal layers and several second metal layers are arranged in the gap, the first metal layers are electrically connected to the positive electrode layer, the second metal layers are electrically connected to the negative electrode layer, and the first metal layers and the second metal layers are arranged in a crossed manner; and a laser chip, which is mounted on the negative electrode layer, wherein a positive electrode wire is connected to the positive electrode layer. By means of the optical module and the laser assembly provided in the present application, the bandwidth of the laser assembly can increase in a suitable frequency range, and the flatness of a bandwidth curve of the optical module can also be ensured.
An optical module (200), comprising: a circuit board (300), which is provided with a first DSP chip (310) and a second DSP chip (320) on a front surface, is provided with an optical receiving assembly (600) on a back surface, is provided with electrical connectors on a front surface and a back surface of one end portion, and is provided with detector sets (305, 306) on a back surface of the other end portion; a case (401), which is provided with protruding reflecting prisms (4208, 4209) on a bottom side portion, with reflecting surfaces of the reflecting prisms (4208, 4209) facing photosensitive surfaces of the detector sets (305, 306), the front surface of the circuit board (300) being electrically connected to the inside of the case (401) by means of bonding wires, the first DSP chip (310) being electrically connected to the detector sets (305, 306) and the bonding wires, and the second DSP chip (320) being electrically connected to the optical receiving assembly (600); and an optical fiber adapter (700), which comprises optical fiber connection ports arranged in upper and lower layers and inserted into the case (401).
An optical module (200), comprising a light emitting assembly (500). The light emitting assembly (500) comprises a TEC (511b) and a tube base (510b); the TEC (511b) comprises a first substrate and a second substrate, the first substrate and the second substrate being arranged oppositely in parallel; the surface of the TEC (511b) is provided with an inclined cushion block (900), the inclined cushion block (900) having a triangular section; the inclined cushion block (900) comprises an inclined surface, a preset angle being formed between the inclined surface and the surface of the first substrate; the surface of the inclined cushion block (900) is provided with a laser chip substrate (512b), the surface of the laser chip substrate (512b) being provided with a laser chip (513b), and an optical signal generated by the laser chip (513b) being obliquely emitted out along the inclined surface.
An optical module, comprising a circuit board. One end of the circuit board is provided with a goldfinger which comprises a power supply pin and a low-power-consumption control pin. An optical chip, an MCU and a load switch are provided on the surface of the circuit board. A first register and a comparator are provided in the MCU. The reference voltage of the comparator is stored in the first register. An upper computer outputs the preset voltage by means of the low-power-consumption control pin and transmits the preset voltage to the MCU. The comparator built in the MCU generates an interrupt flag bit according to the preset voltage and the reference voltage, and generates a first interrupt flag bit when the preset voltage is less than the reference voltage. The MCU interrupts a current action according to the first interrupt flag bit and sends a first control signal to the load switch. The load switch is turned off according to the first control signal so as to stop supplying power to the optical chip, and thus the optical module enters a low-power-consumption mode.
H04B 10/80 - Aspects optiques concernant l’utilisation de la transmission optique pour des applications spécifiques non prévues dans les groupes , p. ex. alimentation par faisceau optique ou transmission optique dans l’eau
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
An optical module (200), comprising a first substrate (4025). A first notch area (40253), a second notch area (40254), a first signal transmission area (40251), and a second signal transmission area (40252) are provided on the first substrate (4025); the first and second notch areas (40253, 40254) each are formed by recessing a first side surface and a bottom surface of the first substrate (4025) inwards; a first pin (40231) is provided in the first notch area (40253); a second pin (40232) is provided in the second notch area (40254); the first signal transmission area (40251) and the second signal transmission area (40252) both extend downwards from the first side surface of the first substrate (4025) to top surfaces of the corresponding notch areas; the surfaces of the first and second signal transmission areas (40251, 40252) are respectively provided with first and second signal line transmission layers; the first pin (40231) is connected to the first signal line transmission layer; the second pin (40232) is connected to the second signal line transmission layer; and a laser chip (4026) is provided on a surface of the second signal line transmission layer.
An optical module, comprising: a circuit board, on which a data processor (310) is provided; an optical transmitting assembly (400a), which is electrically connected to the data processor (310), and comprises a laser array (410a) and a first lens assembly (420a), wherein the laser array (410a) is arranged on the circuit board (300), and is configured to transmit multiple optical signals, which are synthesized into multiple beams of composite light in the first lens assembly (420a); an optical receiving assembly (400b), which is electrically connected to the data processor (310), and comprises a detector array (410b) and a second lens assembly (420b), wherein the detector array (410b) is arranged on the circuit board (300), the second lens assembly (420b) is configured to split the multiple beams of input composite light, and received light after splitting is converged to the detector array (410b); and an optical fiber adapter (600), which is connected to the optical transmitting assembly (400a) by means of a transmitting optical fiber array (500a), is connected to the optical receiving assembly (400b) by means of a receiving optical fiber array (550b), and is configured to transfer the multiple optical signals.
An optical module (200), comprising: a circuit board (206); and a light transceiving component (207) electrically connected to the circuit board (206), the light transceiving component comprising a light receiving component (300), and the light receiving component (300) being used for receiving first signal light and second signal light. The light receiving component (300) comprises: a header (310), a first light receiving chip (312) and a second light receiving chip (313) being provided on the top surface, the first light receiving chip (312) being used for receiving the first signal light, the second light receiving chip (313) being used for the second signal light, and the first signal light and the second signal light having different wavelengths; a cap (320), the bottom of the cap being connected to the header (310) and covering the cap (320); and an optical assembly support (330), having an optical assembly provided therein, the optical assembly being used for splitting the first signal light and the second signal light and transmitting same to the first light receiving chip (312) and the second light receiving chip (313). According to the optical module, the size of a multi-channel light transceiving component is effectively reduced, such that the development trend of miniaturizing the optical module is met.
Disclosed is an optical module, which comprises an optical transceiver assembly and a fiber optic adapter, wherein the optical transceiver assembly comprises a first tube shell, a light-splitting assembly arranged in the first tube shell, a light-emitting assembly connected to the first tube shell, a holder inserted into the first tube shell, and a light-receiving assembly; the first tube shell comprises an inner cavity; an optical element and an inclined surface positioned below the optical element are provided in the inner cavity; the inclined surface is configured to re-reflect light reflected by a transmission surface of the optical element; the light-splitting assembly comprises a support frame and a plurality of light splitters arranged on the support frame; a collimating lens is provided in the support frame; a converging lens at an end of the fiber optic adapter is inserted into the support frame; the light splitters are configured to split different wavelengths of light transmitted by the fiber optic adapter; the holder comprises a mounting groove provided with an inclined mounting surface; the mounting surface is in communication with the first tube shell; and the light-receiving assembly is arranged on the mounting surface.
An optical module, comprising a tube socket (4021). The tube socket (4021) is provided with a semiconductor cooler (4024). The semiconductor cooler (4024) comprises a first substrate (40241) and a second substrate (40243). The first substrate (40241) comprises a support plate (402411) and a heat dissipation plate (402412). The support plate (402411) is fixed on the top surface of the tube socket (4021), and is provided with a first electrode (4024116) and a second electrode (4024117). The heat dissipation plate (402412) is connected to the support plate (402411), is provided at a preset angle with the support plate (402411), and is connected to the second substrate (40243) by means of a semiconductor tube group. The second substrate (40243) is not in contact with the support plate (402411). The support plate (402411) is fixed to the top surface of the tube socket (4021), the support plate (402411) is provided at a preset angle with the heat dissipation plate (402412), and the second substrate (40243) is connected to the heat dissipation plate (402412) by means of the semiconductor tube group, which indicate that the semiconductor tube group is not perpendicular to the top surface of the tube socket (4021), such that the quantity of semiconductor tube groups and the area of the second substrate (40243) and the first substrate (40241) are not limited any more, the quantity of semiconductor tube groups and the area of the second substrate (40243) and the first substrate (40241) are increased, and the temperature control capability of the semiconductor cooler (4024) is further improved.
