A method of the disclosure is for installing a radio wave sensor configured to radiate a radio wave to a range including a target area that is set for detection of an object. The method includes: a step of installing a reference object; and a step of adjusting a radio wave radiation direction of the radio wave sensor, using the reference object as a reference. The reference object is installed at a first position outside the target area.
An abnormality detection device includes a parallel circuit unit in which a plurality of conductive paths are connected in parallel, a plurality of current sensors, and an abnormality determination unit. The current sensors respectively detect currents flowing through the plurality of conductive paths. The abnormality determination unit performs abnormality determination of the current sensors based on the respective detection values of the plurality of current sensors. In the abnormality detection device, currents distributed between the plurality of conductive paths are detected by the respective current sensor, and abnormality determination of the current sensors is performed based on the detection values. Accordingly, with this configuration, the current tolerance of the individual current sensors can be reduced, and thus the current sensors can be easily downsized.
G01R 35/00 - Test ou étalonnage des appareils couverts par les autres groupes de la présente sous-classe
G01R 15/14 - Adaptations fournissant une isolation en tension ou en courant, p. ex. adaptations pour les réseaux à haute tension ou à courant fort
G01R 15/20 - Adaptations fournissant une isolation en tension ou en courant, p. ex. adaptations pour les réseaux à haute tension ou à courant fort utilisant des dispositifs galvano-magnétiques, p. ex. des dispositifs à effet Hall
G01R 19/10 - Mesure d'une somme, d'une différence, ou d'un rapport
A resin composition according to one aspect contains: a polyimide precursor which is the reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine; an organic solvent; and water. The resin composition has a water content of less than 0.5 mass %.
C09D 179/08 - PolyimidesPolyesterimidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
4.
FUSION SPLICING SYSTEM, FUSION SPLICING METHOD, OPTICAL FIBER IDENTIFICATION SYSTEM, OPTICAL FIBER IDENTIFICATION METHOD, AND RECORDING MEDIUM
A fusion splicing system according to one embodiment includes: a process of imaging a plurality of optical fibers having colors, a process of determining whether or not an actual measurement alignment order which is an alignment order of the colors of the plurality of optical fibers in an image imaged in the process of imaging matches with a target alignment order stored in the storage unit; a process of outputting a result of the determination in the process of determining; and a process of fusion-splicing the plurality of optical fibers.
A detection device includes: a calculation unit configured to calculate reception intervals of the target messages; a detection unit configured to perform a detection process based on the reception intervals; and a counting unit configured to count a plurality of burst messages including a delay message that is a target message whose reception interval is larger than the transmission cycle by a predetermined value or more, and one or more target messages which are received subsequently to the delay message and whose reception interval is equal to or smaller than a predetermined value. The detection unit, based on a count value obtained by the counting unit, determines whether or not to perform the detection process based on the reception intervals, for at least one burst message among the plurality of burst messages.
H04L 41/0631 - Gestion des fautes, des événements, des alarmes ou des notifications en utilisant l’analyse des causes profondesGestion des fautes, des événements, des alarmes ou des notifications en utilisant l’analyse de la corrélation entre les notifications, les alarmes ou les événements en fonction de critères de décision, p. ex. la hiérarchie ou l’analyse temporelle ou arborescente
A copper-coated steel wire includes a core wire made of an austenitic stainless steel, a first coating layer made of Ni covering an outer peripheral surface of the core wire, and a second coating layer made of copper or a copper alloy covering an outer peripheral surface of the first coating layer. The core wire includes an austenite layer arranged to constitute the outer peripheral surface and having a thickness of not less than 1 μm and not more than 10 μm and a volume ratio of an austenitic structure of not less than 80%, and a martensite layer arranged on an inner peripheral side of the austenite layer and having a volume ratio of a martensitic structure of not less than 80%.
A coaxial connector includes an inner conductor, an insulator surrounding the inner conductor, and a tubular outer conductor surrounding the insulator. The inner conductor is in the form of a bar having a first end and a second end. The inner conductor includes a first press-fit portion located near the first end and a second press-fit portion located near the second end in an extension direction of the inner conductor. The first and second press-fit portions are located equidistant from a center in the extension direction of the inner conductor. The insulator includes an insertion hole, into which the inner conductor is inserted. The inner conductor is held in the insulator by press-fitting one of the first and second press-fit portions into the insertion hole with the first and second ends coming out from the insulator.
H01R 24/40 - Dispositifs de couplage en deux pièces, ou l'une des pièces qui coopèrent dans ces dispositifs, caractérisés par leur structure générale ayant des contacts disposés concentriquement ou coaxialement spécialement adaptés à la haute fréquence
A terminal fitting (10) includes a detached-side terminal portion (12) to be connected to a mating terminal (T), a mounting-side terminal portion (11) to be mounted on a circuit board (P) and a stress absorbing portion (18) arranged between the detached-side terminal portion (12) and the mounting-side terminal portion (11). Stress generated in the detached-side terminal portion (12) and the mounting-side terminal portion (11), out of the terminal fitting (10), can be relaxed by the resilient deformation of the stress absorbing portion (18).
H01R 12/69 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes bornes déformables, p. ex. bornes à sertir
9.
ONBOARD ECU, INFORMATION PROCESSING METHOD, AND ONBOARD SYSTEM
Provided is an onboard ECU communicatively connected to a plurality of onboard apparatuses installed in a vehicle and a vehicle control apparatus that performs priority determination relating to control of the onboard apparatuses that includes a control unit that executes processing relating to the control of the onboard apparatuses, wherein in a case where there is conflict in control targeting one onboard apparatus from among the plurality of onboard apparatuses or an associated onboard apparatus group, the control unit executes priority determination for the control; and an onboard apparatus which is a target for priority determination by the control unit and an onboard apparatus which is a target for priority determination by the vehicle control apparatus overlap at least at a portion.
G06F 9/48 - Lancement de programmes Commutation de programmes, p. ex. par interruption
B60R 16/023 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule
the ratio of the number of carbon atoms to the sum of the number of carbon atoms and the number of nitrogen atoms in the first unit layers, y1, is higher than that of in the second unit layers, y2.
An optical fiber comprising: a core made of silica glass; and a cladding that is made of silica glass and that surrounds the core, wherein Δ1-Δ2≥0.02 is satisfied, where Δ1 represents the greatest value of the specific refractive index difference of the core in 0≤r/a≤0.3, and Δ2 represents the smallest value of the specific refractive index difference of the core in 0≤r/a≤0.9, where r represents the radial distance from the center axis of the core, and a represents the radius of the core.
A connector 10 includes a wire 12 formed by covering a plurality of strands 14, a terminal fitting 20 connected to an end part of a strand exposed portion 18a, in which the strands 14 are exposed by stripping an insulation coating 16 in an end of the wire, and a connector housing 22 for accommodating the terminal fitting 20 and the wire 12. The connector housing 22 includes a wire press-fit portion 41. A strand exposed portion 18b includes a strand welded portion 24 formed by welding and integrating the strands 14. The strand welded portion 24 is press-fit and held in the wire press-fit portion 41.
A photodetection device includes a sensor array including a compound semiconductor substrate including a first main surface and a second main surface located opposite to the first main surface, and a plurality of light-receiving elements arranged in a two dimensional manner on the first main surface, a readout circuit including a silicon substrate having a third main surface connected to the first main surface of the compound semiconductor substrate and a fourth main surface located opposite to the third main surface, an adhesive layer provided on the fourth main surface, and a ceramic substrate connected to the fourth main surface of the silicon substrate with the adhesive layer. The silicon substrate has a thickness smaller than a thickness of the compound semiconductor substrate.
H10F 39/18 - Capteurs d’images à semi-conducteurs d’oxyde de métal complémentaire [CMOS]Capteurs d’images à matrice de photodiodes
H10F 39/00 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément couvert par le groupe , p. ex. détecteurs de rayonnement comportant une matrice de photodiodes
A wiring module 20 to be attached to a plurality of power storage devices 11 includes a wire, a terminal 60 connected to the wire, and a circuit board 30, with the terminal 60 including a connecting part 63 connected to the circuit board 30, the circuit board 30 including a connection land to which the connecting part 63 is soldered, the connecting part 63 having a cut part 71 formed by cutting a metal plate material, and a pair of connecting surfaces 70 arranged so as to be positioned front and back of each other and connected via the cut part 71, and at least one of the pair of connecting surfaces 70 intersecting the surface of the connection land and being arranged continuously therewith.
