This metal joined body comprises: a first plate member made of metal and having a first main surface and a second main surface facing the side opposite the first main surface; and a second plate member made of metal and having a third main surface and a fourth main surface facing the side opposite the third main surface. The first plate member has an embossed part in which the first main surface side forms a protruding section and the second main surface side forms a recessed section. The plate thickness from the third main surface to the fourth main surface of the second plate member is less than that of the embossed part in the plate thickness direction (X-axis direction) of the second plate member, and an end surface of the second plate member, which connects the peripheral edges of the third main surface and the fourth main surface, is joined to the protruding section of the embossed part.
Hollow containers (3, 4) are provided above a hollow column (2) provided around a liquefied gas pump (P), and a cable (8) for installing and removing the liquefied gas pump (P) is passed through the center of the containers (3, 4) from the bottom towards the top. The containers (3, 4) include: lower plate members (5, 6) having, at the center, cable through-holes (9, 10) allowing the cable (8) to pass; and stuffing box members (12) provided around the cable through-holes (9, 10) at the center of the lower plate members (5, 6), and having, at the center, cable insertion holes (13) through which the cable (8) is inserted. The stuffing box members (12) include opening diameter adjustment mechanisms (14, 20) that adjust the sizes of the opening diameters of the cable insertion holes (13).
F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients
F17C 9/00 - Procédés ou appareils pour vider les gaz liquéfiés ou solidifiés contenus dans des récipients non sous pression
Provided is a technique capable of easily controlling the shape of a three-dimensional object. A shaping nozzle 20 is configured to supply powder to be a material of a three-dimensional object to a shaping area 2 in which a three-dimensional object is shaped, and to melt the powder by irradiating the supplied powder with a beam. The shaping nozzle includes an inner cylinder 23 having a beam passage 25 through which a beam Bm passes, an outer cylinder 24 disposed outside the inner cylinder and having a powder passage 26 through which a powder Pd passes between the outer surface of the inner cylinder and the inner surface of the outer cylinder, and a plate member 40 disposed between a tip 29 of the inner cylinder and a tip 30 of the outer cylinder and the shaping area, and having hole 41 configured so that the beam that has passed through the beam passage and the powder that has passed through the powder passage pass therethrough.
B22F 10/25 - Dépôt direct de particules métalliques, p.ex. dépôt direct de métal [DMD] ou mise en forme par laser [LENS]
B29C 64/153 - Procédés de fabrication additive n’utilisant que des matériaux solides utilisant des couches de poudre avec jonction sélective, p.ex. par frittage ou fusion laser sélectif
The present invention pertains to a liquid-transporting apparatus. A liquid-transporting apparatus (1) for transporting liquefied gas is provided with a gas-mixing prevention device (20) that recovers bubbles generated from the liquefied gas before the bubbles are sucked into a pump (11).
F04D 29/70 - Grilles d'aspiration; Filtres; Séparateurs de poussière; Nettoyage
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
F04D 13/16 - Installations ou systèmes de pompage avec des réservoirs de stockage
5.
METHOD FOR FORMING PROTECTIVE FILM ON OUTER PERIPHERAL PART INCLUDING BEVEL PART OF SUBSTRATE
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japon)
Inventeur(s)
Fujikata, Jumpei
Togawa, Tetsuji
Hatakeyama, Masahiro
Tsuji, Kazuhito
Hori, Masaru
Miyashita, Naoto
Sekine, Makoto
Abrégé
The present invention aims to improve the quality of a protective film for protecting an outer peripheral part of a substrate. The present invention provides a method for forming, with use of a plasma, a protective film on an outer peripheral part, including a bevel part, of a substrate, the method comprising: a step in which a second surface of the substrate, which has a first surface and the second surface opposite to each other, is placed on a stage that is smaller than the size of the substrate, in such a manner that the outer peripheral part of the substrate protrudes from the outer edge of the stage; a step in which at least a part of the outer peripheral part of the substrate in the circumferential direction is caused to face an electrode; a step in which a first shielding structure is brought into contact with the first surface of the substrate, the first shielding structure separating the outer peripheral part and the region inside the outer peripheral part from each other, and/or a second shielding structure is brought into contact with the second surface of the substrate, the second shielding structure separating the outer peripheral part and the region inside the outer peripheral part from each other; and a step in which a protective film is formed on the outer peripheral part of the substrate by supplying a film forming gas between the outer peripheral part of the substrate and the electrode.
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p.ex. pour masquer ou en utilisant des techniques photolithographiques; Post-traitement de ces couches; Emploi de matériaux spécifiés pour ces couches
C23C 16/50 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c. à d. procédés de dépôt chimique en phase vapeur (CVD) caractérisé par le procédé de revêtement au moyen de décharges électriques
6.
WORK MANAGEMENT DEVICE, WORK MANAGEMENT SYSTEM, INFERENCE DEVICE, MACHINE LEARNING DEVICE, WORK MANAGEMENT METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
[Problem] To provide a work management device capable of automatically storing the work status of a worker with high accuracy and properly checking the work status. [Solution] A work management device 5, which manages a plurality of pieces of work performed by a worker U on a predetermined object, is provided with: an image data acquisition unit 501 that acquires image data 111 captured by an image capture unit 63 that is positioned facing forward from a worker U when the worker U wears a worker device 6 provided with the image capture unit 63; a work information generation unit 502 that generates work information 112 for each piece of work performed by the worker U on a predetermined work object 2, on the basis of the image data 111 acquired by the image data acquisition unit 501; and a storage unit 52 that stores, in time series, the work information 112 generated for each piece of work by the work information generation unit 502.
The present invention provides a technology that makes it possible to illuminate a portion (prescribed portion) which is irradiated with a beam in a state where a cover having a gas passage is provided to a nozzle. An observation device 5 of a beam processing device 1 has: a nozzle 20 configured to emit a beam Bm toward a prescribed portion P1; and a cover 30 provided around the nozzle and having a gas passage 32 configured to supply a purge gas Gs toward the prescribed portion. The observation device 5 comprises at least one light source 40 which is configured to generate light Lt. The at least one light source is configured such that the light generated by the light source passes through the gas passage to reach the prescribed portion.
Provided is a technology which enables reduction in influence of electric field shielding caused by a beam member of a paddle, or a technology which enables removal of air bubbles adhering to a hole of an ion resistor. A plating device 1000 comprises a paddle 70 disposed between an anode 11 and a substrate Wf and configured to stir a plating solution Ps by reciprocating in a direction parallel to the substrate, in a first direction and a second direction. The paddle includes a plurality of beam members 71 extending in a direction perpendicular to the reciprocating movement direction of the paddle. The reciprocation movement of the paddle in the first direction and the second direction involves the reciprocation movement of the paddle in a first reciprocation mode. In the first reciprocation mode, the paddle moves in the second direction with a stroke different from a stroke when moving in the first direction, thereby making a difference between the positions of the plurality of beam members when the paddle changes the movement direction from the second direction to the first direction, and the positions of the plurality of beam members when the paddle changes the movement direction from the first direction to the second direction.
A pump device (3) is provided with a motor casing (5) having corrosion resistance, and a motor cable (12) is covered with a motor cable protection tube (14) having corrosion resistance. The pump device (3) is provided with an in-tank pipe (15) having corrosion resistance. A purge gas pipe (17) through which a purge gas supplied from a purge gas supply unit (16) flows is connected to the motor cable protection tube (14) and the in-tank pipe (15), and is configured such that the purge gas circulates inside the pump device (3). The purge gas pipe (17) is provided with a pressure adjustment unit (18), a pressure sensor (19), and a flow rate sensor (20).
F04D 7/06 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant chauds ou corrosifs, p.ex. du métal liquide
F04B 15/04 - Pompes adaptées pour travailler avec des fluides particuliers, p.ex. grâce à l'emploi de matériaux spécifiés pour la pompe elle-même ou certaines de ses parties les fluides étant chauds ou corrosifs
A pump device (3) is provided with a motor casing (5) having corrosion resistance, and a sensor (9) installed near a bearing (8) inside the motor casing (5). A motor cable (12) and a sensor cable (13) are covered with a motor cable protection tube (14) and a sensor cable protection tube (15), respectively, which have corrosion resistance. A purge gas pipe (17) through which a purge gas supplied from a purge gas supply unit (16) flows is connected to the motor cable protection tube (14) and the sensor cable protection tube (15), and is configured such that the purge gas circulates inside the pump device (3).
F04D 7/06 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant chauds ou corrosifs, p.ex. du métal liquide
F04B 15/04 - Pompes adaptées pour travailler avec des fluides particuliers, p.ex. grâce à l'emploi de matériaux spécifiés pour la pompe elle-même ou certaines de ses parties les fluides étant chauds ou corrosifs
H02K 7/14 - Association structurelle à des charges mécaniques, p.ex. à des machines-outils portatives ou des ventilateurs
Provided is a technology which is capable of improving the power of plating solution stirring paddle. This plating apparatus 1000 is provided with a paddle 70 which is arranged between an anode 11 and a substrate Wf, is configured so as to stir a plating solution Ps by reciprocating in a first direction and a second direction, the directions being parallel to the anode, and comprises a honeycomb structure part 71 that has a plurality of polygonal through holes 74. The honeycomb structure part has a shape in which the paddle width in the center in a third direction that is perpendicular to the reciprocating direction of the paddle is wider than the paddle width at an end in the third direction. The honeycomb structure part has a first outer peripheral wall 75 that faces the first direction. The first outer peripheral wall has a first central wall 77 that is located in the center of the first outer peripheral wall in the third direction and extends in the third direction.