An optical module (200), comprising a circuit board (300) and a transceiving cavity (400a). An optical emitting component (600a) is provided inside the transceiving cavity (400a), and comprises an optical emitting chip. An optical receiving component (700a) is provided on a side wall of the transceiving cavity (400a), is provided with a second filter (701a) on the surface thereof, and comprises an optical receiving chip (704a), the arrangement height of the optical receiving chip (704a) being different from that of the optical emitting chip. A transceiver device (500a) is provided inside the transceiving cavity (400a), and comprises a first filter (503a). The first filter (503a) is obliquely arranged with respect to the bottom surface of the transceiving cavity (400a), so that emergent light of the first filter (503a) is obliquely emitted to the optical receiving chip (704a); and/or the first filter (503a) is arranged perpendicular to the bottom surface of the transceiving cavity (400a), and a displacement prism (507) is provided between the first filter (503a) and the second filter (701a), the displacement prism (507) being capable of changing the transmission direction and the transmission height of an optical signal entering the optical receiving chip (704a). The first filter (503a) is obliquely arranged, and/or the displacement prism (507) is provided between the first filter (503a) and the second filter (701a), thereby improving the optical coupling power.
An optical module, comprising: a laser driving chip; a circuit board (300) provided with a first sub-output bonding pad (30111) and a second sub-output bonding pad (30112) which are connected to differential output pins of the laser driving chip; a first capacitor (311) bridged between a first sub differential bonding pad (3105) and a first capacitor bonding pad (3106); a second capacitor (313) bridged between a second sub differential bonding pad (3108) and a second capacitor bonding pad (3109); a second differential line having one end connected to the second capacitor bonding pad (3109); a first resistor (312) bridged between a first negative electrode bonding pad and a first resistor bonding pad (3107), the other end of the first resistor bonding pad (3107) being connected to the first negative electrode bonding pad; and an EML (503), an EA matching resistor (5014) being connected in parallel to the EML (503), and the EML (503) being further connected to the second differential line.
H04B 10/43 - Émetteurs-récepteurs utilisant un seul composant en tant que source lumineuse et récepteur, p. ex. utilisant un photoémetteur comme photorécepteur
89.
LASER CHIP PREPARATION METHOD, LASER CHIP, AND OPTICAL MODULE
A laser chip (600) preparation method, a laser chip (600), and an optical module (200). The method comprises: growing, on a substrate layer (610) of an InP material, a substrate (620) comprising an aluminum indium gallium arsenide (AlInGaAs) quantum well structure; forming a SiO2 mask layer (630) on the upper surface of the substrate (620) by means of photoetching, and performing mask etching on the substrate (620) to obtain a mesa structure (640); performing in-situ CBr4 cleaning by using MOCVD, to grow a buried layer (650) along the mesa structure (640); growing a barrier layer (660) along the buried layer (650) by using the MOCVD; and then continuing the growth to obtain a laser chip (600) having a preset thickness. The etching surface of the mesa structure (640) can be protected by means of the buried layer (650), to prevent the outer surface of the mesa structure (640) from being oxidized by air, and reduce the difficulty of re-growth and facet coating in the subsequent process of obtaining the mesa structure (640); meanwhile, because the degree of oxidation of the outer surface of the mesa structure (640) by the air is low, a surface morphology can be improved, thereby ensuring the performance of the AlInGaAs quantum well laser chip (600).
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
H01S 5/34 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH]
Disclosed in the present disclosure are a circuit board and an optical module. The circuit board is applied to the optical module, and comprises a top layer and a bottom layer. A second intermediate layer is arranged between the top layer and the bottom layer, and comprises: a pin conductive portion, which is connected to a first power source pin by means of a first power supply via hole; and a conductive extension portion, which is connected to the pin conductive portion, wherein the middle area of the conductive extension portion is hollowed out. A first conductive branch is arranged between the top layer and the second intermediate layer, and is connected to the conductive extension portion by means of a third power supply via hole. A third intermediate layer and a second conductive branch are arranged between the bottom layer and the second intermediate layer, and the second conductive branch is connected to the conductive extension portion by means of a fifth power supply via hole, such that power can be supplied to electronic components at different positions, thereby saving on the space on the circuit board; and a finger grounding area is provided with a grounding hollowed-out area, and semi-encloses the pin conductive portion to shield the pin conductive portion, thereby preventing the electromagnetism of the pin conductive portion from interfering with an external signal.
An optical module, comprising a circuit board (300), an optical assembly electrically connected to the circuit board (300), and an optical fiber adapter (600) connected to the optical assembly by means of an optical fiber ribbon. The optical fiber adapter (600) comprises a clamping jaw (610), an optical fiber plug (620), a contact pin (640) and a fixing member (630). A penetrating light through hole is provided in the clamping jaw (610), and a reverse insertion boss (6120) is provided on the inner wall of one end of the light through hole. One end of the optical fiber plug (620) is inserted into the other end of the light through hole, and the optical fiber ribbon is fixed at the other end of the optical fiber plug (620). One end of the fixing member (630) is in contact with the end face of the optical fiber plug (620), and the other end thereof is clamped and fixed to the clamping jaw (610). The fixing member (630) is provided with a first through hole (6330) and a second through hole (6340) communicated with each other. The contact pin (640) comprises an exposure part (6410), a connection part (6420), and an insertion part (6430). The insertion part (6430) is smaller than the first through hole (6330) and is greater than the diameter size of the second through hole (6340), and the insertion part (6430) is inserted into the optical fiber plug (620). The connection part (6420) is smaller than the diameter size of the second through hole (6340), and the connection part (6420) is clamped in the second through hole (6340).
Disclosed is an optical module, comprising an upper housing; a lower housing fitting the upper housing by covering to form an enclosing cavity; a circuit board provided inside the enclosing cavity; a current providing circuit provided on the circuit board, one end of the current providing circuit being connected to a laser chip, and the current providing circuit being used for controlling driving of the laser chip; a temperature detector disposed on one side of the laser chip and monitoring the temperature of the laser chip; and an MCU connected to the temperature detector and the current providing circuit and adjusting the output voltage of the current providing circuit according to the temperature. In the present disclosure, the laser chip is directly driven by the current providing circuit, that is, an integrated laser driving chip is replaced with the independently designed current providing circuit, so that the circuit design is simplified, the module cost is reduced, and the dependence on the laser driving chip is eliminated.
An optical module. The optical module comprises a casing, a circuit board, and at least one of a transmitting optical assembly or a receiving optical assembly, the casing comprising an upper casing and a lower casing. The circuit board has a front surface facing the upper casing and a back surface facing the lower casing. The transmitting optical assembly or the receiving optical assembly is mounted on the circuit board and are in sealed connection with the circuit board. The transmitting optical assembly is configured to convert a first electrical signal from the circuit board into a first optical signal, and to transmit the first optical signal to the outside of the optical module. The receiving optical assembly is configured to convert a second optical signal from the outside of the optical module into a second electrical signal, and to transmit the second electrical signal to the circuit board.
An optical module (200), comprising: a circuit board (105) that is provided with a first signal pad; a flexible printed circuit (600), one end thereof being connected to the circuit board (105), and comprising a second conductive layer (540) at which a first signal pin and a grounding conductive region (544) are configured, the first signal pin being connected to the first signal pad by means of a first tin solder (3031); and a second cover film (550), attached to a lower surface of the second conductive layer (540), the second cover film (550) not covering the first signal pin and the first signal pad. The second cover film (550) covers a portion of the grounding conductive region (544).
An optical module (200), comprising a circuit board (300) provided with a mounting through hole (320), and a light emitting assembly (400). The light emitting assembly (400) comprises an emitting housing (401), a laser (410), an optical path translation prism (430), an emitting optical fiber array assembly, and an emitting cover plate (402). The emitting housing (401) covers the front side of the circuit board (300), and is sealedly connected to the front surface of the circuit board (300); and the emitting cover plate (402) is disposed on the back side of the circuit board (300), covers the mounting through hole (320), and is seadedly connected to the back surface of the circuit board (300). The emitting housing (401) comprises a mounting inner cavity having an opening in one side, and the mounting inner cavity is communicated with the mounting through hole (320) by means of the opening; the laser (410) in the mounting inner cavity is located on the back side of the circuit board (300) by means of the mounting through hole (320); and one end of the optical path translation prism (430) in the mounting inner cavity is located on the back side of the circuit board (300) by means of the mounting through hole (320), and the other end of the optical path translation prism (430) is located on the front side of the circuit board (300). One end of the emitting optical fiber array assembly is inserted into the mounting inner cavity, and an optical fiber array (810) is led out from the other end of the emitting optical fiber array assembly to be connected to an optical fiber adapter (700). By means of unique structural design of a multi-fiber light emitting assembly, complete closed packaging of an optical path is achieved, and the heat dissipation effect of the optical module is greatly improved.