H01M 50/298 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par le câblage des blocs de batterie
H01M 50/249 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports spécialement adaptés aux aéronefs ou aux véhicules, p. ex. aux automobiles ou aux trains
H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p. ex. modules de barres omnibus
H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
This steel wire comprises a steel containing 0.9-1.1 mass % of carbon, 0.15-0.25 mass % of silicon, 0.25-0.35 mass % of manganese, and 0.15-0.25 mass % of chromium, with the remainder consisting of iron and unavoidable impurities, wherein: the steel has a ferrite structure; the diameter of the steel wire is 0.05-0.45 mm; the tensile strength of the steel wire is 3900 to 4700 MPa, in the longitudinal cross section of the steel wire; and the surface region from the surface of the steel wire to a depth of 10% of the diameter has a structure in which the total ratio A of the <100> azimuth aggregate structure ratio A100, the <110> azimuth aggregate structure ratio A110, and the <111> azimuth aggregate structure ratio A111 is 32% or less.
C22C 38/18 - Alliages ferreux, p. ex. aciers alliés contenant du chrome
B21C 1/02 - Étirage des fils métalliques ou d'un matériau flexible analogue au moyen de machines ou d'appareils à étirer dans lesquels l'étirage est effectué par des tambours
C22C 38/02 - Alliages ferreux, p. ex. aciers alliés contenant du silicium
C22C 38/04 - Alliages ferreux, p. ex. aciers alliés contenant du manganèse
16.
OPTICAL-CONNECTOR CLEANER AND METHOD OF CLEANING END SURFACE OF OPTICAL CONNECTOR
An optical-connector cleaner includes a pad having a first surface and having elasticity in at least the first surface, and a cleaning cloth disposed on or above the first surface of the pad and extending in a first direction. The pad has a first cut formed in the first surface and extending in the first direction, and a second cut formed in the first surface and extending in the first direction such that the first cut and the second cut are arranged side by side. At least a portion of the cleaning cloth in the first direction is divided by a first dividing line and a second dividing line, the first dividing line overlapping the first cut, the second dividing line overlapping the second cut.
A semiconductor light-receiving device includes an indium phosphide substrate, a first III-V compound semiconductor layer of a first conductivity type, a second III-V compound semiconductor layer of a second conductivity type, a light absorbing layer provided between the first III-V compound semiconductor layer and the second III-V compound semiconductor layer and including a III-V compound semiconductor, and a third III-V compound semiconductor layer provided between the light absorbing layer and the second III-V compound semiconductor layer, the third III-V compound semiconductor layer being non-doped. The first III-V compound semiconductor layer is provided between the indium phosphide substrate and the light absorbing layer. The third III-V compound semiconductor layer has a band gap energy larger than a maximum value of a band gap energy of the III-V compound semiconductor included in the light absorbing layer.
H10F 30/222 - Dispositifs individuels à semi-conducteurs sensibles au rayonnement dans lesquels le rayonnement commande le flux de courant à travers les dispositifs, p. ex. photodétecteurs les dispositifs ayant des barrières de potentiel, p. ex. phototransistors les dispositifs étant sensibles au rayonnement infrarouge, visible ou ultraviolet les dispositifs ayant une seule barrière de potentiel, p. ex. photodiodes la barrière de potentiel étant une hétérojonction PN
H10F 77/124 - Matériaux actifs comportant uniquement des matériaux du groupe III-V, p. ex. GaAs
H10F 77/14 - Forme des corps semi-conducteursFormes, dimensions relatives ou dispositions des régions semi-conductrices au sein des corps semi-conducteurs
A wiring unit has excellent reliability of electrical connection between a terminal and electrode leads. The wiring unit is mounted on a battery stack, which is formed by stacking a plurality of laminated batteries including electrode leads, and includes a joining portion for joining the electrode leads of the laminated batteries in a mutually overlapping manner, the wiring unit including: a terminal; an electric wire that is connected to the terminal; and a protector that holds the terminal and the electric wire, the terminal including: a main body portion; a connecting portion that is configured to extend from the main body portion and is oppositely connected, in a first direction, to the electrode leads forming the joining portion; and at least one bent plate portion that extends from the main body portion to the side of the laminated batteries in the first direction, and the protector including: a protector main body.
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/514 - Procédés pour interconnecter les batteries ou cellules adjacentes
H01M 50/528 - Connexions électriques fixes, c.-à-d. non prévues pour être déconnectées
H01M 50/588 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’extérieur des batteries, p. ex. les contacts incorrects des bornes ou des barres omnibus
19.
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a first nitride semiconductor layer including gallium, and a second nitride semiconductor layer formed on the first nitride semiconductor layer and including gallium, wherein the second nitride semiconductor layer includes a plurality of third nitride semiconductor layers and a plurality of fourth nitride semiconductor layers alternately laminated on the first nitride semiconductor layer, the plurality of third nitride semiconductor layers include an impurity of a first conductivity type with a first concentration, the plurality of fourth nitride semiconductor layers include the impurity of the first conductivity type with a second concentration higher than the first concentration, and the first concentration is 1×1020 cm−3 or higher.
H10D 30/47 - Transistors FET ayant des canaux à gaz de porteurs de charge de dimension nulle [0D], à une dimension [1D] ou à deux dimensions [2D] ayant des canaux à gaz de porteurs de charge à deux dimensions, p. ex. transistors FET à nanoruban ou transistors à haute mobilité électronique [HEMT]
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 62/824 - Hétérojonctions comprenant uniquement des hétérojonctions de matériaux du groupe III-V, p. ex. des hétérojonctions GaN/AlGaN
H10D 64/27 - Électrodes ne transportant pas le courant à redresser, à amplifier, à faire osciller ou à commuter, p. ex. grilles
20.
SINTERED MEMBER AND METHOD FOR PRODUCING SINTERED MEMBER
A sintered member composed of a metal, wherein the sintered member has a relative density of 95% or more and has at least one of a hole for which the diameter x1 and depth y1 satisfy specific requirements and a groove for which the width x2 and depth y2 satisfy specific requirements.
B22F 5/10 - Fabrication de pièces ou d'objets à partir de poudres métalliques caractérisée par la forme particulière du produit à réaliser d'articles avec des cavités ou des trous, non prévue dans les sous-groupes précédents
B22F 3/16 - Compactage et frittage par des opérations successives ou répétées
A wiring harness 10 according to one aspect of the present disclosure includes a plurality of wires (20) and an exterior member (40) for covering the plurality of wires (20). The exterior member (40) includes a tape member (41) to be wound to bundle the plurality of wires (20). The wiring harness (10) includes a tape cutting wire (50) provided such that an intermediate part in a length direction is covered by the tape member (41), and the tape cutting wire (50) is capable of cutting the tape member (41) by an end part (51) in the length direction being pulled.
An encryption system includes a management device, an encryption device and a decryption device. The encryption device and the decryption device are connected to each other via a first transmission line serving as a physical transmission path, the management device is configured to transmit encryption information to the encryption device and the decryption device, the encryption information relating to an encryption scheme used in the encryption device and the decryption device, the encryption device is configured to generate encrypted data by performing an encryption process on communication data, based on the encryption information received from the management device, and to transmit the generated encrypted data to the decryption device via the first transmission line, and the decryption device is configured to perform a decryption process on the encrypted data received from the encryption device via the first transmission line, based on the encryption information received from the management device.
To protect a circuit from a surge voltage while allowing the circuit to be downsized, a protection device is used in an interruption system including: a first circuit including a first power path and a second power path, which are paths through which electric power is transmitted; an interrupter including an interruption unit provided so as to be able to interrupt the second power path, and a metal housing accommodating at least a portion of the interruption unit; and a second circuit that provides an interruption signal to the interruption unit. The protection device includes a conductive portion serving as a conductive path between a target section including a ground portion and the metal housing.
An in-vehicle apparatus is an in-vehicle apparatus installed in a vehicle and configured to perform communication with at least one in-vehicle device connected to an in-vehicle network of the vehicle, the in-vehicle apparatus including a control unit configured to perform control related to the communication, wherein the control unit acquires a sending time point and a reception time point of communication data sent and received during the communication with the in-vehicle device, and determines whether or not the in-vehicle device that has performed the communication is an unauthorized device based on the acquired sending time point and reception time point.
H04W 4/48 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p. ex. communication véhicule-piétons pour la communication dans le véhicule
H04L 12/22 - Dispositions pour empêcher la prise de données sans autorisation dans un canal de transmission de données
H04L 67/12 - Protocoles spécialement adaptés aux environnements propriétaires ou de mise en réseau pour un usage spécial, p. ex. les réseaux médicaux, les réseaux de capteurs, les réseaux dans les véhicules ou les réseaux de mesure à distance
An electrical connection box includes a housing and a busbar attached to the housing. The housing includes a shared fuse mounting portion on which at least two fuses including large and small fuses of mutually different sizes are to be mounted. The fuse mounting portion includes: a large input-side fixing portion to which a large input terminal of the large fuse is to be fixed; a large output-side fixing portion to which a large output terminal of the large fuse is to be fixed; a small input-side fixing portion to which a small input terminal of the small fuse is to be fixed; and a small output-side fixing portion to which a small output terminal of the small fuse is to be fixed. The small input-side fixing portion and the small output-side fixing portion are arranged between the large input-side fixing portion and the large output-side fixing portion.
H02G 3/16 - Boîtes de distributionBoîtes de connexion ou de dérivation associées par construction à un support pour bornes de connexion de ligne à l'intérieur de la boîte
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H01H 85/20 - Socles pour supporter le fusibleLeurs pièces détachées
26.
SEMICONDUCTOR OPTICAL DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE
A semiconductor optical device includes a substrate including a silicon layer, and a semiconductor device formed of a III-V group compound semiconductor and bonded to the silicon layer of the substrate. The silicon layer is provided with at least one trench, the at least one trench extends from a region overlapping the semiconductor device to a region outside the semiconductor device and is provided with a communicating port that communicates between a portion of the at least one trench in the region overlapping the semiconductor device and a portion of the at least one trench in the region outside the semiconductor device, and the communicating port in the at least one trench is a single communicating port.
A terminal and wire connection structure of the present disclosure includes a first wire, a second wire and a terminal for connecting the first wire and the second wire. The first wire includes a first core wire and a first insulation coating surrounding the first core wire. The second wire includes a second core wire and a second insulation coating surrounding the second core wire. The terminal includes a first connecting portion to be connected to the first core wire, a second connecting portion to be connected to the second core wire and a coupling portion coupling the first and second connecting portions.
A wiring module includes: a wiring member including a first section, a second section, and a third section as sections different from each other along an extension direction; a first rigid member attached to the first section; and a second rigid member attached to the second section. A portion including the first section and the first rigid member is a first portion, a portion including the second section and the second rigid member is a second portion, and a portion including the third section is a third portion. The third portion has bendability to be able to be folded. The second section is more bendable than the first portion, and is less bendable than the third portion.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
29.
TERMINAL MATERIAL AND ELECTRICAL CONNECTION TERMINAL
A terminal material 1 includes a base material 11, an intermediate layer 14 made of Ag or Ag alloy and covering a surface of the base material, and a surface layer 15 containing Ag and at least one of a sulfur-containing organic compound and a carbon material and configured to contact and cover a surface of the intermediate layer 14. The intermediate layer 14 has a higher Ag purity than the surface layer 15. The surface layer 15 has a surface roughness Rz less than 1.2 μm. Further, an electrical connection terminal is configured to contain the terminal material 1, and the intermediate layer 14 and the surface layer 15 are formed on the surface of the base material 11 at least in an electrical contact point to be held in contact with a mating electrically conductive member.
A high frequency device includes a semiconductor chip including a semiconductor substrate, and an amplifier provided on a front surface of the semiconductor substrate and amplifying a high frequency signal, a first reference potential layer provided above the semiconductor chip in an upper direction perpendicular to the front surface of the semiconductor substrate, and provided so as to overlap with the semiconductor chip in a plan view from above, and to which a reference potential is supplied, and a resonator provided between the semiconductor chip and the first reference potential layer in the upper direction perpendicular to the front surface of the semiconductor substrate, wherein a resonance frequency of the resonator is included in an operating frequency band of the amplifier, and an impedance of the resonator becomes minimal at the resonance frequency.
H03F 3/195 - Amplificateurs à haute fréquence, p. ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
31.
IN-VEHICLE DEVICE, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING PROGRAM
An in-vehicle device to be installed in a vehicle, the in-vehicle device includes: a communication unit configured to receive, from a management device, setting information related to a role of the in-vehicle device in an in-vehicle network; and a setting unit configured to perform operation setting for the in-vehicle device corresponding to the role based on the setting information received by the communication unit.
H04W 4/48 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p. ex. communication véhicule-piétons pour la communication dans le véhicule
A relay control device includes a control unit for switching a plurality of relay circuits connected to a plurality of ECUs, between a relay-on state and a relay-off state, the plurality of ECUs include a first ECU having a transition function of causing its own operating state to transition between at least two of a normal state, a sleep state, and a power-off state in accordance with a power supply state of the vehicle, and a second ECU not having the transition function, and the control unit executes switching control of switching a second relay circuit connected to the second ECU to the relay-off state while maintaining a first relay circuit connected to the first ECU in the relay-on state, when switching the second ECU from the relay-on state to the relay-off state due to a change in the power supply state.
B60R 16/023 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
33.
Display screen or portion thereof with transitional graphical user interface
A semiconductor device includes a plurality of transistors electrically connected in parallel to each other, each of the plurality of transistors including a first pad; and a conductive member. The first pad is a source pad or an emitter pad. The first pad includes a first connection region; and a second connection region and a third connection region, the first connection region being located between the second connection region and the third connection region. The semiconductor device includes a first connection member that connects the first connection region to the conductive member; a second connection member that connects second connection regions of two transistors among the plurality of transistors; and a third connection member that connects third connection regions of the two transistors among the plurality of transistors.
H10D 80/20 - Ensembles de plusieurs dispositifs comprenant au moins un dispositif couvert par la présente sous-classe l’au moins un dispositif étant couvert par les groupes , p. ex des ensembles comprenant des condensateurs, des transistors FET de puissance ou des diodes Schottky
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
A cutting tool, comprising a substrate and a coating disposed on the substrate,
wherein the coating comprises a first layer,
dN, and
the a, the b, the c, and the d satisfy
a+b+c+d<1.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
A connector (10) includes a housing (20) and a flexible cable (30) to be assembled with the housing (20). The housing includes a boss pin (52) to be assembled with the flexible cable (30). The flexible cable (30) includes a body portion (31), a first constituent portion (60) protruding in a direction toward a tip from the body portion (31), electrically conductive paths being routed in the first constituent portion (60), and a second constituent portion (70) protruding in the direction toward the tip from the body portion (31) and to be assembled with the boss pin (52). The boss pin (52) includes a column portion (53). A coupled state of the boss pin (52) and the body portion (31) is released by breaking the column portion (53).
An optical fiber ribbon includes a plurality of optical fibers arranged in parallel in a direction perpendicular to a longitudinal direction. In at least a part of the plurality of optical fibers, a plurality of connecting portions that connect adjacent optical fibers are intermittently provided in the longitudinal direction. One of the plurality of connecting portions is configured such that, when the one connecting portion is torn in the longitudinal direction, a tearing stress has a plurality of peaks. The tearing stress has a first peak that indicates a maximum tearing stress, and a second peak that indicates a tearing stress different from the maximum tearing stress. A tearing stress of the first peak is 0.01 N or more. A tearing stress of the second peak is 50% or more of the tearing stress of the first peak.
A connector includes a terminal module including an inner conductor, an insulator surrounding the inner conductor and an outer conductor having a tube portion surrounding the insulator and a projecting portion projecting outwardly of the tube portion, and a mating connection conductor. At least one of the mating connection conductor and the projecting portion includes a spring connecting portion to be resiliently pressed against the other of the mating connection conductor and the projecting portion with a contact pressure having a force component along an axial direction of the tube portion.