The present invention relates to a control device and a control method for controlling the operation of an exhaust gas treatment system having a plurality of processors. A control device (6) for controlling the operation of an exhaust gas treatment system (1) having a plurality of processors (2A-2C) comprises: a plurality of sub-control devices (8A-8C) that correspond to the plurality of processors (2A-2C) and individually control the operations of the plurality of processors (2A-2C); and a main control device (7) that is electrically connected to the plurality of sub-control devices (8A-8C). The main control device (7) comprises: a power supply (10) that supplies power to the plurality of sub-control devices (8A-8C); and an integrated control unit (11) that integrally controls the operations of the plurality of processors (2A-2C). The plurality of sub-control devices (8A-8C) are respectively provided with individual control units (13) that are electrically connected to devices (3, 4) for operating the corresponding processors (2A-2C).
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p.ex. pour masquer ou en utilisant des techniques photolithographiques; Post-traitement de ces couches; Emploi de matériaux spécifiés pour ces couches
Provided is a double suction impeller which can improve the right-rising characteristic of a pump and can easily be manufactured due to a simple configuration. This double suction impeller comprises: a main plate configured to be fixed to a rotary shaft; a pair of side plates provided on a first side and a second side of the main plate along the rotary shaft; and a plurality of blades arranged in a circumferential direction between each of the pair of side plates and the main plate so as to form a flow passage extending from an inner peripheral part to an outer peripheral part of the double suction impeller. The main plate has an outer diameter larger than the outer diameter of the pair of side plates and the outer diameter of the plurality of blades.
The present invention relates to an exhaust gas treatment device and an exhaust gas treatment method for performing a process for rendering harmless exhaust gas which is discharged from manufacturing devices for manufacturing semiconductor devices, liquid crystals, LEDs, etc. An exhaust gas treatment device (1) treats exhaust gas, said exhaust gas treatment device (1) comprising: a heat generation part (2) which is provided with a heat generation device (5) for generating heat; and a heat treatment part (3) which is connected to the heat generation part (2) and which uses heat to heat-treat exhaust gas, wherein the heat treatment part (3) has a tubular body (20) which forms a flow path (F) for exhaust gas and a water supply structure (30) which supplies water into the tubular body (20) and which forms a water film on the inner surface of the tubular body, and the tubular body (20) has a diameter expansion part (21) in which the diameter expands.
F23G 7/06 - Procédés ou appareils, p.ex. incinérateurs, spécialement adaptés à la combustion de déchets particuliers ou de combustibles pauvres, p.ex. des produits chimiques de gaz d'évacuation ou de gaz nocifs, p.ex. de gaz d'échappement
F23M 5/08 - Refroidissement des armatures, enveloppes ou parois; Tubes de parois
A pump device for transferring liquefied gas comprises a suction container (9) and a pump (10). The suction container (9) has a vacuum heat insulation container (18) and a vacuum heat insulation lid (19), and the pump (10) is disposed in a pump chamber (30) formed within the vacuum heat insulation container (18). A gas-layer space (L) for forming a gas heat insulation layer composed of boil-off gas is formed between the inner surface of the vacuum heat insulation container (18) and the outer surface of a sealing structure (25) of the vacuum heat insulation lid (19), the gas-layer space (L) communicating with the pump chamber (30).
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients
This underwater electric motor comprises: a rotary shaft (7) that is rotatably supported by a first bearing (3) and a second bearing (5); a first peripheral wall (25) and a second peripheral wall (26) that are disposed on both sides of a motor stator (20) in the axial direction of the rotary shaft (7); and a cylindrical wall (30) that is fixed to the first peripheral wall (25) and the second peripheral wall (26). The motor stator (20) is disposed in a sealed stator chamber (40). The rotary shaft (7) has a shaft hole (52) extending in the axial direction from an end (7a) thereof and a radial hole (55) that is in communication with the shaft hole (52). The radial hole (55) has an outlet (56) that opens on the outer peripheral surface of the rotary shaft (7). The outlet (56) is positioned further outward in the axial direction than the first bearing (3) and the stator chamber (40).
H02K 5/128 - Enveloppes ou enceintes caractérisées par leur configuration, leur forme ou leur construction spécialement adaptées à un fonctionnement dans un liquide ou dans un gaz utilisant des manchons d'entrefer ou des disques à film d'air
Provided is a technology that can minimize delay in a task of positioning a powder on a build plate, said delay being due to powder that has been scattered by a gas blown by a recoater. A powder supply device 20 comprises: a contactless recoater 30 that is configured so as to position a powder Pd on a build plate 3 by moving while blowing a gas Ga on the powder; and a powder recovery device 40 that is configured so as to move together with the contactless recoater and recover powder that was scattered by the gas blown by the contactless recoater.
B22F 12/60 - Dispositifs de planarisation; Dispositifs de compression
B29C 64/153 - Procédés de fabrication additive n’utilisant que des matériaux solides utilisant des couches de poudre avec jonction sélective, p.ex. par frittage ou fusion laser sélectif
The present invention relates to a casing for a centrifugal pump, and particularly relates to a casing for a multistage centrifugal pump. A casing (7) comprises a side plate (26) that has an obverse surface facing the reverse surface of a main plate (35) of an impeller (5), and a return blade (16) that has a circular arc shape and is projection-welded to the reverse surface of the side plate (26) at a plurality of welding points (PM1 to PM4) on the upper end surface thereof. The main plate (35) of the impeller (5) has a trim edge part (43) that is recessed radially inward. The weld at the outermost welding point (PM4) that is farthest from a rotary shaft (1) among the plurality of welding points (PM1 to PM4) either at least partially overlaps a projection point (PR1) at which the outermost peripheral part (OM) of the impeller (1) is projected onto the return blade (16), or is positioned radially inward of the projection point (PR1).
The present invention relates to an orientation control method for a hull part, and an airship. This orientation control method for the hull part (3) changes the orientation of the hull part (3) from a horizontal orientation to a vertical orientation.
A liquefied ammonia storage tank comprising: a storage tank body separated from the outside by a partition wall; and a vertical hollow column pipe provided to the storage tank body, and allowing communication between the inside and the outside of the storage tank. An upper opening section of the column pipe is provided with an upper opening of the column pipe and a liquid ammonia discharge pipe that branches from the column pipe. The upper opening is provided with an opening/closing lid that is capable of opening and closing. An ammonia gas recovery device for recovering ammonia gas vaporized from liquefied ammonia together with the atmospheric air when the opening/closing lid is in an open state is connected to the upper opening section of the column pipe.
B65D 90/28 - Moyens destinés à empêcher ou à limiter le dégagement de vapeurs
F17C 9/02 - Procédés ou appareils pour vider les gaz liquéfiés ou solidifiés contenus dans des récipients non sous pression avec changement d'état, p.ex. vaporisation
To provide a feature with which it is possible to improve the utilization rate of powder. This shaping nozzle 20 is configured to supply a powder serving as a material of a three-dimensional object to a shaping area where the three-dimensional object is shaped and to melt the powder by irradiating the supplied powder with a beam, the shaping nozzle 20 including an inner cylinder 23 that has beam passage 25 through which the beam passes, and an outer cylinder 24 that is disposed on the outer side of the inner cylinder 23 and that has a powder passage 26 through which the powder passes between the outer surface 28 of the inner cylinder 23 and the inner surface 27 of the outer cylinder 24, the inside dimension (D1) of the tip 29 of the beam passage 25 being larger than the inside dimension (D2) of the tip 30 of the outer cylinder 24.
B29C 64/153 - Procédés de fabrication additive n’utilisant que des matériaux solides utilisant des couches de poudre avec jonction sélective, p.ex. par frittage ou fusion laser sélectif
This pump installation device is provided with a work chamber (1) that forms a closed work space (15), an actuator-driven door (12) that covers an upper opening (3a) of a pump column (3), a suspension cable (23) that is for suspending a submersible pump (2) within the pump column (3), a power cable (36) that is for supplying power to the submersible pump (2), and a crane (40) for raising and lowering the suspension cable (23) and the power cable (36). The upper opening (3a) of the pump column (3), the actuator-driven door (12), and the crane (40) are disposed within the work space (15).
F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients
The present invention relates to a magneto-viscous fluid clutch, and more particularly to a clutch that uses magneto-viscous fluids typified by magneto-rheological (MR) fluids. A magneto-viscous fluid clutch (1) comprises: a first rotating shaft (5); a second rotating shaft (6); a first rotating plate (8) that is coupled to the first rotating shaft (5) and is integrally rotatable with the first rotating shaft (5); a second rotating plate (9) that is coupled to the second rotating shaft (6) and is integrally rotatable with the second rotating shaft (6); a stationary housing (12) that surrounds the first rotating plate (8) and the second rotating plate (9); a magneto-viscous fluid (20) that fills the space between the first rotating plate (8) and the second rotating plate (9); a coil (22) that is held in the stationary housing (12) and generates a magnetic field applied to the magneto-viscous fluid (20); and a current supply device (25) that causes current to flow to the coil (22).
The present invention relates to a cooling system that is used in cooling an etching device or another semiconductor manufacturing device. A cooling system (5) comprising: at least one heat exchange unit (8) that generates a cooling liquid for cooling a plurality of processing chambers (2A-2C) that are installed within a clean room, the at least one heat exchange unit (8) supplying the cooling liquid into the plurality of processing chambers (2A-2C); a cooling device (10) for cooling an antifreeze liquid; an antifreeze liquid circulation line (25) that extends between the at least one heat exchange unit (8) and the cooling device (10); and an antifreeze liquid pump (27) for causing the antifreeze liquid to circulate. The at least one heat exchange unit (8) is provided with a cooling liquid pump (30) for causing the cooling liquid to circulate, a heat exchanger (31) that carries out heat exchange between the cooling liquid and the antifreeze liquid, and a cooling-side buffer tank (33) that is disposed on the upstream side of the heat exchanger (31) in a cooling-liquid circulation direction.
F25B 1/00 - Machines, installations ou systèmes à compression à cycle irréversible
F25B 1/053 - Machines, installations ou systèmes à compression à cycle irréversible à compresseur rotatif du type à turbine
F25B 7/00 - Machines, installations ou systèmes à compression fonctionnant en cascade, c. à d. avec plusieurs circuits, l'évaporateur d'un circuit refroidissant le condenseur du circuit suivant
H01L 21/3065 - Gravure par plasma; Gravure au moyen d'ions réactifs
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
A substrate polishing device according to the present invention comprises: a turntable that has a first adhesion surface; and a polishing pad that has a second adhesion surface that is fixed by adhesion to the first adhesion surface. An adhesion area and a first separation assistance area are provided between the first adhesion surface and the second adhesion surface. The first adhesion surface and the second adhesion surface are adhered at the adhesion area. The adhesive force that works between the first adhesion surface and the second adhesion surface at the first separation assistance area is less than the adhesive force that works between the first adhesion surface and the second adhesion surface at the adhesion area. The first separation assistance area is positioned at an outer circumferential part of the polishing pad.
The present invention relates to a substrate processing device which applies a filler to gaps between edges of a plurality of substrates constituting a multilayer substrate. The substrate processing device, which applies a filler (F) to a multilayer substrate (Ws) obtained by bonding a first substrate (W1) to a second substrate (W2), is equipped with: a substrate holder (2) which holds and rotates the multilayer substrate (Ws); and a multi-nozzle head (20) for applying the filler (F) to a gap (G) between an edge (E1) of the first substrate (W1) and an edge (E2) of the second substrate (W2). The multi-nozzle head (20) includes a plurality of liquid-jet nozzles (21) which eject the filler (F), the plurality of liquid-jet nozzles (21) being arranged parallel to a rotation axis (Ct) of the substrate holder (2).
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluide; Récupération de l'excès de liquide ou d'un autre matériau fluide
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
B05C 11/00 - APPAREILS POUR L'APPLICATION DE MATÉRIAUX FLUIDES AUX SURFACES, EN GÉNÉRAL - Parties constitutives, détails ou accessoires non prévus dans les groupes
B05C 13/02 - Moyens pour manipuler ou tenir des objets, p.ex. des objets individuels pour des objets particuliers
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
This reciprocating pump (2) comprises: a cylinder (26) which has therein an inflow chamber (21), a reset chamber (22), an intermediate chamber (23), and a pressurizing chamber (24); a piston (30) which is disposed inside of the cylinder (26); a first seal (31), a second seal (32), and a third seal (33) which are disposed in a gap between the inside surface of the cylinder (26) and the outside surface of the piston (30); an inlet check valve (51) which is connected to an inlet (26A); an inflow-side check valve (52) and an outflow-side check valve (53) which are disposed in a piston flow passage (40); a discharge check valve (54) which is connected to a discharge outlet (26B); and a leakage discharge check valve (55) which is connected to a leakage discharge port (45) in the cylinder (26). The piston (30) has a communicating flow passage (41) through which the piston flow passage (40) and the intermediate chamber (23) communicate.
F04B 53/00 - "MACHINES" À LIQUIDES À DÉPLACEMENT POSITIF; POMPES - Parties constitutives, détails ou accessoires non prévus dans les groupes ou ou présentant un intérêt autre que celui visé par ces groupes
28.
PLATING DEVICE AND CLEANING METHOD FOR CLEANING SUBSTRATE HOLDER
Provided is a plating device wherein, after a substrate holder is cleaned, residual cleaning solution is removed. This plating device comprises: a substrate holder that holds a substrate and has an electrical contact for supplying power to the substrate; a holder cleaning tank for cleaning the substrate holder when the substrate holder is not holding the substrate; a holder drying tank for drying the substrate holder that has been cleaned in the holder cleaning tank; and a conveying device for conveying the substrate holder from the holder cleaning tank to the holder drying tank.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
C25D 17/28 - Appareils pour le revêtement électrolytique de petits objets en vrac comportant des moyens pour déplacer les objets individuellement à travers l'appareillage pendant le traitement
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
29.
PLASMA TREATMENT DEVICE AND SUBSTRATE TREATMENT DEVICE
NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY (Japon)
Inventeur(s)
Shamoto, Mitsuhiro
Ando, Atsushi
Fujikata, Jumpei
Higashi, Takaaki
Sakue, Daiki
Ishijima, Tatsuo
Abrégé
Provided is a technology that enables liquid plasma treatment of a substrate surface at low power. A plasma treatment device (10) comprises: a chamber (20) that stores a liquid Lq; a substrate holder (50) that holds a substrate Wf while the substrate is disposed in the liquid; a gas chamber (60) which accommodates a gas Ga, which has an opening (64) in an area opposing the substrate, and in which at least the opening is disposed inside the liquid of the chamber and is spaced apart from the substrate; a microwave generation device (80) that generates microwaves; a waveguide (82) that has a prescribed area (84) disposed inside the gas chamber and that transmits, to the prescribed area, the microwaves generated by the microwave generation device; and an antenna (90) that is disposed in the prescribed area of the waveguide and that induces plasma by projecting the microwaves into the gas chamber.
The present invention prevents breakage at the peripheral edges of a substrate and holds the substrate stably. A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334 for suctioning a substrate WF, and a depressurization section 334b that communicates with a depressurization means 31; a shielding member 332 that shields the surface 334c of the porous member 334 on the reverse side from the substrate suction surface 334a; and a bag member 336 that is disposed so as to enclose the porous member 334 and communicates with a gas supply source 331.
The present disclosure provides a substrate holder which is configured such that a mechanism for affixing a first holding material and a second holding material to each other can be operated in a non-contact manner. A substrate holder according to the present disclosure is provided with: a first holding material; a second holding material for holding a substrate together with the first holding material by having the substrate sandwiched therebetween; an engaging member which is provided on one of the first holding material and the second holding material; and a member to be engaged, which is affixed to the other of the first holding material and the second holding material. The engaging member comprises a magnet and is configured to be movable between a locked position in which the engaging member and the member to be engaged are engaged with each other by the magnetic force acting on the magnet, whereby the first holding material and the second holding material are affixed to each other, and an unlocked position in which the engagement between the engaging member and the member to be engaged is released, whereby the fixation of the first holding material and the second holding material is released.
The present invention relates to a polishing method for polishing a substrate such as a wafer or a panel. In this polishing method: a polishing pad (polishing implement) (1) having a polishing surface (1a) is caused to rotate; a substrate (W) is pressed against the polishing surface (1a) to polish the substrate (W); an assessment is made, during polishing of the substrate (W), as to whether each of a plurality of measurement data points measured by a sensor (30) is valid; and a representative measured value of a physical quantity is determined, each time the polishing table (3) rotates, on the basis of measured values of the measurement data points that are assessed to be valid. In the assessment as to whether the measurement data points are valid, the number of measurement data points within a search region is counted, and the measurement data points being assessed are assessed to be valid if the number of measurement data points within the search region is equal to or greater than a threshold value.
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B24B 49/14 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la température pendant le meulage
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
The present invention relates to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also relates to a polishing device for polishing a substrate with such a polishing head. A polishing head (10) for polishing a substrate (W) comprises: a pressing member (12) that presses a polishing tape (2) against the substrate (W); and an actuator (15) that is connected to the pressing member (12), and imparts a pressing force to the pressing member (12). The pressing member (12) has a plurality of protruding parts (50), and the plurality of protruding parts (50) are arranged along a longitudinal direction of the pressing member (12), and arranged along a traveling direction (Z) of the polishing tape (2).
The present invention pertains to a polishing method, a polishing device, and a recording medium. The polishing method is configured as follows: an output waveform which was measured and an estimation detection time are input to a model constructed using a machine learning algorithm; and the model outputs a waveform processing recipe that includes a waveform processing parameter for determining the simulation detection time with which the difference with the estimation detection time becomes the smallest value possible.
