Provided in the present application is a microphone circuit, comprising: a charge pump module, which is connected to a first terminal of a microphone, and used for receiving a preset first voltage, generating a first bias voltage on the basis of the first voltage and outputting same to the microphone; an amplification module, which is connected to a second terminal of the microphone, and used for receiving a voltage signal output by the microphone, amplifying the voltage signal and outputting same as an output signal of the microphone circuit; and a voltage division module, which is connected to the second terminal of the microphone and the amplification module, and used for receiving the first voltage, dividing the first voltage to generate a second bias voltage and outputting same to the microphone, and outputting the second bias voltage as a bias voltage of the amplification module to the amplification module. In the microphone circuit of the present application, the first bias voltage and the second bias voltage change along with the first voltage, that is, regulating any bias voltage causes the other bias voltage to change accordingly, thereby solving the problem of sensitivity offset of MEMS microphones caused by the change in the difference between two bias voltages due to the regulation of any bias voltage.
The present invention provides a MEMS microphone, comprising: a substrate provided with a back cavity passing therethrough; a back plate fixed to the substrate; and a diaphragm located between the back plate and the substrate along the thickness direction of the substrate, the diaphragm comprising a vibrating body, and the vibrating body comprising an inner region, an outer region, and a plurality of connecting portions distributed at intervals along the circumferential direction of the diaphragm, wherein the inner region is suspended above the back cavity, the outer region is fixedly connected to the substrate, the connecting portions are suspended above the substrate, two ends of each connecting portion are respectively fixedly connected to the inner region and the outer region along the radial direction of the diaphragm, and the width of the connecting portions gradually decreases along a direction from the inner region to the outer region. In the MEMS microphone of the present invention, the structural rigidity of the connecting portions can be reduced, increasing the amplitude of the diaphragm, thereby improving the sensitivity of the MEMS microphone; in addition, stress on the connecting portions can also be transferred to the substrate, uniformly distributing the stress on the connecting portions, reducing the maximum stress on the connecting portions under a given load, thereby improving the structural stability of the microphone.
Provided in the embodiments of the present application are a signal processing system and an electronic device. The system comprises: an input signal module, a displacement model, a filter coefficient generation module, a group delay compensation module, a tunable equalizer, an amplifier and an audio transducer, wherein the input signal module is connected to both the group delay compensation module and the displacement model, the displacement model is connected to the filter coefficient generation module, the group delay compensation module is connected to the tunable equalizer, the tunable equalizer is connected to the amplifier, the amplifier is connected to the audio transducer, and the filter coefficient generation module is connected to the tunable equalizer. In the technical solution provided in the embodiments of the present application, frequency response variations related to driver displacement can be corrected within a wide frequency range, thereby reducing distortion, especially intermodulation distortion.
An interpupillary distance adjustment device, comprising: a base (1), a first lens assembly (2) and a second lens assembly (3) which are relatively slidably arranged on the base (1), a knob (4) rotatably arranged on the base (1), and a transmission assembly (5) separately connected to the first lens assembly (2), the second lens assembly (3), and the knob (4). The transmission assembly (5) comprises a transmission gear (51) rotatably arranged on the base (1), and a transmission belt (52) having two portions respectively wound around the knob (4) and the transmission gear (51). The knob (4) is provided with a first groove (41), the transmission gear (51) is provided with a second groove (511), the transmission belt (52) is engaged with the first groove (41) and the second groove (511), and the transmission gear (51) is separately meshed with the first lens assembly (2) and the second lens assembly (3). The knob (4) and the transmission gear (51) are connected by means of the transmission belt (52), so that belt drive is achieved between the knob (4) and the transmission gear (51), thereby ensuring smooth torque during rotation and providing a good operational feel. Moreover, transmission is implemented between the knob (4) and the transmission gear (51) by means of the transmission belt (52), and the transmission gear (51) is separately meshed with the first lens assembly (2) and the second lens assembly (3), such that the structure is simpler and more reliable.
Provided in the present invention are a MEMS device and a manufacturing method therefor. The MEMS device of the present invention comprises a piezoelectric diaphragm, a barrier layer provided on one side of the piezoelectric diaphragm, a sacrificial layer connected to the side of the barrier layer facing away from the piezoelectric diaphragm, and a substrate connected to the side of the sacrificial layer facing away from the barrier layer. The substrate comprises a wall connected to the side of the sacrificial layer facing away from the barrier layer, and the wall encloses a cavity; the substrate further comprises a mass block which is provided on the side of the sacrificial layer facing away from the barrier layer and is accommodated in the cavity; the mass block is formed by etching the substrate and is spaced apart from the wall. After capturing and amplifying a vibration signal, the mass block can drive the piezoelectric diaphragm to generate significant mechanical deformation, so as to effectively capture vibration in solid media, thereby improving the sensitivity and response efficiency of the MEMS device.
A chromatic aberration defect compensation data determination method, a chromatic aberration defect compensation method, and an augmented reality device. The chromatic aberration defect compensation data determination method comprises: acquiring an imaging image of an augmented reality apparatus, and preprocessing the imaging image to obtain a first image; using a preset filtering algorithm to perform chromatic aberration defect detection on the first image; obtaining the position of a chromatic aberration defect region and chromatic aberration defect data; and generating corresponding chromatic aberration defect compensation data on the basis of the chromatic aberration defect data. The augmented reality apparatus can execute the method; the position of the chromatic aberration defect region and the corresponding chromatic aberration defect compensation data are determined by means of a detection result of the preset filtering algorithm, and then the display content of the augmented reality display apparatus is compensated, so as to obtain a compensated display picture, thereby improving the display effect of the augmented reality display apparatus, and correcting chromatic aberration.
An inertial measurement unit and a manufacturing method therefor. The inertial measurement unit comprises: a first substrate (1); a dielectric layer (2), wherein the dielectric layer (2) is stacked on the first substrate (1), and notches (15) are formed on the dielectric layer (2); a first conductive layer (3), wherein the first conductive layer (3) is stacked on the dielectric layer (2); a second conductive layer (5), wherein the second conductive layer (5) is supported on the first conductive layer (3) by means of support portions (7); a second substrate (9), wherein the second substrate (9) covers the second conductive layer (5) by means of a bonding structure (8), a sealed space is formed between the second substrate (9) and the first substrate (1), the sealed space comprises a plurality of separated chambers (14), and the chambers (14) have different chamber pressures; an exhaust channel (12), communicated with at least one chamber (14), wherein the exhaust channel (12) is used for communicating the chamber (14) with the outside; and a sealing portion, used for sealing the exhaust channel (12). A plurality of chambers (14) having different chamber pressures are provided on a single wafer, which is conducive to manufacturing of an inertial measurement unit in which two or more inertial sensors are integrated.
The present invention provides a locking mechanism and a locking device, the locking mechanism being used for locking and securing a detachable optional assembly. The locking mechanism comprises: a housing detachably connected to the detachable optional assembly, a fixing frame mounted in the housing, a driving assembly slidably connected to the fixing frame, and a lock tongue movably connected to the driving assembly. The housing is provided with a locking hole. The fixing frame is provided with a first locating shaft. The lock tongue is rotatably connected to the first locating shaft, and a curved hook adapted to the locking hole is formed at the end of the lock tongue away from the first locating shaft. The driving assembly is used for driving the lock tongue to rotate about the first locating shaft from a first position to a second position, wherein when the lock tongue rotates to the first position, the hook is located inside the housing, and when the lock tongue rotates to the second position, one end of the hook extends through the locking hole to fasten and secure the detachable optional assembly outside the housing. The locking mechanism of the present application allows the locking mechanism to lock and secure a detachable optional assembly within a housing.
Embodiments of the present invention relate to the technical field of semiconductors, and provide a semiconductor structure and a semiconductor structure forming method. The semiconductor structure forming method comprises: providing a substrate; forming an initial photoresist layer on the substrate, and patterning the initial photoresist layer to form a photoresist layer, wherein the photoresist layer is provided with a plurality of positioning openings extending through the thickness of the photoresist layer; forming an initial target layer, wherein the initial target layer is located on the surface of the photoresist layer away from the substrate, and the initial target layer fills the positioning openings; removing the initial target layer higher than the top surface of the photoresist layer, and using the initial target layer located in the positioning openings as a target layer; and removing the photoresist layer. The implementation of the present disclosure is at least conducive to solving the problem of incapability of forming a patterned target layer due to the incompatibility between the material of a target layer and the material of a photoresist layer.
H10N 30/05 - Fabrication de dispositifs piézo-électriques ou électrostrictifs multicouches ou de leurs parties constitutives, p. ex. en empilant des corps piézo-électriques et des électrodes
The present utility model provides a MEMS microphone chip, comprising: a substrate having a back cavity; a diaphragm fixed to the substrate and located above the back cavity; and a back plate arranged spaced apart from the diaphragm in a vibration direction to form an inner cavity. The diaphragm comprises: a main body portion located above the back cavity; a support portion surrounding the main body portion and fixed to the substrate; and an air release valve partially spaced apart from the main body portion to form a first air release gap, the air release valve comprising at least one air release member. The air release member comprises: a fixed portion connected to the main body portion; a movable portion arranged spaced apart from the main body portion; and a connecting portion connecting the fixed portion to the movable portion, the width of the fixed portion being less than the width of the movable portion. The MEMS microphone chip provided in the present utility model has high reliability.
Provided is an MEMS sensor module, comprising a side wall (1) enclosing a cavity, a first circuit board (2), a second circuit board (3), a partition wall (4) dividing the cavity into a first cavity (11) and a second cavity (12), a first MEMS sensor assembly (5) arranged in the first cavity (11) and encapsulated by glue (6), a second MEMS sensor assembly (7) arranged in the second cavity, a first gold finger layer (8) arranged between the side wall (1) and the partition wall (4) and the first circuit board (2), and a second gold finger layer (9) arranged between the side wall (1) and the partition wall (4) and the second circuit board (3), wherein the first gold finger layer (8) surrounds both the first cavity (11) and the second cavity (12), the second gold finger layer (9) surrounds both the first cavity (11) and the second cavity (12), and the first gold finger layer (8) at the partition wall (4) is provided with a slot (80) communicating the first cavity (11) with the second cavity (12). The MEMS sensor module can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
The MEMS sensor module of the present utility model comprises a side wall enclosing a cavity, a first circuit board, a second circuit board, a partition wall dividing the cavity into two cavity bodies, MEMS sensor assemblies respectively arranged in the two cavity bodies, and two gold finger layers that each surround the two cavity bodies and are between the side wall, the partition wall and the two circuit boards. A gold finger layer at the partition wall is provided with a slot opening connecting the two cavity bodies; an MEMS sensor assembly in one cavity body comprises an ASIC chip fixed to the second circuit board and an MEMS chip stacked and fixed on the ASIC chip, and an MEMS sensor assembly in the other cavity body comprises an ASIC chip fixed to the first circuit board and an MEMS chip fixed to the second circuit board; the side wall is provided with a conductor connecting the two circuit boards; and bonding gold wires are respectively connected between the two MEMS chips and the second circuit board. The MEMS sensor module of the present utility model can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.
Provided in the present invention is a smart optical device, comprising a screen, a support spaced apart from the screen, a driving assembly fixed to the support, a reflector assembly movably connected to the support, and a prism assembly fixedly connected to the support, wherein the driving assembly comprises a screw rod at least partially located outside the support, and a slider threadedly connected to the screw rod, the slider abutting against the reflector assembly; and the screw rod is rotated such that the slider moves in a first direction so as to push the reflector assembly to move in a second direction, the first direction being the axial direction of the screw rod, and the second direction being perpendicular to the first direction. The smart optical device of the present invention achieves the effect of adjusting diopters by means of rotating the screw rod, has a simple structure, and is convenient to operate.
G02B 7/198 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs avec des moyens pour régler la position du miroir par rapport à son support
G03B 21/28 - Réflecteurs dans le faisceau de projection
Smart glasses (100), comprising a frame assembly (1) and two temple mechanisms (2) respectively fixed at two opposite ends of the frame assembly (1). The temple mechanisms (2) comprise two connectors (21) fixed at two ends of the frame assembly (1), two female connector assemblies (22) respectively hinged to the ends of the two connectors (21) away from the frame assembly (1), and two temple assemblies (23) that are respectively inserted into the two female connector assemblies (22) from the ends of the two female connector assemblies (22) away from the frame assembly (1), forming a snap-fit connection. The temple assemblies (23) and the female connector assemblies (22) form a detachable connection. By inserting the temple assemblies (23) into the female connector assemblies (22), male connector assemblies and the female connector assemblies (22) form a locked and fixed connection. When an external force is applied to pull out the temple assemblies (23), the temple assemblies (23) separate from quick-release female connectors of the frame assembly (1), thereby completing disassembly. The frame of said smart glasses (100) allows for convenient assembly and disassembly, providing a good user experience.
Smart glasses (100), comprising a frame assembly (1), two female connector assemblies (2) respectively arranged at two opposite ends of the frame assembly (1), and two temple assemblies (3) respectively connected to the two female connector assemblies (2), wherein each female connector assembly (2) comprises a female connector (21) hinged to the frame assembly (1), an engagement slot (22) formed by an inward recess at the end of the female connector (21) close to the temple assembly (3), a bracket (23) engaged and fixed within the engagement slot (22), an insertion slot (24) formed by an inward recess at the end of the bracket (23) close to the frame assembly (1), and an elastic metal wire (25) engaged between the female connector (21) and the bracket (23), both ends of the elastic metal wire (25) extending into the insertion slot (24); and each temple assembly (3) comprises a temple (31) and a male connector (32) fixed to the side of the temple (31) close to the female connector assembly (2), a limiting slot (321) being provided on the peripheral side of the male connector (32), and the male connector (32) being inserted into the insertion slot (24), allowing both ends of the elastic metal wire (25) to be elastically engaged within the limiting slot (321). Rapid replacement of the temple assemblies (3) or the frame assembly (1) can be realized.
SHANGHAI DIFFERENT ADVANCED MATERIAL COMPANY LIMITED (Chine)
Inventeur(s)
Gan, Zhongzong
Cai, Rui
Wang, Yaqi
Xiao, Xiaojun
Zhang, Rui
Wei, Lifei
Wang, Jiahuan
Lu, Yuming
Hao, Dan
Gu, Huiqin
Chen, Huihua
Lei, Ziyu
Yang, Cheng
Zhou, Yonghua
Wu, Lei
Abrégé
A method for preparing a polyethylene furanoate fiber, comprising: drying polyethylene furanoate chips and then performing melt-blending spinning, wherein after the drying, the moisture content of the polyethylene furanoate chips is less than or equal to 200 ppm, the crystallinity is 30% to 50%, and the softening temperature is 120-140°C; the melt-blending spinning comprises a screw extruder melt extrusion process, a spinning process, an annular cross-flow cooling process, a two-stage drawing process, and a tension heat setting process; process parameters of the melt-blending spinning comprise: a screw rotation speed of 28-35 r/min, a spinning beam temperature of 265-280°C, an annular cross-flow air supply-return pressure difference of 600-800 Pa, a first-stage drawing temperature of 70-80°C, a second-stage drawing temperature of 100-120°C, a total drawing ratio of 2.94-3.52, and a tension heat setting temperature of 140-160°C. The polyethylene furanoate fiber has excellent mechanical properties.
D01F 6/62 - Filaments, ou similaires, faits par l’homme, à un seul composant, formés de polymères synthétiquesLeur fabrication à partir de produits d'homopolycondensation à partir de polyesters
D01D 5/08 - Méthodes de filage à partir de masses en fusion
D01D 5/14 - Méthodes de filage par étirage par circulation de fluides provoquant l'étirage
Embodiments of the present invention relate to the technical field of semiconductor devices. Disclosed are a MEMS microphone and a manufacturing method therefor. The MEMS microphone comprises: a substrate, which defines a cavity; anchoring members provided on the substrate; and a diaphragm provided with beam structures, wherein the beam structures are fixed on the anchoring members, such that the diaphragm covers the cavity and is spaced apart from the substrate, and inner edges of the side of the substrate close to the diaphragm is provided with chamfers. In the present invention, the inner edges of the side of the substrate close to the diaphragm are provided with chamfers, and when the diaphragm bends towards the substrate side due to vibration, the provision of the chamfers can prevent the diaphragm from colliding with the substrate, or increase the contact area between the diaphragm and the substrate when the diaphragm collides with the substrate, thereby avoiding stress concentration, reducing the risk of damage to the diaphragm. In this way, the probability of failure of the MEMS microphone due to damage to the diaphragm can be reduced, and the robustness of the MEMS microphone can be enhanced.
Disclosed in the present invention are a microphone array and a mobile terminal. The microphone array comprises: a housing, in which a plurality of microphones are provided, the plurality of microphones forming a first microphone part and a second microphone part; a first end surface, which is provided with at least two first sound pickup holes, the first sound pickup holes being in communication with the microphones in the first microphone part in a manner of corresponding to each other on a one-to-one basis; and a second end surface, which is provided with at least one second sound pickup hole, the second sound pickup holes being in communication with the microphones in the second microphone part in a manner of corresponding to each other on a one-to-one basis. The first end surface intersects the second end surface, a preset included angle is formed between the extension direction of the first end surface and the extension direction of the second end surface, and the spacing between at least two adjacent microphones is less than half the wavelength of a response frequency used for beamforming. Compared with the prior art, the present invention achieves a good spatial capture performance with a minimal actual number of microphones, and is generally applicable to various modern and conventional beamforming algorithms.
Provided in the embodiments of the present invention are a signal playback method and apparatus, and a storage medium and a computer device. The method comprises: detecting an acquired camera image, so as to generate a detection result; generating a playback signal on the basis of adjustment parameters and an acquired audio input signal, wherein the adjustment parameters comprise the detection result; and performing playback on the basis of the playback signal. Thus, a computer device can automatically adjust an audio input signal to be played back, so as to generate a playback signal, thereby improving the sound playback effect and also increasing the user satisfaction.
Embodiments of the present invention relate to the technical field of semiconductors, and disclose a Hall element, a Hall sensor, and an electronic device. The Hall element comprises a substrate, a Hall sensing layer, electrodes, a barrier layer, and a conductor pad. The Hall sensing layer is disposed on the substrate. There are a plurality of electrodes, and the plurality of electrodes are connected to the Hall sensing layer. The barrier layer is disposed on the side of the Hall sensing layer away from the substrate, and the barrier layer covers the Hall sensing layer. The conductor pad is disposed on the side of the barrier layer away from the Hall sensing layer, and the conductor pad is used to be grounded or connected to a preset voltage. By applying a potential to the barrier layer covering the Hall sensing layer by means of the conductive pad, not only can a depletion layer having a sufficient width be generated to limit the current flow direction, thereby generating an effective isolation effect, but also the thickness of the Hall sensing layer can be reduced to increase an induced Hall voltage value, thereby enhancing the sensitivity of Hall element sensing.
Provided in the present application are an accessory recognition method and apparatus, and a storage medium. The method comprises: when it is detected that a target accessory is located at a preset target position of an electronic apparatus, generating target magnetic-field intensity characterization data on the basis of a magnetic-field intensity measurement element and in response to the magnetic-field intensity of a magnetic assembly in the target accessory; matching the target magnetic-field intensity characterization data with a preset accessory index table; and determining accessory identification information, which corresponds to a magnetic-field intensity characterization data range obtained after matching, to be identification information of the target accessory. By means of implementing the solution of the present application, the magnetic-field intensity of a magnetic assembly in a target accessory is measured to obtain magnetic-field intensity characterization data, and identification information of the target accessory can then be obtained by means of looking up a table on the basis of the magnetic-field intensity characterization data. Therefore, identification information of accessories can be hidden, which is conducive to guaranteeing the security of accessory information; moreover, it is not necessary to provide numerous measurement devices, thereby reducing the space occupied by hardware and facilitating the reduction in the hardware resource cost.
Embodiments of the present invention relate to the technical field of microphones. Disclosed are a diaphragm and an MEMS microphone. The diaphragm comprises a vibration portion and a connecting portion arranged around the vibration portion. The vibration portion comprises a first flat portion located at a central position, a corrugated portion arranged around the first flat portion, and a second flat portion arranged around the corrugated portion. The corrugated portion extends in a direction from the center to the edge of the first flat portion. The bending stiffness of the corrugated portion is greater than the bending stiffness of the first flat portion and the second flat portion, and the corrugated portion is made of a material at least comprising silicon nitride. The diaphragm and the MEMS microphone provided in the embodiments of the present invention can increase the structural strength of the diaphragm.
A hand simulator and an audio test system are disclosed. The hand simulator comprises: a main bearing portion used for bearing a device under test, wherein the main bearing portion comprises a palm and a thumb, an index finger, a middle finger, a ring finger, and a little finger that are movably arranged at the end of the palm; a limiting portion comprising a plurality of limiting posts, wherein at least some of the limiting posts are arranged on the palm, the plurality of limiting posts define a receiving space, and the device under test is limited within the receiving space. In contrast to the prior art, the present invention provides a hand simulator that simulates the shape of a human hand, wherein said hand simulator is provided with a limiting portion used for limiting a device under test, allowing the hand simulator to be used for measuring the frequency response of a loudspeaker or microphone of the device under test, or both, while simulating acoustic characteristics resembling those of a user's hand. A device under test can be accurately and repeatedly positioned, improving the practical usefulness of audio testing of any portable device. Further, the invention can be used as a basis for improving existing measurement standards and creating new test methods.
Disclosed are a speaker and an electronic device. The speaker comprises a speaker housing, which has an accommodating chamber; a speaker body, which is housed within the accommodating chamber, where the accommodating chamber is separated by the speaker body into an anterior sound cavity and a posterior sound cavity, the anterior sound cavity being in communication with the exterior of the speaker housing; and a resonator, which is housed within the posterior sound cavity; the posterior sound cavity comprises at least one cavity portion and at least one port portion, a first side of the resonator is provided with a port portion, and the other side is provided with a cavity portion or an additional port portion. Compared with the prior art, the present invention can reduce the space occupied by the speaker, and also reduces flow losses and flow noise; further, by increasing the acoustic mass of the port portion to that of the resonator, any acoustic resonance arising from the interaction between the resonator and the port portion is above the operating frequency range of the speaker.
Embodiments of the present invention provide an electronic system and a control method therefor. The electronic system comprises an electronic device. The electronic device at least comprises: a charging circuit, wherein the charging circuit has a first input end, a second input end, and a first output end, and the charging circuit comprises a first transistor, a second transistor, a third transistor, and a fourth transistor; a switch circuit, wherein an input end of the switch circuit is connected to the first output end, an output end of the switch circuit is connected to a power supply of the electronic device, and the switch circuit is used for connecting or disconnecting a connection path between the first output end and the power supply; and a communication device, wherein in a communication mode, the communication device is connected to the first input end and the second input end so as to communicate with the electronic device by means of the first input end or the second input end. The embodiments of the present invention at least can prolong the service life of an electronic device.
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
26.
SEALING RING MOUNTING STRUCTURE AND ELECTRONIC DEVICE
The present application provides a sealing ring mounting structure and an electronic device. The sealing ring mounting structure comprises a mounting body and sealing rings. The mounting body comprises a main body and limiting protruding rings protruding from the main body. The limiting protruding rings and the main body together define limiting recesses. First through holes in communication with the limiting recesses are formed in the main body. The sealing rings are accommodated in the limiting recesses. Each sealing ring comprises a ring body and an adhesive layer fixed to the bottom surface of the ring body, the ring body is adhesively fixed to the recess bottom surface of the corresponding limiting recess by means of the adhesive layer, and the side surface of the ring body abuts against the recess wall of the corresponding limiting recess. Each sealing ring further comprises a second through hole running through the ring body and the adhesive layer. The second through holes and the first through holes are coaxially arranged. The sealing ring mounting structure of the present application is not only easy to mount, but also achieves accurate mounting, thereby improving the mounting efficiency and product yield.