H01R 13/15 - Broches, lames ou alvéoles ayant un ressort indépendant pour produire ou améliorer la pression de contact
H01R 24/38 - Dispositifs de couplage en deux pièces, ou l'une des pièces qui coopèrent dans ces dispositifs, caractérisés par leur structure générale ayant des contacts disposés concentriquement ou coaxialement
A relay device relays information between first and second function units respectively connected to communication networks that use different communication protocols. The relay device includes: a detection unit configured to detect addition of a new function unit to one of the communication networks; an acquisition unit configured to acquire function unit information from the detected new function unit; and a conversion unit configured to configured to perform a conversion process that converts the acquired function unit information acquired into information that is able to be registered into a database. The conversion process is according to a conversion rule defined in a conversion table indicating a correspondence relationship between elements included in the function unit information of the respective function units.
A coil has a first coil portion that is at least partially located within a slot, and a second coil portion having a first end press-fitted into the first coil portion. Insulating resin has a continuous filling portion that continuously fills a space between an inner wall of the slots and the first coil portion in a central part of the slots with respect to the axial direction. A first positioning component is located on a first side in an axial direction relative to the continuous filling portion, and positions the first coil portion while being at least partially sandwiched between the inner walls of the slot and the first coil portion in a circumferential direction of the stator core. The first positioning component covers a gap between the first coil portion and the second coil portion that are press-fitted into each other, in the circumferential direction.
H02K 3/12 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre disposés dans des encoches
H02K 1/16 - Noyaux statoriques à encoches pour enroulements
H02K 15/02 - Procédés ou appareils spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation des machines dynamo-électriques des corps statoriques ou rotoriques
H02K 15/085 - Exécution des enroulements par pose des conducteurs dans ou autour des parties formant le noyau par pose des conducteurs dans des stators encochés
An infrastructure radio wave sensor includes: a transmission unit configured to transmit radio waves to a detection area that includes a pedestrian crossing; a reception unit configured to receive reflected waves that are the radio waves reflected from an object; and an output unit configured to output a message created based on a reception result of the reflected waves received by the reception unit, wherein the message includes at least one of a vehicle presence status indicating that a vehicle stopped at a stop line, provided on roadway intersecting the pedestrian crossing, is present, a number of vehicles indicating a number of vehicles traveling on the roadway, and an event occurrence status indicating that a sudden event has occurred to a road user on the pedestrian crossing.
G01S 13/92 - Radar ou systèmes analogues, spécialement adaptés pour des applications spécifiques pour la commande du trafic pour la mesure de la vitesse
G01S 7/00 - Détails des systèmes correspondant aux groupes , ,
G08G 1/005 - Systèmes de commande du trafic pour véhicules routiers comprenant un indicateur pour guider les piétons
45.
LIGHT RECEIVING ELEMENT AND METHOD OF MANUFACTURING LIGHT RECEIVING ELEMENT
A light receiving element includes a substrate including a silicon layer and a photodiode formed of a III-V group compound semiconductor and bonded to the silicon layer. The silicon layer includes a waveguide, the photodiode includes a first semiconductor layer, a light absorbing layer, and a second semiconductor layer, the first semiconductor layer is in contact with the silicon layer, the light absorbing layer and the second semiconductor layer are stacked in this order on a surface of the first semiconductor layer opposite to a surface of the first semiconductor layer in contact with the silicon layer, the first semiconductor layer has a first conductivity type, the second semiconductor layer has a second conductivity type, the first semiconductor layer includes a projecting portion and a first slab portion, and the projecting portion is connected to the first slab portion and projects from the first slab portion.
G02B 6/122 - Éléments optiques de base, p. ex. voies de guidage de la lumière
H10F 30/223 - Dispositifs individuels à semi-conducteurs sensibles au rayonnement dans lesquels le rayonnement commande le flux de courant à travers les dispositifs, p. ex. photodétecteurs les dispositifs ayant des barrières de potentiel, p. ex. phototransistors les dispositifs étant sensibles au rayonnement infrarouge, visible ou ultraviolet les dispositifs ayant une seule barrière de potentiel, p. ex. photodiodes la barrière de potentiel étant du type PIN
H10F 71/00 - Fabrication ou traitement des dispositifs couverts par la présente sous-classe
H10F 77/124 - Matériaux actifs comportant uniquement des matériaux du groupe III-V, p. ex. GaAs
A highly versatile branch circuit unit is capable of accommodating increases and decreases in the number of branches with superior space efficiency and handling. The branch circuit unit includes a basic unit, which includes a basic branch circuit and a basic case, and at least one additional unit which each include an additional branch circuit and an additional case. The additional case is linked to the basic case. The basic branch circuit includes a basic-side branch connecting portion, and this basic side branch connecting portion is connected to the additional branch circuit. The additional branch circuit includes an additional-side branch connecting portion. When a plurality of additional units are used, the additional-side branch connecting portion of one additional unit is connected to the additional branch circuit of the other additional unit, and the additional case of the one additional unit is linked to the additional case of the other additional unit.
H02G 3/16 - Boîtes de distributionBoîtes de connexion ou de dérivation associées par construction à un support pour bornes de connexion de ligne à l'intérieur de la boîte
A semiconductor device includes a buffer layer including iron and having a nitrogen polarity at an upper surface thereof, a barrier layer provided on the buffer layer and having a nitrogen polarity at an upper surface thereof, and a channel layer provided on the barrier layer and having a nitrogen polarity at an upper surface thereof.
H10D 62/854 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe III-V, p. ex. GaAs caractérisés en outre par les dopants
H10D 30/47 - Transistors FET ayant des canaux à gaz de porteurs de charge de dimension nulle [0D], à une dimension [1D] ou à deux dimensions [2D] ayant des canaux à gaz de porteurs de charge à deux dimensions, p. ex. transistors FET à nanoruban ou transistors à haute mobilité électronique [HEMT]
H10D 62/60 - Distribution ou concentrations d’impuretés
H10D 62/824 - Hétérojonctions comprenant uniquement des hétérojonctions de matériaux du groupe III-V, p. ex. des hétérojonctions GaN/AlGaN
H10D 62/85 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe III-V, p. ex. GaAs
H10D 62/852 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe III-V, p. ex. GaAs étant des matériaux du groupe III-V comprenant trois éléments ou plus, p. ex. AlGaN ou InAsSbP
The resin composition includes more than 50 mass % and 80 mass % or less of propylene units; and 20 mass % or more of ethylene units or 7 mass % or more of butene units with respect to 100 mass % of a total content of monomer units in a resin component, the resin composition having a co-continuous structure including a first continuous phase in which the propylene units are relatively more and a second continuous phase in which the propylene units are relatively less, or a sea-island structure including a sea phase in which the propylene units are relatively more, and an island phase in which the propylene units are relatively less and a maximum length in a cross-sectional image observed with a transmission electron microscope is 600 nm or less.
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines vinyliquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
A connector is to be connected to a wire including a core wire and an insulation coating covering an outer periphery of the core wire and extending in a front-rear direction, and provided with a terminal to be connected to the core wire, a connector housing for accommodating the terminal inside and a rear holder to be attached to a rear part of the connector housing. The terminal includes a terminal body and a slide portion slidable in the front-rear direction while being externally fit to the terminal body. The terminal body includes a sandwiching portion for sandwiching the core wire. The slide portion includes a core wire insertion opening, through which the core wire is inserted from behind, and a pressing portion for pressing the sandwiching portion against the core wire inserted through the core wire insertion opening.
A wire harness fixing tool (13) according to one embodiment of the present disclosure comprises a first holding member (20) for holding a first electrical wire member (11) and a second holding member (30) for holding a second electrical wire member (12). The second holding member (30) is configured so as to be detachably attachable to the first holding member (20).
H02G 3/32 - Installations de câbles ou de lignes sur les murs, les sols ou les plafonds utilisant des colliers de fixation
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
A connector includes a wire including a core wire and an insulation coating covering an outer periphery of the core wire, a terminal to be connected to the core wire, an inner housing including a terminal accommodating portion for accommodating the terminal inside, a rear holder to be attached to a rear part of the inner housing and a collective sealing portion to be mounted into the rear holder. The rear holder includes a wire insertion hole, through which the wire is inserted. The collective sealing portion includes an inner sealing portion for sealing the wire inserted through the wire insertion hole. The insulation coating of the wire includes a sheath portion and a body portion separate from each other. The sheath portion is disposed forward of the body portion and slidable with respect to the core wire.
H01R 43/24 - Assemblage par moulage sur les pièces de contact
H01R 13/426 - Fixation de manière démontable par un dispositif de retenue indépendant et élastique porté par le socle ou par le boîtier, p. ex. par un collier
H01R 13/506 - SoclesBoîtiers composés de différentes pièces assemblées par enclenchement réciproque des pièces
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
A connector 10 comprises an electric wire 40 having a core wire 41 and an insulating coating 42 covering the outer periphery of the core wire 41, a terminal 50 connected to the core wire 41, a connector housing 20 having a terminal storage part 21 in which the terminal 50 is stored, and a rear holder 30 attached to the rear end portion of the connector housing 20. The rear holder 30 has an electric wire insertion hole 33 in which the electric wire 40 is inserted, the terminal 50 includes an insertion cylindrical part 55 in which the core wire 41 is inserted from the rear and a contact part 56 that is disposed at the rear end portion of the insertion cylindrical part 55 and faces the electric wire insertion hole 33, the insulating coating 42 of the electric wire 40 has a sheath portion 43 and a body portion 44 as separate portions, and the sheath portion 43 is disposed in front of the body portion 44 and is slidable with respect to the core wire 41.
H01R 13/424 - Fixation de manière démontable sur un socle ou dans un boîtier composé de plusieurs pièces isolantes dont l'une au moins est flexible
H01R 43/20 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour assembler les pièces de contact avec le socle isolant, le boîtier ou le manchon ou pour les en désassembler
A high frequency amplifier includes a driver amplifier that amplifies an input high frequency signal and an asymmetrical Doherty amplifier that amplifies a high frequency signal output from the driver amplifier. The high frequency amplifier includes a first layered structure, a second layered structure layered on the first layered structure, and a third layered structure layered on the second layered structure. The asymmetrical Doherty amplifier includes a carrier amplifier, a peak amplifier, a branch circuit, a first signal line, a second signal line, and a phase adjusting circuit. The second layered structure includes a first wiring layer, a second wiring layer, a dielectric layer, and one or more capacitors. The driver amplifier, the carrier amplifier, and the peak amplifier are provided in the first layered structure. The branch circuit and the phase adjusting circuit are provided in the third layered structure.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A circuit assembly includes a heat generating component that generates heat when energized; a energization member that connects to a connection portion of the heat generating component; a fastening member that fastens the energization member to the connection portion; and a heat capacity increasing component that thermally connects to a fastening site of the energization member and the connection portion and increases a heat capacity of the connection portion of the heat generating component.
A pulling jig for pulling a plurality of optical cables while maintaining a state in which the optical cables are arranged in parallel, the pulling jig includes a base portion having a width equal to or more than a width in the state in which the plurality of optical cables are arranged in parallel, a pulling portion for enabling the base portion to be connected to a pulling device, and a plurality of connecting portions provided at the base portion and arranged in a width direction along the width. The connecting portions are connectable to the optical cables in at least one-to-one correspondence.
G02B 6/54 - Installation souterraine ou sous l'eauInstallation à travers des tubes, des conduits ou des canalisations en utilisant des moyens mécaniques, p. ex. des dispositifs pour tirer ou pousser
A high frequency amplifier includes a Doherty amplifier including a carrier amplifier and a peak amplifier; a driver amplifier; a branch circuit configured to branch a signal amplified by the driver amplifier into input paths on a peak amplifier side and on a carrier amplifier side; and a phase adjustment circuit provided on a path on the peak amplifier side or on the carrier amplifier side. An electrical length from an input terminal of the driver amplifier to an output terminal of the carrier amplifier through the driver amplifier, the branch circuit, the input path on the carrier amplifier side, and the carrier amplifier is set such that a phase difference between a signal input to the driver amplifier without passing through the carrier amplifier and a signal fed back to the driver amplifier from the output terminal of the carrier amplifier is in a negative feedback region.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/195 - Amplificateurs à haute fréquence, p. ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
H03F 3/21 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
H03F 3/60 - Amplificateurs dans lesquels les réseaux de couplage ont des constantes réparties, p. ex. comportant des résonateurs de guides d'ondes
59.
IN-VEHICLE DEVICE, COMMUNICATION METHOD, AND COMMUNICATION PROGRAM
An in-vehicle device includes: a communication unit configured to receive map information, which includes information on a moving object in a target area, from a management device; a detection unit configured to detect, based on the map information received by the communication unit and information indicating a detection range of an in-vehicle sensor mounted in a vehicle, a blind spot area of the in-vehicle sensor in the target area; and a communication control unit configured to control communication with the management device by the communication unit, based on a predicted content relating to movement of the moving object in the blind spot area detected by the detection unit and a predicted content relating to movement of the vehicle.
H04W 4/44 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques pour les véhicules, p. ex. communication véhicule-piétons pour la communication entre véhicules et infrastructures, p. ex. véhicule à nuage ou véhicule à domicile
A connector (30) electrically connects a shield member to a mounting object by being fixed to an end part of a shielded cable (20) including a core wire (23), an insulation coating (24) covering an outer periphery of the core wire and the shield member (22) for covering an outer periphery of the insulation coating and fixed to the mounting object. The connector includes a metal pipe (31), through which the core wire and the insulation coating are passed and to which the shield member is connected, and a metal fixing member (32) to be fixed to an outer peripheral surface of the metal pipe and fixed to the mounting object.
H01R 13/73 - Moyens de montage des pièces de couplage sur les appareils ou structures, p. ex. sur un mur
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
H01R 4/20 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation effectuées uniquement par torsion, enroulage, pliage, sertissage ou autre déformation permanente par sertissage en utilisant un manchon de sertissage
H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
H01R 13/6592 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs l'organe conducteur étant un câble blindé
A heat-shrinkable tube of the present disclosure includes an outer layer having a cylindrical shape and having a melting point of 210° C. to 260° C., and an inner layer disposed on an inner peripheral surface of the outer layer. The outer layer and the inner layer contain a fluororesin or a fluororubber as a main component, and the inner layer has a shear viscosity of 300 Pa·s to 10000 Pa·s at 250° C. and a shear rate of 10/s and a shear viscosity of 3000 Pa·s to 70000 Pa·s at 215° C. and a shear rate of 1/s.
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
H02G 1/14 - Méthodes ou appareils spécialement adaptés à l'installation, entretien, réparation, ou démontage des câbles ou lignes électriques pour la jonction ou la terminaison de câbles
H02G 3/04 - Tubes ou conduits de protection, p. ex. échelles à câbles ou goulottes de câblage
A spacer includes a first support portion, a second support portion, and a first holding plate portion. The first support portion and the second support portion are capable of being engaged with a vertically rising portion of a cable laying tray to support the spacer, and are capable of being engaged with the vertically rising portion at different positions in a first direction. The first holding plate portion is connected to the first support portion and the second support portion, and extends in parallel with a bottom portion when the first support portion and the second support portion are engaged with the vertically rising portion. A distance between the bottom portion and the first holding plate portion is larger than a distance obtained by totaling a diameter of a main cable and a diameter of a branch cord portion.
An optical branch cable includes a main cable and a branch cord portion. The main cable includes a plurality of optical cords each including at least one optical fiber core wire, a tension member, and a tape forming an outermost layer. At least one optical fiber core wire of the branch cord portion is led out from the optical cords of the main cable to an outer side of the outermost layer. The optical branch cable includes an optical cord group and a core portion. The optical cord group includes the plurality of optical cords bundled by a first bundle. The core portion includes the optical cord group and the tension member bundled by a second bundle. The tape is wrapped by longitudinal wrapping around the core portion to cover the core portion.
An optical branching cable set includes a plurality of optical branching cables, and a branching cord bag. At least two of the optical branching cables each include a main cable including a plurality of optical cords each including at least one optical fiber, a tensile strength member, and a tape that forms an outermost layer. A branching cord portion including at least one optical fiber that is led out from the optical cords of the main cable to an outside of the outermost layer. The branching cord bag is configured to collectively accommodate a plurality of branching cord portions provided in the plurality of optical branching cables.
