Abrégé

A solder alloy capable of forming a joint portion having heat cycle resistance and drop impact resistance, the solder alloy comprising: 45 mass% or more and 63 mass% or less of Bi; 0.1 mass% or more and less than 0.7 mass% of Sb; and 0.05 mass% or more and 1 mass% or less of In, with a balance being Sn and inevitable impurities, wherein a liquidus temperature of the solder alloy is 170°C or lower.

Classes IPC  ?

• B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
• C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur

Abrégé

The present invention aims at providing a lead-free solder alloy, an electronic circuit substrate and a control device which comprises a solder joint that is formed by using the lead-free solder alloy, which are capable of suppressing crack propagation in a solder joint even in a harsh environment in which a temperature difference is significant and to which vibration is applied, and of suppressing crack propagation in the vicinity of an interface even when performing solder-joining by using an electronic component without Ni/Pd/Au plating or Ni/Au plating. Provided is a lead-free solder alloy comprising : 1% by weight or more and 4% by weight or less of Ag; 1% by weight or less of Cu; 3% by weight or more and 5% by weight or less of Sb; and 0.01% by weight or more and 0.25% by weight or less of Ni, the remainder being Sn.

Classes IPC  ?

• B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
• C22C 13/00 - Alliages à base d'étain
• C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur