Tokyo Ohka Kogyo Co., Ltd.

Japon

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Date
Nouveautés (dernières 4 semaines) 14
2025 juin (MACJ) 10
2025 mai 12
2025 avril 5
2025 mars 3
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Classe IPC
G03F 7/004 - Matériaux photosensibles 320
G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons 281
G03F 7/20 - ExpositionAppareillages à cet effet 210
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables 154
G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides 146
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Statut
En Instance 220
Enregistré / En vigueur 657
Résultats pour  brevets
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1.

METHOD FOR PROCESSING SUBSTRATE, KIT FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Numéro d'application 18971492
Statut En instance
Date de dépôt 2024-12-06
Date de la première publication 2025-06-19
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Namiki, Takumi

Abrégé

There are provided a method for processing a substrate in which a surface of a pattern on a substrate is processed, the method including: a first step for processing the surface of the pattern with a first chemical solution, the first chemical solution including a silane coupling agent that has a SP value of Hansen solubility parameter of 15 or more; and a second step for processing the surface of the pattern with a second chemical solution after the first step, the second chemical solution including an anionic or amphoteric surfactant; a kit for processing a substrate; and a method for manufacturing a semiconductor substrate.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

2.

RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND BLOCK COPOLYMER

      
Numéro d'application 18974245
Statut En instance
Date de dépôt 2024-12-09
Date de la première publication 2025-06-19
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Sugawara, Ryutaro
  • Iino, Shota
  • Seshimo, Takehiro
  • Dazai, Takahiro

Abrégé

A resin composition for forming a phase-separated structure, the resin composition including a block copolymer having a first block and a second block, the first block including a polymer having a repeating structure of a constituent unit represented by the following formula (b1), the second block including a random copolymer having a structure in which a constituent unit represented by the following formula (b2a) and a constituent unit represented by the following formula (b2b) are randomly arranged, and a ratio of a volume of the first block being 20% by volume or more and 80% by volume or less A resin composition for forming a phase-separated structure, the resin composition including a block copolymer having a first block and a second block, the first block including a polymer having a repeating structure of a constituent unit represented by the following formula (b1), the second block including a random copolymer having a structure in which a constituent unit represented by the following formula (b2a) and a constituent unit represented by the following formula (b2b) are randomly arranged, and a ratio of a volume of the first block being 20% by volume or more and 80% by volume or less

Classes IPC  ?

  • C08F 297/02 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire utilisant un catalyseur du type anionique
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet

3.

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Numéro d'application 18965830
Statut En instance
Date de dépôt 2024-12-02
Date de la première publication 2025-06-19
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Koga, Shinya

Abrégé

A processing solution for a semiconductor device, including a water-soluble organic solvent, water, and an ion of a typical metal element; a method for processing a substrate; and a method for manufacturing a semiconductor substrate.

Classes IPC  ?

  • C11D 7/50 - Solvants
  • C11D 7/32 - Composés organiques contenant de l'azote
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives

4.

RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND BLOCK COPOLYMER

      
Numéro d'application 18974039
Statut En instance
Date de dépôt 2024-12-09
Date de la première publication 2025-06-19
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Sugawara, Ryutaro
  • Iino, Shota
  • Seshimo, Takehiro
  • Dazai, Takahiro

Abrégé

A resin composition for forming a phase-separated structure, the resin composition including a block copolymer having a first block and a second block, the first block including a polymer having a repeating structure of a constituent unit represented by the following formula (b1), the second block including a random copolymer having a structure in which a constituent unit represented by the following formula (b2a) and a constituent unit represented by the following formula (b2b) are randomly arranged, and a ratio of a volume of the first block is 20% by volume or more and 80% by volume or less A resin composition for forming a phase-separated structure, the resin composition including a block copolymer having a first block and a second block, the first block including a polymer having a repeating structure of a constituent unit represented by the following formula (b1), the second block including a random copolymer having a structure in which a constituent unit represented by the following formula (b2a) and a constituent unit represented by the following formula (b2b) are randomly arranged, and a ratio of a volume of the first block is 20% by volume or more and 80% by volume or less

Classes IPC  ?

  • C08F 297/02 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire utilisant un catalyseur du type anionique
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet

5.

METHOD OF MANUFACTURING PLATED ARTICLE

      
Numéro d'application 18840867
Statut En instance
Date de dépôt 2023-01-24
Date de la première publication 2025-06-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ojima, Daisuke
  • Kuroiwa, Yasushi

Abrégé

A method for producing a plated article on a metal layer of a substrate which has the metal layer on a surface thereof, including forming a resist pattern to be used as a template for forming a plated article, using a photosensitive composition which includes a sulfur-containing compound and/or a nitrogen-containing compound each having a predetermined structure; before the plated article is formed, subjecting a surface made of metal exposed from a nonresist portion of the resist pattern to ashing; and detaching the resist pattern with a detaching liquid including a basic compound and then etching the metal layer which is on the substrate surface and on which the plated article has not been formed after the plated article formation.

Classes IPC  ?

  • G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage

6.

POLYIMIDE RESIN PRECURSOR

      
Numéro d'application 18843134
Statut En instance
Date de dépôt 2023-01-30
Date de la première publication 2025-06-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Ebisawa, Kazuaki

Abrégé

A polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and excelling in a chemical resistance property; a production method for the polyimide resin precursor; a photosensitive resin composition including the polyimide resin precursor as a polymerizable resin a patterned resin film using the photosensitive resin composition, and a production method for the patterned polyimide resin film. A polymer of a diamine compound and a dicarboxylic acid which is a reactant with a tetracarboxylic dianhydride and an alcohol is used as the polyimide resin precursor, and a compound that either has a combination of a secondary hydroxyl group and an ethylenically unsaturated double bond, or has a combination of a methylol group and an ethylenically unsaturated double bond, is used as the aforementioned alcohol.

Classes IPC  ?

  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • C08G 69/40 - Polyamides contenant de l'oxygène sous forme de groupes éther
  • G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage

7.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18844607
Statut En instance
Date de dépôt 2023-03-22
Date de la première publication 2025-06-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Suzuki, Yosuke
  • Suzuki, Kenta
  • Kojima, Takahiro
  • Yoshida, Jun
  • Ikeuchi, Kengo

Abrégé

A resist composition including a resin component which has a constitutional unit derived from a compound represented by General Formula (a0-1) below and a constitutional unit containing a lactone-containing cyclic group. In General Formula (a0-1), W01 represents a polymerizable group-containing group, Ya01 represents a single bond or a divalent linking group, Ra01 represents an acid dissociable group, q represents an integer of 0 to 3, n represents an integer of 1 or greater and n≤q×2+4 is satisfied A resist composition including a resin component which has a constitutional unit derived from a compound represented by General Formula (a0-1) below and a constitutional unit containing a lactone-containing cyclic group. In General Formula (a0-1), W01 represents a polymerizable group-containing group, Ya01 represents a single bond or a divalent linking group, Ra01 represents an acid dissociable group, q represents an integer of 0 to 3, n represents an integer of 1 or greater and n≤q×2+4 is satisfied

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • C08K 5/375 - Sulfures contenant des cycles aromatiques à six chaînons
  • C08K 5/41 - Composés contenant du soufre lié à l'oxygène
  • C08K 5/42 - Acides sulfoniquesLeurs dérivés
  • C08K 5/45 - Composés hétérocycliques comportant du soufre dans le cycle
  • C08K 5/46 - Composés hétérocycliques comportant du soufre dans le cycle avec de l'oxygène ou de l'azote dans le cycle
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

8.

INSPECTION METHOD, RESIN SOLUTION, RESIST COMPOSITION OR THERMOSETTING COMPOSITION, METHOD OF PRODUCING RESIN COMPOSITION, AND METHOD OF PRODUCING RESIST COMPOSITION OR THERMOSETTING COMPOSITION

      
Numéro d'application 18962049
Statut En instance
Date de dépôt 2024-11-27
Date de la première publication 2025-06-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Hirahara, Komei
  • Kai, Yoshihito
  • Nakata, Akihiko

Abrégé

An inspection method including a step V of filtering a precursor composition V containing a polymer compound and a solvent V, a step X1 of coating a substrate X with a resin composition X containing the precursor composition to form a coating film X, a step X2 of removing the coating film X from the substrate X using a removal solvent X including at least one selected from the group consisting of an organic solvent X, an alkali developing solution X, and water; and a step X3 of measuring the number of defects on the substrate X after the coating film X is removed, using a defect inspection device.

Classes IPC  ?

  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
  • G01N 21/956 - Inspection de motifs sur la surface d'objets

9.

RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND POLYMER COMPOUND

      
Numéro d'application 18843880
Statut En instance
Date de dépôt 2023-03-07
Date de la première publication 2025-06-05
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Miyakawa, Junichi
  • Adachi, Yohei
  • Fujinami, Tetsuo
  • Ishii, Shuichi

Abrégé

A resist composition which generates an acid upon light exposure and whose solubility in a developing solution is changed by an action of an acid, the resist composition including a resin component whose solubility in a developing solution is changed by an action of an acid, in which the resin component has a constitutional unit represented by General Formula (a0-1) in which R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a halogen atom, or a halogenated alkyl group having 1 to 5 carbon atoms; Ya0 represents a single bond or a divalent linking group; Va0 represents a single bond or a linear or branched alkylene group; and Mm+ represents an m-valent cation A resist composition which generates an acid upon light exposure and whose solubility in a developing solution is changed by an action of an acid, the resist composition including a resin component whose solubility in a developing solution is changed by an action of an acid, in which the resin component has a constitutional unit represented by General Formula (a0-1) in which R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a halogen atom, or a halogenated alkyl group having 1 to 5 carbon atoms; Ya0 represents a single bond or a divalent linking group; Va0 represents a single bond or a linear or branched alkylene group; and Mm+ represents an m-valent cation

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • C07C 309/12 - Acides sulfoniques ayant des groupes sulfo liés à des atomes de carbone acycliques d'un squelette carboné acyclique saturé contenant des atomes d'oxygène liés au squelette carboné contenant des groupes hydroxy estérifiés liés au squelette carboné
  • C08F 220/28 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle ne contenant pas de cycles aromatiques dans la partie alcool
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides
  • H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou

10.

RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD

      
Numéro d'application 18837749
Statut En instance
Date de dépôt 2023-04-19
Date de la première publication 2025-06-05
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Someya, Yasuo
  • Kaiho, Takaaki
  • Ohboshi, Yuki

Abrégé

A resist composition that generates an acid via light exposure, and whose solubility in a liquid developer changes through the action of the acid. The resist composition includes a base material component whose solubility in the liquid developer changes through the action of the acid, and an acid generating agent component that generates the acid via light exposure. The acid generating agent component includes a first acid generating agent and a second acid generating agent. The first acid generating agent and second acid generating agent include compounds represented by particular general formulas.

Classes IPC  ?

  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons

11.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER

      
Numéro d'application 18837387
Statut En instance
Date de dépôt 2023-03-09
Date de la première publication 2025-05-29
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Suzuki, Issei
  • Nguyen, Khanhtin
  • Onishi, Koshi

Abrégé

A resist composition containing a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) in which W01 represents a polymerizable group-containing group; RAr represents an aromatic group; Ra0 represents an acid dissociable group represented by General Formula (a0-r-1); Ra01 represents an aliphatic hydrocarbon group; Ra02, Ra03, and Ra04 represent a hydrocarbon group or a hydrogen atom; Ra01 and Ra02 may be bonded to each other to form an alicyclic structure; Ra03 and Ra04 may be bonded to each other to form an aromatic ring structure or an alicyclic structure. The alicyclic structure formed by Ra01 and Ra02 are bonded to each other and the aromatic ring structure or the alicyclic structure formed by Ra03 and Ra04 are bonded to each other or may be condensed to each other; and Ra05 represents a chain-like or alicyclic hydrocarbon group or a hydrogen atom A resist composition containing a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) in which W01 represents a polymerizable group-containing group; RAr represents an aromatic group; Ra0 represents an acid dissociable group represented by General Formula (a0-r-1); Ra01 represents an aliphatic hydrocarbon group; Ra02, Ra03, and Ra04 represent a hydrocarbon group or a hydrogen atom; Ra01 and Ra02 may be bonded to each other to form an alicyclic structure; Ra03 and Ra04 may be bonded to each other to form an aromatic ring structure or an alicyclic structure. The alicyclic structure formed by Ra01 and Ra02 are bonded to each other and the aromatic ring structure or the alicyclic structure formed by Ra03 and Ra04 are bonded to each other or may be condensed to each other; and Ra05 represents a chain-like or alicyclic hydrocarbon group or a hydrogen atom

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • C07C 69/78 - Esters d'acide benzoïque
  • C07C 69/84 - Esters d'acides carboxyliques dont un groupe carboxyle estérifié est lié à un atome de carbone d'un cycle aromatique à six chaînons d'acides hydroxycarboxyliques monocycliques dont les groupes hydroxyle et les groupes carboxyle sont liés à des atomes de carbone d'un cycle aromatique à six chaînons
  • C07C 69/92 - Esters d'acides carboxyliques dont un groupe carboxyle estérifié est lié à un atome de carbone d'un cycle aromatique à six chaînons d'acides hydroxycarboxyliques monocycliques dont les groupes hydroxyle et les groupes carboxyle sont liés à des atomes de carbone d'un cycle aromatique à six chaînons avec des groupes hydroxyle éthérifiés
  • C08F 212/14 - Monomères contenant un seul radical aliphatique non saturé contenant un cycle substitué par des hétéro-atomes ou des groupes contenant des hétéro-atomes
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides

12.

PRODUCTION METHOD FOR HOLLOW STRUCTURE, LAMINATE

      
Numéro d'application 18836505
Statut En instance
Date de dépôt 2023-02-16
Date de la première publication 2025-05-29
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Katayama, Shota
  • Yamagata, Kenichi
  • Imai, Hirofumi

Abrégé

A production method for a hollow structure consisting of a concave portion and a top plate portion that blocks an opening surface of the concave portion is adopted, the production method including forming at least one of a side wall or the top plate portion by using a laminate of a support and a resist layer, in which the support consists of a polyethylene terephthalate film having a light transmittance of 85% or more at a wavelength of 365 nm and a haze value of 1.0% or less when irradiated with light having a wavelength of 365 nm, the resist layer consists of a photosensitive layer formed of a negative photosensitive composition, and an operation of exposing the resist layer via the support and developing the laminate after the exposure with a developing solution containing an organic solvent to form a negative pattern. According to this production method, when the side wall or the top plate portion of the hollow structure is formed, it is possible to further improve lithography characteristics (shape and defect reduction) of a pattern, and the hollow structure can be stably produced.

Classes IPC  ?

  • B32B 7/05 - Liaison entre couches les couches n’étant pas liées sur toute la surface, p. ex. liaison discontinue ou par motifs particuliers
  • B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
  • B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
  • B32B 37/24 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches avec au moins une couche qui ne présente pas de cohésion avant la stratification, p. ex. constituée de matériau granulaire projeté sur un substrat
  • B32B 38/00 - Opérations auxiliaires liées aux procédés de stratification
  • B32B 38/10 - Enlèvement de couches ou de parties de couches, mécaniquement ou chimiquement
  • B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
  • G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
  • H03H 9/64 - Filtres utilisant des ondes acoustiques de surface

13.

CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE

      
Numéro d'application 18840850
Statut En instance
Date de dépôt 2023-01-24
Date de la première publication 2025-05-29
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ojima, Daisuke
  • Kuroiwa, Yasushi

Abrégé

A chemically amplified positive-type photosensitive composition for forming a pattern serving as a template in a process of forming a plated article on a substrate having a metal layer on a surface thereof, the chemically amplified positive-type photosensitive composition being capable of easily forming a resist pattern having a cross-sectional shape in which a large undercut is formed and footing is suppressed. The chemically amplified positive-type photosensitive composition includes an acid generating agent that generates an acid by irradiation with an active ray or radiation, a resin having an alkali solubility that increases under action of an acid, a sulfur-containing compound containing a sulfur atom capable of coordinating with the metal layer, an acid diffusion suppressing agent, and an organic solvent, the resin containing an acrylic resin which contains a specific constituent unit, and the decomposition ratio (%) of the acid generating agent determined using specific steps is more than 0.5 and less than 10.

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/16 - Procédés de couchageAppareillages à cet effet

14.

RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND ACID GENERATOR

      
Numéro d'application 18839698
Statut En instance
Date de dépôt 2023-03-06
Date de la première publication 2025-05-22
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Nguyen, Khanhtin

Abrégé

A resist composition including a base material component and a compound represented by General Formula (b0), in which Rpg represents an acid decomposable group, Rl0 represents a cyclic organic group which may have a substituent, L02 represents a divalent linking group, L01 represents a divalent linking group or a single bond, Rm1 represents a substituent other than an iodine atom, Vb0 represents a single bond, R0 represents a hydrogen atom, nb1 represents an integer of 1 to 4, nb2 represents an integer of 1 to 4, nb3 represents an integer of 0 to 3, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater A resist composition including a base material component and a compound represented by General Formula (b0), in which Rpg represents an acid decomposable group, Rl0 represents a cyclic organic group which may have a substituent, L02 represents a divalent linking group, L01 represents a divalent linking group or a single bond, Rm1 represents a substituent other than an iodine atom, Vb0 represents a single bond, R0 represents a hydrogen atom, nb1 represents an integer of 1 to 4, nb2 represents an integer of 1 to 4, nb3 represents an integer of 0 to 3, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/004 - Matériaux photosensibles
  • C07C 309/12 - Acides sulfoniques ayant des groupes sulfo liés à des atomes de carbone acycliques d'un squelette carboné acyclique saturé contenant des atomes d'oxygène liés au squelette carboné contenant des groupes hydroxy estérifiés liés au squelette carboné
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet

15.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18838433
Statut En instance
Date de dépôt 2023-03-02
Date de la première publication 2025-05-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Suzuki, Issei
  • Onishi, Koshi

Abrégé

A resist composition including a resin component which has a constitutional unit (a01) derived from a compound represented by General Formula (a0-1) and a constitutional unit (a02) derived from a compound represented by General Formula (a0-2), in which W01 and W02 represent a polymerizable group-containing group, Ya01 and Ya02 represent a single bond or a divalent linking group, Rax01 represents an acid dissociable group represented by Formula (a0-r-1) or (a0-r-2), q01 and q02 represent an integer of 0 to 3, n01 and n02 represent an integer of 1 or greater, Ra01 to Ra03 represent a hydrocarbon group, Ra04 represents a hydrocarbon group, Ra05a and Ra05b represent a hydrogen atom and Ra06 represents a hydrogen atom A resist composition including a resin component which has a constitutional unit (a01) derived from a compound represented by General Formula (a0-1) and a constitutional unit (a02) derived from a compound represented by General Formula (a0-2), in which W01 and W02 represent a polymerizable group-containing group, Ya01 and Ya02 represent a single bond or a divalent linking group, Rax01 represents an acid dissociable group represented by Formula (a0-r-1) or (a0-r-2), q01 and q02 represent an integer of 0 to 3, n01 and n02 represent an integer of 1 or greater, Ra01 to Ra03 represent a hydrocarbon group, Ra04 represents a hydrocarbon group, Ra05a and Ra05b represent a hydrogen atom and Ra06 represents a hydrogen atom

Classes IPC  ?

  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/20 - ExpositionAppareillages à cet effet

16.

RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND POLYMER COMPOUND

      
Numéro d'application 18838801
Statut En instance
Date de dépôt 2023-03-09
Date de la première publication 2025-05-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Suzuki, Issei
  • Nguyen, Khanhtin
  • Onishi, Koshi

Abrégé

A resist composition containing a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) in which Rm represents an alkyl group, a halogenated alkyl group, a halogen atom, or a hydrogen atom; L1 represents an aliphatic hydrocarbon group; n represents an integer of 0 to 2; Ra0 represents an acid dissociable group; Ra01 represents an aliphatic hydrocarbon group; Ra02, Ra03, and Ra04 represent a hydrocarbon group or a hydrogen atom; Ra01 and Ra02 may be bonded to each other to form an alicyclic structure; Ra03 and Ra04 may be bonded to each other to form an aromatic ring structure or an alicyclic structure; the alicyclic structure formed by Ra01 and Ra02 being bonded to each other and the aromatic ring structure or alicyclic structure formed by Ra03 and Ra04 being bonded to each other may be condensed to each other; and Ra05 represents a chain-like or alicyclic hydrocarbon group, or a hydrogen atom A resist composition containing a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) in which Rm represents an alkyl group, a halogenated alkyl group, a halogen atom, or a hydrogen atom; L1 represents an aliphatic hydrocarbon group; n represents an integer of 0 to 2; Ra0 represents an acid dissociable group; Ra01 represents an aliphatic hydrocarbon group; Ra02, Ra03, and Ra04 represent a hydrocarbon group or a hydrogen atom; Ra01 and Ra02 may be bonded to each other to form an alicyclic structure; Ra03 and Ra04 may be bonded to each other to form an aromatic ring structure or an alicyclic structure; the alicyclic structure formed by Ra01 and Ra02 being bonded to each other and the aromatic ring structure or alicyclic structure formed by Ra03 and Ra04 being bonded to each other may be condensed to each other; and Ra05 represents a chain-like or alicyclic hydrocarbon group, or a hydrogen atom

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • C08F 220/40 - Esters d'alcools non saturés
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

17.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID GENERATING AGENT

      
Numéro d'application 18937982
Statut En instance
Date de dépôt 2024-11-05
Date de la première publication 2025-05-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Sato, Makoto
  • Mori, Takayoshi
  • Eguchi, Ryohei
  • Nitta, Kazuyuki

Abrégé

A resist composition that generates an acid upon exposure and whose solubility with respect to a liquid developer changes by an action of the acid. The resist composition includes a base material component whose solubility with respect to a liquid developer changes by an action of an acid; an acid generating agent component that generates an acid upon exposure; and an acid diffusion control agent component, in which the acid generating agent component includes a compound represented by a general formula (b1-1) A resist composition that generates an acid upon exposure and whose solubility with respect to a liquid developer changes by an action of the acid. The resist composition includes a base material component whose solubility with respect to a liquid developer changes by an action of an acid; an acid generating agent component that generates an acid upon exposure; and an acid diffusion control agent component, in which the acid generating agent component includes a compound represented by a general formula (b1-1)

Classes IPC  ?

  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons

18.

METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE

      
Numéro d'application 18930500
Statut En instance
Date de dépôt 2024-10-29
Date de la première publication 2025-05-08
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Miyagi, Ken
  • Dazai, Takahiro
  • Tsuchiya, Junichi
  • Takeshita, Masaru

Abrégé

A method for producing a structure having a phase-separated structure that can improve misalignment of a cylinder structure or line roughness and form alignment marks well. The method includes forming a layer including a block copolymer and having a thickness t on a substrate using a resin composition containing the block copolymer, and separating the layer into a cylinder structure. The thickness t is set such that a relationship between the thickness t and a period L0 of the block copolymer satisfies a specific formula.

Classes IPC  ?

  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • G03F 7/16 - Procédés de couchageAppareillages à cet effet

19.

WATER-REPELLING AGENT FOR ELECTROCONDUCTIVE ARTICLE SURFACE, WATER-REPELLENCY-IMPARTING METHOD FOR ELECTROCONDUCTIVE ARTICLE SURFACE, METHOD FOR SELECTIVELY IMPARTING WATER REPELLENCY FOR REGION HAVING ELECTROCONDUCTIVE ARTICLE SURFACE, SURFACE TREATMENT METHOD, AND METHOD FOR FORMING FILM ON SELECTED REGION OF SUBSTRATE SURFACE

      
Numéro d'application 18730248
Statut En instance
Date de dépôt 2023-01-05
Date de la première publication 2025-05-08
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Tanaka, Daichi
  • Seki, Kenji
  • Tajima, Kazuya

Abrégé

A water-repelling agent for an electroconductive article surface, including a compound that contains an aromatic ring, an adsorption group which is bonded to the aromatic ring and is an amino group, a phosphonic acid group, an acid anhydride group, a thiol group, or an acid chloride group, and a linear or branched alkyl group or a linear or branched fluorinated alkyl group bonded to the aromatic ring

Classes IPC  ?

  • C09D 5/16 - Peintures antisalissuresPeintures subaquatiques
  • C09D 7/63 - Adjuvants non macromoléculaires organiques
  • C23C 16/02 - Pré-traitement du matériau à revêtir
  • C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction

20.

PHOTOSENSITIVE COMPOSITION

      
Numéro d'application 18694200
Statut En instance
Date de dépôt 2022-08-18
Date de la première publication 2025-05-01
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Urakawa, Kazuki
  • Shiota, Dai

Abrégé

A photosensitive composition including a radically polymerizable compound (A), and a radical polymerization initiator (C), which tends to hardly occur excessive decrease of weight of a cured product and a component other than a solvent in the photosensitive composition, and having good curability, and a cued product of the photosensitive composition are provided. A compound having a specific structure including a radically polymerizable group-containing group and a radically polymerizable compound other than the compound having the specific structure are used in combination as a radically polymerizable compound (A) in a photosensitive composition including the radically polymerizable compound (A) and a radical polymerization initiator (C).

Classes IPC  ?

  • G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
  • G03F 7/004 - Matériaux photosensibles

21.

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Numéro d'application 18924413
Statut En instance
Date de dépôt 2024-10-23
Date de la première publication 2025-05-01
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Iioka, Jun
  • Gell, Aaron
  • Eto, Takahiro

Abrégé

There are provided a processing solution, including: (a) a compound capable of releasing a fluoride anion or a salt thereof; (b) a water-soluble organic solvent; (c) water; and (d) a nitrogen-containing aromatic compound, in which an anion content of the nitrogen-containing aromatic compound at 25° C. is 5 ppm or more and 30 ppm or less; a method for processing a substrate; and a method for manufacturing a semiconductor.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • B08B 3/08 - Nettoyage impliquant le contact avec un liquide le liquide ayant un effet chimique ou dissolvant
  • C11D 7/06 - Hydroxydes
  • C11D 7/10 - Sels
  • C11D 7/32 - Composés organiques contenant de l'azote
  • C11D 7/50 - Solvants
  • C23C 16/06 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le dépôt d'un matériau métallique
  • C23C 16/34 - Nitrures
  • C23C 16/56 - Post-traitement

22.

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Numéro d'application 18924422
Statut En instance
Date de dépôt 2024-10-23
Date de la première publication 2025-05-01
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Iioka, Jun
  • Gell, Aaron
  • Eto, Takahiro

Abrégé

There are provided a processing solution, including: (a) a compound capable of releasing a fluoride anion or a salt thereof; (b) a water-soluble organic solvent; (c) water; and (d) a nitrogen-containing aromatic compound, in which a mass ratio of a nonionic component of the nitrogen-containing aromatic compound to a total amount of ammonia and an ammonium ion at 35° C. is more than 0.5 and less than 1; a method for processing a substrate; and a method for manufacturing a semiconductor substrate.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • B08B 3/08 - Nettoyage impliquant le contact avec un liquide le liquide ayant un effet chimique ou dissolvant
  • C11D 7/10 - Sels
  • C11D 7/32 - Composés organiques contenant de l'azote
  • C11D 7/50 - Solvants
  • C23C 16/06 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le dépôt d'un matériau métallique
  • C23C 16/34 - Nitrures
  • C23C 16/56 - Post-traitement

23.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND COMPOUND

      
Numéro d'application 18725976
Statut En instance
Date de dépôt 2023-01-17
Date de la première publication 2025-04-24
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Matsushita, Tetsuya

Abrégé

A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1), in which R01 represents a hydrogen atom, L01 represents a divalent linking group, Ra01 and Ra02 each independently represent a hydrocarbon group which may have a substituent, Ar01 represents an aryl group in which some or all hydrogen atoms are substituted with iodine atoms, and the aryl group may have a substituent other than the iodine atoms A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1), in which R01 represents a hydrogen atom, L01 represents a divalent linking group, Ra01 and Ra02 each independently represent a hydrocarbon group which may have a substituent, Ar01 represents an aryl group in which some or all hydrogen atoms are substituted with iodine atoms, and the aryl group may have a substituent other than the iodine atoms

Classes IPC  ?

  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • C07C 69/675 - Esters d'acides carboxyliques dont le groupe carboxyle estérifié est lié à un atome de carbone acyclique et dont l'un des groupes OH, O-métal, —CHO, céto, éther, acyloxy, des groupes , des groupes ou des groupes se trouve dans la partie acide d'acides saturés d'acides hydroxycarboxyliques saturés
  • C07C 69/76 - Esters d'acides carboxyliques dont un groupe carboxyle estérifié est lié à un atome de carbone d'un cycle aromatique à six chaînons
  • C07D 307/00 - Composés hétérocycliques contenant des cycles à cinq chaînons comportant un atome d'oxygène comme unique hétéro-atome du cycle
  • C07D 333/28 - Atomes d'halogènes
  • C07D 493/08 - Systèmes pontés
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons

24.

RESIST UNDERLAYER FILM FORMATION COMPOSITION, RESIST PATTERN FORMATION METHOD, FORMATION METHOD FOR RESIST UNDERLAYER FILM PATTERN, AND PATTERN FORMATION METHOD

      
Numéro d'application 18725992
Statut En instance
Date de dépôt 2022-12-22
Date de la première publication 2025-04-24
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ibata, Keiichi
  • Takeshita, Masaru

Abrégé

A composition for forming a resist underlayer film, including a furan resin, a thermal acid generator component that generates an acid by heat, and a solvent; a resist pattern formation method including forming a resist underlayer film on a substrate using the composition, forming a resist film on the resist underlayer film using the resist composition, exposing the resist film to light, and developing the resist film exposed to light to form a resist pattern; and a formation method for a resist underlayer film pattern and a pattern formation method, including the resist pattern formation method.