A resin composition includes a base resin containing polyolefin, a styrene-based elastomer containing styrene units, and a copolymer containing styrene units and maleic anhydride units, wherein a content of the copolymer is 0.5 parts by mass or more with respect to the total content of the base resin and the styrene-based elastomer being 100 parts by mass, a content of the styrene-based elastomer is equal to or more than the content of the copolymer, and the copolymer does not contain side chains that are eliminated by pyrolysis or hydrolysis at 300° C. or less.
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines vinyliquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
H01B 13/06 - Isolation des conducteurs ou des câbles
66.
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM
An information processing device, including: a storage unit configured to store therein probe information of a probe vehicle traveling on an inflow road to an intersection; and an information processing unit configured to execute a determination process of determining presence or absence of pulsation on the inflow road. The determination process includes a process of generating time series data of a delay index that is a traffic index indicating a degree of delay in vehicle traffic due to waiting at a traffic signal, the delay index being calculated from the probe information, and a process of determining presence or absence of pulsation, based on the time series data of the delay index.
A connector includes a terminal and a connector housing including a housing body having a cavity and a retainer to be removably mounted into the housing body, the terminal being accommodated into the cavity. The housing body includes a cavity exposing recess for exposing an intermediate part in an extension direction of the cavity to outside and a pair of locking portions formed on both side parts of the housing body. The retainer includes a retainer body for holding the terminal in the cavity, a pair of retainer side portions extending from both side parts of the retainer body toward the pair of locking portions and a pair of mating locking portions respectively formed on the pair of retainer side portions and lockable to the locking portions. A dividing recess recessed in the extension direction of the cavity is formed in each of the pair of retainer side portions.
An insulated wire (1, 11) according to one embodiment of the present disclosure comprises a linear conductor (2) and an insulating layer (3) that is superposed on the outer circumferential surface of the conductor; the insulating layer contains a resin component, an antioxidant and a copper corrosion inhibitors; the resin component is composed of a block polypropylene; the content of ethylene units relative to all monomer units of the resin component is 0.5% by mole to 25.0% by mole; the antioxidant has a hindered phenol structure; the content of the antioxidant is 0.05 part by mass to 0.50 part by mass relative to 100 parts by mass of the resin component; the copper corrosion inhibitors has a triazole structure, a hydrazide structure or a hydrazine structure; and the content of the copper corrosion inhibitors is 0.05 part by mass to 0.50 part by mass relative to 100 parts by mass of the resin component.
H01B 3/30 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires
H01B 11/00 - Câbles ou conducteurs de communication
A fuse unit 10 includes: a first terminal portion 21 to be connected to a bus bar 70; a second terminal portion 31 to be connected to an electric wire 60; a melting portion 41 that connects the first terminal portion 21 and the second terminal portion 31 to each other and is configured to melt due to overcurrent; and a case 50 covering the melting portion 41. The first terminal portion 21 includes a first connection portion 24 having a contact surface 24A that is to come into contact with the bus bar 70, and a first holding portion 23 that is arranged between the first connection portion 24 and the melting portion 41 and is held by the case 50. The second terminal portion 31 includes a second connection portion 34 to be connected to the electric wire 60, and a second holding portion 33 that is arranged between the second connection portion 34 and the melting portion 41 and is held by the case 50.
A wire harness includes: a plurality of wirings; a base member keeping the plurality of wirings in a flat state; and a magnetic core positioned on the base member and covering a target wiring in the plurality of wirings.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H01B 7/00 - Conducteurs ou câbles isolés caractérisés par la forme
H01R 24/20 - Pièces de couplage portant des douilles, des pinces ou des contacts analogues, assujetties uniquement à un fil ou un câble
H02G 3/04 - Tubes ou conduits de protection, p. ex. échelles à câbles ou goulottes de câblage
A connector includes a terminal and a connector housing including a housing body having a cavity and a retainer to be removably mounted into the housing body. The housing body includes a cavity exposing recess, a pair of retainer guide grooves and a pair of locking portion respectively formed on bottom surfaces of the pair of retainer guide grooves. The retainer includes a retainer body for holding the terminal in the cavity, a pair of retainer side portions extending along the pair of retainer guide grooves and a pair of mating locking portions respectively formed on the pair of retainer side portions. A pair of recessed grooves are formed to extend from positions of the housing body where the pair of locking portions are respectively formed toward at least one end of the housing body.
A floor wiring module includes a silencer, a carpet stacked on one main surface of the silencer, and a wiring member sandwiched and held between the silencer and the carpet. A stacked region where the silencer and the carpet are stacked includes a first region where the silencer and the carpet are thermally pressed and fixed to each other and a second region, adjacent to the first region on one main surface, where the wiring member is located between the silencer and the carpet.
A stator includes an annular stator core, a coil, an insulating resin, and a positioning component (first positioning component). The stator core includes a plurality of slots that are arranged in an annular shape and extend through the stator core in an axial direction. The coil includes an insertion portion that passes through the slots. The insulating resin includes a continuous filling portion that is located in a center portion in the axial direction inside a slot of the plurality of slots and that continuously fills a space between an inner wall of the slot and the insertion portion. The positioning component (first positioning component) positions the insertion portion in a state where, on one side in the axial direction with respect to the continuous filling portion, at least a portion of the positioning component enters between the inner wall of the slot and the insertion portion.
H02K 3/48 - Fixation des enroulements sur la structure statorique ou rotorique dans les encoches
H02K 1/16 - Noyaux statoriques à encoches pour enroulements
H02K 3/34 - Enroulements caractérisés par la configuration, la forme ou la réalisation de l'isolement entre conducteurs ou entre conducteur et noyau, p. ex. isolement d'encoches
H02K 15/064 - Enroulements constitués de segments séparés
H02K 15/122 - Imprégnation, chauffage ou séchage des bobinages, des stators, des rotors ou des machines des enroulements
74.
IN-VEHICLE DEVICE, PROGRAM, AND INFORMATION PROCESSING METHOD
An in-vehicle device is to be connected to an in-vehicle network installed in a vehicle and includes: a first processing unit; a second processing unit connected to the first processing unit; and a physical layer communication unit connected to the second processing unit. The first processing unit includes a first upper layer communication unit corresponding to a layer that is higher than the physical layer communication unit, the second processing unit includes a second upper layer communication unit corresponding to a layer that is higher than the physical layer communication unit, the first processing unit and the second processing unit are connected via the first upper layer communication unit, and the second processing unit and the physical layer communication unit are connected via the second upper layer communication unit.
H04L 12/28 - Réseaux de données à commutation caractérisés par la configuration des liaisons, p. ex. réseaux locaux [LAN Local Area Networks] ou réseaux étendus [WAN Wide Area Networks]
A door trim constitutes a design on an interior side of a vehicle door. The door trim includes a scheduled insertion region where a wire-like transmission member for an optional component mounted to the vehicle door is to be inserted.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
B60J 5/04 - Portes disposées sur les côtés du véhicule
H02G 11/00 - Installations de câbles ou de lignes électriques entre deux pièces en mouvement relatif
76.
OPTICAL MODULE AND METHOD FOR MANUFACTURING OPTICAL MODULE
An optical module includes a base material, an optical semiconductor element, an optical circuit element, a first adhesive, and a second adhesive. The base material has a first surface. The optical semiconductor element has a first optical port and is provided on the first surface. The optical circuit element has a second optical port, which faces the first optical port and is optically coupled to the first optical port, in a side surface thereof. The optical circuit element is disposed alongside the optical semiconductor element on the first surface. The first adhesive mainly includes a UV curable material. The first adhesive fixes the optical semiconductor element to the first surface and has a first thermal conductivity. The second adhesive mainly includes a thermosetting material and has a second thermal conductivity higher than the first thermal conductivity. The second adhesive fixes the optical semiconductor element to the first surface.
A magnetic wire made of an alloy containing iron and cobalt as main components, wherein the magnetic wire has a structure including at least an α phase of the α phase and a γ phase, the structure has a high angle grain boundary having a misorientation of 15° or more, the proportion of the area of the α phase relative to the total area of the α phase and the γ phase in a cross section of the magnetic wire is 90% or more, the average crystal grain size of the α phase in the cross section is 2.5 μm or less, and the proportion of the length of the high angle grain boundary relative to the total length of grain boundaries in the structure in the cross section is 60% or more.
