Abrégé

Provided in the present disclosure is an optical module, comprising a light emitting component and a light receiving component, wherein the light emitting component comprises a base, a first cover plate, a laser array, a first optical fiber array and a second optical fiber array. The first optical fiber array comprises a first optical fiber ribbon, and the second optical fiber array comprises a second optical fiber ribbon. A first opening is formed at the end of the first cover plate facing an optical port, so that the first optical fiber ribbon and the second optical fiber ribbon pass through the first opening. A first sealing portion is provided in the first opening to seal the first opening, thereby preventing a cooling medium from entering, through the first opening, a cavity formed by the base and the first cover plate, and thus being adapted to a liquid cooling environment. A barrier is provided between the base and the first cover plate and facing towards the first opening. The barrier comprises a plurality of baffles arranged at intervals, and a gap is formed between adjacent baffles, so that the first optical fiber ribbon and the second optical fiber ribbon pass through the gap.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a circuit board (300), an optical transmitting component (400), an optical receiving component (500), first flexible printed circuits (301a, 301b), second flexible printed circuits (302a, 302b) and third flexible printed circuits (303a, 303b). The optical receiving component (500) is arranged below the optical transmitting component (400), and the optical receiving component (500) supports and is connected to the optical transmitting component (400). The optical transmitting component (400) comprises a laser assembly (450), a backlight detection assembly (490) and an electrical connector (430), wherein the backlight detection assembly (490) is arranged on the electrical connector (430) so as to fully utilize the electrical connector (430) to implement optical power detection of the laser assembly (450). A first driver (320) is provided on the top surface of the circuit board (300), a first pad group (304) is provided on one side of the first driver (320), and a second pad group (305) is provided on the other side of the first driver (320). The electrical connector (430) comprises a first connection surface (431) and a second connection surface (432) arranged at one end, and a third connection surface (433) and a fourth connection surface (434) arranged at the other end. The laser assembly (450) is wire-bonded to the first connection surface (431) and then electrically connected to the first pad group (304) by means of the third connection surface (433) and the first flexible printed circuits (301a, 301b) in sequence. The backlight detection assembly (490) is wire-bonded to the second connection surface (432) and then electrically connected to the second pad group (305) by means of the fourth connection surface (434) and the second flexible printed circuits (302a, 302b) in sequence.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure are a home intelligent gateway and a wavelength switching method. The home intelligent gateway establishes a communication with an optical line terminal by means of an optical interface, and the intelligent gateway can switch a wavelength channel. The method comprises: in response to a wavelength switching event, first, setting the current of a regulator to execute wavelength switching of a second optical interface, and after the switching of the second optical interface is completed, setting the current of the regulator to execute wavelength switching of a first optical interface; and after the switching of the first optical interface is completed, sending a registration request by means of the second optical interface, so as to use the switched wavelength channel for communication. The method can reduce the power consumption of a wavelength switching process while ensuring accurate switching of a wavelength channel, thereby improving the stability and reliability of intelligent gateway devices.

Classes IPC  ?

• H04L 12/66 - Dispositions pour la connexion entre des réseaux ayant différents types de systèmes de commutation, p. ex. passerelles
• H04B 10/572 - Commande de la longueur d’onde

Abrégé

Disclosed is an optical module, comprising at least two MZM modulators. Each MZM modulator comprises a second optical splitter, interferometer arms, an optical combiner, a third optical splitter, a fourth optical splitter and an optical phase shifter; the second optical splitter, the interferometer arms, the optical combiner, the third optical splitter and the fourth optical splitter are successively connected; the fourth optical splitter is further connected to a first photodetector; the first photodetector is connected to an MCU, such that the MCU reads first monitoring light of the first photodetector, and calculates an output optical power on the basis of the first monitoring light. The optical phase shifters are arranged on interferometer arms, and the optical phase shifters are connected to the MCU, such that the MCU adds a sinusoidal perturbation to the current power of the optical phase shifters, and, on the basis the integral of the product of the power of the optical phase shifters to which the sinusoidal perturbation is added and the output optical power, adjusts the power output to the optical phase shifters; thus, the output optical power can dynamically stay at a minimum point, thereby avoiding deterioration or even failure of the optical shut-off effect caused by aging of optical chips.

Classes IPC  ?

• H04B 10/54 - Modulation d'intensité
• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure are an optical module, an optical coupler, and a preparation method for an optical coupler. The optical module comprises an optical chip, an optical fiber array, and an optical coupler. The optical coupler comprises a substrate, a refractive index difference layer, and a transmission waveguide layer. The optical coupler comprises a coupling waveguide, wherein the coupling waveguide is located in the transmission waveguide layer; and a first end of the coupling waveguide faces the optical fiber array, and a second end of the coupling waveguide faces the interior of the optical chip. In a direction from the first end to the second end, the width of the coupling waveguide tends to increase. The optical coupler comprises a first confinement waveguide and a second confinement waveguide. The first confinement waveguide comprises a first inclined surface, and the first inclined surface gradually inclines in a direction away from the central axis of the coupling waveguide, so as to gradually increase the distance to the coupling waveguide, thereby reducing coupling loss between the first confinement waveguide and the coupling waveguide. The second confinement waveguide comprises a second inclined surface, and the second inclined surface gradually inclines in a direction away from the central axis of the coupling waveguide, so as to gradually increase the distance to the coupling waveguide, thereby reducing coupling loss between the second confinement waveguide and the coupling waveguide.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, wherein an output pin of an MCU outputs a first voltage or a second voltage, and the optical module comprises: a control circuit, an enable control pin being connected to the output pin of the MCU, a first output pin being connected to a temperature regulator, and a second output pin outputting a third voltage; and a switching transistor, a gate electrode thereof being connected to the output pin of the MCU, a source electrode thereof being connected to the second output pin of the control circuit, and a drain electrode thereof being connected to a temperature detector. When the first voltage is greater than the third voltage, the source electrode and the drain electrode are connected, so that the third voltage can be transmitted to the temperature detector by means of the switching transistor, causing the temperature detector and the temperature regulator to operate. When second voltage is less than the third voltage, the source electrode and the drain electrode are disconnected, so that the third voltage cannot be transmitted to the temperature detector by means of the switching transistor, causing the temperature detector and the temperature regulator to stop operating. Both the temperature regulator and the temperature detector operate or stop operating, thereby preventing the temperature detector from being short-circuited due to condensation.

Classes IPC  ?

• H04B 10/25 - Dispositions spécifiques à la transmission par fibres

Abrégé

An optical module (200), comprising: a circuit board (300), wherein a first light-emitting chip (304) and a first light-receiving chip (303) are provided on the surface thereof; a first signal processing chip (305), which is electrically connected to the circuit board (300), wherein the first signal processing chip (305) is located on the same surface of the circuit board (300) as the first light-emitting chip (304) and the first light-receiving chip (303), the first signal processing chip (305) is electrically connected to the first light-emitting chip (304) and/or the first light-receiving chip (303), and heat on the surface of the first signal processing chip (305) is dissipated by means of a thermally conductive medium; and a first lens assembly (400), which is located on the same surface of the circuit board (300) as the first signal processing chip (305), wherein an open cavity (400b) is formed between the first lens assembly (400) and the surface of the circuit board (300), the open cavity (400b) has an opening which opens towards the first signal processing chip (305), the first light-emitting chip (304) and the first light-receiving chip (303) are located in the open cavity (400b), and the first lens assembly (400) covers the surfaces of the first light-receiving chip (303) and the first light-emitting chip (304), so as to change the transmission direction of optical signals to be transmitted to the first light-receiving chip (303) and change the transmission direction of light-emitting signals generated by the first light-emitting chip (304). The optical module (200) further comprises a cover assembly or a heat dissipation assembly.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module. A light receiving component (500) comprises multiple light receiving assemblies (520, 530, 540), a first light receiving assembly (520) and a second light receiving assembly (530) being located at one side of the light receiving component (500), and a third light receiving assembly (540) being located at another side of the light receiving component (500). A transmitted optical signal is transmitted via a first optical filter (5173), and a received optical signal is sequentially reflected via the first optical filter (5173), a first reflective sheet (5174) and a second reflective sheet (5175), and then is incident on a wave division assembly (5172) and is divided into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal by means of the wave division assembly (5172). The wave division assembly (5172) is disposed along a length direction of the light receiving component (500). A first end of the wavelength division assembly (5172) is provided with a first light-exiting position, a second end of the wavelength division assembly (5172) is provided with a second light-exiting position and a third light-exiting position, and three beams of received optical signals are transmitted via the first light-exiting position, the second light-exiting position and the third light-exiting position, respectively.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs

Abrégé

Disclosed is an optical module, comprising an optical receiving component. The optical receiving component comprises a first optical receiving assembly, a second optical receiving assembly, a third optical receiving assembly, and a demultiplexing assembly. The first optical receiving assembly and the second optical receiving assembly are located on one side of the optical receiving component. The demultiplexing assembly is arranged along the length direction of the optical receiving component. A transmitted optical signal is incident on a transmitted light entry position of the demultiplexing assembly, and is emitted by means of a received light entry position of the demultiplexing assembly. A received optical signal comprising a first wavelength, a second wavelength and a third wavelength is incident on the received light entry position of the demultiplexing assembly, is reflected by the transmitted light entry position of the demultiplexing assembly, and then is divided into a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal for emission. In the present disclosure, the demultiplexing assembly is arranged along the length direction of the optical receiving component, and an optical path for transmitting an optical signal and an optical path for receiving an optical signal overlap in the width direction of the optical receiving component, reducing the width of the optical receiving component.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs

Abrégé

An optical module (200), comprising a wavelength division assembly (5172b), a first reflective sheet (5713), a first reflector (5176a) and a second reflector (5174a), wherein the wavelength division assembly (5172b) comprises a first substrate (51721), a first wave plate (51722), a second wave plate (51723b), a third wave plate (51724b), a fourth wave plate (51725b), a fifth wave plate (51726b), a sixth wave plate (51727b), a seventh wave plate (51728b) and an eighth wave plate (51729b), the fifth wave plate (51726b) being located on a transmission optical path of the first wave plate (51722), the second wave plate (51723b) being located on a reflection optical path of the fifth wave plate (51726b), the sixth wave plate (51727b) being located on a reflection optical path of the second wave plate (51723b), the third wave plate (51724b) being located on a reflection optical path of the sixth wave plate (51727b), the seventh wave plate (51728b) being located on a reflection optical path of the third wave plate (51724b), the fourth wave plate (51725b) being located on a reflection optical path of the seventh wave plate (51728b), and the eighth wave plate (51729b) being located on a reflection optical path of the fourth wave plate (51725b); the first reflective sheet (5713) is located between the second wave plate (51723b) and a second light-receiving assembly (520); the first reflector (5176a) is located between the seventh wave plate (51728b) and a first light-receiving assembly (530); the second reflector (5174a) is located between the eighth wave plate (51729b) and a third light-receiving assembly (540); and a received optical signal is reflected and transmitted between the plurality of wave plates, so as to achieve wavelength division.

Classes IPC  ?

• G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré

Abrégé

A laser chip (900) and a preparation method therefor. The laser chip (900) comprises a light-emitting region (910) and an electro-absorption modulation region (920). The electro-absorption modulation region (920) comprises a substrate (922), an active layer (923), a waveguide layer (924), and a modulation electrode (926). The waveguide layer (924) comprises a ridge structure (900a), and a first ridge groove (900a1) and a second ridge groove (900a2) located on two sides of the ridge structure. A first filling medium (940) is provided in the first ridge groove (900a1), and a second filling medium (950) is provided in the second ridge groove (900a2). The first filling medium (940) and the second filling medium (950) are both low dielectric constant media. An end of the modulation electrode (926) is disposed on the surface of the ridge structure (900a), and another end thereof is disposed on the surface of the first filling medium (940), that is, the first filling medium (940) is located between the modulation electrode (926) and the surface of the laser chip (900).

Classes IPC  ?

• H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
• H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque

Abrégé

The present disclosure provides an optical module, comprising: a light emitting part, comprising an emitting housing, wherein a connecting through hole is embedded in the emitting housing, a laser assembly is arranged in the emitting housing, a first optical fiber fixing seat is located in the emitting housing, and a light exit end face of the laser assembly is close to a light incidence surface of the first optical fiber fixing seat. The laser assembly comprises: a second substrate, arranged in the emitting housing and located on the edge of a circuit board, the second substrate being electrically connected to the circuit board; and a laser chip, arranged on the second substrate and electrically connected to the second substrate, a plurality of modulation waveguides being formed side by side at a light exit end of the laser chip to output a plurality of light signals, each modulation waveguide comprising a deflection part, the included angle between the central axis of the deflection part and the normal line of the light exit end face of the laser chip being a first preset angle, and the first preset angle being not 0°. The deflection parts can prevent reflected light signals from being transmitted back to the modulation waveguides, thereby reducing the interference of the reflected light signals on optical signals generated in the modulation waveguides, and ensuring the quality of optical signals generated by the laser chip.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique
• H01S 5/10 - Structure ou forme du résonateur optique
• H01S 5/042 - Excitation électrique
• H01S 5/0237 - Fixation des puces laser sur des supports par soudage

Abrégé

An optical module (200), comprising a laser assembly (460), wherein the laser assembly (460) comprises a substrate (420) and a laser chip (900), and the laser chip (900) is arranged on a surface of the substrate (420). The substrate (420) is electrically connected to a circuit board (300), and the laser chip (900) is electrically connected to the substrate (420). A light-emitting area (910) is formed at one end of the laser chip (900), and the light-emitting area (910) emits multiple beams of light that do not carry information. A plurality of modulation areas (940, 950, 960, 970) are formed on one side of the light-emitting area (910), and one modulation area (940, 950, 960, 970) among the plurality of modulation areas (940, 950, 960, 970) performs signal modulation on one beam of light that does not carry information to generate an optical signal. A plurality of optical signals can be generated by modulation by the plurality of modulation areas (940, 950, 960, 970). A light-emitting port area (900d) is formed on one side of the plurality of modulation areas (940, 950, 960, 970), the light-emitting port area (900d) is located on one side of the plurality of modulation areas (940, 950, 960, 970), the light-emitting port area (900d) is arranged opposite to the light-emitting area (910), and the plurality of modulation areas (940, 950, 960, 970) are located between the light-emitting area (910) and the light-emitting port area (900d). The plurality of optical signals generated by modulation by the plurality of modulation areas (940, 950, 960, 970) are outputted along the light-emitting port area (900d). In this way, the laser chip (900) can output a plurality of optical signals, thereby achieving arrayed light emission, improving the integration of the chip, and increasing the transmission rate of the optical module (200).

Classes IPC  ?

• H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique

Abrégé

An optical module provided by the present disclosure comprises an optical receiving component. The optical receiving component is configured to convert a received optical signal into an electrical signal. The optical receiving component comprises a substrate, an optical fiber adapter, an optical demultiplexing assembly, an optical receiving chip and a refraction member. The refraction member comprises a first inclined plane and a second inclined plane. An optical signal outputted by the first inclined plane is transmitted along the direction non-perpendicular to an interface which the optical signal reaches, and the optical signal finally outputted by the refraction member is perpendicularly incident to the surface of the optical receiving chip after the refraction of the second inclined plane. The first inclined plane is a functional plane for optical path deflection, and significantly deflects the transmission direction of an optical path. The second inclined plane is a functional plane for optical path adjustment, and further adjusts the deflected optical path, so that the optical signal is perpendicularly incident to the surface of the optical receiving chip to adapt to the limited area of a photosensitive surface of the optical receiving chip, thereby avoiding light blocking, and improving the optical coupling efficiency of light incident to the optical receiving chip. Meanwhile, return loss can be reduced, and the influence on the quality of an optical receiving signal can be reduced.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/60 - Récepteurs

Abrégé

Provided in the present disclosure are an optical module, comprising a circuit board and a light-receiving component, wherein the light receiving component comprises a substrate, an optical fiber adapter, a light-receiving chip, a refractive member and a light-splitting assembly; the light-splitting assembly comprises light-splitting units, and each light-splitting unit comprises a filtering member and a reflective member; in the same light-splitting unit, a wavelength transmitted through the filtering member is different from a wavelength reflected by the filtering member, and the wavelength reflected by the filtering member is the same as a wavelength reflected by the reflective member, so as to realize light splitting; and the reflective member is arranged on a light-emission path of the wavelength reflected by the filtering member, so as to change the transmission direction of the wavelength reflected by the filtering member, reflecting the wavelength reflected by the filtering member, thus realizing light splitting. In the present disclosure, the light splitting and reception of a plurality of optical signals can be realized by means of light-splitting units.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde

Abrégé

Provided in the present disclosure are a laser chip fabrication method, a laser chip and an optical module. The laser chip fabrication method comprises: growing a laser epitaxial layer on a substrate; etching an initial modulation region on the laser epitaxial layer so as to form an initial light-emitting region on a side edge of the initial modulation region; growing a modulator epitaxial layer in the initial modulation region, and forming an initial butt joint region at a butt joint position of the modulator epitaxial layer and the initial light-emitting region; growing a waveguide layer at the top of the modulator epitaxial layer and the top of the initial light-emitting region; forming a butt joint opening, the butt joint opening spanning across the initial butt joint region, and in a light field transmission direction of the laser chip, forming a light emitting region on one side of the butt joint opening, and forming a modulation region on the other side of the butt joint opening; and growing a but joint waveguide in the butt joint opening, the butt-joint waveguide connecting the light-emitting region and the modulation region, the butt-joint waveguide comprising a wrapping layer and a butt-joint waveguide layer, the wrapping layer wrapping the butt-joint waveguide layer, and the refractive index of the butt-joint waveguide layer being greater than that of the wrapping layer.

Classes IPC  ?

• H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique

Abrégé

Provided in the present disclosure is an optical module, comprising: a circuit board, a driving chip, a first light-emitting assembly and a second light-emitting assembly. The first light-emitting assembly comprises: a substrate and a light-emitting chip. The substrate comprises: a first platform and a second platform, wherein the second platform is located above the first platform. A first EA signal line and a second EA signal line are provided on a surface of the second platform. A first matching resistor is connected across the first EA signal line and the second EA signal line; and a matching capacitor is connected in parallel to the first matching resistor, and is then connected in series to a light-emitting chip. The driving chip simultaneously provides modulation signals to a first light-emitting chip and a second light-emitting chip. The first light-emitting chip emits first signal light; and the second light-emitting chip emits second signal light. A polarization beam combiner combines the first signal light and the second signal light into first integrated signal light. The wavelength of the first signal light is the same as the wavelength of the second signal light; and the polarization direction of the first signal light is perpendicular to the polarization direction of the second signal light.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/50 - Émetteurs
• H01S 5/042 - Excitation électrique

Abrégé

Provided in the embodiment of the present disclosure is an optical module. The optical module comprises: a circuit board, which is provided with a golden finger at one end; a first light-transceiving component, which comprises: a first lens assembly, a first accommodating cavity being formed between the first lens assembly and the circuit board, and a first light-transmitting assembly and a first light-receiving assembly which are arranged in the first accommodating cavity; a second light-transceiving component, which comprises a second lens assembly, a second accommodating cavity being formed between the second lens assembly and the circuit board, and a second light-transmitting assembly and a second light-receiving assembly which are arranged in the second accommodating cavity; a first chipset, which is electrically connected between the first light-transceiving component and the golden finger; and a second chipset, which is electrically connected between the second light-transceiving component and the golden finger, wherein the first chipset is located in the first accommodating cavity, and the second chipset is located in the second accommodating cavity; and the wiring distance between the first chipset and the first light-transmitting assembly is less than the wiring distance between the first chipset and the golden finger, and the wiring distance between the second chipset and the second light-transmitting assembly is less than the wiring distance between the second chipset and the golden finger.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising a circuit board; and a hybrid integrated optical chip electrically connected to the circuit board and configured to modulate and generate an optical signal. The hybrid integrated optical chip comprises: a Si-based platform provided with a substrate layer, a cladding layer located on the substrate layer and a Si waveguide layer located between the substrate layer and the cladding layer, a first heating part and a second heating part being separately embedded in the cladding layer; a InP light-emitting area arranged on the Si-based platform, a plurality of lasers being arranged side by side in the InP light-emitting area; and a InP modulation area arranged on the Si-based platform and arranged on a light exit path of the InP light-emitting area to receive light output by the lasers. A plurality of InP modulators are arranged side by side in the InP modulation area, and the InP modulators are linear electro-optic modulators; the InP modulators are correspondingly connected to the lasers; the InP modulators is each provided with a first modulation waveguide and a second modulation waveguide, the first modulation waveguide and the second modulation waveguide are in optical coupling connection to each laser to receive light output by the lasers and perform signal modulation so as to generate an optical signal.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a circuit board (300) and a hybrid integrated optical chip (400), wherein the hybrid integrated optical chip (400) is electrically connected to the circuit board (300). The hybrid integrated optical chip (400) comprises an Si-based platform (410), an InP light-emitting region (480) and an InP modulation region (420). Laser devices (481) are arranged side by side on a surface of the InP light-emitting region (480). Each laser device (481) comprises an active quantum well layer (4813) and a grating layer (4815), wherein the active quantum well layer (4813) is used for outputting light, and the grating layer (4815) is arranged on a surface of an Si waveguide layer (413). InP modulators (421) are arranged side by side on a surface of the InP modulation region (420). The InP modulators (421) are linear electro-optic modulators. Each InP modulator (421) comprises a first modulation waveguide (4211) and a second modulation waveguide (4212), wherein the first modulation waveguide (4211) and the second modulation waveguide (4212) are both optically coupled to one laser device (481) to receive light output by the laser device (481) and perform signal modulation. The hybrid integrated optical chip (400) can have both light emission and signal modulation functions, thereby being more applicable to multi-channel remote transmission.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising an optical processing component (500). The optical processing component (500) comprises: a first beam processing assembly (510); a second beam processing assembly (520), the second beam processing assembly (520) being arranged above the first beam processing assembly (510); a lens assembly (530) arranged at the light exit side of the first beam processing assembly (510) and the second beam processing assembly (520); and a deflecting prism (540) arranged at the light exit side of the lens assembly (530), wherein the deflecting prism (540) is provided with reflective surfaces (5411, 5421, 5431, 5441, 5451) at the reflection side thereof, the reflective surfaces (5411, 5421, 5431, 5441, 5451) are located on an output optical path of at least one of the first beam processing assembly (510) and the second beam processing assembly (520), and the reflective surfaces (5411, 5421, 5431, 5441, 5451) are configured to reflect light signals output by the first beam processing assembly (510) and/or the second beam processing assembly (520).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure are an optical module and an optical chip. The optical chip comprises a silicon platform, on which an optical coupler and an indium phosphide modulated waveguide are provided, wherein the optical coupler comprises a silicon coupled waveguide layer and an indium phosphide coupled waveguide layer, each of which comprises a gradient region, and there is an overlapping region between the gradient region of the indium phosphide coupled waveguide layer and the gradient region of the silicon coupled waveguide layer; the width of the gradient region of the silicon coupled waveguide layer gradually decreases, and the width of the gradient region of the indium phosphide coupled waveguide layer gradually increases; and the indium phosphide modulated waveguide comprises a first modulated waveguide layer, a second modulated waveguide layer and a third modulated waveguide layer, which are stacked in sequence, the second modulated waveguide layer comprises a plurality of quantum wells, a P-doping concentration of the third modulated waveguide layer falls within a first preset range, and an N-doping concentration of the first modulated waveguide layer falls within a second preset range. In the present application, the optical coupler improves the coupling efficiency, and the P-doping concentration and the N-doping concentration fall within corresponding preset ranges, so as to compensate for an increase in quantum well absorption loss.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique

Abrégé

An optical module (200), comprising a circuit board (300), a carrier (900), an optical transmitting component (400) and an optical receiving component (500). A recess (302) is formed on the surface of the circuit board (300), and the carrier (900) is embedded in the recess (302). The optical transmitting component (400) comprises a laser device (401) and an optical multiplexing assembly (403), the laser device (401) and the optical multiplexing assembly (403) both being arranged on the surface of the carrier (900). The optical receiving component (500) comprises a support portion (508), a light-redirecting portion (505), an optical receiving chip (506) and an optical demultiplexing assembly (503), wherein the support portion (508) can support the light-redirecting portion (505) to a certain height. The optical demultiplexing assembly (503) and the optical multiplexing assembly (403) are stacked, and there is a difference between the height of a light inlet of the light-redirecting portion (505) and the height of a light outlet of the laser device (401), such that, when positioned opposite each other in a vertical direction, an optical path between the optical demultiplexing assembly (503) and the light-redirecting portion (505) is separated from an optical path between the optical multiplexing assembly (403) and the laser device (401) by a certain distance, thereby preventing interference and crosstalk between an optical receiving path and an optical transmitting path. In addition, by stacking the optical demultiplexing assembly (503) and the optical multiplexing assembly (403), space occupied by an optical engine is reduced.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/25 - Dispositions spécifiques à la transmission par fibres

Abrégé

The present application discloses an optical module, comprising: a light-emitting chip, a photodetector, and a control chip. The control chip converts an electrical signal from the photodetector into a current optical power. When the current optical power is 0, a degradation count is cleared to zero. When the current optical power is not 0, the current optical power is greater than a second limit threshold and an output bias current is not a second bias current, the degradation count is cleared to zero. When the current optical power is not 0 and the current optical power is less than or equal to the second limit threshold, the degradation count is increased by 1; and when the degradation count is greater than or equal to a preset value, the bias current is set to the second bias current, and the second bias current is greater than the operating current of the light-emitting chip. When the current optical power is not 0 and the current optical power is less than or equal to the second limit threshold, an optical power alarm signal is output. The optical module provided by the present application can increase the bias current of a degraded light-emitting chip.

Classes IPC  ?

• H04B 10/60 - Récepteurs

Abrégé

An optical module, comprising: a circuit board (300) which is provided with a through hole (301); a light-emitting assembly (310), which is configured to generate an optical signal; a driver (330), which is located at a side edge of the light-emitting assembly (310), and is electrically connected to the light-emitting assembly (310); a lens assembly (400), the bottom of which is connected to the circuit board (300) and covers the light-emitting assembly (310), the lens assembly (400) being configured to change a transmission direction of the optical signal generated by the light-emitting assembly (310); a support component (700), which comprises a support portion (711) and a connecting portion (712), the support portion (711) being located in the through hole (301), the connecting portion (712) being connected to the circuit board (300), an unfilled corner (718) being formed on one side of the support portion (711), and the top of the support portion (711) supporting and being connected to the driver (330); and a temperature adjustment mechanism (500), which is located below the lens assembly (400), and the bottom of which is connected to the support component (700). The temperature adjustment mechanism (500) is located below the light-emitting assembly (310) or arranged at the side edge of the light-emitting assembly (310), and the temperature adjustment mechanism (500) is configured to maintain an operation temperature of the light-emitting assembly (310).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure are an optical module, comprising a circuit board, a photodetector, a boost circuit, a sampling circuit and an MCU. The photodetector is used for converting an optical signal into a photocurrent signal. The boost circuit is used for providing a bias voltage to the photodetector. The sampling circuit is used for sampling, on the basis of a trigger signal, received light intensity received by the photodetector. During the power-on of the photodetector, the MCU provides the trigger signal to the sampling circuit. Moreover, during the power-on of the photodetector, a power-on optical overload protection mechanism is implemented, involving: comparing the sampled received light intensity with the current intensity threshold before each time the bias voltage is stepped; if the sampled received light intensity is less than the current intensity threshold, making the bias voltage be further stepped; and if the sampled received light intensity is greater than the current intensity threshold, maintaining the output of the current bias voltage, not executing stepping, and continuing to trigger the sampling, thereby protecting the photodetector.

Classes IPC  ?

• H04Q 11/00 - Dispositifs de sélection pour systèmes multiplex

Abrégé

Disclosed are an optical module and a received optical power monitoring method. The optical module comprises an optical receiver component, and the optical receiver component comprises a photoelectric detector, an amplitude measurer, a compensation controller and an equalizer. The photoelectric detector is configured to convert signal light into an electrical signal. The amplitude measurer is configured to measure an amplitude value of the amplified electrical signal. According to the amplitude value, the compensation controller can output different equalization compensation values to control the equalizer, so that the equalizer compensates for the electrical signal according to the equalization compensation values.

Classes IPC  ?

• H04B 10/69 - Dispositions électriques dans le récepteur
• H04B 10/40 - Émetteurs-récepteurs
• H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données
• H04B 10/293 - Commande de la puissance du signal

Abrégé

The present disclosure provides an optical module, comprising a circuit board, a bearing member, a light-emitting component, and a light-receiving component. A cutout is formed in the surface of the circuit board, and the bearing member is disposed at the cutout. The light-emitting component comprises a laser and an optical multiplexing assembly. The laser and the optical multiplexing assembly are both disposed at a surface of the bearing member. The light-receiving component comprises a support part, a refraction part, an optical receiving chip, and an optical demultiplexing assembly. The support part can support the refraction part to a certain height. In the present disclosure, the optical demultiplexing assembly and the optical multiplexing assembly are arranged in a stacked manner, and a difference value exists between the height of a light inlet of the refraction part and the height of a light outlet of the laser, so that the optical path between the optical demultiplexing assembly and the refraction part and the optical path between the optical multiplexing assembly and the laser are separated by a certain distance in terms of the relative vertical positional relationship thereof, so that interference and crosstalk between a light-receiving optical path and a light-emitting optical path are avoided. In addition, by means of arranging the optical demultiplexing assembly and the optical multiplexing assembly in a stacked manner, the space occupied by an optical engine is reduced.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising an optical fiber array (1300), an optical modulation chip (1100) and a hybrid integrated optical amplification chip (1200), wherein the optical fiber array (1300) transmits into the optical modulation chip (1100) light to be modulated, and the optical modulator (1130) modulates the light to be modulated and then outputs first modulated light and second modulated light; a first optical amplifier (1210), a second optical amplifier (1220), a first optical waveguide (1230) and a second optical waveguide (1250) are all integrated in the hybrid integrated optical amplification chip (1200); the first modulated light and the second modulated light are output and transmitted into the hybrid integrated optical amplification chip (1200); the first optical amplifier (1210) and the second optical amplifier (1220) respectively perform optical amplification on the first modulated light and the second modulated light; the amplified first modulated light and the amplified second modulated light are respectively returned the optical modulation chip (1100) along the first optical waveguide (1230) and the second optical waveguide (1250) for multiplexing; and the hybrid integrated optical amplification chip (1200) can simultaneously leverage gain characteristics of an optical amplifier and low transmission loss characteristics of a silicon-based waveguide, and improve the stability of an optical path.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

A laser chip provided in the present invention. The laser chip comprises a first electrode layer, an active layer, a waveguide layer, and a second electrode layer, respectively. In an optical field propagation direction, the waveguide layer comprises a waveguide layer section I, a waveguide layer section II, and a waveguide layer section III. The waveguide layer section I uses a shallow-etched ridge waveguide structure, and the waveguide layer section III uses a deep-etched ridge waveguide structure. In order to improve the coupling efficiency between the waveguide layer section I and the waveguide layer section III, the waveguide layer section II is provided. In the optical field propagation direction, the waveguide layer section II is divided into a first connecting portion and a second connecting portion, the first connecting portion uses a shallow-etched ridge waveguide structure, and the second connecting portion uses a deep-etched ridge waveguide structure to realize continuity in etching depth. In addition, the second connecting portion comprises a first tapered section and a second tapered section, and the side walls, close to the ridge structure, in the first tapered section and the second tapered section progressively converge toward the ridge structure, achieving optical field mode matching, and improving the coupling efficiency of the laser chip.

Classes IPC  ?

• H01S 5/12 - Structure ou forme du résonateur optique le résonateur ayant une structure périodique, p. ex. dans des lasers à rétroaction répartie [lasers DFB]
• H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
• H01S 5/042 - Excitation électrique

Abrégé

Embodiments of the present application disclose an optical module. The optical module comprises an upper housing and an unlocking component. The upper housing comprises a cover plate, a first upper side plate, a second upper side plate, and a support plate. An engagement groove is provided in an upper surface of the cover plate, a matching protrusion is provided in the engagement groove, a mounting seat is formed on the cover plate, and a movement recess is formed in the mounting seat. The unlocking component comprises a pull ring, an unlocking member, and an elastic member. The pull ring comprises: a first support arm, a second support arm, a third support arm and a fourth support arm, which are connected in sequence end to end, and a bending part located at one side of the first support arm. The first support arm is located at a side wall of the cover plate, the bending part is located between the first support arm and the cover plate, and the first support arm is perpendicular to the cover plate. The third support arm is perpendicular to the first support arm. The unlocking member abuts against one side of the bending part, and the unlocking member moves in the movement recess when pushed by the bending part. The elastic piece is assembled with and connected to the unlocking member and the mounting seat.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module, comprising: a light receiving assembly (500), a first end of the light receiving assembly (500) being connected to a fiber optic adapter (700), a second end of the light receiving assembly (500) being connected to a light emitting assembly (400), and a light emitting direction of the light emitting assembly (400) facing the fiber optic adapter (700); the light receiving assembly (500) comprising a first light receiving component (530), a second light receiving component (520), and a third light receiving component (540), the first light receiving component (530) and the second light receiving component (520) being located on one side of the light receiving assembly (500), and the third light receiving component (540) being located on the other side of the light receiving assembly (500); and the light receiving assembly (500) further comprising a wavelength demultiplexing component (5172) for dividing emitted light into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal and then transmitting same; and the light emitting assembly (400), comprising a first laser component (440), a second laser component (450), and a third laser component (460) which are in a triangular distribution state, wherein the light emitting assembly (400) further comprises a wavelength multiplexing component, and the wavelength multiplexing component is configured to combine a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal into a transmitted optical signal.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

In an optical module provided in the present disclosure, a first light-receiving component receives a fourth-wavelength optical signal, a fifth-wavelength optical signal and a sixth-wavelength optical signal which are reflected by a first reflector, and outputs a first voltage signal, a second voltage signal or a third voltage signal; a gold finger, an MCU, a first limiting amplifier, a second limiting amplifier and a filtering circuit are provided on a circuit board; an input end of the first limiting amplifier and an input end of the second limiting amplifier are connected to the first light-receiving component by means of the filtering circuit; the filtering circuit bypasses the second voltage signal to the first limiting amplifier, such that the first limiting amplifier processes the second voltage signal and then transmits the processed second voltage signal to the gold finger; and the MCU controls and is connected to the second limiting amplifier so that, by means of the control signal, the second limiting amplifier processes the first voltage signal or the third voltage signal and then transmits the processed first voltage signal or the processed third voltage signal to the gold finger by means of a corresponding output end.

Classes IPC  ?

• H04B 10/40 - Émetteurs-récepteurs
• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• G02B 6/27 - Moyens de couplage optique avec des moyens de sélection et de réglage de la polarisation

Abrégé

An optical module (200). The optical module (200) comprises a circuit board (300) and a light emission component (400). The light emission component (400) comprises a substrate (910), a laser chip (920), and an adapter board (980). The power supply connection and signal connection between the substrate (910) and the laser chip (920) are achieved by means of the adapter board (980), thereby avoiding the use of wire bonding to achieve the connection between the substrate (910) and the laser chip (920). The laser chip (920) comprises a first optical waveguide (9212), a second optical waveguide (9214), and a third optical waveguide (9213). The passive third optical waveguide (9213) is butt-joined to the second optical waveguide (9214) at an output end of the first optical waveguide (9212); and the transition connection between the first optical waveguide (9212) and the second optical waveguide (9214) is achieved by means of the third optical waveguide (9213), so as to reduce the end face reflection between the first optical waveguide (9212) and the second optical waveguide (9214). By controlling the thickness and width of a waveguide core layer (9226) in the second optical waveguide (9214), the effective refractive index difference between the waveguide core layer (9226) and a cladding layer of the second optical waveguide (9214) is made smaller than the effective refractive index difference between a waveguide core layer (9221) and a cladding layer of the first optical waveguide (9212), so as to optimize the spot shape and far-field divergence angle of the laser chip (920).

Classes IPC  ?

• H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique
• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module, and a temperature collection method for an optical module. The optical module comprises: a circuit board (300), wherein a first temperature sensor (302) and a micro-control unit (303) are provided on the circuit board (300), and a second temperature sensor (3031) is built in the micro-control unit (303). The micro-control unit (303) is configured to: determine a collected-data source for the current working temperature of the optical module and acquire third collected data corresponding to the current working temperature of the optical module; when the collected-data source for the current working temperature is the first temperature sensor (302), determine the magnitude relationship between the third collected data and a first preset threshold; when the third collected data is greater than or equal to the first preset threshold, determine the current working temperature of the optical module by means of first collected data of the first temperature sensor (302); when the third collected data is less than the first preset threshold, acquire a compensation value, and second collected data of the second temperature sensor (3031); and perform compensation calibration on the second collected data on the basis of the compensation value, and determine the current working temperature of the optical module.

Classes IPC  ?

• G01K 1/022 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres pour l’enregistrement
• G01K 1/02 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres
• G01K 15/00 - Test ou étalonnage des thermomètres
• H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données

Abrégé

An optical module (200) and a light receiving component (500). The light receiving component (500) comprises: a base plate (510), a light receiving chip array (520) and a receiving assembly (530). The light receiving chip array (520) is located on one side of the base plate (510), and the receiving assembly (530) is located above the base plate (510). The light receiving assembly (530) comprises: a substrate (531), a deflecting prism (532), a light splitting device (533) and a lens assembly (534). Signal light is incident to the deflecting prism (532) after passing through the light splitting device (533), is deflected by the deflecting prism (532) and then is incident to the lens assembly (534), and is converged to the light receiving chip array (520) by the lens assembly (534). The lens assembly (534) is located inside the substrate (531), an upper surface of the lens assembly (534) is lower than an upper surface of the substrate (531), and a lower surface of the lens assembly (534) is higher than a lower surface of the substrate (531) such that damage to the lens assembly (534) by an external structure can be avoided. An upper surface of the base plate (510) is higher than an upper surface of the light receiving chip array (520), such that the light receiving chip array (520) does not make contact with the light receiving assembly (530), thereby avoiding damage to the light receiving chip array (520). The convergence of the signal light is achieved by means of a group of lenses, which is conducive to reducing the size of the assembly. The deflecting prism (532) is separated from the light splitting device (533) such that the three-dimensional position of the deflecting prism (532) can be adjusted, and the optical coupling efficiency is improved.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• G02B 6/43 - Dispositions comprenant une série d'éléments opto-électroniques et d'interconnexions optiques associées
• H04B 10/40 - Émetteurs-récepteurs
• H04B 10/43 - Émetteurs-récepteurs utilisant un seul composant en tant que source lumineuse et récepteur, p. ex. utilisant un photoémetteur comme photorécepteur

Abrégé

An optical module (200) comprises a coherent optical assembly (902); the coherent optical assembly (902) comprises a cover shell (921) and a substrate (923); the substrate (923) is fixed on a circuit board (300); the cover shell (921) covers the substrate (923) to form a storage cavity; an optical chip, an optical matching chip, and an electrical adapter fixed member (922) are provided in the storage cavity; bonding pads are provided on first surfaces of the optical chip and the optical matching chip, and second surfaces of the optical chip and the optical matching chip are attached to the cover shell (921). The electrical adapter fixed member (922) is provided with a plurality of hollowed areas, the optical chip and the optical matching chip are placed in the corresponding hollowed areas, and gaps are provided between the first surfaces of the optical chip and the optical matching chip and the substrate (923).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present application discloses an optical module, comprising a DSP chip, an adjustable voltage source, and an MCU. The DSP chip comprises an electrical input pin and an electrical input/output pin, an electrical input/output pin of the MCU is connected to the electrical input/output pin of the DSP chip, an electrical output pin of the MCU is connected to a control pin of the adjustable voltage source, and a voltage output pin of the adjustable voltage source is connected to the electrical input pin of the DSP chip. The DSP chip is used for storing a voltage adjustment feedback flag bit. The MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source on the basis of the voltage adjustment feedback flag bit. In the present application, the MCU adjusts the output voltage of the voltage output pin of the adjustable voltage source on the basis of the voltage adjustment feedback flag bit so as to supply the minimum voltage required by the DSP chip, thereby reducing the power consumption of the optical module to the maximum extent while ensuring that the performance of the optical module is not affected.

Classes IPC  ?

• H04B 10/40 - Émetteurs-récepteurs

Abrégé

Provided in the present disclosure is an optical module, comprising: a lower housing, which is covered with an upper housing to form a cavity; a circuit board, which is located in the cavity; and a light-emitting component, which is located in the cavity, is electrically connected to the circuit board, and comprises a plurality of light-emitting chips and a multiplexing assembly, wherein the plurality of light-emitting chips are configured to emit different wavelength signal light, and the multiplexing assembly is located on a light-emergent side of the light-emitting chips; the multiplexing assembly comprises a plurality of filters, and the plurality of filters are configured to reflect and/or transmit the different wavelength signal light, so as to perform beam-combining processing on a plurality of pieces of different wavelength signal light; or the multiplexing assembly comprises a reflection assembly, and the reflection assembly is configured to reflect and/or transmit the different wavelength signal light, so as to perform beam-combining processing on a plurality of pieces of different wavelength signal light.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module. The optical module comprises: a circuit board, a bearing plate, a light emitting component and a first light receiving component. The light emitting component comprises: a laser chip array, a first lens array, a second lens array, a semiconductor cooler and a first circuit adapter plate, wherein the laser chip array is arranged in a width direction of the circuit board, the laser chip array, the first lens array and the second lens array are arranged in a length direction of the circuit board, a first electrode post and a second electrode post of the semiconductor cooler and the first circuit adapter plate are located between the first lens array and the second lens array, the first circuit adapter plate is connected to the circuit board, the first electrode post and the second electrode post, and the first light receiving component and the light emitting component are arranged in parallel in the width direction of the circuit board. In the present application, the first electrode post and the second electrode post of the semiconductor cooler and the first circuit adapter plate are located between the first lens array and the second lens array, and the size occupied by the light emitting component in the width direction of the circuit board is reduced, such that the light emitting component and the first light receiving component are arranged in parallel in the width direction of the circuit board.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure is an optical module. The optical module comprises a fiber optic adapter, one end of which is configured to be connected to an external optical fiber; an optical accommodating component, comprising a first housing, wherein one end of the first housing is connected to the other end of the fiber optic adapter, one side of the first housing is connected to a first optical receiving component, a second optical receiving component and a third optical receiving component, and the first optical receiving component, the second optical receiving component and the third optical receiving component are configured to respectively receive a fourth wavelength optical signal, a fifth wavelength optical signal and a sixth wavelength optical signal that are input by means of the fiber optic adapter; and an optical transmitting component, one end of which is connected to the other end of the optical accommodating component, wherein the optical transmitting component comprises a second cavity, and a first laser assembly, a second laser assembly, a third laser assembly and a wave combining assembly that are arranged in the second cavity, the first laser assembly generating a first wavelength optical signal, the second laser assembly generating a second wavelength optical signal, and the third laser assembly generating a third wavelength optical signal.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising an optical fiber adapter (700), an optical accommodation component (500), a laser assembly (431) and a multiplexing assembly (490). The laser assembly (431) emits optical signals of multiple wavelengths. The multiplexing assembly (490) comprises a first multiplexing member (4341) and a second multiplexing member (4342), wherein the first multiplexing member (4341) is configured to reflect a first-wavelength optical signal, and the second multiplexing member (4342) is configured to reflect one of the first-wavelength optical signal and a second-wavelength optical signal and transmit the other of the first-wavelength optical signal and the second-wavelength optical signal, so as to achieve beam multiplexing.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs

Abrégé

Disclosed is an optical module, comprising a circuit board, a laser and, located on the circuit board, a bias circuit, a power supply circuit, a voltage measurement circuit and an MCU. The laser comprises a light-emitting area connected to the bias circuit and an electro-absorption modulation area connected to the power supply circuit, the bias circuit supplying a bias current to the light-emitting area, and the power supply circuit supplying power to the electro-absorption modulation area; the voltage measurement circuit is connected to the electro-absorption modulation area so as to measure the voltage of the electro-absorption modulation area and convert the voltage into a current; the MCU is connected to a first end of the power supply circuit and the voltage measurement circuit, collects the current output by the voltage measurement circuit and, according to the current, adjusts the voltage output by the power supply circuit so as to reduce the voltage of the electro-absorption modulation area.

Classes IPC  ?

• H04B 10/25 - Dispositions spécifiques à la transmission par fibres

Abrégé

Provided in the present disclosure is an optical module, comprising: an optical fiber adapter, an optical accommodating component and an optical transmitting component. The optical accommodating component comprises a first housing and an optical assembly, which is arranged inside the first housing, wherein a first connection hole and a second connection hole are formed on one side of the first housing, the first connection hole being connected to a first optical receiving component, and the second connection hole being connected to a second optical receiving component; and the optical assembly comprises a first displacement prism, a reflecting mirror, a first optical filter, a wavelength division multiplexer and a second displacement prism. The use of corresponding devices in the optical assembly to correspondingly transmit to the first optical receiving component or the second optical receiving component optical receiving signals of different wavelengths that are inputted by means of the optical fiber adapter, and the use of corresponding devices in the optical assembly to transmit to the optical fiber adapter an optical transmitting signal generated by the optical transmitting component and output the optical transmitting signal by means of the optical fiber adapter are facilitated. In this way, the optical module is integrated with the reception and transmission of optical signals of multiple wavelengths, thus adapting to the requirement for multiple transmission channels in the optical module.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present application is an optical module, comprising: a cavity formed by an upper housing covering a lower housing, and a circuit board located inside the cavity. The circuit board comprises an upper conductive layer, a lower conductive layer, and an intermediate conductive layer, which is located between an upper surface layer and a lower surface layer. The upper conductive layer is provided with: a first power supply pin; a second power supply pin, the voltage of which is the same as the voltage of the first power supply pin; and a not-connected pin, which is located between the first power supply pin and the second power supply pin, wherein there is a gap between the first power supply pin and the not-connected pin; and there is a gap between the second power supply pin and the not-connected pin. The intermediate conductive layer is provided with a conductive wire. A third through hole is provided below the second power supply pin, one end of the third through hole being connected to the second power supply pin, and the other end thereof being connected to the conductive wire; a first through hole is provided below the not-connected pin, one end of the first through hole being connected to the not-connected pin, and the other end thereof being connected to the conductive wire; and a power supply line is connected to a soft-start circuit. The present application avoids the occurrence of secondary power-on, thus improving the stability of the optical module.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H05K 1/02 - Circuits imprimés Détails
• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
• H01H 89/00 - Combinaisons de plusieurs types d'interrupteurs électriques, de relais, de sélecteurs et de dispositifs de protection d'urgence, non couvertes par un des autres groupes principaux de la présente sous-classe

Abrégé

A laser (900) and a manufacturing method therefor. The laser (900) comprises a packaging chamber, and a gain chip (910), a wavelength selection assembly and a reflector (960) are separately provided in the packaging chamber. The gain chip (910) comprises a top layer (911), a bottom layer (916) and a light-emitting layer (914). The light-emitting layer (914) comprises a first active region (9141), a passive grating region (9142) and a second active region (9143). The first active region (9141) emits a light beam with a wide wavelength range. The end surface of the passive grating region (9142) can serve as a first resonance end surface of the laser (900). The reflector (960) serves as a second resonance end surface of the laser (900), and forms a resonance chamber with the first resonance end surface. The wavelength selection assembly selects light of a specific wavelength from the light beam with a wide wavelength range; the light of the specific wavelength oscillates back and forth in the resonance chamber to obtain a gain so as to form laser, and the second active region (9143) further performs gain amplification on the laser, thereby improving the output optical power of the laser. On-chip integration of the first active region (9141) and the second active region (9143) is achieved by means of the passive grating region (9142), thereby reducing the volume of the packaging chamber, and miniaturizing the laser.

Classes IPC  ?

• H01S 5/026 - Composants intégrés monolithiques, p. ex. guides d'ondes, photodétecteurs de surveillance ou dispositifs d'attaque
• H01S 5/50 - Structures amplificatrices non prévues dans les groupes

Abrégé

The present disclosure provides an optical module, comprising a circuit board and a light emitting part. A notch is formed on the surface of the circuit board. The light emitting part comprises a tube shell and an electric connector, the tube shell overlaps the surface of the notch, and the electric connector is arranged at an end portion of the tube shell. One end of the electric connector extends into the tube shell, the other end of the electric connector is provided with a boss, and the boss is located outside the tube shell. In the present disclosure, a first connecting portion is formed on the side wall of the notch, a second connecting portion is formed on the end face of the boss facing the circuit board, and the first connecting portion and the second connecting portion are connected in an embedded mode, so as to achieve relatively fixed connection between the electric connector and the circuit board, thereby reducing the relative displacement between the electric connector and the circuit board, preventing the gold wire from being pulled. Moreover, the fixed connection between the first connecting portion and the second connecting portion can ensure that a wire bonding end face of the electric connector is flush with a wire bonding end face of the circuit board, so as to avoid misalignment of the wire bonding end faces due to other external forces, providing a stable platform for wire bonding, and thus ensuring the transmission quality of high-frequency signals.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising: a circuit board (300); an optical transceiver component (900) fixed on the circuit board (300), the optical transceiver component (900) comprising a lens assembly (901a), an optical fiber support (902a), a positioning column (903) and an optical emitter chip (310), wherein the optical fiber support (902a) is provided with a first positioning hole (921), the surface of the lens assembly (901a) facing the optical fiber support (902a) is provided with a second lens (9142) and a second positioning hole (9143), the second positioning hole (9143) is located at one side of the second lens (9142), the positioning column (903) is fixed to the second positioning hole (9143) and the first positioning hole (921), the second lens (9142) is plated with an antireflection film, the surface where the second lens (9142) is located is flush with or protrudes from the surface of the lens assembly (901a) facing the optical fiber support (902a), and the optical emitter chip (310) is electrically connected to the circuit board (300) and is configured to generate an optical signal; and a heating device (350a, 350b) provided on the side edge of the optical emitter chip (310) or below the optical emitter chip (310) and configured to generate heat. The second positioning hole (9143) is located at one side of the second lens (9142), and the surface where the second lens (9142) is located is not recessed inwards relative to the surface of the lens assembly (901a) facing the optical fiber support (902a), such that the antireflection film on the second lens (9142) has a uniform thickness.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising: a circuit board (300); a light-receiving component (500), which is arranged on the circuit board (300), and comprises a light-receiving chip array (310) and an optical device (520), wherein the light-receiving chip array (310) is electrically connected to the circuit board (300), the optical device (520) is located above the light-receiving chip array (310), and the light-receiving chip array (310) comprises a first light-receiving chip and a second light-receiving chip; and a second optical fiber (502), which is connected to the optical device (520). The optical device (520) comprises: a demultiplexing assembly, which has a light inlet (5213), wherein the demultiplexing assembly is optically coupled and connected to the second optical fiber (502), a light signal enters the demultiplexing assembly via the light inlet (5213), and the demultiplexing assembly is configured to perform beam splitting on the light signal, and redirect light beams which are transmitted in the extension direction of the second optical fiber (502); and a lens array (522), which is located below a light output end of the demultiplexing assembly, wherein the lens array (522) is located above the light-receiving chip array (310), and the optical axis of the lens array (522) is not perpendicular to a photosensitive surface of the light-receiving chip array (310).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure is an optical module, comprising a circuit board, a substrate, and a heater and a laser chip, which are mounted on the substrate, wherein a signal line and a ground pad are provided on the circuit board; a high-frequency transmission line wire-bonded to the signal line and a ground metal area wire-bonded to the ground pad are provided on the substrate; the laser chip is mounted on the ground metal area; the high-frequency transmission line is wire-bonded to the laser chip; the heater is thermally isolated from the substrate; the heater has a first power supply terminal, a second power supply terminal and a ground terminal; the second power supply terminal is electrically connected to the circuit board; the ground terminal is connected to the ground metal area to supply power to the heater; the first power supply terminal is electrically connected to the circuit board to transmit a drive current to the heater; and the heater is connected to the laser chip via a gold wire to transmit the drive current and conduct heat to the laser chip.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/50 - Émetteurs

Abrégé

An optical module (200) comprises a circuit board (300) and an optical modulation chip (900). The optical modulation chip (900) comprises a first substrate (910), an optical modulator (911), a second coupled waveguide (913); and a modulation driver (918) is formed on the other side of the optical modulator (911). A transimpedance amplifier (919) is further provided on a surface of the first substrate (910). An optical demodulator (921) is provided on a surface of a second substrate (920), and a first coupled waveguide (923) is formed on one side of the optical demodulator (921). Since the optical demodulator (911) is enclosed in a first recess (912), in order to electrically connect the optical demodulator (921) to the transimpedance amplifier (919), a first via (919a) that runs through the first substrate (910) in a direction from an end of the optical demodulator (912) to the circuit board (300) is formed to electrically connect the optical demodulator (921) to the circuit board (300). A second via (919b) that runs through the first substrate (910) in a direction from a bottom surface of the transimpedance amplifier (919) to the circuit board (300) is formed to electrically connect the transimpedance amplifier (919) to the circuit board (300) and thus electrically connect the light demodulator (921) to the transimpedance amplifier (919).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising an upper housing (201), a circuit board (105), a base (900a), a light receiving component (500a), and a light emitting component (400a). Respectively arranging the light receiving component (500a) and the light emitting component (400a) on different surfaces of the same base (900a) can achieve light reception and light emission of multiple paths of signals. A base mounting portion (301) is formed on a surface of the circuit board (105), such that the base (900a) is fixed to the surface of the circuit board (105) by means of the base mounting portion (301). In order to improve the cooling effect of the base (900a), the light emitting component (400a) is arranged on the lower surface of the base (900a), and a protruding portion (910a) is formed on the upper surface of the base (900a), the protruding portion (910a) protruding towards the upper housing (201), and the protruding portion (910a) being in thermally-conductive connection to the upper housing (201), thereby allowing heat to be dissipated via the base (900a).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, and a method for preparing a hybrid InP/Si optical chip. The optical module comprises: a circuit board; and a hybrid InP/Si optical chip, which is electrically connected to the circuit board and is configured to modulate and generate an optical signal. The hybrid InP/Si optical chip comprises: a Si platform, which is integrated with a silicon optical circuit, wherein an InP region is formed inside the Si platform, the InP region has no pad, a radio frequency pad and a direct-current bias pad are provided at the top of the Si platform, the radio frequency pad is located on one side of the InP region, and the direct-current bias pad is located on the other side of the InP region; an InP phase modulator, which is located in the InP region and comprises an InP waveguide and a coupling electrode, wherein the coupling electrode is arranged above the InP waveguide, and the InP waveguide is electrically connected to the direct-current bias pad; and a radio frequency traveling waveguide, one end of which is connected to the radio frequency pad, and the other end of which extends over the InP waveguide and extends to the other side of the InP region, wherein the radio frequency traveling waveguide is electrically connected to the coupling electrode. Thus, the modulation rate of a phase modulator is increased, thereby meeting the requirements of a high-rate optical module.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
• G02B 6/136 - Circuits optiques intégrés caractérisés par le procédé de fabrication par gravure
• G02F 1/017 - Structures avec une variation de potentiel périodique ou quasi périodique, p. ex. superréseaux, puits quantiques

Abrégé

An optical module (200), comprising: a housing formed by covering an upper housing (201) and a lower housing (202), and a circuit board (300) located inside the housing. An optical receiving component (500) is located on the lower surface of the circuit board (300). A first optical channel (4051) and a second optical channel (4052) are provided on the upper surface of a transmitting housing (401) of an optical transmitting component (400), and a first optical fiber accommodating portion (4023) and a second optical fiber accommodating portion (4024) are provided on the lower surface of the transmitting housing (401) for accommodating a first internal optical fiber and a second internal optical fiber. A first side wall of the transmitting housing (401) is sequentially provided with a first optical fiber adapter (701), a second optical fiber adapter (702), a third optical fiber adapter (703), and a fourth optical fiber adapter (704) which are located at the same height. By reasonably arranging the position of the optical transmitting component (400), the position of the optical receiving component (500), and the center height of an optical port (205) of the optical module, the number of optical components is reduced, and the space of the optical module is reduced.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present application discloses an optical module, comprising a circuit board and an optical transceiving component, wherein the optical transceiving component comprises a transceiving tube, a first notch is provided on the end of the transceiving tube facing the circuit board, and the circuit board is fitted in the first notch. A receiving recess is provided on the upper surface of the transceiving tube, and the receiving recess comprises a first receiving recess part and a second receiving recess part, the height of the first receiving recess part being smaller than the height of the second receiving recess part. A transmitting recess is provided on the lower surface of the transceiving tube, and the transmitting recess comprises a first transmitting recess part, a second transmitting recess part and a third transmitting recess part, the heights of the second transmitting recess part, the third transmitting recess part and the first transmitting recess part sequentially increasing. In the present application, a receiving recess is provided on the upper surface of the transceiving tube, and an optical receiver is provided in the receiving recess so as to realize the reception of an optical signal; a transmitting recess is provided on the lower surface of the transceiving tube, and an optical transmitter is provided in the transmitting recess so as to realize the transmission of an optical signal.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs
• H04B 10/25 - Dispositions spécifiques à la transmission par fibres

Abrégé

An optical module (200), and a preparation method for an optical chip (900). The optical module (200) comprises an optical chip (900) and an optical fiber (101). The optical chip (900) comprises a first substrate (9101), a first buried layer (9102) provided on the first substrate (9101), a first cladding layer (9103) provided on the first buried layer (9102), a second cladding layer (9203) provided on the first cladding layer (9103), and a second buried layer (9202) provided on the second cladding layer (9203), wherein a first waveguide (905) that is away from the first substrate (9101), and a first metal electrode group are provided inside the first cladding layer (9103), and there is a first gap between the first waveguide (905) and the first substrate (9101); and a second waveguide (904) that is away from the first cladding layer (9103) and a second metal electrode group that is close to the first cladding layer (9103) are provided inside the second cladding layer (9203), the second metal electrode group is bonded to the first metal electrode group, the second waveguide (904) is coupled to the first waveguide (905), there is a second gap between the second waveguide and the first waveguide, and the optical fiber (101) is coupled to the first waveguide (905). The optical chip (900) has two substrates (9101, 9201), so as to integrate, in the optical chip (900), the first waveguide (905) that is very far away from the substrates, thereby increasing the distances between the first waveguide (905) and the substrates, and reducing the leakage loss of the substrates.

Classes IPC  ?

• G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière

Abrégé

Disclosed is an optical module, comprising a circuit board, wherein the circuit board comprises a first metal surface layer, a second metal surface layer, and a first metal intermediate layer; the first metal surface layer is provided with golden fingers, an elastic piece is provided on each golden finger, the golden finger includes a high-frequency signal golden finger, and a gap is formed on one side of the golden finger; the first metal intermediate layer is located below the first metal surface layer, and a first insulating supporting layer is provided between the first metal intermediate layer and the first metal surface layer; the first metal intermediate layer in the projection area of the high-frequency signal golden finger does not have a metal layer to form a hollowed-out area; the first insulating supporting layer in the projection area of one side of the high-frequency signal golden finger is hollowed out to form a first groove.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200). In the optical module (200), a support plate (2024) is arranged at one end of a lower housing (202), and a support surface (240) is formed on the top of the support plate (2024); an assembly mechanism is arranged on the support surface (240), and the bottom of the assembly mechanism is connected to the support surface (240); snap-fitting components (243, 623, 318) are arranged at an end of the support surface (240), and the snap-fitting components (243, 623, 318) protrude from the support surface (240); the snap-fitting components (243, 623, 318) each is provided with an unlocking surface (245) at a side edge thereof, the unlocking surface (245) being lower than a top surface of each of the snap-fitting components (243, 623, 318); each of the unlocking components (600, 400) comprises a holding portion (610), a connecting portion (620), an assembly portion (630) and an unlocking portion (640); the unlocking portion (640) comprises an unlocking body (641) and an unlocking support body (640a), one end of the unlocking body (641) being connected to the other end of the assembly portion (630), the other end of the unlocking body (641) being connected to the unlocking support body (640a), and the height of the unlocking support body (640a) being greater than the thickness of the unlocking body (641); the assembly portion (630) is assembled and connected to the assembly mechanism, and the assembly portion (630) can move relative to the assembly mechanism; and the unlocking support body (640a) is located at a side edge of each of the snap-fitting components (243, 623, 318), and the unlocking surface (245) enables the unlocking support body (640a) to unlock the snap-fitting components (243, 623, 318).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module, comprising: an upper shell, wherein a first optical fiber socket mounting portion is formed at the end of the upper shell close to an optical port; a lower shell, wherein a second optical fiber socket mounting portion is formed at the end of the lower shell close to the optical port, and the second optical fiber socket mounting portion and the first optical fiber socket mounting portion form an optical fiber socket mounting cavity; a first optical fiber, on which a first optical fiber connecting component is provided, wherein an end portion of the first optical fiber connecting component is located in the optical fiber socket mounting cavity; and a second optical fiber connected to the first optical fiber connecting component; or, the second optical fiber having one end connected to the second optical fiber connecting component, the second optical fiber connecting component comprising a second optical fiber connector and a second optical fiber protection sleeve, wherein the second optical fiber protection sleeve is sleeved on the first optical fiber, one end of the second optical fiber connector is connected to the second optical fiber protection sleeve, the outer edge of an end portion of the second optical fiber protection sleeve is assembled and connected to the optical fiber socket mounting cavity, and the outer edge of the second optical fiber connector is assembled and connected to the optical fiber socket mounting cavity.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• G02B 6/44 - Structures mécaniques pour assurer la résistance à la traction et la protection externe des fibres, p. ex. câbles de transmission optique
• G02B 6/36 - Moyens de couplage mécaniques

Abrégé

An optical module provided by the present disclosure comprises: a lower housing, comprising a bottom plate, a first lower side plate and a third lower side plate which are located on a side of the bottom plate, and a second lower side plate and a fourth lower side plate which are located on another side of the bottom plate, a first interval being provided between the first lower side plate and the third lower side plate, and a second interval being provided between the second lower side plate and the fourth lower side plate; a first upper sub-housing, which is coveringly connected to the first lower side plate and the second lower side plate, so that the first upper sub-housing and the lower housing form a first accommodating cavity; a second upper sub-housing, one end of which is coveringly connected to the first lower side plate, the second lower side plate, and the first upper sub-housing, the other end of which is coveringly connected to the third lower side plate and the fourth lower side plate, so that the second upper sub-housing and the lower housing form a second accommodating cavity, and the second accommodating cavity is in communication with the first accommodating cavity. The optical module provided by the present disclosure has convenient optical module assembly.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising a light source comprising a laser assembly. The laser assembly comprises a semiconductor gain chip and a wavelength tuning chip which form a resonant cavity; the wavelength tuning chip comprises at least one micro-ring filter; the at least one micro-ring filter is used for screening for a beam of a specific wavelength from among beams emitted by the semiconductor gain chip; the micro-ring filter comprises a first slab region and a second slab region which are located on two sides of a silicon waveguide ridge region, and a contact electrode; an N-type doped region is provided in the first slab region, and a P-type doped region is provided in the second slab region; the P-type doped region and the N-type doped region form a PN junction electrically connected to the contact electrode; and electron-hole pairs in the silicon waveguide ridge region and the first and second slab regions can be absorbed by applying a reverse bias to the PN junction.

Classes IPC  ?

• G02B 6/14 - Convertisseurs de mode

Abrégé

The present disclosure provides an optical module, comprising a coherent assembly for receiving local oscillator light and a first optical signal and performing coherent demodulation on the local oscillator light and the first optical signal. A reception photodetector generates a photo-generated current from the first optical signal. A transimpedance amplifier receives the photo-generated current and amplifies the photo-generated current to output a voltage signal. An analog-to-digital conversion sampler converts the voltage signal into an AD sampling value and transmits the AD sampling value to an MCU formula. The AD sampling value is substituted into a reference optical power formula to calculate a reference optical power value, and the current frequency value is substituted into a frequency deviation formula to calculate the current frequency deviation. The current frequency deviation is subtracted from the reference optical power value to obtain an optical power calculation value as a reported optical power.

Classes IPC  ?

• H04B 10/25 - Dispositions spécifiques à la transmission par fibres

Abrégé

An optical module (200), comprising a circuit board (300) and a lens assembly. A first sealing member is provided between the lens assembly and the circuit board (300); one end of the first lens assembly (911) is provided with a wrapping cavity (9112); optical port recesses (9111), a blocking piece (913) and a third sealing member are arranged on the first lens assembly, the third sealing member is located on the outer side wall of the blocking piece (913), the blocking piece (913) covers the optical port recesses (9111), and each optical port recess (9111) is provided with a reflective surface (9115); an optical fiber holder (912) is fixed in the wrapping cavity (9112); a first end surface of the optical fiber holder (912) is buried in the wrapping cavity (9112); a second sealing member is provided between the optical fiber holder (912) and the wrapping cavity (9112); a first vent hole (9119a) is formed in the wrapping cavity (9112); the extension range of the second sealing member in a gap between the top surface of the optical fiber holder (912) and the wrapping cavity (9112) does not exceed the first vent hole (9119a); and a twelfth sealing member is provided in the first vent hole (9119a). A cooling liquid is isolated by means of the first sealing member, the second sealing member, the blocking piece (913), and the twelfth sealing member arranged in the first vent hole (9119a), and a sealing adhesive is isolated by burying the first end surface of the optical fiber holder (912) in the wrapping cavity (9112).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising: a circuit board provided with an optical chip; a lens assembly covering the optical chip, wherein a first sealing member is arranged between the lens assembly and the circuit board, the first sealing member is located on the outer side wall of the lens assembly and the surface of the circuit board, a wrapping cavity is formed in one end of the lens assembly, the lens assembly is provided with a recessed optical port slot and a blocking assembly, at least part of the blocking assembly covers the optical port slot so as to block a cooling liquid from permeating into the optical port slot, the optical port slot is provided with a reflecting surface, and the reflecting surface is configured to reflect an optical signal; and an optical fiber holder, wherein an optical fiber is fixed on one end of the optical fiber holder, and the other end of the optical fiber holder is fixed in the wrapping cavity; a first end face of the optical fiber holder is buried in the wrapping cavity, a second sealing member is arranged between the optical fiber holder and the wrapping cavity, and the second sealing member is located between side surfaces of the optical fiber holder and the outer side surfaces of three side walls of the wrapping cavity away from the circuit board, and located around one side wall of the wrapping cavity close to the circuit board.