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
The present invention relates to a technology for applying a filler to a gap between edges of a plurality of substrates constituting a multilayer substrate produced by bonding the substrates. This multilayer structure production device comprises: a substrate holder (2) which holds and rotates a multilayer substrate (Ws); an applicator (3) which has a filler ejection port (21a) for ejecting a filler (F) and applies the filler (F) to a gap (G) between an edge (E1) of a first substrate (W1) and an edge (E2) of a second substrate (W2); a relative-movement mechanism (30) for moving the applicator (3) and/or the substrate holder (2); a position detector (5) which detects position information on an application-target point (Tp) within the gap (G); and a movement control unit (10) which makes the relative-movement mechanism (30) regulate the relative positions of the filler ejection port (21a) and the application-target point (Tp) on the basis of the detected position information.
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluide; Récupération de l'excès de liquide ou d'un autre matériau fluide
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
B05C 11/00 - APPAREILS POUR L'APPLICATION DE MATÉRIAUX FLUIDES AUX SURFACES, EN GÉNÉRAL - Parties constitutives, détails ou accessoires non prévus dans les groupes
B05C 13/02 - Moyens pour manipuler ou tenir des objets, p.ex. des objets individuels pour des objets particuliers
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliqués; Traitement ultérieur des revêtements appliqués, p.ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
B05D 7/00 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
A plurality of trench grooves (8) are formed in a first electrode (6) of a gas generation device (1). A discharge space (12) formed between a first electrode surface (7) and a second electrode surface (11) is connected to a gas introduction space (17) for introducing a material gas from a material gas supply port (4). The ratio P/D of the pitch P of the trench grooves (8) to the diameter D of the first electrode (7) is set at 0.0020-0.0150, and the ratio VT/VG of the volume VT of the trench space formed by the trench grooves (8) to the volume VG of the gas introduction space (17) is set at 0.016-0.203.
The present invention efficiently removes bubbles from the entirety of a resistor. The present invention comprises: a plating bath 410 that is configured to accommodate a plating solution; a substrate holder 440 that is configured to hold a substrate Wf such that a surface to be plated faces downward; an anode 430 that is disposed in the plating bath 410; a resistor 450 that is disposed between the substrate Wf and the anode 430; a mixing member 480 that is disposed between the substrate Wf and the resistor 450; and a driving mechanism 482 that is configured to cause the mixing member 480 to reciprocate along the surface of the substrate Wf to be plated, wherein the driving mechanism 482 is configured to perform, during a bubble removal process for removing bubbles that have adhered to the resistor 450, a first bubble removal operation in which the mixing member 480 is caused to reciprocate using a first position as a center, and a second bubble removal operation in which the mixing member 480 is caused to reciprocate using a second position that differs from the first position as a center.
Provided is a technique whereby the amount of a powder discharged from a discharge port of a powder supply device can be easily adjusted. A powder supply device 30 comprises: a storage member 31 having a storage chamber 38; a discharge member 33 having a discharge port that discharges a powder; an introduction member 32, the introduction member being disposed lower than the storage member and higher than the discharge member and configured so as to introduce powder in the storage chamber to the discharge port, and a plurality of introduction chambers 40, 41 having mutually different volumes being provided inside the introduction member so as to be layered in a vertical direction in the introduction member; an inlet shutter 34 that is configured so as to open and close an inlet opening 42 for introducing the powder in the storage chamber to the introduction member; an outlet shutter 35 that is configured so as to open and close an outlet opening 43 for introducing the powder in the introduction member to the discharge port; and an intermediate shutter 36 that is configured so as to open and close an intermediate opening 44 that communicates one introduction chamber with another introduction chamber which are adjacent to each other among the plurality of introduction chambers.
The present invention relates to: a substrate processing apparatus which cleans a substrate after polishing; and a substrate processing method. According to the present invention, a substrate cleaning apparatus is provided with a cleaning device (131) which cleans a polished substrate. The cleaning device (131) is provided with a microbubble water module (90) that cleans the surface of a substrate (W), which is held by a substrate cleaning holding part (52), by spraying microbubble water onto the surface of the substrate (W). The microbubble water module (90) is provided with: a spray nozzle (91) for spraying microbubble water onto a target region (TR) which is a long region extending from the center (Cr) of the substrate (W) to the outermost circumferential part (Ci) of the substrate (W); and a microbubble water supply device (93) which supplies microbubble water to the spray nozzle (91).
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
B24B 55/06 - Equipement d'enlèvement des poussières sur les machines à meuler ou à polir
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
40.
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
[Problem] To provide an information processing device that enables appropriate prediction of the state of a driven roller in accordance with the operation state of a substrate processing device. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires operation state information including driving roller state information indicating the state of a driving roller as the operation state of a substrate processing device provided with a polishing tape conveyance part which conveys a polishing tape for polishing a peripheral part of a substrate along a conveyance path in which the driving roller and a driven roller are disposed, and with a polishing head part which is disposed midway of the conveyance path and which can press the polishing tape to the peripheral part, the substrate processing device being configured to perform a polishing process of the peripheral part; and a state prediction unit 501 that inputs the operation state information acquired by the information acquisition unit 500 to trained models 12A, 12B which have learned, through machine learning, the correlation between the operation state information and driven roller state information indicating the state of the driven roller when the substrate processing device performs the polishing process in the operation state indicated by the operation state information, to thereby predict driven roller state information with respect to the operation state information.
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
The present invention forms a plurality of bumps at a uniform height on a substrate. The present invention provides a plating device for forming bumps on a substrate. This plating device comprises: a substrate holder that is configured so as to hold the substrate; a plating tank that is configured so as to accommodate the substrate holder along with a plating fluid; an anode that is positioned within the plating tank so as to face the substrate which is held by the substrate holder; a power source that is configured so as to supply a current between the substrate and the anode; and a control unit, wherein the control unit is configured so as to cause a current to be outputted from the power source, said current having a first period, during which a positive direction current for depositing a metal onto the substrate from the plating fluid is supplied, a second period, during which at least one reverse current pulse flowing in the opposite direction from the positive direction current is supplied, and a third period, during which the supply of current is stopped in the midst of transitioning from the reverse current pulse to the positive direction current.
The present invention relates to a joint device used for driving a reciprocating pump such as a plunger pump or a piston pump. A joint device (1) for coupling a drive source and a reciprocating pump comprises a first thrust member (3) having a first recessed surface (3a), a second thrust member (5) having a second recessed surface (5a), a spherical body (7) sandwiched between the first recessed surface (3a) and the second recessed surface (5a), and a housing (11) having an internal space (10) for accommodating the first thrust member (3), the second thrust member (5), and the spherical body (6). The first thrust member (3) and the second thrust member (5) are disposed along a center axis line CL of the housing (11) and the width of the internal space (10) is longer than the widths of the first thrust member (3), the second thrust member (5), and the spherical body (7).
This liquefied gas transportation system is provided with a reciprocating pump device (3) for pressurizing boil-off gas and a liquefied gas in a storage tank (1). The reciprocating pump device (3) is provided with a cylinder (14) having therein a gas pressurization chamber (10) and a liquid pressurization chamber (11), a piston (17) disposed in the cylinder (14), and an actuator (18) that is connected to the piston (17) and is for reciprocating the piston (17). The piston (17) is positioned between the gas pressurization chamber (10) and the liquid pressurization chamber (11). The piston (17) has a gas pressurization surface (21) facing the gas pressurization chamber (10) and a liquid pressurization surface (22) facing the liquid pressurization chamber (11).
F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients
F17C 9/00 - Procédés ou appareils pour vider les gaz liquéfiés ou solidifiés contenus dans des récipients non sous pression
Provided is a plating device with which it is possible to detect, during a plating process, the film thickness of a plating film formed on a substrate. This plating device is provided with: a plating bath; a substrate holder for holding a substrate; an anode disposed in the plating bath so as to face the substrate held by the substrate holder; a resistor that is disposed between the substrate and the anode and that is for adjusting electrical field; a first sensing electrode disposed in a region between the anode and the surface of the substrate subject to plating, the tip of the first sensing electrode being disposed at a first position in the resistor; a second sensing electrode disposed at a second position, at which there is less potential change than at the first position, in the plating bath; and a control module for measuring the potential difference between the first sensing electrode and the second sensing electrode and estimating the plating thickness of the substrate on the basis of the potential difference.
Provided is a technology with which an increase in size of a polishing table can be suppressed, and with which a polishing pad can be dressed while preventing a dresser from contacting a top ring during polishing of a substrate. A polishing device 1 comprises a top ring 30 and at least one dressing mechanism 40. In plan view, the value of 1/2 of a maximum outer dimension of a polishing table 20 is smaller than a maximum outer dimension of the top ring. The top ring has, above a substrate retaining member 31, an expanded area 34 that is expanded farther outward than the substrate retaining member in a plan view. The at least one dressing mechanism comprises: a dresser 41; and a raising/lowering device 43 that is fixed to the expanded area of the top ring, and that is configured to raise/lower the dresser so as to switch between a state in which the dresser is in contact with a polishing pad Pd and a state in which the dresser is not in contact with the polishing pad. The raising/lowering device brings the dresser into contact with the polishing pad during polishing of a substrate Wf.