Disclosed is a MEMS microphone, comprising: a substrate, a cavity being penetratingly provided in the substrate; a diaphragm, supported on the substrate and covering the cavity; a back plate, supported on the diaphragm, a first preset gap being formed between the back plate and the diaphragm; and a first support member, formed in the cavity, the first support member comprising a support portion spaced apart from the substrate and a connecting portion, the connecting portion extending from the support portion towards the substrate to be fixed to the substrate, the first support member further comprising a boss portion extending from the end of the support portion close to the diaphragm towards the diaphragm and supporting the diaphragm, and a second preset gap being formed between the diaphragm and the connecting portion in the vibration direction of the diaphragm. Compared with the existing technology, in the present invention, by means of providing the first support member to support the diaphragm, structural deformation of the diaphragm can be effectively prevented, and the firmness of the diaphragm is improved. When the impact force of a sound wave is too large, the diaphragm will not move significantly because the diaphragm is supported by the first support member, thereby preventing the diaphragm from being damaged.
Provided in the embodiments of the present invention are an ultra-low-power noise buffer and an electronic device. The ultra-low-power noise buffer comprises: a source current driving circuit and a sink current driving circuit. The sink current driving circuit is electrically connected to the source current driving circuit, and the sink current driving circuit comprises a first transistor, a second transistor and a first current source, wherein the first transistor is electrically connected to the first current source, the first transistor is electrically connected to the second transistor, and the second transistor is electrically connected to the first current source. The source current driving circuit comprises a second current source, a third transistor, an operational amplifier and a voltage source, wherein the second current source is electrically connected to the first transistor and the third transistor, the third transistor is electrically connected to the first transistor and the operational amplifier, and the operational amplifier is electrically connected to the voltage source, the first transistor, the second transistor and the first current source. Thus, the chip area is reduced, the power consumption, noise induction, output resistance and total harmonic distortion (THD) are reduced, and the power supply rejection ratio (PSRR) is improved.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
A MEMS microphone, comprising: a substrate having a back cavity; a back plate spaced apart from the substrate; a diaphragm disposed on the substrate and located between the substrate and the back plate, wherein the diaphragm comprises a main body portion, an edge portion, isolation islands and beam structures, the main body portion being spaced apart from the substrate and the back plate, the edge portion being fixedly connected to the substrate, a plurality of the isolation islands being provided and being spaced apart from the main body portion, a gap being formed between each of the isolation islands and the main body portion, a plurality of the beam structures being provided and being arranged at intervals around the main body portion, one beam structure being provided between any two adjacent isolation islands, and the beam structure being configured to connect the main body portion and the edge portion; and a connector configured to connect each of the isolation islands to at least one of the substrate and the back plate. In the present invention, the isolation islands are fixedly connected to the back plate or the substrate, so that the degree of freedom in designing the isolation islands can be optimized, and the robustness of the diaphragm can also be improved.
Provided in the present utility model is a bone conduction packaging structure, comprising: a base board, a housing covering the base board to form an accommodating space, and a bone conduction MEMS chip and an ASIC chip which are disposed in the accommodating space. The bone conduction MEMS chip comprises a substrate having a cavity, a vibration diaphragm supported on the substrate, and a back plate spaced apart from the side of the vibration diaphragm away from the substrate; a first cavity is formed between the vibration diaphragm and the back plate; a second cavity is formed between the vibration diaphragm and the substrate and the base board; a third cavity is formed between the back plate, and the housing, the substrate and the base board; and the first cavity is configured as a low-pressure region the pressure of which is lower than atmospheric pressure. The bone conduction packaging structure of the present utility model configures the region between the vibration diaphragm and the back plate as the low-pressure region, so as to reduce damping between the vibration diaphragm and the back plate, thereby improving the performance of the bone conduction packaging structure.
A feedback apparatus and an operation input device. The feedback apparatus comprises a mounting base, a mechanism to be operated, a position detection mechanism and a feedback mechanism; the mechanism to be operated comprises a member to be operated and a first magnet, said member being rotatably connected to the mounting base, and the first magnet being connected to said member; the position detection mechanism is arranged on the mounting base; the feedback mechanism comprises a driving assembly and a second magnet; the driving assembly is arranged on the mounting base; the second magnet is connected to the driving assembly, a preset distance being provided between the second magnet and the first magnet; the second magnet is arranged to fit the first magnet and is used for controlling the rotation speed of said member.
The present application provides an operating mechanism and an operating input device. The operating mechanism comprises: a housing, the housing having an accommodating space; a movable operating member, the movable operating member being accommodated in the accommodating space and at least partially extending out of the housing; a support member, used for supporting the movable operating member, wherein the movable operating member moves around the support member; magnets, the magnets being connected to the movable operating member; and magnetic members, wherein the magnetic members have magnetic attraction to the magnets, and the movable operating member can be reset and/or retained in an initial position by means of the magnetic attraction between the magnetic members and the magnets. According to the operating mechanism and the operating input device provided in the embodiments of the present application, the operating mechanism has vibration resistance and drop impact resistance, the reliability of the operating mechanism is not easily affected by assembly, and the operating mechanism has high durability against user inputs.
The present utility model provides a MEMS microphone, comprising a substrate having a cavity, a backplate disposed above the substrate, a diaphragm disposed between the backplate and the substrate, and a limiting structure disposed in the cavity for limiting a maximum displacement of the diaphragm away from the backplate, wherein the maximum displacement is not less than a normal operating displacement of the diaphragm away from the backplate. The MEMS microphone of the present utility model has high reliability.
The present utility model provides a bone conduction microphone, comprising a base provided with a cavity having openings at both ends, a back plate provided above the base, and a vibration structure provided between the back plate and the base. The vibration structure comprises a diaphragm provided between the back plate and the base and spaced apart from the back plate and the base, and a mass block suspended below the diaphragm and inserted into the cavity from the opening at one end of the cavity. The bone conduction microphone further comprises a limiter configured to limit the maximum displacement of the vibration structure. The bone conduction microphone of the present utility model has high reliability.
The present invention provides a bone conduction MEMS chip and a manufacturing method therefor, and a bone conduction packaging structure having the bone conduction MEMS chip. The bone conduction MEMS chip comprises: a substrate provided with a cavity, a diaphragm supported on the substrate, and a back plate spaced apart from the side of the diaphragm distant from the substrate, wherein a mass block is arranged on the side of the diaphragm distant from the back plate. The mass block in the bone conduction MEMS chip of the present invention is directly formed on the diaphragm, and the bone conduction packaging structure avoids additionally providing a vibration sheet and a mass block, thereby reducing costs, achieving simple packaging, and allowing the structure to be smaller.
Disclosed in the present application are a joystick and an input device. The joystick comprises a housing, a movable assembly, a position measurement assembly and a magnetic reset assembly, wherein the housing has an accommodating cavity; the movable assembly is arranged in the accommodating cavity and partially penetrates the housing; the position measurement assembly is arranged in the accommodating cavity and is used for measuring displacement information of the movable assembly and outputting a corresponding first control signal; and the magnetic reset assembly comprises a first magnetic attraction member and a second magnetic attraction member, one of the first magnetic attraction member and the second magnetic attraction member is arranged on the housing, the other of the first magnetic attraction member and the second magnetic attraction member is arranged on the movable assembly, and the first magnetic attraction member and the second magnetic attraction member can attract each other, so as to reset the movable assembly by means of the mutual attraction action of the first magnetic attraction member and the second magnetic attraction member. Compared with the method of using a physical spring to reset the movable assembly, the present application can eliminate the problem of damage to the physical spring caused by vibration and falling impact of the movable assembly, thereby prolonging the service life of the joystick.
Disclosed in the present invention is an optical system, sequentially comprising, from the rear side to the front side, an aperture located on the rear side of the optical system, a first lens, a second lens, a circular polarizer, and an image plane. The circular polarizer is attached to the rear side surface of the image plane; a composite film is arranged provided on the rear side surface of the first lens; the composite film comprises a reflective polarizing film and a quarter-wave plate; and the reflective polarizing film is provided on the rear side of the quarter-wave plate. The maximum semi-diameter of the first lens and the second lens is Max SD, the focal length of the optical system is f, the focal length of the first lens is f1, the focal length of the second lens is f2, the central radius of curvature of the front side surface of the second lens is R4, and the following relational expressions are satisfied: Max SD ≤ 25.60 mm; -0.61 ≤ R4/f2 ≤ -0.17; and 19.00 ≤ |f1/f| + |f2/f| ≤23.20.
An optical system (100, 200, 300, 400) comprising in sequence from a rear side to a front side: an aperture (11) located on the rear side of the optical system (100, 200, 300, 400); a first lens (14); a second lens (17); a circular polarizer (19); and an image surface (20), wherein the circular polarizer (19) is attached to a rear side of the image surface (20); a composite film is provided on a rear-side surface of the first lens (14); the composite film comprises a reflective polarizing film (12) and a quarter-wave plate (13), with the reflective polarizing film (12) being arranged on a rear side of the quarter-wave plate (13); the first lens (14) and the second lens (17) have a maximum semi-diameter of Max SD, the first lens (14) has an on-axis thickness of T1, the second lens (17) has an on-axis thickness of T2, an on-axis distance between a front-side surface of the first lens (14) and a rear-side surface of the second lens (17) is T12, the optical system (100, 200, 300, 400) has a focal length of f, and the second lens (17) has a front side-surface with a central radius of curvature of R4; and the following relational expressions are satisfied: Max SD≤28.50mm; 0.10≤T12/(T1+T2)≤0.70; and -0.32≤f/R4≤-0.20.
The microphone chip provided in the present utility model comprises a substrate having a back cavity and a capacitor system fixed on the substrate and disposed above the back cavity, wherein the capacitor system comprises a diaphragm and a back plate which are disposed opposite each other and spaced apart from each other, the diaphragm comprises a vibrating part and several elastic connecting parts disposed at the edge of the vibrating part, and the diaphragm is fixed to the substrate by means of the elastic connecting parts; and the vibrating part comprises a middle vibrating part located in the middle position and an outer vibrating part connected to the middle vibrating part and the elastic connecting parts, an anchoring part extending towards the diaphragm is disposed on the back plate, and the anchoring part is fixedly connected to the middle vibrating part. The MEMS microphone chip provided in the present utility model is highly reliability.
Provided in the present utility model is an MEMS package structure, comprising a housing, a circuit board that covers the housing to form an accommodating space, and an MEMS chip and an ASIC chip that are disposed in the accommodating space. The MEMS chip comprises a vibrating diaphragm and a backplate spaced apart from the vibrating diaphragm. The MEMS chip is disposed on the circuit board. The circuit board comprises an upper surface connected to the MEMS chip and a lower surface. The circuit board is further provided with a first sound hole extending from the lower surface towards the upper surface but not passing through the upper surface, a second sound hole extending from the upper surface towards the lower surface but not passing through the lower surface, and a communication passage arranged between the upper surface and the lower surface and interconnecting the first sound hole and the second sound hole. The MEMS chip covers the second sound hole, projections of the first sound hole and the second sound hole in the vibrating direction of the vibrating diaphragm not overlapping each other. A plurality of protruding structures are provided in the communication passage, the protruding structures allowing the pressure of an air flow entering from the first sound hole to be 2-3.5 times the pressure of an air flow flowing out of the second sound hole. The MEMS package structure provided in the present utility model has a strong anti-blowing capability.
The present application provides a resonator and a manufacturing method therefor. The resonator comprises: a substrate; a bottom electrode located on the substrate; a piezoelectric layer stacked on the bottom electrode, a recessed frame being arranged on the surface of the piezoelectric layer away from the substrate; a barrier layer stacked on the piezoelectric layer, wherein the barrier layer and the piezoelectric layer are partially spaced to form air gap areas, and the air gap areas are located at the edges of the recessed frame; at least one shunt metal layer stacked on the barrier layer, wherein in the thickness direction of the resonator, the projection contour of the recessed frame and the projection contours of the air gap areas are all located in the projection contour of the shunt metal layer; and a top electrode stacked on the shunt metal layer, wherein a protruding frame is arranged on the surface of the top electrode away from the piezoelectric layer, and the projection contour of the protruding frame is located at the edge of a resonance area. The resonator and the manufacturing method therefor provided by the embodiments of the present application can provide greater flexibility in frequency adjustment, and meet the requirements of different bandwidths, and can further improve the quality factor Q of the resonator.
The present application provides a microphone, comprising a housing, a circuit board covering and fixed to the housing, and enclosing a cavity together with the housing, a first chip assembly fixed to the side of the circuit board close to the housing, and a second chip assembly embedded and fixed in the circuit board. The circuit board is formed from multiple stacked layer structures, comprising a chip mounting layer, a first wiring layer, shielding layers, a second wiring layer, and an SMT layer, which are sequentially arranged spaced apart from the side close to the first chip assembly toward the side away from the first chip assembly. The shielding layers comprise multiple layers which are sequentially arranged, the multiple shielding layers each being connected to a grounding point of the circuit board, and each shielding layer being provided with a clearance hole penetrating through the shielding layer. The microphone of the present application can reduce interference of heat emitted by an ASIC chip during operation with the performance of another chip.
Embodiments of the present disclosure relate to the field of electronic product accessories, and provides an accessory identification method, an accessory identification apparatus, an electronic device, and a computer-readable storage medium. The accessory identification method comprises: providing a main unit equipped with an accessory, a detection element being provided in the area of the main unit close to the accessory; acquiring state information of the detection element, a trigger element being in the area of each accessory close to the main unit, the number of trigger elements on one accessory being less than or equal to the number of detection elements on the main unit on the corresponding area, the state information comprising a triggered state and a non-triggered state, if the detection element detects a matched trigger element, the state information being a triggered state, and if the detection element does not detect a matched trigger element, the state information being a non-triggered state; determining the arrangement situation of the trigger element on the accessory on the basis of the state information of each detection element; and determining the type of the accessory equipped on the main unit on the basis of the arrangement situation of the trigger element on the accessory. At least the type of the accessory can be identified, the cost is reduced, and the occupied volume is reduced.
G01V 3/08 - Prospection ou détection électrique ou magnétiqueMesure des caractéristiques du champ magnétique de la terre, p. ex. de la déclinaison ou de la déviation fonctionnant au moyen de champs magnétiques ou électriques produits ou modifiés par les objets ou les structures géologiques, ou par les dispositifs de détection
G01B 7/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques
44.
MICROPHONE SIGNAL BEAMFORMING PROCESSING METHOD, ELECTRONIC DEVICE AND STORAGE MEDIUM
The embodiments of the present invention relate to the technical field of microphone signal processing. Disclosed is a microphone signal beamforming processing method. In the present invention, the method comprises: performing time-frequency transformation on first output signals corresponding to a plurality of microphones, the number of which is no less than three, to obtain frequency-domain signals, and performing a plurality of different sets of beamforming preprocessing on the frequency-domain signals of the plurality of microphones to obtain a plurality of different beam signals; performing a plurality of different sets of cross-mode analysis on the plurality of beam signals to obtain a plurality of positive weighting coefficients; multiplying the plurality of positive weighting coefficients to obtain a combined coefficient, and multiplying the combined coefficient by a frequency-domain signal of any microphone to obtain a weighted spectral component; and performing inverse time-frequency transformation on the weighted spectral component to obtain second output signals corresponding to the plurality of microphones. Compared with conventional methods, combined cross-mode analysis used in the present invention achieves better channel separation, thereby obtaining narrower beams having great sidelobe suppression and a higher signal-to-noise ratio.
A microphone, comprising a housing (1), a circuit board (2) covering and fixed to the housing (1) and defining a first cavity (104) and a second cavity (105) together with the housing (1), a first chip assembly (3) fixed on the side of the circuit board (2) close to the housing (1) and located in the first cavity (104), and a second chip assembly (4) fixed on the side of the circuit board (2) close to the housing (1) and located in the second cavity (105), wherein the first chip assembly (3) comprises a first ASIC chip (301) and a first MEMS chip (302), and the second chip assembly (4) comprises a second ASIC chip (401) and a second MEMS chip (402). The microphone further comprises a first metal layer (5) fixed on the side of the circuit board (2) close to the housing (1) and surrounding both the first chip assembly (3) and the second chip assembly (4). The microphone can prevent the problem that heat generated by operation of the ASIC chips affects performance of other components by means of heat conduction via a substrate of the circuit board (2) or heat dissipation via thermal motion of air.
A loudspeaker unit and a terminal device are disclosed. The loudspeaker unit comprises: a loudspeaker main body, which is internally provided with a receiving cavity; a transducer, which is received in the receiving cavity and divides same along a first direction into a front sound cavity and a rear sound cavity, wherein a loudspeaker hole is formed in the loudspeaker main body, and the loudspeaker hole is communicated with the front sound cavity; a throat, which is internally provided with a throat cavity, wherein a first opening and a second opening are formed in the throat, the first opening and the second opening are sequentially distributed along a second direction, the first opening is arranged corresponding to the loudspeaker hole, the throat cavity is communicated with the front sound cavity via the first opening and the loudspeaker hole, and the throat cavity is communicated with the environment outside of the throat via the second opening. Compared with the prior art, the present invention allows the space occupied by the loudspeaker unit to be compressed to a certain extent. The loudspeaker unit is quite suitable for terminal devices that have a certain amount of internal space but that are limited in height.
The embodiments of the present application relate to the technical field of vibration electric motors. Disclosed are a linear vibration electric motor (100) and an electronic device (200). In the linear vibration electric motor (100) of the present application, in a receiving space (11) defined by a housing (10), a supporting frame (21) of a vibrator (20) is provided with a driven member (22), and a driving member (30) is provided opposite the driven member (22) and configured to drive the driven member (22) to move the supporting frame (21) along a straight line. A plurality of accommodating grooves (211) are formed on the supporting frame (21), at least one supporting component (40) is provided in each accommodating groove (211), part of the supporting component (40) is located outside the accommodating groove (211), the supporting component (40) is pressed against the housing (10) by the supporting frame (21), and the supporting component (40) is configured to support the supporting frame (21). When the driving member (30) drives the supporting frame (21) to move relative to the housing (10), the supporting component (40) rolls relative to the housing (10) and the supporting frame (21), so that the supporting frame (21) can stably move, and the accommodating grooves (211) are located inside the receiving space (11) and will not be deformed due to impact. The electronic device (200) of the present application comprises the linear vibration electric motor (100) and a device body (210) provided with the linear vibration electric motor (100).
H02K 33/02 - Moteurs avec un aimant, un induit ou un système de bobines à mouvement alternatif, oscillant ou vibrant avec des induits entraînés dans un sens par application d'énergie à un système à une seule bobine et ramenés par une force d'origine mécanique, p. ex. par des ressorts
H02K 1/34 - Parties du circuit magnétique à mouvement alternatif, oscillant ou vibrant
H02K 7/08 - Association structurelle avec des paliers
Disclosed is a directional microphone module, comprising: a sound-transmitting mesh fabric, a housing covered with the sound-transmitting mesh fabric, a circuit board fixed to the housing, and a MEMS microphone fixed to the circuit board. The housing comprises a top wall and side walls; the circuit board and the top wall are spaced apart to form a first cavity; the circuit board and the sound-transmitting mesh fabric are spaced apart to form a second cavity; the side walls comprise two first side walls arranged opposite to each other and two second side walls arranged opposite to each other; the first cavity and the second cavity are communicated only at one of the two second side walls; the MEMS microphone is arranged in the first cavity and located at the other of the two second side walls; the MEMS microphone is provided with a first sound hole facing the top wall and a second sound hole facing the circuit board; the first sound hole is communicated with the first cavity; the circuit board is provided with a through hole; and the second sound hole is communicated with the second cavity by means of the through hole. The directional microphone module of the present disclosure has stable performance and simple structure, and can improve production efficiency and reduce labor costs.
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
H04R 1/38 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en utilisant un seul transducteur avec des moyens réfléchissant, diffractant, dirigeant ou guidant des sons dans lesquelles les ondes sonores attaquent les deux côtés d'une membrane et comprenant des moyens de décalage de phase acoustique, p. ex. microphone à gradient de pression
The present utility model provides a smart wearable device, comprising a glasses frame and glasses temples extending backwards from two sides of the glasses frame. Each glasses temple comprises a frame having an accommodating space, and a loudspeaker unit and a microphone unit which are accommodated in the accommodating space; the loudspeaker unit comprises a first sound production surface and a second sound production surface facing away from the first sound production surface; the frame comprises an upper wall surface, a lower wall surface and an outer wall surface connecting the upper wall surface and the lower wall surface; the lower wall surface is provided with a primary sound outlet hole, and the outer wall surface is provided with a secondary sound outlet hole; the primary sound outlet hole is communicated with the first sound production surface of the loudspeaker unit, and the secondary sound outlet hole is communicated with the second sound production surface of the loudspeaker unit; a microphone sound hole is formed at a position on the outer wall surface of the frame close to the secondary sound outlet hole; the microphone sound hole is communicated with the microphone unit; and an ultrasonic signal emitted from the secondary sound outlet hole reaches the microphone unit by means of the microphone sound hole. The smart wearable device of the present utility model is suitable for gesture recognition or mode adjustment, and has diverse functions.
Provided in the present invention are a surface acoustic wave filter module packaging structure and a packaging method therefor. The surface acoustic wave filter module packaging structure comprises a substrate, at least one surface acoustic wave filter chip disposed on the substrate, at least one non-filter chip disposed on the substrate, a dry film layer which covers the cover surface acoustic wave filter chip and the non-filter chip, and a plastic encapsulation layer which covers the dry film layer, wherein the surface of the surface acoustic wave filter chip is fixed to the substrate by means of a first bump structure, and a first cavity is formed between the surface acoustic wave filter chip and the substrate; and the surface of the non-filter chip is fixed to the substrate by means of a second bump structure, and a second cavity is formed between the non-filter chip and the substrate. The surface acoustic wave filter module packaging structure and method of the present invention ensure that cavities can be formed between the bottoms of all the chips and the substrate, and avoid using an injection molding process for a filter based on wafer-level packaging, thereby reducing costs and the damage to the chips in the reliability stage.
The present application provides a waterproof microphone apparatus. The waterproof microphone apparatus is installed on a vehicle body, and the vehicle body comprises a framework provided with a circular opening. The waterproof microphone apparatus comprises a shell, a circuit board provided in the shell, a microphone installed on the circuit board, a cover plate connected to the shell and the framework, a first waterproof film sealed on the cover plate, and a mask fixed to the cover plate; the inner wall of the framework where the opening is formed gradually inwardly inclines from the outer surface to the inner surface of the framework; the mask comprises a first wall facing the outside of the vehicle body, a second wall opposite to the first wall, and an outer sidewall connected to the first wall and the second wall; the outer sidewall gradually inwardly inclines from the first wall to the second wall, so that an inclined annular sound inlet channel is formed between the inner wall of the opening of the framework and the outer sidewall of the mask. The waterproof microphone apparatus of the present application can achieve a good waterproof effect, and have a more stable structure and an attractive appearance.
A bone conduction microphone, comprising: a circuit board, which has an acoustic channel; a housing, which is connected to the circuit board in a covering manner to form an accommodating space; a metal cover, which is arranged in the accommodating space and is connected to the circuit board in a covering manner to form a first cavity, wherein the metal cover comprises a top wall spaced apart from the circuit board and a side wall located between the top wall and the circuit board; a vibration assembly, which is arranged in the accommodating space and is connected to the top wall in a covering manner to form a second cavity, wherein the vibration assembly comprises a vibration member spaced apart from the top wall and a spacer located between the vibration member and the top wall, and the housing, the vibration assembly, the metal cover and the circuit board enclose to form a first conduction cavity; and an MEMS chip, which is arranged in the first cavity and is fixed to the circuit board, wherein the MEMS chip has a back cavity, the acoustic channel communicates the first conduction cavity with the back cavity, and vibration of the vibration member is conducted to one side of the MEMS chip through the first conduction cavity, the acoustic channel and the back cavity. The bone conduction microphone can reduce the impact of electromagnetic interference and improve the signal-to-noise ratio.
Provided in the present invention are a surface acoustic wave filter module packaging structure, and a packaging method for the structure. The surface acoustic wave filter module packaging structure comprises a substrate, a surface acoustic wave filter chip and a non-filter chip which are disposed on the substrate, a dry film layer covering the surface acoustic wave filter chip and the non-filter chip, and a plastic packaging layer covering the dry film layer, wherein the surface acoustic wave filter chip is fixed to the substrate by means of first bump structures; a cavity is formed between the surface acoustic wave filter chip and the substrate; the non-filter chip is fixed to the substrate by means of second bump structures; the dry film layer has a fracture area surrounding the non-filter chip; and the plastic packaging layer is filled between the substrate and the non-filter chip via the fracture area. The surface acoustic wave filter module packaging structure and the method of the present invention can ensure that a cavity can be formed between the bottom of the surface acoustic wave filter chip and the substrate, and bumps do not break easily; moreover, an injection molding process of a filter based on wafer-level packaging is avoided, thereby reducing the cost and damage to the chip in a reliability stage.
Disclosed in the present invention are an MEMS element and a preparation method therefor. The MEMS element comprises: a substrate; a diaphragm, which is connected to the substrate, wherein the diaphragm comprises an upper membrane and a lower membrane, which are arranged opposite each other; a counter electrode; and a plurality of supporting members, which are arranged between the upper membrane and the lower membrane and are spaced apart from the counter electrode, wherein two opposite ends of each supporting member are connected to the upper membrane and the lower membrane respectively. The diaphragm comprises a first area and a second area, the second area being located in the outer circumferential direction of the first area, wherein in the first area, a first electrode covers the surface of the side of the upper membrane away from the lower membrane, and a second electrode covers the surface of the side of the lower membrane away from the upper membrane; and in the second area, reinforcing layers respectively cover the surface of the side of the upper membrane away from the lower diaphragm and the surface of the side of the lower membrane away from the upper membrane. Compared with the prior art, in the present invention, the reinforcing layers are arranged in the second area of the diaphragm, such that the mechanical strength and robustness of the diaphragm can be enhanced by means of the reinforcing layers, thereby improving the preparation process yield.
The embodiments of the present invention provide a microphone amplifier circuit, a microphone circuit, and an electronic device. The microphone amplifier circuit comprises: a voltage regulator having an output end, a first constant-current source having an input end connected to the output end of the voltage regulator, a first transistor, a second transistor, a first driving unit, and a second driving unit. A gate electrode of the first transistor serves as an input end of the microphone amplifier circuit, and a source electrode of the first transistor serves as an output end of the microphone amplifier circuit. A source electrode of the second transistor is connected to an output end of the first constant-current source, a gate electrode of the second transistor is connected to the source electrode of the first transistor, and a drain electrode of the second transistor is grounded. The first driving unit is used for increasing the power supply rejection ratio of the microphone amplifier circuit, and the second driving unit is used for improving the sound pressure overload point of the microphone amplifier circuit. The embodiments of the present invention at least facilitate an improvement to the electrical performance of microphone circuits.
The embodiments of the present invention provide a microphone amplifier circuit, a microphone circuit, and an electronic device. The microphone amplifier circuit comprises a first transistor, a first constant-current source, and a source follower. A gate electrode of the first transistor serves as an input end of the microphone amplifier circuit, a source electrode of the first transistor serves as an output end of the microphone amplifier circuit, and a drain electrode of the first transistor is grounded. An input end of the first constant-current source is connected to a power supply, and an output end of the first constant-current source is connected to the source electrode of the first transistor. The source follower at least comprises a second transistor. A drain electrode of the second transistor is connected to the power supply, a gate electrode of the second transistor is connected to the source electrode of the first transistor, and a source electrode of the second transistor is connected to the drain electrode of the first transistor. The present invention at least facilitates an improvement to the THD performance of microphone amplifier circuits.
A micro-electro-mechanical system comprises counter electrodes, a first diaphragm, and a second diaphragm. The first diaphragm is provided with a plurality of first corrugations, each first corrugation comprises a first wave crest and a first wave trough, and the plurality of first wave crests and the plurality of first wave troughs are alternately arranged in a third direction. The second diaphragm is provided with a plurality of second corrugations, each second corrugation comprises a second wave crest and a second wave trough, and the plurality of second wave crests and the plurality of second wave troughs are alternately arranged in the third direction. The plurality of first wave crests and the plurality of second wave troughs are respectively aligned to form cavities, and the plurality of counter electrodes are respectively provided in the cavities. The plurality of first wave troughs are respectively aligned with the plurality of second wave crests, and at least some of the plurality of first wave troughs and the corresponding second wave crests are configured to be in contact with each other. The micro-electro-mechanical system maintains high acoustic compliance and sensitivity of the sealed dual-diaphragm structure, and has better firmness.
A microphone module, comprising a shell, a PCB, and at least two MEMS microphones having sound inlet holes. The MEMS microphones, the PCB, and the shell are sequentially arranged from top to bottom; the MEMS microphones are electrically connected to the PCB; the PCB is provided with first sound pickup holes corresponding to the sound inlet holes of the MEMS microphones; the shell is provided with second sound pickup holes corresponding to the first sound pickup holes; and the sound inlet holes, the first sound pickup holes and the second sound pickup holes are sequentially communicated. The diameter size of the first sound pickup hole is defined to be D1 mm, and the distance between the center axes of two adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. A plurality of MEMS microphones, a PCB, and a shell are used, and sound waves are sensed by means of sound inlet holes in the MEMS microphones, first sound pickup holes in the PCB and second sound pickup holes in the shell. By means of the sound wave sensing structure, the microphone module has a good sound receiving effect, and the sound recognition effect is improved.
The present invention relates to the technical field of enclosures, and provides an enclosure and an electronic device. The enclosure is applied to a mobile electronic terminal, and comprises: an inner enclosure, the inner enclosure comprising an inner enclosure body and an accommodating recess formed by recessing a side of the inner enclosure body; and an outer enclosure, the outer enclosure being in an annular shape, and the outer enclosure extending around the peripheral side of the inner enclosure body and being fixed to the inner enclosure body. The outer enclosure is made of a titanium alloy material; the inner enclosure body is made of a metal material other than the titanium alloy material; the outer enclosure and the inner enclosure body are fixed and formed into an integrated structure by means of the hot isostatic pressing process. The compactness, uniformity and performance of the enclosure of the present invention can be improved by means of the hot isostatic pressing process.
The present invention provides a thin-film bulk acoustic resonator. The resonator comprises a substrate, an acoustic reflection structure arranged on one side of the substrate, a bottom electrode stacked on the side of the acoustic reflection structure distant from the substrate, a piezoelectric film stacked on the side of the bottom electrode distant from the acoustic reflection structure, a top electrode stacked on the side of the piezoelectric film distant from the bottom electrode, and a protruding frame arranged on the side of the top electrode distant from the piezoelectric film; a spatial region formed by overlapping of the acoustic reflection structure, the bottom electrode, the piezoelectric film and the top electrode in the thickness direction of the thin-film bulk acoustic resonator is a resonance region; the protruding frame is located in the resonance region; and a plurality of holes are formed in the side of the protruding frame distant from the top electrode. According to the present invention, the area ratio of the protruding frame in the resonance region can be reduced, the intensity of a parasitic resonance peak caused by the protruding frame is reduced, the Q value of the resonator is not reduced, and steps of the manufacturing process are not increased.
A microelectromechanical system device. The device comprises a cover sheet (501) provided with a recess (502), and a device piece (503) bonded to the cover sheet (501) and provided with a functional chamber directly facing the recess (502). The cover sheet comprises a substrate (511), a first metal layer (521) and a grounding structure (507), the substrate (511) having a first surface that faces the device piece (503), the recess (502) being formed on the first surface, the first metal layer (521) and the grounding structure (507) being arranged on the part of the first surface except the recess, and the grounding structure (507) being arranged along the periphery of a bonding area where the first metal layer is located. The device piece (503) comprises a substrate (513), a structural layer (523) and a second metal layer (533) which are stacked successively, the structural layer (523) comprising a first portion and a second portion surrounding the first portion, the first portion being located in the functional chamber (504) and forming a structure used for achieving a mechanical function, and the second metal layer (533) being located on the second portion. The cover sheet (501) and the device piece (503) each comprise at least one electrode, and are bonded together by means of the first metal layer (521) and the second metal layer (533), all the electrodes being electrically connected by means of the first metal layer (521) and the second metal layer (533) bonded to each other. Further provided is a manufacturing method for a microelectromechanical system device.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
62.
RADIO FREQUENCY MODULE PREPARATION METHOD AND RADIO FREQUENCY MODULE
A radio frequency module preparation method and a radio frequency module. The method comprises: providing an initial chip board, wherein the initial chip board comprises a substrate (120) and a plurality of radio frequency modules fixed on the substrate (120), and each radio frequency module comprises a plurality of components (110); covering, with a layer of dry film (140), the surface of the side of the initial chip board having the radio frequency modules, so as to form a cavity between the dry film (140), the corresponding component (110) and the substrate (120); forming a first metal layer (150) on a surface of the dry film (140), and forming a plastic packaging layer (160) on the first metal layer (150); forming a second metal layer (170) on a surface of the plastic packaging layer (160), and electrically connecting the second metal layer (170) to the first metal layer (150); and cutting the initial chip board along a boundary between adjacent radio frequency modules to obtain a single radio frequency module. The method can effectively reduce the risk of short circuit of the radio frequency module, such that the electromagnetic shielding effect of the radio frequency module is more obvious, and the production efficiency of the single radio frequency module after electromagnetic shielding processing is improved.
A bone conduction microphone, comprising: a housing; a single-layer circuit board covered with the housing to form an accommodating space, the circuit board being integrated with an acoustic channel; a vibration assembly dividing the accommodating space into a first cavity and a second cavity and enclosed with the circuit board to form the second cavity; and an MEMS chip arranged in the second cavity and fixed to the circuit board, wherein the MEMS chip is provided with a back cavity, the acoustic channel is communicated with the first cavity and the back cavity, vibration of the vibration assembly is conducted to one side of the MEMS chip by means of the first cavity, the acoustic channel and the back cavity, and the vibration of the vibration assembly is also conducted to the other side of the MEMS chip by means of the second cavity. The bone conduction microphone configured in this way uses the single-layer circuit board integration method to achieve a bottom sound channel, thereby effectively reducing a product's height to meet the design requirements for product height specifications, lowering the cost of circuit board materials and simplifying the packaging production process.
A wearable device, comprising a support, wherein the following components are arranged inside the support: a first loudspeaker (3), which can output a first sound wave signal, the propagation direction comprising a first direction and a second direction, and an included angle θ meeting 90°<θ≤180°; and a second loudspeaker (4), which can output a second sound wave signal, the propagation direction being the second direction, and the two signals having the same waveform and opposite phases. When the wearable device is used, the first direction is a direction in which sounds propagate towards human ears, the second direction is a direction in which sounds propagate away from human ears, the first loudspeaker (3) is a main sound source, which transmits an audible sound, the second loudspeaker (4) adjusts the phase and waveform of the second sound wave signal, such that the second sound wave signal has the same waveform as the first sound wave signal and has an opposite phase to the first sound wave signal, the second sound wave signal can offset the first sound wave signal propagating in the second direction, and the sound attenuation of the first sound wave signal in the second direction is increased, that is, the degree of far-field isolation of the wearable device is improved, and thus the privacy is better.
Embodiments of the present invention provide a voice wake-up method, an electronic device, and a computer readable storage medium. The method comprises: collecting an original voice signal inputted by a user; generating pulse density modulation data on the basis of the original voice signal; decoding the pulse density modulation data to generate decoded data; performing preprocessing and feature extraction processing on the decoded data to generate a voice feature; on the basis of an obtained hidden Markov model, performing mode matching on the voice feature to generate an identification result; and on the basis of the identification result, waking up an external processor of an electronic device. In the technical solution provided in the embodiments of the present invention, preprocessing and feature extraction processing are performed on the decoded data to obtain a voice feature; on the basis of an obtained hidden Markov model, mode matching is performed on the voice feature to generate an identification result; and on the basis of the identification result, an external processor of an electronic device is woken up. Thus, a voice wake-up function is realized, and the accuracy of voice wake-up is improved while power consumption of the electronic device is reduced.
A diaphragm unit and a loudspeaker having said diaphragm unit. The diaphragm unit comprises: a diaphragm body (10), which is capable of vibrating in a first direction, and the diaphragm body (10) being provided with mounting portions (11); a shake prevention mechanism, which comprises a plurality of shake prevention assemblies, the plurality of shake prevention assemblies all being connected to the mounting portions (11), and the shake prevention assemblies (20) comprising first movable portions (21) and second movable portions (22); one end of each first movable portion (21) is pivotally connected to a mounting portion (11), the other end of said first movable portion (21) is pivotally connected to a second movable portion (22), and said second movable portion (22) can move back and forth in a direction normal to a first direction (D1). Compared to the prior art, by the provision of the plurality of shake prevention assemblies (20), the diaphragm body (10) can be stably supported, which effectively prevents shaking and swinging motions of the diaphragm body (10); the stability and reliability of the diaphragm body (10) are improved, the occurrence of unwanted noise is prevented, and the acoustic performance of a loudspeaker is effectively improved.
The present invention relates to the technical field of gimbals. Disclosed is a gimbal device, comprising: a lifting module (100), which comprises a first driving member (11), a worm (12), and a rack (13) in transmission connection with the worm (12); a horizontal rotating module (200), which is connected to the rack (13) and comprises a second driving member (21), a first synchronous pulley (22) and a bearing assembly, the first synchronous pulley (22) driving the bearing assembly to rotate horizontally; a rotating shaft (300) connected to the bearing assembly, a pitch module (400) and a yaw module (500) being provided at an end of the rotating shaft (300); the pitch module (400) comprising a third driving member (31), a first transmission gear (32) and a fixed gear (33), the third driving member (31) being rotatable around the axial direction of the fixed gear (33); and the yaw module (500) comprising a fourth driving member (41), a second transmission gear (42), a yaw gear (43) and a yaw shell (44), the yaw shell (44) being rotatable around the axial direction of the yaw gear (43). In the device, the lifting module (100) can achieve vertical lifting, the horizontal rotating module (200) can achieve horizontal rotation, the pitch module (400) can achieve front-rear rotation, and the yaw module (500) can achieve left-right rotation, that is, four-axis movement is achieved, which provides a rich variety of movement modes; moreover, a compact layout is achieved between the modules, so that the four-axis movement can be realized in a small space.
F16M 11/24 - Infrastructure avec ou sans roues à hauteur ou longueur modifiables des pieds, avec utilisation possible pour le transport également
F16M 11/12 - Moyens pour la fixation des appareilsMoyens permettant le réglage des appareils par rapport au banc permettant la rotation dans plus d'une direction
Provided in the present utility model is a smart wearable device, comprising a spectacles frame and a pair of temples extending backward from two sides of the spectacles frame. Each temple comprises a frame, a cover plate that covers the frame to form a accommodating space, and a speaker unit accommodated in the accommodating space, wherein the speaker unit comprises a first sound-generating surface and a second sound-generating surface opposite the first sound-generating surface; the frame comprises an upper wall, a lower wall opposite the upper wall, and an outer wall connecting the upper wall and the lower wall; the cover plate is arranged opposite the outer wall; and a first sound output hole is provided in the upper wall, a second sound output hole is provided in the lower wall, and a third sound output hole is provided in the outer wall, the first sound output hole being in communication with an inner cavity of the speaker unit, the second sound output hole being in communication with the first sound-generating surface of the speaker unit, and the third sound output hole being in communication with the second sound-generating surface of the speaker unit. In the smart wearable device of the present utility model, two front cavities are independent of each other and each have an independent sound outlet, so as to achieve independent sound output of the two front cavities, and a rear cavity has the effect of preventing sound leakage.
The present invention provides an intelligent wearable device, comprising a glasses frame and a pair of temples extending backwards from two sides of the glasses frame, wherein the glasses frame comprises connecting parts connected to the temples; each temple comprises a frame, a cover plate covering the frame to form an accommodating space, and a rotating shaft assembly accommodated in the accommodating space and fitted with the corresponding connecting part of the glasses frame; the frame comprises an upper wall and a lower wall opposite to the upper wall; the rotating shaft assembly comprises a first rotating shaft support fixed to the upper wall, a second rotating shaft support fixed to the lower wall, a screw connected between the first rotating shaft support and the second rotating shaft support, and locating ball plunger assemblies fixed to the corresponding connecting part; the locating ball plunger assemblies are movably connected between the first rotating shaft support and the second rotating shaft support so as to implement stored and unfolded states of the intelligent wearable device. According to the intelligent wearable device of the present invention, storage and unfolding of the intelligent wearable device are implemented by means of rotating shaft assemblies, the structure is simple, the requirements for part machining precision and assembling precision are low, and the development cost is low.
A diopter adjusting apparatus and a VR device. The diopter adjusting apparatus comprises: a lens mounting part for mounting a lens module; a guide adjusting part connected to the lens mounting part, wherein the guide adjusting part can move along a preset path such that the lens mounting part moves in a first direction; and a driving part used for driving the guide adjusting part to move along the preset path. Compared with the prior art, by means of the arranged lens mounting part, guide adjusting part, and driving part, the driving part drives the guide adjusting part to move along the preset path, such that the lens mounting part is driven to move in a reciprocating manner, thereby achieving automatic adjustment of the diopter.
Embodiments of the present application provide a power supply device and a terminal. The device comprises a battery module and optical engine modules. The battery module is electrically connected to the optical engine modules. The battery module is used for providing electric signals to the optical engine modules, so that the battery module directly supplies power to the optical engine modules, reducing the length of the power supply line, and also reducing the width of the power supply line.
A loudspeaker module and an intelligent head-mounted device. The loudspeaker module comprises: a loudspeaker housing (1), an accommodating cavity (2) being provided within the loudspeaker housing (1), and the accommodating cavity (2) having a first space and a second space; a first sound-producing unit, which divides the first space into a first rear sound cavity (22) and a first front sound cavity (21), a first speaker hole (3) being provided in a first surface (11) of the loudspeaker housing (1), and the first front sound cavity (21) being in communication with the outside of the loudspeaker housing (1) via the first speaker hole (3); and a second sound-producing unit, which divides the first space into a second rear sound cavity (24) and a second front sound cavity (23), a second speaker hole (4) being provided in the first surface (11), and the second front sound cavity (23) being in communication with the outside of the loudspeaker housing (1) via the second speaker hole (4). Compared with the prior art, by means of providing two speaker holes which are located in the same surface of the loudspeaker housing (1), the sound of the loudspeaker module is supplemented and superposed, and the overall frequency range and loudness are also increased.
The present application provides a microphone and a method for manufacturing same. The microphone comprises a housing in which a cavity is formed, and a photonic crystal assembly and a photoelectric module respectively fixed in the cavity. The housing is provided with a sound inlet communicating the cavity with the outside. The photonic crystal assembly comprises a diaphragm provided in the cavity and a photonic crystal back plate fixed to the side of the diaphragm facing the photoelectric module; a gap is formed between the diaphragm and the photonic crystal back plate; and an array of through holes are provided on the photonic crystal back plate. The photoelectric module is used for emitting laser light to the diaphragm, and is further used for receiving laser light reflected back from the photonic crystal back plate and the diaphragm and performing photoelectric signal conversion processing on the received laser light. The present application provides a photonic crystal-based optical microphone, and by means of the arrangement of the photonic crystal back plate structure, the sensitivity and the signal-to-noise ratio of the microphone can be effectively improved.
Provided in the present invention is a rotation limiting structure, which is used for limiting the rotation of a first rotating member, wherein the first rotating member is provided with a protrusion. The rotation limiting structure comprises a body and a first limiting portion, wherein the body is provided with a second limiting portion; the first limiting portion is movably mounted on the body, and has a first state and a second state, in which same is limited by the second limiting portion; when the first rotating member rotates clockwise, the first limiting portion can be pushed to be in the first state by the protrusion in a first direction, and the first rotating member then reaches a first limit position; when the first rotating member rotates anticlockwise, the first limiting portion can be pushed to be in the second state by the protrusion in a second direction, and the first rotating member then reaches a second limit position; and the second direction is opposite to the first direction. As the protrusion can push the first limiting portion in opposite directions, the rotation angle of the first rotating member when same rotates from the first limit position to the second limit position is increased, thereby reducing the influence of the width of the protrusion on the rotation angle of the first rotating member.
Disclosed in the present invention are an acoustic sensor and a preparation method therefor. The acoustic sensor comprises: a substrate unit, wherein the substrate unit comprises a first silicon layer, a first oxide layer, and a second silicon layer sequentially stacked from bottom to top, and a back cavity is formed in the substrate unit; a second oxide layer formed on the substrate unit; a piezoelectric unit formed on the second oxide layer, wherein the piezoelectric unit comprises a first electrode layer, a piezoelectric layer, and a second electrode layer sequentially stacked from bottom to top; a first slit, wherein the first slit is formed in the middle of the second electrode layer, and the first slit sequentially passes through the second electrode layer, the piezoelectric layer, and the first electrode layer; a second slit, wherein the second slit is formed in the middle of the second silicon layer, and the second slit sequentially passes through the second silicon layer and the second oxide layer; and an additional film layer filled in the first slit, wherein the additional film layer is not filled in the second slit. Compared with the prior art, the present invention can effectively improve the SPL and the structural reliability, and the material type is not limited by a dry film type material any more.
G01H 11/08 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores par détection des changements dans les propriétés électriques ou magnétiques par des moyens électriques utilisant des dispositifs piézo-électriques
A microphone module and a defrosting method. The microphone module comprises a housing having an accommodating space and a microphone mounted within the accommodating space. The microphone module further comprises a thermally conductive ring (3) embedded inside of the housing (1) and a heating unit (4) connected to the thermally conductive ring (3). A sound hole (31) corresponding to the position of the microphone (2) is formed at the interior of the thermally conductive ring (3). The heating unit (4) is used for providing heat to the thermally conductive ring (3). The defrosting method comprises the steps of: in response to a heating instruction, activating a heating action of a heating unit (4) (S1); and checking the current performance of a microphone (2), and if the current performance of the microphone (2) is normal, deactivating the heating action of the heating unit (4) (S2). According to the present solution, water, frost, or ice inside of the sound hole (31) may be removed, preventing the sound hole (31) from being blocked and ensuring normal performance of the microphone (2).
An MEMS microphone, comprising: a substrate provided with a back cavity (11) and a capacitance system arranged on the substrate. The capacitance system comprises a back plate (2) and a diaphragm (3) arranged opposite and spaced apart from the back plate (2), wherein the surface of the back plate (2) facing the diaphragm (3) or the surface of the diaphragm (3) facing the back plate (2) is provided with dimples (4), characterized in that when the diaphragm (3) moves to enable the dimples (4) to simultaneously come into contact with the diaphragm (3) and the back plate (2), the dimples (4) can elastically deform in the vibration direction of the diaphragm (3). The dimples (4) of the MEMS microphone have elasticity, which can provide a buffer for the movement of the diaphragm (3), and thus avoids rapid concentration of stress on the position where the diaphragm (3) is in contact with the dimples (4), thereby preventing pits from forming on the diaphragm (3) and preventing the diaphragm (3) from breaking under the repeated impact of the dimples (4).
A MEMS element and an electro-acoustic conversion apparatus, relating to the technical field of microphones. The MEMS element comprises spacers, counter electrodes, a first diaphragm, and a second diaphragm. The spacers and the counter electrodes are located on the same horizontal plane and are alternately arranged in a cross section of the MEMS element; the first diaphragm and the second diaphragm are respectively disposed on opposite sides of the spacers and are in airtight connection with one another; the first diaphragm comprises a plurality of first protrusions disposed at intervals along a first direction, and the second diaphragm comprises a plurality of second protrusions disposed at intervals along the first direction, wherein the first protrusions and the second protrusions are in one-to-one correspondence and align with one another to form cavities, and the counter electrodes are suspended within the cavities; each first protrusion comprises a first front wall and a first rear wall, each second protrusion comprises a second front wall and a second rear wall, and at least part of the first front walls, the first rear walls, the second front walls, or the second rear walls are sub-corrugated structures. The MEMS element effectively reduces the maximum stress applied to the diaphragms under high-pressure impact, thus ultimately enhancing the mechanical robustness of the apparatus.
Provided in the present application are a lens surface defect detection method and apparatus, and a device and a readable storage medium. The specific implementation solution comprises: acquiring a RAW image captured by an imaging module that carries a lens to be tested; separating the RAW image into four single-channel images, and performing mean filtering processing on each single-channel image; performing a subtraction operation on each filtered image and a corresponding single-channel image, so as to obtain a difference image, and performing binarization processing on each difference image; acquiring a corresponding image connected component on the basis of each binarized difference image, and mapping the image connected components of all channels to the RAW image for merging; and if the total number of pixel points of a merged connected component is greater than or equal to a preset threshold value, outputting a lens surface defect detection result on the basis of image position information of the merged connected component. In the present application, lens surface defect detection is performed by means of computer vision without the need for a complex detection instrument and without the need for relying on manual labor to identify a lens surface defect, thereby effectively reducing the detection cost and the detection workload, and improving the detection accuracy.
The present application provides a camera calibration method, a device, and a readable storage medium. The specific implementation solution comprises: acquiring spectral response sensitivity of a camera, spectral power distribution data of different light sources, and spectral reflectivity of multiple color samples; for each light source, on the basis of the spectral response sensitivity, the spectral reflectivity and the corresponding spectral power distribution data, calculating a response parameter of the camera with respect to each color sample; on the basis of a current color correction matrix (CCM), correcting the response parameter to obtain a corrected response parameter; if it is determined on the basis of the corrected response parameters corresponding to all the color samples that the CCM does not satisfy an effective correction condition, adjusting an element value of the current CCM until the CCM satisfies the effective correction condition; and calibrating an adjusted CCM corresponding to each light source to the camera. In the present application, by means of mathematical modeling, the response of a camera to a color sample in a real light source environment is simulated to calibrate a CCM, thereby effectively reducing the calibration complexity and efficiency.
A directional MIC assembly (100) with double-sided sound intake and an electronic device (10). The electronic device (10) comprises the directional MIC assembly (100) with double-sided sound intake, wherein the MIC assembly (100) comprises a front housing (1) having a pair of sound intake holes (13) and an MIC device (2) provided on the inner side of the front housing (1); the MIC device (2) is provided with two receiving holes (21); and the MIC assembly (100) further comprises a fixing member (3) assembled on the inner side of the front housing (1). The fixing member (3) is provided with an assembly cavity (31), and two sound intake channels (32) which are in communication with the assembly cavity (31). The MIC device (2) is mounted in the assembly cavity (31), the two receiving holes (21) of the MIC device (2) are respectively in communication with the two sound intake channels (32), and the two sound intake channels (32) are respectively in communication with the two sound intake holes (13) of the same pair. Both the front housing (1) and the fixing member (3) can be separately processed, the arrangement of the sound intake holes (13) can meet the requirements of appearance design, external ports of the sound intake channels (32) on the fixing member (3) are not limited by appearance, can be processed by multiple methods such as molding and CNC, and can particularly be manufactured on a large scale at a low cost and a high yield by means of a mold, and the mold is simpler in design and lower in cost.
A capacitive sensing circuit and method. The capacitive sensing circuit comprises a charge pump, an MEMS chip, an analog signal modulator and a digital signal modulator, wherein the analog signal modulator is configured to perform analog signal modulation according to an output signal from the MEMS chip and an output signal from the analog signal modulator; and the digital signal modulator is configured to perform digital signal modulation on the output signal from the analog signal modulator, and outputs a modulated signal by using a digital interface. By directly using an input signal from an MEMS chip and an output signal from an analog signal modulator as input signals for analog modulation, harmonic distortion is reduced.
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
The present invention provides an inertial sensor and a manufacturing method. The manufactured inertial sensor comprises a base body structure and a movable inertial structure arranged at one side of the base body structure and spaced apart from same; the base body structure comprises a base layer, a circuit layer attached to the side of the base layer close to the movable inertial structure, and a blocking structure arranged on the circuit layer; the blocking structure is made of an insulating material; a plurality of slots running through in the thickness direction are formed in the circuit layer; the blocking structure comprises a plurality of protruding blocks which are connected to the circuit layer and protrude from the surface of the circuit layer facing away from the base layer; and the slots are blocked by insertion of the protruding blocks in a one-to-one manner. The inertial sensor has the advantages of reducing likeliness of viscosity, having a stable structure, and having a small limitation on the minimum size of the base body structure and the movable inertial structure, thereby facilitating improvement of the final performance of the inertial sensor.
G01C 21/16 - NavigationInstruments de navigation non prévus dans les groupes en utilisant des mesures de la vitesse ou de l'accélération exécutées à bord de l'objet navigantNavigation à l'estime en intégrant l'accélération ou la vitesse, c.-à-d. navigation par inertie
G01C 19/00 - GyroscopesDispositifs sensibles à la rotation utilisant des masses vibrantesDispositifs sensibles à la rotation sans masse en mouvementMesure de la vitesse angulaire en utilisant les effets gyroscopiques
A MEMS microphone, comprising a base (1), a housing (2) defining an accommodating space with the base (1), a MEMS chip (3) defining a back cavity with the base (1), and an ASIC chip (4) fixed to the base (1). The base (1) is provided with a sound inlet channel (10) communicating the accommodating space with the outside; the MEMS chip (3) is provided with a diaphragm (31) located on a sound inlet path of the sound inlet channel (10); the sound inlet channel (10) comprises a buffer cavity (101) located in the base (1), a first sound inlet hole (102) formed in the base (1) and communicating the buffer cavity (101) with the outside, and a second sound inlet hole (103) formed in the base (1) and communicating the buffer cavity (101) with the back cavity; the second sound inlet hole (103) faces the diaphragm (31); and the second sound inlet hole (103) comprises at least two sub-holes (1031) spaced apart from each other. When external air pressure enters the sound inlet channel (10) from the first sound inlet hole (102), the air pressure will not directly pass through the second sound inlet hole (103) to act on the diaphragm (31), and the sub-holes (1031) can further block airflow, so that the impact of the air pressure on the diaphragm (31) can be effectively buffered, thereby reducing rupture of the diaphragm, and improving the reliability and performance of the MEMS microphone.
A MEMS microphone (100), comprising a housing (10), a substrate (20) covering the housing (10) to form an accommodating space (101), and an ASIC chip (40) and a MEMS chip (30) disposed in the accommodating space (101); the substrate (20) is also provided with a first sound hole (21) extending from an upper surface (201) to a lower surface (202) and not passing through the lower surface, a second sound hole (22) extending from the lower surface (202) to the upper surface (201) and not passing through the upper surface (201), a connecting channel (23) provided between the upper surface (201) and the lower surface (202) of the substrate (20) and placing the first sound hole (21) and the second sound hole (22) in communication, and an air hole (24) extending from the upper surface (201) to the lower surface (202) and not passing through the lower surface (202), the air hole (24) and the second sound hole (22) being disposed to be transversely spaced apart from one another. The MEMS microphone (100) is also provided with an elastic member (50) covering the air hole (24), the elastic member (50) being able to open or close the air hole (24). The MEMS microphone (100) has strong anti-wind capability.
Disclosed in the present invention are an inertial sensor and a manufacturing method therefor. The inertial sensor comprises a first substrate; a dielectric layer; a first conductive layer, the first conductive layer being provided therein with a plurality of first openings; a plurality of second conductive layers, the plurality of second conductive layers being bonded to the first conductive layer by means of bonding structures, gaps being formed between the adjacent second conductive layers from the bottom to the top, the adjacent second conductive layers being connected by means of connection parts, and each second conductive layer being provided with a plurality of second openings; a second substrate, the second substrate covering the first substrate, and the second substrate and the first substrate defining a closed space therebetween. Compared with the prior art, the present invention is provided with a plurality of second conductive layers. Therefore, compared with those for traditional single-layer structures, a mold is reduced to a lower size, thereby reducing manufacturing costs and improving the integration between a device and a portable consumer application. In addition, a relatively large movable conductive structure has a larger surface area, thereby improving XY-axis sensitivity.
B81B 5/00 - Dispositifs comportant des éléments mobiles les uns par rapport aux autres, p. ex. comportant des éléments coulissants ou rotatifs
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G01P 15/14 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en utilisant un gyroscope
G01P 15/02 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie
G01P 15/00 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération
A diaphragm and a MEMS microphone. The diaphragm comprises a vibrating portion (1) and supporting structures (2) connected to the vibrating portion (1). Each supporting structure (2) comprises a cantilever portion (21) extending outwards from the periphery of the vibrating portion (1), and a first anchoring portion (22) and a second anchoring portion (23), both of which are connected to the end of the cantilever portion (21) away from the vibrating portion (1). The lengths of both the first anchoring portion (22) and the second anchoring portion (23) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portion (22) and the length of the second anchoring portion (23) extend in opposite directions. As the lengths of both the first anchoring portion (22) and the cantilever portion (21) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portions (22) and the length of the second anchoring portion (23) extend in opposite directions, the first anchoring portion (22), the cantilever portion (21), and the second anchoring portion (23) are connected to form a T shape, that is, each supporting structure is a T-shaped beam, enabling the diaphragm to have a wider range of vibration displacement, and thereby improving the sensitivity and adaptability of the MEMS microphone.
The present invention provides a counter electrode structure and a dual-membrane MEMS microphone. The dual-membrane MEMS microphone comprises a substrate and a capacitor system. The capacitor system comprises a first electrode membrane and a second electrode membrane which are arranged at an interval to form an accommodating cavity, and the two electrode membranes have corrugated cross-sectional shapes in the radial direction. The wave crest of one electrode membrane is connected to the wave trough of the other electrode membrane to form a supporting body. The capacitor system further comprises a counter electrode structure suspended in the accommodating cavity. The counter electrode structure comprises a plurality of circumferential beams arranged at intervals from inside to outside and a plurality of radial beams connected to the circumferential beams and extending from inside to outside, a via hole extending around the center of the counter electrode structure is formed between every two adjacent circumferential beams inside and outside, and the supporting body passes through the via holes and is spaced apart from the edges of the via holes. The arrangement of a counter electrode structure enables two electrode membranes to achieve a dual-corrugated membrane structure, which is more sensitive to sound pressure and can significantly improve the sensitivity performance.
Provided are an MEMS sensor and a preparation method therefor. The MEMS sensor comprises: a bottom electrode layer (1) and a top electrode layer (2) forming a cavity (3), and a device layer (4) accommodated in the cavity (3). The device layer (4) comprises a plurality of movable mass blocks (41) arranged at intervals. Preset gaps are formed between the movable mass blocks (41) and the top electrode layer (2), and the preset gaps formed by different movable mass blocks (41) are different from each other. The preparation method for the MEMS sensor comprises: S1, sequentially forming a bottom electrode layer (1), a sacrificial layer (5), a device layer (4), and a top electrode layer (2) from bottom to top; S2, etching the device layer (4) to form a plurality of movable mass blocks (41) arranged at intervals; and S3, releasing the sacrificial layer (5). A differential output electrical signal is formed by means of the difference of the preset gaps, thereby achieving the high sensitivity and volume miniaturization of the MEMS sensor.
H04R 31/00 - Appareils ou procédés spécialement adaptés à la fabrication des transducteurs ou de leurs diaphragmes
G01L 9/12 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent en faisant usage des variations de la capacité
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
G01P 15/125 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
H01G 5/16 - Condensateurs dont la capacité varie par des moyens mécaniques, p. ex. en tournant un axeProcédés pour leur fabrication à variation de la distance entre armatures
H01G 5/00 - Condensateurs dont la capacité varie par des moyens mécaniques, p. ex. en tournant un axeProcédés pour leur fabrication
90.
FILM BULK ACOUSTIC RESONATOR MANUFACTURING METHOD, FILM BULK ACOUSTIC RESONATOR AND FILTER
A film bulk acoustic resonator manufacturing method provided in the present invention comprises: providing a substrate having a top surface; forming a dielectric material layer on the top surface of the substrate; forming a bottom electrode on the surface of the dielectric material layer away from the substrate; forming a piezoelectric material layer on the surface of the bottom electrode away from the substrate; forming an intermediate metal layer on the surface of the piezoelectric material layer away from the substrate; forming a mass load layer on the surface of the intermediate metal layer away from the substrate; and forming a top electrode on the surface of the mass load layer away from the substrate. This mode increases process options, and increases the flexibility of forming multi-mass loads of film bulk acoustic resonators below top electrodes and in filters having the film bulk acoustic resonators, thereby improving the sensitivity of the filters.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
91.
ACOUSTIC WAVE RESONATOR AND PREPARATION METHOD THEREFOR
An acoustic wave resonator and a preparation method therefor. The acoustic wave resonator comprises: a substrate (1), provided with a plurality of cavities (2); a plurality of piezoelectric units, the plurality of piezoelectric units being in one-to-one correspondence with the plurality of cavities (2), the piezoelectric units covering the cavities (2), and each piezoelectric unit comprising a first electrode layer (4), a piezoelectric layer (5) and a second electrode layer (8) which are sequentially stacked from bottom to top; a protective layer (9), stacked on the piezoelectric units; and a series unit, having one end electrically connected to the first electrode layer (4) of one piezoelectric unit and the other end electrically connected to the second electrode layer (8) of another piezoelectric unit, so as to connect the two piezoelectric units in series. The protective layer (9) is provided on the piezoelectric units, such that the piezoelectric units are protected from being further damaged by downstream processing, and the acoustic wave resonator has a better Q value and a better coupling coefficient.
Provided in the present invention are an MEMS device and a method for manufacturing the MEMS device. The MEMS device comprises a cap piece and a device piece, wherein the device piece comprises a silicon substrate, at least two device structure layers and at least one electrically conductive structure layer, every two adjacent device structure layers being coupled to each other by means of the corresponding electrically conductive structure layer; the device piece has a functional cavity, which comprises a first area, a second area and a third area; the at least two device structure layers and the at least one electrically conductive structure layer each stretch across the first area, the second area and the third area; and the at least two device structure layers and the at least one electrically conductive structure layer collaboratively form a first movable structure in the first area, collaboratively form an anchor point in the second area, and collaboratively form a second movable structure in the third area.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
G01P 15/14 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en utilisant un gyroscope
G01C 19/56 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
Provided in the present invention are a capturing control method and a related apparatus. A capturing module and a communication module are provided on a Bluetooth earphone box. The method comprises: first, establishing a target communication connection with a terminal device on the basis of a communication module; then, on the basis of the target communication connection, receiving a capturing control instruction sent by the terminal device; next, according to the capturing control instruction, controlling a capturing module to trigger a corresponding image capturing state; and finally, on the basis of the target communication connection, sending a target captured image to the terminal device. By means of the implementation of the present invention, a terminal device can control a capturing module on a Bluetooth earphone box to implement a capturing function. That is, the capturing function of the Bluetooth earphone box is expanded to provide a capturing function and capturing performance support to the terminal device, such that capturing requirements of a terminal user are met, and the miniaturization of the terminal device can also be ensured.
H04N 23/661 - Transmission des signaux de commande de la caméra par le biais de réseaux, p. ex. la commande via Internet
H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
H04W 76/14 - Établissement de la connexion en mode direct
An electronic cigarette (200), comprising a cigarette body housing (201) and an MEMS airflow sensor (100) accommodated in the cigarette body housing (201). The MEMS airflow sensor (100) comprises a circuit board (1), an upper cover (2) covering the circuit board (1) and forming an accommodating space (10) together with the circuit board (1), an ASIC chip (3), and an MEMS chip (4) having a back cavity (41), the ASIC chip (3) and the MEMS chip being fixed to the circuit board (1) and electrically connected to each other. The upper cover (2) is provided with a first sound hole (21) running through the upper cover (2); an upper metal layer (5) and a lower metal layer (6) which are exposed on surfaces of the circuit board (1) and are electrically connected to each other are respectively provided on the side of the circuit board (1) close to the upper cover (2) and the side of the circuit board (1) away from the upper cover (2); the projection of the ASIC chip (3) on the circuit board (1) is at least partially located within the range of the upper metal layer (5). According to the electronic cigarette (200), the overall heat dissipation performance of the circuit board (1) can be improved by means of the upper metal layer (5) and the lower metal layer (6) which are additionally provided, so as to transfer heat generated during operation of the ASIC chip (3) to the outside of the accommodating space (10) in time, thereby avoiding trigger of overheating protection and shutdown of the ASIC chip (3).
An electronic cigarette (200), comprising a cigarette body casing (201) and a MEMS sensor (100) accommodated in the cigarette body casing (201); the MEMS sensor (100) comprises a housing (1) having an accommodating space (10), and, accommodated in the accommodating space (10) and electrically connected to each other, an AISC chip (2) and an MEMS chip (3) having a back chamber (31); the housing (1) is provided with a first sound hole (11) and a second sound hole (12) penetrating therethrough and communicating the accommodating space (10) with the outside; the MEMS sensor (100) further comprises a first waterproof and breathable film (4) fixed to the housing (1) and completely covering the first sound hole (11), and a second waterproof and breathable film (5) fixed to the housing (1) and completely covering the second sound hole (12). The MEMS sensor (100) of the electronic cigarette can intercept impurities such as water, liquid, dust and aerosol by means of the first waterproof and breathable film (4) and the second waterproof and breathable film (5), thereby avoiding performance decline or damage of the MEMS chip (3) due to impurities entering the MEMS chip (3) via the first sound hole (11) and the second sound hole (12).
The present invention provides a gas sensor, comprising a housing provided with an accommodating cavity, and a sound sensor and an infrared transmitter which are arranged in the accommodating cavity. The housing comprises a cover plate, a substrate spaced apart from the cover plate, and a side wall located between the cover plate and the substrate. The housing is provided with a vent hole used for communicating the outside with the accommodating cavity. The gas sensor further comprises a flexible film connected to the side wall. The flexible film separates the accommodating cavity into a first cavity and a second cavity. The infrared transmitter is located in the first cavity. The sound sensor is located in the second cavity. The flexible film, the first cavity and the second cavity constitute a resonator system. An inherent frequency of the resonant system is the same as a modulation frequency of the infrared transmitter. The vent hole is communicated with the first cavity. Compared with the related art, the gas sensor provided by the present invention has improved sensitivity.
G01N 21/35 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge
Provided in the present invention is an onboard microphone system, comprising a microphone module and a vehicle body where the microphone module is mounted; the vehicle body comprises an outer surface facing the outside of the vehicle and an inner surface opposite to the outer surface, the microphone module being mounted on the inner surface; the vehicle body is provided with a sound inlet channel of the microphone module, the sound inlet channel comprising an arched channel and a sound hole leading to the arched channel; a first end opening and a second end opening of the arched channel are formed in the outer surface and are spaced apart from each other; the sound hole leads to the arched channel at the top of the arched channel and forms a sound hole opening located in the inner surface, sound entering the microphone module via the sound hole opening. The water resistance of the onboard microphone system of the present invention is optimized and the effect of wind noise thereon is reduced.
B60R 11/02 - Autres aménagements pour tenir ou monter des objets pour postes radio, de télévision, téléphones, ou objets similairesDisposition de leur commande
The present invention provides a MEMS microphone, comprising a substrate having a back cavity and a capacitor system arranged on the substrate. The capacitor system comprises a back plate and a diaphragm arranged opposite to the back plate. The diaphragm is located between the substrate and the back plate. The diaphragm is provided with a through hole. The back plate comprises a body part, an extending column extending from the body part to the substrate and passing through the through hole, and a gasket connected to the extending column. The gasket is located between the diaphragm and the substrate. One end of the extending column is connected to the body part of the back plate, and the other end of the extending column is connected to the gasket. Compared with the prior art, the MEMS microphone provided by the present invention can enhance the reliability of the product.
Provided in the present utility model is an electronic cigarette. The electronic cigarette of the present utility model comprises an atomizer, an e-liquid cavity, and an airflow sensing apparatus, which mainly comprises a first circuit board, an MEMS airflow sensor and a main control IC. A second circuit board of the present solution is provided with a first pad and a second pad, wherein the second pad is arranged around the first pad, a first pin is provided in the first pad, and a second pin is provided in the second pad. Since the first pad is surrounded and sealed by the second pad, the first pin is electrically connected to a capacitance measurement port of the main control IC, and the second pin is grounded, the present solution can prevent condensate from coming into contact with the first pin of the MEMS airflow sensor, which first pin is electrically connected to the main control IC, such that condensate flowing through a capacitance measurement line of the electronic cigarette can be effectively avoided, and the main control IC does not detect an increase in a capacitance value. Therefore, self-starting of the electronic cigarette can be prevented, and the electronic cigarette is safe and reliable and has a low cost.
Disclosed in the present invention are a MEMS diaphragm and a MEMS sensor. The MEMS diaphragm comprises: a main diaphragm, the main diaphragm comprising a main body sensing part and fixing parts, and the plurality of fixing parts being annularly connected to the outer edge of the main body sensing part at intervals; and an additional material layer, the additional material layer being arranged on the fixing parts, or the additional material layer being arranged on the edge of the main body sensing part and the fixing parts, wherein the internal stress of the additional material layer is greater than the internal stress of the main body sensing part. Compared with the prior art, in the present invention, the additional material layer is arranged on the main diaphragm, the additional material layer is mechanically reinforced in a diaphragm area subjected to a high stress during pressure pulses, and the internal stress of the additional material layer is greater than the internal stress of the main body sensing part, so that the flexibility of the main diaphragm can be guaranteed.
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