Classes IPC  ?

• G02B 6/44 - Structures mécaniques pour assurer la résistance à la traction et la protection externe des fibres, p. ex. câbles de transmission optique

Abrégé

An optical module (200), comprising a cover shell (910), a base (920), an optical waveguide substrate (900a), a turning prism (502), an optical receiving chip (503), a laser chip (402), a reflector (405), and a displacement prism (407), wherein the base (920) comprises a partition (923), an upper-layer space (924), and a lower-layer space (925); the optical waveguide substrate (900a) is optically coupled to an internal optical fiber, such that a corresponding first input optical port (901a), first output optical port (902a), second input optical port (903a), and second output optical port (904a) are respectively provided on different sides of the optical waveguide substrate (900a), thereby transmitting an optical receiving signal and an optical emitting signal; the laser chip (402) is arranged in the lower-layer space (925) and located in a different layer from that of the optical waveguide substrate (900a), and the laser chip (402) is electrically connected to the other surface of a circuit board (300); in order to guide to the second input optical port (903a) the optical emitting signal generated by the laser chip (402), the reflector (405) is disposed on an output optical path of the laser chip (402), so that the reflector (405) reflects towards a side wall of the partition (923) the optical emitting signal generated by the laser chip (402); and the displacement prism (407) is disposed on the side wall of the partition (923), the displacement prism (407) has an input end facing the layer of the laser chip (402), and an output end facing the second input optical port (903a), thereby guiding into the optical waveguide substrate (900a) the optical emitting signal reflected outwards by the reflector (405).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the present disclosure is an optical module, comprising a lens assembly and an optical fiber holder, wherein an enclosure cavity is provided in the end of the lens assembly facing the optical fiber holder; a second lens is provided in the enclosure cavity; the optical fiber holder encloses an optical fiber; there is a gap between an optical-fiber end face of the optical fiber and the second lens; and the optical-fiber end face of the optical fiber and a first end face of the optical fiber holder are both bevel faces. The enclosure cavity comprises a stop protrusion, wherein the stop protrusion protrudes from the second lens, and the face of the stop protrusion facing the optical fiber holder is a stop face; and the stop face is a bevel face, and is in contact connection with the first end face. In the optical fiber holder and lens assembly of the present disclosure, the stop face and the first end face of the optical fiber holder are both bevel faces, such that the connection between the optical fiber holder and the lens assembly in the lengthwise direction of the lens assembly is realized.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200) comprises a tube body (910), a light emitting component (400), a light receiving component (500) and an optical assembly (920). The optical assembly (920) is located in the tube body (910); the light emitting component (400) and the light receiving component (500) are both connected to the tube body (910); the light emitting component (400) is used for emitting emitted light; and the light receiving component (500) is used for receiving first reflected light. A receiving tube cap (502) of the light receiving component (500) is provided with a first lens (501); a light blocking member (950) covers the first lens (501); the light blocking member (950) is provided with a first light through hole (951); the optical assembly (920) comprises a light processing member; the light processing member is located on a light exit path of second reflected light and is configured to process the second reflected light; the tube body (910) is provided with an extinction cavity; and the extinction cavity is in communication with an inner cavity of the tube body (910) by means of a third light through hole (908). An extinction member is attached to the inner wall of the extinction cavity, and an isolation member (924) is provided at the third light through hole (908).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs

Abrégé

Provided in the present disclosure is an optical module, comprising: a circuit board; an optical receiving component, which is arranged on the circuit board and is used for receiving a received optical signal comprising multiple wavelengths, wherein the optical receiving component comprises: a first lens assembly comprising a first lens body, an accommodating groove being provided in the first lens body, the bottom of the first lens body being connected to the circuit board, the accommodating groove and the circuit board defining an accommodating cavity, the received optical signal being input at one end of the first lens body, a reflective surface being provided on a side wall of the accommodating groove, and the reflective surface being configured to reflect the optical signal; a demultiplexer, which is arranged in the accommodating groove and is configured to receive the received optical signal and transmit the demultiplexed optical signal to the reflective surface; and an optical receiving chip, which is surface-mounted on the circuit board and is located in the accommodating cavity, the optical receiving chip receiving the optical signal reflected by the reflective surface.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a circuit board (105) and a light emitting component (400). The light emitting component (400) comprises a housing (410), a first flexible circuit board (440), an electrical connector (420), and a support member (450). A first wire bonding area is formed on the surface of the first flexible circuit board (440). One end of the electrical connector (420) is separately provided with a first step (422a1) and a second step (423a1). A wire bonding area is formed on the surface of the first step (422a1). In order to achieve wire bonding between the first flexible circuit board (440) and the first step (422a1), a support member (450) is provided on the second step (423a1), the support member (450) is fixedly connected to the second step (423a1), and the first flexible circuit board (440) is supported by means of the support member (450), so that the first wire bonding area on the surface of the first flexible circuit board (440) is flush with the second wire bonding area on the surface of the first step (422a1), thereby implementing a wire bonding process between the first flexible circuit board (440) and the first step (422a1). The high-frequency signal transmission quality can be improved.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a lower housing (202), an upper housing (201), a circuit board (300), an optical component, an optical fiber adapter (700), an optical cable plug (900), a protective sleeve, and an unlocking component (600). The upper housing (201) and the lower housing (202) form a cavity. The optical fiber adapter (700) is located in the cavity, and the optical fiber adapter (700) comprises a snap-fit clip (710) and an optical fiber plug (720). The optical cable plug (900) comprises an insertion portion (901), a connection portion (906), and an annular sliding sleeve (905). The protective sleeve comprises a first protective sleeve (910) and a second protective sleeve (920), the first protective sleeve (910) is snap-fitted to the second protective sleeve (920), and the annular sliding sleeve (905) is located in the first protective sleeve (910) and the second protective sleeve (920); and the protective sleeve abuts against side surfaces of the upper housing (201) and of the lower housing (202). The unlocking component (600) comprises a handle (610) and an unlocking device, the unlocking device is snap-fitted onto side plates of the upper housing (201), and the handle (610) is rotatably connected to the unlocking device. Switching between an optical fiber optical module and an optical cable optical module is achieved by means of the optical cable plug (900); the detachment of the optical cable plug (900) is prevented by means of the protective sleeve; and the rotatable structure of the unlocking component facilitates the mounting of the protective sleeve on the optical cable plug (900).

Classes IPC  ?

• G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising: a circuit board (300), a light receiving component (500), and a digital signal processor chip (301). The light receiving component (500) and the digital signal processor chip (301) are both located on the upper surface of the circuit board (300). The light receiving component (500) comprises a light receiving chip (504). The digital signal processor chip (301) is connected to the circuit board (300) by means of a solder ball. A transimpedance amplifier chip is integrated inside the digital signal processor chip (301), a first solder ball of the transimpedance amplifier chip is provided on the lower surface of the digital signal processor chip (301), and the light receiving chip (504) is connected to the first solder ball of the digital signal processor chip (301). A first placement recess (310a) recessed inwards is provided on the upper surface of the circuit board (300), and the light receiving chip (504) is provided in the first placement recess (310a). The difference between the depth of the first placement recess (310a) and the thickness of the light receiving chip (504) is within a first preset range, such that the height difference between a high-frequency signal pin of the light receiving chip (504) and the first solder ball is within the first preset range.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising an upper shell (201), a lower shell (202), a circuit board (300), optical components (400, 500), and an optical connecting component (900) mounted on the circuit board (300). A cavity formed by the upper shell (201) and the lower shell (202) has only one opening (204) for accommodating the optical connecting component (900) and a goldfinger (301) on the circuit board (300). Optical devices of the optical components (400, 500) are electrically connected to the circuit board (300), and comprise a first optical emitting component connected to the optical connecting component (900) through a first ribbon optical fiber cable, and a second optical emitting component connected to the optical connecting component (900) through a second ribbon optical fiber cable. The optical connecting component (900) comprises an optical fiber fixing piece (902), a plug-in connector (904) and a ferrule element (905) connected to the plug-in connector (904), wherein the optical fiber fixing piece (902) comprises a connecting part and an inserting part (9021) which are connected, an accommodating cavity into which the plug-in connector (904) is inserted being formed in the connecting part, and a cavity (910) in communication with the accommodating cavity being formed in the inserting part (9021); the ferrule element (905) is inserted into the cavity (910) through the plug-in connector (904); optical fibers connected to the optical components (400, 500) run through the accommodating cavity to be optically connected to the ferrule element (905); and a clearance gap (9045) is formed in the plug-in connector (904), and the first ribbon optical fiber cable and the second ribbon optical fiber cable run through the clearance gap (9045).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs
• H04B 10/25 - Dispositions spécifiques à la transmission par fibres

Abrégé

Provided in the present disclosure is an optical module (200), comprising: a circuit board (300), in which a mounting hole (302) is formed; a light-emitting component (400) embedded in the mounting hole (302), the light-emitting component (400) comprising an emitting base (410) embedded in and connected to the mounting hole (302), a light-emitting assembly arranged on the emitting base (410) and connected to a surface of the circuit board (300) in a wire bonding manner for generating 2N paths of optical signals, where N ≥ 1, and a collimating lens group (440) located in an output optical path of the light-emitting assembly; a first light receiving component (510) arranged on the circuit board (300) for receiving N paths of optical signals, the first light receiving component (510) being connected to the surface of the circuit board (300); and a second light receiving component (520) arranged on the circuit board (300) for receiving N paths of optical signals, the second light receiving component (520) being connected to the surface of the circuit board (300). A second optical fiber (721) is connected to the first light receiving component (510), and the second optical fiber (721) passes through the side of the emitting base (410); and a third optical fiber (731) is connected to the second light receiving component (520), and the third optical fiber (731) passes through the side of the emitting base (410).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising: a first optical transmitter chip, a second optical transmitter chip, a first amplitude-limiting driver chip, a second amplitude-limiting driver chip, and a micro control unit. A first input end of a third switch is connected to the first amplitude-limiting driver chip, a second input end of the third switch is connected to the micro control unit, and a second output end of the third switch is connected to the first amplitude-limiting driver chip. The second amplitude-limiting driver chip is connected to a first output end of the third switch. At a first temperature, the first optical transmitter chip transmits first wavelength signal light, and the second optical transmitter chip transmits third wavelength signal light. At a second temperature, the first optical transmitter chip transmits second wavelength signal light, and the second optical transmitter chip transmits fourth wavelength signal light. The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light increase sequentially. The ratio of a high temperature difference to an ambient temperature threshold is less than or equal to 40%.

Classes IPC  ?

• H04B 10/40 - Émetteurs-récepteurs

Abrégé

Provided in the embodiments of the present disclosure is an optical module, comprising: a circuit board, which is provided with a digital signal processing assembly, a depressed area being formed on the surface of the circuit board; and an optical receiving component, comprising an optical receiving chip which is configured to receive an optical signal and is located in the depressed area, the difference between the depth of the depressed area and the thickness of the optical receiving chip being within a first preset range, such that the height difference between a high-frequency signal pin of the optical receiving chip and a signal connection end of the digital signal processing assembly is within the first preset range, wherein the signal connection end of the digital signal processing assembly and the depressed area are located on the same surface of the circuit board. The optical module further comprises a receiving bottom board, which is embedded in the depressed area, the optical receiving component being located on the receiving bottom board, and the elastic modulus of the receiving bottom board being greater than that of the circuit board.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

Provided in the embodiments of the present disclosure is an optical module, comprising: a circuit board, wherein a notch is formed in the surface thereof, a first connecting part is formed on the side wall of the notch, and the circuit board is provided with a signal pin area; a light transmitting component, located at the notch, the light transmitting component comprising an electric connector, the electric connector being provided with a bonding pad area, the bonding pad area being connected to the signal pin area, a second connecting part being formed on the end face of the electric connector facing the circuit board, and the second connecting part being embeddedly connected to the first connecting part, so as to achieve a relatively fixed connection between the electric connector and the circuit board; a carrying component, connected to the light transmitting component or the circuit board, the carrying component being configured to adjust the position of the light transmitting component at the notch, such that the signal pin area is flush with the bonding pad area; and a protective component, provided on the circuit board, the protective component being configured to protect the connection between the signal pin area and the bonding pad area.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), the optical module (200) comprising: a circuit board (300), a surface of which is provided with an optical transmitting chip (310) and an optical receiving chip (320); and a lens assembly (400), wherein the bottom of the lens assembly (400) is connected to the circuit board (300) and the lens assembly (400) covers the optical transmitting chip (310) and the optical receiving chip (320); the lens assembly (400) comprises a lens assembly body (430), a first optical fiber adapter (410) and a second optical fiber adapter (420); the first optical fiber adapter (410) and the second optical fiber adapter (420) are arranged at a first end of the lens assembly body (430), the first optical fiber adapter (410) is configured to transmit an emitted-light signal, and the second optical fiber adapter (420) is configured to transmit a received-light signal; the distance between the center of the optical transmitting chip (310) and the center of the optical receiving chip (320) in a direction perpendicular to the optical axis of the first optical fiber adapter (410) and the optical axis of the second optical fiber adapter (420) is less than the distance between the optical axis of the first optical fiber adapter (410) and the optical axis of the second optical fiber adapter (420); and the lens assembly body (430) is provided with a first optical face (4311), a second optical face (4321), a third optical face (4331) and a fourth optical face (4341).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre

Abrégé

The present invention provides an optical module, comprising a circuit board, a power supply chip, a DSP chip, a light receiving component, an MCU, and a light transmitting component. The power supply chip is electrically connected to gold fingers on a circuit board, and supplies power to the DSP chip; the light receiving component is electrically connected to the DSP chip; and the MCU is separately connected to the power supply chip and the DSP chip. The MCU is configured to: control the power supply chip to output a power supply voltage; acquire the power supply voltage and a reception parameter in the DSP chip, wherein the reception parameter comprises a bit error rate and a signal-to-noise ratio at a receiving side; when a temperature changes, determine whether the reception parameter exceeds a target range; when the reception parameter does not exceed the target range, control the power supply chip to decrease the outputted power supply voltage value; and when the reception parameter exceeds the target range, control the power supply chip to increase or decrease the outputted power supply voltage value. According to the optical module, when the temperature changes, a reception parameter of the optical module is changed by adjusting a power supply voltage of a DSP chip, such that the high performance and low power consumption of the optical module are guaranteed.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising a circuit board and a transceiver housing. The transceiver housing is provided with a notch, and the circuit board extends into the transceiver housing through the notch. One surface of the circuit board is provided with a first light receiving chip and a second light receiving chip, and the other surface of the circuit board is provided with a third light receiving chip. A second prism, a first prism, a wavelength division multiplexer, a first displacement prism set, a second displacement prism set and a third displacement prism set are respectively arranged in the transceiver housing. The wavelength division multiplexer comprises a first light outlet, a second light outlet and a third light outlet. The first displacement prism set is arranged corresponding to the first light outlet and is configured to adjust the transmission direction of a fifth wavelength optical signal and raise an optical path of the fifth wavelength optical signal. The second displacement prism set is arranged corresponding to the second light outlet and is configured to raise the optical path of the fifth wavelength optical signal. The third displacement prism set is arranged corresponding to the third light outlet and is configured to guide the transmission direction of a sixth wavelength optical signal on one surface of the circuit board to the other surface of the circuit board.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module. The optical module comprises a circuit board and a light emitting component electrically connected to the circuit board; the light emitting component comprises a transmitting tube shell, pins, and a grounding member and a light emitting assembly which are located in the transmitting tube shell; insertion holes are formed in one side of the transmitting tube shell; one end of each pin is electrically connected to the circuit board, and the other end of the pin is inserted into the insertion hole; the pins are sealedly connected to the insertion holes by means of insulating members; the pins comprise grounding pins connected to the transmitting tube shell and high-speed signal pins inserted into the transmitting tube shell; the grounding member is attached to the inner wall of the transmitting tube shell; the grounding member surrounds the high-speed signal pins; the projection area of the grounding member on the transmitting tube shell covers some of the insulating members; and laser groups of the light emitting assembly are respectively connected to the high-speed signal pins and the grounding member by means of wire bonding so as to generate signal light. According to the present disclosure, the grounding member is additionally arranged on the periphery of the high-speed signal pins, so that the distance between the high-speed signal pins and the GND is reduced by means of the grounding member, thereby achieving impedance matching between the high-speed signal pins and the laser groups.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module, comprising: a circuit board; and a light emitting component having one end electrically connected to the circuit board. The light emitting component comprises a bottom plate; the bottom plate comprises a first placement recess and a supporting plate; a laser chip set and a first focusing lens set are arranged in the first placement recess; an optical transmission component is arranged in the supporting plate; and an optical signal emitted by the laser chip set is converged by the first focusing lens set and is then coupled to the optical transmission component. The supporting plate comprises: an adaptation base protruding from the upper surface of the supporting plate, the optical transmission component being located above the adaptation base; and an adhesive spilling groove located on at least one side of the adaptation base. The supporting plate is provided with a limiting portion, and the limiting portion protrudes from the upper surface of the adaptation base; and the side wall of the optical transmission component is connected to the limiting portion.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising a circuit board and a light emitting component. A driver on the circuit board comprises a first output end and a second output end, which respectively output a first modulation signal and a second modulation signal. In the light emitting component, a first modulation unit is connected to the first output end by means of a first path, and a second modulation unit is connected to the second output end by means of a second path. The first modulation unit performs first modulation on an optical signal according to the first modulation signal, and the second modulation unit performs second modulation on the optical signal according to the second modulation signal. The first modulation and the second modulation are in-phase modulations. The in-phase modulations comprise: when the first modulation signal and the second modulation signal are the same signals, the attributes of the first modulation unit and the second modulation unit are different, and a phase reverse circuit is arranged on the first path or the second path; when the first modulation signal and the second modulation signal are differential signals, the attributes of the first modulation unit and the second modulation unit are the same, and a phase reverse circuit is arranged on the first path or the second path.

Classes IPC  ?

• H04B 10/50 - Émetteurs

Abrégé

An optical module (200), comprising: a circuit board (300) provided with a notch (310), and an optical transceiver component (400) comprising an optical transceiver housing (500). A first support plate (510) is formed on one side of the optical transceiver housing (500), and a second support plate (520) and a third support plate (530) are formed on another side of the optical transceiver housing (500), the first support plate (510) being located above the second support plate (520), and a gap (570) being formed between a bottom surface of the second support plate (520) and a top surface of the third support plate (530). The optical transceiver housing (500) is located in the notch (310), and the gap (570) has an embedded connection to the circuit board (300) having the notch (310) in its edge. The optical module also comprises: a first light-emitting assembly (410a), disposed on the top surface of the first support plate (510); a second light-emitting assembly (410b), disposed on the bottom surface of the first support plate (510); a first light-receiving assembly (420a), disposed on the second support plate (520); a second light-receiving assembly (420b), disposed on the third support plate (530); a first upper cover (430), connected to the optical transceiver housing (500) and covering the first light-emitting assembly (410a) and the first light-receiving assembly (420a); and a second upper cover (440), connected to the optical transceiver housing (500) and covering the second light-emitting assembly (410b) and the second light-receiving assembly (420b).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a circuit connection board (300a) and an optical receiver (500), wherein the optical receiver (500) comprises a case. A recess (301a) is formed on one end of the circuit connection board (300a), the surface of the recess (301a) comprising a first side wall (301a1), a second side wall (301a2), and a connecting face (301a3) disposed between the first side wall (301a1) and the second side wall (301a2). One end of the case is provided with a clearance hole (515); and a first step (511), a second step (512), a third step (513) and a fourth step (514), which are located at sequentially increasing heights, are formed on a bottom surface of the case, such that different optical elements are arranged by means of the steps at different heights. The clearance hole (515) allows the circuit connection board (300a) to extend into the case until the recess (301a) surrounds the periphery of the second step (512); the first step (511) is used for supporting the circuit connection board (300a); and the second step (512) is used for supporting an optical receiving chip (550) and a TIA (560). The surface of the recess (301a) consists of the first side wall (301a1), the second side wall (301a2), and the connecting face (301a3) disposed between the first side wall (301a1) and the second side wall (301a2); and the recess (301a) of this form allows for an increase in the orientations and regions for pad arrangement, thereby facilitating the layout of bonding wires of the optical receiving chip (550) and the TIA (560), and shortening the length of said bonding wires.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

In an optical module provided in the present disclosure, one end of an optical fiber adapter is configured to connect to an external optical fiber; an optical accommodating component is connected to the other end of the optical fiber adapter; a light-emitting component comprises a second cavity; one end of the second cavity is connected to the optical accommodating component; and a first-wavelength optical signal, a second-wavelength optical signal and a third-wavelength optical signal outputted by the light-emitting component are input into the optical accommodating component, and are transmitted to the external optical fiber by means of the optical fiber adapter. The optical accommodating component comprises: a first cavity inside which an accommodating inner cavity is formed, wherein one end of the first cavity is connected to the optical fiber adapter, and the other end thereof is connected to the second cavity, and a second connecting hole, a third connecting hole and a fourth connecting hole are provided in a second side of the first cavity; an optical assembly, which is arranged in the accommodating inner cavity; a first light-receiving component, which is connected to the second connecting hole; a second light-receiving component, which is connected to the third connecting hole; and a third light-receiving component, which is connected to the fourth connecting hole. A circuit board is electrically connected to the light-emitting component, the first light-receiving component, the second light-receiving component and the third light-receiving component.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a first light shaping assembly (540) or a second light shaping assembly, a filter assembly (560), and photoelectric assemblies (570, 580), wherein the filter assembly (560) is located on a light exit path of the first light shaping assembly (540) or the second light shaping assembly; photosensitive surfaces of the photoelectric assemblies (570, 580) face the filter assembly (560); the first light shaping assembly (540) converts a second light signal into a first light sub-beam and a second light sub-beam, which each include first signal light and second signal light, the wavelength of the first signal light being different from the wavelength of the second signal light; and the central axis of the first light shaping assembly (540) coincides with a bisector of an included angle between the first light sub-beam and the second light sub-beam.

Classes IPC  ?

• G02B 6/34 - Moyens de couplage optique utilisant des prismes ou des réseaux
• G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde

Abrégé

An optical module, comprising a lower casing (202), a circuit board (300) mounted in the lower casing (202) and a digital signal processor connected, by means of solder balls, to the circuit board (300). Opposite side surfaces of the circuit board (300) are respectively in contact with lower side plates (2022) of the lower casing (202). The circuit board (300) comprises an upper layer plate (303), at least one heat conduction plate (304, 305) and a lower layer plate (306) which are stacked, a heat conduction layer (3019) being plated on the upper layer plate (303), the heat conduction layer (3019) being in contact with the lower side plates (2022), and grounding solder balls (3021) at the edge of the digital signal processor being connected to the heat conduction layer (3019). A heat-conducting connection block (312) is provided in the upper layer plate (303), and grounding solder balls (3021) on the inner side of the digital signal processor are connected to the grounding solder balls (3021) at the edge of the digital signal processor by means of the heat-conducting connection block (312). The at least one heat conduction plate (304, 305) is in contact with the lower side plates (2022), and a heat conduction via hole is provided between the upper layer plate (303) and the at least one heat conduction plate (304, 305), two ends of the heat conduction via hole being respectively connected to the grounding solder balls (3021) and the at least one heat conduction plate (304, 305). Heat of the digital signal processor is transferred to the side wall of the lower casing (202) by means of the circuit board (300), thereby increasing heat dissipation channels and improving heat dissipation efficiency.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising an optical transceiver component (400). The optical transceiver component (400) comprises: a rounded square tube (401), which is provided with a rounded square tube (401) accommodating cavity, and a first tube opening (40131), a second tube opening (4011) and a third tube opening (40134) in communication with the rounded square tube (401) accommodating cavity; an adjusting ring, which is provided with an adjusting ring accommodating cavity, and a first end and a second end in communication with the adjusting ring accommodating cavity, wherein the first end of the adjusting ring is fixedly connected to the first tube opening (40131) of the rounded square tube (401); a light-emitting assembly (402), which is in communication with the first tube opening (40131) of the rounded square tube (401) by means of the adjusting ring, wherein the light-emitting assembly (402) is provided with a light-emitting assembly accommodating cavity, and the second end of the adjusting ring is fixed in the light-emitting assembly accommodating cavity; a light-receiving assembly (403), which is arranged in the second tube opening (4011); an optical fiber adapter (405), which is arranged in the third tube opening (40134); and an optical assembly (404), which is partially arranged inside the rounded square tube accommodating cavity, is partially arranged inside the adjusting ring accommodating cavity, and extends into the light-emitting assembly (402). The optical assembly (404) comprises: a first lens (4042), which is provided at one end of the optical assembly (404), and is used for collimating an optical signal emitted by the light-emitting assembly (402); a second lens (4043), which is provided at the other end of the optical assembly (404), faces the optical fiber adapter (405), and is used for coupling an optical signal in the rounded square tube (401) to the optical fiber adapter (405) and for collimating an optical signal incident into the rounded square tube (401) from the optical fiber adapter (405); and a light guide member (4041), which is located between the first lens (4042) and the second lens (4043), and is provided with a first end and a second end, wherein the first end of the light guide member (4041) is connected to the first lens (4042), and the second end of the light guide member (4041) is connected to the second lens (4043). The light guide member (4041) is provided with a light-splitting film or an optical filter, and is used for transmitting into the second lens (4043) the optical signal collimated by the first lens (4042) and for reflecting to the light-receiving assembly (403) the optical signal collimated by the second lens (4043). The first lens (4043) is arranged in the light-emitting assembly (402); and the first end of the light guide member (4041) is inserted into the adjusting ring accommodating cavity, and the second end of the light guide member (4041) and the second lens (4043) are arranged in the rounded square tube accommodating cavity.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/40 - Émetteurs-récepteurs