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
A transfer machine 80 comprises: an arm 810; a holding unit 830 provided on the arm 810 to hold a substrate W; a turning unit 100 that turns the arm 810 about a turning axis A; and a control unit 50 that adjusts the position in an in-plane direction of the substrate W by turning the arm 810 by means of the turning unit 100 on the basis of the position, measured by a measuring unit 110, in the in-plane direction of the substrate W being held by the holding unit 830.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
B25J 15/08 - Têtes de préhension avec des éléments en forme de doigts
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
The present invention suppresses sagging of a central section of a paddle in a cup-type plating device. The present invention includes: a plating bath 410 for accommodating a plating liquid; an anode disposed within the plating bath 410; a substrate holder configured so as to retain a substrate Wf in a state in which a surface to be plated Wf-a is facing downward; a paddle 460 disposed between the anode and the substrate Wf; a drive mechanism 462 configured so as to support a base section 460A of the paddle 460 and cause the paddle 460 to move reciprocally along the surface to be plated Wf-a of the substrate Wf; a first magnet 464 provided on the paddle 460; and a second magnet 468 provided so as to face the first magnet 464. The first magnet 464 and the second magnet 468 are configured so as to mutually exert magnetic force so that a central section 460C of the paddle 460 between the base section 460A and a tip section 460B approaches the surface to be plated Wf-a of the substrate Wf.
C25D 21/10 - Agitation des électrolytes; Déplacement des claies
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
This substrate processing device comprises a plurality of polishing modules for polishing a substrate, and a transport unit for moving the substrate between the plurality of polishing modules. The plurality of polishing modules include a first module group and a second module group. In plan view, the transport unit is positioned between the first module group and the second module group. The first module group has a first upper-side lane and a first lower-side lane in which at least two polishing modules are arranged adjacent to one another. The second module group has a second upper-side lane and a second lower-side lane in which at least two polishing modules are arranged adjacent to one another.
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verre; Accessoires à cet effet
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
The present invention increases a transport speed of a substrate and suppress attachment of particles to a processed surface of the substrate. This transport device configured to transport the substrate in an elevation direction and a travel direction orthogonal to the elevation direction comprises a mounting member 710-1 that is fixed to a side surface of a first module frame 402A for installing a plating module having substrate loading/unloading ports 404-1 to 404-8. The mounting member 710-1 includes plurality of travel rails 714-1 to 714-3 disposed on both sides of the substrate loading/unloading ports 404-1 to 404-8 in the elevation direction and extending in the travel direction. The transport device includes an elevation rail 716 extending in the elevation direction crossing over the plurality of travel rails 714-1 to 714-3 and being movable along the plurality of travel rails 714-1 to 714-3 and a transport robot 718 capable of being elevated along the elevation rail 716 and having a hand for holding the substrate.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
[Problem] To provide a safety assistance device that can improve operation efficiency of an operator while appropriately securing safety of the operator. [Solution] A safety assistance device 5 assists safety of an operator U who performs, with at least one portion of the body positioned within a prescribed movable range, a prescribed operation to a processing device that performs prescribed processing by moving a movable unit having the movable range. The safety assistance device 5 comprises: an image data acquisition unit 500 that acquires image data 110 captured by an image capturing unit 63 disposed so as to face the front of the operator U when the operator U wears an operator device 6; and an interlock information generation unit 501 that generates interlock information indicating an interlock state of the movable unit on the basis of the image data 110 acquired by the image data acquisition unit 500.
The present invention relates to a polishing information processing device provided to a polishing device that polishes a peripheral edge section of a substrate. A polishing information processing device (112) comprises: an information acquisition unit (241) that acquires a polishing condition, and a profile before and after polishing of a peripheral edge section of a wafer (W); a state prediction unit (240b) that inputs, into a trained model, information including the newly acquired polishing condition and the profile of the peripheral edge section of a substrate before polishing, and predicts the profile of the peripheral edge section of the substrate after polishing; and a correction unit (242) that corrects the polishing condition on the basis of a target profile of the peripheral edge section of the wafer (W) and the profile of the peripheral edge section of the wafer (W) after polishing, as predicted by the state prediction unit (240b).
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
52.
SUBSTRATE PROCESSING METHOD, PROCESSING HEAD, AND SUBSTRATE PROCESSING DEVICE
The present invention relates to a substrate processing method for processing a substrate. The substrate processing method includes processing a processed surface (5a) of a substrate (W) by rotating the substrate (W) about an axis thereof, pressing a processing tape (2A) against the processed surface (5a) of the substrate (W) by means of a pressing member (12) of a processing head (10A) while feeding the processing tape (2A) in a longitudinal direction thereof, in a state in which the pressing member (12) is inclined in a first direction (D1) relative to a prescribed pressing direction (CL), and then pressing the processing tape (2A) against the processed surface (5a) by means of the pressing member (12) in a state in which the pressing member (12) is inclined relative to the pressing direction (CL) in a second direction (D2) opposite to the first direction (D1), the first direction (D1) and the second direction (D2) being directions in the longitudinal direction of the processing tape (2A) on the pressing member (12).
B24B 21/06 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet pour meuler des surfaces planes munis d'organes à surface de contact limitée pour pousser la courroie contre la pièce à travailler, p.ex. munis de sabots qui balaient complètement la surface à meuler
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissage; Accessoires à cet effet
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A substrate processing device comprises: a plurality of polishing modules (1A-1D) that are disposed in a polishing level and that polish a substrate; a post-processing lane (2A, 2B) that is disposed in a post-processing level and that performs post-processing, which includes washing and drying, on the polished substrate; and a lifting/lowering conveyance device (5) that extracts the polished substrate from one of the plurality of polishing modules (1A-1D) and conveys the substrate directly to the post-processing lane (2A, 2B). The post-processing level is an upper level positioned above the polishing level or a lower level positioned below the polishing level. The lifting/lowering conveyance device (5) is disposed equidistantly from the plurality of polishing modules (1A-1D). The lifting/lowering conveyance device (5) has a holding hand (40) that enables lifting/lowering between the polishing level and the post-processing level.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p.ex. entre différents postes de travail
The present invention pertains to a polishing device. This polishing device comprises a sensor structure (100) for detecting a polishing amount of a peripheral edge section of a substrate (W). The sensor structure (100) comprises: a sensor head (102) having a contact surface (102a); and a displacement sensor (101) for detecting the polishing amount of the peripheral edge section of the substrate (W) by means of the displacement of the sensor head (102).
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
55.
CULTIVATION MANAGEMENT DEVICE AND CULTIVATION MANAGEMENT SYSTEM
A cultivation management device 10 according to one aspect of the present invention manages the cultivation of aquatic organisms in a fish tank. This cultivation management device 10 comprises: a body length measurement unit for measuring the body length of an aquatic organism; and an activity estimation unit which estimates the activity of the aquatic organism on the basis of the measured body length.
The present invention relates to a substrate-cleaning device and a substrate-cleaning method, in which a cleaning tool is brought into contact with the front or back surface of a substrate, e.g., a wafer, to clean the front or back surface of the substrate. This substrate-cleaning device comprises: a substrate-holding part (41) which holds and rotates a peripheral edge portion of a substrate (W); and at least one substrate-cleaning tool (42) which comes into contact with the front or back surface of the substrate (W) held by the substrate-holding part (41) and cleans the front or back surface of the substrate (W). The substrate-cleaning tool (42) comprises a Bernoulli chuck (55), which ejects a fluid to generate suction power for suction-holding the front or back surface of the substrate (W), and a cleaning member (56) attached to the Bernoulli chuck (55). The cleaning member (56) is pressed against the front or back surface of the substrate (W) in accordance with the suction power of the Bernoulli chuck (55).
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
57.
POLISHING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the polishing device by inputting state-reflective information reflecting the state of the polishing pad of the polishing device, into a machine learning model that has learned, by machine learning, a correlation between state-reflective information reflecting the state of another polishing pad and the polishing index of the other polishing pad.
B24B 37/10 - Machines ou dispositifs de rodage; Accessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
A data processing system according to the present invention comprises: a physical quantity measurement device that measures a physical quantity for each predetermined monitoring cycle; a data collection device that has a collection communication unit which is connected to the physical quantity measurement device and a collection control unit which causes the collection communication unit to provide an external notification of the physical quantity acquired via the collection communication unit; and a data management device that has a management communication unit which is connected to the data collection device, a management control unit which determines that an anomaly has occurred when the physical quantity acquired from the data collection device via the management communication unit has exceeded a predetermined threshold, and a management storage unit which, for each monitoring cycle, stores determination data indicative of the occurrence of the anomaly, wherein when the management storage unit has acquired determination data indicative of the occurrence of an anomaly a predetermined number of times or more consecutively, the management control unit yields a determination result and causes the management communication unit to notify a terminal device of the determination result.
Provided is a technology by which a chemical can be effectively fixed to the surface of a substrate. A substrate treatment device 1 comprises: an activating device 40 configured so that, in a state where a liquid is supplied to a surface of a substrate Wf and a glass plate 100 is disposed on the surface of the substrate, the activating device activates the surface of a substrate by projecting light onto the surface of the substrate from the side of the glass plate opposite the substrate; a liquid chemical supply device 50 that supplies a liquid chemical to the surface of the substrate in a state where the glass plate is removed from the surface of the substrate; and a chemical fixing device that fixes the chemical to the surface of the substrate by drying and heating the liquid chemical on the surface of the substrate. A flow path 110 through which liquid can flow is provided to an opposing surface of the glass plate, said surface facing the surface of the substrate.