An optical module, comprising a first laser, a first coupler, at least one modulator, and a vortex mode multiplexing assembly. The first laser emits first emission light, and the first emission light is Gaussian mode light. The first coupler is provided on a light emergent side of the first laser, and is configured to receive the first emission light and divide the first emission light into at least one path of sub-emission light and first pilot light. The at least one modulator is connected to the first coupler, and is configured to modulate the at least one path of sub-emission light, so as to generate at least one optical signal. The vortex mode multiplexing assembly is connected to the at least one modulator and the first coupler, and is configured to respectively convert the at least one optical signal and the first pilot light into different vortex modes, and combine same into a beam of vortex emission light.
Provided in some embodiments of the present disclosure is an optical module. The optical module comprises a shell, a circuit board, an optical receiving assembly, a first sub-optical fiber adapter and a first sub-internal optical fiber. The circuit board is located in the shell. The optical receiving assembly is located in the shell, is electrically connected to the circuit board, is configured to convert an optical signal from the outside of the optical module into an electric signal and to transmit the electric signal to the circuit board, and comprises an optical fiber fixing frame. The first sub-optical fiber adapter is fixedly connected to the shell, and is arranged opposite the end of the optical receiving assembly that is configured to receive the optical signal from the outside of the optical module. One end of the first sub-internal optical fiber is connected to the first sub-optical fiber adapter, and the other end thereof is wound around the optical fiber fixing frame in a circle and is then connected to the optical receiving assembly.
An optical module (200). The optical module (200) comprises a housing, a circuit board (300), and a first optical transceiver assembly (500), wherein the circuit board (300) is arranged in the housing; and the first optical transceiver assembly (500) comprises a first base (510), a first silicon photonics chip (530), a first light source (520), a first secondary circuit board (540), and a first digital signal processing chip (550). The first silicon photonics chip (530) is configured to receive and modulate light that does not carry a signal, so as to output light carrying the signal, or to receive an optical signal from the outside of the optical module (200); the first light source (520) is configured to provide the first silicon photonics chip (530) with the light that does not carry the signal; the end of the first secondary circuit board (540) that faces the first silicon photonics chip (530) is open, so as to form a first notch (541); the first silicon photonics chip (530) is arranged in the first notch (541); and the first digital signal processing chip (550) is arranged on the first secondary circuit board (540) and is electrically connected to the first silicon photonics chip (530) by means of the first secondary circuit board (540), so as to drive the first silicon photonics chip (530).
An optical module (200), comprising a round square tube body (401), a light-emitting member (402), a light-receiving member (403), and an optical assembly (404). The light-emitting member (402) and the light-receiving member (403) are both embedded in a tube opening of the round square tube body (401). The optical assembly (404) is arranged in an inner cavity of the round square tube body (401) and comprises a baffle (4045) and a first light filter (4041). The baffle (4045) is provided with a through hole, the edge of which is hermetically connected to an inner wall of the round square tube body (401), so as to block an area except the through hole. The first light filter (4041) is arranged on the through hole and bonded to a lower side of the baffle (4045) for absorbing light of other wavelengths except received light. The through opening corresponds to the light-receiving member (403). The baffle (4045) can not only emit the received light into the light-receiving member (403) through the through hole, but also block the light of other wavelengths except the received light from being emitted into the light-receiving member (403) through the sealing connection to the round square tube body (401), so that the light received by the light-receiving member (403) is almost entirely the received light and only a small amount of emitted light, further reducing the optical crosstalk and improving the crosstalk index.
Provided in the present disclosure is an optical module. The optical module comprises an optical receiving assembly, a microprocessor, a laser driving chip and a laser transmitting chip, wherein the optical receiving assembly is used for receiving a received optical signal carrying a first low-frequency message; the microprocessor is electrically connected to the optical receiving assembly, and is used for receiving the first low-frequency message and sending a power control signal according to the first low-frequency message; the laser driving chip is electrically connected to the microprocessor, and is used for receiving the power control signal and adjusting the power supply of the laser transmitting chip according to the power control signal, so as to adjust the transmit power of the laser transmitting chip; and the laser transmitting chip is electrically connected to the laser driving chip and is used for emitting a transmission optical signal. In the present disclosure, a low-frequency message for indicating and adjusting the transmit power of a laser transmitting chip is obtained by means of signal transmission between optical modules at two ends, and the laser transmitting chip is adjusted to an appropriate transmit power according to an actual optical network condition, thereby reducing the power consumption between the optical modules at the two ends, and thus achieving an optimal power consumption level.
brevets