Classes IPC  ?

  • G03F 7/09 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires
  • G03F 7/20 - ExpositionAppareillages à cet effet

25.

PHOTOCURABLE COMPOSITION AND METHOD FOR FORMING PATTERN

      
Numéro d'application 18712975
Statut En instance
Date de dépôt 2022-12-12
Date de la première publication 2025-04-17
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Mizusawa, Ryuma

Abrégé

A photocurable composition including an acrylic resin, an epoxy group-containing compound excluding a component corresponding to the acrylic resin, and a cationic polymerization initiator. The acrylic resin has a glass transition point of 0° C. or lower and has a constitutional unit derived from an epoxy group-containing acrylic monomer. A content proportion of the constitutional unit in a total amount of all constitutional units constituting the acrylic resin is greater than 0% by mass and less than 50% by mass.

Classes IPC  ?

  • C08G 59/22 - Composés diépoxydés
  • C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/085 - Compositions photosensibles caractérisées par les additifs non macromoléculaires augmentant l'adhérence

26.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18729822
Statut En instance
Date de dépôt 2023-01-24
Date de la première publication 2025-04-03
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Miyazaki, Masato
  • Hirayama, Fumitake
  • Kohno, Shinichi
  • Nakagawa, Yusuke

Abrégé

A resist composition including a resin component that has a constitutional unit containing an acid decomposable group whose polarity is increased due to an action of an acid, a constitutional unit represented by General Formula (a10-1), and a constitutional unit represented by General Formula (a5-1), and a resin component that has a constitutional unit represented by General Formula (z1-1) and no acid dissociable group. In the formulae, Wax1 represents an aromatic hydrocarbon group, Ra5 represents an acid non-dissociable aliphatic cyclic group in which some carbon atoms forming a ring skeleton may be substituted with oxygen atoms, and Rz0 represents a hydrogen atom or a hydrocarbon group containing no acid dissociable group A resist composition including a resin component that has a constitutional unit containing an acid decomposable group whose polarity is increased due to an action of an acid, a constitutional unit represented by General Formula (a10-1), and a constitutional unit represented by General Formula (a5-1), and a resin component that has a constitutional unit represented by General Formula (z1-1) and no acid dissociable group. In the formulae, Wax1 represents an aromatic hydrocarbon group, Ra5 represents an acid non-dissociable aliphatic cyclic group in which some carbon atoms forming a ring skeleton may be substituted with oxygen atoms, and Rz0 represents a hydrogen atom or a hydrocarbon group containing no acid dissociable group

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

27.

METHOD OF PRODUCING RESIST COMPOSITION PURIFIED PRODUCT, RESIST PATTERN FORMING METHOD, AND RESIST COMPOSITION PURIFIED PRODUCT

      
Numéro d'application 18894241
Statut En instance
Date de dépôt 2024-09-24
Date de la première publication 2025-04-03
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Kanamaru, Takuma
  • Watahiki, Kosuke
  • Akiyama, Satoshi

Abrégé

A method of producing a resist composition purified product, the method including a step of filtering a resist composition through a filter having a porous structure in which adjacent spherical cells communicate with each other, in which the filter includes a porous membrane containing at least one resin selected from the group consisting of polyimide and polyamide-imide, the resist composition contains a resin component (A1) whose solubility in a developing solution is changed by an action of an acid and an organic solvent component, and the resin component (A1) contains a copolymer having a constitutional unit (a01) with an onium salt structure that generates sulfonic acid upon light exposure and a constitutional unit (a02) with an onium salt structure that generates a carboxylic acid upon light exposure.

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/075 - Composés contenant du silicium

28.

RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND

      
Numéro d'application 18726225
Statut En instance
Date de dépôt 2023-01-17
Date de la première publication 2025-03-27
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Matsushita, Tetsuya

Abrégé

A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) or a constitutional unit derived from a compound represented by General Formula (a0-2). In the formulae, R01 and R02 represent a hydrogen atom; L01 and L02 represent a single bond or a divalent linking group; Ar01 and Ar02 represent an aryl group substituted with iodine atoms; Xa01 represents a group which forms an alicyclic hydrocarbon group together with a carbon atom to which Ar01 is bonded; Ra02 represents a hydrocarbon group which may have a substituent; and Xa02 represents a group which forms an alicyclic hydrocarbon group together with a carbon atom to which Ra02 is bonded and a group which is bonded to Ar02 to form a condensed ring A resist composition including a resin component having a constitutional unit derived from a compound represented by General Formula (a0-1) or a constitutional unit derived from a compound represented by General Formula (a0-2). In the formulae, R01 and R02 represent a hydrogen atom; L01 and L02 represent a single bond or a divalent linking group; Ar01 and Ar02 represent an aryl group substituted with iodine atoms; Xa01 represents a group which forms an alicyclic hydrocarbon group together with a carbon atom to which Ar01 is bonded; Ra02 represents a hydrocarbon group which may have a substituent; and Xa02 represents a group which forms an alicyclic hydrocarbon group together with a carbon atom to which Ra02 is bonded and a group which is bonded to Ar02 to form a condensed ring

Classes IPC  ?

  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • C08F 20/40 - Esters d'alcools non saturés
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou

29.

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Numéro d'application 18828149
Statut En instance
Date de dépôt 2024-09-09
Date de la première publication 2025-03-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Iioka, Jun
  • Gell, Aaron

Abrégé

There are provided a processing solution, including: an oxidizing agent (A), and hexafluorosilicic acid (B), in which a molar ratio of the content of the hexafluorosilicic acid (B) to the content of the oxidizing agent (A) is from 8 to 1900; a method for processing a substrate; and a method for manufacturing a semiconductor substrate.

Classes IPC  ?

  • C11D 7/08 - Acides
  • C11D 7/32 - Composés organiques contenant de l'azote
  • C11D 7/34 - Composés organiques contenant du soufre
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives

30.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER

      
Numéro d'application 18726559
Statut En instance
Date de dépôt 2023-01-20
Date de la première publication 2025-03-06
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Onishi, Koshi
  • Miyakawa, Junichi

Abrégé

A resist composition which generates an acid upon light exposure and whose solubility in a developing solution is changed due to an action of the acid, in which a polymer compound having a constitutional unit derived from a compound represented by General formula (a0-1) is employed as a resin component whose solubility in a developing solution is changed due to the action of the acid. In General Formula (a0-1), W01 represents a polymerizable group-containing group, W02 represents an aromatic hydrocarbon group, Ya01 represents a divalent linking group or a single bond, Ra01 represents an acid dissociable group. Ra02 represents a chain-like hydrocarbon group which may have a substituent or an alicyclic hydrocarbon group which may have a substituent, m represents an integer of 1 or greater, and n represents an integer of 1 or greater A resist composition which generates an acid upon light exposure and whose solubility in a developing solution is changed due to an action of the acid, in which a polymer compound having a constitutional unit derived from a compound represented by General formula (a0-1) is employed as a resin component whose solubility in a developing solution is changed due to the action of the acid. In General Formula (a0-1), W01 represents a polymerizable group-containing group, W02 represents an aromatic hydrocarbon group, Ya01 represents a divalent linking group or a single bond, Ra01 represents an acid dissociable group. Ra02 represents a chain-like hydrocarbon group which may have a substituent or an alicyclic hydrocarbon group which may have a substituent, m represents an integer of 1 or greater, and n represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons

31.

RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD

      
Numéro d'application 18714343
Statut En instance
Date de dépôt 2022-12-22
Date de la première publication 2025-02-27
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Sunamichi, Tomonari
  • Hashimoto, Haruna
  • Hirano, Tomoyuki
  • Nakagawa, Yusuke

Abrégé

A resist composition containing a resin, an acid generator, and a crosslinking agent, in which the resin is an alkali-soluble resin having a molar absorption coefficient of 2,000 mol−1·L·cm−1 or less at a wavelength of 248 nm, and the crosslinking agent is at least one of a melamine-based crosslinking agent, a urea-based crosslinking agent, an alkylene urea-based crosslinking agent, a glycoluril-based crosslinking agent, and an epoxy-based crosslinking agent.

Classes IPC  ?

  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/004 - Matériaux photosensibles

32.

RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE AND METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE

      
Numéro d'application 18776834
Statut En instance
Date de dépôt 2024-07-18
Date de la première publication 2025-02-27
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Miyagi, Ken
  • Dazai, Takahiro
  • Iino, Shota

Abrégé

A resin composition for forming a phase-separated structure that can improve a process margin. A resin composition for forming a phase-separated structure containing a predetermined block copolymer A and a predetermined block copolymer B, the composition having a ratio (L0B/L0A) of L0 of the block copolymer B (L0B) to L0 of the block copolymer A (L0A) of 0.70 or more and 1.20 or less.

Classes IPC  ?

  • C09D 153/00 - Compositions de revêtement à base de copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères

33.

PHOTOSENSITIVE COMPOSITION

      
Numéro d'application 18723757
Statut En instance
Date de dépôt 2022-11-30
Date de la première publication 2025-02-20
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Urakawa, Kazuki
  • Shiota, Dai

Abrégé

A photosensitive composition including a radically polymerizable compound (A), and a radical polymerization initiator (C), which tends to hardly occur excessive decrease of weight of a cured product and a component other than a solvent in the photosensitive composition, and having good curability, and a cued product of the photosensitive composition are provided. A compound having a specific structure including a radically polymerizable group-containing group and a radically polymerizable compound other than the compound having the specific structure are used in combination as a radically polymerizable compound (A) in a photosensitive composition including the radically polymerizable compound (A) and a radical polymerization initiator (C).

Classes IPC  ?

  • G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
  • C08K 3/22 - OxydesHydroxydes de métaux

34.

SURFACE TREATMENT AGENT, SURFACE TREATMENT METHOD, AND AREA-SELECTIVE FILM FORMING METHOD ON SUBSTRATE SURFACE

      
Numéro d'application 18940071
Statut En instance
Date de dépôt 2024-11-07
Date de la première publication 2025-02-20
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Iioka, Jun
  • Seki, Kenji
  • Nakamura, Taiji

Abrégé

A surface treatment agent including a compound (P) represented by R1—P(═O)(OR2)(OR3) in which R1 is an alkyl group, an alkoxy group, a fluorinated alkyl group, or an aromatic hydrocarbon group which may have a substituent, and R2 and R3 are each independently a hydrogen atom, an alkyl group, a fluorinated alkyl group, or an aromatic hydrocarbon group which may have a substituent; a compound (S) represented by R—SH . . . in which R is an alkyl group having 3 or more carbon atoms, a fluorinated alkyl group having 3 or more carbon atoms, or an aromatic hydrocarbon group which may have a substituent; and a solvent.

Classes IPC  ?

  • C09D 7/63 - Adjuvants non macromoléculaires organiques
  • C23C 16/02 - Pré-traitement du matériau à revêtir
  • C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction

35.

RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD

      
Numéro d'application 18719786
Statut En instance
Date de dépôt 2022-12-12
Date de la première publication 2025-02-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Adegawa, Minoru
  • Nakamura, Tsuyoshi
  • Takaki, Daichi
  • Tsuji, Hiromitsu
  • Nakamura, Kumi

Abrégé

A resist composition containing a resin component that exhibits changed solubility in a developing solution under action of an acid, a photodecomposable base, and a fluorine additive component. The fluorine additive component includes a polymeric compound having a constitutional unit represented by General Formula (f01-1) and a constitutional unit represented by General Formula (f02-1). In the formulas, R represents a hydrogen atom; Vf01 represents an alkylene group or a halogenated alkylene group; Yf01 represents —CO—O— or —O—CO—; Rf01 represents an organic group containing a fluorine atom; Vf02 represents a divalent hydrocarbon group; Rf02 represents an acid dissociable group represented by General Formula (f02-r1-1); Rf021, Rf022, Rf023, Rf024, and Rf025 represent a hydrocarbon group; and Yf02 represents a quaternary carbon atom A resist composition containing a resin component that exhibits changed solubility in a developing solution under action of an acid, a photodecomposable base, and a fluorine additive component. The fluorine additive component includes a polymeric compound having a constitutional unit represented by General Formula (f01-1) and a constitutional unit represented by General Formula (f02-1). In the formulas, R represents a hydrogen atom; Vf01 represents an alkylene group or a halogenated alkylene group; Yf01 represents —CO—O— or —O—CO—; Rf01 represents an organic group containing a fluorine atom; Vf02 represents a divalent hydrocarbon group; Rf02 represents an acid dissociable group represented by General Formula (f02-r1-1); Rf021, Rf022, Rf023, Rf024, and Rf025 represent a hydrocarbon group; and Yf02 represents a quaternary carbon atom

Classes IPC  ?

  • C08F 220/28 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle ne contenant pas de cycles aromatiques dans la partie alcool
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/16 - Procédés de couchageAppareillages à cet effet

36.

CURABLE COMPOSITION FOR FORMING LOW REFRACTIVE INDEX FILM, LOW REFRACTIVE INDEX FILM, OPTICAL DEVICE, AND METHOD FOR PRODUCING LOW REFRACTIVE INDEX FILM

      
Numéro d'application 18795579
Statut En instance
Date de dépôt 2024-08-06
Date de la première publication 2025-02-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Aoyama, Yohei
  • Konno, Kenri
  • Mori, Risako

Abrégé

To provide a curable composition for forming a low refractive index film of which a cured film excellent in heat resistance can be formed. A curable composition for forming a low refractive index film containing a hollow filler (A), a polymerizable compound (B), and a polymerization initiator (C), and not containing an alkali-soluble resin. The polymerizable compound (B) includes a compound (B1) having 5 or more polymerizable functional groups and a compound (B2) having 1 or more and 3 or less polymerizable functional groups. A ratio (B1/B2) of a mass of the compound (B1) to a mass of the compound (B2) is 0.25 or more and 3 or less.

Classes IPC  ?

37.

PHOTOCURABLE COMPOSITION AND PATTERN FORMING METHOD

      
Numéro d'application 18712891
Statut En instance
Date de dépôt 2022-12-12
Date de la première publication 2025-02-06
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Mizusawa, Ryuma

Abrégé

A photocurable composition including an acrylic resin, an epoxy group-containing compound (excluding a component corresponding to the acrylic resin), and a cationic polymerization initiator. The acrylic resin has a glass transition point of 0° C. or lower. In such a photocurable composition, a cured film obtained by curing the photocurable composition has an elastic modulus of 2.0×106 [Pa] or greater and 1.0×109 [Pa] or less at a temperature of 80° C. when the viscoelasticity of the cured film is measured at a frequency of 1 Hz.

Classes IPC  ?

  • C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

38.

Container for cell observation

      
Numéro d'application 29864444
Numéro de brevet D1060724
Statut Délivré - en vigueur
Date de dépôt 2022-05-27
Date de la première publication 2025-02-04
Date d'octroi 2025-02-04
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Ohsaka, Takashi

39.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18713393
Statut En instance
Date de dépôt 2022-12-05
Date de la première publication 2025-01-30
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Hirano, Tomoyuki
  • Sunamichi, Tomonari
  • Hashimoto, Haruna
  • Nakagawa, Yusuke

Abrégé

A resist composition including a polymer compound having a constitutional unit represented by General Formula (a10-1) below, an onium salt-based acid generator, a crosslinking agent, and a polynuclear phenol low-molecular-weight compound containing 5 or less phenyl groups, in which the resist composition has a solid content concentration of 15% by mass or greater. In the formula, R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Yax1 represents a single bond or a divalent linking group; Wax1 represents an aromatic hydrocarbon group which may have a substituent; and nax1 represents an integer of 1 or greater A resist composition including a polymer compound having a constitutional unit represented by General Formula (a10-1) below, an onium salt-based acid generator, a crosslinking agent, and a polynuclear phenol low-molecular-weight compound containing 5 or less phenyl groups, in which the resist composition has a solid content concentration of 15% by mass or greater. In the formula, R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Yax1 represents a single bond or a divalent linking group; Wax1 represents an aromatic hydrocarbon group which may have a substituent; and nax1 represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

40.

METHOD FOR PRODUCING STRUCTURE BODY INCLUDING PHASE-SEPARATED STRUCTURE, AND COMPOSITION

      
Numéro d'application 18437759
Statut En instance
Date de dépôt 2024-02-09
Date de la première publication 2025-01-09
Propriétaire
  • TOKYO OHKA KOGYO CO., LTD. (Japon)
  • TOKYO INSTITUTE OF TECHNOLOGY (Japon)
Inventeur(s)
  • Uehara, Takuya
  • Dazai, Takahiro
  • Hayakawa, Teruaki
  • Maekawa, Shinsuke
  • Mizusaki, Riku

Abrégé

A method for producing a structure body including a phase-separated, the method including (i) applying a composition containing a block copolymer represented by Formula (n1) onto a substrate to form an undercoat agent layer, (ii) applying the composition containing the block copolymer onto the undercoat agent layer to form a self-organization layer, and (iii) subjecting the self-organization layer to phase separation. In General Formula (n1), A represents a first polymer block, B represents a second polymer block, R1c and R1d represent a substrate adsorptive group-containing group, R2c and R2d represent a substituent other than the substrate adsorptive group-containing group, m1 and n1 represent an integer of 0 to 5, m2 and n2 represent an integer of 0 to 5, m1+n1 >1, m1+m2<5, and n1+n2<5 A method for producing a structure body including a phase-separated, the method including (i) applying a composition containing a block copolymer represented by Formula (n1) onto a substrate to form an undercoat agent layer, (ii) applying the composition containing the block copolymer onto the undercoat agent layer to form a self-organization layer, and (iii) subjecting the self-organization layer to phase separation. In General Formula (n1), A represents a first polymer block, B represents a second polymer block, R1c and R1d represent a substrate adsorptive group-containing group, R2c and R2d represent a substituent other than the substrate adsorptive group-containing group, m1 and n1 represent an integer of 0 to 5, m2 and n2 represent an integer of 0 to 5, m1+n1 >1, m1+m2<5, and n1+n2<5

Classes IPC  ?

  • C09D 153/00 - Compositions de revêtement à base de copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères
  • C08J 7/04 - Revêtement
  • C08L 53/00 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères

41.

BLOCK COPOLYMER, UNDERCOAT AGENT, RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, AND METHOD FOR PRODUCING STRUCTURE BODY INCLUDING PHASE-SEPARATED STRUCTURE

      
Numéro d'application 18438090
Statut En instance
Date de dépôt 2024-02-09
Date de la première publication 2025-01-09
Propriétaire
  • TOKYO OHKA KOGYO CO., LTD. (Japon)
  • TOKYO INSTITUTE OF TECHNOLOGY (Japon)
Inventeur(s)
  • Uehara, Takuya
  • Dazai, Takahiro
  • Hayakawa, Teruaki
  • Maekawa, Shinsuke
  • Mizusaki, Riku

Abrégé

A block copolymer represented by General Formula (n1) in which A represents a first polymer block, B represents a second polymer block, R1c and R1d each independently represents a substrate adsorptive group-containing group, R2c and R2d each independently represents a substituent other than the substrate adsorptive group-containing group, m1 and n1 each independently represents an integer of 0 to 5, m2 and n2 each independently represents an integer of 0 to 5, m1+n1≥1, m1+m2≤5, and n1+n2≤5 A block copolymer represented by General Formula (n1) in which A represents a first polymer block, B represents a second polymer block, R1c and R1d each independently represents a substrate adsorptive group-containing group, R2c and R2d each independently represents a substituent other than the substrate adsorptive group-containing group, m1 and n1 each independently represents an integer of 0 to 5, m2 and n2 each independently represents an integer of 0 to 5, m1+n1≥1, m1+m2≤5, and n1+n2≤5

Classes IPC  ?

  • C09D 183/10 - Copolymères séquencés ou greffés contenant des séquences de polysiloxanes
  • C08G 81/02 - Composés macromoléculaires obtenus par l'interréaction de polymères en l'absence de monomères, p. ex. polymères séquencés au moins un des polymères étant obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone
  • C09D 5/20 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte pour revêtements pelables sous forme de films cohérents, p. ex. revêtements pelables temporaires sous forme de films cohérents

42.

RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND ACID GENERATOR

      
Numéro d'application 18691733
Statut En instance
Date de dépôt 2022-09-20
Date de la première publication 2025-01-09
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Uehara, Takuya
  • Nguyen, Khanhtin
  • Ikeda, Takuya

Abrégé

A resist composition including a base material component and a compound represented by General Formula (b0), in which Rb0 represents a fused cyclic group in which an aromatic ring and an alicyclic ring are fused, the alicyclic ring in the fused cyclic group has substituents, at least one of the substituents contains a hydrocarbon group having a bromine atom or an iodine atom, Yb0 represents a divalent linking group or a single bond, Yb0 is bonded to the alicyclic ring in the fused cyclic group, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater A resist composition including a base material component and a compound represented by General Formula (b0), in which Rb0 represents a fused cyclic group in which an aromatic ring and an alicyclic ring are fused, the alicyclic ring in the fused cyclic group has substituents, at least one of the substituents contains a hydrocarbon group having a bromine atom or an iodine atom, Yb0 represents a divalent linking group or a single bond, Yb0 is bonded to the alicyclic ring in the fused cyclic group, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/004 - Matériaux photosensibles
  • C07C 309/12 - Acides sulfoniques ayant des groupes sulfo liés à des atomes de carbone acycliques d'un squelette carboné acyclique saturé contenant des atomes d'oxygène liés au squelette carboné contenant des groupes hydroxy estérifiés liés au squelette carboné
  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides

43.

METHOD FOR PRODUCING ACID GENERATOR

      
Numéro d'application 18697720
Statut En instance
Date de dépôt 2022-10-20
Date de la première publication 2024-12-26
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Odashima, Rin
  • Kato, Hiroki

Abrégé

A method for producing an acid generator including reacting a carboxylic acid represented by Formula (d0-1) having a pKa of 0.50 or more with at least one of a nitrogen-containing base compound and an onium compound to obtain an intermediate represented by Formula (d0-p), and subjecting the intermediate (d0-p) to an ion exchange reaction with a compound represented by Formula (c0) to obtain a compound represented by Formula (d0). In the formulae, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, 1≤nb1+nb2≤5 is satisfied, Yd represents a divalent linking group or a single bond, Mpm′+ represents an organic ammonium cation having a logPOW of 4.8 or less or an onium cation having a logPOW of 4.8 or less, X− represents a counter anion, and Mm+ represents an onium cation. A method for producing an acid generator including reacting a carboxylic acid represented by Formula (d0-1) having a pKa of 0.50 or more with at least one of a nitrogen-containing base compound and an onium compound to obtain an intermediate represented by Formula (d0-p), and subjecting the intermediate (d0-p) to an ion exchange reaction with a compound represented by Formula (c0) to obtain a compound represented by Formula (d0). In the formulae, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, 1≤nb1+nb2≤5 is satisfied, Yd represents a divalent linking group or a single bond, Mpm′+ represents an organic ammonium cation having a logPOW of 4.8 or less or an onium cation having a logPOW of 4.8 or less, X− represents a counter anion, and Mm+ represents an onium cation.

Classes IPC  ?

  • C07C 51/41 - Préparation de sels d'acides carboxyliques par conversion de ces acides ou de leurs sels en sels ayant la même partie acide carboxylique
  • G03F 7/004 - Matériaux photosensibles

44.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18700987
Statut En instance
Date de dépôt 2022-11-01
Date de la première publication 2024-12-26
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Someya, Yasuo
  • Kaiho, Takaaki

Abrégé

A resist composition containing a base component, an acid generator component, and an acid diffusion-controlling agent. The acid generator component includes a compound having a molar absorption coefficient of 50,000 mol−1·L·cm−1 or less at an exposure wavelength of 193 nm, and the acid diffusion-controlling agent includes a compound represented by General Formula (d0), in which Rd01 represents a cyclic group or a chain alkenyl group which may have a substituent, Yd01 represents a divalent linking group containing an oxygen atom, m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation A resist composition containing a base component, an acid generator component, and an acid diffusion-controlling agent. The acid generator component includes a compound having a molar absorption coefficient of 50,000 mol−1·L·cm−1 or less at an exposure wavelength of 193 nm, and the acid diffusion-controlling agent includes a compound represented by General Formula (d0), in which Rd01 represents a cyclic group or a chain alkenyl group which may have a substituent, Yd01 represents a divalent linking group containing an oxygen atom, m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation Rd01-Yd01-CH2—SO3⊖(Mm⊕)1/m  (d0)

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

45.

RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, AND METHOD FOR PRODUCING STRUCTURE BODY INCLUDING PHASE-SEPARATED STRUCTURE

      
Numéro d'application 18692782
Statut En instance
Date de dépôt 2022-09-20
Date de la première publication 2024-12-26
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Miyagi, Ken
  • Dazai, Takahiro
  • Tsuchiya, Junichi

Abrégé

A resin composition for forming a phase-separated structure, the resin composition containing a first block copolymer having a first a block and a first b block, a second block copolymer having a second a block and a second b block, a homopolymer A compatible with the first a block and the second a block, and a homopolymer B compatible with the first b block and the second b block, in which a constitutional unit constituting the first a block and a constitutional unit constituting the second a block are the same, a constitutional unit constituting the first b block and a constitutional unit constituting the second b block are the same, and a number-average molecular weight of the second block copolymer is larger than a number-average molecular weight of the first block copolymer.

Classes IPC  ?

  • C08L 53/00 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères

46.

CLEANING SOLUTION, METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR

      
Numéro d'application 18747824
Statut En instance
Date de dépôt 2024-06-19
Date de la première publication 2024-12-26
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Seki, Kenji
  • Iioka, Jun

Abrégé

There are provided a cleaning solution, including: an oxoacid having an acid dissociation constant pka of less than 5.0 and a valence of two or more, in which a value of pH of the cleaning solution is smaller than the acid dissociation constant; a method for cleaning a semiconductor substrate using the same; and a method for manufacturing a semiconductor.

Classes IPC  ?

47.

PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Numéro d'application 18680569
Statut En instance
Date de dépôt 2024-05-31
Date de la première publication 2024-12-19
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Kimura, Kenta

Abrégé

A processing solution for a semiconductor device including a fluorine-containing compound, water, a cyclic ether compound, and a water-soluble organic solvent that is not the cyclic ether compound; a method for processing a substrate; and a method for manufacturing a semiconductor device.

Classes IPC  ?

  • C11D 3/20 - Composés organiques contenant de l'oxygène
  • C11D 3/04 - Composés inorganiques solubles dans l'eau
  • C11D 3/43 - Solvants
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
  • H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs
  • H01L 21/308 - Traitement chimique ou électrique, p. ex. gravure électrolytique en utilisant des masques

48.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER COMPOUND, AND COMPOUND

      
Numéro d'application 18694868
Statut En instance
Date de dépôt 2022-10-06
Date de la première publication 2024-12-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Kato, Hiroki
  • Ishii, Shuichi
  • Fujinami, Tetsuo

Abrégé

A resist composition which generates an acid upon exposure to light and whose solubility in a developing solution is changed under action of an acid, the resist composition containing a resin component whose solubility in a developing solution is changed under action of an acid, in which the resin component has a constitutional unit derived from a compound represented by General Formula (a0) in which W represents a polymerizable group, Ar represents an aromatic hydrocarbon group, —OH represents a hydroxy group, La0 represents a divalent linking group, Ya0 represents a single bond or a divalent linking group, Ra01 and Ra02 each independently represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group, n0 represents an integer in a range of 1 to 4, m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation.

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/20 - ExpositionAppareillages à cet effet

49.

TREATMENT LIQUID

      
Numéro d'application 18732471
Statut En instance
Date de dépôt 2024-06-03
Date de la première publication 2024-12-12
Propriétaire Tokyo Ohka Kogyo Co., Ltd. (Japon)
Inventeur(s) Eto, Takahiro

Abrégé

A treatment liquid containing a fluorine-containing compound, an organic solvent, a basic compound represented by General Formula NR1R2R3, and water, in which a content of the organic solvent is 65% by mass or more with respect to a total amount of the treatment liquid, and a pH is 6 to 9. In the formula, R1 to R3 are each independently a hydrogen atom or a hydrocarbon group which may have a substituent.

Classes IPC  ?

  • C09K 13/06 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique avec une substance organique
  • C09K 13/08 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique contenant un composé du fluor

50.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID DIFFUSION CONTROL AGENT

      
Numéro d'application 18699225
Statut En instance
Date de dépôt 2022-10-18
Date de la première publication 2024-12-05
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Odashima, Rin
  • Kato, Hiroki

Abrégé

A resist composition containing a resin component (A1) and a photodecomposable base (D0) represented by General Formula (d0) that generates a carboxylic acid having a pKa of 0.50 or more as a generated acid. In the formula, Rm represents a hydrogen atom or a hydroxy group, X0 represents a bromine atom or an iodine atom, Yd0 represents a divalent linking group or a single bond, Rb1 represents a fluorine atom or a fluorinated alkyl group, p01 represents an integer in a range of 1 to 5, and Rb2 and Rb3 are hydrocarbon groups, provided that at least one Rb1 is bonded to an ortho-position or a meta-position of a benzene ring, and the number of all fluorine atoms contained in —F and/or —CFRx1Rx2 bonded to an aromatic ring bonded to the sulfur atom in the formula is 3 or more, and Rx1 and Rx2 represent a fluorine atom or a hydrogen atom A resist composition containing a resin component (A1) and a photodecomposable base (D0) represented by General Formula (d0) that generates a carboxylic acid having a pKa of 0.50 or more as a generated acid. In the formula, Rm represents a hydrogen atom or a hydroxy group, X0 represents a bromine atom or an iodine atom, Yd0 represents a divalent linking group or a single bond, Rb1 represents a fluorine atom or a fluorinated alkyl group, p01 represents an integer in a range of 1 to 5, and Rb2 and Rb3 are hydrocarbon groups, provided that at least one Rb1 is bonded to an ortho-position or a meta-position of a benzene ring, and the number of all fluorine atoms contained in —F and/or —CFRx1Rx2 bonded to an aromatic ring bonded to the sulfur atom in the formula is 3 or more, and Rx1 and Rx2 represent a fluorine atom or a hydrogen atom

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

51.