This data processing system comprises a terminal device and a data management device comprising: a management and communication unit which can connect to the terminal device; a management and storage unit which stores notification item data including specifications of at least one machine to serve as a target; and a management and control unit which causes a notification of the notification item data stored in the management and storage unit to be provided by the management and communication unit to the terminal device, acquires, from the management and communication unit, notification item data in which selection or non-selection has been indicated using the terminal device, and causes the notification item data to be stored in the management and storage unit.
The present invention relates to a pump for a liquid and particularly relates to a pump having a mechanical seal disposed on a rotating shaft. A pump (P) includes: a retainer (41) held by a spring (33) that presses a rotating ring (31) of a mechanical seal (20) against a stationary ring (32) thereof; and a retainer holder (50) attached to a back side of an impeller (2). The retainer holder (50) has: a peripheral wall (52) inside which the retainer (41) is fitted; and a bottom wall (53) that extends radially inward from the peripheral wall (52). The peripheral wall (52) protrudes from the bottom wall (53) toward the mechanical seal (20). The peripheral wall (52) has a tapered surface (54) formed at an edge thereof. The tapered surface (54) has a truncated cone shape in which the inner diameter of the peripheral wall (52) increases with increasing the distance from the bottom wall (53).
F04D 29/62 - Montage; Assemblage; Démontage des pompes radiales ou hélicocentrifuges
F16J 15/34 - Joints d'étanchéité entre deux surfaces mobiles l'une par rapport à l'autre par bague glissante pressée contre la face plus ou moins radiale d'une des deux parties
62.
DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, AND DATA COLLECTION METHOD
This data processing system: acquires processing data as new collection data from a processing data transmission source, which is an external device, at a predetermined monitoring cycle; when a collection communication unit is not connected to a management communication unit, stores the new collection data as storage data in a collection and storage unit; and, after the collection communication unit has been connected to the management communication unit, transmits, to a data management device, collection data which is a combination of new collection data that has been newly acquired from the processing data transmission source at the next monitoring cycle and the storage data stored in the collection and storage unit.
G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps
H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
63.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The present invention relates to a substrate processing method and a substrate processing apparatus, with which cracking and chipping of a multilayer substrate obtained by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge parts of the plurality of substrates that constitute the multilayer substrate. This substrate processing apparatus (1) is provided with: an application device (3) which applies a filler (F) to a gap (G) between an edge part (E1) of a first substrate (W1) and an edge part (E2) of a second substrate (W2); a thermographic camera (5) which produces a thermal image (40) from the infrared light irradiated from the filler (F) applied to the gap (G); and an image processing unit (30) which determines the state of the filler (F) applied to the gap (G) on the basis of the thermal image (40).
The present invention relates to a pump device for transferring an ultracold liquefied gas such as liquefied hydrogen or liquefied natural gas, and in particular to a pump device having an electric motor as a pump drive source. The pump device comprises a pump (1) having an impeller (2), a rotation shaft (5) to which the impeller (2) is fixed, and an electric motor (7) for rotating the rotation shaft (5) and the impeller (1). A rotor assembly (21) of the electric motor (7) comprises a motor rotor (40) fixed to the rotation shaft (5), a side ring (41) disposed on both sides of the motor rotor (40), and a sealed cover (42) fixed to the outer circumferential surface of the side ring (41). The sealed cover (42) is made of glass fiber.
F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
F04D 29/00 - POMPES À DÉPLACEMENT NON POSITIF - Parties constitutives, détails ou accessoires
H02K 7/14 - Association structurelle à des charges mécaniques, p.ex. à des machines-outils portatives ou des ventilateurs
65.
DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, DATA MANAGEMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, AND DATA MANAGEMENT METHOD
This data processing system comprises a data collection device and a data management device. The data collection device has: a collection storage unit which stores specific information for identifying information pertaining to processing data generated by physical quantity measurement devices that measure physical quantities; a collection communication unit which is connected to the physical quantity measurement devices; and a collection control unit which collects, on the basis of the specific information, processing data for each of the physical quantity measurement devices. The data management device has: a management storage unit which stores the specific data and the processing data; and a management communication unit which transmits the specific information stored in the management storage unit to the data collection device and receives the processing data from the data collection device.
H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
G08C 15/00 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune
G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps
Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member having a substrate suctioning surface for suctioning a substrate and a pressure reducing part communicating with a pressure reducing means; and a first pressure assembly that is disposed between the base member and the substrate suctioning member and has a plurality of first pressure means disposed on the side of the substrate suctioning member opposite to the substrate suctioning surface, the first pressure assembly being configured such that the first pressure means are capable of applying a pressing force to the substrate suctioning member completely independently of each other.
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
67.
DATA PROCESSING SYSTEM, DATA COLLECTION DEVICE, PHYSICAL QUANTITY MEASUREMENT DEVICE, DATA PROCESSING METHOD, DATA COLLECTION METHOD, DATA PRESENTATION METHOD, AND DATA STRUCTURE
This data processing structure is made up of a plurality of physical quantity measurement devices and a data collection device. Upon accepting a data request including an object identification index from the data collection device, the physical quantity measurement devices transmit, to the data collection device, a physical quantity data array made up of physical quantity data associated with an index of which the measurement order is later than the object identification index and an index therefor, out of a plurality of physical quantity data and indices stored in a storage unit. When a predetermined collection condition is satisfied, the data collection device transmits a data request including the object identification index to the physical quantity measurement devices, receives a physical quantity data array as a response thereto, and identifies and manages an index of which the measurement order is last when receiving the physical quantity data array the previous time, as the object identification index.
G06F 16/901 - Indexation; Structures de données à cet effet; Structures de stockage
G08C 15/00 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune
68.
DATA PROCESSING SYSTEM, PHYSICAL QUANTITY MEASURING DEVICE, DATA COLLECTION DEVICE, DATA PROCESSING METHOD, DATA PROVISION METHOD, AND DATA COLLECTION METHOD
This data processing system includes a physical quantity measuring device and a data collection device. This physical quantity measuring device transmits a physical quantity data string constituted by a plurality of physical quantity data, which are obtained when the physical quantity is measured by a physical quantity sensor under sampling conditions, so that the measurement order thereof can be determined, and a time elapsed since the last measurement, which is obtained by measuring, with a timer count unit, the time elapsed after the physical quantity was measured last time by the physical quantity sensor, to the data collection device. The data collection device specifies a measurement time for each of the plurality of physical quantity data, which constitute the physical quantity data string, on the basis of the current time measured by a time measurement unit and the time elapsed since the last measurement.
G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps
69.
DATA PROCESSING DEVICE, PHYSICAL QUANTITY MEASURING DEVICE, DATA PROCESSING SYSTEM, AND DATA PROCESSING METHOD
This data processing device comprises: an arithmetic operation unit that repeatedly acquires the physical quantity to be measured, as physical quantity data, and performs a prescribed arithmetic operation on the physical quantity data so as to generate process data; and a communication processing unit that sequentially transmits process data each time process data is generated. The arithmetic operation unit executes a first arithmetic operation on the physical quantity data of a prescribed number of data points and generates first process data when a prescribed start condition is satisfied, and executes a second arithmetic operation until an end condition is satisfied, on physical quantity data for a number of data points comprising physical quantity data at the most recent time and physical quantity data at a past time and generates second process data after the elapse of a prescribed wait time when a prescribed end condition is not satisfied after executing the first arithmetic operation.
H04Q 9/00 - Dispositions dans les systèmes de commande à distance ou de télémétrie pour appeler sélectivement une sous-station à partir d'une station principale, sous-station dans laquelle un appareil recherché est choisi pour appliquer un signal de commande ou
G08C 15/06 - Dispositions caractérisées par l'utilisation du multiplexage pour la transmission de plusieurs signaux par une voie commune successivement, c. à d. utilisant la division de temps
This detection device (1) comprises: a detection unit (2) attached to an apparatus (100) to be measured; a power supply unit (3) that supplies power to the detection unit (2); and a cable (4) that connects the detection unit (2) and the power supply unit (3). The detection unit (2) has a detection part (10) that detects the state of the apparatus (100) to be measured, a communication part (11) that transmits a detection result of the detection part (10), and a substrate (12) on which the detection part (10) and the communication part (11) are both mounted.
G01D 11/30 - Supports spécialement adaptés à un instrument; Supports spécialement adaptés à un ensemble d'instruments
G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
G01K 1/14 - Supports; Dispositifs de fixation; Dispositions pour le montage de thermomètres en des endroits particuliers
71.
GRAPH DISPLAY METHOD FOR POLISHING DEVICE, AND COMPUTER PROGRAM
The present invention enables data of interest to be found quickly from among multiple sets of measured data in a polishing device. Provided is a method for displaying measured data relating to a polishing device as a graph. The method includes: a step for acquiring, from the polishing device, a plurality of series of measured data measured in the polishing device; a step for creating graphs corresponding to each of the plurality of series of measured data; a step for classifying the plurality of created graphs into a plurality of groups on the basis of a similarity of the graph shapes; and a step for displaying the plurality of graphs in an overlaid manner, using a different display mode for each group.