C22C 19/07 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de cobalt
B21C 1/02 - Étirage des fils métalliques ou d'un matériau flexible analogue au moyen de machines ou d'appareils à étirer dans lesquels l'étirage est effectué par des tambours
C22C 30/00 - Alliages contenant moins de 50% en poids de chaque constituant
C22F 1/10 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du nickel ou du cobalt ou de leurs alliages
C22F 1/16 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid des autres métaux ou de leurs alliages
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01F 1/147 - Alliages caractérisés par leur composition
H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques
78.
RESIN COMPOSITION FOR COLORED COATING ON OPTICAL FIBER, OPTICAL FIBER, AND OPTICAL FIBER RIBBON
A resin composition for colored coating on an optical fiber contains a photopolymerizable compound, a photopolymerization initiator, a photosensitizer, and an organic pigment, in which the photosensitizer includes at least one selected from the group consisting of an anthracene-based photosensitizer and a naphthalene-based photosensitizer, and a content of the photosensitizer is 0.01 parts by mass or more and less than 3.00 parts by mass with respect to 100 parts by mass of the total amount of the photopolymerizable compound.
A multicore optical fiber includes a plurality of cores along a fiber axis and cladding surrounding the plurality of cores. The plurality of cores includes a first core having an elliptical shape in a cross section orthogonal to the fiber axis and one or more second cores different from the first core. The non-circularity of the elliptical shape is 0.1% or more. In the cross section orthogonal to the fiber axis, an angle formed by a straight line connecting a center of gravity of the first core and a center of gravity of a core group including one or more second cores and a straight line along a major axis of the elliptical shape is 30 degrees or less. Polarization mode dispersion is 0.2 ps/rtkm or less.
An optical fiber cable includes a cable core including a plurality of optical fibers, at least one tensile strength member provided along the cable core, and a sheath covering the cable core from an outside of the cable core and containing the tensile strength member. The cable core has a non-circular shape. In a cross-sectional view, when a thickness of the sheath at a location where the thickness of the sheath is the largest at a position including the tensile strength member is defined as a first sheath thickness, and a thickness of the sheath at a position facing the tensile strength member across the cable core is defined as a second sheath thickness, the first sheath thickness is larger than the second sheath thickness.
The method for measuring the refractive index variation position of an optical fiber preform comprises: rotating the optical fiber preform about the central axis such that a straight line which is orthogonal to the central axis and which passes through two more refractive index variation positions of choice that are subject to measurement is orthogonal to the observation axis; irradiating a side surface of the optical fiber preform with light emitted from the light source, via the polarizer; receiving, with the camera and via the analyzer, the light that has been transmitted by the optical fiber preform, and acquiring a light intensity image; detecting a refractive index variation position of the optical fiber preform on the basis of the light intensity image; and moving the optical fiber preform or the observation axis parallel to the central axis.
An operation plan generation apparatus includes an operation plan input unit configured to receive an input of a first operation plan, the first operation plan being an operation plan of a vehicle, a work time estimation unit configured to estimate a work time of a driver at an operation destination, based on the first operation plan, external information including a possible influencing event for realization of the first operation plan, and feature data indicating a feature of at least one of the driver of the vehicle and the operation destination of the vehicle, a travel time estimation unit configured to estimate a travel time of the vehicle from an operation origin to the operation destination, based on the first operation plan, the external information, and the feature data, and an operation plan creation unit configured to correct the first operation plan.
A pre-crimped terminal includes a terminal connecting portion, a wire connecting portion disposed behind the terminal connecting portion and to be connected to the wire, and a coupling portion coupling the terminal connecting portion and the wire connecting portion. The terminal connecting portion includes a first bottom wall and a pair of first side walls. The coupling portion includes a second bottom wall and a pair of second side walls. The wire connecting portion includes a third bottom wall and a pair of third side walls. The wire connecting portion is crimped to the wire. The second side wall is integrally formed to the third side wall in a range reaching a top of the third side wall most distant from the third bottom wall and coupled to the third side wall over an entire height of the second side wall.
H01R 4/18 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation effectuées uniquement par torsion, enroulage, pliage, sertissage ou autre déformation permanente par sertissage
A connector is to be connected to a first wire including a first core wire and extending in a front-rear direction, and provided with a first terminal to be connected to the first core wire, and a connector housing for accommodating the first terminal, the first wire being inserted into the connector housing. The first terminal includes a first terminal body and a first slide portion slidable in the front-rear direction in a state fit to the first terminal body from outside. The first terminal body includes a sandwiching portion for sandwiching the first core wire. The first slide portion includes a core wire insertion opening, a pressing portion for pressing the sandwiching portion, a guide portion disposed in a rear end part of the first slide portion, and a coupling portion continuously coupling the pressing portion and the guide portion in the front-rear direction.
A wire includes: a core; and a shell that covers an outer periphery of the core, wherein the core includes silver, the shell includes 33.0 mass % or more and 37.0 mass % or less of nickel, 9.0 mass % or more and 10.5 mass % or less of molybdenum, 19.0 mass % or more and 21.0 mass % or less of chromium, 0.5 mass % or more and 1.2 mass % or less of titanium, and a remainder including cobalt and an inevitable impurity, a diameter of the wire is 100 μm or less, and an elongation of the wire is 12% or more.
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
C22C 30/00 - Alliages contenant moins de 50% en poids de chaque constituant
H01B 7/18 - Protection contre les dommages provoqués par des facteurs extérieurs, p. ex. gaines ou armatures par l'usure, la contrainte mécanique ou la pression
H01B 13/00 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles
H01B 13/008 - Appareils ou procédés spécialement adaptés à la fabrication de conducteurs ou câbles pour fabriquer des conducteurs ou câbles extensibles
86.
CONTROL BOARD, CONTROL SYSTEM, CONTROL METHOD, AND COMPUTER PROGRAM
Disclosed is a control board configured to be mounted in a vehicle and capable of rewriting a circuit configuration, the control board including: a connector to which is connected a second end of a cable having a first end connected to a component mounted in the vehicle, the second end being located opposite to the first end; and a control unit configured to perform control of the component, wherein the control unit is configured to obtain, based on component information transmitted from the component via the cable, wiring data relating to an arrangement of a plurality of pins included in the connector, and a control program for controlling the component.
B60R 16/023 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule
G06F 15/78 - Architectures de calculateurs universels à programmes enregistrés comprenant une seule unité centrale
87.
SEMICONDUCTOR OPTICAL DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE
A semiconductor optical device includes a substrate having a silicon layer, and a semiconductor element formed of a III-V group compound semiconductor and bonded to the silicon layer. The silicon layer includes a first waveguide, a first recess, a terrace, and a first slab portion. The first recess is a recessed portion lower than a surface of the first waveguide, a surface of the terrace, and a surface of the first slab portion. The first recess and the terrace are disposed in this order on each of two sides of the first waveguide. The first waveguide is connected to one end of the first slab portion. The first slab portion is connected to the terrace. The semiconductor element includes a second slab portion, a projecting portion, and a mesa. The second slab portion is located on or above the first slab portion.
H01S 5/22 - Structure ou forme du corps semi-conducteur pour guider l'onde optique ayant une structure à nervures ou à bandes
H01S 5/02 - Détails ou composants structurels non essentiels au fonctionnement laser
H01S 5/343 - Structure ou forme de la région activeMatériaux pour la région active comprenant des structures à puits quantiques ou à superréseaux, p. ex. lasers à puits quantique unique [SQW], lasers à plusieurs puits quantiques [MQW] ou lasers à hétérostructure de confinement séparée ayant un indice progressif [GRINSCH] dans des composés AIIIBV, p. ex. laser AlGaAs
88.
SEMICONDUCTOR OPTICAL DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE
A semiconductor optical device includes a substrate having a silicon layer, a semiconductor element includes a mesa, and the semiconductor element is formed of a III-V group compound semiconductor and has an optical gain. The silicon layer includes a waveguide, a recess, and a first slab portion. The recess is a recessed portion lower than a surface of the waveguide and a surface of the first slab portion, and the recess is provided on each of two sides of the waveguide. The first slab portion is connected to the waveguide. The semiconductor element is bonded to the first slab portion. The mesa is located on or above the first slab portion.
A terminal block that is to be fixed to a case of a device and to which an electrically conductive member is to be fastened by a bolt, the terminal block including: a nut to which the bolt is to be screwed; a heat sink that includes a heat dissipation portion configured to come into contact with a coolant for cooling the device; and an insulator that electrically insulates the nut and the heat sink from each other, wherein the heat sink includes a rib located around the nut.
A lever-type connector includes a connector housing connectable to a mating connector and including a housing body having an assembly surface and rail receiving portions disposed on the assembly surface and to be engaged with a vehicle body panel, a lever having a code arrangement surface and to be assembled with the connector housing rotatably from a connection start position to a connection completion position, and a two-dimensional code disposed on the code arrangement surface. The code arrangement surface is a surface facing outward both when the lever is at the connection start position and when the lever is at the connection completion position, facing the same side as the assembly surface when the lever is at the connection start position and facing a side different from the assembly surface when the lever is at the connection completion position.
H01R 13/641 - Moyens pour empêcher, bloquer ou éviter le couplage incorrect par l'indication du couplage incorrectMoyens pour empêcher, bloquer ou éviter le couplage incorrect par l'indication d'un engagement complet ou correct
H01R 13/629 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz
In a communication system, a plurality of control apparatuses control respective operations of a plurality of on-board devices. A communication apparatus communicates with the plurality of control apparatuses. A plurality of switches are provided for a plurality of supply paths for respectively supplying power to the plurality of control apparatuses. The plurality of switches are each associated in advance with one of the plurality of on-board devices. The communication apparatus includes a processing unit configured to perform processing. The processing unit is configured to provide an instruction to turn on a specific switch included in the plurality of switches. After providing the instruction to turn on the specific switch, the processing unit is configured to provide an instruction to transmit device data indicating an on-board device corresponding to the specific switch, to the plurality of control apparatuses.
A cemented carbide consists of a first hard phase, second hard phases, and a binder phase, wherein the first hard phase is composed of tungsten carbide grains, a D10 and a D90 of grain sizes of the tungsten carbide grains are 0.40 μm or more and 2.00 μm or less respectively, the second hard phases are composed of at least one first compound selected from the group consisting of TaNbC, TaNbN, TaNbCN, TiCN, TiNbC, TiNbN, and TiNbCN, the cemented carbide includes 0.30% to 1.60% by volume of the second hard phases, an average of circularities of the second hard phases is 0.10 to 0.32, a standard deviation of the circularity is 0.094 to 0.130, the binder phase includes 50% by mass or more of cobalt, and the cemented carbide includes 8.0% to 12.0% by volume of the binder phase.
B23B 27/14 - Outils de coupe sur lesquels les taillants ou éléments tranchants sont en matériaux particulier
C23C 14/06 - Revêtement par évaporation sous vide, pulvérisation cathodique ou implantation d'ions du matériau composant le revêtement caractérisé par le matériau de revêtement
C23C 14/32 - Évaporation sous vide par explosionÉvaporation sous vide par évaporation suivie d'une ionisation des vapeurs
A vehicle-mounted device is communicably connected to a vehicle-mounted ECU that controls a vehicle-mounted load mounted in the vehicle, and receives supply of power from a power source device mounted in the vehicle. The vehicle-mounted device includes a control unit that controls power supply to the vehicle-mounted ECU. The control unit takes over control to be performed by the vehicle-mounted ECU on the vehicle-mounted load, according to the state of the vehicle-mounted ECU.
B60R 16/023 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule
94.
ELECTRIC CONNECTOR, CONNECTION ASSEMBLY, AND CABLE
An electric connector includes a cable including a plurality of conductors and a covering portion, the plurality of conductors being arranged side by side and including a plurality of signal lines and a plurality of ground lines, the covering portion being configured to cover the plurality of conductors such that an end portion of each of the plurality of conductors is exposed, and a plurality of terminals arranged side by side along an aligned direction of the plurality of conductors in such a manner that each of the plurality of terminals faces a corresponding one of the end portions of the plurality of ground lines, the plurality of terminals electrically connecting each of the plurality of ground lines to a ground.
H01R 12/53 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à des câbles à l'exclusion des câbles plats ou à rubans
H01R 13/6471 - Moyens pour empêcher la diaphonie par agencement particulier des conducteurs de mise à la masse et de signaux, p. ex. GSGS [mise à la masse - signal - mise à la masse - signal]
A phase shifter according to one embodiment includes a substrate; an optical waveguide disposed in a vertical direction with respect to the substrate; a first temperature measuring element and a second temperature measuring element disposed in a horizontal direction with respect to the optical waveguide, and disposed to sandwich the optical waveguide between the first temperature measuring element and the second temperature measuring element; and a heating element disposed in the vertical direction with respect to the optical waveguide, the first temperature measuring element, and the second temperature measuring element.
G02F 1/01 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur
An electrical device 1 includes a relay 30 that has a relay terminal 32 and generates heat in response to passage of a current, and an intermediate busbar 50 connected to the relay terminal 32. The intermediate busbar 50 includes: a first busbar strip 51 having a first inner abutting portion 52 connected to the relay terminal 32 and a first separated portion 53 continuous with the first inner abutting portion 52; and a second busbar strip 61 having a first outer abutting portion 54 abutting the first inner abutting portion 52 and a second separated portion 63 continuous with the first outer abutting portion 54 and separated from the first separated portion 53.
A waterproof connector includes a plurality of terminal fittings to be individually accommodated into a plurality of rear terminal accommodation chambers from front of a housing, a one-piece rubber plug to be mounted into a rear end part of the housing, and a plurality of wires to be accommodated into the terminal fittings mounted in the rear terminal accommodation chambers through sealing holes from behind the one-piece rubber plug. The terminal fitting is configured by assembling a first component including a flexible connecting portion capable of sandwiching the wire and a second component including a pressing portion and relatively movable in a front-rear direction between an initial position and a connection position with respect to the first component. The flexible connecting portion sandwiches the wire by being deformed by the pressing portion in the process of moving the second component from the initial position to the connection position.
An update control apparatus includes a reception unit that receives first partial data that is partial data of update data to be used in the update of a program; a storage unit in which the first partial data received by the reception unit is stored; and a transmission unit that transmits the first partial data stored in the storage unit to a target on-board apparatus so that the target on-board apparatus can generate the update data by combining the first partial data and second partial data transmitted from a selected on-board apparatus, wherein the selected on-board apparatus is an on-board apparatus in which the second partial data transmitted from the external apparatus is stored, the selected on-board apparatus being selected from among the plurality of non-target on-board apparatuses based on a selection condition for each of the plurality of on-board apparatuses.
A shielded electrically conductive path (100) includes a shielded cable (10) formed such that a shield layer (13) surrounding a core wire (11) is surrounded by a sheath (14), a sleeve (15) arranged to surround an outer periphery of the shield layer (13) extending forward in an axial direction of the shielded cable (10) from a front end of the sheath (14), and a butting portion (15) extending forward in the axial direction from a rear end of the sleeve (15) and configured to contact the front end of the sheath (14).
H01R 13/631 - Moyens additionnels pour faciliter l'engagement ou la séparation des pièces de couplage, p. ex. moyens pour aligner ou guider, leviers, pression de gaz pour l'engagement uniquement
H01R 13/22 - Contacts pour coopération par aboutage
H01R 13/6592 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs l'organe conducteur étant un câble blindé
100.
SEMICONDUCTOR OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor optical device is a method of manufacturing a semiconductor optical device including a substrate having a silicon layer and a semiconductor element having a III-V group compound semiconductor layer. The silicon layer is provided with a waveguide, a terrace, and an outgassing countermeasure structure, and the outgassing countermeasure structure includes a portion recessed from an upper surface of the silicon layer. The method includes bringing the semiconductor element into contact with the upper surface of the silicon layer by disposing the semiconductor element over the waveguide and the outgassing countermeasure structure, and bonding the semiconductor element to the substrate by performing a thermal treatment after the bringing into contact.
H01L 21/324 - Traitement thermique pour modifier les propriétés des corps semi-conducteurs, p. ex. recuit, frittage
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
brevets