COMPOSITION AND PHOTOSENSITIVE COMPOSITION

      
Numéro d'application 18694193
Statut En instance
Date de dépôt 2022-08-18
Date de la première publication 2024-12-05
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Sugawara, Ryutaro
  • Asaba, Takuro

Abrégé

A photosensitive composition which tends to hardly occur excessive decrease of weight of a component (in which is a component other than a solvent, when the composition or the photosensitive composition includes the solvent) in the composition or the photosensitive composition by heating, and includes inorganic microparticles in a stably dispersed state, a cured product of the photosensitive composition, a compound which can be preferably added to the composition and the photosensitive composition, and a production method of the compound are provided. In a composition including a photopolymerizable compound (A) and inorganic microparticles (B) or a photosensitive composition including a photopolymerizable compound (A), inorganic microparticles (B), and an initiator, a compound with a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group is used as the photopolymerizable compound (A).

Classes IPC  ?

  • G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
  • C07C 69/54 - Esters d'acide acryliqueEsters d'acide méthacrylique
  • C07D 217/02 - Composés hétérocycliques contenant les systèmes cycliques de l'isoquinoléine ou de l'isoquinoléine hydrogénée avec uniquement des atomes d'hydrogène ou des radicaux ne contenant que des atomes d'hydrogène et de carbone, liés directement aux atomes de carbone du cycle contenant l'azoteAlkylène-bis-isoquinoléines
  • C07D 277/74 - Atomes de soufre substitués par des atomes de carbone
  • C08K 3/22 - OxydesHydroxydes de métaux

52.

CLEANING LIQUID, METHOD OF CLEANING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

      
Numéro d'application 18659895
Statut En instance
Date de dépôt 2024-05-09
Date de la première publication 2024-11-28
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Serizawa, Kohei
  • Uchida, Emi

Abrégé

A cleaning liquid for removing an etching residue containing a titanium component, the cleaning liquid including a compound represented by General Formula (a1) below, in which the cleaning liquid has a pH of 6 or greater, which is measured at 23° C., in which R represents an organic group or a hydrogen atom A cleaning liquid for removing an etching residue containing a titanium component, the cleaning liquid including a compound represented by General Formula (a1) below, in which the cleaning liquid has a pH of 6 or greater, which is measured at 23° C., in which R represents an organic group or a hydrogen atom

Classes IPC  ?

  • C11D 7/32 - Composés organiques contenant de l'azote
  • C11D 7/26 - Composés organiques contenant de l'oxygène
  • C11D 7/50 - Solvants
  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
  • H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
  • H01L 21/311 - Gravure des couches isolantes

53.

CLEANING LIQUID, METHOD OF CLEANING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

      
Numéro d'application 18667524
Statut En instance
Date de dépôt 2024-05-17
Date de la première publication 2024-11-28
Propriétaire Tokyo Ohka Kogyo Co., Ltd. (Japon)
Inventeur(s)
  • Serizawa, Kohei
  • Uchida, Emi

Abrégé

A cleaning liquid that removes an etching residue containing a titanium component, the cleaning liquid including a compound represented by General Formula (a1) and a compound (B) represented by General Formula (b1). In formula (a1), Ra0 represents a monovalent organic group containing a hydroxy group or a carboxy group, or a hydrogen atom. In formula (b1), Rb0 represents a monovalent organic group or a hydrogen atom A cleaning liquid that removes an etching residue containing a titanium component, the cleaning liquid including a compound represented by General Formula (a1) and a compound (B) represented by General Formula (b1). In formula (a1), Ra0 represents a monovalent organic group containing a hydroxy group or a carboxy group, or a hydrogen atom. In formula (b1), Rb0 represents a monovalent organic group or a hydrogen atom

Classes IPC  ?

  • C11D 3/20 - Composés organiques contenant de l'oxygène
  • C11D 3/30 - AminesAmines substituées

54.

METHOD FOR PROCESSING SUBSTRATE, CHEMICAL SOLUTION, AND METHOD FOR PROVIDING CHEMICAL SOLUTION

      
Numéro d'application 18695607
Statut En instance
Date de dépôt 2022-09-20
Date de la première publication 2024-11-28
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Namiki, Takumi
  • Wakiya, Kazumasa
  • Wada, Yukihisa

Abrégé

A method for processing a substrate, for processing a surface of a substrate having projections/depressions formed on the surface, the method having: a rinsing step S101 of rinsing the surface of the substrate with a rinsing solution containing water; a chemical solution replacement step S102 of bringing a chemical solution into contact with the surface of the substrate that has been rinsed, to replace a liquid adhering to the surface of the substrate from the rinsing solution to the chemical solution; a state change step S103 of raising a temperature of the substrate wetted with the chemical solution to a temperature equal to or higher than the critical temperature of the chemical solution to allow the chemical solution to reach a supercritical state; and a removing step S104 of removing the chemical solution in the supercritical state from the surface of the substrate, in which the chemical solution contains an organic solvent (S1) (excluding, however, organic solvents having a fluorine atom) having a higher specific gravity than water.

Classes IPC  ?

  • H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives

55.

ETCHING SOLUTION, ETCHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Numéro d'application 18659602
Statut En instance
Date de dépôt 2024-05-09
Date de la première publication 2024-11-21
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Tajima, Kazuya
  • Sugawara, Mai

Abrégé

An etching solution, an etching method using the etching solution, and a method for manufacturing a semiconductor device using the etching solution. The etching solution includes an oxidizing agent, a fluoride, a compound represented by formula (1) below, and water, a mass of the oxidizing agent is 20 mass % or more with respect to a mass of the etching solution, An etching solution, an etching method using the etching solution, and a method for manufacturing a semiconductor device using the etching solution. The etching solution includes an oxidizing agent, a fluoride, a compound represented by formula (1) below, and water, a mass of the oxidizing agent is 20 mass % or more with respect to a mass of the etching solution, An etching solution, an etching method using the etching solution, and a method for manufacturing a semiconductor device using the etching solution. The etching solution includes an oxidizing agent, a fluoride, a compound represented by formula (1) below, and water, a mass of the oxidizing agent is 20 mass % or more with respect to a mass of the etching solution, and R1 and R2 each independently represents a hydrogen atom, a halogen atom, an alkyl group, a fluoroalkyl group, or an alkoxy group, and R3 and R4 each independently represents a halogen atom, a hydroxy group, an alkyl group, a fluoroalkyl group, or an alkoxy group.

Classes IPC  ?

  • C09K 13/08 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique contenant un composé du fluor
  • H01L 21/306 - Traitement chimique ou électrique, p. ex. gravure électrolytique

56.

ETCHING SOLUTION, ETCHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Numéro d'application 18659906
Statut En instance
Date de dépôt 2024-05-09
Date de la première publication 2024-11-21
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Go, Choitsu
  • Tajima, Kazuya
  • Sugawara, Mai

Abrégé

An etching solution having excellent etching selectivity, an etching method using the etching solution, and a method for manufacturing a semiconductor device using the etching solution. The etching solution includes an oxidizing agent, a fluoride, a compound represented by the following formula (1), a carboxylic acid as a solvent, and water, An etching solution having excellent etching selectivity, an etching method using the etching solution, and a method for manufacturing a semiconductor device using the etching solution. The etching solution includes an oxidizing agent, a fluoride, a compound represented by the following formula (1), a carboxylic acid as a solvent, and water, An etching solution having excellent etching selectivity, an etching method using the etching solution, and a method for manufacturing a semiconductor device using the etching solution. The etching solution includes an oxidizing agent, a fluoride, a compound represented by the following formula (1), a carboxylic acid as a solvent, and water, and R1 and R2 each independently represents a hydrogen atom, a halogen atom, an alkyl group, a fluoroalkyl group, or an alkoxy group, and R3 and R4 each independently represents a halogen atom, a hydroxy group, an alkyl group, a fluoroalkyl group, or an alkoxy group.

Classes IPC  ?

  • C09K 13/08 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique contenant un composé du fluor
  • H01L 21/306 - Traitement chimique ou électrique, p. ex. gravure électrolytique

57.

METHOD OF FORMING SURFACE TREATMENT FILM

      
Numéro d'application 18662778
Statut En instance
Date de dépôt 2024-05-13
Date de la première publication 2024-11-21
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Inomata, Koya
  • Tanaka, Daichi

Abrégé

A method of forming a surface treatment film on a substrate having, on a surface thereof, a first region where an insulator is exposed and a second region where at least one metallic matter is exposed, in which the surface treatment film is formed on the second region and is capable of suppressing intrusion of the surface treatment film onto the first region. A method of forming a surface treatment film, including preparing the substrate, oxidizing a surface of the second region, and forming a surface treatment film on the second region by exposing a surface of the substrate after the oxidation to a surface-treatment agent including a thiol having 8 or less carbon atoms.

Classes IPC  ?

  • C23C 16/56 - Post-traitement
  • C23C 16/02 - Pré-traitement du matériau à revêtir
  • C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction

58.

COMPOSITION AND PHOTOSENSITIVE COMPOSITION

      
Numéro d'application 18694174
Statut En instance
Date de dépôt 2022-08-18
Date de la première publication 2024-11-21
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Sugawara, Ryutaro
  • Asaba, Takuro

Abrégé

A photosensitive composition which tends to hardly occur excessive decrease of weight of a component (in which is a component other than a solvent, when the composition or the photosensitive composition includes the solvent) in the composition or the photosensitive composition by heating, and include inorganic microparticles in a stably dispersed state, a cured product of the photosensitive composition, a compound which can be preferably added to the composition and the photosensitive composition, and a production method of the compound are provided. In a composition including a photopolymerizable compound (A) and inorganic microparticles (B) or a photosensitive composition including a photopolymerizable compound (A), inorganic microparticles (B), and an initiator, a compound with a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group is used as the photopolymerizable compound (A).

Classes IPC  ?

  • C08K 3/08 - Métaux
  • C07C 319/14 - Préparation de thiols, de sulfures, d'hydropolysulfures ou de polysulfures de sulfures
  • C07C 319/20 - Préparation de thiols, de sulfures, d'hydropolysulfures ou de polysulfures de sulfures par des réactions n'impliquant pas la formation de groupes sulfure
  • C07C 323/19 - Thiols, sulfures, hydropolysulfures ou polysulfures substitués par des halogènes, des atomes d'oxygène ou d'azote ou par des atomes de soufre ne faisant pas partie de groupes thio contenant des groupes thio et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné ayant l'atome de soufre d'au moins un des groupes thio lié à un atome de carbone d'un cycle aromatique à six chaînons du squelette carboné avec des atomes d'oxygène, liés par des liaisons simples, liés à des atomes de carbone acycliques du squelette carboné
  • C07C 323/20 - Thiols, sulfures, hydropolysulfures ou polysulfures substitués par des halogènes, des atomes d'oxygène ou d'azote ou par des atomes de soufre ne faisant pas partie de groupes thio contenant des groupes thio et des atomes d'oxygène, liés par des liaisons simples, liés au même squelette carboné ayant l'atome de soufre d'au moins un des groupes thio lié à un atome de carbone d'un cycle aromatique à six chaînons du squelette carboné avec des atomes d'oxygène, liés par des liaisons simples, liés à des atomes de carbone du même cycle aromatique à six chaînons non condensé
  • C08F 122/24 - Esters contenant du soufre
  • C08K 3/22 - OxydesHydroxydes de métaux

59.

RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND ACID DIFFUSION CONTROL AGENT

      
Numéro d'application 18691411
Statut En instance
Date de dépôt 2022-09-21
Date de la première publication 2024-11-14
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Uehara, Takuya

Abrégé

A resist composition containing a base material component (A) and a compound represented by General Formula (d0), in which Rd0 represents a condensed cyclic group in which an aromatic ring and an alicyclic ring are condensed, the alicyclic ring in the condensed cyclic group has a substituent, at least one of the substituents includes a hydrocarbon group having a bromine atom or a hydrocarbon group having an iodine atom, Yd0 represents a divalent linking group or a single bond, Yd0 is bonded to the alicyclic ring in the condensed cyclic group, Mm+ represents an m-valent organic cation, m represents an integer of 1 or more A resist composition containing a base material component (A) and a compound represented by General Formula (d0), in which Rd0 represents a condensed cyclic group in which an aromatic ring and an alicyclic ring are condensed, the alicyclic ring in the condensed cyclic group has a substituent, at least one of the substituents includes a hydrocarbon group having a bromine atom or a hydrocarbon group having an iodine atom, Yd0 represents a divalent linking group or a single bond, Yd0 is bonded to the alicyclic ring in the condensed cyclic group, Mm+ represents an m-valent organic cation, m represents an integer of 1 or more

Classes IPC  ?

  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons

60.

RESIN COMPOSITION FOR FORMING ETCHING MASK PATTERN, AND METHOD FOR MANUFACTURING ETCHING MASK PATTERN

      
Numéro d'application 18645876
Statut En instance
Date de dépôt 2024-04-25
Date de la première publication 2024-11-07
Propriétaire
  • TOKYO OHKA KOGYO CO., LTD. (Japon)
  • TOKYO INSTITUTE OF TECHNOLOGY (Japon)
Inventeur(s)
  • Seshimo, Takehiro
  • Miyagi, Ken
  • Dazai, Takahiro
  • Hayakawa, Teruaki
  • Maekawa, Shinsuke
  • Uehara, Ryota

Abrégé

A resin composition for forming an etching mask pattern containing a block copolymer having a first block and a second block, and a homopolymer having a number-average molecular weight of less than 3,000. The first block is a polymer of a constitutional unit represented by Formula (b1) and the second block is a random copolymer of a constitutional unit represented by Formula (b2m) and a constitutional unit represented by Formula (b2g). The proportion of the volume of the first block is 20% to 80% by volume. The homopolymer includes a polymer of the constitutional unit represented by Formula (b1). In the formulas illustrated below, R1 is an alkyl group, Rb1 is a hydrogen atom or a methyl group, n is an integer of 0 to 5, R2 is an alkyl group, R3 is an alkylene group, Rb2 is a hydrogen atom or the like, and x is more than 0 and less than 1 A resin composition for forming an etching mask pattern containing a block copolymer having a first block and a second block, and a homopolymer having a number-average molecular weight of less than 3,000. The first block is a polymer of a constitutional unit represented by Formula (b1) and the second block is a random copolymer of a constitutional unit represented by Formula (b2m) and a constitutional unit represented by Formula (b2g). The proportion of the volume of the first block is 20% to 80% by volume. The homopolymer includes a polymer of the constitutional unit represented by Formula (b1). In the formulas illustrated below, R1 is an alkyl group, Rb1 is a hydrogen atom or a methyl group, n is an integer of 0 to 5, R2 is an alkyl group, R3 is an alkylene group, Rb2 is a hydrogen atom or the like, and x is more than 0 and less than 1

Classes IPC  ?

  • C08L 53/00 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères

61.

METHOD FOR MANUFACTURING ETCHING MASK PATTERN, AND RESIN COMPOSITION FOR FORMING ETCHING MASK PATTERN

      
Numéro d'application 18645208
Statut En instance
Date de dépôt 2024-04-24
Date de la première publication 2024-10-31
Propriétaire
  • TOKYO OHKA KOGYO CO., LTD. (Japon)
  • TOKYO INSTITUTE OF TECHNOLOGY (Japon)
Inventeur(s)
  • Seshimo, Takehiro
  • Dazai, Takahiro
  • Hayakawa, Teruaki
  • Maekawa, Shinsuke
  • Uehara, Ryota

Abrégé

A manufacturing method including applying a resin composition for forming an etching mask pattern onto a support to form a layer containing a block copolymer and having a film thickness of 25 nm or more, and phase-separating the layer. The resin composition contains a block copolymer having a first block and a second block, the first block is includes a constitutional unit having General Formula (b1), and the second block is a random copolymer of a constitutional unit of General Formula (b2m) and a constitutional unit of General Formula (b2g). In the formulas illustrated below, R1 is an alkyl group which may have an oxygen atom or a silicon atom; R2 is an alkyl group; R3 is an alkylene group; and x represents a molar ratio and is more than 0 and 0.10 or less A manufacturing method including applying a resin composition for forming an etching mask pattern onto a support to form a layer containing a block copolymer and having a film thickness of 25 nm or more, and phase-separating the layer. The resin composition contains a block copolymer having a first block and a second block, the first block is includes a constitutional unit having General Formula (b1), and the second block is a random copolymer of a constitutional unit of General Formula (b2m) and a constitutional unit of General Formula (b2g). In the formulas illustrated below, R1 is an alkyl group which may have an oxygen atom or a silicon atom; R2 is an alkyl group; R3 is an alkylene group; and x represents a molar ratio and is more than 0 and 0.10 or less

Classes IPC  ?

  • G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
  • C08F 287/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères séquencés
  • C09D 151/00 - Compositions de revêtement à base de polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères
  • G03F 1/80 - Attaque chimique
  • G03F 7/16 - Procédés de couchageAppareillages à cet effet

62.

RESIN COMPOSITION FOR FORMING ETCHING MASK PATTERN, AND METHOD FOR MANUFACTURING ETCHING MASK PATTERN

      
Numéro d'application 18636069
Statut En instance
Date de dépôt 2024-04-15
Date de la première publication 2024-10-31
Propriétaire
  • TOKYO OHKA KOGYO CO., LTD. (Japon)
  • TOKYO INSTITUTE OF TECHNOLOGY (Japon)
Inventeur(s)
  • Seshimo, Takehiro
  • Dazai, Takahiro
  • Hayakawa, Teruaki
  • Maekawa, Shinsuke
  • Uehara, Ryota

Abrégé

A resin composition for forming an etching mask pattern, with which a phase-separated structure having a period (L0) of less than 20 nm and having excellent vertical orientation even when subjected to high-temperature annealing can be obtained; and a method for manufacturing an etching mask pattern. The method includes applying the resin composition onto a support to form a block copolymer layer having a film thickness of 25 nm or more and phase-separating the block copolymer layer. The resin composition contains a block copolymer having a first block and a second block, the first block includes a structure of General Formula (b1), and the second block consists of a block 2M of a structure of General Formula (b2m) and a block 2G of a structure of General Formula (b2g), and y/(y+z) is 0.01 or more and 0.11 or less; R1 is an alkyl group, R2 is an alkyl group; and R3 is an alkylene group A resin composition for forming an etching mask pattern, with which a phase-separated structure having a period (L0) of less than 20 nm and having excellent vertical orientation even when subjected to high-temperature annealing can be obtained; and a method for manufacturing an etching mask pattern. The method includes applying the resin composition onto a support to form a block copolymer layer having a film thickness of 25 nm or more and phase-separating the block copolymer layer. The resin composition contains a block copolymer having a first block and a second block, the first block includes a structure of General Formula (b1), and the second block consists of a block 2M of a structure of General Formula (b2m) and a block 2G of a structure of General Formula (b2g), and y/(y+z) is 0.01 or more and 0.11 or less; R1 is an alkyl group, R2 is an alkyl group; and R3 is an alkylene group

Classes IPC  ?

  • C08F 297/02 - Composés macromoléculaires obtenus en polymérisant successivement des systèmes différents de monomère utilisant un catalyseur de type ionique ou du type de coordination sans désactivation du polymère intermédiaire utilisant un catalyseur du type anionique

63.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18575649
Statut En instance
Date de dépôt 2022-08-01
Date de la première publication 2024-10-10
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Kato, Hiroki
  • Fujinami, Tetsuo
  • Ishii, Shuichi

Abrégé

A resist composition including a resin component having a constitutional unit represented by General Formula (a0-1) and a compound represented by General Formula (d0-1). In General Formula (a0-1), R0 represents a hydrogen atom, an alkyl group, a halogen atom, or a halogenated alkyl group; Vax0 represents a single bond or a divalent linking group; Wa represents a divalent aromatic hydrocarbon group; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; and Ra00 represents an acid dissociable group. In General Formula (d0-1), X0 represents a bromine atom or an iodine atom; Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom; nd1 represents an integer of 1 to 5; nd2 represents an integer of 0 to 4; Yd0 represents a divalent linking group or a single bond; Mm+ represents an m-valent organic cation; and m represents an integer of 1 or greater A resist composition including a resin component having a constitutional unit represented by General Formula (a0-1) and a compound represented by General Formula (d0-1). In General Formula (a0-1), R0 represents a hydrogen atom, an alkyl group, a halogen atom, or a halogenated alkyl group; Vax0 represents a single bond or a divalent linking group; Wa represents a divalent aromatic hydrocarbon group; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; and Ra00 represents an acid dissociable group. In General Formula (d0-1), X0 represents a bromine atom or an iodine atom; Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom; nd1 represents an integer of 1 to 5; nd2 represents an integer of 0 to 4; Yd0 represents a divalent linking group or a single bond; Mm+ represents an m-valent organic cation; and m represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • C08F 212/14 - Monomères contenant un seul radical aliphatique non saturé contenant un cycle substitué par des hétéro-atomes ou des groupes contenant des hétéro-atomes
  • C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

64.

CELL CULTURE CHIP, CELL CULTURE DEVICE, METHOD FOR PRODUCING CELL CULTURE CHIP, AND METHOD FOR CULTURING CELLS

      
Numéro d'application 18681554
Statut En instance
Date de dépôt 2022-08-25
Date de la première publication 2024-10-10
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Kamizono, Takashi
  • Fujimoto, Takashi
  • Akabane, Takafumi
  • Satoh, Taku
  • Moriguchi, Hiroyuki

Abrégé

A chip for cell culture, including a laminate having a flow path structure inside, in which respective members constituting respective layers of the laminate are adhered by adhesive layers, and the adhesive layer includes a first adhesive layer formed of an adhesive that contains a polyester-based resin having a glass transition temperature of 37° C. or higher and 120° C. or lower.

Classes IPC  ?

  • C12M 3/06 - Appareillage pour la culture de tissus, de cellules humaines, animales ou végétales, ou de virus avec des moyens de filtration, d'ultrafiltration, d'osmose inverse ou de dialyse
  • C12M 1/00 - Appareillage pour l'enzymologie ou la microbiologie
  • C12M 1/12 - Appareillage pour l'enzymologie ou la microbiologie avec des moyens de stérilisation, filtration ou dialyse

65.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18568489
Statut En instance
Date de dépôt 2022-06-24
Date de la première publication 2024-10-03
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Nagamine, Takashi
  • Inari, Takatoshi

Abrégé

A resist composition including a resin component (A1), a compound (B0) represented by General Formula (b0), and a photodegradable base (D0) that has a carboxylic acid with a pKa of 0.3 to 2.5 as a generated acid. In formula (b0), Rb11 to Rb13 represent a halogen atom, Rb21 to Rb23 each independently represents a hydrogen atom, mb1, nb1, and ob1 represent an integer of 2 to 5, mb2 represents an integer of 5-mb1, nb2 represents an integer of 5-nb1, ob2 represents an integer of 5-ob1, R101 represents a cyclic group, R102 represents a fluorinated alkyl group or a fluorine atom, Y101 represents a divalent linking group having an oxygen atom or a single bond, and V101 represents a single bond, an alkylene group, or a fluorinated alkylene group A resist composition including a resin component (A1), a compound (B0) represented by General Formula (b0), and a photodegradable base (D0) that has a carboxylic acid with a pKa of 0.3 to 2.5 as a generated acid. In formula (b0), Rb11 to Rb13 represent a halogen atom, Rb21 to Rb23 each independently represents a hydrogen atom, mb1, nb1, and ob1 represent an integer of 2 to 5, mb2 represents an integer of 5-mb1, nb2 represents an integer of 5-nb1, ob2 represents an integer of 5-ob1, R101 represents a cyclic group, R102 represents a fluorinated alkyl group or a fluorine atom, Y101 represents a divalent linking group having an oxygen atom or a single bond, and V101 represents a single bond, an alkylene group, or a fluorinated alkylene group

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

66.

CHIP FOR CELL CULTURING, DEVICE FOR CELL CULTURING, METHOD FOR MANUFACTURING CHIP FOR CELL CULTURING, AND METHOD FOR CULTURING CELLS

      
Numéro d'application 18681331
Statut En instance
Date de dépôt 2022-08-25
Date de la première publication 2024-10-03
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Yoshioka, Takahiro
  • Fujimoto, Takashi
  • Kamizono, Takashi
  • Akabane, Takafumi
  • Satoh, Taku
  • Moriguchi, Hiroyuki

Abrégé

A chip for cell culture, including a laminate having a flow path structure inside, in which the laminate includes a bottom plate substrate, a flow path substrate in which a flow path is formed by laser processing, and a top plate substrate in this order, and the flow path substrate includes a resin having a glass transition temperature of 37° C. or higher, an elastic modulus at 25° C. of 1×109 Pa or more, and an elastic modulus at 150° C. of 1×107 Pa or less.

Classes IPC  ?

  • C12M 1/12 - Appareillage pour l'enzymologie ou la microbiologie avec des moyens de stérilisation, filtration ou dialyse

67.

FILM-FORMING COMPOSITION, RESIST PATTERN FORMATION METHOD, AND POLYHEDRAL OLIGOMERIC SILSESQUIOXANE

      
Numéro d'application 18606762
Statut En instance
Date de dépôt 2024-03-15
Date de la première publication 2024-10-03
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ibata, Keiichi
  • Ouchi, Hayato

Abrégé

A film-forming composition including a polyhedral oligomeric silsesquioxane represented by General Formula (a1), an acid generating agent component, and a crosslinking agent component. In Formula (a1), R1 to R8 represent an aromatic group containing a phenolic hydroxyl group, a hydrocarbon group having 1 to 10 carbon atoms, or a hydrogen atom; at least one of R1 to R8 represents an aromatic group containing a phenolic hydroxyl group; L1 to L8 represent a specific divalent linking group at least one of L1 to L8 represents a divalent linking group represented by General Formula (a1-L-2) or General Formula (a1-L-3), ZX and ZY represent a hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom, and n2 and n3 represent an integer of 0 to 10).

Classes IPC  ?

68.

PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT

      
Numéro d'application 18546814
Statut En instance
Date de dépôt 2022-02-21
Date de la première publication 2024-09-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ijima, Yoichiro
  • Chisaka, Hiroki
  • Misumi, Koichi
  • Urakawa, Kazuki

Abrégé

A photocurable liquid composition capable of forming a cured product in which localization of metal oxide nanoparticles is suppressed, a cured product of the photocurable liquid composition, and a method for producing a cured product using the photocurable liquid composition. As a photopolymerizable monomer, a polyfunctional monomer having 3 or more ethylenically unsaturated double bond is added to the photocurable liquid composition including the photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiator.

Classes IPC  ?

  • C08F 222/10 - Esters
  • C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
  • C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
  • C08J 5/18 - Fabrication de bandes ou de feuilles

69.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18254802
Statut En instance
Date de dépôt 2021-12-21
Date de la première publication 2024-09-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Hirano, Tomoyuki
  • Yonemura, Koji
  • Nakagawa, Yusuke

Abrégé

A resist composition containing a polymeric compound having a constitutional unit containing a phenolic hydroxyl group, an acid generator, at least one crosslinking agent among a melamine-based crosslinking agent, a urea-based crosslinking agent, an alkylene urea-based crosslinking agent, a glycoluril-based crosslinking agent, and an epoxy-based crosslinking agent, and a polyether compound, a content of which is less than 50 parts by mass with respect to 100 parts by mass of the polymeric compound.

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

70.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18568071
Statut En instance
Date de dépôt 2022-06-10
Date de la première publication 2024-09-12
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ishii, Shuichi
  • Kato, Hiroki
  • Nguyen, Khanhtin
  • Ikeda, Takuya
  • Onishi, Koshi
  • Odashima, Rin
  • Fujinami, Tetsuo
  • Todoroki, Seiji
  • Kawatani, Ryo

Abrégé

A resist composition that contains a resin component having a constitutional unit containing an acid-dissociable group represented by General Formula (a01-r) below and contains an acid generator component containing a compound represented by General Formula (b0) below. In General Formula (a01-r), Ra01 and Ra02 represent a saturated aliphatic hydrocarbon group, Ra01 and Ra02 may be bonded to each other to form an alicyclic group. Ra03 to Ra05 represent an aliphatic hydrocarbon group and two or more of Ra03 to Ra05 may be bonded to each other to form an alicyclic group. In General Formula (b-0), X0 represents an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, nb2 represents an integer in a range of 0 to 4, 1≤nb1+nb2≤5, Yb0 represents a divalent linking group, Vb0 represents an alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms, and Mm+ represents an m-valent organic cation A resist composition that contains a resin component having a constitutional unit containing an acid-dissociable group represented by General Formula (a01-r) below and contains an acid generator component containing a compound represented by General Formula (b0) below. In General Formula (a01-r), Ra01 and Ra02 represent a saturated aliphatic hydrocarbon group, Ra01 and Ra02 may be bonded to each other to form an alicyclic group. Ra03 to Ra05 represent an aliphatic hydrocarbon group and two or more of Ra03 to Ra05 may be bonded to each other to form an alicyclic group. In General Formula (b-0), X0 represents an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, nb2 represents an integer in a range of 0 to 4, 1≤nb1+nb2≤5, Yb0 represents a divalent linking group, Vb0 represents an alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms, and Mm+ represents an m-valent organic cation

Classes IPC  ?

71.

RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, AND POLYMER

      
Numéro d'application 18424025
Statut En instance
Date de dépôt 2024-01-26
Date de la première publication 2024-09-05
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ibata, Keiichi
  • Yamada, Tomotaka
  • Uehara, Takuya

Abrégé

A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymer containing a siloxane bond and an ionic group represented by General Formula (I0), which is decomposed upon exposure to generate an acid. In General Formula (I0), Mm+ represents a sulfonium cation or an iodonium cation, m represents an integer of 1 or more, and * represents a bonding site A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymer containing a siloxane bond and an ionic group represented by General Formula (I0), which is decomposed upon exposure to generate an acid. In General Formula (I0), Mm+ represents a sulfonium cation or an iodonium cation, m represents an integer of 1 or more, and * represents a bonding site

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/075 - Composés contenant du silicium
  • G03F 7/32 - Compositions liquides à cet effet, p. ex. développateurs

72.

RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING COMPOUNDS, INTERMEDIATE, AND COMPOUNDS

      
Numéro d'application 18566338
Statut En instance
Date de dépôt 2022-06-15
Date de la première publication 2024-09-05
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Miyakawa, Junichi
  • Kato, Hiroki
  • Nguyen, Khanhtin
  • Ikeda, Takuya
  • Todoroki, Seiji
  • Matsushita, Tetsuya

Abrégé

A resin component (A1) and a compound (B0) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, and Rb1 to Rb15 each independently represents a hydrogen atom or a substituent, and at least two of Rb1 to Rb5 represent a fluorine atom or at least one of Rb1 to Rb5 represents a perfluoroalkyl group A resin component (A1) and a compound (B0) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, and Rb1 to Rb15 each independently represents a hydrogen atom or a substituent, and at least two of Rb1 to Rb5 represent a fluorine atom or at least one of Rb1 to Rb5 represents a perfluoroalkyl group

Classes IPC  ?

  • G03F 7/004 - Matériaux photosensibles
  • C07C 25/18 - Hydrocarbures halogénés aromatiques polycycliques
  • C07C 211/63 - Composés d'ammonium quaternaire ayant des atomes d'azote quaternisés liés à des atomes de carbone acycliques
  • C07C 303/22 - Préparation d'esters ou d'amides d'acides sulfuriquesPréparation d'acides sulfoniques ou de leurs esters, halogénures, anhydrides ou amides d'acides sulfoniques ou de leurs halogénures à partir d'acides sulfoniques par des réactions n'impliquant pas la formation de groupes sulfo ou halogénosulfonyle
  • C07C 309/12 - Acides sulfoniques ayant des groupes sulfo liés à des atomes de carbone acycliques d'un squelette carboné acyclique saturé contenant des atomes d'oxygène liés au squelette carboné contenant des groupes hydroxy estérifiés liés au squelette carboné
  • C07C 381/12 - Composés sulfonium
  • C07D 333/76 - Dibenzothiophènes

73.

SUBSTRATE SUPPORT

      
Numéro d'application 18431275
Statut En instance
Date de dépôt 2024-02-02
Date de la première publication 2024-08-22
Propriétaire Tokyo Ohka Kogyo Co., Ltd. (Japon)
Inventeur(s)
  • Kikuchi, Yubun
  • Yamada, Yoshihiro
  • Mizusawa, Ryuma

Abrégé

A substrate support that allows for effortless debonding of a circuit pattern, the substrate support including a base material having a bonding surface to which a semiconductor substrate (circuit pattern) is bonded; and an adhesive layer having a pattern of dots formed in at least a portion of the bonding surface.

Classes IPC  ?

  • H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
  • H01L 23/492 - Embases ou plaques

74.

SEMICONDUCTOR DEVICE PRODUCTION METHOD

      
Numéro d'application 18431549
Statut En instance
Date de dépôt 2024-02-02
Date de la première publication 2024-08-22
Propriétaire Tokyo Ohka Kogyo Co., Ltd. (Japon)
Inventeur(s)
  • Kikuchi, Yubun
  • Yamada, Yoshihiro
  • Mizusawa, Ryuma

Abrégé

A method for efficiently producing circuit patterns (semiconductor devices) that allows for effortless pickup of circuit patterns after dicing. The method includes producing a semiconductor substrate with circuit patterns formed on a first surface; forming a first laminate by bonding a first support through a first adhesive layer to the first surface; forming a second laminate by bonding a second support through a second adhesive layer having a dot pattern to a second surface opposite to the first surface; debonding the first support from the second laminate; and picking up the circuit patterns from the second support.

Classes IPC  ?

  • H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
  • H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels

75.

AQUEOUS CLEANING LIQUID

      
Numéro d'application 18433986
Statut En instance
Date de dépôt 2024-02-06
Date de la première publication 2024-08-22
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Namiki, Takumi
  • Kumada, Shinji
  • Suga, Eita
  • Kimura, Kenta
  • Kondo, Jun

Abrégé

An aqueous cleaning liquid containing hydrofluoric acid, at least one kind of triazole compound selected from the group consisting of triazole and a triazole derivative, and a nonionic surfactant.

Classes IPC  ?

  • C11D 3/28 - Composés hétérocycliques contenant de l'azote dans le cycle
  • C11D 1/66 - Composés non ioniques
  • C11D 3/00 - Autres composés entrant dans les compositions détergentes couvertes par le groupe
  • C11D 3/04 - Composés inorganiques solubles dans l'eau
  • C11D 3/20 - Composés organiques contenant de l'oxygène

76.

AQUEOUS CLEANING LIQUID

      
Numéro d'application 18433953
Statut En instance
Date de dépôt 2024-02-06
Date de la première publication 2024-08-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Namiki, Takumi
  • Iioka, Jun

Abrégé

An aqueous cleaning liquid containing hydrofluoric acid and an aliphatic sulfonic acid, where the aqueous cleaning liquid is used in a case of cleaning a substrate having cobalt in a surface layer.

Classes IPC  ?

  • C11D 3/24 - Composés organiques contenant un halogène
  • C11D 3/34 - Composés organiques contenant du soufre
  • C11D 17/00 - Détergents ou savons caractérisés par leur forme ou leurs propriétés physiques

77.

AQUEOUS CLEANING LIQUID

      
Numéro d'application 18433995
Statut En instance
Date de dépôt 2024-02-06
Date de la première publication 2024-08-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Iioka, Jun
  • Namiki, Takumi

Abrégé

There is provided an aqueous cleaning liquid containing hydrofluoric acid and a water-soluble aromatic compound, where the aqueous cleaning liquid has a pH of more than 5.

Classes IPC  ?

  • C11D 3/24 - Composés organiques contenant un halogène
  • C11D 3/36 - Composés organiques contenant du phosphore
  • C11D 17/00 - Détergents ou savons caractérisés par leur forme ou leurs propriétés physiques

78.

COMPOSITION FOR PRODUCING POROUS FILM, METHOD FOR PRODUCING POROUS FILM, AND POROUS FILM

      
Numéro d'application 18430987
Statut En instance
Date de dépôt 2024-02-02
Date de la première publication 2024-08-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Noguchi, Takuya
  • Akiyama, Satoshi

Abrégé

Provided are a composition for producing a porous film the composition enabling a decrease in a pore diameter of a produced porous film and improvement of a flow rate through the porous film, a method for producing a porous film, and a porous film. A composition for producing a porous film, the composition comprising at least one resin component (A) selected from a group consisting of polyamide acid, polyimide, a polyamide-imide precursor, polyamide-imide, and polyethersulfone, fine particles (B), and a solvent (S), the fine particles (B) comprising fine particles (B1) and fine particles (B2) having an average particle diameter larger than that of the fine particles (B1), the fine particles (B1) having an average particle diameter of smaller than 100 nm.

Classes IPC  ?

  • C08J 9/26 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement par élimination d'une phase solide d'un objet ou d'une composition macromoléculaire, p. ex. par lessivage
  • C08J 5/18 - Fabrication de bandes ou de feuilles

79.

AQUEOUS CLEANING LIQUID

      
Numéro d'application 18433969
Statut En instance
Date de dépôt 2024-02-06
Date de la première publication 2024-08-15
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Namiki, Takumi
  • Iioka, Jun

Abrégé

There is provided an aqueous cleaning liquid containing hydrofluoric acid and at least one kind of chelating compound selected from the group consisting of a β-diketone compound and a compound containing a total of two or more carboxy groups or hydroxyl groups in a molecule, where the aqueous cleaning liquid is used in a case of cleaning a substrate that contains aluminum oxide in a surface layer.

Classes IPC  ?

  • C11D 3/20 - Composés organiques contenant de l'oxygène
  • C11D 3/00 - Autres composés entrant dans les compositions détergentes couvertes par le groupe
  • C11D 3/04 - Composés inorganiques solubles dans l'eau
  • C11D 3/30 - AminesAmines substituées

80.

RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD

      
Numéro d'application 18563359
Statut En instance
Date de dépôt 2022-06-14
Date de la première publication 2024-08-08
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Uehara, Takuya
  • Matsushita, Tetsuya
  • Miyakawa, Junichi
  • Nguyen, Khanhtin
  • Kato, Hiroki
  • Fujimoto, Yuuki

Abrégé

A resist composition including a resin component which has a constitutional unit (a01a) containing a polycyclic lactone-containing cyclic group and a constitutional unit (a02) represented by General Formula (a0-2), and a compound (B0) represented by General Formula (b0), Ra05 to Ra08 each independently represents a hydrogen atom, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, R0 represents a hydrogen atom, Mm+ represents an m-valent organic cation, m represents an integer of 1 or greater A resist composition including a resin component which has a constitutional unit (a01a) containing a polycyclic lactone-containing cyclic group and a constitutional unit (a02) represented by General Formula (a0-2), and a compound (B0) represented by General Formula (b0), Ra05 to Ra08 each independently represents a hydrogen atom, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, R0 represents a hydrogen atom, Mm+ represents an m-valent organic cation, m represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • C08F 212/14 - Monomères contenant un seul radical aliphatique non saturé contenant un cycle substitué par des hétéro-atomes ou des groupes contenant des hétéro-atomes
  • C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables

81.

RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Numéro d'application 18563358
Statut En instance
Date de dépôt 2022-06-06
Date de la première publication 2024-07-25
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Matsushita, Tetsuya
  • Onishi, Koshi
  • Ishii, Shuichi
  • Miyakawa, Junichi

Abrégé

A resist composition including a resin component (A1) which has a constitutional unit (a0) containing a photodegradable base that is decomposed upon light exposure and loses acid diffusion controllability, and an acid generator component (B) which contains a compound (BO) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, where 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater A resist composition including a resin component (A1) which has a constitutional unit (a0) containing a photodegradable base that is decomposed upon light exposure and loses acid diffusion controllability, and an acid generator component (B) which contains a compound (BO) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, where 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater

Classes IPC  ?

  • G03F 7/039 - Composés macromoléculaires photodégradables, p. ex. réserves positives sensibles aux électrons
  • G03F 7/004 - Matériaux photosensibles
  • G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
  • G03F 7/20 - ExpositionAppareillages à cet effet

82.

PHOTOCURABLE COMPOSITION

      
Numéro d'application 18556281
Statut En instance
Date de dépôt 2022-04-21
Date de la première publication 2024-07-18
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Urakawa, Kazuki
  • Miyazaki, Masato

Abrégé

The present invention provides: a photocurable composition that, although including metal oxide microparticles at high concentration, is such that the metal oxide microparticles are satisfactorily dispersed and leakability to a to-be-coated substrate is satisfactory; a cured product of said photocurable composition; and a cured film formation method that uses the photocurable composition. A photocurable resin composition contains a photopolymerizable compound (A), metal oxide microparticles (B), an initiator (C), and a solvent (S). A compound having a radical-polymerizable-group-containing group or a cationically-polymerizable-group-containing group is used as the photopolymerizable compound (A). As the solvent (S), a plurality of solvents (S1) are used that have a specific structure that includes an oxyalkylene group, and are such that the Hildebrand solubility parameter value thereof is 21.0 MPa0.5 (alternatively, the solvent (S1) and another solvent (S2) are used at a prescribed mass ratio).

Classes IPC  ?

  • C08F 2/48 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible
  • C08F 222/24 - Esters contenant du soufre
  • C08F 222/38 - Amides
  • C08K 3/22 - OxydesHydroxydes de métaux
  • C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
  • C09D 7/20 - Diluants ou solvants
  • C09D 7/61 - Adjuvants non macromoléculaires inorganiques

83.

METAL-CONTAINING SILYLOXY COMPOUND, METAL-CONTAINING SILYLOXY GROUP-COATED PARTICLES, METHOD FOR PRODUCING SAME, AND DISPERSION COMPOSITION

      
Numéro d'application 18555306
Statut En instance
Date de dépôt 2022-03-22
Date de la première publication 2024-07-04
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Liao, Yuehchun
  • Takahashi, Michihito

Abrégé

Provided are: a compound used as a capping agent which imparts particles having excellent dispersibility and refractive index; particles coated with the compound; a method for producing the same; and a dispersion composition containing said particles. A compound according to the present invention has a structure represented by formula (1). In the formula, R1 represents an organic group having 1-30 carbon atoms, R2 represents a group represented by OR3 or a group represented by formula (2), R3 represents an organic group having 1-30 carbon atoms, n1 and n2 each represent an integer of at least 0, n1+2×n2 represents a valence determined by the type of L, L represents aluminum, gallium, yttrium, titanium, zirconium, hafnium, bismuth, tin, vanadium, or tantalum, * represents a bond, R4 and R5 each represent an organic group having 1-30 carbon atoms which may have an oxygen atom. Particles according to the present invention have a structure represented by formula (1) on a surface thereof.

Classes IPC  ?

  • C07F 7/18 - Composés comportant une ou plusieurs liaisons C—Si ainsi qu'une ou plusieurs liaisons C—O—Si
  • C01G 23/053 - Obtention par voie humide, p. ex. par hydrolyse de sels de titane

84.

RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND ACID GENERATOR

      
Numéro d'application 18554179
Statut En instance
Date de dépôt 2022-04-21
Date de la première publication 2024-06-27
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Nguyen, Khanhtin
  • Fujii, Tatsuya
  • Murata, Mari

Abrégé

A resist composition containing a base material component (A) and a compound (B0) represented by General Formula (b0), in which Rb0 represents a condensed cyclic group containing a condensed ring containing one or more aromatic rings, the condensed cyclic group has, as a substituent, an acid decomposable group that is decomposed under action of acid to form a polar group, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more A resist composition containing a base material component (A) and a compound (B0) represented by General Formula (b0), in which Rb0 represents a condensed cyclic group containing a condensed ring containing one or more aromatic rings, the condensed cyclic group has, as a substituent, an acid decomposable group that is decomposed under action of acid to form a polar group, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more

Classes IPC  ?

85.

METHOD FOR SUPPRESSING COLLAPSE OF THREE-DIMENSIONAL STRUCTURE

      
Numéro d'application 18552267
Statut En instance
Date de dépôt 2022-03-25
Date de la première publication 2024-06-20
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Saeki, Fusayo
  • Wakiya, Kazumasa

Abrégé

A method for suppressing collapse of a three-dimensional structure which can hydrophobize a surface of a three-dimensional structure on a substrate, regardless of a material of the substrate and a material of the three-dimensional structure, and can suppress collapse of the three-dimensional structure on the substrate, as a result of hydrophobization, a surface treatment liquid, a method for producing the surface treatment liquid, and a substrate having a three-dimensional structure with silane condensate that is a component of the surface treatment liquid and is attached or bound to a surface of the three-dimensional structure. The method includes preparing a substrate having a three-dimensional structure on a surface thereof, and contacting a surface treatment liquid to a surface of the three-dimensional structure, a surface treatment liquid including a silane condensate that is a silane condensate formed by hydrolyzation condensation of a hydrolyzable silane compound including a trifunctional silane compound having a specific structure.

Classes IPC  ?

  • C09D 183/06 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène
  • C08G 77/08 - Procédés de préparation caractérisés par les catalyseurs utilisés
  • C08G 77/18 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène à des groupes alcoxyle ou aryloxyle
  • G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
  • H01L 21/3105 - Post-traitement

86.

COMPOSITION AND PHOTOSENSITIVE COMPOSITION

      
Numéro d'application 18488113
Statut En instance
Date de dépôt 2023-10-17
Date de la première publication 2024-06-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Sugawara, Ryutaro

Abrégé

Provided are a composition and a photosensitive composition that contain inorganic fine particles dispersed stably over a long period of time and are less likely to undergo excessive loss of the mass of their components (or non-solvent components in a case where the composition or the photosensitive composition contains a solvent) even when heated; a product of curing of such a photosensitive composition; a compound suitable for use in such a photosensitive composition; and a method of producing such a compound. The composition includes a photopolymerizable compound (A) and inorganic fine particles (B) and the photosensitive composition includes a photopolymerizable compound (A), inorganic fine particles (B), and an initiating agent (C), in which the photopolymerizable compound (A) is a compound of a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group.

Classes IPC  ?

  • C08F 2/48 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible
  • C08F 220/30 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle contenant des cycles aromatiques dans la partie alcool
  • C08F 222/10 - Esters
  • C08K 3/08 - Métaux
  • C08K 3/22 - OxydesHydroxydes de métaux

87.

CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Numéro d'application 18527976
Statut En instance
Date de dépôt 2023-12-04
Date de la première publication 2024-06-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Takahashi, Kazuhiro

Abrégé

A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), an acid component (B) that is two or more acid components having different pKa's one another, provided that perchloric acid is excluded, and water.

Classes IPC  ?

  • C23F 1/30 - Compositions acides pour les autres matériaux métalliques

88.

PHOTOSENSITIVE COMPOSITION

      
Numéro d'application 18488127
Statut En instance
Date de dépôt 2023-10-17
Date de la première publication 2024-06-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Urakawa, Kazuki
  • Asaba, Takuro
  • Saijyo, Hideki
  • Chisaka, Hiroki

Abrégé

Provided are a highly-curable photosensitive composition capable of forming cured products that are less likely to undergo excessive mass loss even when heated; and a product of curing of such a photosensitive composition. The photosensitive composition includes photopolymerizable compounds (A) and an initiating agent (C), in which the photopolymerizable compounds (A) include a combination of a compound of a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group and a polyfunctional compound different from the compound of a specific structure.

Classes IPC  ?

  • G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
  • C07C 69/54 - Esters d'acide acryliqueEsters d'acide méthacrylique
  • G03F 7/004 - Matériaux photosensibles

89.

UNDERCOAT AGENT, AND METHOD FOR PRODUCING STRUCTURE INCLUDING PHASE-SEPARATED STRUCTURE

      
Numéro d'application 18491270
Statut En instance
Date de dépôt 2023-10-20
Date de la première publication 2024-06-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Tsuchiya, Junichi
  • Iino, Shota

Abrégé

An undercoat agent that is used for subjecting a layer including a block copolymer to phase separation on a substrate, the undercoat agent containing a resin component (A1) having a constitutional unit (u1) represented by General Formula (u1) and a constitutional unit (u2) represented by General Formula (u2). In General Formula (u1), R11 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, R12 represents a substituent, and n represents an integer of 0 to 5. In General Formula (u2), R2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, L2 represents a single bond or a divalent linking group, and Y2 represents a divalent linking group having 5 to 15 carbon atoms An undercoat agent that is used for subjecting a layer including a block copolymer to phase separation on a substrate, the undercoat agent containing a resin component (A1) having a constitutional unit (u1) represented by General Formula (u1) and a constitutional unit (u2) represented by General Formula (u2). In General Formula (u1), R11 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, R12 represents a substituent, and n represents an integer of 0 to 5. In General Formula (u2), R2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, L2 represents a single bond or a divalent linking group, and Y2 represents a divalent linking group having 5 to 15 carbon atoms

Classes IPC  ?

  • C09D 153/00 - Compositions de revêtement à base de copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères
  • C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
  • G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
  • G03F 7/26 - Traitement des matériaux photosensiblesAppareillages à cet effet

90.

CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Numéro d'application 18528264
Statut En instance
Date de dépôt 2023-12-04
Date de la première publication 2024-06-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Takahashi, Kazuhiro

Abrégé

A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), an acid component (B) selected from the group consisting of carbonic acid, formic acid, propionic acid, butyric acid, and sulfonic acid, and salts thereof, and water.

Classes IPC  ?

  • C23F 1/30 - Compositions acides pour les autres matériaux métalliques
  • H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable

91.

CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

      
Numéro d'application 18528283
Statut En instance
Date de dépôt 2023-12-04
Date de la première publication 2024-06-13
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Takahashi, Kazuhiro
  • Saeki, Fusayo

Abrégé

A chemical solution for removing a precious metal includes a cerium-containing oxidizing agent (A), a metal component (B) including a transition metal other than cerium, and water, in which a content of the metal component (B) is less than 1.65×10−3 parts by mass with respect to 1 part by mass of the cerium-containing oxidizing agent (A) in terms of the transition metal.

Classes IPC  ?

  • C23F 1/30 - Compositions acides pour les autres matériaux métalliques

92.

RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, METHOD OF PRODUCING STRUCTURE CONTAINING PHASE-SEPARATED STRUCTURE, AND BLOCK COPOLYMER

      
Numéro d'application 18513191
Statut En instance
Date de dépôt 2023-11-17
Date de la première publication 2024-06-06
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Satoh, Toshifumi
  • Isono, Takuya
  • Suzuki, Kazushige
  • Iizuka, Toi
  • Miyagi, Ken
  • Dazai, Takahiro

Abrégé

A resin composition for forming a phase-separated structure contains a block copolymer that is formed of a first block, a second block, and a third block, which are bonded to one another. The structure of a constituent unit of a polymer constituting the first block is identical to the structure of a constituent unit of a polymer constituting the third block. The number-average molecular weight (Mn3) of the polymer constituting the third block is smaller than the number-average molecular weight (Mn1) of the polymer constituting the first block.

Classes IPC  ?

  • C08L 53/00 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères

93.

METHOD OF PRODUCING BLOCK COPOLYMER, AND BLOCK COPOLYMER

      
Numéro d'application 18512901
Statut En instance
Date de dépôt 2023-11-17
Date de la première publication 2024-06-06
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Satoh, Toshifumi
  • Isono, Takuya
  • Suzuki, Kazushige
  • Iizuka, Toi
  • Miyagi, Ken
  • Dazai, Takahiro

Abrégé

A method of producing a triblock copolymer, the method including reacting a diblock copolymer that contains a first block formed from a repeating structure including a constituent unit containing an aromatic hydrocarbon group, and a second block formed from a repeating structure including a constituent unit derived from an α-substituted acrylic acid ester with a homopolymer that contains a third block formed from a repeating structure including a constituent unit containing an aromatic hydrocarbon group and containing a hydroxy group bonded to a terminal of a main chain in the third block to obtain a triblock copolymer, in which the reaction is transesterification of the constituent unit derived from an (α-substituted) acrylic acid ester at a terminal of a main chain of the diblock copolymer with the homopolymer.

Classes IPC  ?

  • C08F 299/00 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires

94.

Container for cell observation

      
Numéro d'application 29864449
Numéro de brevet D1030092
Statut Délivré - en vigueur
Date de dépôt 2022-05-27
Date de la première publication 2024-06-04
Date d'octroi 2024-06-04
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Ohsaka, Takashi

95.

PHOTOCURABLE COMPOSITION AND PATTERN FORMATION METHOD

      
Numéro d'application 18550002
Statut En instance
Date de dépôt 2022-03-07
Date de la première publication 2024-05-23
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Konno, Kenri
  • Mori, Risako

Abrégé

A photocurable composition including metal oxide nanoparticles (X) and a photopolymerizable sulfur compound (C).

Classes IPC  ?

  • C08F 22/24 - Esters contenant du soufre
  • B29C 59/00 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet
  • B29C 59/02 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage
  • B29K 81/00 - Utilisation de polymères contenant dans la chaîne principale uniquement du soufre avec ou sans azote, oxygène ou carbone comme matière de moulage
  • B29K 105/16 - Charges
  • B29K 509/02 - Céramiques
  • C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
  • C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
  • C08K 3/22 - OxydesHydroxydes de métaux

96.

METHOD FOR PRODUCING POLYMER AND POLYMER

      
Numéro d'application 18491256
Statut En instance
Date de dépôt 2023-10-20
Date de la première publication 2024-05-23
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s) Uehara, Takuya

Abrégé

A method for producing a polymer, including reacting a polymer (P1) having a structure represented by General Formula (t1-1) at a terminal of a main chain with a nucleophilic agent in which a pKa of a conjugate acid is 11 or less to obtain a polymer (P2) having a structure represented by Formula (t2-1) at a terminal of a main chain. In formula (t1-1), Z represents a monovalent organic group, and in both formulas, * represents a bonding site bonded to a carbon atom which constitutes a main chain of an adjacent constitutional unit A method for producing a polymer, including reacting a polymer (P1) having a structure represented by General Formula (t1-1) at a terminal of a main chain with a nucleophilic agent in which a pKa of a conjugate acid is 11 or less to obtain a polymer (P2) having a structure represented by Formula (t2-1) at a terminal of a main chain. In formula (t1-1), Z represents a monovalent organic group, and in both formulas, * represents a bonding site bonded to a carbon atom which constitutes a main chain of an adjacent constitutional unit

Classes IPC  ?

  • C08F 20/06 - Acide acryliqueAcide méthacryliqueLeurs sels métalliques ou leurs sels d'ammonium
  • C08F 8/34 - Introduction d'atomes de soufre ou de groupes contenant du soufre

97.

COMPOSITION AND POLYMER

      
Numéro d'application 18493501
Statut En instance
Date de dépôt 2023-10-24
Date de la première publication 2024-05-16
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Uehara, Takuya
  • Seshimo, Takehiro

Abrégé

A composition for selectively modifying a base material having a surface having two or more regions made of materials that are different from each other and contains a polymer and a solvent, in which the polymer has at least one structure represented by Formula (1-1) at a terminal of a main chain thereof. In the formula, X represents NR1, O, S, or Te; R1 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms; A1 represents a monovalent substituent having substrate adsorbability at a terminal; and * represents a bonding site that is bonded to the main chain of the polymer A composition for selectively modifying a base material having a surface having two or more regions made of materials that are different from each other and contains a polymer and a solvent, in which the polymer has at least one structure represented by Formula (1-1) at a terminal of a main chain thereof. In the formula, X represents NR1, O, S, or Te; R1 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms; A1 represents a monovalent substituent having substrate adsorbability at a terminal; and * represents a bonding site that is bonded to the main chain of the polymer *—X-A1  (1-1).

Classes IPC  ?

  • C08F 20/14 - Esters méthyliques
  • C08F 12/08 - Styrène
  • C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
  • C08F 20/56 - AcrylamideMéthacrylamide
  • C08J 5/18 - Fabrication de bandes ou de feuilles

98.

PHOTOCURABLE COMPOSITION AND PATTERN-FORMING METHOD

      
Numéro d'application 18547637
Statut En instance
Date de dépôt 2022-03-11
Date de la première publication 2024-05-16
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Konno, Kenri
  • Mori, Risako

Abrégé

A photocurable composition containing metal oxide nanoparticles (X), a photopolymerizable compound (B), and a photoradical polymerization initiator (C), in which the content of the photoradical polymerization initiator (C) is 10 parts by mass or more with respect to 100 parts by mass of the total content of the metal oxide nanoparticles (X) and the photopolymerizable compound (B).

Classes IPC  ?

  • C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
  • B29C 59/00 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet
  • B29C 59/02 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage
  • C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
  • C08F 22/10 - Esters
  • C08F 22/20 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle
  • C08F 22/24 - Esters contenant du soufre

99.

COMPOSITION HAVING MAGNETOSTRICTIVE PROPERTIES, AND CURED PRODUCT THEREOF

      
Numéro d'application 18548394
Statut En instance
Date de dépôt 2022-03-01
Date de la première publication 2024-05-09
Propriétaire
  • TOKYO OHKA KOGYO CO., LTD. (Japon)
  • TOHOKU UNIVERSITY (Japon)
Inventeur(s)
  • Senzaki, Takahiro
  • Kurita, Hiroki
  • Narita, Fumio

Abrégé

Provided is a composition having magnetostrictive properties, which contains a component (P): a compound having a polymerizable group, a component (M): a powdery magnetostrictive material, and a component (R): a radical polymerization initiator.

Classes IPC  ?

  • H01F 1/28 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre dispersées ou suspendues dans un liant
  • C08F 299/06 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés à partir de polyuréthanes
  • C08G 18/42 - Polycondensats contenant des groupes ester carboxylique ou carbonique dans la chaîne principale
  • C08G 18/67 - Composés non saturés contenant un hydrogène actif
  • C08G 18/75 - Polyisocyanates ou polyisothiocyanates cycliques cycloaliphatiques
  • C08K 3/11 - Composés contenant des métaux des groupes 4 à 10 ou des groupes 14 à 16 du tableau périodique

100.

PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT

      
Numéro d'application 18546848
Statut En instance
Date de dépôt 2022-02-21
Date de la première publication 2024-05-02
Propriétaire TOKYO OHKA KOGYO CO., LTD. (Japon)
Inventeur(s)
  • Ijima, Yoichiro
  • Chisaka, Hiroki
  • Misumi, Koichi
  • Urakawa, Kazuki

Abrégé

A photocurable liquid composition capable of forming a cured product in which localization of metal oxide nanoparticles is suppressed, a cured product of the photocurable liquid composition, and a method for producing a cured product using the photocurable liquid composition. As a nitrogen-containing compound, at least one of an amine compound having a specific structure and an imine compound having specific structure is added to the photocurable liquid composition including the photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiator.

Classes IPC  ?

  • C08F 220/38 - Esters contenant du soufre
  • C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
  • C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
  • C08K 3/22 - OxydesHydroxydes de métaux
  • C08K 5/18 - AminesComposés d'ammonium quaternaire avec des groupes amino liés aromatiquement
  • C08K 9/04 - Ingrédients traités par des substances organiques
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