The present invention provides a method for determining color difference defect compensation data, a compensation method, and an augmented reality device. The method for determining color difference defect compensation data, including: obtaining a generated image of an augmented reality device, and preprocessing the generated image to obtain a first image; using a preset filtering algorithm to detect a color difference defect in the first image; obtaining a position of the color difference defect region and color difference defect data; and generating corresponding color difference defect compensation data based on the color difference defect data. According to the method for determining the color difference defect compensation data provided in the embodiments of the present invention, to compensate for display content of an augmented reality display apparatus and obtain a compensated display picture, thereby enhancing a display effect of the augmented reality display apparatus and correcting a color difference.
G06T 7/194 - DécoupageDétection de bords impliquant une segmentation premier plan-arrière-plan
G06T 7/90 - Détermination de caractéristiques de couleur
G06V 10/56 - Extraction de caractéristiques d’images ou de vidéos relative à la couleur
G09G 5/02 - Dispositions ou circuits de commande de l'affichage communs à l'affichage utilisant des tubes à rayons cathodiques et à l'affichage utilisant d'autres moyens de visualisation caractérisés par la manière dont la couleur est visualisée
The present application provides an interpupillary distance adjustment device, including a base, a first lens assembly and a second lens assembly that are relatively slidably mounted on the base, a knob rotatably mounted on the base, and a transmission assembly connected to the first lens assembly, the second lens assembly, and the knob. The transmission assembly includes a transmission gear rotatably mounted on the base, and a transmission belt wound around the knob and the transmission gear. The knob is provided with a first groove, and the transmission gear is provided with a second groove. The transmission belt is engaged with the first and second grooves, and the transmission gear is meshed with the first and second lens assemblies. The knob and the drive gear establish a belt-driven mechanism, ensuring smooth rotational force transmission and a superior tactile feedback, and providing a simpler and more reliable structure.
The present application provides a MEMS device and a preparation method therefor. The MEMS device includes a piezoelectric diaphragm, a blocking layer disposed on a side of the piezoelectric diaphragm, a sacrificial layer connected to a side of the blocking layer back away from the piezoelectric diaphragm, and a substrate connected to a side of the sacrificial layer back away from the blocking layer. The substrate includes a wall connected to a side of the sacrificial layer back away from the blocking layer and forming a cavity, and a mass block disposed on the side of the sacrificial layer back away from the blocking layer and accommodated within the cavity, which is formed by etching the substrate and is spaced apart from the wall. The mass block can drive the piezoelectric diaphragm to produce significant mechanical deformation, improving the sensitivity and response efficiency of the MEMS device.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G01P 15/09 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs piézo-électriques
The present invention provides a smart optical device includes a screen, a holder spaced apart from the screen, a driving assembly secured to the holder, a reflector assembly movably connected to the holder, and a prism assembly fixedly connected to the holder. The driving assembly includes a screw located at least partially out of the holder and a slider connected to the screw through a thread. The reflector assembly abuts against the slider. When rotating the screw, the slider moves in a first direction to push the reflector assembly to move in a second direction, the first direction is an axis direction of the screw and the second direction is perpendicular to the first direction. The smart optical device of the present invention has the function of adjusting refractive power by rotating the screw. The smart optical device has a simple structure and is easy to operate.
Disclosed are a locking mechanism and a locking apparatus. The locking mechanism is operable to securely lock a detachable attachment. A bolt is connected to a drive and also rotatably connected to a securing rack; the drive may be subjected to an external force to slide relative to the securing rack, which drives the bolt to rotate, so that a snap hook of the bolt may access and exit a locking bore, whereby locking or unlocking is realized. A snap hook according to the disclosure may extend out of the locking bore to snap-fit the detachable attachment outside the housing, realizing positionally retaining of the bolt in multiple directions, which eliminates a need of additionally setting a limiting mechanism to extend the bolt outside of the housing to lock the detachable attachment, which facilitates use and offers a strong practicality.
The present disclosure discloses an MEMS microphone chip including a diaphragm having a support portion fixed on the substrate, a main body portion located above the back cavity, and a deflation valve spaced apart from the main body portion for forming a first deflation slit. The deflation valve includes at least one deflation plates. Each of the at least one deflation plates includes a fixation portion connected with the main body portion, a move portion arranged at an interval from the main body portion, and a connection portion connected with the fixation portion and the move portion. A width of the fixation portion is smaller than a width of the move portion. The MEMS microphone chip in the present disclosure has higher reliability.
A MEMS sensor module includes an inner space enclosed by a side wall, a first circuit board, a second circuit board, a dividing wall for dividing the inner space into two cavities, a first MEMS sensor in one cavity wrapped by glue, a second MEMS sensor in another cavity, a first golden finger layer between the side wall and the first circuit board as well as between the dividing wall and the first circuit board for respectively surrounding the two cavities, a second golden finger layer between the side wall and the second circuit board as well as between the dividing wall and the second circuit board for respectively surrounding the two cavities, and a notch in the first golden finger layer at the dividing wall for communicating the two cavities. The MEMS sensor module can avoid the heat generated by one MEMS sensor affecting another one.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
H04R 3/06 - Circuits pour transducteurs pour corriger la fréquence de réponse des transducteurs électrostatiques
A MEMS sensor module includes an inner space enclosed by a side wall, a dividing wall for dividing the inner space into two cavities, a first circuit board, a second circuit board, two MEMS sensors respectively disposed in the two cavities, and two golden finger layers. One or both of the two golden finger layers at the dividing wall have a notch communicating the two cavities. One MEMS sensor includes an ASIC chip on the second circuit board and a MEMS chip on the ASIC chip. Another MEMS sensor includes an ASIC chip on the first circuit board and a MEMS chip on the second circuit board. The side wall has a conductor connecting the two circuit boards. A bonding wire connects the MEMS chip and the second circuit board. The MEMS sensor module can avoid the heat generated by one MEMS sensor affecting another one.
Smart glasses are provided, including a frame assembly, two female connecting assemblies, and two temple assemblies. The two female connecting assemblies are respectively fixed to two opposite ends of the frame assembly, and the two temple assemblies are respectively connected to the two female connecting assemblies. Each of the two female connecting assemblies includes a female connector, a clamping groove, a bracket, an inserting groove, and an elastic metal component. Each of the two temple assemblies includes a temple and a male connector, each male connector is fixed to one end of a corresponding temple close to a corresponding one of the two female connecting assemblies. The smart glasses enable quick replacement of the two temple assemblies or the frame assembly.
Smart glasses are provided, including a frame assembly and two temple mechanisms. The two temple mechanisms are respectively fixed to two opposite ends of the frame assembly. The two temple mechanisms include two connecting components respectively fixed to the two opposite ends of the frame assembly, two female connecting assemblies respectively hinged to ends of the two connecting components, and two temple assemblies respectively inserted into the two female connecting assemblies. Through respectively inserting the two temple assemblies into the two female connecting assemblies, each female connector is fixed and locked with a corresponding female connecting assembly; when the two temple assemblies are pulled out by external force, the two temple assemblies are separated from the frame assembly to complete the quick disassembly, a frame of the smart glasses is easily assembled and disassembled, thereby proving better user experience.
Embodiments of the present invention relate to the technical field of semiconductor devices and disclose a MEMS microphone and a method for preparing the same. In the disclosure, the substrate is provided with at least one chamfer at an inner edge of a side of the substrate close to the diaphragm, so that when the diaphragm is bent towards the substrate due to vibration, providing the chamfer can prevent the diaphragm from hitting the substrate, or increase the contact area between the diaphragm and the substrate when the diaphragm hits the substrate, avoiding the concentration of stress and thus reducing the risk of the diaphragm breaking. In this way, the probability of failure of the MEMS microphone due to breakage of the diaphragm can be reduced, and the robustness of the MEMS microphone can be enhanced.
The present disclosure provides a speaker including a chamber filled with the sound absorbing material. The chamber is also filled with expandable foam which is expandable by heating from a predetermined volume to a larger volume to limit the movement of the sound absorbing material in the chamber. The expandable foam is formed by compressing a foam impregnated with polymeric adhesive to the predetermined volume. The speaker provided by the present disclosure improves the reliability of the filled sound absorbing material.
H04R 1/28 - Supports de transducteurs ou enceintes conçus pour réponse de fréquence spécifiqueEnceintes de transducteurs modifiées au moyen d'impédances mécaniques ou acoustiques, p. ex. résonateur, moyen d'amortissement
The present disclosure discloses a MEMS microphone chip. The diaphragm of the MEMS microphone chip is suspended on the substrate by a plurality of elastic connection portions connected with the vibration portion of the diaphragm. The vibration portion includes a central vibration portion and an outer vibration portion connected with the central vibration portion and the plurality of elastic connection portions. The back plate includes an anchor portion extending towards the diaphragm. The anchor portion is fixedly connected with the central vibration portion. Therefore, the diaphragm is mounted on the substrate by the plurality of elastic connection portions. The central vibration portion is anchored to the back plate by the anchor portion. The MEMS microphone chip in the present disclosure has higher reliability.
An accessory identification method includes: generating target magnetic intensity characterization data by the magnetic intensity detection element in response to a magnetic intensity of a magnetic component in a target accessory, when it is detected that the target accessory is located at a preset target position of the electronic device; matching the target magnetic intensity characterization data with a preset accessory index table; and determining accessory identification information corresponding to a matched magnetic field intensity characterization data range as identification information of the target accessory. According to the present disclosure, the identification information of the accessory can be hidden, which is conductive to achieving the security of the accessory information. Meanwhile, excessive detection devices is not required and thus the volume occupied by hardware can be reduced, thereby saving the hardware resource cost.
G01R 33/07 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs à effet Hall
G01R 33/00 - Dispositions ou appareils pour la mesure des grandeurs magnétiques
15.
SEALING RING ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE
Provided is a sealing ring assembly structure and electronic device. The sealing ring assembly structure comprises an assembly body having a main body and a limiting convex ring protruding therefrom, and a sealing ring. The limiting convex ring and the main body jointly enclose to form a limiting groove. The main body has a first through hole communicating with the limiting groove. The sealing ring is accommodated in the limiting groove, and comprises a ring body and an adhesive layer through which the ring body is adhered and fixed to the limiting groove. The ring body abuts against the groove wall of the limiting groove. The sealing ring has a second through hole penetrating the ring body and the adhesive layer and coaxially arranged with the first through hole. The sealing ring assembly structure is easy and accurate to assemble, the assembling efficiency and the product yield are improved.
F16J 15/10 - Joints d'étanchéité entre surfaces immobiles entre elles avec garniture solide comprimée entre les surfaces à joindre par garniture non métallique
16.
ELECTRONIC SYSTEM AND METHOD FOR CONTROLLING THE SAME
Provided are an electronic system and a method for controlling the same. The electronic system includes an electronic device at least including: a charging circuit having a first input terminal, a second input terminal, and a first output terminal, and including a first transistor, a second transistor, a third transistor, and a fourth transistor; a switching circuit including an input terminal connected to the first output terminal and an output terminal connected to a power supply of the electronic device and configured to connect or disconnect a connection path between the first output terminal and the power supply; and a communication device, which, in a communication mode, is connected to the first and second input terminals to communicate with the electronic device through the first and second input terminals. The implementation of the present disclosure is at least conducive to prolonging the service life of the electronic device.
The present invention provides a bone conduction package structure including a base board, a housing covered with the base board to form a receiving room, a bone conduction MEMS chip and an ASIC chip located in the receiving room. The bone conduction MEMS chip includes a substrate, a diaphragm, and a backplate. A first cavity is formed between the diaphragm and the backplate. A second cavity is formed by the diaphragm, the substrate, and the base board. And a third cavity is formed by the backplate, the housing, the substrate, and the base board. The first cavity is set as a low-pressure area below atmospheric pressure. The bone conduction package structure of the present invention sets the area between the diaphragm and the backplate as a low-pressure area to reduce damping between the diaphragm and backplate, thereby improving the performance of the bone conduction package structure.
A bone conduction microphone is disclosed. The bone conduction microphone includes a substrate having a cavity with two end openings, a backplate disposed above the substrate, a vibration structure disposed between the backplate and the substrate, and a limiter for limiting a maximum displacement of the vibration structure. The vibration structure includes a diaphragm disposed between the backplate and the substrate and arranged at intervals with the backplate and the substrate respectively and a mass block suspended by the diaphragm and inserted into the cavity through one end opening of the cavity. The bone conduction microphone improves the reliability.
A MEMS microphone is disclosed. The MEMS microphone includes a substrate with a cavity, a backplate disposed above the substrate, a diaphragm disposed between the backplate and the substrate, and a limiting structure disposed in the cavity for limiting a maximum displacement of the diaphragm away from the backplate that is not less than a normal working displacement of the diaphragm away from the backplate. The MEMS microphone improves the reliability.
The present application provides a bone-conduction MEMS chip and a manufacturing method thereof, and a bone-conduction packaging structure having the bone-conduction MEMS chip. The bone-conduction MEMS chip includes a substrate having a cavity, a diaphragm supported on the substrate, and a back plate spaced apart on a side of the diaphragm away from the substrate. A side of the diaphragm away from the back plate is provided with a mass block. The mass block in the bone-conduction MEMS chip of the present application is formed directly on the diaphragm, and the bone-conduction packaging structure avoids setting the vibration sheet and the mass block additionally, resulting in lower costs, simpler packaging, and a smaller structure.
The present invention provides a MEMS package structure including a housing, a circuit board, a MEMS chip and an ASIC chip. The MEMS chip includes a diaphragm. The circuit board includes an upper and a lower surface. The circuit board includes a first acoustic hole extending from the lower surface, a second acoustic hole extending from the upper surface, and a communication channel. A projection of the first acoustic hole and a projection of the second acoustic hole along a vibration direction of the diaphragm are non-overlapped with each other. Some protruding structures are located in communication channel. The protruding structures cause a pressure of an airflow entering from the first acoustic hole to be 2-3.5 times the pressure of the airflow exiting from the second acoustic hole. The MEMS package structure of present invention has a stronger ability of anti-air-blowing.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
The present application provides a speaker module, including a casing, a speaker driver arranged in an accommodating cavity of the casing, a heat dissipation bracket, and a heat dissipation pipe arranged on the heat dissipation bracket outside the casing and abutted against the heat dissipation members outside the speaker module. The heat dissipation bracket is provided with a first cooling channel, which is arranged around the speaker driver. The heat dissipation pipe is provided with a second cooling channel communicated with the first cooling channel. Both the first cooling channel and the second cooling channel are filled with cooling liquid. The heat generated by the vibration of the speaker driver can be transferred to the outside through the cooling liquid in the first and so that the circulating flow of the cooling liquid is realized, and the heat dissipation efficiency of the heat dissipation bracket is improved.
The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.
Disclosed are a method and device for identification of accessory, an electronic device, and a non-transitory computer-readable storage medium. The method for identification of accessory includes: providing a host assembled with at least one accessory, where the host is provided with at least one detection element; obtaining status information of the at least one detection element, where each of the at least one accessory is provided with at least one trigger element, where the status information includes triggered and untriggered; determining arrangement of the at least one trigger element of the respective accessory according to the status information of each of the at least one detection element; and determining a type of the respective accessory according to the arrangement of the at least one trigger element. The method for identification of accessory achieves identification of type of accessory along with a reduced cost and occupied space.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
The present disclosure discloses a microphone including a housing, a printed circuit board assembled with the housing for forming a first cavity and a second cavity, a first chip component, a second chip component, and a first metal layer, the first chip component includes a first MEMS chip and a first ASIC chip, the second chip component includes a second MEMS chip and a second ASIC chip, the housing is fixed with a side of the first metal layer away from the printed circuit board. Compared with the related art, a microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.
The present invention provides a smart wearable device including a glass frame and a pair of temples. Each temple includes a shelf having a receiving room, a speaker unit and a microphone unit accommodated in the receiving room. The speaker unit includes a first sounding surface and a second sounding surface. The shelf includes an upper wall, a lower wall, and an outer wall. The outer wall provides with an auxiliary sound hole. The auxiliary sound hole is communicated with the second sounding surface. The outer wall provides with a microphone sound hole. The microphone sound hole is communicated with the microphone unit. An ultrasonic signal emitted from auxiliary sound hole reaches the microphone unit from the microphone sound hole after reflection. The smart wearable device of the present invention is suitable for gesture recognition or mode adjustment, and has more diversified functions.
The present invention provides a surface acoustic wave filter module packaging structure and packaging method thereof. Packaging structure includes a substrate, a surface acoustic wave filter chip, a non-filter chip, a dry film layer, and a plastic sealing layer. Filter chip is fixed to substrate by first convex structures, a cavity is formed between filter chip and substrate. Non-filter chip is fixed to substrate by second convex structures. Dry film layer includes a fracture area surrounding non-filter chip, plastic sealing layer is filled between substrate and non-filter chip through fracture area. The packaging structure and method thereof of the present invention can ensure that a cavity can be formed between the bottom of surface acoustic wave filter chip and substrate, convex structures are not easily broken, avoiding the use of injection molding processes based on wafer level packaging filters, reducing costs and damage to chips during reliability testing.
H03H 9/64 - Filtres utilisant des ondes acoustiques de surface
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
The present invention provides a surface acoustic wave filter module packaging structure and packaging method thereof. The packaging structure includes a substrate, a surface acoustic wave filter chip, a non-filter chip, a dry film layer, and a plastic sealing layer. The surface acoustic wave filter chip is fixed to the substrate by first convex structures, a first cavity is formed between the surface acoustic wave filter chip and the substrate. The non-filter chip is fixed to the substrate by second convex structures, a second cavity is formed between the non-filter chip and the substrate. The packaging structure and method thereof of the present invention can ensure that a cavity can be formed between the bottom of all chips and the substrate, avoiding the use of injection molding processes based on wafer level packaging filters, reducing costs and damage to chips during reliability testing.
H03H 9/64 - Filtres utilisant des ondes acoustiques de surface
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
The present invention provides a waterproof microphone device installed on a vehicle body. The vehicle body includes a frame having a circular opening. The waterproof microphone device includes an outer housing, a circuit board, a microphone, a cover, a first waterproof membrane, and a casing. An inner wall of the frame forming the opening gradually slopes inwardly from an outer surface to an inner surface of the frame. The casing includes a first wall, a second wall, and an outer sidewall. The outer sidewall gradually slopes inwardly from the first wall to the second wall to form an inclined annular sound channel between the inner wall of the frame enclosing the opening and the outer sidewall of the casing. In present invention, the waterproof microphone device can achieve better waterproof effect, and has a more stable structure with a beautiful appearance.
A directional microphone module is disclosed. The directional microphone module includes a sound-permeable mesh, a housing having a top wall and a side wall, a circuit board, and a MEMS microphone fixed to the circuit board. The circuit board and the top wall are spaced for forming a first cavity. The circuit board and the sound-permeable mesh are spaced for forming a second cavity. The two cavities are only communicated at a side, and the MEMS microphone locates at an opposite side. The MEMS microphone includes two acoustic holes, the first one faces the top wall and communicates with the first cavity, the second one faces the circuit board and communicates with the second cavity through a through hole of the circuit board. The directional microphone module can always work stably and has a simple structure, and also can improve the production efficiency and reduce the labor cost.
H04R 1/32 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement
A bone conduction microphone is disclosed. The bone conduction microphone includes a circuit board, a housing engaged with the circuit board, a metal cover engaged with the circuit board for forming a first cavity, a vibration assembly, and a MEMS chip disposed in the first cavity. The metal cover includes a top wall and a side wall. The vibration assembly engages with the top wall for forming a second cavity and includes a vibration member and a spacer member. A first conduction cavity is formed by the housing, the vibration assembly, the metal cover and the circuit board. A vibration of the vibration member is transmitted to one side of the MEMS chip through the first conduction cavity, an acoustic channel of the circuit board and a back cavity of the MEMS chip. The bone conduction microphone reduces the electromagnetic interference and improves the SNR.
The present disclosure discloses a microphone module including at least two MEMS microphones, a printed circuit board, and a shell, each of the MEMS microphones is provided a sound inlet hole, a plurality of first sound pickup holes are provided on the printed circuit board, a plurality of second sound pickup holes are provided on the shell, each of the first sound pickup holes is communicating with the corresponding sound inlet hole and the corresponding second sound pickup hole, a diameter dimension of each of the first sound pickup holes is D1 mm, a distance between a center axes of adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. Compared with the related art, the microphone module disclosed by the present disclosure could have a better sound recognition effect.
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
The present disclosure discloses an electromagnetic microphone including: a housing; a circuit board; and a sound transducer, including: a substrate including a back cavity, a vibrator mounted on a side of the substrate away from the circuit board and covering the back cavity, including: a membrane; and a magnetic component mounted on the membrane and configured to generate magnetic field; a coil located within the magnetic field of the magnetic component; a sound hole penetrated on the housing or the circuit board is configured to communicate with the back cavity; when external sound wave transmitted from the sound hole and the back cavity acts on the membrane, the magnetic component and the coil interact to generate electrical signal. The electromagnetic microphone in the present disclosure has higher sensitivity, reliability and stability.
The present disclosure relates to the technical field of machine housings, and provides a machine housing and an electronic device. The machine housing is applied to a mobile electronic terminal. The machine housing includes: an inner shell including an inner shell body and an accommodating groove formed by recessing from one side of the inner shell body; and an outer shell in an annular shape, wherein the housing extends around a periphery of the inner shell body and is fixed to the inner shell body. The outer shell is made of a titanium alloy material, the inner shell body is made of a metal material other than the titanium alloy material; and the outer shell and the inner shell body are fixedly molded into an integrated structure by a hot isostatic pressing process. Compactness, uniformity and performance of the machine housing may be improved by the hot isostatic pressing process.
A film bulk acoustic resonator, including: a substrate; an acoustic reflection structure; a bottom electrode; a piezoelectric film; a top electrode; and a raised frame. A spatial region formed by overlapping of the acoustic reflection structure, the bottom electrode, and the piezoelectric film and the top electrode in a thickness direction of the film bulk acoustic resonator is a resonance region, in which the raised frame is arranged, and openings are formed at a side of the raised frame away from the top electrode. The film bulk acoustic resonator can reduce the area ratio of the raised frame in the resonance region and the intensity of the parasitic resonance peak introduced by the raised frame without reducing the Q value of the resonator and without increasing manufacturing process steps.
The present application discloses a speaker box, including a casing with an accommodating cavity, and a sounding unit fixed in the accommodating cavity and dividing the accommodating cavity into a closed rear acoustic cavity and a front acoustic cavity communicated with an outside of the casing. The sounding unit is further provided with a heat exchange member, and a heat exchange cavity is formed in the heat exchange member. The heat exchange cavity is filled with a heat exchange medium, and part of the heat exchange element is exposed to the sounding unit. Compared with the prior art, in the present application, the sounding unit is provided with a heat exchange member. When the speaker box is in the working state, the sounding unit vibrates and generates heat, and the heat is conducted to the heat exchange medium in the heat exchange member through a wall of the heat exchange member. The heat exchange medium is in contact with the outside air of the sounding unit for heat exchange to release heat, thereby improving the heat dissipation efficiency of the speaker box.
A method for manufacturing radio frequency module, including: providing initial chip board including substrate and radio frequency modules fixed to the substrate, and the radio frequency module includes components; covering dry film on the initial chip board provided with the radio frequency modules, cavity is formed between the dry film, the components and the substrate; forming first metal layer on the dry film, forming plastic sealing layer on the first metal layer; forming second metal layer on the plastic sealing layer, the second metal layer is electrically connected to the first metal layer; and cutting the initial chip board along boundary between adjacent radio frequency modules to obtain single radio frequency module. The risk of short circuit of the radio frequency module can be effectively reduced, the electromagnetic shielding effect is better, and the production efficiency after electromagnetic shielding treatment is improved.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
The present application discloses a speaker box, including a casing with an accommodating cavity, and a sounding unit fixed in the accommodating cavity and dividing the accommodating cavity into a closed rear acoustic cavity and a front acoustic cavity communicated with an outside of the casing. A heat exchange cavity is arranged within a wall of the accommodating cavity, and the heat exchange cavity is filled with a heat exchange medium. Compared with the prior art, in the present application, the heat exchange cavity filled with the heat exchange medium is arranged in the casing. When the speaker box is in the working state, the sounding unit vibrates and generates heat, and the heat is conducted to the heat exchange medium through a wall of the accommodating cavity. The heat exchange medium is in contact with the outside air for heat exchange to release heat, thereby improving the heat dissipation efficiency of the speaker box.
The present application provides a speaker module, included a casing, a speaker driver arranged in an accommodating cavity of the casing, and a heat dissipation bracket. The heat dissipation bracket includes a body portion. A part of the body portion is arranged in the accommodation cavity, and the other part of the body portion is arranged outside the casing. One end of the body portion located outside the casing is provided with an extension portion bent and extended upward along a thickness direction of the speaker module, and the extension portion is in abutted against the heat dissipation members outside the speaker module. The body portion is provided with a first cooling channel, which is arranged around the speaker driver. The extension portion is provided with a second cooling channel communicated with the first cooling channel. The heat dissipation bracket provided by the present application has high heat dissipation efficiency.
The present disclosure discloses a sound transducer including a substrate; a back plate mounted on the substrate; a back plate electrode mounted on a side of back plate facing the substrate, including a plurality of first electrode plates arranged at intervals; a diaphragm electrode opposite to the back plate along a first direction, including: a plurality of second electrode plates arranged at intervals; and a center pillar arranged between the back plate and the diaphragm electrode, extending along the first direction; the plurality of first electrode plates surrounds the center pillar; the plurality of second electrode plates surrounds the center pillar; each second electrode plate is flexibly connected to the center pillar. The sound transducer in the present disclosure has sound localization function.
An electronic device, and a shell module for packaging an electronic device, comprising a first shell and a second shell connected through an engagement-locking structure with a protruding inserting portion arranged on a first side of the first shell. The inserting portion is located between two engagement portions on the first side of the first shell, an inserting space is formed between two engagement portions that are on a third side of the second shell and nearest to the inserting portion, and a non-inserting space is formed between two locking portions that are on a fourth side of the second shell and nearest to the inserting portion. An orthographic projection of the inserting portion onto the inserting space completely falls within the inserting space, and an orthographic projection of the inserting portion onto the non-inserting space is at least partially located outside the non-inserting space, avoiding incorrect assembly.
The present disclosure discloses a housing; a monolayer circuit board engaged with the housing for enclosing a receiving space, and including an acoustic channel; a vibration assembly received in the receiving space, dividing the receiving space into a first cavity and a second cavity; and a MEMS chip including a back cavity, received in the second cavity enclosed by the vibration assembly and the circuit board, and mounted on the circuit board; the acoustic channel is configured to connect the first cavity with the back cavity; an airflow generated by the vibration of the vibration assembly is transmitted to one side of the MEMS chip through the first cavity, the acoustic channel and the back cavity successively; the airflow is transmitted to the other side of the MEMS chip through the second cavity. The bone conduction microphone in the present disclosure has low height and higher sensitivity.
Provided is a manufacturing method for a micro-electro-mechanical microphone, including: providing a substrate, and forming a first baffle on the substrate; forming a diaphragm at a side of the first baffle, an orthographic projection of a periphery of the diaphragm towards the first baffle falling onto the first baffle; forming a second baffle at a side of the diagram at an interval, the second baffle being connected to the first baffle, and an orthographic projection of the second baffle towards the diaphragm at least partially falling onto a periphery of the diaphragm; forming a back-plate at a side of the second baffle at an interval, the back-plate including acoustic through-holes; and etching the substrate to form a back-cavity. The manufacturing method aims to improve a degree of freedom of the diaphragm to improve sensitivity of the micro-electro-mechanical microphone while improving the structural strength of the diaphragm.
A wearable apparatus is provided. The wearable apparatus includes a support, at least one first speaker, and the at least one second speaker. The at least one first speaker and the at least one second speaker are disposed in the support. When a user wears the wearable apparatus for using, the at least one second speaker respectively adjusts a waveform and a phase of a second sound wave signal according to sound wave features, such as waveform and phase, of a first sound wave signal. The second sound wave signal cancels at least a part of the first sound wave signal propagating in a second direction. Sound attenuation of the first sound wave signal in the second direction is increased, that is, the far-field isolation degree of the wearable device is improved through a cancellation effect of the at least one second speaker, a privacy effect thereof is better.
A voice wake-up method, an electronic device, and a computer-readable storage medium are provided. The voice wake-up method comprises collecting an original voice signal input by a user; generating pulse density modulation data according to the original voice signal; decoding the pulse density modulation data to generate decoded data; performing preprocessing and feature extraction processing on the decoded data to generate voice features; performing pattern matching on the voice features according to a hidden Markov model to generate a recognition result; and waking up an external processor of the electronic device according to the recognition result. In the voice wake-up method, a voice wake-up function of the electronic device is realized, which reduce the power consumption of the electronic devices while improving the accuracy of voice wake-up.
G10L 15/14 - Classement ou recherche de la parole utilisant des modèles statistiques, p. ex. des modèles de Markov cachés [HMM]
G10L 15/02 - Extraction de caractéristiques pour la reconnaissance de la paroleSélection d'unités de reconnaissance
G10L 15/22 - Procédures utilisées pendant le processus de reconnaissance de la parole, p. ex. dialogue homme-machine
G10L 15/30 - Reconnaissance distribuée, p. ex. dans les systèmes client-serveur, pour les applications en téléphonie mobile ou réseaux
G10L 19/038 - Quantification vectorielle, p. ex. TwinVQ audio
G10L 25/21 - Techniques d'analyse de la parole ou de la voix qui ne se limitent pas à un seul des groupes caractérisées par le type de paramètres extraits les paramètres extraits étant l’information sur la puissance
G10L 25/24 - Techniques d'analyse de la parole ou de la voix qui ne se limitent pas à un seul des groupes caractérisées par le type de paramètres extraits les paramètres extraits étant le cepstre
The present invention provides a smart wearable device includes a glass frame and two temples. Each temple includes a shelf, a cover plate, and a speaker. The speaker includes a first and a second sounding surface. The shelf includes an upper wall, a lower wall, and an outer wall. The upper wall has a first sound hole, the lower wall has a second sound hole, the outer wall has a third sound hole. The speaker has an inner cavity communicated with the first sound hole. The first sounding surface is communicated with the second sound hole. The second sounding surface is communicated with the third sound hole. Two front cavities of the smart wearable device of present invention are independent of each other, and each has an independent sound hole, so that the two cavities can independently produce sound, the back cavity plays a role in preventing sound leakage.
A power supply device and a terminal are provided. The power supply device includes a battery module and at least one optical display module, the battery module is electrically connected to the at least one optical display module, the battery module is configured to supply electrical signals to the at least one optical display module, so that the battery module directly supplies power to the at least one optical display module, which reduces a length of a power supply circuit and further reduces a width of the power supply circuit.
A gimbal device includes a lifting module, a horizontal rotating module, a rotating shaft, a pitch module, and a swing module, the lifting module includes a driving piece, a transmission worm, and a gear rack, the horizontal rotating module includes a driving piece, a first synchronous pulley, and a bearing assembly, the first synchronous pulley drives the bearing assembly to rotate, the rotating shaft is connected with the bearing assembly, the pitch module includes a driving piece, a first transmission gear, and a fixed gear, the third driving piece rotates around the fixed gear, the swing module includes a driving piece, a second transmission gear, a swing gear, and a swing housing, the swing housing rotates around the swing gear. The gimbal device is capable of performing four-axis motion, and modules of the gimbal device are disposed compactly, the four-axis motion is realized in a small space.
F16M 11/12 - Moyens pour la fixation des appareilsMoyens permettant le réglage des appareils par rapport au banc permettant la rotation dans plus d'une direction
F16M 11/18 - Têtes des supports avec mécanisme déplaçant les appareils par rapport au banc
A diopter adjustment device and a virtual reality (VR) apparatus are provided. The diopter adjustment device includes a lens mounting part, a guide adjustment part, and a driving part. The lens mounting part is configured to mount a lens module. The guide adjustment part is connected to the lens mounting part, the guide adjustment part moves along a preset path to drive the lens mounting part to move along a first direction, and the driving part is configured to drive the guide adjustment part to move along the preset path. Compared with the prior art, the diopter adjustment device includes the lens mounting part, the guide adjustment part, and the driving part, the driving part drives the guide adjustment part to move along the preset path, so as to drive the lens mounting part to reciprocate to automatically adjust the diopters.
G02B 7/10 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement par déplacement axial relatif de plusieurs lentilles, p. ex. lentilles d'objectif à distance focale variable
A speaker module and a smart headset are provided. The speaker module includes a speaker housing, a first sounding unit, and a second sounding unit. An accommodating cavity is defined in the speaker housing, the accommodating cavity includes a first space and a second space. The first sounding unit is fixed in the accommodating cavity, the first sounding unit divides the first space into a first rear sound cavity and a first front sound cavity. The second sounding unit is fixed in the accommodating cavity, the second sounding unit divides the second space into a second rear sound cavity and a second front sound cavity. The speaker provides a first speaker hole and a second speaker hole defined on the same surface of the speaker housing, which supplements and superposes sound of the speaker module and further improves an overall frequency range and loudness of the speaker.
H04R 1/24 - Combinaisons structurelles de transducteurs séparés ou de parties du même transducteur et sensibles respectivement à plusieurs bandes de fréquences
H04R 1/02 - BoîtiersMeublesMontages à l'intérieur de ceux-ci
H04R 1/26 - Dispositions dans l'espace de transducteurs séparés sensibles à plusieurs bandes de fréquences
The present invention provides a smart wearable device includes a glass frame and a pair of temples. The glass frame includes a connecting portion. Each temple includes a shelf, a cover plate, and a rotating shaft assembly matched with the connecting portion. The shelf includes an upper wall and a lower wall. The rotating shaft assembly includes a first rotating shaft bracket, a second rotating shaft bracket, a screw, and a positioning bead assembly. The positioning bead assembly is movably connected between the first and the second rotating shaft bracket to realize a folded and an unfolded state of the smart wearable device. The smart wearable device of the present invention uses a rotating shaft assembly to realize the folded and unfolded states. The smart wearable device has a simple structure, requirements of the processing accuracy and assembly accuracy of components are low, and the development cost is low.
The present disclosure discloses a MEMS microphone, including: a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the fixing portion are spaced apart from each other by a slit, the fixing portion includes a plurality of releasing portions, and the releasing portions pass through the fixing portion. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability of the back plate.
The present application provides a film bulk acoustic resonator, including a substrate, an acoustic reflection structure arranged on one side of the substrate, a bottom electrode stacked on one side of the acoustic reflection structure, a piezoelectric film covered on the bottom electrode and a top electrode stacked on a side of the piezoelectric film away from the bottom electrode. An interdigital protrusion frame is provided on a side of the top electrode away from the piezoelectric film, and the interdigital protrusion frame includes a first protrusion frame and a second protrusion frame arranged at intervals. The first protrusion frame and the second protrusion frame respectively extend toward each other and overlap each other to form at least a pair of interdigital structures, and each of the interdigital structures includes two forks spaced apart by a preset distance along an overlapping direction.
A microphone module includes a housing with a receiving space and a microphone mounted in the receiving space. The microphone module further includes a heat-conducting ring embedded in the housing and a heating unit connected to the heat-conducting ring. A sound hole corresponding to a position of the microphone is formed inside the heat-conducting ring. The heating unit is configured to provide heat for the heat-conducting ring. The defrosting method includes the following steps: enabling a heating action of the heating unit in response to a heating instruction; and detecting current performance of the microphone, and disabling the heating action of the heating unit if the current performance of the microphone is normal. According to the solution, water, frost or ice can be removed from the sound hole to prevent clogging of the sound hole, thereby ensuring normal performance of the microphone.
An MEMS microphone includes a substrate with a back cavity and a capacitor system arranged on the substrate. The capacitor system includes a back plate and a diaphragm opposite to and spaced apart from the back plate. Surface of the back plate facing diaphragm or surface of diaphragm facing the back plate being provided with an anti-adhesion member. When the diaphragm moves until the anti-adhesion member is in contact with the diaphragm and the back plate at the same time, the anti-adhesion member is elastically deformable along a vibrating direction of the diaphragm. The anti-adhesion member of the present disclosure is elastic and may provide cushioning for movement of the diaphragm, which prevents rapid concentration of stress at a position of the diaphragm in contact with the anti-adhesion member, thereby preventing formation of pits in the diaphragm and preventing breakage of the diaphragm under repeated impact of the anti-adhesion member.
A speaker module and an assembling method of the speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, and the vibration system and the magnetic circuit system are accommodated in the accommodation space. The housing includes a frame, an upper cover plate, and a lower cover plate. The frame includes a side wall. When the upper cover plate and the lower cover plate are assembled on the frame, the frame, the upper cover plate, and the lower cover plate form an outer housing. An assembling process of the speaker module is simplified from two separate assembly processes of the speaker monomer and the speaker module into single assemble process of the speaker module, which reduces processing difficulty and cost.
The present disclosure discloses a MEMS microphone chip having a substrate with a back cavity, a back plate fixed to the substrate, and a diaphragm unit opposite to the back plate. The diaphragm unit includes a first diaphragm spaced apart from the back plate, a support member fixed on a side of the first diaphragm away from the back cavity, and a second diaphragm spaced apart from the first diaphragm. The second diaphragm includes a support portion fixed to the support member and a free end. The first diaphragm is utilized to drive the second diaphragm having the free end so that the vibration of the second diaphragm from is no longer subject to its thickness and stress, thus significantly improving the sensitivity of the MEMS microphone chip and accordingly improving the SNR.
H04R 7/24 - Dispositions pour monter ou pour tendre des membranes ou des cônes pour tendre par des moyens agissant directement sur la partie libre de la membrane ou du cône
H04R 1/22 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique de fréquence désirée uniquement
H04R 7/18 - Dispositions pour monter ou pour tendre des membranes ou des cônes à la périphérie
A speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, the vibration system is accommodated in the accommodation space, and the magnetic circuit system is accommodated in the accommodation space and is configured to drive the vibration system. The housing includes a supporting frame, a front cover, and a rear cover. The vibration system and the magnetic circuit system are directly assembled with the housing to obtain the loudspeaker module. Compared with the related art, an assembling process of the speaker module is simplified from two separate assembly processes of a speaker and a module into single assemble process of the speaker, which provides a simple assembling process and further reduces the cost.
The present invention provides a sounding device including a housing body having a containment cavity and a sounding unit placed in the containment cavity. The sounding unit includes a vibration system and a magnetic circuit system. The sounding device includes a box, a coil, a circuit board, and an elastic assembly. The elastic assembly is used to suspend the box in the containment cavity. The present invention coil shares a magnetic circuit system with the vibration system and the sounding unit is directly used as the weight unit of the coil. The parts are shared to the greatest extent, the assembly process is simplified, and the cost is reduced.
The present invention provides a speaker including a chamber filled with the sound absorbing material. The chamber is also filled with expandable foam that is triggered to expand in volume to limit the movement of the sound absorbing material in the chamber. The speaker provided by the present invention improves the reliability of the filled sound absorbing material.
The present disclosure discloses a Micro-Electro-Mechanical System (MEMS) microphone including a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate, the diaphragm located on a side of the back plate close to the substrate; a support member located between the diaphragm and the back plate; a blocking portion arranged on a side of the back plate facing the diaphragm; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the back plate are fixedly connected by the support member, a projection of the blocking portion along a vibration direction of the diaphragm is located within the vibration portion of the diaphragm. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high signal-to-noise ratio.
The present invention provides a single-end-to-differential microphone circuit, including a power supply end for inputting a first bias voltage, a microphone capacitor, a coupling capacitor, a first primary amplifier, a second primary amplifier, a signal processing module, current sharing amplifier, a feedback resistor at positive end, a feedback capacitor at positive end, a feedback resistor at negative end, a feedback capacitor at negative end. Compared with the prior art, the single-end-to-differential microphone circuit of the present invention can utilize the current sharing amplifier with a small input common mode voltage range and low noise to realize the single-end-to-differential of the signal, which is beneficial to improve the signal to noise ratio of the circuit.
FB1. The circuit of the present invention can adopt a microphone structure with smaller capacity, and at the same time has a better system signal to noise ratio.
The invention provides a microphone circuit, which includes an amplifier, a bias resistor and a bias network module. The first terminal of bias resistor connects to the preset bias voltage. The second end of the bias resistor connects the output end of the microphone. The bias network module is used to judge level of the voltage value of the signal. If the voltage value of the signal exceeds the preset voltage value of the threshold voltage group range, connect the impeder corresponding to the bias network module to the input end of the microphone circuit. The invention provides a microphone module and a method for raising sound pressure overload point of microphone. Compared with the related art, the technical scheme of the invention improves the sound pressure overload point of microphone and has good electrical performance.
Disclosed are a directional bilateral sound intake-based MIC assembly and an electronic device. The electronic device includes the directional bilateral sound intake-based MIC assembly. The MIC assembly includes a front shell with paired sound inlet holes and a microphone arranged on an inner side of the front shell. The microphone has two receiving holes. The MIC assembly further includes a fixture assembled within the inner side of the front shell. An assembling chamber and two sound inlet channels in communication with the assembling chamber are defined in the fixture. The microphone is mounted within the assembling chamber. The two receiving holes of the microphone are in communication with the two sound inlet channels respectively. The two sound inlet channels are in communication with a same pair of two sound inlet holes respectively.
H04R 1/02 - BoîtiersMeublesMontages à l'intérieur de ceux-ci
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
66.
Microphone amplifying circuit design method and microphone amplifying circuit
The present invention provides a microphone amplifying circuit including an amplifier, a bias resistor, an input end, an output end, a microphone capacitor, a first parasitic capacitor and a second parasitic capacitor. The first parasitic capacitor is connected to the input end, and the other end of the first parasitic capacitor is connected to the output end. The second parasitic capacitor is connected to the output end, and the other end of the second parasitic capacitor is grounded. The first parasitic capacitor and the second parasitic capacitor are formed after adding a layer of underlying metal between the substrate of the integrated circuit and the welding plate. Compared with the related art, the microphone amplifying circuit design method and the microphone amplifying circuit of the present invention have higher signal to noise ratio and better performance.
H03F 3/187 - Amplificateurs à basse fréquence, p. ex. préamplificateurs à fréquence musicale comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
The present disclosure discloses a MEMS microphone including a shell, a substrate assembled with the shell for forming a receiving space, an ASIC Die, a MEMS Die including a diaphragm and a back plate, and an elastic member. The diaphragm divides the receiving space into a front chamber and a rear chamber, the substrate comprises a first acoustic hole, a second acoustic hole, a connecting channel, and a ventilation hole, the MEMS Die covers the first acoustic hole which is communicating with the front chamber, the ventilation hole is communicating with the connecting channel and the rear chamber, the elastic member covering the ventilation hole is used for opening or closing the ventilation hole. Compared with the related art, a MEMS microphone disclosed by the present disclosure could have with high blowout resistance.
A MEMS microphone includes substrate, housing, MEMS chip and ASIC chip. The substrate is provided with sound inlet channel communicating the receiving space with the outside. The MEMS chip includes diaphragm located on sound inlet path of sound inlet channel. The sound inlet channel includes buffering cavity, first sound inlet hole, and second sound inlet hole provided in the substrate and communicating the buffering cavity with the back cavity. The second sound inlet hole includes at least two sub-holes spaced apart from each other. When external air pressure enters the sound inlet channel, the air pressure entering from the first sound inlet hole may not directly act on the diaphragm through the second sound inlet hole, and the sub-holes can further block the airflow, which can effectively buffer the impact of the air pressure on the diaphragm, reduce diaphragm rupture, and improve reliability and performance of the MEMS microphone.
Provided is a diaphragm and a micro-electromechanical system (MEMS) microphone. The diaphragm includes a vibrating portion and a support structure. The support structure includes a cantilever portion. Lengths of the first and second anchoring portion both extend along a circumferential direction of the vibrating portion, and a length extension direction of the first anchoring portion is opposite to that of the second one. The lengths of the first and second anchoring portions both extend along the circumferential direction of the vibrating portion, and the length extension direction of the first anchoring portion is opposite to that of the second one, so that the first and second anchoring portions and the cantilever portion are connected in a T shape. A vibration displacement range of the diaphragm is larger, thereby improving sensitivity and compliance of the MEMS microphone.
A trigger module with force feedback includes a housing including an installation groove; a trigger swing bar rotatably connected to the housing; and a transmission device connected to the trigger swing bar. the transmission device includes a one-way transmission module engaged with the trigger swing bar, a driving module connected to the one-way transmission module and installed in the installation groove, and a driving member configured to drive the driving module. The driving member is connected to the driving module and installed in the housing; and the one-way transmission module includes two ends connected to the driving module and the trigger swing bar respectively. The trigger swing bar will not drive the driving member to reverse or drag the driving member when the trigger swing bar returns. Therefore, the trigger swing bar can quickly return, thereby providing users with good gaming experiences.
G05G 1/04 - Organes de commande actionnés à la main par un mouvement de pivotement, p. ex. leviers
A63F 13/24 - Parties constitutives, p. ex. manettes de jeu avec poignées amovibles
A63F 13/28 - Dispositions de sortie pour les dispositifs de jeu vidéo répondant à des signaux de commande reçus du dispositif de jeu pour influer sur les conditions ambiantes, p. ex. pour faire vibrer les sièges des joueurs, activer des distributeurs de parfums ou agir sur la température ou la lumière
A63F 13/285 - Génération de signaux de retour tactiles via le dispositif d’entrée du jeu, p. ex. retour de force
G05G 5/03 - Moyens pour attirer l'attention de l'opérateur sur l'arrivée de l'organe de commande dans une position de commande ou de repèreCréation d'une sensation, p. ex. moyens pour générer une force antagoniste
71.
METHOD FOR CAPTURING CONTROL AND RELATED APPARATUS
Provided is a method for capturing control and a related apparatus. A Bluetooth earphone case is provided with a capturing module and a communication module. Firstly, a target communication connection is established with a terminal device based on the communication module. Then, a capturing control instruction sent by the terminal device is received based on the target communication connection. Next, the capturing module is controlled to trigger a corresponding image capturing state. Finally, a target captured image is sent to the terminal device based on the target communication connection. The terminal device may control the capturing module on the Bluetooth earphone case to realize a capturing function, that is, the terminal device is provided with the capturing function and capturing performance support by expanding the capturing function of the Bluetooth earphone case, which satisfies a capturing requirement of a terminal user and ensure miniaturization of the terminal device.
The present disclosure provides a shell with a receiving cavity, an infrared transmitter and an acoustic sensor accommodated in the receiving cavity, and a flexible film connected with the side wall, the shell includes a cover, a substrate, and a side wall, the flexible film divides the receiving cavity into a first cavity and a second cavity, the infrared transmitter is located in the first cavity, the acoustic sensor is located in the second cavity, the shell comprises a vent hole communicating with an outside and the first cavity, the flexible film, the first cavity and the second cavity form a resonant system, an intrinsic frequency of the resonant system is the same as a modulation frequency of the infrared transmitter. Compared with the related art, the gas sensor disclosed by the present disclosure could improve the sensitivity of the product.
The present disclosure discloses a MEMS microphone including a substrate with a back cavity and a capacitive system arranged on the substrate, the capacitive system includes a back plate and a diaphragm opposite to the back plate, the diaphragm is located between the substrate and the back plate, the diaphragm is provided with a through hole, the back plate includes a body portion, an extension post extending from the body portion towards the substrate and penetrating the through hole, and a spacer connected to the extension post, the spacer is located between the diaphragm and the substrate, one end of the extension post is connected to the body portion of the back plate, the other end of the extension post is connected to the spacer. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability.
A vehicle-mounted microphone system, including a microphone module and a vehicle body on which the microphone module is mounted. The vehicle body includes an outer surface facing the outside of a vehicle and an inner surface arranged opposite to the outer surface. The microphone module is mounted on the inner surface. The vehicle body is provided with a sound inlet channel of the microphone module. The sound inlet channel includes an arched channel and a sound hole communicated with the arched channel. A first-end opening and a second-end opening of the arched channel are formed on the outer surface and are spaced apart from each other. The sound hole is communicated with the arched channel at the top of the arched channel and forms a sound hole opening on the inner surface. The microphone module receives sound through the sound hole opening.
B60R 11/02 - Autres aménagements pour tenir ou monter des objets pour postes radio, de télévision, téléphones, ou objets similairesDisposition de leur commande
An electronic cigarette includes a cigarette body housing and a MEMS sensor located in the cigarette body housing. The MEMS sensor includes a shell with a receiving cavity, a MEMS Die with a back cavity received in the receiving cavity, an ASIC Die located in the receiving cavity and electrically connected to the MEMS Die, a first waterproof breathable membrane fixed to the shell and completely covering the first acoustic hole, and a second waterproof breathable membrane fixed to the shell and completely covering the second acoustic hole. The shell includes a first acoustic hole and a second acoustic hole penetrating the shell and communicating with the receiving cavity and an outside. Compared with the related art, the MEMS sensor disclosed by the present disclosure provides a MEMS Die with good performance.
An electronic cigarette, including cigarette housing and micro-electromechanical system (MEMS) airflow sensor received in the cigarette housing. The MEMS airflow sensor includes a printed circuit board (PCB), an upper cover that covers PCB and encloses a receiving space together with PCB, and application specific integrated circuit (ASIC) chip and an MEMS chip with back cavity that are fixed to PCB and electrically connected to each other. The upper cover is provided with first sound hole passing therethrough. A side of PCB close to the upper cover and a side of PCB away from the upper cover are respectively provided with an upper metal layer and a lower metal layer that are exposed to a surface of PCB and are electrically connected to each other. A projection of ASIC chip on PCB at least partially falls within a range of the upper metal layer.
A24F 40/40 - Détails de construction, p. ex. connexion des cartouches et des batteries
G01F 1/20 - Mesure du débit volumétrique ou du débit massique d'un fluide ou d'un matériau solide fluent, dans laquelle le fluide passe à travers un compteur par un écoulement continu en utilisant des effets mécaniques par détection des effets dynamiques de l’écoulement
An electronic cigarette includes an atomizer, an e-liquid cavity, and an airflow sensing device. The airflow sensing device includes a first circuit board, a MEMS airflow sensor, and a main control IC. A second control board includes a first bonding pad and a second bonding pad. The second bonding pad is disposed around the first bonding pad. The first bonding pad includes a first pin and the second bonding pad includes a second pin. Since the first bonding pad is surrounded and sealed by the second bonding pad, the first pin is electrically connected to a capacitance detection port of the main control IC, and the second pin is grounded, condensate is prevented from contacting the first pin, thus preventing the condensate from flowing through a capacitance detection circuit. The main control IC does not detect an increase in capacitance value, which prevent the electronic cigarette from self-starting.
The present disclosure discloses a microphone module including a housing having a first sound channel penetrating thereon, a first support member, a first microphone mounted on the first support member and configured to pick up sound signal in full frequency rage, and a second microphone mounted on the first support member and configured to pick up sound signal in a frequency range of 700-1500 Hz; a first sound hole corresponding to the first microphone and a second sound hole corresponding to the second microphone are provided on the first support member; external sound wave entering the first sound channel is transmitted to the first microphone through the first sound hole; external sound wave entering the first sound channel is transmitted to the second microphone through the second sound hole. The microphone module in the present disclosure can balance the functions of external voice control, and siren detection and penetration.
H04R 1/24 - Combinaisons structurelles de transducteurs séparés ou de parties du même transducteur et sensibles respectivement à plusieurs bandes de fréquences
A MEMS microphone, includes a substrate with a back cavity, and a capacitive system including a back plate and a diaphragm located on the substrate, the back plate includes a body portion and a first protrusion, the diaphragm includes a main portion and a second protrusion, the first protrusion is corresponding to the second protrusion, the substrate includes an upper end close to the capacitive system and a lower end away from the capacitive system, an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the resonant frequency.
The present disclosure provides a gas sensor including a shell with a receiving cavity, an acoustic sensor, a partition plate and a flexible film accommodated in the receiving cavity. The partition plate and the flexible film jointly divide the receiving cavity into a first cavity and a second cavity, the first cavity is a sealed cavity formed by the joint enclosure of the flexible film, the partition plate, the side wall and the substrate. The acoustic sensor is located in the first cavity, the infrared transmitter is located in the second cavity. Compared with the related art, the gas sensor disclosed by the present disclosure could improve the sensitivity of the product.
A MEMS sensor, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the MEMS sensor includes a first back plate assembly and a diaphragm opposite to the first back plate assembly. The first back plate assembly includes a first back plate and a second back plate, the first back plate includes a plurality of a first back plate holes, the second back plate includes a plurality of a second back plate holes, each first back plate hole and each second back plate hole are staggered with each other in a vibration direction of the diaphragm. Compared with the related art, the MEMS sensor disclosed by the present disclosure could play a good dustproof effect.
The present disclosure provides a gas sensor, including a shell with a receiving cavity, an infrared transmitter, an acoustic sensor and a partition plate accommodated in the receiving cavity. The partition plate is connected with the substrate and the side wall, the partition plate divides the receiving cavity into a first receiving cavity and a second receiving cavity, the acoustic sensor is located in the first receiving cavity, the infrared transmitter is located in the second receiving cavity. Compared with the related art, the gas sensor disclosed by the present disclosure could improve the sensitivity of the product.
G01N 21/17 - Systèmes dans lesquels la lumière incidente est modifiée suivant les propriétés du matériau examiné
G01N 21/3504 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge pour l'analyse des gaz, p. ex. analyse de mélanges de gaz
83.
Vibration control method, vibration control device, and non-transitory computer-readable storage medium
A vibration control method, a vibration control device, and a non-transitory computer-readable storage medium are provided. Target effect parameters are obtained in a preset vibration effect design model with reference to a haptic effect demand index, effect parameters in the vibration effect design model including a granularity parameter, a sharpness parameter and a hardness parameter. A vibration control signal is generated based on the target effect parameter. The actuator is controlled to vibrate based on the vibration control signal. With the implementations of the present disclosure, the vibration control models of the actuator can be adaptively designed based on different haptic effect demand scenarios, thereby ensuring the diversity of haptic effects and the adaptability to the scenarios. A variety of perception factors are considered in the vibration effect of the actuator, thereby providing the user with a more complex haptic feedback experience.
Disclosed are a method and a system of audio signal processing for in-vehicle virtual multichannel sound, and an electronic device. The method includes: obtaining an audio input signal in a single audio channel; identifying different frequency components in the audio input signal; assigning audio data in different frequency bands of the audio input signal to different signal paths according to the different frequency components; performing a digital signal processing on the audio data from different signal paths to obtain a plurality of single-channel signals in different frequency bands; and combining the plurality of single-channel signals into a single-channel audio output signal and outputting it. The present application not only realizes individual digital signal processing of different frequency bands for multiple speakers connected in parallel to a single audio channel, to improve the sound quality of the whole vehicle, but also reduces the cost of the whole vehicle.
Smart wearable glasses include a frame, temples, a vibration unit, and a sounding unit including a housing having an accommodation space and an inverted channel, a sounding driver fixed in the accommodation space, and an inverted tube. A first sound outlet hole, a first inverted hole, and a first leakage hole are arranged through the housing. The accommodation space is separated into a front cavity and a coupled rear cavity. The front cavity is connected to the outside world through the first sound outlet hole. The inverted tube is connected to the outside world through the inverted channel and the first inverted hole. The coupled rear cavity is connected to the outside world through the first leakage hole and the inverted tube. A phase of an acoustic wave emitted through the first sound outlet hole is opposite to that of an acoustic wave emitted through the first leakage hole.
Disclosed are a motion-sensing in-vehicle alerting method, a system, and a related device, which are applied to vehicles. The method includes steps of: obtaining, by a controller, an audio signal from an in-vehicle audio bus; performing an acoustic characteristics analysis on the audio signal, and extracting an acoustic waveform of the audio signal in a time domain waveform; performing an amplitude modulation on a sinusoidal signal of the acoustic waveform to obtain a modulated sinusoidal signal after amplitude modulation; obtaining, by the controller, a control signal indicating operational behavior information from an in-vehicle control bus, matching the control signal with the modulated sinusoidal signal according to a predetermined rule to generate a vibration signal, and transmitting the vibration signal to the excitation oscillator to achieve a vibration alert. The method of the present application not only enhances safety, but also provides the vibration alert, resulting in an improved user experience.
Provided is a sealed dual membrane (SDM) structure and a device including the same. The SDM structure according to the present invention includes a substrate, a first vibrating membrane and a second vibrating membrane disposed on the substrate, which form a sealed cavity together with the substrate, a first back electrode plate and a second back electrode plate disposed between the vibrating membrane and the second vibrating membrane, and a conductor plate unit disposed between the first back electrode plate and the second back electrode plate. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate unit, and the conductor plate unit forms a capacitor structure with each of the first back electrode plate and the second back electrode plate. The present invention reduces the number of pillars required in the SDM structure and increases the sensitivity of the device including the SDM.
Provided is an optical microphone, including a case including an inner cavity and a sound inlet aperture that makes the inner cavity communicate with exterior; a micro-electromechanical module in the inner cavity and including a flexible film and a grating; an optoelectronic module in the rear cavity and including a light source and a light beam detector; and an integrated circuit module in the rear cavity and electrically connected to the micro-electromechanical module and the optoelectronic module. The optoelectronic module and the integrated circuit module are provided on a same chip; a reflective layer is provided at a side of the flexible film facing the light source, and another reflective layer is provided at a side of the grating facing the light source. The microphone has following beneficial effects: connection wires are less and crosstalk noise between wires is reduced, thereby achieving easier package manufacturing and better package miniaturization.
A microphone is provided. The microphone includes a housing having an accommodating cavity, a circuit board fixed to the accommodating cavity, an interface assembly fixed to an outer side of the housing and electrically connected to the circuit board, and a microphone unit fixed to the circuit board. The housing includes a shell having the accommodating cavity and a cover plate fixed to the housing and covering the accommodating cavity, the interface assembly is fixed to one side of the shell away from the cover plate, an insertion direction of the interface assembly is perpendicular to a surface of the circuit board. The microphone cancels the weak connecting plate, which can enhance the connection strength between interface assembly and the housing, which is conducive to miniaturizing the microphone and allowing it to flexibly adapt to different installation methods.
A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.
An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; a MEMS module including a diaphragm suspended in the inner cavity, a light flap is formed in the diaphragm, when an acoustic pressure is applied, an aperture is formed by opening of the light flap, and a size of the aperture increases or decreases with a magnitude of the acoustic pressure applied; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, and a light beam passes through the aperture to the sensor; and an integrated circuit module electrically connected with the optoelectronic module. Advantages of high sensitivity and flat frequency response are realized.
An MEMS optical microphone, including: a case, a membrane, a waveguide plate, a variable optical waveplate, an optoelectronic module, and an IC module. The case includes a cavity and a sound inlet. The membrane is suspended in the cavity and closes the sound inlet. The waveguide plate is suspended in the cavity and located at a side of the membrane away from the sound inlet. The optoelectronic module includes an electromagnetic radiation source and a sensing part provided at two opposite sides of the waveguide plate, respectively. The variable optical waveplate is configured to convert an input polarization state of the first light path into an output polarization state, which varies as a moving distance of the variable optical waveplate. The IC module is electrically connected to the membrane and the optoelectronic module. It has advantages such as high sensitivity, flat frequency response, thereby further improving the device performance.
H04R 23/00 - Transducteurs autres que ceux compris dans les groupes
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
An MEMS optical microphone, including a casing including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, an aperture is provided penetrating through the diaphragm, and a size of the aperture increases or decreases with acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the aperture, and a size of the light beam is larger than a maximum size of the aperture; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Dynamic range of the MEMS optical microphone is improved, wider range of sound signals can be sensed, and higher sensitivity can be realized.
A method for eliminating sound leakage includes: controlling, upon detecting call voice being outputted by a receiver, a collection device to determine a first frequency response curve of first sound wave of the call voice at a first position outside a terminal device; controlling a speaker to generate a second sound wave; controlling the collection device to determine a second frequency response curve of the second sound wave at the first position; and regulating, according to the first frequency response curve, the second frequency response curve to a third frequency response curve. Frequency responses of the first and third frequency response curves at a corresponding frequency are superimposed on and cancel each other. The speaker actively generates second sound wave that is modulated according to a parameter of first sound wave, so as to ensure that second sound wave effectively eliminates leakage of call content caused by first sound wave.
G10K 11/178 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général utilisant des effets d'interférenceMasquage du son par régénération électro-acoustique en opposition de phase des ondes acoustiques originales
95.
Method and apparatus for eliminating sound leakage
The present application relates to a method and apparatus for eliminating sound leakage which includes: determining a first frequency response curve of a first sound wave generated by the call voice at a first position outside a terminal device; controlling a vibration motor to drive a rear housing of the terminal device to vibrate to generate a second sound wave; determining a second frequency response curve of the second sound wave at the first position; and regulating the second frequency response curve to a third frequency response curve, frequency response of the third frequency response curve being superimposed on and canceling frequency response of the first frequency response curve at a corresponding frequency. The vibration motor drives the rear housing to vibrate to actively generate the second sound wave superimposed on and canceling the first sound wave generated by call sound leakage, so as to eliminate leakage of call content.
A sound-absorbing material block, a method for preparing the same and application thereof are provided. The sound-absorbing material block includes three-dimensional open-cell foam, sound-absorbing material powder, a binder, a gel, and a cross-linking agent. The sound-absorbing material powder is bonded to each other and connected to the three-dimensional open-cell foam by means of the gel, the cross-linking agent, and the binder, by mass of the sound-absorbing material powder, the gel accounts for 1 wt % to 5 wt % of the sound-absorbing material powder, and the binder accounts for 1 wt % to 8 wt % of the sound-absorbing material powder, and by mass of the gel, the cross-linking agent accounts for 1 wt % to 10 wt % of the gel. The sound-absorbing material block according to the present disclosure reduces an additive amount of the binder, and significantly improves sound-absorbing performance and strength of the material block.
C09D 125/18 - Homopolymères ou copolymères de monomères aromatiques contenant des éléments autres que le carbone et l'hydrogène
C09D 133/04 - Homopolymères ou copolymères d'esters
H04R 1/02 - BoîtiersMeublesMontages à l'intérieur de ceux-ci
H04R 1/28 - Supports de transducteurs ou enceintes conçus pour réponse de fréquence spécifiqueEnceintes de transducteurs modifiées au moyen d'impédances mécaniques ou acoustiques, p. ex. résonateur, moyen d'amortissement
A MEMS microphone, includes a substrate with a back cavity, and a capacitive system located on the substrate, including a back plate and a diaphragm opposite to the back plate, wherein the back plate includes a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the strength of the back plate.
A microphone chip and a microphone are provided. The microphone chip includes a diaphragm and a back plate. When the sound wave drives the diaphragm to vibrate through the sound hole, a distance between the electrode sheet and the diaphragm changes, and a capacitance value of the capacitance system changes, thereby converting the sound wave signal into an electrical signal. In the direction perpendicular to the back plate, the outer contour of the projection of each protrusion on the diaphragm and an outer contour of a corresponding fold of the plurality of folds do not intersect, so as to prevent the protrusion from contacting and getting stuck with the side wall of the fold in the process of external vibration or excessive blowing, which may lead to adhesion between the diaphragm and the back plate and affection of the normal operation of the microphone chip.
A microphone chip is provided and includes a substrate and a capacitive system. The capacitive system includes a diaphragm and a back plate. The diaphragm includes an inner membrane portion, an outer membrane portion, and at least one supporting portion. The inner membrane portion and the outer membrane portion of the microphone chip are separated by a slit, and the at least one supporting portion is connected with the fixing portion to fix the diaphragm, so that the diaphragm is in a cantilever state. By arranging the sealing element between the back plate and the diaphragm, the inner membrane portion is attracted and adsorbed on the sealing element by electrostatic force, and the sealing element is configured to support the inner membrane portion to reach an operating state, thereby reducing the low attenuation of the microphone.
A microphone chip and a microphone are provided. The microphone chip includes a substrate and a capacitive system disposed on the substrate. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate. The diaphragm includes an inner membrane portion, at least one outer membrane portion, and at least one supporting portion. The microphone chip further includes a supporting member. In an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions. The diaphragm in the operating state is divided by the supporting member into a plurality of floating regions separated from each other, such that the rigidity of the diaphragm can be effectively adjusted and enhanced according to requirements.
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