This threshold value setting device comprises: an input unit for inputting a period of data to be extracted from acquired data; a data extraction unit for extracting data for the period inputted by the input unit; a reference value determination unit for determining a reference value from the data extracted by the data extraction unit; and a threshold value calculation unit for calculating a threshold value from the reference value determined by the reference value determination unit.
This data processing device comprises: a data acquisition unit which acquires a sequence of physical quantity data individually measured at a prescribed sampling frequency and the number of sampling points; a first data generation unit which generates a first time data sequence by extracting physical quantity data of a first analysis point number continuously measured at the first analysis point of a number smaller than the number of sampling points; a first frequency analysis unit which converts the first time data sequence into a first frequency data sequence through a frequency analysis; a second data generation unit which generates a second time data sequence by thinning the physical quantity sequence into physical quantity data of a second analysis point number smaller than the number of sampling points; and a second frequency analysis unit which converts the second time data sequence into a second frequency data sequence through the frequency analysis.
G01H 17/00 - Mesure des vibrations mécaniques ou des ondes ultrasonores, sonores ou infrasonores non prévue dans les autres groupes de la présente sous-classe
G01M 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
[Problem] To provide an information processing device that enables the appropriate prediction of the effect of electromagnetic waves generated from an AC power line when substrate treatment is performed. [Solution] An information processing device 5 includes: a current value information generation unit 501 that generates current value information of AC current supplied to an AC device when substrate treatment is performed by a substrate treatment device which is provided with the AC device connected to an AC power supply via an AC power line, and which is provided with a control board that controls the AC device in order to perform substrate treatment for supplying a treatment fluid to a substrate or a treatment member while bringing the treatment member into contact with the substrate; and an electromagnetic wave effect information generation unit 502 that generates, on the basis of the current value information generated by the current value information generation unit 501, electromagnetic wave effect information indicating an effect of electromagnetic waves generated from the AC power line.
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed layer, and rotate; at least one white confocal sensor for measuring the plate surface of the substrate supported by the stage; and a state measurement module for measuring the state of a power supply member contact region, which is a region of the substrate that comes into contact with a power supply member, on the basis of detection, by the white confocal sensor, of the power supply member contact region.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
This hearth component is provided with an in-incinerator exposed surface that is exposed to the inside of an incinerator. The in-incinerator exposed surface comprises a front surface and an upper surface, and at least the front surface is provided with a protective layer having grooves formed on the surface thereof.
A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowering mechanism which raises/lowers the substrate holder; and a control unit. The substrate holder is equipped with: a contact member configured so as to come into contact with the substrate to enable power supply; a seal member configured so as to fill the gap between the substrate holder and the substrate; a liquid-holding part having the contact member inside and configured so as to hold a liquid when the gap between the substrate holder and the substrate is filled by the seal member; and an ejection port which is open to the liquid-holding part or to a space lying inside the substrate holder and communicating with the liquid-holding part or can be disposed on a lateral side of the substrate holder and which has been configured so that the liquid is ejected.
The present disclosure provides a substrate holder having a centering pin that does not push the substrate any farther toward the center than the design position even if a first holding member deviates from the design position with respect to a second holding member when positioning the substrate. The substrate holder according to the present disclosure has a first holding member and a second holding member. The second holding member has a positioning member for positioning the substrate at a predetermined position and a stopper. The positioning member has a centering pin that can move between a first position and a second position. The centering pin is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a drive member configured to bias the centering pin to the first position when the substrate is held by the first holding member and second holding member. The stopper is configured to contact the centering pin and stop the centering pin at the first position.
The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a to be processed that faces upward; a rotating mechanism 224 configured so as to rotate the stage 220; a cleaning liquid supply member 260 that has nozzles 262 disposed above the stage 220 and is configured so as to supply a cleaning liquid in the direction of the stage 220 via the nozzles 262; and a degassed liquid supply member 250 that is configured so as to supply a degassed liquid to the surface WF-a to be processed of the base plate WF held on the stage 220, wherein the degassed liquid supply member 250 is configured so as to be able to move between a supply position between the nozzles 262 and the surface WF-a to be processed of the substrate WF and a retreat position to which to retreat between the nozzles 262 and the surface WF-a to be processed of the substrate WF.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction, the plating method including: a step for rotating the substrate holder at a first rotation speed in a state in which the substrate holder is inclined; a step for discharging a liquid towards the substrate holder rotating at the first rotation speed so that the liquid is fed to the contact member; a step for stopping the discharging of the liquid; a step for beginning, before or within a prescribed time after the discharging of the liquid is stopped, to reduce the incline of the substrate holder towards a horizontal position; a step for rotating the substrate holder at a second rotation speed higher than the first rotation speed, in a state in which the substrate holder is in the horizontal position; and a step for performing the plating process on the substrate after the substrate has been mounted on the substrate holder.
[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-point detection function for detecting that a chemical mechanical polishing process has reached the end point. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires reliability decrease cause state information during a chemical mechanical polishing process being performed on a substrate by a substrate processing device 2, the reliability decrease cause state information including at least one of wear state information indicating the state of wear of a constituent element of the substrate processing device 2, and processing state information indicating processing state during the polishing process; and a state prediction unit 501 that inputs the reliability decrease cause state information acquired by the information acquisition unit 500 into a learning model that has learned, by machine learning, the correlation between the reliability decrease cause state information and reliability information of a polishing end-point detection function indicating the reliability of an end-point detection function for detecting that the chemical mechanical polishing process has reached an end point, thereby predicting the reliability information of the polishing end-point detection function with respect to the reliability decrease cause state information.
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
The present invention relates to a filler application device that applies a filler to a gap formed between the edge parts of a plurality of boards that constitute a laminated board. This filler application device (100) comprises: a board holding unit (33) that holds and rotates a laminated board (Ws) manufactured by joining a first board (W1) and a second board (W2); an application device (39) that is disposed away from the laminated board (Ws) held by the board holding unit (33), and discharges a filler (F) toward a gap (G) formed between the peripheral edge of the first board (W1) and the peripheral edge of the second board (W2); and a protector (12) that prevents the attachment of liquid splash (Fs) of the filler (F) that occurs when the filler (F) discharged from the application device (39) collides with the gap (G) on the top surface and/or the bottom surface of the laminated board (Ws).
The present invention relates to an information processing device, a machine learning device, an information processing method, and a machine learning method. An information processing device (5) comprises: a fluid supply information acquisition unit (500) for, in a substrate process performed by a substrate processing device provided with a processing member which is to be brought into contact with a substrate and which performs a prescribed substrate process thereon and a processing fluid supply unit for supplying a processing fluid to the substrate or to the processing member, acquiring fluid supply information that includes processing fluid state information indicating the supply state of the processing fluid to be supplied from the processing fluid supply unit; and a fluid distribution information generation unit (501) for generating, on the basis of the fluid supply information acquired by the fluid supply information acquisition unit (500), fluid distribution information indicating the distribution state when the processing fluid supplied from the processing fluid supply unit is distributed while passing through a position of contact between the substrate and the processing member.
The present invention relates to a substrate production method and a substrate production apparatus. A substrate production method according to the present invention comprises: a step in which a filler (F) is applied to a space between a bevel part of a first substrate (W1) and a bevel part of a second substrate (W2); and a step in which air bubbles are removed from the filler (F) that has been applied to the space.
The present invention relates to a substrate holding device, a substrate manufacturing device, and a substrate manufacturing method. A substrate holding device (1) comprises a holding roller (51) and a fluid blowing device (60) that blows pressurized fluid out to a bevel section (B) held by the holding roller (51).
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
The present invention improves the in-plane uniformity of a plating film that is formed on a polygonal substrate. A plating apparatus according to the present invention is provided with: a plating bath; a substrate holder which is configured so as to hold a polygonal substrate; an anode which is arranged within the plating bath so as to face the substrate that is held by the substrate holder; and an anode mask which delimits an opening that corresponds to the outer shape of the polygonal substrate. The anode mask comprises: a first mask member that delimits a first projection, which protrudes toward the center of the opening, at the central part of a first opening side of the opening, the first opening side corresponding to a first side of the polygonal substrate; and a second mask member that delimits a second projection, which protrudes toward the center of the opening, at the central part of a second opening side of the opening, the second opening side corresponding to a second side of the polygonal substrate. Meanwhile, the anode mask is configured such that the distance between the first mask member and the second mask member is able to be adjusted.
This water detecting device, for detecting a state of generation of water present on a surface of a target object which is installed in an ambient environment and through the interior of which water flows, comprises: a target object temperature and humidity sensor for detecting a temperature and humidity of the target object; an environmental temperature and humidity sensor for detecting a temperature and humidity of the ambient environment; and a determining unit for determining whether or not water has been generated, and the cause of generation of the water, on the basis of target object temperature and humidity information indicating a change over time in the temperature and humidity detected by the target object temperature and humidity sensor, and ambient environment temperature and humidity information indicating a change over time in the temperature and humidity detected by the environmental temperature and humidity sensor.
