An ultraviolet light fluid treatment device that can enhance treatment effects is provided. The ultraviolet light fluid treatment device includes an inlet and an outlet of fluid; a flow channel connecting the inlet and the outlet and including a plurality of branch flow channels branching from the inlet, and a merged flow channel connected to a downstream side of each of the branch flow channels; a first light source configured to emit ultraviolet light to the merged flow channel; and a plurality of second light sources configured to emit the ultraviolet light to the plurality of respective branch flow channels.
A61L 9/20 - Désinfection, stérilisation ou désodorisation de l'air utilisant des phénomènes physiques des radiations des ultraviolets
B01J 19/12 - Procédés utilisant l'application directe de l'énergie ondulatoire ou électrique, ou un rayonnement particulaireAppareils à cet usage utilisant des radiations électromagnétiques
C02F 1/32 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par irradiation par la lumière ultraviolette
Provided is a method of treating a post-harvest plant after harvest, the method in-cluding: irradiating a harvested plant with light having a peak wavelength in a wavelength range from 270 to 290 nm and/or light having a peak wavelength in a wavelength range from 370 to 400 nm at an irradiance effective to increase an amount of at least one rare cannabinoid compound and/or at least one terpene compound in the harvested plant, wherein an irradiance of light of all wavelengths in a wavelength range from 410 to 700 nm received by the harvested plant during the irradiation is less than 20% of the irradiance of the light having a peak wavelength in the wavelength range from 270 to 290 nm and/or less than 20% of the irradiance of the light having a peak wavelength in the wavelength range from 370 to 400 nm.
A23B 7/015 - Conservation par irradiation ou traitement électrique sans effet de chauffage
A23L 5/00 - Préparation ou traitement des aliments ou produits alimentaires en généralAliments ou produits alimentaires ainsi obtenusLeurs matériaux
A23L 33/105 - Extraits de plantes, leurs doublons artificiels ou leurs dérivés
A23N 15/00 - Machines ou appareils destinés à d'autres traitements des fruits ou des légumes pour les besoins de l'hommeMachines ou appareils pour écimer ou peler les bulbes à fleurs
A light emitting device manufacturing method includes: disposing n pieces of light emitting elements in m rows on a substrate block, where an interval between a kth light emitting element from one end of rows and a (k+1)th light emitting element has a first distance; disposing a phosphor member on the light emitting elements; disposing a frame member to surround the light emitting elements; disposing a cover member in each area surrounded by the frame member to cover lateral surfaces of the light emitting elements and the phosphor members while forming recesses at an upper surface between the kth light emitting elements and the (k+1)th light emitting elements apart by the first distance; disposing a light shielding member in each recess; and cutting the light shielding members, the cover members, and the substrate block between the light emitting elements that are apart by the first distance.
F21K 9/60 - Agencements optiques intégrés dans la source lumineuse, p. ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière
F21K 9/64 - Agencements optiques intégrés dans la source lumineuse, p. ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière en utilisant des moyens de conversion de longueur d’onde distincts ou espacés de l’élément générateur de lumière, p. ex. une couche de phosphore éloignée
F21S 41/20 - Dispositifs d’éclairage spécialement adaptés à l’extérieur des véhicules, p. ex. phares caractérisés par des réfracteurs, des glaces de fermeture transparentes, des guides ou des filtres de lumière
F21S 41/40 - Dispositifs d’éclairage spécialement adaptés à l’extérieur des véhicules, p. ex. phares caractérisés par des écrans, des éléments non réfléchissants, des éléments faisant écran à la lumière ou des éléments d’occultation fixes
A light emitting device includes: one or more semiconductor laser elements, each configured to emit laser light; one or more light-reflecting parts, each having a light-reflecting surface configured to reflect the laser light emitted from a corresponding one of the one or more semiconductor laser elements; and a fluorescent part having a light-receiving surface configured to be irradiated with the laser light reflected at the light-reflecting surface of each of the one or more light-reflecting parts; wherein an irradiated region is formed on the light-reflecting surface when the light-reflecting surface is irradiated with the laser light, the irradiated region including a first end and a second end opposite the first end; and wherein the light-reflecting surface of each of the one or more light-reflecting parts is arranged such that a portion of the laser light reflected at at least a first end of the irradiated region and a portion of the laser light reflected at a location other than the first end of the irradiated region are overlapped with each other on the light-receiving surface.
F21K 9/00 - Sources lumineuses utilisant des dispositifs à semi-conducteurs en tant qu’éléments générateurs de lumière, p. ex. utilisant des diodes électroluminescentes [LED] ou des lasers
F21K 9/60 - Agencements optiques intégrés dans la source lumineuse, p. ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière
F21K 9/64 - Agencements optiques intégrés dans la source lumineuse, p. ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière en utilisant des moyens de conversion de longueur d’onde distincts ou espacés de l’élément générateur de lumière, p. ex. une couche de phosphore éloignée
F21K 9/68 - Détails des réflecteurs faisant partie de la source lumineuse
An object of the present invention is to provide a method that can effectively/efficiently increase the amount of a phenolic compound such as a polyphenol. The invention provides a method for increasing an amount of a phenolic compound in a plant, or a method for producing a plant containing an increased amount of a phenolic compound, the method comprising irradiating the/a plant with ultraviolet light, wherein a fluence at wavelengths of 270 to 290 nm is 1500 to 50000 .mu.mol/m2 and a fluence at wavelengths of 310 to 400 nm is less than 50% of that at wavelengths of 270 to 290 nm.
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY (Japon)
OSAKA UNIVERSITY (Japon)
Inventeur(s)
Torimoto, Tsukasa
Kameyama, Tatsuya
Kishi, Marino
Miyamae, Chie
Kuwabata, Susumu
Uematsu, Taro
Oyamatsu, Daisuke
Niki, Kenta
Abrégé
Provided is a semiconductor nanoparticle that demonstrates band-edge luminescence and that has a short light emission peak wavelength. The semiconductor nanoparticle comprises Ag, In, Ga and S, and the ratio of the number of Ga atoms to the total number of In atoms and Ga atoms is 0.95 or less. Moreover, the semiconductor nanoparticle has a light emission peak wavelength within a range between at least 500 nm and less than 590 nm, and emits light having a light emission peak half-width of 70 nm or less. The average particle size is 10 nm or less.
B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
B82Y 40/00 - Fabrication ou traitement des nanostructures
C01G 15/00 - Composés du gallium, de l'indium ou du thallium
C09K 11/08 - Substances luminescentes, p. ex. électroluminescentes, chimiluminescentes contenant des substances inorganiques luminescentes
C09K 11/62 - Substances luminescentes, p. ex. électroluminescentes, chimiluminescentes contenant des substances inorganiques luminescentes contenant du gallium, de l'indium ou du thalium
H10H 20/851 - Moyens de conversion de la longueur d’onde
7.
OPTICAL COMPONENT AND METHOD OF MANUFACTURING SAME
An optical component includes: a light transmissive member having an upper face, a lower face, and at least one lateral face; and a light reflecting member that surrounds the at least one lateral face of the light transmissive member, wherein the light reflecting member is made of a ceramic that contains a plurality of pores, and wherein the plurality of pores are localized in a vicinity of the light transmissive member in a cross section that extends through the light transmissive member and the light reflecting member.
C04B 35/00 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques
C09K 11/02 - Emploi de substances particulières comme liants, revêtements de particules ou milieux de suspension
G02B 1/02 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de cristaux, p. ex. sel gemme, semi-conducteurs
G02B 17/00 - Systèmes avec surfaces réfléchissantes, avec ou sans éléments de réfraction
8.
LIGHT-EMITTING DEVICE AND PACKAGE FOR LIGHT-EMITTING DEVICE
A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.
F21K 9/00 - Sources lumineuses utilisant des dispositifs à semi-conducteurs en tant qu’éléments générateurs de lumière, p. ex. utilisant des diodes électroluminescentes [LED] ou des lasers
F21V 15/01 - Boîtiers, p. ex. matériau ou assemblage de parties du boîtier
F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
F21V 29/503 - Dispositions de refroidissement caractérisées par l’adaptation au refroidissement de composants spécifiques de sources lumineuses
9.
LIGHT-EMITTING DEVICE, INTEGRATED LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING MODULE
A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.
A light emitting device includes a light emitting element adapted to emit blue light, quantum dots that absorb part of the blue light emitted from the light emitting element to emit green light, and at least one of a KSF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light and a MGF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light.
H10H 20/812 - Corps ayant des structures ou des superréseaux à effet quantique, p. ex. jonctions tunnel au sein des régions électroluminescentes, p. ex. structures de confinement quantique
A light emitting device includes a light emitting element adapted to emit blue light, quantum dots that absorb part of the blue light emitted from the light emitting element to emit green light, and at least one of a KSF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light and a MGF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light.
B82Y 20/00 - Nano-optique, p. ex. optique quantique ou cristaux photoniques
H01L 29/12 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués
H05B 33/14 - Sources lumineuses avec des éléments radiants ayant essentiellement deux dimensions caractérisées par la composition chimique ou physique ou la disposition du matériau électroluminescent
A light emitting device includes a substrate member and at least one light emitting element. The substrate member has a groove portion defined between two wiring portions spaced apart from each other. The groove portion includes a first groove portion, a second groove portion, and a third groove portion. The first groove portion extends in a direction that forms a slanted angle with respect to a first direction, the second groove portion is spaced apart from the first groove and extends in a direction that forms a slanted angle with respect to the first direction, and the third groove portion is interconnected with the first groove portion and the second groove portion. The light emitting element is disposed over the third groove portion.
F21S 4/20 - Dispositifs ou systèmes d'éclairage utilisant une guirlande ou une bande de sources lumineuses avec les sources lumineuses maintenues par ou à l'intérieur de supports allongés
F21S 4/26 - Dispositifs ou systèmes d'éclairage utilisant une guirlande ou une bande de sources lumineuses avec les sources lumineuses maintenues par ou à l'intérieur de supports allongés flexibles ou déformables, p. ex. en une forme courbée en forme de corde, p. ex. cordes d’éclairage à LED, ou de forme tubulaire
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
F21V 33/00 - Combinaisons structurales de dispositifs d'éclairage avec d'autres objets, non prévues ailleurs
A semiconductor light emitting device, has a package constituted by the lamination of a first insulating layer having a pair of positive and negative conductive wires formed on its upper face, an inner-layer wire below the first insulating layer, and a second insulating layer below the inner-layer wire; a semiconductor light emitting element that has a pair of positive and negative electrodes on the same face side and that is disposed with these electrodes opposite the conductive wires; and a sealing member that covers the semiconductor light emitting element, wherein part of the conductive wires is formed extending in the outer edge direction of the sealing member from directly beneath the semiconductor light emitting element, on the upper face of the first insulating layer, and is connected to the inner-layer wire via a conductive wire disposed in the thickness direction of the package, and the inner-layer wire is disposed so as to be spaced apart from the outer periphery of the semiconductor light emitting element in a see-through view of the package from the upper face side of the first insulating layer.