Provided in the present application is a microphone circuit, comprising: a charge pump module, which is connected to a first terminal of a microphone, and used for receiving a preset first voltage, generating a first bias voltage on the basis of the first voltage and outputting same to the microphone; an amplification module, which is connected to a second terminal of the microphone, and used for receiving a voltage signal output by the microphone, amplifying the voltage signal and outputting same as an output signal of the microphone circuit; and a voltage division module, which is connected to the second terminal of the microphone and the amplification module, and used for receiving the first voltage, dividing the first voltage to generate a second bias voltage and outputting same to the microphone, and outputting the second bias voltage as a bias voltage of the amplification module to the amplification module. In the microphone circuit of the present application, the first bias voltage and the second bias voltage change along with the first voltage, that is, regulating any bias voltage causes the other bias voltage to change accordingly, thereby solving the problem of sensitivity offset of MEMS microphones caused by the change in the difference between two bias voltages due to the regulation of any bias voltage.
The present invention provides a MEMS microphone, comprising: a substrate provided with a back cavity passing therethrough; a back plate fixed to the substrate; and a diaphragm located between the back plate and the substrate along the thickness direction of the substrate, the diaphragm comprising a vibrating body, and the vibrating body comprising an inner region, an outer region, and a plurality of connecting portions distributed at intervals along the circumferential direction of the diaphragm, wherein the inner region is suspended above the back cavity, the outer region is fixedly connected to the substrate, the connecting portions are suspended above the substrate, two ends of each connecting portion are respectively fixedly connected to the inner region and the outer region along the radial direction of the diaphragm, and the width of the connecting portions gradually decreases along a direction from the inner region to the outer region. In the MEMS microphone of the present invention, the structural rigidity of the connecting portions can be reduced, increasing the amplitude of the diaphragm, thereby improving the sensitivity of the MEMS microphone; in addition, stress on the connecting portions can also be transferred to the substrate, uniformly distributing the stress on the connecting portions, reducing the maximum stress on the connecting portions under a given load, thereby improving the structural stability of the microphone.
Provided in the embodiments of the present application are a signal processing system and an electronic device. The system comprises: an input signal module, a displacement model, a filter coefficient generation module, a group delay compensation module, a tunable equalizer, an amplifier and an audio transducer, wherein the input signal module is connected to both the group delay compensation module and the displacement model, the displacement model is connected to the filter coefficient generation module, the group delay compensation module is connected to the tunable equalizer, the tunable equalizer is connected to the amplifier, the amplifier is connected to the audio transducer, and the filter coefficient generation module is connected to the tunable equalizer. In the technical solution provided in the embodiments of the present application, frequency response variations related to driver displacement can be corrected within a wide frequency range, thereby reducing distortion, especially intermodulation distortion.
The present invention provides a method for determining color difference defect compensation data, a compensation method, and an augmented reality device. The method for determining color difference defect compensation data, including: obtaining a generated image of an augmented reality device, and preprocessing the generated image to obtain a first image; using a preset filtering algorithm to detect a color difference defect in the first image; obtaining a position of the color difference defect region and color difference defect data; and generating corresponding color difference defect compensation data based on the color difference defect data. According to the method for determining the color difference defect compensation data provided in the embodiments of the present invention, to compensate for display content of an augmented reality display apparatus and obtain a compensated display picture, thereby enhancing a display effect of the augmented reality display apparatus and correcting a color difference.
G06T 7/194 - DécoupageDétection de bords impliquant une segmentation premier plan-arrière-plan
G06T 7/90 - Détermination de caractéristiques de couleur
G06V 10/56 - Extraction de caractéristiques d’images ou de vidéos relative à la couleur
G09G 5/02 - Dispositions ou circuits de commande de l'affichage communs à l'affichage utilisant des tubes à rayons cathodiques et à l'affichage utilisant d'autres moyens de visualisation caractérisés par la manière dont la couleur est visualisée
An interpupillary distance adjustment device, comprising: a base (1), a first lens assembly (2) and a second lens assembly (3) which are relatively slidably arranged on the base (1), a knob (4) rotatably arranged on the base (1), and a transmission assembly (5) separately connected to the first lens assembly (2), the second lens assembly (3), and the knob (4). The transmission assembly (5) comprises a transmission gear (51) rotatably arranged on the base (1), and a transmission belt (52) having two portions respectively wound around the knob (4) and the transmission gear (51). The knob (4) is provided with a first groove (41), the transmission gear (51) is provided with a second groove (511), the transmission belt (52) is engaged with the first groove (41) and the second groove (511), and the transmission gear (51) is separately meshed with the first lens assembly (2) and the second lens assembly (3). The knob (4) and the transmission gear (51) are connected by means of the transmission belt (52), so that belt drive is achieved between the knob (4) and the transmission gear (51), thereby ensuring smooth torque during rotation and providing a good operational feel. Moreover, transmission is implemented between the knob (4) and the transmission gear (51) by means of the transmission belt (52), and the transmission gear (51) is separately meshed with the first lens assembly (2) and the second lens assembly (3), such that the structure is simpler and more reliable.
Provided in the present invention are a MEMS device and a manufacturing method therefor. The MEMS device of the present invention comprises a piezoelectric diaphragm, a barrier layer provided on one side of the piezoelectric diaphragm, a sacrificial layer connected to the side of the barrier layer facing away from the piezoelectric diaphragm, and a substrate connected to the side of the sacrificial layer facing away from the barrier layer. The substrate comprises a wall connected to the side of the sacrificial layer facing away from the barrier layer, and the wall encloses a cavity; the substrate further comprises a mass block which is provided on the side of the sacrificial layer facing away from the barrier layer and is accommodated in the cavity; the mass block is formed by etching the substrate and is spaced apart from the wall. After capturing and amplifying a vibration signal, the mass block can drive the piezoelectric diaphragm to generate significant mechanical deformation, so as to effectively capture vibration in solid media, thereby improving the sensitivity and response efficiency of the MEMS device.
A chromatic aberration defect compensation data determination method, a chromatic aberration defect compensation method, and an augmented reality device. The chromatic aberration defect compensation data determination method comprises: acquiring an imaging image of an augmented reality apparatus, and preprocessing the imaging image to obtain a first image; using a preset filtering algorithm to perform chromatic aberration defect detection on the first image; obtaining the position of a chromatic aberration defect region and chromatic aberration defect data; and generating corresponding chromatic aberration defect compensation data on the basis of the chromatic aberration defect data. The augmented reality apparatus can execute the method; the position of the chromatic aberration defect region and the corresponding chromatic aberration defect compensation data are determined by means of a detection result of the preset filtering algorithm, and then the display content of the augmented reality display apparatus is compensated, so as to obtain a compensated display picture, thereby improving the display effect of the augmented reality display apparatus, and correcting chromatic aberration.
The present application provides an interpupillary distance adjustment device, including a base, a first lens assembly and a second lens assembly that are relatively slidably mounted on the base, a knob rotatably mounted on the base, and a transmission assembly connected to the first lens assembly, the second lens assembly, and the knob. The transmission assembly includes a transmission gear rotatably mounted on the base, and a transmission belt wound around the knob and the transmission gear. The knob is provided with a first groove, and the transmission gear is provided with a second groove. The transmission belt is engaged with the first and second grooves, and the transmission gear is meshed with the first and second lens assemblies. The knob and the drive gear establish a belt-driven mechanism, ensuring smooth rotational force transmission and a superior tactile feedback, and providing a simpler and more reliable structure.
The present application provides a MEMS device and a preparation method therefor. The MEMS device includes a piezoelectric diaphragm, a blocking layer disposed on a side of the piezoelectric diaphragm, a sacrificial layer connected to a side of the blocking layer back away from the piezoelectric diaphragm, and a substrate connected to a side of the sacrificial layer back away from the blocking layer. The substrate includes a wall connected to a side of the sacrificial layer back away from the blocking layer and forming a cavity, and a mass block disposed on the side of the sacrificial layer back away from the blocking layer and accommodated within the cavity, which is formed by etching the substrate and is spaced apart from the wall. The mass block can drive the piezoelectric diaphragm to produce significant mechanical deformation, improving the sensitivity and response efficiency of the MEMS device.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G01P 15/09 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs piézo-électriques
The present invention provides a smart optical device includes a screen, a holder spaced apart from the screen, a driving assembly secured to the holder, a reflector assembly movably connected to the holder, and a prism assembly fixedly connected to the holder. The driving assembly includes a screw located at least partially out of the holder and a slider connected to the screw through a thread. The reflector assembly abuts against the slider. When rotating the screw, the slider moves in a first direction to push the reflector assembly to move in a second direction, the first direction is an axis direction of the screw and the second direction is perpendicular to the first direction. The smart optical device of the present invention has the function of adjusting refractive power by rotating the screw. The smart optical device has a simple structure and is easy to operate.
An inertial measurement unit and a manufacturing method therefor. The inertial measurement unit comprises: a first substrate (1); a dielectric layer (2), wherein the dielectric layer (2) is stacked on the first substrate (1), and notches (15) are formed on the dielectric layer (2); a first conductive layer (3), wherein the first conductive layer (3) is stacked on the dielectric layer (2); a second conductive layer (5), wherein the second conductive layer (5) is supported on the first conductive layer (3) by means of support portions (7); a second substrate (9), wherein the second substrate (9) covers the second conductive layer (5) by means of a bonding structure (8), a sealed space is formed between the second substrate (9) and the first substrate (1), the sealed space comprises a plurality of separated chambers (14), and the chambers (14) have different chamber pressures; an exhaust channel (12), communicated with at least one chamber (14), wherein the exhaust channel (12) is used for communicating the chamber (14) with the outside; and a sealing portion, used for sealing the exhaust channel (12). A plurality of chambers (14) having different chamber pressures are provided on a single wafer, which is conducive to manufacturing of an inertial measurement unit in which two or more inertial sensors are integrated.
Disclosed are a locking mechanism and a locking apparatus. The locking mechanism is operable to securely lock a detachable attachment. A bolt is connected to a drive and also rotatably connected to a securing rack; the drive may be subjected to an external force to slide relative to the securing rack, which drives the bolt to rotate, so that a snap hook of the bolt may access and exit a locking bore, whereby locking or unlocking is realized. A snap hook according to the disclosure may extend out of the locking bore to snap-fit the detachable attachment outside the housing, realizing positionally retaining of the bolt in multiple directions, which eliminates a need of additionally setting a limiting mechanism to extend the bolt outside of the housing to lock the detachable attachment, which facilitates use and offers a strong practicality.
The present invention provides a locking mechanism and a locking device, the locking mechanism being used for locking and securing a detachable optional assembly. The locking mechanism comprises: a housing detachably connected to the detachable optional assembly, a fixing frame mounted in the housing, a driving assembly slidably connected to the fixing frame, and a lock tongue movably connected to the driving assembly. The housing is provided with a locking hole. The fixing frame is provided with a first locating shaft. The lock tongue is rotatably connected to the first locating shaft, and a curved hook adapted to the locking hole is formed at the end of the lock tongue away from the first locating shaft. The driving assembly is used for driving the lock tongue to rotate about the first locating shaft from a first position to a second position, wherein when the lock tongue rotates to the first position, the hook is located inside the housing, and when the lock tongue rotates to the second position, one end of the hook extends through the locking hole to fasten and secure the detachable optional assembly outside the housing. The locking mechanism of the present application allows the locking mechanism to lock and secure a detachable optional assembly within a housing.
Embodiments of the present invention relate to the technical field of semiconductors, and provide a semiconductor structure and a semiconductor structure forming method. The semiconductor structure forming method comprises: providing a substrate; forming an initial photoresist layer on the substrate, and patterning the initial photoresist layer to form a photoresist layer, wherein the photoresist layer is provided with a plurality of positioning openings extending through the thickness of the photoresist layer; forming an initial target layer, wherein the initial target layer is located on the surface of the photoresist layer away from the substrate, and the initial target layer fills the positioning openings; removing the initial target layer higher than the top surface of the photoresist layer, and using the initial target layer located in the positioning openings as a target layer; and removing the photoresist layer. The implementation of the present disclosure is at least conducive to solving the problem of incapability of forming a patterned target layer due to the incompatibility between the material of a target layer and the material of a photoresist layer.
H10N 30/05 - Fabrication de dispositifs piézo-électriques ou électrostrictifs multicouches ou de leurs parties constitutives, p. ex. en empilant des corps piézo-électriques et des électrodes
The present utility model provides a MEMS microphone chip, comprising: a substrate having a back cavity; a diaphragm fixed to the substrate and located above the back cavity; and a back plate arranged spaced apart from the diaphragm in a vibration direction to form an inner cavity. The diaphragm comprises: a main body portion located above the back cavity; a support portion surrounding the main body portion and fixed to the substrate; and an air release valve partially spaced apart from the main body portion to form a first air release gap, the air release valve comprising at least one air release member. The air release member comprises: a fixed portion connected to the main body portion; a movable portion arranged spaced apart from the main body portion; and a connecting portion connecting the fixed portion to the movable portion, the width of the fixed portion being less than the width of the movable portion. The MEMS microphone chip provided in the present utility model has high reliability.
The present disclosure discloses an MEMS microphone chip including a diaphragm having a support portion fixed on the substrate, a main body portion located above the back cavity, and a deflation valve spaced apart from the main body portion for forming a first deflation slit. The deflation valve includes at least one deflation plates. Each of the at least one deflation plates includes a fixation portion connected with the main body portion, a move portion arranged at an interval from the main body portion, and a connection portion connected with the fixation portion and the move portion. A width of the fixation portion is smaller than a width of the move portion. The MEMS microphone chip in the present disclosure has higher reliability.
Provided is an MEMS sensor module, comprising a side wall (1) enclosing a cavity, a first circuit board (2), a second circuit board (3), a partition wall (4) dividing the cavity into a first cavity (11) and a second cavity (12), a first MEMS sensor assembly (5) arranged in the first cavity (11) and encapsulated by glue (6), a second MEMS sensor assembly (7) arranged in the second cavity, a first gold finger layer (8) arranged between the side wall (1) and the partition wall (4) and the first circuit board (2), and a second gold finger layer (9) arranged between the side wall (1) and the partition wall (4) and the second circuit board (3), wherein the first gold finger layer (8) surrounds both the first cavity (11) and the second cavity (12), the second gold finger layer (9) surrounds both the first cavity (11) and the second cavity (12), and the first gold finger layer (8) at the partition wall (4) is provided with a slot (80) communicating the first cavity (11) with the second cavity (12). The MEMS sensor module can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
The MEMS sensor module of the present utility model comprises a side wall enclosing a cavity, a first circuit board, a second circuit board, a partition wall dividing the cavity into two cavity bodies, MEMS sensor assemblies respectively arranged in the two cavity bodies, and two gold finger layers that each surround the two cavity bodies and are between the side wall, the partition wall and the two circuit boards. A gold finger layer at the partition wall is provided with a slot opening connecting the two cavity bodies; an MEMS sensor assembly in one cavity body comprises an ASIC chip fixed to the second circuit board and an MEMS chip stacked and fixed on the ASIC chip, and an MEMS sensor assembly in the other cavity body comprises an ASIC chip fixed to the first circuit board and an MEMS chip fixed to the second circuit board; the side wall is provided with a conductor connecting the two circuit boards; and bonding gold wires are respectively connected between the two MEMS chips and the second circuit board. The MEMS sensor module of the present utility model can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.
A MEMS sensor module includes an inner space enclosed by a side wall, a first circuit board, a second circuit board, a dividing wall for dividing the inner space into two cavities, a first MEMS sensor in one cavity wrapped by glue, a second MEMS sensor in another cavity, a first golden finger layer between the side wall and the first circuit board as well as between the dividing wall and the first circuit board for respectively surrounding the two cavities, a second golden finger layer between the side wall and the second circuit board as well as between the dividing wall and the second circuit board for respectively surrounding the two cavities, and a notch in the first golden finger layer at the dividing wall for communicating the two cavities. The MEMS sensor module can avoid the heat generated by one MEMS sensor affecting another one.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
G01L 9/00 - Mesure de la pression permanente, ou quasi permanente d’un fluide ou d’un matériau solide fluent par des éléments électriques ou magnétiques sensibles à la pressionTransmission ou indication par des moyens électriques ou magnétiques du déplacement des éléments mécaniques sensibles à la pression, utilisés pour mesurer la pression permanente ou quasi permanente d’un fluide ou d’un matériau solide fluent
H04R 3/06 - Circuits pour transducteurs pour corriger la fréquence de réponse des transducteurs électrostatiques
A MEMS sensor module includes an inner space enclosed by a side wall, a dividing wall for dividing the inner space into two cavities, a first circuit board, a second circuit board, two MEMS sensors respectively disposed in the two cavities, and two golden finger layers. One or both of the two golden finger layers at the dividing wall have a notch communicating the two cavities. One MEMS sensor includes an ASIC chip on the second circuit board and a MEMS chip on the ASIC chip. Another MEMS sensor includes an ASIC chip on the first circuit board and a MEMS chip on the second circuit board. The side wall has a conductor connecting the two circuit boards. A bonding wire connects the MEMS chip and the second circuit board. The MEMS sensor module can avoid the heat generated by one MEMS sensor affecting another one.
Provided in the present invention is a smart optical device, comprising a screen, a support spaced apart from the screen, a driving assembly fixed to the support, a reflector assembly movably connected to the support, and a prism assembly fixedly connected to the support, wherein the driving assembly comprises a screw rod at least partially located outside the support, and a slider threadedly connected to the screw rod, the slider abutting against the reflector assembly; and the screw rod is rotated such that the slider moves in a first direction so as to push the reflector assembly to move in a second direction, the first direction being the axial direction of the screw rod, and the second direction being perpendicular to the first direction. The smart optical device of the present invention achieves the effect of adjusting diopters by means of rotating the screw rod, has a simple structure, and is convenient to operate.
G02B 7/198 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs avec des moyens pour régler la position du miroir par rapport à son support
G03B 21/28 - Réflecteurs dans le faisceau de projection
Smart glasses (100), comprising a frame assembly (1) and two temple mechanisms (2) respectively fixed at two opposite ends of the frame assembly (1). The temple mechanisms (2) comprise two connectors (21) fixed at two ends of the frame assembly (1), two female connector assemblies (22) respectively hinged to the ends of the two connectors (21) away from the frame assembly (1), and two temple assemblies (23) that are respectively inserted into the two female connector assemblies (22) from the ends of the two female connector assemblies (22) away from the frame assembly (1), forming a snap-fit connection. The temple assemblies (23) and the female connector assemblies (22) form a detachable connection. By inserting the temple assemblies (23) into the female connector assemblies (22), male connector assemblies and the female connector assemblies (22) form a locked and fixed connection. When an external force is applied to pull out the temple assemblies (23), the temple assemblies (23) separate from quick-release female connectors of the frame assembly (1), thereby completing disassembly. The frame of said smart glasses (100) allows for convenient assembly and disassembly, providing a good user experience.
Smart glasses (100), comprising a frame assembly (1), two female connector assemblies (2) respectively arranged at two opposite ends of the frame assembly (1), and two temple assemblies (3) respectively connected to the two female connector assemblies (2), wherein each female connector assembly (2) comprises a female connector (21) hinged to the frame assembly (1), an engagement slot (22) formed by an inward recess at the end of the female connector (21) close to the temple assembly (3), a bracket (23) engaged and fixed within the engagement slot (22), an insertion slot (24) formed by an inward recess at the end of the bracket (23) close to the frame assembly (1), and an elastic metal wire (25) engaged between the female connector (21) and the bracket (23), both ends of the elastic metal wire (25) extending into the insertion slot (24); and each temple assembly (3) comprises a temple (31) and a male connector (32) fixed to the side of the temple (31) close to the female connector assembly (2), a limiting slot (321) being provided on the peripheral side of the male connector (32), and the male connector (32) being inserted into the insertion slot (24), allowing both ends of the elastic metal wire (25) to be elastically engaged within the limiting slot (321). Rapid replacement of the temple assemblies (3) or the frame assembly (1) can be realized.
SHANGHAI DIFFERENT ADVANCED MATERIAL COMPANY LIMITED (Chine)
Inventeur(s)
Gan, Zhongzong
Cai, Rui
Wang, Yaqi
Xiao, Xiaojun
Zhang, Rui
Wei, Lifei
Wang, Jiahuan
Lu, Yuming
Hao, Dan
Gu, Huiqin
Chen, Huihua
Lei, Ziyu
Yang, Cheng
Zhou, Yonghua
Wu, Lei
Abrégé
A method for preparing a polyethylene furanoate fiber, comprising: drying polyethylene furanoate chips and then performing melt-blending spinning, wherein after the drying, the moisture content of the polyethylene furanoate chips is less than or equal to 200 ppm, the crystallinity is 30% to 50%, and the softening temperature is 120-140°C; the melt-blending spinning comprises a screw extruder melt extrusion process, a spinning process, an annular cross-flow cooling process, a two-stage drawing process, and a tension heat setting process; process parameters of the melt-blending spinning comprise: a screw rotation speed of 28-35 r/min, a spinning beam temperature of 265-280°C, an annular cross-flow air supply-return pressure difference of 600-800 Pa, a first-stage drawing temperature of 70-80°C, a second-stage drawing temperature of 100-120°C, a total drawing ratio of 2.94-3.52, and a tension heat setting temperature of 140-160°C. The polyethylene furanoate fiber has excellent mechanical properties.
D01F 6/62 - Filaments, ou similaires, faits par l’homme, à un seul composant, formés de polymères synthétiquesLeur fabrication à partir de produits d'homopolycondensation à partir de polyesters
D01D 5/08 - Méthodes de filage à partir de masses en fusion
D01D 5/14 - Méthodes de filage par étirage par circulation de fluides provoquant l'étirage
Smart glasses are provided, including a frame assembly, two female connecting assemblies, and two temple assemblies. The two female connecting assemblies are respectively fixed to two opposite ends of the frame assembly, and the two temple assemblies are respectively connected to the two female connecting assemblies. Each of the two female connecting assemblies includes a female connector, a clamping groove, a bracket, an inserting groove, and an elastic metal component. Each of the two temple assemblies includes a temple and a male connector, each male connector is fixed to one end of a corresponding temple close to a corresponding one of the two female connecting assemblies. The smart glasses enable quick replacement of the two temple assemblies or the frame assembly.
Embodiments of the present invention relate to the technical field of semiconductor devices. Disclosed are a MEMS microphone and a manufacturing method therefor. The MEMS microphone comprises: a substrate, which defines a cavity; anchoring members provided on the substrate; and a diaphragm provided with beam structures, wherein the beam structures are fixed on the anchoring members, such that the diaphragm covers the cavity and is spaced apart from the substrate, and inner edges of the side of the substrate close to the diaphragm is provided with chamfers. In the present invention, the inner edges of the side of the substrate close to the diaphragm are provided with chamfers, and when the diaphragm bends towards the substrate side due to vibration, the provision of the chamfers can prevent the diaphragm from colliding with the substrate, or increase the contact area between the diaphragm and the substrate when the diaphragm collides with the substrate, thereby avoiding stress concentration, reducing the risk of damage to the diaphragm. In this way, the probability of failure of the MEMS microphone due to damage to the diaphragm can be reduced, and the robustness of the MEMS microphone can be enhanced.
Smart glasses are provided, including a frame assembly and two temple mechanisms. The two temple mechanisms are respectively fixed to two opposite ends of the frame assembly. The two temple mechanisms include two connecting components respectively fixed to the two opposite ends of the frame assembly, two female connecting assemblies respectively hinged to ends of the two connecting components, and two temple assemblies respectively inserted into the two female connecting assemblies. Through respectively inserting the two temple assemblies into the two female connecting assemblies, each female connector is fixed and locked with a corresponding female connecting assembly; when the two temple assemblies are pulled out by external force, the two temple assemblies are separated from the frame assembly to complete the quick disassembly, a frame of the smart glasses is easily assembled and disassembled, thereby proving better user experience.
Disclosed in the present invention are a microphone array and a mobile terminal. The microphone array comprises: a housing, in which a plurality of microphones are provided, the plurality of microphones forming a first microphone part and a second microphone part; a first end surface, which is provided with at least two first sound pickup holes, the first sound pickup holes being in communication with the microphones in the first microphone part in a manner of corresponding to each other on a one-to-one basis; and a second end surface, which is provided with at least one second sound pickup hole, the second sound pickup holes being in communication with the microphones in the second microphone part in a manner of corresponding to each other on a one-to-one basis. The first end surface intersects the second end surface, a preset included angle is formed between the extension direction of the first end surface and the extension direction of the second end surface, and the spacing between at least two adjacent microphones is less than half the wavelength of a response frequency used for beamforming. Compared with the prior art, the present invention achieves a good spatial capture performance with a minimal actual number of microphones, and is generally applicable to various modern and conventional beamforming algorithms.
Embodiments of the present invention relate to the technical field of semiconductor devices and disclose a MEMS microphone and a method for preparing the same. In the disclosure, the substrate is provided with at least one chamfer at an inner edge of a side of the substrate close to the diaphragm, so that when the diaphragm is bent towards the substrate due to vibration, providing the chamfer can prevent the diaphragm from hitting the substrate, or increase the contact area between the diaphragm and the substrate when the diaphragm hits the substrate, avoiding the concentration of stress and thus reducing the risk of the diaphragm breaking. In this way, the probability of failure of the MEMS microphone due to breakage of the diaphragm can be reduced, and the robustness of the MEMS microphone can be enhanced.
Provided in the embodiments of the present invention are a signal playback method and apparatus, and a storage medium and a computer device. The method comprises: detecting an acquired camera image, so as to generate a detection result; generating a playback signal on the basis of adjustment parameters and an acquired audio input signal, wherein the adjustment parameters comprise the detection result; and performing playback on the basis of the playback signal. Thus, a computer device can automatically adjust an audio input signal to be played back, so as to generate a playback signal, thereby improving the sound playback effect and also increasing the user satisfaction.
The present disclosure provides a speaker including a chamber filled with the sound absorbing material. The chamber is also filled with expandable foam which is expandable by heating from a predetermined volume to a larger volume to limit the movement of the sound absorbing material in the chamber. The expandable foam is formed by compressing a foam impregnated with polymeric adhesive to the predetermined volume. The speaker provided by the present disclosure improves the reliability of the filled sound absorbing material.
H04R 1/28 - Supports de transducteurs ou enceintes conçus pour réponse de fréquence spécifiqueEnceintes de transducteurs modifiées au moyen d'impédances mécaniques ou acoustiques, p. ex. résonateur, moyen d'amortissement
The present disclosure discloses a MEMS microphone chip. The diaphragm of the MEMS microphone chip is suspended on the substrate by a plurality of elastic connection portions connected with the vibration portion of the diaphragm. The vibration portion includes a central vibration portion and an outer vibration portion connected with the central vibration portion and the plurality of elastic connection portions. The back plate includes an anchor portion extending towards the diaphragm. The anchor portion is fixedly connected with the central vibration portion. Therefore, the diaphragm is mounted on the substrate by the plurality of elastic connection portions. The central vibration portion is anchored to the back plate by the anchor portion. The MEMS microphone chip in the present disclosure has higher reliability.
Embodiments of the present invention relate to the technical field of semiconductors, and disclose a Hall element, a Hall sensor, and an electronic device. The Hall element comprises a substrate, a Hall sensing layer, electrodes, a barrier layer, and a conductor pad. The Hall sensing layer is disposed on the substrate. There are a plurality of electrodes, and the plurality of electrodes are connected to the Hall sensing layer. The barrier layer is disposed on the side of the Hall sensing layer away from the substrate, and the barrier layer covers the Hall sensing layer. The conductor pad is disposed on the side of the barrier layer away from the Hall sensing layer, and the conductor pad is used to be grounded or connected to a preset voltage. By applying a potential to the barrier layer covering the Hall sensing layer by means of the conductive pad, not only can a depletion layer having a sufficient width be generated to limit the current flow direction, thereby generating an effective isolation effect, but also the thickness of the Hall sensing layer can be reduced to increase an induced Hall voltage value, thereby enhancing the sensitivity of Hall element sensing.
An accessory identification method includes: generating target magnetic intensity characterization data by the magnetic intensity detection element in response to a magnetic intensity of a magnetic component in a target accessory, when it is detected that the target accessory is located at a preset target position of the electronic device; matching the target magnetic intensity characterization data with a preset accessory index table; and determining accessory identification information corresponding to a matched magnetic field intensity characterization data range as identification information of the target accessory. According to the present disclosure, the identification information of the accessory can be hidden, which is conductive to achieving the security of the accessory information. Meanwhile, excessive detection devices is not required and thus the volume occupied by hardware can be reduced, thereby saving the hardware resource cost.
G01R 33/07 - Mesure de la direction ou de l'intensité de champs magnétiques ou de flux magnétiques en utilisant des dispositifs galvano-magnétiques des dispositifs à effet Hall
G01R 33/00 - Dispositions ou appareils pour la mesure des grandeurs magnétiques
35.
ACCESSORY RECOGNITION METHOD AND APPARATUS, AND STORAGE MEDIUM
Provided in the present application are an accessory recognition method and apparatus, and a storage medium. The method comprises: when it is detected that a target accessory is located at a preset target position of an electronic apparatus, generating target magnetic-field intensity characterization data on the basis of a magnetic-field intensity measurement element and in response to the magnetic-field intensity of a magnetic assembly in the target accessory; matching the target magnetic-field intensity characterization data with a preset accessory index table; and determining accessory identification information, which corresponds to a magnetic-field intensity characterization data range obtained after matching, to be identification information of the target accessory. By means of implementing the solution of the present application, the magnetic-field intensity of a magnetic assembly in a target accessory is measured to obtain magnetic-field intensity characterization data, and identification information of the target accessory can then be obtained by means of looking up a table on the basis of the magnetic-field intensity characterization data. Therefore, identification information of accessories can be hidden, which is conducive to guaranteeing the security of accessory information; moreover, it is not necessary to provide numerous measurement devices, thereby reducing the space occupied by hardware and facilitating the reduction in the hardware resource cost.
Embodiments of the present invention relate to the technical field of microphones. Disclosed are a diaphragm and an MEMS microphone. The diaphragm comprises a vibration portion and a connecting portion arranged around the vibration portion. The vibration portion comprises a first flat portion located at a central position, a corrugated portion arranged around the first flat portion, and a second flat portion arranged around the corrugated portion. The corrugated portion extends in a direction from the center to the edge of the first flat portion. The bending stiffness of the corrugated portion is greater than the bending stiffness of the first flat portion and the second flat portion, and the corrugated portion is made of a material at least comprising silicon nitride. The diaphragm and the MEMS microphone provided in the embodiments of the present invention can increase the structural strength of the diaphragm.
A hand simulator and an audio test system are disclosed. The hand simulator comprises: a main bearing portion used for bearing a device under test, wherein the main bearing portion comprises a palm and a thumb, an index finger, a middle finger, a ring finger, and a little finger that are movably arranged at the end of the palm; a limiting portion comprising a plurality of limiting posts, wherein at least some of the limiting posts are arranged on the palm, the plurality of limiting posts define a receiving space, and the device under test is limited within the receiving space. In contrast to the prior art, the present invention provides a hand simulator that simulates the shape of a human hand, wherein said hand simulator is provided with a limiting portion used for limiting a device under test, allowing the hand simulator to be used for measuring the frequency response of a loudspeaker or microphone of the device under test, or both, while simulating acoustic characteristics resembling those of a user's hand. A device under test can be accurately and repeatedly positioned, improving the practical usefulness of audio testing of any portable device. Further, the invention can be used as a basis for improving existing measurement standards and creating new test methods.
Provided is a sealing ring assembly structure and electronic device. The sealing ring assembly structure comprises an assembly body having a main body and a limiting convex ring protruding therefrom, and a sealing ring. The limiting convex ring and the main body jointly enclose to form a limiting groove. The main body has a first through hole communicating with the limiting groove. The sealing ring is accommodated in the limiting groove, and comprises a ring body and an adhesive layer through which the ring body is adhered and fixed to the limiting groove. The ring body abuts against the groove wall of the limiting groove. The sealing ring has a second through hole penetrating the ring body and the adhesive layer and coaxially arranged with the first through hole. The sealing ring assembly structure is easy and accurate to assemble, the assembling efficiency and the product yield are improved.
F16J 15/10 - Joints d'étanchéité entre surfaces immobiles entre elles avec garniture solide comprimée entre les surfaces à joindre par garniture non métallique
39.
ELECTRONIC SYSTEM AND METHOD FOR CONTROLLING THE SAME
Provided are an electronic system and a method for controlling the same. The electronic system includes an electronic device at least including: a charging circuit having a first input terminal, a second input terminal, and a first output terminal, and including a first transistor, a second transistor, a third transistor, and a fourth transistor; a switching circuit including an input terminal connected to the first output terminal and an output terminal connected to a power supply of the electronic device and configured to connect or disconnect a connection path between the first output terminal and the power supply; and a communication device, which, in a communication mode, is connected to the first and second input terminals to communicate with the electronic device through the first and second input terminals. The implementation of the present disclosure is at least conducive to prolonging the service life of the electronic device.
Disclosed are a speaker and an electronic device. The speaker comprises a speaker housing, which has an accommodating chamber; a speaker body, which is housed within the accommodating chamber, where the accommodating chamber is separated by the speaker body into an anterior sound cavity and a posterior sound cavity, the anterior sound cavity being in communication with the exterior of the speaker housing; and a resonator, which is housed within the posterior sound cavity; the posterior sound cavity comprises at least one cavity portion and at least one port portion, a first side of the resonator is provided with a port portion, and the other side is provided with a cavity portion or an additional port portion. Compared with the prior art, the present invention can reduce the space occupied by the speaker, and also reduces flow losses and flow noise; further, by increasing the acoustic mass of the port portion to that of the resonator, any acoustic resonance arising from the interaction between the resonator and the port portion is above the operating frequency range of the speaker.
Embodiments of the present invention provide an electronic system and a control method therefor. The electronic system comprises an electronic device. The electronic device at least comprises: a charging circuit, wherein the charging circuit has a first input end, a second input end, and a first output end, and the charging circuit comprises a first transistor, a second transistor, a third transistor, and a fourth transistor; a switch circuit, wherein an input end of the switch circuit is connected to the first output end, an output end of the switch circuit is connected to a power supply of the electronic device, and the switch circuit is used for connecting or disconnecting a connection path between the first output end and the power supply; and a communication device, wherein in a communication mode, the communication device is connected to the first input end and the second input end so as to communicate with the electronic device by means of the first input end or the second input end. The embodiments of the present invention at least can prolong the service life of an electronic device.
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie
42.
SEALING RING MOUNTING STRUCTURE AND ELECTRONIC DEVICE
The present application provides a sealing ring mounting structure and an electronic device. The sealing ring mounting structure comprises a mounting body and sealing rings. The mounting body comprises a main body and limiting protruding rings protruding from the main body. The limiting protruding rings and the main body together define limiting recesses. First through holes in communication with the limiting recesses are formed in the main body. The sealing rings are accommodated in the limiting recesses. Each sealing ring comprises a ring body and an adhesive layer fixed to the bottom surface of the ring body, the ring body is adhesively fixed to the recess bottom surface of the corresponding limiting recess by means of the adhesive layer, and the side surface of the ring body abuts against the recess wall of the corresponding limiting recess. Each sealing ring further comprises a second through hole running through the ring body and the adhesive layer. The second through holes and the first through holes are coaxially arranged. The sealing ring mounting structure of the present application is not only easy to mount, but also achieves accurate mounting, thereby improving the mounting efficiency and product yield.
Disclosed is a MEMS microphone, comprising: a substrate, a cavity being penetratingly provided in the substrate; a diaphragm, supported on the substrate and covering the cavity; a back plate, supported on the diaphragm, a first preset gap being formed between the back plate and the diaphragm; and a first support member, formed in the cavity, the first support member comprising a support portion spaced apart from the substrate and a connecting portion, the connecting portion extending from the support portion towards the substrate to be fixed to the substrate, the first support member further comprising a boss portion extending from the end of the support portion close to the diaphragm towards the diaphragm and supporting the diaphragm, and a second preset gap being formed between the diaphragm and the connecting portion in the vibration direction of the diaphragm. Compared with the existing technology, in the present invention, by means of providing the first support member to support the diaphragm, structural deformation of the diaphragm can be effectively prevented, and the firmness of the diaphragm is improved. When the impact force of a sound wave is too large, the diaphragm will not move significantly because the diaphragm is supported by the first support member, thereby preventing the diaphragm from being damaged.
Provided in the embodiments of the present invention are an ultra-low-power noise buffer and an electronic device. The ultra-low-power noise buffer comprises: a source current driving circuit and a sink current driving circuit. The sink current driving circuit is electrically connected to the source current driving circuit, and the sink current driving circuit comprises a first transistor, a second transistor and a first current source, wherein the first transistor is electrically connected to the first current source, the first transistor is electrically connected to the second transistor, and the second transistor is electrically connected to the first current source. The source current driving circuit comprises a second current source, a third transistor, an operational amplifier and a voltage source, wherein the second current source is electrically connected to the first transistor and the third transistor, the third transistor is electrically connected to the first transistor and the operational amplifier, and the operational amplifier is electrically connected to the voltage source, the first transistor, the second transistor and the first current source. Thus, the chip area is reduced, the power consumption, noise induction, output resistance and total harmonic distortion (THD) are reduced, and the power supply rejection ratio (PSRR) is improved.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
A MEMS microphone, comprising: a substrate having a back cavity; a back plate spaced apart from the substrate; a diaphragm disposed on the substrate and located between the substrate and the back plate, wherein the diaphragm comprises a main body portion, an edge portion, isolation islands and beam structures, the main body portion being spaced apart from the substrate and the back plate, the edge portion being fixedly connected to the substrate, a plurality of the isolation islands being provided and being spaced apart from the main body portion, a gap being formed between each of the isolation islands and the main body portion, a plurality of the beam structures being provided and being arranged at intervals around the main body portion, one beam structure being provided between any two adjacent isolation islands, and the beam structure being configured to connect the main body portion and the edge portion; and a connector configured to connect each of the isolation islands to at least one of the substrate and the back plate. In the present invention, the isolation islands are fixedly connected to the back plate or the substrate, so that the degree of freedom in designing the isolation islands can be optimized, and the robustness of the diaphragm can also be improved.
The present invention provides a bone conduction package structure including a base board, a housing covered with the base board to form a receiving room, a bone conduction MEMS chip and an ASIC chip located in the receiving room. The bone conduction MEMS chip includes a substrate, a diaphragm, and a backplate. A first cavity is formed between the diaphragm and the backplate. A second cavity is formed by the diaphragm, the substrate, and the base board. And a third cavity is formed by the backplate, the housing, the substrate, and the base board. The first cavity is set as a low-pressure area below atmospheric pressure. The bone conduction package structure of the present invention sets the area between the diaphragm and the backplate as a low-pressure area to reduce damping between the diaphragm and backplate, thereby improving the performance of the bone conduction package structure.
A bone conduction microphone is disclosed. The bone conduction microphone includes a substrate having a cavity with two end openings, a backplate disposed above the substrate, a vibration structure disposed between the backplate and the substrate, and a limiter for limiting a maximum displacement of the vibration structure. The vibration structure includes a diaphragm disposed between the backplate and the substrate and arranged at intervals with the backplate and the substrate respectively and a mass block suspended by the diaphragm and inserted into the cavity through one end opening of the cavity. The bone conduction microphone improves the reliability.
A MEMS microphone is disclosed. The MEMS microphone includes a substrate with a cavity, a backplate disposed above the substrate, a diaphragm disposed between the backplate and the substrate, and a limiting structure disposed in the cavity for limiting a maximum displacement of the diaphragm away from the backplate that is not less than a normal working displacement of the diaphragm away from the backplate. The MEMS microphone improves the reliability.
Provided in the present utility model is a bone conduction packaging structure, comprising: a base board, a housing covering the base board to form an accommodating space, and a bone conduction MEMS chip and an ASIC chip which are disposed in the accommodating space. The bone conduction MEMS chip comprises a substrate having a cavity, a vibration diaphragm supported on the substrate, and a back plate spaced apart from the side of the vibration diaphragm away from the substrate; a first cavity is formed between the vibration diaphragm and the back plate; a second cavity is formed between the vibration diaphragm and the substrate and the base board; a third cavity is formed between the back plate, and the housing, the substrate and the base board; and the first cavity is configured as a low-pressure region the pressure of which is lower than atmospheric pressure. The bone conduction packaging structure of the present utility model configures the region between the vibration diaphragm and the back plate as the low-pressure region, so as to reduce damping between the vibration diaphragm and the back plate, thereby improving the performance of the bone conduction packaging structure.
A feedback apparatus and an operation input device. The feedback apparatus comprises a mounting base, a mechanism to be operated, a position detection mechanism and a feedback mechanism; the mechanism to be operated comprises a member to be operated and a first magnet, said member being rotatably connected to the mounting base, and the first magnet being connected to said member; the position detection mechanism is arranged on the mounting base; the feedback mechanism comprises a driving assembly and a second magnet; the driving assembly is arranged on the mounting base; the second magnet is connected to the driving assembly, a preset distance being provided between the second magnet and the first magnet; the second magnet is arranged to fit the first magnet and is used for controlling the rotation speed of said member.
The present application provides an operating mechanism and an operating input device. The operating mechanism comprises: a housing, the housing having an accommodating space; a movable operating member, the movable operating member being accommodated in the accommodating space and at least partially extending out of the housing; a support member, used for supporting the movable operating member, wherein the movable operating member moves around the support member; magnets, the magnets being connected to the movable operating member; and magnetic members, wherein the magnetic members have magnetic attraction to the magnets, and the movable operating member can be reset and/or retained in an initial position by means of the magnetic attraction between the magnetic members and the magnets. According to the operating mechanism and the operating input device provided in the embodiments of the present application, the operating mechanism has vibration resistance and drop impact resistance, the reliability of the operating mechanism is not easily affected by assembly, and the operating mechanism has high durability against user inputs.
The present application provides a bone-conduction MEMS chip and a manufacturing method thereof, and a bone-conduction packaging structure having the bone-conduction MEMS chip. The bone-conduction MEMS chip includes a substrate having a cavity, a diaphragm supported on the substrate, and a back plate spaced apart on a side of the diaphragm away from the substrate. A side of the diaphragm away from the back plate is provided with a mass block. The mass block in the bone-conduction MEMS chip of the present application is formed directly on the diaphragm, and the bone-conduction packaging structure avoids setting the vibration sheet and the mass block additionally, resulting in lower costs, simpler packaging, and a smaller structure.
The present utility model provides a MEMS microphone, comprising a substrate having a cavity, a backplate disposed above the substrate, a diaphragm disposed between the backplate and the substrate, and a limiting structure disposed in the cavity for limiting a maximum displacement of the diaphragm away from the backplate, wherein the maximum displacement is not less than a normal operating displacement of the diaphragm away from the backplate. The MEMS microphone of the present utility model has high reliability.
The present utility model provides a bone conduction microphone, comprising a base provided with a cavity having openings at both ends, a back plate provided above the base, and a vibration structure provided between the back plate and the base. The vibration structure comprises a diaphragm provided between the back plate and the base and spaced apart from the back plate and the base, and a mass block suspended below the diaphragm and inserted into the cavity from the opening at one end of the cavity. The bone conduction microphone further comprises a limiter configured to limit the maximum displacement of the vibration structure. The bone conduction microphone of the present utility model has high reliability.
The present invention provides a bone conduction MEMS chip and a manufacturing method therefor, and a bone conduction packaging structure having the bone conduction MEMS chip. The bone conduction MEMS chip comprises: a substrate provided with a cavity, a diaphragm supported on the substrate, and a back plate spaced apart from the side of the diaphragm distant from the substrate, wherein a mass block is arranged on the side of the diaphragm distant from the back plate. The mass block in the bone conduction MEMS chip of the present invention is directly formed on the diaphragm, and the bone conduction packaging structure avoids additionally providing a vibration sheet and a mass block, thereby reducing costs, achieving simple packaging, and allowing the structure to be smaller.
Disclosed in the present application are a joystick and an input device. The joystick comprises a housing, a movable assembly, a position measurement assembly and a magnetic reset assembly, wherein the housing has an accommodating cavity; the movable assembly is arranged in the accommodating cavity and partially penetrates the housing; the position measurement assembly is arranged in the accommodating cavity and is used for measuring displacement information of the movable assembly and outputting a corresponding first control signal; and the magnetic reset assembly comprises a first magnetic attraction member and a second magnetic attraction member, one of the first magnetic attraction member and the second magnetic attraction member is arranged on the housing, the other of the first magnetic attraction member and the second magnetic attraction member is arranged on the movable assembly, and the first magnetic attraction member and the second magnetic attraction member can attract each other, so as to reset the movable assembly by means of the mutual attraction action of the first magnetic attraction member and the second magnetic attraction member. Compared with the method of using a physical spring to reset the movable assembly, the present application can eliminate the problem of damage to the physical spring caused by vibration and falling impact of the movable assembly, thereby prolonging the service life of the joystick.
Disclosed in the present invention is an optical system, sequentially comprising, from the rear side to the front side, an aperture located on the rear side of the optical system, a first lens, a second lens, a circular polarizer, and an image plane. The circular polarizer is attached to the rear side surface of the image plane; a composite film is arranged provided on the rear side surface of the first lens; the composite film comprises a reflective polarizing film and a quarter-wave plate; and the reflective polarizing film is provided on the rear side of the quarter-wave plate. The maximum semi-diameter of the first lens and the second lens is Max SD, the focal length of the optical system is f, the focal length of the first lens is f1, the focal length of the second lens is f2, the central radius of curvature of the front side surface of the second lens is R4, and the following relational expressions are satisfied: Max SD ≤ 25.60 mm; -0.61 ≤ R4/f2 ≤ -0.17; and 19.00 ≤ |f1/f| + |f2/f| ≤23.20.
An optical system (100, 200, 300, 400) comprising in sequence from a rear side to a front side: an aperture (11) located on the rear side of the optical system (100, 200, 300, 400); a first lens (14); a second lens (17); a circular polarizer (19); and an image surface (20), wherein the circular polarizer (19) is attached to a rear side of the image surface (20); a composite film is provided on a rear-side surface of the first lens (14); the composite film comprises a reflective polarizing film (12) and a quarter-wave plate (13), with the reflective polarizing film (12) being arranged on a rear side of the quarter-wave plate (13); the first lens (14) and the second lens (17) have a maximum semi-diameter of Max SD, the first lens (14) has an on-axis thickness of T1, the second lens (17) has an on-axis thickness of T2, an on-axis distance between a front-side surface of the first lens (14) and a rear-side surface of the second lens (17) is T12, the optical system (100, 200, 300, 400) has a focal length of f, and the second lens (17) has a front side-surface with a central radius of curvature of R4; and the following relational expressions are satisfied: Max SD≤28.50mm; 0.10≤T12/(T1+T2)≤0.70; and -0.32≤f/R4≤-0.20.
The microphone chip provided in the present utility model comprises a substrate having a back cavity and a capacitor system fixed on the substrate and disposed above the back cavity, wherein the capacitor system comprises a diaphragm and a back plate which are disposed opposite each other and spaced apart from each other, the diaphragm comprises a vibrating part and several elastic connecting parts disposed at the edge of the vibrating part, and the diaphragm is fixed to the substrate by means of the elastic connecting parts; and the vibrating part comprises a middle vibrating part located in the middle position and an outer vibrating part connected to the middle vibrating part and the elastic connecting parts, an anchoring part extending towards the diaphragm is disposed on the back plate, and the anchoring part is fixedly connected to the middle vibrating part. The MEMS microphone chip provided in the present utility model is highly reliability.
The present invention provides a MEMS package structure including a housing, a circuit board, a MEMS chip and an ASIC chip. The MEMS chip includes a diaphragm. The circuit board includes an upper and a lower surface. The circuit board includes a first acoustic hole extending from the lower surface, a second acoustic hole extending from the upper surface, and a communication channel. A projection of the first acoustic hole and a projection of the second acoustic hole along a vibration direction of the diaphragm are non-overlapped with each other. Some protruding structures are located in communication channel. The protruding structures cause a pressure of an airflow entering from the first acoustic hole to be 2-3.5 times the pressure of the airflow exiting from the second acoustic hole. The MEMS package structure of present invention has a stronger ability of anti-air-blowing.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
Provided in the present utility model is an MEMS package structure, comprising a housing, a circuit board that covers the housing to form an accommodating space, and an MEMS chip and an ASIC chip that are disposed in the accommodating space. The MEMS chip comprises a vibrating diaphragm and a backplate spaced apart from the vibrating diaphragm. The MEMS chip is disposed on the circuit board. The circuit board comprises an upper surface connected to the MEMS chip and a lower surface. The circuit board is further provided with a first sound hole extending from the lower surface towards the upper surface but not passing through the upper surface, a second sound hole extending from the upper surface towards the lower surface but not passing through the lower surface, and a communication passage arranged between the upper surface and the lower surface and interconnecting the first sound hole and the second sound hole. The MEMS chip covers the second sound hole, projections of the first sound hole and the second sound hole in the vibrating direction of the vibrating diaphragm not overlapping each other. A plurality of protruding structures are provided in the communication passage, the protruding structures allowing the pressure of an air flow entering from the first sound hole to be 2-3.5 times the pressure of an air flow flowing out of the second sound hole. The MEMS package structure provided in the present utility model has a strong anti-blowing capability.
The present application provides a resonator and a manufacturing method therefor. The resonator comprises: a substrate; a bottom electrode located on the substrate; a piezoelectric layer stacked on the bottom electrode, a recessed frame being arranged on the surface of the piezoelectric layer away from the substrate; a barrier layer stacked on the piezoelectric layer, wherein the barrier layer and the piezoelectric layer are partially spaced to form air gap areas, and the air gap areas are located at the edges of the recessed frame; at least one shunt metal layer stacked on the barrier layer, wherein in the thickness direction of the resonator, the projection contour of the recessed frame and the projection contours of the air gap areas are all located in the projection contour of the shunt metal layer; and a top electrode stacked on the shunt metal layer, wherein a protruding frame is arranged on the surface of the top electrode away from the piezoelectric layer, and the projection contour of the protruding frame is located at the edge of a resonance area. The resonator and the manufacturing method therefor provided by the embodiments of the present application can provide greater flexibility in frequency adjustment, and meet the requirements of different bandwidths, and can further improve the quality factor Q of the resonator.
The present application provides a speaker module, including a casing, a speaker driver arranged in an accommodating cavity of the casing, a heat dissipation bracket, and a heat dissipation pipe arranged on the heat dissipation bracket outside the casing and abutted against the heat dissipation members outside the speaker module. The heat dissipation bracket is provided with a first cooling channel, which is arranged around the speaker driver. The heat dissipation pipe is provided with a second cooling channel communicated with the first cooling channel. Both the first cooling channel and the second cooling channel are filled with cooling liquid. The heat generated by the vibration of the speaker driver can be transferred to the outside through the cooling liquid in the first and so that the circulating flow of the cooling liquid is realized, and the heat dissipation efficiency of the heat dissipation bracket is improved.
The present application provides a microphone, comprising a housing, a circuit board covering and fixed to the housing, and enclosing a cavity together with the housing, a first chip assembly fixed to the side of the circuit board close to the housing, and a second chip assembly embedded and fixed in the circuit board. The circuit board is formed from multiple stacked layer structures, comprising a chip mounting layer, a first wiring layer, shielding layers, a second wiring layer, and an SMT layer, which are sequentially arranged spaced apart from the side close to the first chip assembly toward the side away from the first chip assembly. The shielding layers comprise multiple layers which are sequentially arranged, the multiple shielding layers each being connected to a grounding point of the circuit board, and each shielding layer being provided with a clearance hole penetrating through the shielding layer. The microphone of the present application can reduce interference of heat emitted by an ASIC chip during operation with the performance of another chip.
The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.
Disclosed are a method and device for identification of accessory, an electronic device, and a non-transitory computer-readable storage medium. The method for identification of accessory includes: providing a host assembled with at least one accessory, where the host is provided with at least one detection element; obtaining status information of the at least one detection element, where each of the at least one accessory is provided with at least one trigger element, where the status information includes triggered and untriggered; determining arrangement of the at least one trigger element of the respective accessory according to the status information of each of the at least one detection element; and determining a type of the respective accessory according to the arrangement of the at least one trigger element. The method for identification of accessory achieves identification of type of accessory along with a reduced cost and occupied space.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
67.
ACCESSORY IDENTIFICATION METHOD, ACCESSORY IDENTIFICATION APPARATUS, ELECTRONIC DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM
Embodiments of the present disclosure relate to the field of electronic product accessories, and provides an accessory identification method, an accessory identification apparatus, an electronic device, and a computer-readable storage medium. The accessory identification method comprises: providing a main unit equipped with an accessory, a detection element being provided in the area of the main unit close to the accessory; acquiring state information of the detection element, a trigger element being in the area of each accessory close to the main unit, the number of trigger elements on one accessory being less than or equal to the number of detection elements on the main unit on the corresponding area, the state information comprising a triggered state and a non-triggered state, if the detection element detects a matched trigger element, the state information being a triggered state, and if the detection element does not detect a matched trigger element, the state information being a non-triggered state; determining the arrangement situation of the trigger element on the accessory on the basis of the state information of each detection element; and determining the type of the accessory equipped on the main unit on the basis of the arrangement situation of the trigger element on the accessory. At least the type of the accessory can be identified, the cost is reduced, and the occupied volume is reduced.
G01V 3/08 - Prospection ou détection électrique ou magnétiqueMesure des caractéristiques du champ magnétique de la terre, p. ex. de la déclinaison ou de la déviation fonctionnant au moyen de champs magnétiques ou électriques produits ou modifiés par les objets ou les structures géologiques, ou par les dispositifs de détection
G01B 7/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques
The present disclosure discloses a microphone including a housing, a printed circuit board assembled with the housing for forming a first cavity and a second cavity, a first chip component, a second chip component, and a first metal layer, the first chip component includes a first MEMS chip and a first ASIC chip, the second chip component includes a second MEMS chip and a second ASIC chip, the housing is fixed with a side of the first metal layer away from the printed circuit board. Compared with the related art, a microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.
The embodiments of the present invention relate to the technical field of microphone signal processing. Disclosed is a microphone signal beamforming processing method. In the present invention, the method comprises: performing time-frequency transformation on first output signals corresponding to a plurality of microphones, the number of which is no less than three, to obtain frequency-domain signals, and performing a plurality of different sets of beamforming preprocessing on the frequency-domain signals of the plurality of microphones to obtain a plurality of different beam signals; performing a plurality of different sets of cross-mode analysis on the plurality of beam signals to obtain a plurality of positive weighting coefficients; multiplying the plurality of positive weighting coefficients to obtain a combined coefficient, and multiplying the combined coefficient by a frequency-domain signal of any microphone to obtain a weighted spectral component; and performing inverse time-frequency transformation on the weighted spectral component to obtain second output signals corresponding to the plurality of microphones. Compared with conventional methods, combined cross-mode analysis used in the present invention achieves better channel separation, thereby obtaining narrower beams having great sidelobe suppression and a higher signal-to-noise ratio.
A microphone, comprising a housing (1), a circuit board (2) covering and fixed to the housing (1) and defining a first cavity (104) and a second cavity (105) together with the housing (1), a first chip assembly (3) fixed on the side of the circuit board (2) close to the housing (1) and located in the first cavity (104), and a second chip assembly (4) fixed on the side of the circuit board (2) close to the housing (1) and located in the second cavity (105), wherein the first chip assembly (3) comprises a first ASIC chip (301) and a first MEMS chip (302), and the second chip assembly (4) comprises a second ASIC chip (401) and a second MEMS chip (402). The microphone further comprises a first metal layer (5) fixed on the side of the circuit board (2) close to the housing (1) and surrounding both the first chip assembly (3) and the second chip assembly (4). The microphone can prevent the problem that heat generated by operation of the ASIC chips affects performance of other components by means of heat conduction via a substrate of the circuit board (2) or heat dissipation via thermal motion of air.
A loudspeaker unit and a terminal device are disclosed. The loudspeaker unit comprises: a loudspeaker main body, which is internally provided with a receiving cavity; a transducer, which is received in the receiving cavity and divides same along a first direction into a front sound cavity and a rear sound cavity, wherein a loudspeaker hole is formed in the loudspeaker main body, and the loudspeaker hole is communicated with the front sound cavity; a throat, which is internally provided with a throat cavity, wherein a first opening and a second opening are formed in the throat, the first opening and the second opening are sequentially distributed along a second direction, the first opening is arranged corresponding to the loudspeaker hole, the throat cavity is communicated with the front sound cavity via the first opening and the loudspeaker hole, and the throat cavity is communicated with the environment outside of the throat via the second opening. Compared with the prior art, the present invention allows the space occupied by the loudspeaker unit to be compressed to a certain extent. The loudspeaker unit is quite suitable for terminal devices that have a certain amount of internal space but that are limited in height.
The embodiments of the present application relate to the technical field of vibration electric motors. Disclosed are a linear vibration electric motor (100) and an electronic device (200). In the linear vibration electric motor (100) of the present application, in a receiving space (11) defined by a housing (10), a supporting frame (21) of a vibrator (20) is provided with a driven member (22), and a driving member (30) is provided opposite the driven member (22) and configured to drive the driven member (22) to move the supporting frame (21) along a straight line. A plurality of accommodating grooves (211) are formed on the supporting frame (21), at least one supporting component (40) is provided in each accommodating groove (211), part of the supporting component (40) is located outside the accommodating groove (211), the supporting component (40) is pressed against the housing (10) by the supporting frame (21), and the supporting component (40) is configured to support the supporting frame (21). When the driving member (30) drives the supporting frame (21) to move relative to the housing (10), the supporting component (40) rolls relative to the housing (10) and the supporting frame (21), so that the supporting frame (21) can stably move, and the accommodating grooves (211) are located inside the receiving space (11) and will not be deformed due to impact. The electronic device (200) of the present application comprises the linear vibration electric motor (100) and a device body (210) provided with the linear vibration electric motor (100).
H02K 33/02 - Moteurs avec un aimant, un induit ou un système de bobines à mouvement alternatif, oscillant ou vibrant avec des induits entraînés dans un sens par application d'énergie à un système à une seule bobine et ramenés par une force d'origine mécanique, p. ex. par des ressorts
H02K 1/34 - Parties du circuit magnétique à mouvement alternatif, oscillant ou vibrant
H02K 7/08 - Association structurelle avec des paliers
Disclosed is a directional microphone module, comprising: a sound-transmitting mesh fabric, a housing covered with the sound-transmitting mesh fabric, a circuit board fixed to the housing, and a MEMS microphone fixed to the circuit board. The housing comprises a top wall and side walls; the circuit board and the top wall are spaced apart to form a first cavity; the circuit board and the sound-transmitting mesh fabric are spaced apart to form a second cavity; the side walls comprise two first side walls arranged opposite to each other and two second side walls arranged opposite to each other; the first cavity and the second cavity are communicated only at one of the two second side walls; the MEMS microphone is arranged in the first cavity and located at the other of the two second side walls; the MEMS microphone is provided with a first sound hole facing the top wall and a second sound hole facing the circuit board; the first sound hole is communicated with the first cavity; the circuit board is provided with a through hole; and the second sound hole is communicated with the second cavity by means of the through hole. The directional microphone module of the present disclosure has stable performance and simple structure, and can improve production efficiency and reduce labor costs.
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
H04R 1/38 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en utilisant un seul transducteur avec des moyens réfléchissant, diffractant, dirigeant ou guidant des sons dans lesquelles les ondes sonores attaquent les deux côtés d'une membrane et comprenant des moyens de décalage de phase acoustique, p. ex. microphone à gradient de pression
The present invention provides a smart wearable device including a glass frame and a pair of temples. Each temple includes a shelf having a receiving room, a speaker unit and a microphone unit accommodated in the receiving room. The speaker unit includes a first sounding surface and a second sounding surface. The shelf includes an upper wall, a lower wall, and an outer wall. The outer wall provides with an auxiliary sound hole. The auxiliary sound hole is communicated with the second sounding surface. The outer wall provides with a microphone sound hole. The microphone sound hole is communicated with the microphone unit. An ultrasonic signal emitted from auxiliary sound hole reaches the microphone unit from the microphone sound hole after reflection. The smart wearable device of the present invention is suitable for gesture recognition or mode adjustment, and has more diversified functions.
The present invention provides a surface acoustic wave filter module packaging structure and packaging method thereof. Packaging structure includes a substrate, a surface acoustic wave filter chip, a non-filter chip, a dry film layer, and a plastic sealing layer. Filter chip is fixed to substrate by first convex structures, a cavity is formed between filter chip and substrate. Non-filter chip is fixed to substrate by second convex structures. Dry film layer includes a fracture area surrounding non-filter chip, plastic sealing layer is filled between substrate and non-filter chip through fracture area. The packaging structure and method thereof of the present invention can ensure that a cavity can be formed between the bottom of surface acoustic wave filter chip and substrate, convex structures are not easily broken, avoiding the use of injection molding processes based on wafer level packaging filters, reducing costs and damage to chips during reliability testing.
H03H 9/64 - Filtres utilisant des ondes acoustiques de surface
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
The present invention provides a surface acoustic wave filter module packaging structure and packaging method thereof. The packaging structure includes a substrate, a surface acoustic wave filter chip, a non-filter chip, a dry film layer, and a plastic sealing layer. The surface acoustic wave filter chip is fixed to the substrate by first convex structures, a first cavity is formed between the surface acoustic wave filter chip and the substrate. The non-filter chip is fixed to the substrate by second convex structures, a second cavity is formed between the non-filter chip and the substrate. The packaging structure and method thereof of the present invention can ensure that a cavity can be formed between the bottom of all chips and the substrate, avoiding the use of injection molding processes based on wafer level packaging filters, reducing costs and damage to chips during reliability testing.
H03H 9/64 - Filtres utilisant des ondes acoustiques de surface
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
The present utility model provides a smart wearable device, comprising a glasses frame and glasses temples extending backwards from two sides of the glasses frame. Each glasses temple comprises a frame having an accommodating space, and a loudspeaker unit and a microphone unit which are accommodated in the accommodating space; the loudspeaker unit comprises a first sound production surface and a second sound production surface facing away from the first sound production surface; the frame comprises an upper wall surface, a lower wall surface and an outer wall surface connecting the upper wall surface and the lower wall surface; the lower wall surface is provided with a primary sound outlet hole, and the outer wall surface is provided with a secondary sound outlet hole; the primary sound outlet hole is communicated with the first sound production surface of the loudspeaker unit, and the secondary sound outlet hole is communicated with the second sound production surface of the loudspeaker unit; a microphone sound hole is formed at a position on the outer wall surface of the frame close to the secondary sound outlet hole; the microphone sound hole is communicated with the microphone unit; and an ultrasonic signal emitted from the secondary sound outlet hole reaches the microphone unit by means of the microphone sound hole. The smart wearable device of the present utility model is suitable for gesture recognition or mode adjustment, and has diverse functions.
Provided in the present invention are a surface acoustic wave filter module packaging structure and a packaging method therefor. The surface acoustic wave filter module packaging structure comprises a substrate, at least one surface acoustic wave filter chip disposed on the substrate, at least one non-filter chip disposed on the substrate, a dry film layer which covers the cover surface acoustic wave filter chip and the non-filter chip, and a plastic encapsulation layer which covers the dry film layer, wherein the surface of the surface acoustic wave filter chip is fixed to the substrate by means of a first bump structure, and a first cavity is formed between the surface acoustic wave filter chip and the substrate; and the surface of the non-filter chip is fixed to the substrate by means of a second bump structure, and a second cavity is formed between the non-filter chip and the substrate. The surface acoustic wave filter module packaging structure and method of the present invention ensure that cavities can be formed between the bottoms of all the chips and the substrate, and avoid using an injection molding process for a filter based on wafer-level packaging, thereby reducing costs and the damage to the chips in the reliability stage.
The present application provides a waterproof microphone apparatus. The waterproof microphone apparatus is installed on a vehicle body, and the vehicle body comprises a framework provided with a circular opening. The waterproof microphone apparatus comprises a shell, a circuit board provided in the shell, a microphone installed on the circuit board, a cover plate connected to the shell and the framework, a first waterproof film sealed on the cover plate, and a mask fixed to the cover plate; the inner wall of the framework where the opening is formed gradually inwardly inclines from the outer surface to the inner surface of the framework; the mask comprises a first wall facing the outside of the vehicle body, a second wall opposite to the first wall, and an outer sidewall connected to the first wall and the second wall; the outer sidewall gradually inwardly inclines from the first wall to the second wall, so that an inclined annular sound inlet channel is formed between the inner wall of the opening of the framework and the outer sidewall of the mask. The waterproof microphone apparatus of the present application can achieve a good waterproof effect, and have a more stable structure and an attractive appearance.
The present invention provides a waterproof microphone device installed on a vehicle body. The vehicle body includes a frame having a circular opening. The waterproof microphone device includes an outer housing, a circuit board, a microphone, a cover, a first waterproof membrane, and a casing. An inner wall of the frame forming the opening gradually slopes inwardly from an outer surface to an inner surface of the frame. The casing includes a first wall, a second wall, and an outer sidewall. The outer sidewall gradually slopes inwardly from the first wall to the second wall to form an inclined annular sound channel between the inner wall of the frame enclosing the opening and the outer sidewall of the casing. In present invention, the waterproof microphone device can achieve better waterproof effect, and has a more stable structure with a beautiful appearance.
A directional microphone module is disclosed. The directional microphone module includes a sound-permeable mesh, a housing having a top wall and a side wall, a circuit board, and a MEMS microphone fixed to the circuit board. The circuit board and the top wall are spaced for forming a first cavity. The circuit board and the sound-permeable mesh are spaced for forming a second cavity. The two cavities are only communicated at a side, and the MEMS microphone locates at an opposite side. The MEMS microphone includes two acoustic holes, the first one faces the top wall and communicates with the first cavity, the second one faces the circuit board and communicates with the second cavity through a through hole of the circuit board. The directional microphone module can always work stably and has a simple structure, and also can improve the production efficiency and reduce the labor cost.
H04R 1/32 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement
A bone conduction microphone is disclosed. The bone conduction microphone includes a circuit board, a housing engaged with the circuit board, a metal cover engaged with the circuit board for forming a first cavity, a vibration assembly, and a MEMS chip disposed in the first cavity. The metal cover includes a top wall and a side wall. The vibration assembly engages with the top wall for forming a second cavity and includes a vibration member and a spacer member. A first conduction cavity is formed by the housing, the vibration assembly, the metal cover and the circuit board. A vibration of the vibration member is transmitted to one side of the MEMS chip through the first conduction cavity, an acoustic channel of the circuit board and a back cavity of the MEMS chip. The bone conduction microphone reduces the electromagnetic interference and improves the SNR.
A bone conduction microphone, comprising: a circuit board, which has an acoustic channel; a housing, which is connected to the circuit board in a covering manner to form an accommodating space; a metal cover, which is arranged in the accommodating space and is connected to the circuit board in a covering manner to form a first cavity, wherein the metal cover comprises a top wall spaced apart from the circuit board and a side wall located between the top wall and the circuit board; a vibration assembly, which is arranged in the accommodating space and is connected to the top wall in a covering manner to form a second cavity, wherein the vibration assembly comprises a vibration member spaced apart from the top wall and a spacer located between the vibration member and the top wall, and the housing, the vibration assembly, the metal cover and the circuit board enclose to form a first conduction cavity; and an MEMS chip, which is arranged in the first cavity and is fixed to the circuit board, wherein the MEMS chip has a back cavity, the acoustic channel communicates the first conduction cavity with the back cavity, and vibration of the vibration member is conducted to one side of the MEMS chip through the first conduction cavity, the acoustic channel and the back cavity. The bone conduction microphone can reduce the impact of electromagnetic interference and improve the signal-to-noise ratio.
Provided in the present invention are a surface acoustic wave filter module packaging structure, and a packaging method for the structure. The surface acoustic wave filter module packaging structure comprises a substrate, a surface acoustic wave filter chip and a non-filter chip which are disposed on the substrate, a dry film layer covering the surface acoustic wave filter chip and the non-filter chip, and a plastic packaging layer covering the dry film layer, wherein the surface acoustic wave filter chip is fixed to the substrate by means of first bump structures; a cavity is formed between the surface acoustic wave filter chip and the substrate; the non-filter chip is fixed to the substrate by means of second bump structures; the dry film layer has a fracture area surrounding the non-filter chip; and the plastic packaging layer is filled between the substrate and the non-filter chip via the fracture area. The surface acoustic wave filter module packaging structure and the method of the present invention can ensure that a cavity can be formed between the bottom of the surface acoustic wave filter chip and the substrate, and bumps do not break easily; moreover, an injection molding process of a filter based on wafer-level packaging is avoided, thereby reducing the cost and damage to the chip in a reliability stage.
Disclosed in the present invention are an MEMS element and a preparation method therefor. The MEMS element comprises: a substrate; a diaphragm, which is connected to the substrate, wherein the diaphragm comprises an upper membrane and a lower membrane, which are arranged opposite each other; a counter electrode; and a plurality of supporting members, which are arranged between the upper membrane and the lower membrane and are spaced apart from the counter electrode, wherein two opposite ends of each supporting member are connected to the upper membrane and the lower membrane respectively. The diaphragm comprises a first area and a second area, the second area being located in the outer circumferential direction of the first area, wherein in the first area, a first electrode covers the surface of the side of the upper membrane away from the lower membrane, and a second electrode covers the surface of the side of the lower membrane away from the upper membrane; and in the second area, reinforcing layers respectively cover the surface of the side of the upper membrane away from the lower diaphragm and the surface of the side of the lower membrane away from the upper membrane. Compared with the prior art, in the present invention, the reinforcing layers are arranged in the second area of the diaphragm, such that the mechanical strength and robustness of the diaphragm can be enhanced by means of the reinforcing layers, thereby improving the preparation process yield.
The embodiments of the present invention provide a microphone amplifier circuit, a microphone circuit, and an electronic device. The microphone amplifier circuit comprises: a voltage regulator having an output end, a first constant-current source having an input end connected to the output end of the voltage regulator, a first transistor, a second transistor, a first driving unit, and a second driving unit. A gate electrode of the first transistor serves as an input end of the microphone amplifier circuit, and a source electrode of the first transistor serves as an output end of the microphone amplifier circuit. A source electrode of the second transistor is connected to an output end of the first constant-current source, a gate electrode of the second transistor is connected to the source electrode of the first transistor, and a drain electrode of the second transistor is grounded. The first driving unit is used for increasing the power supply rejection ratio of the microphone amplifier circuit, and the second driving unit is used for improving the sound pressure overload point of the microphone amplifier circuit. The embodiments of the present invention at least facilitate an improvement to the electrical performance of microphone circuits.
The embodiments of the present invention provide a microphone amplifier circuit, a microphone circuit, and an electronic device. The microphone amplifier circuit comprises a first transistor, a first constant-current source, and a source follower. A gate electrode of the first transistor serves as an input end of the microphone amplifier circuit, a source electrode of the first transistor serves as an output end of the microphone amplifier circuit, and a drain electrode of the first transistor is grounded. An input end of the first constant-current source is connected to a power supply, and an output end of the first constant-current source is connected to the source electrode of the first transistor. The source follower at least comprises a second transistor. A drain electrode of the second transistor is connected to the power supply, a gate electrode of the second transistor is connected to the source electrode of the first transistor, and a source electrode of the second transistor is connected to the drain electrode of the first transistor. The present invention at least facilitates an improvement to the THD performance of microphone amplifier circuits.
The present disclosure discloses a microphone module including at least two MEMS microphones, a printed circuit board, and a shell, each of the MEMS microphones is provided a sound inlet hole, a plurality of first sound pickup holes are provided on the printed circuit board, a plurality of second sound pickup holes are provided on the shell, each of the first sound pickup holes is communicating with the corresponding sound inlet hole and the corresponding second sound pickup hole, a diameter dimension of each of the first sound pickup holes is D1 mm, a distance between a center axes of adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. Compared with the related art, the microphone module disclosed by the present disclosure could have a better sound recognition effect.
H04R 1/40 - Dispositions pour obtenir la fréquence désirée ou les caractéristiques directionnelles pour obtenir la caractéristique directionnelle désirée uniquement en combinant plusieurs transducteurs identiques
H04R 1/04 - Association constructive d'un microphone avec son circuit électrique
The present disclosure discloses an electromagnetic microphone including: a housing; a circuit board; and a sound transducer, including: a substrate including a back cavity, a vibrator mounted on a side of the substrate away from the circuit board and covering the back cavity, including: a membrane; and a magnetic component mounted on the membrane and configured to generate magnetic field; a coil located within the magnetic field of the magnetic component; a sound hole penetrated on the housing or the circuit board is configured to communicate with the back cavity; when external sound wave transmitted from the sound hole and the back cavity acts on the membrane, the magnetic component and the coil interact to generate electrical signal. The electromagnetic microphone in the present disclosure has higher sensitivity, reliability and stability.
A micro-electro-mechanical system comprises counter electrodes, a first diaphragm, and a second diaphragm. The first diaphragm is provided with a plurality of first corrugations, each first corrugation comprises a first wave crest and a first wave trough, and the plurality of first wave crests and the plurality of first wave troughs are alternately arranged in a third direction. The second diaphragm is provided with a plurality of second corrugations, each second corrugation comprises a second wave crest and a second wave trough, and the plurality of second wave crests and the plurality of second wave troughs are alternately arranged in the third direction. The plurality of first wave crests and the plurality of second wave troughs are respectively aligned to form cavities, and the plurality of counter electrodes are respectively provided in the cavities. The plurality of first wave troughs are respectively aligned with the plurality of second wave crests, and at least some of the plurality of first wave troughs and the corresponding second wave crests are configured to be in contact with each other. The micro-electro-mechanical system maintains high acoustic compliance and sensitivity of the sealed dual-diaphragm structure, and has better firmness.
A microphone module, comprising a shell, a PCB, and at least two MEMS microphones having sound inlet holes. The MEMS microphones, the PCB, and the shell are sequentially arranged from top to bottom; the MEMS microphones are electrically connected to the PCB; the PCB is provided with first sound pickup holes corresponding to the sound inlet holes of the MEMS microphones; the shell is provided with second sound pickup holes corresponding to the first sound pickup holes; and the sound inlet holes, the first sound pickup holes and the second sound pickup holes are sequentially communicated. The diameter size of the first sound pickup hole is defined to be D1 mm, and the distance between the center axes of two adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. A plurality of MEMS microphones, a PCB, and a shell are used, and sound waves are sensed by means of sound inlet holes in the MEMS microphones, first sound pickup holes in the PCB and second sound pickup holes in the shell. By means of the sound wave sensing structure, the microphone module has a good sound receiving effect, and the sound recognition effect is improved.
The present disclosure relates to the technical field of machine housings, and provides a machine housing and an electronic device. The machine housing is applied to a mobile electronic terminal. The machine housing includes: an inner shell including an inner shell body and an accommodating groove formed by recessing from one side of the inner shell body; and an outer shell in an annular shape, wherein the housing extends around a periphery of the inner shell body and is fixed to the inner shell body. The outer shell is made of a titanium alloy material, the inner shell body is made of a metal material other than the titanium alloy material; and the outer shell and the inner shell body are fixedly molded into an integrated structure by a hot isostatic pressing process. Compactness, uniformity and performance of the machine housing may be improved by the hot isostatic pressing process.
A film bulk acoustic resonator, including: a substrate; an acoustic reflection structure; a bottom electrode; a piezoelectric film; a top electrode; and a raised frame. A spatial region formed by overlapping of the acoustic reflection structure, the bottom electrode, and the piezoelectric film and the top electrode in a thickness direction of the film bulk acoustic resonator is a resonance region, in which the raised frame is arranged, and openings are formed at a side of the raised frame away from the top electrode. The film bulk acoustic resonator can reduce the area ratio of the raised frame in the resonance region and the intensity of the parasitic resonance peak introduced by the raised frame without reducing the Q value of the resonator and without increasing manufacturing process steps.
The present invention relates to the technical field of enclosures, and provides an enclosure and an electronic device. The enclosure is applied to a mobile electronic terminal, and comprises: an inner enclosure, the inner enclosure comprising an inner enclosure body and an accommodating recess formed by recessing a side of the inner enclosure body; and an outer enclosure, the outer enclosure being in an annular shape, and the outer enclosure extending around the peripheral side of the inner enclosure body and being fixed to the inner enclosure body. The outer enclosure is made of a titanium alloy material; the inner enclosure body is made of a metal material other than the titanium alloy material; the outer enclosure and the inner enclosure body are fixed and formed into an integrated structure by means of the hot isostatic pressing process. The compactness, uniformity and performance of the enclosure of the present invention can be improved by means of the hot isostatic pressing process.
The present invention provides a thin-film bulk acoustic resonator. The resonator comprises a substrate, an acoustic reflection structure arranged on one side of the substrate, a bottom electrode stacked on the side of the acoustic reflection structure distant from the substrate, a piezoelectric film stacked on the side of the bottom electrode distant from the acoustic reflection structure, a top electrode stacked on the side of the piezoelectric film distant from the bottom electrode, and a protruding frame arranged on the side of the top electrode distant from the piezoelectric film; a spatial region formed by overlapping of the acoustic reflection structure, the bottom electrode, the piezoelectric film and the top electrode in the thickness direction of the thin-film bulk acoustic resonator is a resonance region; the protruding frame is located in the resonance region; and a plurality of holes are formed in the side of the protruding frame distant from the top electrode. According to the present invention, the area ratio of the protruding frame in the resonance region can be reduced, the intensity of a parasitic resonance peak caused by the protruding frame is reduced, the Q value of the resonator is not reduced, and steps of the manufacturing process are not increased.
The present application discloses a speaker box, including a casing with an accommodating cavity, and a sounding unit fixed in the accommodating cavity and dividing the accommodating cavity into a closed rear acoustic cavity and a front acoustic cavity communicated with an outside of the casing. The sounding unit is further provided with a heat exchange member, and a heat exchange cavity is formed in the heat exchange member. The heat exchange cavity is filled with a heat exchange medium, and part of the heat exchange element is exposed to the sounding unit. Compared with the prior art, in the present application, the sounding unit is provided with a heat exchange member. When the speaker box is in the working state, the sounding unit vibrates and generates heat, and the heat is conducted to the heat exchange medium in the heat exchange member through a wall of the heat exchange member. The heat exchange medium is in contact with the outside air of the sounding unit for heat exchange to release heat, thereby improving the heat dissipation efficiency of the speaker box.
A method for manufacturing radio frequency module, including: providing initial chip board including substrate and radio frequency modules fixed to the substrate, and the radio frequency module includes components; covering dry film on the initial chip board provided with the radio frequency modules, cavity is formed between the dry film, the components and the substrate; forming first metal layer on the dry film, forming plastic sealing layer on the first metal layer; forming second metal layer on the plastic sealing layer, the second metal layer is electrically connected to the first metal layer; and cutting the initial chip board along boundary between adjacent radio frequency modules to obtain single radio frequency module. The risk of short circuit of the radio frequency module can be effectively reduced, the electromagnetic shielding effect is better, and the production efficiency after electromagnetic shielding treatment is improved.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
98.
MICROELECTROMECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREFOR
A microelectromechanical system device. The device comprises a cover sheet (501) provided with a recess (502), and a device piece (503) bonded to the cover sheet (501) and provided with a functional chamber directly facing the recess (502). The cover sheet comprises a substrate (511), a first metal layer (521) and a grounding structure (507), the substrate (511) having a first surface that faces the device piece (503), the recess (502) being formed on the first surface, the first metal layer (521) and the grounding structure (507) being arranged on the part of the first surface except the recess, and the grounding structure (507) being arranged along the periphery of a bonding area where the first metal layer is located. The device piece (503) comprises a substrate (513), a structural layer (523) and a second metal layer (533) which are stacked successively, the structural layer (523) comprising a first portion and a second portion surrounding the first portion, the first portion being located in the functional chamber (504) and forming a structure used for achieving a mechanical function, and the second metal layer (533) being located on the second portion. The cover sheet (501) and the device piece (503) each comprise at least one electrode, and are bonded together by means of the first metal layer (521) and the second metal layer (533), all the electrodes being electrically connected by means of the first metal layer (521) and the second metal layer (533) bonded to each other. Further provided is a manufacturing method for a microelectromechanical system device.
B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
The present application discloses a speaker box, including a casing with an accommodating cavity, and a sounding unit fixed in the accommodating cavity and dividing the accommodating cavity into a closed rear acoustic cavity and a front acoustic cavity communicated with an outside of the casing. A heat exchange cavity is arranged within a wall of the accommodating cavity, and the heat exchange cavity is filled with a heat exchange medium. Compared with the prior art, in the present application, the heat exchange cavity filled with the heat exchange medium is arranged in the casing. When the speaker box is in the working state, the sounding unit vibrates and generates heat, and the heat is conducted to the heat exchange medium through a wall of the accommodating cavity. The heat exchange medium is in contact with the outside air for heat exchange to release heat, thereby improving the heat dissipation efficiency of the speaker box.
The present application provides a speaker module, included a casing, a speaker driver arranged in an accommodating cavity of the casing, and a heat dissipation bracket. The heat dissipation bracket includes a body portion. A part of the body portion is arranged in the accommodation cavity, and the other part of the body portion is arranged outside the casing. One end of the body portion located outside the casing is provided with an extension portion bent and extended upward along a thickness direction of the speaker module, and the extension portion is in abutted against the heat dissipation members outside the speaker module. The body portion is provided with a first cooling channel, which is arranged around the speaker driver. The extension portion is provided with a second cooling channel communicated with the first cooling channel. The heat dissipation bracket provided by the present application has high heat dissipation efficiency.