An anode chamber liquid management method comprising: a step for preparing a plating tank in which an anode and a diaphragm in contact with or attached firmly to the upper surface of the anode are arranged, and which is provided with a cathode chamber and an anode chamber partitioned above and below by the diaphragm, and an exhaust passage that is connected to the anode chamber and that is for discharging air bubbles from the anode chamber to the outside of the plating tank; a step for holding a plating liquid in the anode chamber and the cathode chamber such that the liquid level that is of the plating liquid in the exhaust passage and that is equal to the liquid level of the plating liquid in the anode chamber becomes lower than the liquid level of the plating liquid in the cathode chamber; a step for determining whether the height of the liquid level of the plating liquid in the exhaust passage is lower than a prescribed height, on the basis of an output of a liquid level sensor disposed in the exhaust passage; and a step for feeding pure water or an electrolytic solution to the anode chamber when the height of the liquid level of the plating liquid in the exhaust passage is determined as being lower than the prescribed height.
With the present invention, a pre-treatment of a substrate is efficiently performed, and also adhesion of air bubbles to a surface to be treated of the substrate is suppressed. This pre-wetting module 200 includes a deaeration tank 210 which is configured to accommodate a deaeration liquid, a cleaning device 260 which is disposed above the deaeration tank 210 and configured to supply a cleaning liquid downward, a substrate holder 220 which is disposed between the deaeration tank 210 and the cleaning device 260 and has a first holding member 222 configured to hold a first substrate WF-1 and a second holding member 224 configured to hold a second substrate WF-2, and a drive mechanism 230 which is configured to rotate and raise/lower the substrate holder 220, wherein the first holding member 222 and the second holding member 224 are configured to be able to hold the first substrate WF-1 and the second substrate WF-2 in such a manner that when a surface to be treated WF-1a of the first substrate WF-1 is tilted with respect to a horizontal plane to face the surface of the deaeration liquid in the deaeration tank 210, a surface to be treated WF-2a of the second substrate WF-2 horizontally faces the cleaning device 260 at the same time.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p.ex. dépôt électrolytique
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which the surface to be plated is facing downwards, the substrate holder having a contact member for supplying power to the substrate; a contact cleaning member 482 for discharging a cleaning solution towards the contact member when at a cleaning position between the plating tank and the substrate holder; a drive mechanism 476 configured to move the contact cleaning member 482 between a cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover the upper part of the contact cleaning member 482 when the contact cleaning member 482 is at the retracted position.
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid to a contact member of a substrate holder, after a substrate held by the substrate holder is immersed in a plating liquid to perform plating; a measuring step 122 for measuring the electrical conductivity of the washing liquid after the contact member is washed; and a determination step 128 for determining the presence or absence of a plating liquid leak to the region where the contact member is disposed, on the basis of a comparison between a first electrical conductivity of the washing liquid, measured in advance for a reference substrate holder, and a second electrical conductivity of the washing liquid, measured in the measurement step 122.
C25D 17/00 - PROCÉDÉS POUR LA PRODUCTION ÉLECTROLYTIQUE OU ÉLECTROPHORÉTIQUE DE REVÊTEMENTS; GALVANOPLASTIE; JONCTION DE PIÈCES PAR ÉLECTROLYSE; APPAREILLAGES À CET EFFET Éléments structurels, ou leurs assemblages, des cellules pour revêtement électrolytique
The present invention pertains to a pump operation assistance method and a pump operation assistance device. This pump operation assistance method comprises: a performance characteristic acquisition step for acquiring a flowrate-total head representative performance curve and a rated rotational speed during a rated operation as performance characteristics of a device to be assisted and identified by a model number of a pump device; an installation state acquisition step for acquiring a real head as an installation state of the device to be assisted; an operation state acquisition step for acquiring an operation frequency, suction pressure, and discharge pressure as an operation state of the device to be assisted; and a first operation assistance step for calculating an operation condition during a reference operation when the device to be assisted is operated in the installation state and the operation state. In the first operation assistance step, the flowrate and the total head during the reference operation are calculated on the basis of the performance characteristics, the installation state, and the operation state.
The present invention pertains to a pump device for raising the pressure of liquid hydrogen, and particularly, to a pump device comprising a thrust balance mechanism for canceling axial thrust applied to an impeller. This pump device comprises: a rotary shaft (1); a plurality of impellers (2a-2h) fixed to the rotary shaft (1); bearings (5, 6) which rotatably support the rotary shaft (1); a pump casing (7) which accommodates the plurality of impellers (2a-2h); and a first thrust balance mechanism (20) and a second thrust balance mechanism (40) which cancel the own weight of a rotary body including the rotary shaft (1) and the plurality of impellers (2a-2h), and the axial thrust acting on the plurality of impellers (2a-2h).
To provide a technology with which it is possible to suppress uneven film thickness of the outer edge of a substrate. This plating device 1 comprises a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a-60d, a bus bar 61 having a power supply portion 62 to which electricity is supplied and a plurality of connection portions 63 connected to the at least one auxiliary anode and arranged in the extending direction of the auxiliary anode, and at least one ion resistor 80a-80d. The ion resistor is configured such that the resistivity of the ion resistor increases with proximity to the power supply portion in the extending direction of the ion resistor.
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing head (1).
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
96.
RESISTOR FOR PLATING APPARATUSES, AND PLATING APPARATUS
The present invention provides: a resistor which makes it possible to improve the uniformity of a plating film that is formed on a substrate; and the like. The present invention provides a resistor for plating apparatuses for electric field control, the resistor being arranged between an anode and a holder, which holds an object to be plated, in a plating apparatus. This resistor for plating apparatuses comprises: a first resistive member which has a first surface and a plurality of first through holes that open to the first surface; and a second resistive member which has a second surface and a plurality of second through holes that open to the second surface. The first resistive member and the second resistive member are arranged such that the first surface and the second surface face each other; and this resistor for plating apparatuses is configured such that the size of overlappings of the plurality of first through holes and the plurality of second through holes is variable.
This machine learning method includes performing: dataset splitting processing for dividing a period into a learning period and a validation period, and splitting a dataset into learning data and validation data; learning candidate period division processing for dividing a learning candidate period into a plurality of split learning periods; learning period evaluation processing for generating a learning period evaluation model for each split learning period, using a learning model corresponding to the split learning period, and using the verification data to calculate an evaluation index of the learning period evaluation model for each split learning period; learning period selection processing for repeating the learning candidate period division processing and the learning period evaluation processing until a predetermined end condition is satisfied, and when the end condition is satisfied, selecting a split learning period having a high evaluation index as a learning target period; and model output processing for outputting a learning model obtained by performing machine learning employing the learning data corresponding to the learning target period.
This dry-up method introduces a purge gas into a suction container (2A) of a pump device (100A), causes the purge gas to pass through a flow path switching device (5A) within the suction container (2A) while causing the purge gas to bypass a submerged pump (1A) within the suction container (2A), introduces, into a suction container (2B) of a pump device (100B), the purge gas that has been passed through the flow path switching device (5A), and causes the purge gas to pass through a flow path switching device (5B) within the suction container (2B) while causing the purge gas to bypass a submerged pump (1B) within the suction container (2B).
F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
F04D 13/14 - Combinaisons de plusieurs pompes les pompes étant toutes du type centrifuge
F17C 13/00 - RÉCIPIENTS POUR CONTENIR OU EMMAGASINER DES GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS; GAZOMÈTRES À CAPACITÉ FIXE; REMPLISSAGE OU VIDAGE DE RÉCIPIENTS DE GAZ COMPRIMÉS, LIQUÉFIÉS OU SOLIDIFIÉS - Détails des récipients ou bien du remplissage ou du vidage des récipients
99.
START-UP METHOD AND STOPPING METHOD FOR PUMP DEVICES CONNECTED IN SERIES
The present invention relates to a start-up method for submerged pumps used for transferring liquefied gas. In the present method, a submerged pump (1A) disposed in an intake container (2A) of a pump device (100A) is started up, liquefied gas is transferred to an intake container (2B) of a pump device (100B) via a flow path switching device (5A) in the intake container (2A), the liquefied gas is made to bypass a submerged pump (1B) disposed in the intake container (2B) and to pass through a flow path switching device (5B) in the intake container (2B), and thereafter, the submerged pump (1B) is started up.
F04D 15/00 - Commande, p.ex.régulation de pompes, d'installations ou de systèmes de pompage
F04B 49/035 - Commande d'arrêt, de démarrage, de décharge ou de ralenti par clapets de dérivation
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p.ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
100.
SUBSTRATE POLISHING METHOD, PROGRAM, AND SUBSTRATE POLISHING DEVICE
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a polishing surface; a top ring for holding a substrate and pressing the substrate against the polishing surface; and a vertical movement mechanism for vertically moving the top ring. The method includes: an acquisition step for acquiring information relating to a thickness of the substrate; a position adjustment step for adjusting a height position of the top ring relative to the polishing table on the basis of the acquired information relating to the thickness of the substrate; and a polishing step for polishing the substrate by supplying a pressurized fluid to a pressure chamber of the top ring to press the substrate against the polishing surface.
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
B24B 41/06 - Supports de pièces, p.ex. lunettes réglables
B24B 47/22 - Equipement permettant le positionnement exact de l'outil de meulage ou de la pièce au début de l'opération de meulage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meuler; Agencements de l'appareillage d'indication ou de mesure, p.ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe
brevets