Abrégé

An optical module (200), a substrate (600) being provided on the surface of a circuit board (300), and the substrate (600) has a clamping groove. A light receiving portion comprises two light receiving assemblies (503, 504), the two light receiving assemblies (503, 504) both being disposed at the clamping groove. The two light receiving assemblies (503, 504) each comprise a receiving tube cap (5032), a receiving tube base (5031) and a light splitting device (5036, 5038). The light splitting device (5036, 5038) is fixedly connected to the receiving tube cap (5032), the light splitting device (5036, 5038) comprises a light splitting member and at least two lenses (50363, 50365), and the at least two lenses (50363, 50365) are each fixedly connected to the light splitting member. The light splitting member has at least two light splitting films, the at least two light splitting films dividing a received beam of data light into at least two beams of data light. The at least two beams of data light are coupled to corresponding light receiving chips (5034, 5035), respectively, by means of the lenses. The light receiving portion comprises light receiving assemblies (503, 504), the light receiving assemblies (503, 504) being fixed on the circuit board (300) by means of the substrate (600). The light receiving assemblies (503, 504) comprise the light splitting devices (5036, 5038), the light splitting devices (5036, 5038) being used to split light to enable the light receiving components (503, 504) to achieve at least dual-channel receiving functions.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

An optical module (200), comprising a circuit board (300) and a light receiving component (500). The light receiving component (500) is electrically connected to the circuit board (300). The light receiving component (500) comprises a tube base (510), a tube cap (520), a support (530) and an optical assembly (540). The top surface of the tube base (510) is provided with a first photoelectric detector (512) receiving a light signal having a first wavelength, and a second photoelectric detector (513) receiving a light signal having a second wavelength. The bottom of the tube cap (520) is connected to the tube base (510), and covers the tube base (510) to form a sealed cavity with the tube base (510). The support (530) is provided in the sealed cavity and has a chamber. The optical assembly (540) is provided on the support rack (530), and is located above the first photoelectric detector (512) and the second photoelectric detector (513). The optical assembly (540) is configured to separate the optical signal having the first wavelength and the optical signal having the second wavelength according to the wavelength in a beam of optical signals, transmit the optical signal having the first wavelength to the first photoelectric detector (512), and transmit the optical signal having the second wavelength to the second photoelectric detector (513). The optical assembly (540) comprises a light splitting sheet (541) located above the first photoelectric detector (512), a reflecting sheet (542) located above the second photoelectric detector (513) as well as an optical filter (543), all of which are located in the chamber.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H04B 10/60 - Récepteurs

Abrégé

An optical module (200), comprising a circuit board (300), a first object placement member (600), a second object placement member (900), a first digital signal processing chip (301), a second digital signal processing chip (302), a first light-emitting component (400), a first light-receiving component (500), a second light-emitting component (401) and a second light-receiving component (501), wherein the first light-emitting component (400) is located on the second object placement member (900), and both the first light-emitting component (400) and the first light-receiving component (500) that is located on an upper surface of the circuit board (300) are connected to the first digital signal processing chip (301); the second light-emitting component (401) is located on a lower surface of the first object placement member (600), and both the second light-emitting component (401) and the second light-receiving component (501) that is located on the upper surface of the circuit board (300) are connected to the second digital signal processing chip (302); the first object placement member (600) is provided with a notch (602) and a hollow region (604); a second receiving optical fiber is wound from one face of the first object placement member (600) to the other face by means of the notch (602), and a second emitting optical fiber is wound from one face of the first object placement member (600) to the other face by means of the hollow region (604), such that the second light-emitting component (401) and the second light-receiving component (501) are connected to an optical fiber connector group (800) by means of optical fibers; the second receiving optical fiber is an optical fiber for connecting the optical fiber connector group (800) to the second light-receiving component (501); and the second emitting optical fiber is an optical fiber for connecting the optical fiber connector group (800) to the second light-emitting component (401).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module and a received optical power calibration method therefor. The optical module comprises a circuit board, a photoelectric detector and an MCU. The photoelectric detector is electrically connected to the circuit board, and is used to convert an optical signal into an electric signal. The MCU comprises a first register, the first register being used to store a compensation rule used for receiving an optical power ADC sampling value, the compensation rule comprising a deviation value of a received optical power ADC sampling value of a selected wavelength relative to a received optical power ADC sampling value of a reference wavelength. The MCU is configured to: acquire a received optical power calibration function of the reference wavelength; perform compensation on the received optical power ADC sampling value of the corresponding wavelength according to the compensation rule, to obtain a received optical power ADC compensation value; and obtain a corresponding received optical power report value according to the received optical power calibration function of the reference wavelength and the received optical power ADC compensation value of the corresponding wavelength.

Classes IPC  ?

• H04B 10/40 - Émetteurs-récepteurs
• H04B 10/69 - Dispositions électriques dans le récepteur
• H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données

Abrégé

The present disclosure provides an optical module, comprising a circuit board and a transceiving component. The optical transceiving component comprises a tube base and an optical device. The tube base comprises: a tube base body, provided with a through hole running through a top surface and a bottom surface of the tube base body, a first optical device being supported on the top surface; a grounding pin, one end of which is connected to a conductive layer, the conductive layer being disposed in the through hole, and an insulating layer being disposed between the conductive layer and the tube base body; and a high frequency pin, one end of which passes through the conductive layer, the conductive layer surrounding around an edge of the high frequency pin, an insulating layer being disposed between the conductive layer and the high frequency pin, and the end of the high frequency pin passing through the conductive layer being electrically connected to the first optical device. Alternatively, the tube base comprises: a tube base body, provided with a through hole running through a top surface and a bottom surface of the tube base body, a second optical device being supported on the top surface, a conductive wall being provided on the top surface, and the conductive wall surrounding an edge of the through hole; and a high frequency pin, one end of which passes through the through hole and is insulated from the tube base body, the end of the high frequency pin passing through the through hole being electrically connected to the second optical device.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

The present disclosure provides an optical module, comprising a circuit board and a light emitting device. The light emitting device is electrically connected to the circuit board, and the light emitting device comprises: a tube base; a cap in snap-fit to the tube base to form a light emitting space; a base arranged on one side of the tube base and located in the light emitting space; pins, one end of each pin passing through and protruding out of the tube base; and a metal ceramic substrate arranged on one side of the base, the bottom surface of the metal ceramic substrate abutting against the tops of the pins. The maximum distance between the metal ceramic substrate and the base is larger than the minimum distance between the pin and the base. The other end of the pin passes through the tube base and protrudes out of the light emitting space. The light emitting device further comprises a laser chip connected to the pins; and a flexible circuit board having one end sleeved on the pins and the other end connected to the circuit board, wherein a matching resistor is arranged on the flexible circuit board, and the sum of the impedance of the matching resistor and the impedance of a laser driving chip is equal to the impedance of the laser chip.

Classes IPC  ?

• H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données

Abrégé

The present disclosure provides an electrical port module, which comprises a circuit board, a network port terminal, and a PHY chip and an MCU arranged on the circuit board. The end part of the circuit board is provided with a gold finger comprising an I2C pin and a multiplexing pin. The PHY chip comprises a state register used for storing a state register value corresponding to a link state of the network port terminal. One end of the MCU receives an instruction of a host device through the I2C pin, and the other end of the MCU is connected to the PHY chip to obtain a state register value and send a corresponding level signal to the multiplexing pin according to the state register value. A function configuration register in the MCU is configured to store a register value corresponding to the instruction of the host device, and the MCU performs corresponding function configuration on the multiplexing pin according to the register value, thus obtaining the link state of the network port terminal according to the level signal of the multiplexing pin. The present disclosure allows the multiplexing pin to have a new function, and the host device obtains the link state of the network port terminal by monitoring the level state of the multiplexing pin, thereby facilitating identification by a user.

Classes IPC  ?

• H04L 49/15 - Interconnexion de modules de commutation

Abrégé

A laser device (900) and an optical module (200). The optical module (200) comprises the laser device (900), which comprises a substrate, wherein the surface of the substrate is provided with a grating region (910) and a silicon waveguide region (920), and a III-V waveguide region (930) covers the entire upper surface of the grating region (910) and part of the upper surface of the silicon waveguide region (920). The grating region (910) comprises a first partition (911) and a second partition (912); the silicon waveguide region (920) comprises a first tapered silicon waveguide region (921), a second tapered silicon waveguide region (922) and a third tapered silicon waveguide region (923); and the III-V waveguide region (930) comprises a III-V linear waveguide region (931), a first III-V gradient waveguide region (932) and a second III-V gradient waveguide region (933). The laser device (900) is of an asymmetric waveguide coupling structure, the grating coupling coefficient of the grating region (910) showing partitioned differences, wherein the grating coupling coefficient of the first partition (911) is greater than the grating coupling coefficient of the second partition (912), such that the reflection on the side of the first partition (911) is improved, thereby realizing single-ended, high-power and single-wavelength output of the laser device (900), and improving the optical power and reducing the power consumption thereof.

Classes IPC  ?

• H01S 5/10 - Structure ou forme du résonateur optique
• H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
• H01S 5/20 - Structure ou forme du corps semi-conducteur pour guider l'onde optique

Abrégé

Disclosed are an optical module, and a method for monitoring the transmitted optical power of an optical module. The optical module comprises: a circuit board, which is provided with a laser driving chip and an MCU; and a light transmitting component, which comprises a semiconductor laser, a backlight detector and a temperature sensor, wherein the backlight detector is used for receiving backlight of the semiconductor laser, and the temperature sensor is used for measuring the operating temperature of the semiconductor laser; the backlight detector is connected to the laser driving chip, the laser driving chip is connected to the MCU, and the laser driving chip obtains an ADC value and transmits same to the MCU; and the MCU acquires the ADC value and the current operating temperature of the semiconductor laser, determines a corresponding dark current compensation value and a corresponding optical power compensation value according to the current operating temperature, and uses the dark current compensation value and the optical power compensation value to compensate for the ADC value, which is measured by using the backlight detector, of the transmitted optical power of the optical module.

Classes IPC  ?

• H04B 10/079 - Dispositions pour la surveillance ou le test de systèmes de transmissionDispositions pour la mesure des défauts de systèmes de transmission utilisant un signal en service utilisant des mesures du signal de données

Abrégé

An optical module is provided in the present disclosure, which comprises: a circuit board; a light source; an optical modulation chip, said chip being electrically connected to the circuit board, and the optical modulation chip comprising an optical modulator, the optical modulator being configured to modulate direct current light that does not carry data into an optical signal; the optical modulator comprises: two interference arms; and optical power detection assemblies, which are at least arranged on light emergent sides of the two interference arms, and acquire detected voltages; an MCU is electrically connected to the circuit board, and the MCU is configured to adjust the detected voltages to preset voltages. By means of heaters or phase converters, the optical power of the optical modulator is adjusted, and the power consumption of the optical module is reduced.

Classes IPC  ?

• H04B 10/564 - Commande de la puissance

Abrégé

An optical module (200), comprising a first circuit board (300) and a tunable laser module (600), wherein the tunable laser module (600) comprises a packaging cavity (600c) and a second circuit board (600a); a light-emitting chip (651), a functional electrical chip group, a wavelength selection component, a shifter (655) and a phase shifter (654) are respectively arranged inside the packaging cavity (600c); a second MCU and a power conversion chip (600a2) are arranged on a surface of the second circuit board (600a); the functional electrical chip group comprises an analog switch (665), a current driving chip (666) and a monitoring chip (667); the current driving chip (666) and the monitoring chip (667) are transferred into the packaging cavity (600c) to reduce the area of the second circuit board (600a), thereby reducing the volume of the tunable laser module (600); and according to a first enable control signal that is output by the second MCU, the analog switch (665) controls a polling connection between the current driving chip (666) and an object to be heated, and according to a second enable control signal that is output by the second MCU, the analog switch (665) also controls a polling connection between the monitoring chip (667) and an object to be monitored, so as to ensure the normal operation of the current driving chip (666) and the monitoring chip (667).

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques

Abrégé

A pluggable electronic module, comprising: a housing, the housing consisting of an upper housing and a lower housing (202), the upper housing and the lower housing (202) defining a chamber for accommodating a circuit board (105), and the housing comprising an unlocking motion guide structure for limiting the motion position of a unlocking device (2032), a position-fixing protrusion (2021) provided on the outer wall of the housing, and a first pivotable position-fixing component provided on the side surface, wherein the position-fixing protrusion (2021) and the unlocking motion guide structure are arranged on the same surface of the housing; and an unlocking mechanism (203), comprising a handle (2031) and an unlocking device (2032). The handle (2031) is provided with a second pivotable position-fixing component and an unlocking surface, and the handle (2031) is pivotably connected to the housing by means of the fitting connection of the second pivotable position-fixing component and the first pivotable position-fixing component. A reset spring (2033) is provided in an accommodation chamber of the unlocking motion guide structure, and the reset spring (2033) connects the unlocking device (2032) and the housing. One side of the unlocking device (2032) is inserted into the accommodation chamber of the unlocking motion guide structure, and the end part of the other side of the unlocking device opposite to said side is in contact with the unlocking surface. Thus, when the handle (2031) rotates, an applied force drives the unlocking device (2032) to slide on the housing; during unlocking, the applied force drives the unlocking device (2032) to slide and compress the reset spring (2033) until the locking of the position-fixing protrusion (2021) by an external device is released; and after unlocking, as the applied force is removed, the compressed reset spring (2033) drives the unlocking device (2032) to slide on the housing, and the unlocking device (2032) slides to drive the handle (2031) to rotate to be reset.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques