Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer. The same multilayered flexible interconnect circuit can provide battery interconnect, voltage/temperature sense, and/or other functions.
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
2.
FLEXIBLE INTERCONNECT CIRCUITS COMPRISING SPRING CONTACTS
Described herein are flexible interconnect circuits comprising spring contacts, methods of fabricating such circuits, as well as methods of using such circuits to form electrical connections to various components. A flexible interconnect circuit comprises two insulators and one or more conductive traces, at least partially protruding between the insulators. The circuit also comprises one or more spring contacts, each comprising a base portion and a spring portion, which is monolithic with the base portion. The base portion directly interfaces, is mechanically attached, and is electrically connected to one of the protruding portions of the conductive traces forming a trace-contact interface. The spring portion is configured to flex relative to the base portion at least in a direction substantially perpendicular to the trace-contact interface. In some examples, multiple spring contacts are attached to the same protruding portion and are offset along the width of this portion.
Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/498 - Connexions électriques sur des substrats isolants
Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.
H01M 50/516 - Procédés pour interconnecter les batteries ou cellules adjacentes par soudage, brasage ou brasage tendre
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/533 - Connexions d’électrodes dans un boîtier de batterie caractérisées par la forme des conducteurs ou des languettes
H05K 1/14 - Association structurale de plusieurs circuits imprimés
5.
FLEXIBLE INTERCONNECT CIRCUITS AND METHODS OF FABRICATION THEREOF
Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises two insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures higher welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs ensures are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure the electrical connections and mechanical support.
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/521 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau
A connector for connecting a flexible interconnect circuit comprises a base comprising a first set of protrusions and a second set of protrusions. The first set of protrusions and second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further comprises a cover piece configured to secure the flexible interconnect circuit in the arched configuration.
H01R 12/79 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.
Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.
H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.
H01R 12/79 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a HF signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may be removed, e.g., together with undesirable portions of the conductive layer. If the substrate is removed and is not a part of the interconnect circuit, it may be damaged during patterning. Alternatively, the substrate is retained as a component of the circuit. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.
Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.
B60R 16/02 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques
H01R 12/59 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
H01R 12/65 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes
H01R 12/69 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes bornes déformables, p. ex. bornes à sertir
Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead a width to thickness ratio of at least 2, which provides for a lower thickness profile and enhances thermal conductivity with the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The conductor trace also comprises connecting end, monolithic with the conductor lead. The width to thickness ratio of the connecting end is less than that of conductor trace, allowing for direct mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width to thickness ratio, which in some examples may be close to 1.
H05K 7/02 - Dispositions de composants de circuits ou du câblage sur une structure de support
B60R 16/023 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour la transmission de signaux entre des parties ou des sous-systèmes du véhicule
B60R 16/03 - Circuits électriques ou circuits de fluides spécialement adaptés aux véhicules et non prévus ailleursAgencement des éléments des circuits électriques ou des circuits de fluides spécialement adapté aux véhicules et non prévu ailleurs électriques pour l'alimentation des sous-systèmes du véhicule en énergie électrique
F01D 25/00 - Parties constitutives, détails ou accessoires non couverts dans les autres groupes ou d'un intérêt non traité dans ces groupes
Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.
H01R 9/16 - Fixation des pièces de connexion sur le socle ou sur le coffretIsolement des pièces de connexion par rapport au socle ou au coffret
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
H01R 13/68 - Association structurelle avec des composants électriques incorporés avec fusible incorporé
H01M 2/20 - Connexions conductrices du courant pour les éléments
16.
SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER
Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.
Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.
brevets
